DE212018000237U1 - Structure of a panel receiver / transmitter module with high output power - Google Patents

Abstract

Multi-channel, hermetic, compact panel receiver / transmitter module with high output power, which forms part of the phased array structures used in radar and communication systems, characterized in that it comprises:
the first LTCC module (1), on which a microwave element (1.1) with high heat dissipation is arranged,
a second LTCC module (2) on which a microwave element (1.1) is arranged,
- The first intermediate link (1.3), which is located on the underside of the first LTCC module (1) and provides high-frequency, direct current supply and control connections between the first LTCC module (1) and the second LTCC module (2),
- a printed circuit board (4) which provides the required DC power supply and control signals for the elements in and on the first LTCC module (1) and the second LTCC module (2),
a second intermediate element (1.3), which is located between the second LTCC module (2) and the printed circuit board (4), in order to transmit the direct current supply and control signals received from the printed circuit board (4) to the first LTCC Module (1) and the second LTCC module (2) to transmit.

Description

TECHNICAL AREA

The invention relates to the construction of multi-channel, hermetic, powerful and compact panel receiver / transmitter modules which are part of the phased array structures used in radar and communication systems.

STATE OF THE ART

Currently, the number of T / R transceiver modules in phased array systems per system is in the thousands. The weight, size and cost of the receiver / transmitter modules therefore form an important part of the systems.

According to the prior art, system requirements such as operating frequency, scanning angle and the like influence the design and layout of the modules. The spacing between the antennas required to achieve the desired scan angles at X-band frequencies and beyond limits the module dimensions. This requires designs of high density module architecture. However, high-density modules also involve high operating temperatures and insulation problems. All of these factors must be considered when designing a module.

As a result of the literature search, patent application no. US2010259913 with the title "LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) TRANSMIT / RECEIVE (T / R) ASSEMBLY UTILIZING BALL GRID ARRAY (BGA) TECHNOLOGY". The system mentioned in the patent application is created by combining the microwave components in a low-temperature ceramic. However, this system has a low output and is not a compact structure.

A document found when searching for the subject in the literature is patent application no. US2007210959 (A1 ) with the title "Multi-beam array module for phased array systems". In this patent application, the control module communicates with each array element to control phase shift and damping. This system is advantageous for phased array systems, but has a low output power and no compact structure.

As a result, there is a need for improvement in the technical field due to the drawbacks mentioned above and the inadequacy of the existing solutions.

PURPOSE OF THE INVENTION

The invention is inspired by the existing circumstances and aims to eliminate the disadvantages mentioned above.

The main purpose of the invention is the introduction of a multi-channel and powerful T / R module by means of microwave elements.

Another purpose of the invention is to introduce a compact T / R module structure.

Another purpose of the invention is to introduce a T / R module structure that meets system requirements such as operating frequency and scan angle.

• - das erste LTCC-Modul, auf dem ein Mikrowellenelement mit hoher Wärmeabweisung angeordnet ist,
• - ein zweites LTCC-Modul, auf dem ein Mikrowellenelement angeordnet ist,
• - das erste Zwischenglied, das sich an der Unterseite des ersten LTCC-Moduls befindet und Hochfrequenz-, Gleichstromversorgungs- und Steuerverbindungen zwischen dem ersten LTCC-Modul und dem zweiten LTCC-Modul vorsieht,
• - eine Leiterplatte, die die erforderlichen Gleichstromversorgungs- und Steuersignale für die Elemente in und auf dem ersten LTCC-Modul und dem zweiten LTCC-Modul vorsieht,
• - ein zweites Zwischenglied, das sich zwischen dem zweiten LTCC-Modul und der Leiterplatte befindet, um die Gleichstromversorgungs- und die Steuersignale, die von der Leiterplatte empfangen werden, an das erste LTCC-Modul und das zweite LTCC-Modul zu übertragen.

To accomplish the above purposes, the invention is a multi-channel, hermetic, powerful, and compact panel receiver / transmitter module structure that forms part of the phased array structures used in radar and communication systems and includes:

• the first LTCC module, on which a microwave element with high heat rejection is arranged,
• a second LTCC module on which a microwave element is arranged,
• the first link, which is located on the underside of the first LTCC module and provides high-frequency, direct current supply and control connections between the first LTCC module and the second LTCC module,
• a printed circuit board which provides the necessary direct current supply and control signals for the elements in and on the first LTCC module and the second LTCC module,
• a second intermediate element, which is located between the second LTCC module and the printed circuit board, in order to transmit the direct current supply and control signals received from the printed circuit board to the first LTCC module and the second LTCC module.

The structural and characteristic features and all the advantages of the invention, which are illustrated in the following drawings and in the detailed description by reference to these figures, are clearly understood, therefore the evaluation should be made taking into account these figures and the detailed explanations.

list of figures

• 1 shows the side view of the T / R module structure of the invention.
• 2 shows the perspective top view of the first LTCC module.
• 3 shows a view of the pontic and the frame on the first L TCC module.
• 4 shows the perspective top view of the second LTCC module.
• 5 shows the top view of the T / R module structure of the invention.
• 6 shows a view of the T / R module structure of the invention inside the housing.

LIST OF REFERENCE NUMBERS

1. The first LTCC module 1.1. A microwave circuit 1.2. HF plug 1.3. The first pontic 1.3.1. hole 1.4. carrier 1.5. frame 1.6. Peripheral element 1.7. crossing Second Second LTCC module 2.1. pad 2.2. The second pontic Third pen 3.1. pen space 4th circuit board 4.1. PCB connector 5th casing LTCC: Low temperature co-fired ceramics

DETAILED DESCRIPTION OF THE INVENTION

In this detailed description, the preferred embodiments of the high output T / R receiver / transmitter module of the invention are explained only for a better understanding of the subject.

The architecture of the invention comprises a combination of microwave elements ( 1.1 ), mechanical parts and spacers on a low-temperature co-fired ceramic (LTCC). This architecture includes multiple dielectric layers formed by LTCC technology, multiple cavities in these layers, multiple microwave elements in these cavities ( 1.1 ) and several RF transitions ( 1.7 ), DC power and control signals that extend to these elements.

• - das erste LTCC-Modul (1), auf dem ein Mikrowellenelement (1.1) mit hoher Wärmeabweisung angeordnet ist,
• - ein zweites LTCC-Modul (2), auf dem das Mikrowellenelement (1.1) angeordnet ist,
• - das erste Zwischenglied (1.3), das sich an der Unterseite des ersten LTCC-Moduls (1) befindet und Hochfrequenz-, Gleichstromversorgungs- und Steuerverbindungen zwischen dem ersten LTCC-Modul (1) und dem zweiten LTCC-Modul (2) vorsieht,
• - eine Leiterplatte (4), die die erforderlichen Gleichstromversorgungs- und Steuersignale für die Elemente in und auf dem ersten LTCC-Modul (1) und dem zweiten LTCC-Modul (2) vorsieht,
• - ein zweites Zwischenglied (1.3), das sich zwischen dem zweiten LTCC-Modul (2) und der Leiterplatte (4) befindet, um die Gleichstromversorgungs- und die Steuersignale, die von der Leiterplatte (4) empfangen werden, an das erste LTCC-Modul (1) und das zweite LTCC-Modul (2) zu übertragen.

As in 1 The invention is a multi-channel, hermetic, powerful and compact panel receiver / transmitter module structure which forms part of the phased array structures used in radar and communication systems and comprises the following:

• - the first LTCC module ( 1 ) on which a microwave element ( 1.1 ) is arranged with high heat rejection,
• - a second LTCC module ( 2 ) on which the microwave element ( 1.1 ) is arranged,
• - the first link ( 1.3 ), which is located on the underside of the first LTCC module ( 1 ) and radio frequency, DC power and control connections between the first LTCC module ( 1 ) and the second LTCC module ( 2 ) provides
• - a printed circuit board ( 4 ) that provide the necessary DC power and control signals for the elements in and on the first LTCC module ( 1 ) and the second LTCC module ( 2 ) provides
• - a second intermediate link ( 1.3 ), which is between the second LTCC module ( 2 ) and the circuit board ( 4 ) to the DC power and control signals from the PCB ( 4 ) are received to the first LTCC module ( 1 ) and the second LTCC module ( 2 ) transferred to.

1 shows a side view of the receiver / transmitter module. The microwave elements ( 1.1 ) in the T / R module are in the first LTCC module ( 1 ) and in the second LTCC module ( 2 ) arranged. Antenna and distributor connections can be made using the HF connector ( 1.2 ) by the first LTCC module ( 1 ) getting produced. RF (radio frequency), DC power and control connections between the first LTCC module ( 1 ) and the second LTCC module ( 2 ) with the unsoldered spring "fuzz button" plugs in the first intermediate link ( 1.3 ) are provided. The DC power and control signals required for the devices located in and on the first LTCC module ( 1 ) and the second LTCC module ( 2 ) can be located through the circuit board ( 4 ) via the unsoldered spring plugs within the second intermediate link ( 2.2 ) can be provided. Through the pens ( 3 ) the alignment of the entire structure is made possible.

The first LTCC module ( 1 ) can be used with microwave elements ( 1.1 ) be provided that dissipate high heat. Microwave elements ( 1.1 ) can on the first LTCC module ( 1 ) or can be arranged on the carriers ( 1.4 ) to be ordered. For this purpose, the carrier ( 1.4 ) in the middle of the base of the first LTCC module ( 1 ) be attached by soldering. This carrier ( 1.4 ) can transfer high heat to the cooler (heat sink). In addition, the first LTCC module near the antenna ( 1 ) low-noise microwave elements ( 1.1 ) included to reduce the possible noise figure.

MMIC microwave elements ( 1.1 ) on the first LTCC module ( 1 ) and the second LTCC module ( 2 ) in the hermetic housing with the Kovar frame ( 5 ) are included.

This in 2 shown first LTCC module ( 1 ) in its simplest form comprises more than a dielectric layer that provides miniaturization, more than a window that provides insulation, a cavity and several microwave elements ( 1.1 ), which are arranged within the cavity. A high thermal conductivity is achieved by using microwave elements ( 1.1 ) with high heat dissipation on the lowest ceramic layer (the first LTCC module ( 1 )) or preferably on the carrier ( 1.4 ) to be ordered. Additional microwave elements ( 1.1 ) to be ordered. The connection of the microwave elements ( 1.1 ) with the peripheral elements ( 1.6 ), such as capacitor, coil and resistor, is manufactured. The transition design of the HF microwave elements ( 1.1 ) on the first LTCC module ( 1 ) are made and from these transitions ( 1.7 ) with the gold wire on the microwave elements ( 1.1 ) Connections established. The pen space ( 3.1 ) on the first LTCC module ( 1 ) are formed.

On the in 3 shown first LTCC module ( 1 ) the CTE compliant Kovar frame ( 1.5 ) with ceramic materials on the center of the LTCC module ( 1 ) soldered. This frame ( 1.5 ) can be covered by a lid to hold the MMIC-based microwave elements ( 1.1 ) to protect against external influences. On the lower part and the edges of the first LTCC module ( 1 ) there is a first intermediate link ( 1.3 ), which is preferably selected from the material with a low coefficient of expansion and in terms of shape with the Kovar frame ( 1.5 ) is compatible so that the dimensions of the T / R module are not exceeded. In the holes ( 1.3.1 ) on the first pontic ( 1.3 ) are trained, unsoldered plugs are used, which is suitable for reprocessing. These connectors see the power and control signals from the microwave elements ( 1.1 ) and the vertical RF transitions between the first LTCC module ( 1 ) and the second LTCC module ( 2 ) in front. To ensure an effective connection, the height of the Kovar frame ( 1.5 ) slightly less than the height of the first pontic ( 1.3 ). The pin spaces ( 3.1 ) on the first pontic ( 1 ) be formed.

This in 4 shown second LTCC module ( 2 ) in its simplest form comprises more than one dielectric layer, which provides for miniaturization, and several microwave elements ( 1.1 ), which are arranged within these layers. Packaged microwave elements ( 1.1 ) such as MMIC devices and peripheral elements ( 1.6 ) like resistor and capacitor, can also be on the second LTCC module ( 2 ) be positioned. Between the microwave elements ( 1.1 ) there are signal transfer lines. The pads ( 2.1 ) to be pressed by the unsoldered connector are in areas near the edges of the second LTCC module ( 2 ) intended. The pen space ( 3.1 ) on the second LTCC module ( 2 ) are formed.

For the RF connections of the in 5 The T / R module shown for the possible antenna and the distribution card are based on the first LTCC-based module ( 1 ) several mini SMP HF connectors ( 1.2 ) available. This architecture has a 4-channel T / R module structure. The carrier ( 1.4 ), which can carry powerful microwave elements, are connected to the cooler from this side. The circuit board ( 4 ), the second link ( 2.2 ), the second LTCC module ( 2 ), the first intermediate link ( 1.3 ) and the first LTCC module ( 1 ) are like in 5 aligned and in which 6 mechanical housing shown ( 5 ) arranged.

This in 6 shown T / R module in the mechanical housing ( 5 ) is via the PCB connector ( 4.1 ) attached to the main board.

QUOTES INCLUDE IN THE DESCRIPTION

This list of documents listed by the applicant has been generated automatically and is only included for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• US 2010259913 [0004]
• US 2007210959 A1 [0005]

Claims (16)

Multi-channel, hermetic, compact panel receiver / transmitter module with high output power, which forms part of the phased array structures used in radar and communication systems, characterized in that it comprises: - the first LTCC module (1) , on which a microwave element (1.1) with high heat dissipation is arranged, - a second LTCC module (2), on which a microwave element (1.1) is arranged, - the first intermediate member (1.3), which is located on the underside of the first LTCC -Module (1) and high-frequency, DC power supply and control connections between the first LTCC module (1) and the second LTCC module (2) provides, - a printed circuit board (4), which provides the required DC power and control signals for the Provides elements in and on the first LTCC module (1) and the second LTCC module (2), - a second intermediate element (1.3), which is located between the second LTCC module (2) and the printed circuit board (4), around the dc current rsorgungs- and the control signals, which are received by the circuit board (4) to the first LTCC module (1) and the second LTCC module (2). Structure after Claim 1 , characterized in that it comprises a microwave element (1.1) positioned on a first LTCC module (1) which provides for noise reduction. Structure after Claim 1 , characterized in that it comprises a carrier (1.4) which is arranged on the first LTCC module (1) on which the microwave elements (1.1) can be arranged. Structure after Claim 1 or Claim 3 , characterized in that it comprises a support (1.4) which enables the high heat to be transferred to the radiator. Structure after Claim 1 , characterized in that it comprises a frame (1.5) on the first LTCC module (1) in order to provide protection for the microwave elements against external influences by closing the lid thereon. Structure after Claim 1 or Claim 5 , characterized in that the height of the Kovar frame (1.5) is slightly lower than the height of the first intermediate member (1.3) to accommodate vertical RF transitions between the first LTCC module (1) and the second LTCC module (2) provided. Structure after Claim 1 , characterized in that it comprises an RF connector (1.5) which is positioned on the first LTCC module (1) which provides antenna and distributor connections. Structure after Claim 1 , characterized in that it has a hole (1.3.1) on the first intermediate member (1.3) in which the unsoldered plugs are to be arranged. Structure after Claim 1 , characterized in that it comprises a pad (2.1) on the first LTCC module (1) and the second LTCC module (2) in which the unsoldered plugs are to be arranged. Structure after Claim 1 , characterized in that it comprises peripheral elements (1.6) which are arranged on the first LTCC module (1) and the second LTCC module (2). Structure after Claim 1 or Claim 10 , characterized in that the peripheral elements (1.6) are resistor and capacitor. Structure after Claim 1 , characterized in that it comprises a pin (3) to enable alignment. Structure after Claim 1 or Claim 12 , characterized in that it has a pin space (3.1) on the first LTCC module (1), the second LTCC module (2), the first intermediate member (1.3), the second intermediate member (2.2) and a printed circuit board (4th ) is arranged, in which the pin (3) extends to enable alignment. Structure after Claim 1 , characterized in that it comprises a transition (1.7) on the first LTCC module (1) which provides a connection with microwave elements (1.1). Structure after Claim 1 , characterized in that it comprises a printed circuit board connector (4.1), which makes it possible to install the panel receiver / transmitter module on the main board. Structure according to one of the above claims, characterized in that it comprises a housing (5) in which the panel receiver / transmitter module is arranged.

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