DE59309995D1 - Optical device - Google Patents

Optical device

Info

Publication number
DE59309995D1
DE59309995D1 DE59309995T DE59309995T DE59309995D1 DE 59309995 D1 DE59309995 D1 DE 59309995D1 DE 59309995 T DE59309995 T DE 59309995T DE 59309995 T DE59309995 T DE 59309995T DE 59309995 D1 DE59309995 D1 DE 59309995D1
Authority
DE
Germany
Prior art keywords
optical device
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE59309995T
Other languages
German (de)
Inventor
Dr-Ing Schwaderer
Dipl-Ing Hauer
Dr Rer Nat Kuke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4313487A external-priority patent/DE4313487C2/en
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE59309995T priority Critical patent/DE59309995D1/en
Application granted granted Critical
Publication of DE59309995D1 publication Critical patent/DE59309995D1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Communication System (AREA)
DE59309995T 1992-11-25 1993-11-19 Optical device Expired - Fee Related DE59309995D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE59309995T DE59309995D1 (en) 1992-11-25 1993-11-19 Optical device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE9217928 1992-11-25
DE4313487A DE4313487C2 (en) 1992-11-25 1993-04-24 Arrangement for connecting at least one light-emitting element with at least one light-receiving element
DE59309995T DE59309995D1 (en) 1992-11-25 1993-11-19 Optical device

Publications (1)

Publication Number Publication Date
DE59309995D1 true DE59309995D1 (en) 2000-05-04

Family

ID=25925228

Family Applications (1)

Application Number Title Priority Date Filing Date
DE59309995T Expired - Fee Related DE59309995D1 (en) 1992-11-25 1993-11-19 Optical device

Country Status (6)

Country Link
EP (1) EP0603549B1 (en)
DE (1) DE59309995D1 (en)
DK (1) DK0603549T3 (en)
ES (1) ES2147190T3 (en)
GR (1) GR3033821T3 (en)
PT (1) PT603549E (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5479540A (en) * 1994-06-30 1995-12-26 The Whitaker Corporation Passively aligned bi-directional optoelectronic transceiver module assembly
US5911022A (en) * 1994-09-29 1999-06-08 Siemens Aktiengesellschaft Optical coupling arrangement
DE4436204C1 (en) * 1994-09-29 1996-03-21 Siemens Ag Optical coupling arrangement
DE19601955C2 (en) * 1996-01-09 1997-12-11 Siemens Ag Optoelectronic transmitter module
US6071426A (en) * 1997-12-08 2000-06-06 The Regents Of The University Of California Micro benchtop optics by bulk silicon micromachining
GB0000405D0 (en) 2000-01-11 2000-03-01 British Aerospace Improvements relating to interfacing embedded optical transmission structures
US6450699B1 (en) * 2000-12-19 2002-09-17 Intel Corporation Photonic and electronic components on a shared substrate
JP2005062557A (en) 2003-08-15 2005-03-10 Canon Inc Optical element device, two-dimensional optical waveguide element using the same and optoelectronic fusion wiring substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121014A (en) * 1984-11-16 1986-06-09 Nec Corp Optical and electric hybrid integrated circuit
US4772787A (en) * 1985-01-07 1988-09-20 Siemens Aktiengesellschaft Monolithically integrated opto-electronic semiconductor component
JPS63502315A (en) * 1986-01-21 1988-09-01 アメリカン　テレフォン　アンド　テレグラフ　カムパニ− Interconnection of wafer-sized integrated assemblies
US4897711A (en) * 1988-03-03 1990-01-30 American Telephone And Telegraph Company Subassembly for optoelectronic devices
DE3833413C2 (en) * 1988-10-01 1995-02-23 Licentia Gmbh Arrangement with integrated optical semiconductor components
DE3914835C1 (en) * 1989-05-05 1990-07-26 Ant Nachrichtentechnik Gmbh, 7150 Backnang, De
US5017986A (en) * 1989-08-28 1991-05-21 At&T Bell Laboratories Optical device mounting apparatus
US5122652A (en) * 1989-09-29 1992-06-16 Siemens Aktiengesellschaft Means for deflecting and focusing a light beam with silicon optical members

Also Published As

Publication number Publication date
PT603549E (en) 2000-09-29
DK0603549T3 (en) 2000-09-04
ES2147190T3 (en) 2000-09-01
EP0603549B1 (en) 2000-03-29
GR3033821T3 (en) 2000-10-31
EP0603549A1 (en) 1994-06-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee