DE3922233A1 - Precipitating. metal layers from metal organic cpds. - by irradiating with light energy photon beam - Google Patents
Precipitating. metal layers from metal organic cpds. - by irradiating with light energy photon beamInfo
- Publication number
- DE3922233A1 DE3922233A1 DE3922233A DE3922233A DE3922233A1 DE 3922233 A1 DE3922233 A1 DE 3922233A1 DE 3922233 A DE3922233 A DE 3922233A DE 3922233 A DE3922233 A DE 3922233A DE 3922233 A1 DE3922233 A1 DE 3922233A1
- Authority
- DE
- Germany
- Prior art keywords
- metal
- irradiating
- photon beam
- organometallic compounds
- photon radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
H. Suhr beschreibt in "Plasmasynthesen und Beschichtungen mit organischen und metallorganischen Verbindungen", Metalloberfläche 42 (1988), 10, 467-472, die Anwendung von Plasmen nach dem PECVD-Prozeß.H. Suhr describes in "Plasma Synthesis and Coatings organic and organometallic compounds ", metal surface 42 (1988), 10, 467-472, the use of plasmas according to the PECVD process.
Auch das fotolytische CVD-Verfahren beschreibt die Metallabscheidung mittels metallorganischer Verbindungen.The photolytic CVD process also describes metal deposition using organometallic compounds.
Die bei den obengenannten Prozessen eingesetzten Metallverbindungen unterteilen sich in Metallalkyle [z. B. Cd(CH₃)₂; Gd(CH₃)₃; Pb(CH₃)₄], Metallcarbonyle [z. B. Cr(CO)₆; Fe(CO)₅], Metallchelate und Metall-¶-Komplexe.The metal compounds used in the above processes are divided into metal alkyls [e.g. B. Cd (CH₃) ₂; Gd (CH₃) ₃; Pb (CH₃) ₄], metal carbonyls [e.g. B. Cr (CO) ₆; Fe (CO) ₅], Metal chelates and metal ¶ complexes.
Nach den genannten Verfahren werden mit Hilfe von Plasmen aus organisch ungesättigten Verbindungen und den in der Gasphase flüchtigen metallorganischen Verbindungen zunächst Plasmapolymere gebildet, die je nach Ausgangsprodukt und atmosphärischen Bedingungen im weiteren Reaktionsverlauf metallische Abscheidungen liefern.According to the above procedures, plasmas are used organically unsaturated compounds and those in the gas phase volatile organometallic compounds initially plasma polymers formed, depending on the starting product and atmospheric Conditions in the further course of the reaction metallic deposits deliver.
Voraussetzung für die Anwendung nach den bekannten Verfahren ist jedoch eine ausreichende Flüchtigkeit und Thermostabilität der metallorganischen Verbindung. Ein weiterer Nachteil beim Einsatz derartiger Verbindungen ist das extrem kritische Handling. Aufgrund der leichten Entzündlichkeit und der hohen Toxizität sind extreme Sicherheitsbedingungen zu berücksichtigen. Weiter sind die erzielbaren Abscheideraten der Metallschicht nur schwierig steuerbar und entsprechend den Versuchsbedingungen ausgesprochen spezifisch. Requirement for use according to the known methods is, however, sufficient volatility and thermal stability the organometallic compound. Another disadvantage with The use of such connections is extremely critical handling. Because of its flammability and high toxicity extreme safety conditions must be taken into account. Next are the achievable deposition rates of the metal layer only difficult to control and according to the test conditions very specific.
Aufgabenstellung war daher für uns die Entwicklung eines universellen Verfahrens, welches die genannten Nachteile nicht mehr besitzt. Im Gegensatz zu den bisher bekannten Verfahren erlaubt die nachfolgend beschriebene Methode die Anwendung flüchtiger und nichtflüchtiger metallorganischer Verbindungen. Das Verfahren ermöglicht ferner den Einsatz preiswerter technischer Metallverbindungen, die in einem plasma- und laserunabhängigen, externen Arbeitsprozeß erzeugt werden. Prinzipiell können alle metallorganischen Verbindungen angewandt werden, die eine Me-C- bzw. Me-O-Bindung vorweisen, besonders folgende:For us, the task was to develop a universal one Process, which no longer has the disadvantages mentioned owns. In contrast to the previously known methods allowed the method described below uses volatile and non-volatile organometallic compounds. The procedure also enables the use of inexpensive technical metal connections, the in a plasma and laser independent, external Work process are generated. In principle, everyone can organometallic compounds are used which have a Me-C or Me-O bond, especially the following:
Metallcarboxilate:
z. B. Cu-abietat, Zn-benzoat, Cu-naphthenat,
V-hexanat, Bi-oktoat, Pb-nonat, Ce-dekanat,
Cr-oleat, Fe-tallat, Co-oxalat, Mn-linoleat,
Zn-acrylat, Ni-stearat
Metallsäureester:
z. B. Propyltitanat, Butylpolytitanat, Tianacetat,
Äthylglykoltitanat, Zirkoniumbutylat,
Triäthanolaminzirkonat
Metallalkoholate:
z. B. Mg-propylat, Al-butylat, Ba-phenolat
Metallchelate:
z. B. Pd-acetylacetonat, Au-acetylacetonat
Metallalkyle/aryle (polymer):
z. B. Methylpolysiloxan, Phenylpolysiloxan
Metall-¶-Komplexe:
z. B. Ferrocen, Äthylferrocen, Chromocen,
2,2-Bis-(äthylferrocenyl)propanMetal carboxylates:
e.g. B. Cu-abietate, Zn-benzoate, Cu-naphthenate, V-hexanate, bi-octoate, Pb-nonate, Ce-decanate, Cr-oleate, Fe-tallate, Co-oxalate, Mn-linoleate, Zn-acrylate, Ni stearate
Metallic acid ester:
e.g. B. propyl titanate, butylpolytitanate, tianacetate, ethyl glycol titanate, zirconium butylate, triethanolamine zirconate
Metal alcoholates:
e.g. B. Mg propylate, Al-butoxide, Ba-phenolate
Metal chelates:
e.g. B. Pd acetylacetonate, Au acetylacetonate
Metal alkyls / aryls (polymer):
e.g. B. methylpolysiloxane, phenylpolysiloxane
Metal ¶ complexes:
e.g. B. ferrocene, ethyl ferrocene, chromocene, 2,2-bis (ethylferrocenyl) propane
Die durch Photonenstrahlung spaltbaren organischen Metallverbindungen können sowohl als einheitlich definierte Verbindung als auch kombiniert mit organischen verträglichen Polymerbindemitteln, wie sie aus der Lackindustrie bekannt sind, zum Einsatz gelangen. Bei Anwendung mehrerer Verbindungs- und Metallgemische resultieren nach der Laserbehandlung Metall-Legierungen unterschiedlichster Zusammensetzung.The organic metal compounds that can be split by photon radiation can be used as a uniformly defined connection also combined with organic compatible polymer binders, as they are known from the paint industry. The result is the use of several compound and metal mixtures After laser treatment, metal alloys of all kinds Composition.
Die metallorganischen Schichten können je nach resultierender Molmasse in Lösemittel lösliche oder mehrdimensional vernetzte Körper von großer chemischer/mechanischer Widerstandsfestigkeit sein.The organometallic layers can be depending on the resulting Molar mass cross-linked in solvent or multidimensional Body of great chemical / mechanical resistance be.
Als Substratuntergrund, auf dem das Metall aus der metallorganischen Verbindung abgeschieden werden soll, eignen sich alle durch die entsprechend angewandte Laserstrahlung nicht veränderbaren Werkstoffe, wie z. B. Metall, Keramik, Glas, Kunststoff usw.As a substrate on which the metal from the organometallic Connection should be separated, all are suitable cannot be changed by the correspondingly applied laser radiation Materials such as B. metal, ceramic, glass, plastic etc.
Die metallorganischen Verbindungen können mit allen üblichen, definierte Schichtstärken erlaubenden Auftragsverfahren appliziert werden, wie z. B. alle Zerstäubungs-, Gieß-, Tauch-, Walz- und Druckverfahren. Der Vorteil der jeweiligen Applizierungsverfahren ist der Auftrag über weite Schichtstärkenbereiche, wobei zwischen µ und mm gearbeitet werden kann.The organometallic compounds can be mixed with all the usual applied application methods that allow defined layer thicknesses be such. B. all atomization, casting, dipping, rolling and printing process. The advantage of the respective application process is the application over wide layer thickness ranges, whereby can be worked between µ and mm.
Die angefertigten metallorganischen Schichten trocknen physikalisch oder chemisch vernetzend. Strahlenhärtende Wärmeverfahren forcieren die Aushärtung. The manufactured organometallic layers dry physically or chemically cross-linking. Radiation-curing heat processes accelerate curing.
Voraussetzung für die Möglichkeit der Metallbildung durch Photonenstrahlung ist, daß das Laserlicht in Wechselwirkung mit der metallorganischen Beschichtung tritt. Um eine optimale Anpassung zu erreichen, werden Laser verschiedener Wellenlänge eingesetzt.Prerequisite for the possibility of metal formation through Photon radiation is that the laser light interacts with the organometallic coating occurs. For optimal adjustment to achieve lasers of different wavelengths used.
Je nach den "Laserbedingungen" und der gewählten Arbeitsatmosphäre tritt bei der Aufspaltung der metallorganischen Filme neben einer Serie von Zersetzungs- und Verbrennungsprodukten auch elementarer Kohlenstoff auf, der sich in die wachsende Metallschicht einlagern kann.Depending on the "laser conditions" and the chosen working atmosphere occurs when the organometallic films split in addition to a series of decomposition and combustion products also elemental carbon that is growing in the Can store metal layer.
Eine weitere Eigenschaft ist, daß in sauerstoffhaltiger Atmosphäre die Oxidation unedler Metalle zum Oxid fortschreitet oder Einschlüsse vorliegen.Another property is that in an oxygen-containing atmosphere the oxidation of base metals progresses to the oxide or Inclusions are present.
Reine Metalle resultieren am ehesten aus Edelmetallverbindungen. Dies trifft insbesondere auf die gleichzeitige Anwendung von Edelgasatmosphäre zu.Pure metals are most likely to result from precious metal compounds. This applies in particular to the simultaneous use of Noble gas atmosphere too.
Die Auswahl der richtigen atmosphärischen Bedingungen besitzt daher eine entscheidende Bedeutung.Choosing the right atmospheric conditions therefore of crucial importance.
Die durch Laserstrahlung erzeugten Metalle können mit entsprechenden anorganischen/organischen Materialien zur Isolation nachbehandelt werden. The metals generated by laser radiation can be used with appropriate inorganic / organic materials for insulation be treated.
Versuch 1
beinhaltet die Kombination Metallcarboxylat (Fe-okloat)/
Metallsäureester (Ti-butylat)/Metallalkoholat (Al-butylat)
Versuch 2
beinhaltet die Kombination Metallcarboxylat (Cu-oktoat)/
Metallsäureester (Ti-butylat)/Metallalkoholat (Al-butylat)
Versuch 3
beinhaltet die Kombination Metallcarboxylat (Cu-dekanat)/
Metallalkoholat (Al-butylat)
Versuch 4
beinhaltet die Kombination Metallcarboxylat (Cu-naphthenol)/
Metallsäureester (Zr-butylat)
Versuch 5
beinhaltet die Kombination Metallcarboxylat (Cu-oktoat)/
Metallsäureester (Ti-butylat)/Metall-¶-Komplex (Äthylferrocen)
Trial 1
contains the combination of metal carboxylate (Fe-ocloate) / metal acid ester (Ti-butylate) / metal alcoholate (Al-butylate)
Trial 2
includes the combination of metal carboxylate (Cu octoate) / metal acid ester (Ti butoxide) / metal alcoholate (Al butoxide)
Trial 3
contains the combination of metal carboxylate (Cu-decanate) / metal alcoholate (Al-butylate)
Trial 4
contains the combination of metal carboxylate (Cu-naphthenol) / metal acid ester (Zr-butylate)
Trial 5
contains the combination of metal carboxylate (Cu-octoate) / metal acid ester (Ti-butylate) / metal-¶ complex (ethyl ferrocene)
Entsprechend den obengenannten Herstellungsvorschriften werden die metallorganischen Verbindungen präpariert. Es resultieren stabile flüssige Medien. Diese werden in definierter Schichtstärke (z. B. 100-µ-Naßfilm) auf Glasplatten appliziert. Nach Trocknung über Nacht oder 15 Minuten wärmeforciert bei 95°C werden die Targetmaterialien mit dem Nd-YAG-Laser, Fa. Optronic, Typ 815, laserbestrahlt. Die Laserbehandlung wurde im Fokus durchgeführt. Je nach angelegten Laserbearbeitungsparametern, die sich wie folgt zusammensetzen,According to the above manufacturing regulations prepared the organometallic compounds. Result stable liquid media. These are in a defined layer thickness (e.g. 100 µ wet film) applied to glass plates. After drying They are heat forced at 95 ° C overnight or for 15 minutes Target materials with the Nd-YAG laser, from Optronic, type 815, laser irradiated. The focus was on laser treatment. Depending on the laser processing parameters created, it works as follows put together,
- - Bearbeitungsgeschwindigkeit, Laserstrom, Pulsfrequenz und Pulslänge,- processing speed, laser current, pulse frequency and pulse length,
können unterschiedliche Spurtiefen und -breiten erzielt werden. Ebenso läßt sich die Laserbehandlung im cw-Betrieb, d. h. unter kontinuierlicher Strahleneinwirkung, durchführen und gezielte Metallabscheidungen erzeugen.different track depths and widths can be achieved. The laser treatment in cw mode, i.e. H. under continuous exposure to radiation, perform and targeted metal deposition produce.
Es resultieren durch die Laserbelichtung elektrische Leiterbahnen. Der elektrische Widerstand bei Anlegen einer Gleichspannung von ca. 1,5 Volt beträgt größenordnungsmäßig einige Hundert Ohm.The laser exposure results in electrical conductor tracks. The electrical resistance when applying a DC voltage of 1.5 volts is on the order of a few hundred ohms.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3922233A DE3922233A1 (en) | 1989-07-06 | 1989-07-06 | Precipitating. metal layers from metal organic cpds. - by irradiating with light energy photon beam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE3922233A DE3922233A1 (en) | 1989-07-06 | 1989-07-06 | Precipitating. metal layers from metal organic cpds. - by irradiating with light energy photon beam |
Publications (1)
Publication Number | Publication Date |
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DE3922233A1 true DE3922233A1 (en) | 1991-01-17 |
Family
ID=6384430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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DE3922233A Withdrawn DE3922233A1 (en) | 1989-07-06 | 1989-07-06 | Precipitating. metal layers from metal organic cpds. - by irradiating with light energy photon beam |
Country Status (1)
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0540983A2 (en) * | 1991-11-05 | 1993-05-12 | Solvay Deutschland GmbH | Process for the deposition of molybdenum- or tungsten containing layers |
DE4201612A1 (en) * | 1992-01-22 | 1993-07-29 | Alf Harnisch | Inserting galvanic metals or alloys into glass or glass ceramic bodies - by applying metal substrate and filling holes in bodies with metal or alloys |
WO1998038351A1 (en) * | 1997-02-28 | 1998-09-03 | The Whitaker Corporation | Direct deposition of palladium |
WO1998038350A1 (en) * | 1997-02-28 | 1998-09-03 | The Whitaker Corporation | Direct deposition of gold |
DE19723734A1 (en) * | 1997-06-06 | 1998-12-10 | Gerhard Prof Dr Naundorf | Conductor structures on a non-conductive carrier material, in particular fine conductor structures, and methods for their production |
DE19835158A1 (en) * | 1998-08-04 | 2000-02-10 | Wolfgang Anger | Process for the production of printed circuit boards |
US7777059B2 (en) | 2003-12-18 | 2010-08-17 | Basf Se | Copper(I) formate complexes |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1251451A (en) * | 1969-03-19 | 1971-10-27 | ||
US4543270A (en) * | 1984-06-20 | 1985-09-24 | Gould Inc. | Method for depositing a micron-size metallic film on a transparent substrate utilizing a visible laser |
DE3347038C2 (en) * | 1983-12-24 | 1986-12-11 | Fr. Kammerer GmbH, 7530 Pforzheim | Process for coating substrates with metals |
US4636403A (en) * | 1985-04-29 | 1987-01-13 | At&T Technologies, Inc. | Method of repairing a defective photomask |
US4694138A (en) * | 1984-02-10 | 1987-09-15 | Kabushiki Kaisha Toshiba | Method of forming conductor path |
EP0300846A1 (en) * | 1987-06-30 | 1989-01-25 | Institut Français du Pétrole | Process for modifying the surface of a substrate by the formation of an alloy, use of the process, paticularly in the preparation of ferrous alloys, and catalysts and alloys obtained by the process |
DE3826046A1 (en) * | 1987-08-17 | 1989-03-02 | Asea Brown Boveri | METHOD FOR PRODUCING METAL LAYERS |
-
1989
- 1989-07-06 DE DE3922233A patent/DE3922233A1/en not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1251451A (en) * | 1969-03-19 | 1971-10-27 | ||
DE3347038C2 (en) * | 1983-12-24 | 1986-12-11 | Fr. Kammerer GmbH, 7530 Pforzheim | Process for coating substrates with metals |
US4694138A (en) * | 1984-02-10 | 1987-09-15 | Kabushiki Kaisha Toshiba | Method of forming conductor path |
US4543270A (en) * | 1984-06-20 | 1985-09-24 | Gould Inc. | Method for depositing a micron-size metallic film on a transparent substrate utilizing a visible laser |
US4636403A (en) * | 1985-04-29 | 1987-01-13 | At&T Technologies, Inc. | Method of repairing a defective photomask |
EP0300846A1 (en) * | 1987-06-30 | 1989-01-25 | Institut Français du Pétrole | Process for modifying the surface of a substrate by the formation of an alloy, use of the process, paticularly in the preparation of ferrous alloys, and catalysts and alloys obtained by the process |
DE3826046A1 (en) * | 1987-08-17 | 1989-03-02 | Asea Brown Boveri | METHOD FOR PRODUCING METAL LAYERS |
Non-Patent Citations (3)
Title |
---|
EHRLICH, D.J. * |
Patterned photonuclea- tion of chemical vapor deposition of Al by UV- laser photodeposition. In: Appl.Phys.Lett. 45, (6)Sept.1984, S.617-619 * |
TSAO, J.Y. * |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0540983A2 (en) * | 1991-11-05 | 1993-05-12 | Solvay Deutschland GmbH | Process for the deposition of molybdenum- or tungsten containing layers |
EP0540983A3 (en) * | 1991-11-05 | 1994-10-19 | Solvay Deutschland | Process for the deposition of molybdenum- or tungsten containing layers |
DE4201612A1 (en) * | 1992-01-22 | 1993-07-29 | Alf Harnisch | Inserting galvanic metals or alloys into glass or glass ceramic bodies - by applying metal substrate and filling holes in bodies with metal or alloys |
WO1998038351A1 (en) * | 1997-02-28 | 1998-09-03 | The Whitaker Corporation | Direct deposition of palladium |
WO1998038350A1 (en) * | 1997-02-28 | 1998-09-03 | The Whitaker Corporation | Direct deposition of gold |
US5894038A (en) * | 1997-02-28 | 1999-04-13 | The Whitaker Corporation | Direct deposition of palladium |
DE19882125B4 (en) * | 1997-02-28 | 2009-03-19 | The Whitaker Corp., Wilmington | Direct deposition of palladium |
DE19723734A1 (en) * | 1997-06-06 | 1998-12-10 | Gerhard Prof Dr Naundorf | Conductor structures on a non-conductive carrier material, in particular fine conductor structures, and methods for their production |
US6319564B1 (en) | 1997-06-06 | 2001-11-20 | Gerhard Naundorf | Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same |
DE19723734C2 (en) * | 1997-06-06 | 2002-02-07 | Gerhard Naundorf | Conductor structures on a non-conductive carrier material and method for their production |
DE19835158A1 (en) * | 1998-08-04 | 2000-02-10 | Wolfgang Anger | Process for the production of printed circuit boards |
US7777059B2 (en) | 2003-12-18 | 2010-08-17 | Basf Se | Copper(I) formate complexes |
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