DE3732854A1 - Assembly of integral construction - Google Patents
Assembly of integral constructionInfo
- Publication number
- DE3732854A1 DE3732854A1 DE19873732854 DE3732854A DE3732854A1 DE 3732854 A1 DE3732854 A1 DE 3732854A1 DE 19873732854 DE19873732854 DE 19873732854 DE 3732854 A DE3732854 A DE 3732854A DE 3732854 A1 DE3732854 A1 DE 3732854A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- cover plates
- assembly according
- deformation
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Die Erfindung betrifft eine einstückig ausgebildete Baugruppe aus Kunststoff, bestehend aus einer mit Leiterbahnen ver sehenen Leiterplatte zur Aufnahme von Bauelementen in SMD-Tech nik, aus einer einen Isolierkörper aufweisenden Steckerleiste mit Kontaktelementen und einer an die Leiterplatte angeformten Frontblende.The invention relates to a one-piece assembly made of plastic, consisting of a ver see circuit board for receiving components in SMD-Tech nik, from a plug connector with an insulating body with contact elements and one molded onto the circuit board Front panel.
Derartige einstückige aus Kunststoff bestehende spritzgegossene Baugruppen wurden entwickelt um bei der Fertigung den Teile- sowie den Montageaufwand erheblich zu senken. Dies wird durch eine reduzierte Lagerhaltung sowie durch das Fehlen von Montage vorgängen, durch die getrennte Einheiten erst zu einer Funktions einheit zusammmengefügt werden, erreicht. In vielen Fällen ist es erwünscht, die Bauelemente einer Baugruppe mittels Abdeckungen vor schädlichen Umgebungseinflüssen zu schützen. Wird dies bei einer einstückig ausgebildeten Baugruppe gefordert, so sind weitere Abdeckelemente notwendig, die in zusätzlichen Montage vorgängen mit der Baugruppe verbunden werden müssen.Such one-piece injection-molded plastic Assemblies were developed in order to manufacture the parts as well as significantly reduce the assembly effort. This is through reduced inventory and the lack of assembly processes, through the separate units only to a functional unit can be joined together. In many cases it is desirable to cover the components of an assembly by means of covers to protect against harmful environmental influences. Will this be a one-piece assembly is required additional cover elements necessary in additional assembly processes must be connected to the module.
Aufgabe der vorliegenden Erfindung ist es, eine einstückig aus gebildete Baugruppe anzugeben, bei der die Bauelemente gegen schädliche von außen kommende Einflüsse geschützt werden können.The object of the present invention is to be made in one piece Specify formed assembly in which the components against harmful external influences are protected can.
Diese Aufgabe wird für eine einstückig ausgebildete Baugruppe der eingangs genannten Art erfindungsgemäß dadurch gelöst, daß an den freien Seitenkanten der Leiterplatte Deckelplatten angespritzt sind, wobei jeweils unmittelbar benachbart zur Leiterplattenkante ein schmaler parallel zur Leiterplattenkante verlaufender erster Verformungsbereich und parallel zu diesem in einem der Höhe der Steckerleiste beziehungsweise der Front blende entsprechenden Abstand ein zweiter Verformungsbereich vorgesehen ist.This task is for a one-piece assembly of the type mentioned in the invention solved in that cover plates on the free side edges of the circuit board are injection molded, each immediately adjacent to PCB edge a narrow parallel to the PCB edge running first deformation area and parallel to this in one of the height of the connector strip or the front cover a corresponding distance a second deformation area is provided.
Durch die Verlängerung der Leiterplatte um biegsame ange spritzte Seitenteile, welche als Deckelplatten dienen, können bei der erfindungsgemäßen Baugruppe die Bauelemente wirksam gegen schädliche Umgebungseinflüsse abgeschirmt werden, ohne daß zusätzliche Abdeckteile montiert werden müssen.By extending the circuit board to be flexible splashed side panels that serve as cover plates can the components are effective in the assembly according to the invention be shielded against harmful environmental influences without that additional cover parts must be installed.
Eine vorteilhafte Ausgestaltung der erfindungsgemäßen Baugruppe ist dadurch gekennzeichnet, daß die Verformungsbereiche als Filmscharniere ausgebildet sind, wodurch sich eine einfache Herstellung sowie eine einfache Handhabung der Verformungsbe reiche ergibt.An advantageous embodiment of the assembly according to the invention is characterized in that the deformation areas as Film hinges are formed, making it easy Production and easy handling of the deformation rich results.
Eine andere vorteilhafte Ausgestaltung ist dadurch gekenn zeichnet, daß parallel zu den freien Kanten der Deckelplatten Abstandszapfen vorgesehen sind. Dadurch wird ein Hinabdrücken der Deckelplatten beim Umbiegen bis auf die Bauelemente ver mieden.Another advantageous embodiment is characterized records that parallel to the free edges of the cover plates Spacers are provided. This will push it down ver the cover plates when bending down to the components avoided.
Eine weitere vorteilhafte Ausgestaltung der erfindungsgemäßen einstückigen Baugruppe ist dadurch gekennzeichnet, daß jeweils zwischen den benachbarten Verformungsbereichen auf der nach dem Einklappen der Deckelplatten außen liegenden Fläche ein parallel zu den Verformungsbereichen verlaufender Steg ange spritzt ist. Dieser Steg kann bei eingeklappten Deckelteilen die Führungsfunktion der Baugruppe im Baugruppenrahmen über nehmen, die sonst von der freien Leiterplattenkante ausgeübt wird.Another advantageous embodiment of the invention one-piece assembly is characterized in that each between the adjacent deformation areas on the after the Fold in the outer surface of the cover plates Web running parallel to the deformation areas is injected. This web can with the cover parts folded the management function of the module in the module frame take that otherwise exerted by the free circuit board edge becomes.
Eine weitere zweckmäßige Ausgestaltung ist dadurch gekenn zeichnet, daß die den Bauelementen zugewandten Flächen der Deckelplatten mit einer metallischen Beschichtung, die mit einem Schirmpotential verbunden ist, versehen sind. Auf diese Weise ist nicht nur ein Schutz der Bauelemente gegen schädliche mechanische Umgebungseinflüsse gewährleistet, sondern auch gegen störende elektromagnetische Umgebungseinflüsse.A further useful embodiment is characterized records that the surfaces of the components facing the Cover plates with a metallic coating that with is connected to a screen potential. To this Wise is not just protecting components against harmful ones guarantees mechanical environmental influences, but also against disturbing electromagnetic environmental influences.
Die Erfindung wird nachfolgend anhand eines in der Zeichnung dargestellten Ausführungsbeispiels näher erläutert.The invention is described below with reference to a drawing illustrated embodiment explained in more detail.
Die dargestellte Figur zeigt den prinzipiellen Aufbau einer einstückigen Baugruppe mit angespritzten Deckelplatten.The figure shown shows the basic structure of a one-piece assembly with molded cover plates.
Die aus Kunststoff bestehende mit SMD-Anschlüssen für ober flächenmontierte Bauelemente versehene Leiterplatte 1 ist auf einer Seite von einer Steckerleiste 2 und auf einer zweiten dieser gegenüberliegenden Seite von einer Frontblende 3 begrenzt. Die Steckerleiste weist einen mit der Leiterplatte verbundenen Isolierkörper auf, in dem Anschlußenden und Kontaktenden aufweisende Kontaktelemente vorgesehen sind, die mit ihren Anschlußenden elektrisch leitend mit bestimmten herauszuführenden Leiterbahnen in Verbindung stehen. Bei der dargestellten Baugruppe ist davon ausgegangen worden, daß die mit Bauelementen bestückte Seite der Leiterplatte 1 dargestellt ist. Jedoch ist auf eine Darstellung der Bauelemente zugunsten einer besseren Übersichtlichkeit verzichtet worden. An den freien Kanten der Leiterplatte 1 sind die Deckelplatten 4 ange spritzt. Diese Deckelplatten weisen jeweils zwei Verformungs bereiche 5 auf, um deren Längsachse sie gebogen werden können. Der Abstand der beiden Verformungsbereiche 5 entspricht jeweils der Höhe der Steckerleiste 2 beziehungsweise der Frontblende 3. Werden die Deckelplatten 4 nun in Richtung auf die Bauelemente seite der Leiterplatte 1 geklappt, so bilden die Abschnitte zwischen zwei benachbarten Verformungsbereichen 5 jeweils eine Seitenwand. The plastic circuit board 1 provided with SMD connections for surface-mounted components is delimited on one side by a connector strip 2 and on a second side opposite this by a front panel 3 . The connector strip has an insulating body connected to the printed circuit board, in which contact elements having connection ends and contact ends are provided, which are connected in an electrically conductive manner to certain conductor tracks to be led out with their connection ends. In the assembly shown, it has been assumed that the side of the printed circuit board 1 which is equipped with components is shown. However, the components have been omitted for the sake of clarity. At the free edges of the circuit board 1 , the cover plates 4 are injected. These cover plates each have two deformation areas 5 , about the longitudinal axis of which they can be bent. The distance between the two deformation areas 5 corresponds in each case to the height of the connector strip 2 or the front panel 3 . If the cover plates 4 are now folded in the direction of the components side of the printed circuit board 1 , the sections between two adjacent deformation regions 5 each form a side wall.
Eine vorteilhafte Ausgestaltung des Verformungsbereichs 5 be steht darin, daß dieser als Filmscharnier ausgebildet ist. Dadurch ergibt sich sowohl eine einfache Herstellung als auch eine einfache Handhabung. Um beim Einklappen der Deckelplatten 4 ein zu weites Durchbiegen der Deckelplatten 4 zu verhindern, was unter Umständen zu einer Beschädigung der Bauelemente führen könnte, sind jeweils an den freien Kanten der Deckel platten 4 Abstandszapfen 6 vorgesehen. Dabei besteht die Möglichkeit, die Abstandszapfen 6 so auszubilden, daß sie mit entsprechenden Gegenstücken auf der Bauelementeseite der Lei terplatte 1 im zusammengeklappten Zustand eine Rastverbindung bilden.An advantageous embodiment of the deformation area 5 be that it is designed as a film hinge. This results in both simple manufacture and simple handling. In order to prevent collapse when the cover plates 4 too far bending of the cover plates 4, which could possibly result in damage to the components, each of plates at the free edges of the lid 4, spacer pins 6 are provided. It is possible to form the spacer pin 6 so that they form a locking connection with corresponding counterparts on the component side of the Lei terplatte 1 in the folded state.
Zwischen jeweils zwei benachbarten Verformungsbereichen 5 ist auf der nach dem Einklappen der Deckelplatten 4 außenliegenden Seite ein Steg 7 vorgesehen, der parallel zu der Leiterplatten kante verläuft. Dieser Steg 7 kann beim Einschieben der Bau gruppe in einen Baugruppenrahmen die sonst von der Außenkante der Leiterplatte 1 ausgeübte Führungsfunktion übernehmen.Between each two adjacent deformation areas 5, a ridge 7 is provided on the outside after the folding of the cover plates 4 side extending edge parallel to the printed circuit boards. This web 7 can take over the otherwise exercised from the outer edge of the circuit board 1 guide function when inserting the construction group in a module frame.
Wird eine elektromagnetische Abschirmung der Bauelemente ge wünscht so können die Innenflächen der Deckelplatten 4 mit einer metallischen Beschichtung 8 versehen werden, die mit einem Schirmpotential der Leiterplatte 1 - in der Figur nicht dargestellt - verbunden ist.If an electromagnetic shielding of the components is desired, the inner surfaces of the cover plates 4 can be provided with a metallic coating 8 , which is connected to a shield potential of the circuit board 1 - not shown in the figure.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873732854 DE3732854C2 (en) | 1987-09-29 | 1987-09-29 | One-piece assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873732854 DE3732854C2 (en) | 1987-09-29 | 1987-09-29 | One-piece assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3732854A1 true DE3732854A1 (en) | 1989-04-13 |
DE3732854C2 DE3732854C2 (en) | 1993-12-02 |
Family
ID=6337154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873732854 Expired - Fee Related DE3732854C2 (en) | 1987-09-29 | 1987-09-29 | One-piece assembly |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3732854C2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19511648B4 (en) * | 1995-03-30 | 2005-12-29 | Moeller Gmbh | Method of manufacturing low-voltage switchgear inserts and mounting plate therefor |
DE202017105514U1 (en) * | 2017-09-12 | 2018-12-14 | Tridonic Gmbh & Co Kg | Housing for an electrical operating device for bulbs |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7708528U1 (en) * | 1977-03-17 | 1977-07-14 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Slide-in assembly with a printed circuit board |
US4510551A (en) * | 1984-05-21 | 1985-04-09 | Endeco Canada Limited | Portable memory module |
-
1987
- 1987-09-29 DE DE19873732854 patent/DE3732854C2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7708528U1 (en) * | 1977-03-17 | 1977-07-14 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Slide-in assembly with a printed circuit board |
US4510551A (en) * | 1984-05-21 | 1985-04-09 | Endeco Canada Limited | Portable memory module |
Also Published As
Publication number | Publication date |
---|---|
DE3732854C2 (en) | 1993-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |