DE202020004748U1 - Electromagnetic Interference (EMI) mitigation materials and EMI absorbing compositions comprising carbon nanotubes - Google Patents

Abstract

A composition for an electromagnetic interference (EMI) absorber, the composition comprising carbon nanotubes within a polymer resin.

Description

AREA OF EXPERTISE

The present disclosure relates to electromagnetic interference mitigation (EMI) materials and EMI absorbing compositions containing carbon nanotubes (e.g., single wall carbon nanotubes, multi-wall carbon nanotubes, and / or carbon nanostructures, etc.).

BACKGROUND

This section provides background information about the present disclosure that is not necessarily prior art.

Electrical components, such as semiconductors, integrated circuit packages, transistors, etc., usually have fixed temperatures at which the electrical components operate optimally. Ideally, the specified temperatures correspond approximately to the temperature of the ambient air. However, the operation of the electrical components generates heat. If the heat is not removed, the electrical components can operate at temperatures much higher than the normal or desirable operating temperature. Such excessive temperatures can adversely affect the operational characteristics of the electrical components and the operation of the associated device.

In order to avoid or at least reduce the unfavorable operating properties caused by the generation of heat, the heat should be removed, for example by dissipating the heat from the operating electrical component to a heat sink. The heat sink can then be cooled by conventional convection and / or radiation methods. When dissipating the heat from the working electrical component, either through direct surface contact between the electrical component and the heat sink and / or through contact of the electrical component and the heat sink surfaces by means of an intermediate medium or thermal compensation material (TIM), can flow to the heat sink. The thermal compensation material can be used to fill the gap between heat transfer surfaces in order to increase the thermal conductivity compared to an air-filled gap, which is a relatively poor conductor of heat.

The operation of electronic devices generates electromagnetic radiation within the electronic circuitry of the equipment. Such radiation can cause electromagnetic interference (EMI) or radio frequency interference (RFI), which can interfere with the operation of other electronic devices within a certain distance. Without adequate shielding, EMI / RFI interference can degrade, or completely lose, critical signals, rendering electronic equipment inefficient or inoperable.

A common solution to improving the effects of EMI / RFI is through the use of shields that can absorb and / or reflect and / or redirect EMI energy. These shields are typically used to contain EMI / RFI at its source and to isolate other devices near the EMI / RFI source.

As used herein, the term "EMI" should be understood to refer generally to and encompass EMI emissions and RFI emissions, and the term "electromagnetic" should be understood to generally refer to electromagnetic and radio frequencies from external sources Sources and internal sources and includes them. Accordingly, the term shield (as used herein) generally refers to and includes attenuation (or limitation) of EMI and / or RFI, such as e.g. B. by attenuation, absorption, reflection, blocking and / or redirection of the energy, or a combination thereof, so that it no longer interferes, for example to meet regulations and / or the internal functionality of the electronic assembly.

Figure list

• 1A-1E stellen ein beispielhaftes pyramidenförmiges Muster für ein Material gemäß einer beispielhaften Ausführungsform dar.
• 2A-2E stellen jeweils Schritte eines beispielhaften Verfahrens dar, dass sich auf die Herstellung von Mustern in gefüllten dielektrischen Systemen gemäß beispielhafter Ausführungsformen bezieht.
• 3 stellt eine mehrschichtige Folienstruktur dar, die Blockcopolymerfolien mit Bereichen durchgehende Dicke gemäß einer beispielhaften Ausführungsform aufweist.
• 4 stellt eine mehrschichtige Folienstruktur gemäß einer beispielhaften Ausführungsform dar, bei der sich die Dichte des Füllstoffs von Schicht zu Schicht in Richtung von oben nach unten erhöht.
• 5 stellt ein gefülltes Dielektrikum mit pyramidenförmigen Strukturen gemäß einer beispielhaften Ausführungsform dar, bei der die pyramidenförmigen Strukturen luftgefüllte Microballons, Mikrokügelchen oder Mikroblasen in sich enthalten.
• 6 stellt eine beispielhafte Ausführungsform dar, die pyramidenförmige Strukturen, eine Planarisierungsschicht und eine mehrschichtige frequenzselektive Oberflächenstruktur (FSS) enthält.
• 7 stellt pyramidenförmige Strukturen entlang eines Abschnitts einer Abschirmung auf Plattenebene (BLS) gemäß einer beispielhaften Ausführungsform dar.
• 8 stellt pyramidenförmige Strukturen entlang eines Abschnitts einer BLS gemäß einer beispielhaften Ausführungsform dar, bei der eine oder mehrere pyramidenförmige Strukturen eine andere Größe als eine oder mehrere der anderen pyramidenförmigen Strukturen haben (z.B. zufallsmäßige oder nicht zufallsmäßige Höhenunterschiede usw.).
• 9 stellt pyramidenförmige Strukturen entlang eines Abschnitts einer BLS gemäß einer beispielhaften Ausführungsform dar, bei der die pyramidenförmigen Strukturen luftgefüllte Microballons, Mikrokügelchen oder Mikroblasen in sich enthalten, z.B. zur Verringerung der dielektrischen Konstante der pyramidenförmigen Strukturen.
• 10 stellt pyramidenförmige Strukturen entlang eines Abschnitts einer BLS gemäß einer beispielhaften Ausführungsform dar, bei der mindestens eine oder mehrere der pyramidenförmigen Strukturen mehrschichtig ausgebildet ist/sind und die Dichte des Füllstoffs von Schicht zu Schicht in Richtung von oben nach unten zunimmt.
• 11 stellt eine BLS und pyramidenförmige Strukturen entlang innerer oder innenliegender Oberflächen der Deckel und Seitenwände der BLS gemäß einer beispielhaften Ausführungsform dar, bei der die pyramidenförmigen Strukturen vom Deckel und den Seitenwänden der BLS nach innen hervorstehen, in eine Richtung allgemein auf eine Komponente auf einem Substrat, z.B. ein integrierter Schaltkreis (IC) auf einer gedruckten Leiterplatte (PCB) usw.
• 12 stellt eine BLS und pyramidenförmige Strukturen entlang äußerer oder außenliegender Oberflächen der Deckel und Seitenwände der BLS gemäß einer beispielhaften Ausführungsform dar, bei der die pyramidenförmigen Strukturen vom Deckel und den Seitenwänden der BLS nach außen hervorstehen, in eine Richtung allgemein von der PCB Komponente wegweisend.
• 13 stellt eine BLS und pyramidenförmige Strukturen entlang des Deckels und der Seitenwände der BLS gemäß einer beispielhaften Ausführungsform dar, bei der pyramidenförmige Strukturen sowohl von den äußeren als auch den inneren (oder außenliegenden und innenliegenden) Oberflächen des Deckels und der Seitenwände der BLS, die nach außen bzw. nach innen hervorstehen, in entgegengesetzte Richtungen allgemein auf die PCB Komponente und allgemein von der PCB Komponente weg weisen.
• 14 stellt sowohl nicht-pyramidenförmige Strukturen und pyramidenförmige Strukturen entlang eines Abschnitts einer BLS gemäß einer beispielhaften Ausführungsform dar.
• 15 stellt nicht-pyramidenförmige Strukturen entlang eines Abschnitts einer BLS gemäß einer beispielhaften Ausführungsform dar.
• 16 stellt ein äußeres Vorrichtungsgehäuse dar, das eine mehrschichtige Folie und/oder ein Metamaterial aufweist, dass gemäß einer beispielhaften Ausführungsform ausgebildet ist, um einen oder mehrere elektrische Leiter, Wellenleiter, EMI Absorber, thermisches Ausgleichsmaterial (TIM) oder Dielektrikum zur Verfügung zu stellen.
• 17 stellt einen Interposer dar, der eine mehrschichtige Folie und/oder ein Metamaterial aufweist, dass gemäß einer beispielhaften Ausführungsform ausgebildet ist, um einen oder mehrere elektrische Leiter, Wellenleiter, EMI Absorber, thermisches Ausgleichsmaterial (TIM) oder Dielektrikum zwischen zwei PCB's zur Verfügung zu stellen.
• 18 stellt ein Paket mit integrierten Schaltkreisen (IC) dar, dass eine mehrschichtige Folie und/oder ein Metamaterial aufweist, dass gemäß einer beispielhaften Ausführungsform ausgebildet ist, um einen oder mehrere elektrische Leiter/Ausgleichsleiter, Wellenleiter, EMI Absorber, thermisches Ausgleichsmaterial (TIM) oder Dielektrikum zur Verfügung zu stellen.
• 19 stellt eine mehrschichtige frequenzselektive Oberflächenstruktur (FSS) dar, die gemäß einer beispielhaften Ausführungsform Muster von elektrisch leitfähigen, EMI absorbierenden und/oder Metamaterialelementen enthält.
• 20 stellt ein Metamaterial TIM gemäß einer beispielhaften Ausführungsform dar, dass ausgebildet ist, um zum Bereitstellen eines wärmeleitfähigen Wärmewegs betrieben zu werden, und zum Richten von Millimeterwellensignalen im allgemeinen in Richtung auf Reflektoren.
• 21A und 21B stellen ein beispielhaftes flexibles Material dar, dass gefüllte dielektrische pyramidenförmige Strukturen enthält, die gemäß einer beispielhaften Ausführungsform durch das in 2A-2E gezeigte Verfahren hergestellt werden können.
• 22 ist eine perspektivische Ansicht einer Abschirmung auf Plattenebene (BLS) gemäß einer beispielhaften Ausführungsform, bei der eine Seitenwand der BLS aus einem EMI absorbierenden Material oder Absorber hergestellt ist.
• 23 ist ein Liniendiagramm, dass eine simulierte Verringerung in der gesamten abgestrahlten Energie in Dezibel (dB) über der Frequenz in Gigahertz (GHz) für die Abschirmung auf Plattenebene in 22 zeigt, wobei der Ort des Absorbers in zwei Fällen verschieden ist, mit einem Wechsel in der Frequenz der maximalen gesamten abgestrahlten Energieverringerung.
• 24 stellt eine EMI absorbierende pyramidenförmige Struktur entlang der Außenseite einer Vorrichtungskomponente dar, die gemäß einer beispielhaften Ausführungsform eine Ausnehmung oder Kammer bildet.
• 25 Stellt eine pyramidenförmige Struktur für einen EMI Absorber gemäß einer beispielhaften Ausführungsform dar.
• 26 ist ein Liniendiagramm des Reflexionsverlustes in Dezibel (dB) über der Frequenz in Gigahertz (GHz) für eine Zusammensetzung enthaltend 0,5 Volumenprozent (vol%) Kohlenstoffnanostrukturen. Zu Vergleichszwecken enthält 26 auch den Reflexionsverlust für eine Zusammensetzung enthaltend 10 vol% Ruß und eine Zusammensetzung enthaltend 50 vol% Siliziumkarbid (SiC).

The drawings described herein are for illustration purposes only of selected embodiments, and not all possible fields of application, and are not intended to limit the scope of the present disclosure.

• 1A-1E illustrate an exemplary pyramidal pattern for a material in accordance with an exemplary embodiment.
• 2A-2E each illustrate steps of an exemplary method that relates to the production of patterns in filled dielectric systems according to exemplary embodiments.
• 3 Figure 10 illustrates a multilayer film structure comprising block copolymer films with regions of continuous thickness in accordance with an exemplary embodiment.
• 4th shows a multilayer film structure according to an exemplary embodiment, in which the density of the filler increases from layer to layer in the direction from top to bottom.
• 5 shows a filled dielectric with pyramidal structures according to an exemplary embodiment, in which the pyramidal structures contain air-filled microballoons, microspheres or microbubbles.
• 6th FIG. 10 illustrates an exemplary embodiment that includes pyramidal structures, a planarization layer, and a multilayer frequency selective surface structure (FSS).
• 7th Figure 10 illustrates pyramidal structures along a portion of a plate-level shield (BLS) in accordance with an exemplary embodiment.
• 8th illustrates pyramidal structures along a portion of a BLS in which one or more pyramidal structures are a different size than one or more of the other pyramidal structures (e.g., random or non-random height differences, etc.).
• 9 shows pyramidal structures along a section of a BLS according to an exemplary embodiment, in which the pyramidal structures contain air-filled microballoons, microspheres or microbubbles, for example to reduce the dielectric constant of the pyramidal structures.
• 10 shows pyramidal structures along a section of a BLS according to an exemplary embodiment, in which at least one or more of the pyramidal structures is / are multilayered and the density of the filler increases from layer to layer in a top-down direction.
• 11 illustrates a BLS and pyramidal structures along inner or inner surfaces of the lids and sidewalls of the BLS according to an exemplary embodiment in which the pyramidal structures protrude inward from the lid and sidewalls of the BLS, in a direction generally toward a component on a substrate, e.g. an integrated circuit (IC) on a printed circuit board (PCB) etc.
• 12 Figure 12 illustrates a BLS and pyramidal structures along outer or outer surfaces of the lids and sidewalls of the BLS according to an exemplary embodiment in which the pyramidal structures protrude outward from the lid and sidewalls of the BLS, facing in a direction generally away from the PCB component.
• 13th illustrates a BLS and pyramidal structures along the lid and the side walls of the BLS according to an exemplary embodiment, in which pyramidal structures from both the outer and inner (or outer and inner) surfaces of the lid and the side walls of the BLS facing outwards or inwardly facing in opposite directions generally towards the PCB component and generally away from the PCB component.
• 14th FIG. 12 illustrates both non-pyramidal structures and pyramidal structures along a portion of a BLS in accordance with an exemplary embodiment.
• 15th Figure 10 illustrates non-pyramidal structures along a portion of a BLS according to an exemplary embodiment.
• 16 represents an outer device housing which has a multilayer film and / or a metamaterial that is designed according to an exemplary embodiment to provide one or more electrical conductors, waveguides, EMI absorbers, thermal compensation material (TIM) or dielectric.
• 17th represents an interposer which has a multilayer film and / or a metamaterial that is designed according to an exemplary embodiment to provide one or more electrical conductors, waveguides, EMI absorbers, thermal compensation material (TIM) or dielectric between two PCBs .
• 18th represents a package with integrated circuits (IC) that has a multilayer film and / or a metamaterial that is formed according to an exemplary embodiment to one or more electrical conductors / compensating conductors, waveguides, EMI absorbers, thermal compensating material (TIM) or To provide dielectric.
• 19th shows a multilayer frequency-selective surface structure (FSS) which, according to an exemplary embodiment, contains patterns of electrically conductive, EMI absorbing and / or metamaterial elements.
• 20th Figure 10 illustrates a metamaterial TIM, according to an exemplary embodiment, that is configured to operate to provide a thermally conductive thermal path and to direct millimeter wave signals generally towards reflectors.
• 21A and 21B represent an exemplary flexible material that is filled dielectric contains pyramidal structures, which according to an exemplary embodiment by the in 2A-2E Processes shown can be produced.
• 22nd Figure 13 is a perspective view of a plate level shield (BLS) in accordance with an exemplary embodiment in which a sidewall of the BLS is made from an EMI absorbing material or absorber.
• 23 is a line graph showing a simulated decrease in total radiated energy in decibels (dB) versus frequency in gigahertz (GHz) for plate level shielding in 22nd shows where the location of the absorber is different in two cases, with a change in the frequency of the maximum total radiated energy reduction.
• 24 Figure 12 illustrates an EMI absorbing pyramidal structure along the exterior of a device component that forms a recess or chamber in accordance with an exemplary embodiment.
• 25th Represents a pyramidal structure for an EMI absorber according to an exemplary embodiment.
• 26th Figure 13 is a line diagram of the return loss in decibels (dB) versus frequency in gigahertz (GHz) for a composition containing 0.5 volume percent (vol%) carbon nanostructures. Contains for comparison purposes 26th also the reflection loss for a composition containing 10 vol% carbon black and a composition containing 50 vol% silicon carbide (SiC).

Corresponding reference characters may indicate corresponding (but not necessarily identical) parts throughout the different views of the drawings.

DETAILED DESCRIPTION

Exemplary embodiments will now be described in more detail with reference to the accompanying drawings.

As recognized herein, a system transmitting energy can experience interference from reflections back to the transmitter. These unwanted reflections can disturb other systems. EMI absorbers with magnetic or dielectric fillers can be used to reduce reflectance. A typical decrease in reflectance for outdoor weatherproof EMI absorber materials can be -20 decibels (dB), which eliminates about 99% of the reflection. A conventional broadband millimeter wave EMI absorber at frequencies of 77 gigahertz (GHz) and 90 GHz may contain a dielectric filler such as carbon black and / or silicon carbide with a very high loading of up to 20 volume percent (vol%) to reduce reflection loss of To reach -20 dB. However, production with such high filler loadings tends to be difficult, especially when producing EMI absorber sheets with relatively fine pyramidal patterns.

Accordingly, exemplary embodiments of EMI attenuating materials (e.g., EMI absorbers, thermally conductive EMI absorbers, etc.) including carbon nanotubes are disclosed herein. The carbon nanotubes can have single-walled carbon nanotubes, multi-walled carbon nanotubes and / or carbon nanostructures which have a branched network of crosslinked carbon nanotube structures. Example embodiments may include broadband millimeter wave EMI absorbers comprising carbon nanotubes, for example.

Exemplary embodiments can contain carbon nanostructures (CNS) and other highly conductive coated, branched and cross-linked carbon nanotube structures with relatively low filler loadings, e.g. only 0.1 volume percent to 0.5 volume percent, etc. At such low filler loadings, the CNS filler can do well liquid silicone or another thermosetting material matrix to achieve a low viscosity. The low viscosity mixture allows the mixture to be easily poured or poured into shapes or patterns (e.g. patterns of pyramidal structures, etc.) that are configured to have a reflection loss of more than 15 decibels (e.g. reflection loss of more than 20 dB etc.) ) can be operated at frequencies from about 40 gigahertz (GHz) to about 120 GHz and / or frequencies from about 60 GHz to about 90 GHz and / or frequencies from about 70 GHz to about 85 GHz.

In exemplary embodiments, CNS material is mixed in low concentration in the range from about 0.1 vol% to about 1.0 vol% in liquid silicone or thermosetting material, for example with the aid of a centrifugal mixer, etc. The composition or mixture is of low viscosity and can easily be mixed A mold can be poured or poured to produce parts with a pyramidal pattern that achieve similar or better results than compositions with a high load of carbon black (e.g. 10 vol% etc.) or silicon carbide (SiC) (e.g. 50 vol% etc.), such as in 26th shown. It is advantageous that the low filler loading of CNS (eg from about 0.1% by volume to about 1.0% by volume, etc.) in some exemplary embodiments leads to a low viscosity, so that the production is easier to carry out and cheaper than with higher filler loads.

In exemplary embodiments, an EMI absorber comprises carbon nanotubes within a polymer resin. The EMI absorber can be operated to absorb noise and / or to reflect signals, as a result of which the passage or transmission of the signals through the EMI absorber is impeded.

In exemplary embodiments, an automotive component (e.g., a radar mount, etc.) has an EMI absorber that includes soot and / or carbon nanotubes in an injection moldable resin and / or is configured to have more than 15 decibels of reflection loss at frequencies of about 40 Gigahertz (GHz) to about 120 GHz and / or frequencies from about 60 GHz to about 90 GHz and / or frequencies from about 70 GHz to about 85 GHz can be operated. The EMI absorber can be operated to absorb noise and / or to reflect signals, as a result of which the passage or transmission of the signals through the motor vehicle component is impeded.

In exemplary embodiments, a composition for an injection-moldable EMI absorber comprises carbon black and / or carbon nanotubes within an injection-moldable resin. The composition can serve to absorb noise and / or reflect signals, thereby impeding the passage or transmission of the signals through the composition.

In exemplary embodiments, a composition for an EMI absorber comprises carbon nanotubes within a polymer resin. The composition can serve to absorb noise and / or reflect signals, thereby impeding the passage or transmission of the signals through the composition. The carbon nanotubes can have one or more single-walled carbon nanotubes, multi-walled carbon nanotubes and / or carbon nanostructures which have a branched network of crosslinked carbon nanotube structures.

The resin can include a thermoplastic resin. The carbon nanotubes can include single-walled carbon nanotubes within the thermoplastic resin, multi-walled carbon nanotubes within the thermoplastic resin, and / or carbon nanostructures that have a branched network of crosslinked carbon nanotube structures within the thermoplastic resin. The thermoplastic resin may include one or more of liquid silicone, urethane, polycarbonate, polyamide, polyester, and / or polyolefin. In some exemplary embodiments, the thermoplastic resin comprises one or more of polybutylene terephthalate, polypropylene, thermoplastic vulcanizate, thermoplastic elastomer, and / or a mixture containing polyolefin.

The resin can comprise an injection moldable resin. The carbon nanotubes can have single-walled carbon nanotubes within the injection-moldable resin, multi-walled carbon nanotubes within the injection-moldable resin and / or carbon nanostructures which have a branched network of cross-linked carbon nanotube structures within the injection-moldable resin.

The resin can comprise polypropylene and thermoplastic santoprene vulcanizate, and the carbon nanotubes can comprise carbon nanostructures. Exemplary embodiments (e.g., a composition, an EMI absorber, an automotive component, etc.) may include, for example, about 29.5 percent or less by volume of the thermoplastic Santoprene vulcanizate, about 69.5 percent or more by volume of the polypropylene, and about 0.5 percent or less by volume of the Contain carbon nanostructures. As another example, exemplary embodiments (e.g., a composition, an EMI absorber, an automotive component, etc.) can include about 10 percent or less by volume of the thermoplastic Santoprene vulcanizate, about 89 percent or more by volume of the polypropylene, and about 0.3 percent or less by volume of the carbon Contain nanostructures.

The resin may have a two-part silicone composition containing the silicone part A and the silicone part B. The ratio of the weight percentage of silicone part A to the weight percentage of silicone part B can range from about 1: 1 to about 10: 1.

The resin may have a two-part urethane composition that includes urethane part A and urethane part B. The ratio of the weight percent urethane A to the weight percent ureth B can be in a range from about 1: 1 to about 10: 1.

The resin can be a silicone or urethane resin. Exemplary embodiments (e.g., a composition, an EMI absorber, an automotive component, etc.) may include about 99.4 percent by weight of the silicone or urethane resin and about 0.6 percent by weight of the carbon Contain nanotubes within the silicone or urethane resin.

Exemplary embodiments (e.g., a composition, an EMI absorber, an automotive component, etc.) can include about 98 to about 99 weight percent of a resin and about 2 weight percent or less of the carbon nanotubes. Exemplary embodiments (e.g., a composition, an EMI absorber, an automotive component, etc.) may contain about 1 percent by volume or less of carbon nanotubes.

Exemplary embodiments (e.g., a composite, an EMI absorber, an automotive component, etc.) can be configured to have more than 15 decibels of return loss at frequencies from about 40 gigahertz (GHz) to about 120 GHz and / or frequencies from about 60 GHz to about 90 GHz and / or frequencies from about 70 GHz to about 85 GHz can be operated.

Exemplary embodiments (e.g., a composition, an EMI absorber, an automotive component, etc.) may contain about 0.5 percent by volume or less of the carbon nanotubes.

Exemplary embodiments (e.g., a composite, an EMI absorber, an automotive component, etc.) can be configured to operate with greater than 15 decibels of return loss at a frequency of about 77 GHz.

In exemplary embodiments (e.g., a composition, an EMI absorber, an automotive component, etc.), one or more fillers and / or additives are in the resin. The one or more fillers and / or additives can have one or more pigments, plasticizers, processing aids, flame retardants, extenders, tackifiers, EMI-absorbing fillers, electrically conductive fillers and / or magnetic particles.

An EMI absorber (e.g., an EMI absorbing sheet, an automotive component, an injection molded EMI absorber, an EMI absorbing automotive component, an EMI absorbing radar mount, etc.) may comprise and / or consist of a composition as disclosed herein manufactured (e.g. injection molded, etc.). For example, the EMI absorber can be injection molded with the composition so that the EMI absorber has a monolithic, one-piece construction. As another example, the EMI absorber can be an EMI absorbent sheet made from the composition.

The EMI absorber can have a pattern of EMI absorbing structures comprising the composition. The EMI absorbing structures may include rectangular pyramidal structures with rectangular bases that are configured such that the rectangular bases of adjacent rectangular pyramidal structures contact each other with substantially no gaps or spaces between the rectangular bases of the adjacent rectangular pyramidal structures. The pattern of EMI absorbing structures can be a pattern of pyramidal structures, a pattern of non-pyramidal structures, a pattern that includes a combination of pyramidal structures and non-pyramidal structures, and / or a pattern of structures that includes at least two structures with different heights that are predetermined or randomized have. The EMI absorbing structures can protrude outward along a first portion of the EMI absorber. Tissue may be along a second portion of the EMI absorber opposite the first portion along which the EMI absorbing structures protrude outward. The fabric can comprise one or more of a flame-resistant meta-aramid material and / or an openly woven polymer fabric; and / or the fabric can include a fabric layer along the second portion of the EMI absorber; and / or the fabric can be configured to provide reinforcement and mechanical strength to the EMI absorber.

A radar mount can be injection molded from a composition as disclosed herein. An EMI absorbing radar mount can be comprised of and / or fabricated from (e.g., injection molded, etc.) as disclosed herein. The EMI absorbing radar mount can be configured to be positionable relative to a radar device, whereby reflection loss changes the radiation surrounding the radar device. A radar mount may have a pattern of EMI absorbing structures that have a composition specified herein and / or are made from (e.g., injection molded, etc.). The EMI absorbing structures can protrude outwardly along at least a portion of the radar mount. An automotive component can comprise and / or be made from a composition (e.g., injection molded, etc.) as disclosed herein. A motor vehicle can have a motor vehicle component and / or a radar mount, as disclosed herein.

A thermal management and EMI mitigation material may have a composition as disclosed herein. The material for thermal management and EMI mitigation can configured to be multifunctional with a first functionality of EMI attenuation and a second functionality of thermal management. For example, for thermal management and EMI attenuation, the material can be configured to operate with greater than 15 decibels of reflection loss at frequencies from about 40 gigahertz (GHz) to about 120 GHz and to have high thermal conductivity (e.g., all in one Range from about 1 W / mK (watts per meter per Kelvin) to about 10 W / mK etc.).

An EMI attenuating material can have a composition as disclosed herein. For example, the EMI attenuating material can have a multilayer film structure defined by a plurality of layers having different filler densities and / or concentrations. As another example, the EMI attenuation may comprise a multilayer film structure defined by a plurality of layers containing fillers distributed within the layers to define areas of continuous thickness and / or discrete areas within the layers.

In exemplary embodiments, a method of making a composition for an EMI absorber comprises mixing carbon nanotubes in a polymer resin such that the composition contains less than 1 percent by volume of the carbon nanotubes. The composition can serve to absorb noise and / or reflect signals, thereby impeding the passage or transmission of the signals through the composition. For example, the composition can operate with greater than 15 decibels of return loss at frequencies from about 40 gigahertz (GHz) to about 120 GHz and / or frequencies from about 60 GHz to about 90 GHz and / or frequencies from about 70 GHz to about 85 GHz. The composition can operate with more than 15 decibels of return loss at a frequency of about 77 GHz. The composition can be configured to be multifunctional with a first functionality of EMI attenuation and a second functionality of thermal management. For example, the composition can be configured to operate with more than 15 decibels of reflection loss at frequencies from about 40 gigahertz (GHz) to about 120 GHz and have high thermal conductivity (e.g. in a range of about 1 W / mK (watt per meter per Kelvin) to about 10 W / mK etc.). The composition can contain about 0.5 volume percent or less of the carbon nanotubes. The carbon nanotubes can have single-walled carbon nanotubes, multi-walled carbon nanotubes and / or carbon nanostructures which have a branched network of crosslinked carbon nanotube structures. The polymer resin can have a liquid silicone and / or thermosetting material matrix.

The method may include mixing the carbon nanotubes into the liquid silicone and / or thermosetting material matrix, which is composed such that the composition contains an amount of the carbon nanotubes in a range from about 0.1 volume percent to about 0.5 volume percent contains.

The method may include pouring or pouring the composition into a mold and molding the composition into a molded article having a pattern of EMI absorbers. The EMI absorbers may have rectangular pyramidal structures that protrude outwardly along at least one side of the molding and include rectangular bases that are configured such that the rectangular bases of adjacent rectangular pyramidal structures have substantially no gaps or spaces between the rectangular bases of the adjacent rectangular ones Touch pyramid structures. Molding the composition into a molded part may include injection molding the composition into a radar mount.

In addition, exemplary embodiments of films (e.g. multilayer block copolymer films, homogeneous block copolymer films, single-layer block copolymer films, etc.) and structured materials (e.g. structurally capable polymers from roll to roll, etc.) are disclosed that can have a controlled and / or tailored behavior (e.g. thermal management, Electromagnetic interference (EMI) mitigation, electrical conductivity, thermal conductivity, EMI absorption, magnetic, dielectric and / or structural performance, etc.). In addition, exemplary embodiments of systems and methods for making such multilayer films, structured materials, and single-layer / homogeneous films are disclosed. Exemplary embodiments of thermal management and / or EMI attenuation materials, board level shields, and components are also disclosed. For example, an electronic device (e.g. smartphone, smartwatch, 5G antenna in housing (AIP), etc.) can contain one or more of the following components: multilayer film, structured material, single layer / homogeneous film, shielding at circuit board level and / or material for thermal management and / or EMI attenuation as disclosed herein.

In exemplary embodiments, a material contains a pattern of structures (eg patterns of pyramidal structures, hierarchical structures Patterns, patterns of non-pyramidal structures, patterns of bell-shaped structures, combinations thereof, etc.). The material can have a filled dielectric, such as polydimethylsiloxane (a), which is filled with carbon black and / or carbon nanotubes (e.g. single-walled carbon nanotubes, multi-walled carbon nanotubes and / or carbon nanostructures, etc.), a filled block copolymer system , a filled elastomeric system (e.g. cured elastomers, thermoplastic elastomers (TPE), thermoplastic Santoprene vulcanizate, etc.), a filled thermoplastic system (e.g., liquid silicone, urethane, polycarbonate, polyamide, polyester, polyolefin, polybutylene terephthalate, thermoplastic vulcanizate, elastomer , a mixture containing polyolefin, acrylonitrile-butadiene-styrene (ABS), polypropylene (PP), polyethylene (PE), etc.), injection-moldable and / or polymer resin, which is made with single-walled carbon nanotubes, multi-walled carbon nanotubes and / or Carbon nanostructures is filled, etc. The structural pattern can be a pattern of pyramidal structures (e.g.rechtec square pyramids, truncated pyramids with a rectangular base, pyramidal structures according to 1A-1E , etc.), non-pyramidal structures or a combination of pyramidal structures and non-pyramidal structures.

Now referring to the figures show 1A-1E an exemplary pyramid pattern 100 for a material (eg film, layer, etc.) according to an exemplary embodiment. The sample dimensions in centimeters (cm) are for illustrative purposes only. Other exemplary embodiments may include a different pattern than FIG 1A-1E shown, such as a pattern of non-pyramidal structures, structures with different dimensions, structures in a different pattern or layout, a combination of pyramidal structures and non-pyramidal structures, etc.

2A-2E each show steps of an exemplary method 200 in relation to the production of patterns (e.g. pyramidal patterns, shown in 1A-1E , non-pyramidal patterns, combinations thereof, etc.) in filled dielectric systems (e.g., polydimethylsiloxanes (PDMS) filled with carbon black and / or carbon nanotubes, filled block copolymer systems, filled elastomeric systems, filled thermoplastic systems, injection molding resin filled with carbon nanotubes , polymer resin filled with carbon nanotubes, etc.) according to exemplary embodiments. In general, this exemplary process includes computer design to model the part, 3D printing or additive manufacturing to create the modeled part, finishing the 3D printed part for the final properties (e.g., gloss, etc.), using the 3D printed part to make a shape and the use of the shape (e.g. by casting, injection molding, etc.) to make a material that contains a pattern in a filled dielectric system.

A first step 201 ( 2A) contains computer engineering to model the part. Computer modeling of the 3D part, eg with the help of computer-aided design (CAD), etc. A second step 202 ( 2 B) includes 3D printing or additive manufacturing (e.g., fused deposition molding (FDM), stereolithography (SLA), laser direct structuring (LDS), etc.) of the modeled part based on information from the computer design of the modeled part. The 3D-printed part (e.g. 3D-printed thermoplastic positive master, etc.) can then be subjected to post-processing, e.g. removing excess material, post-curing, applying a surface layer for a matt or glossy surface, etc.

A third step 203 ( 2C ) involves the replication of a shape (e.g. elastomer, etc.) using the 3D printed part. For example, the 3D printed part can be used to replicate patterns in a negative mold in a variety of ways. For example, the 3D printed part can be used to replicate patterns in a negative mold made of polydimethylsiloxane (PDMS) using melt deposition, stereolithography, etc. The negative mold can be surface treated, e.g. with a separating layer (e.g. self-made monolayer, other barrier or separating layers, etc.) for easier demolding, ultraviolet (UV) glazing, vapor-phase silanization, etc.

As another example, frontal photopolymerization and polymerizable photoresists can be used to create a negative PDMS mold, e.g. from rigid thiol-ene patterns, etc. Another example is CNC milling (computer numerical control) to produce a negative mold Metal (e.g. aluminum etc.). Another example includes frontal photopolymerization with thiol-ene as an optical adhesive that is cured on a PDMS mold under a UV lamp on a conveyor belt of a continuous process (e.g. configured so that multiple passes under the UV lamp during curing etc.). An additional example involves replicating patterns in thermosetting plastics to create a shape from which parts (e.g. thermosetting, thermoplastic, elastomer, etc.) can be further replicated.

A fourth step 204 ( 2D ) includes the production of parts from PDMS and carbon black using the negative mold. For example, this fourth step 204 after making the inverse PDMS form (negative pattern) from the 3D printing master (positive pattern). In this fourth step 204 the negative mold is used as a starting point for the production of a pattern (e.g. pyramid pattern, other geometric patterns, etc.) in a filled dielectric, e.g. PDMS filled with carbon black, injection molding resin filled with carbon nanotubes, polymer resin filled with carbon nanotubes, etc. A mixture of PDMS and soot (or another filled dielectric) can be applied to the negative mold (e.g. poured, etc.) and then degassed and cured in the oven before the PDMS / soot part is removed from the negative mold (e.g. peeled off, etc.) ) becomes.

A fifth step 205 ( 2E) may include testing of molded PDMS and carbon black parts. For example, the height and width of the samples produced on the molded parts can be analyzed. Or the molded parts can be subjected to a reflection test, for example. As another example, the PDMS negative mold can be subjected to durability tests to determine how many molded parts (e.g. at least 20 filled elastomer parts, etc.) can be made with a single mold before the height and model fidelity after casting multiple parts from the single one Form begin to subside.

In alternative exemplary embodiments, other methods for producing materials with patterns in filled dielectric systems can alternatively or additionally be used. The example processes include roll-to-roll processes such as a roll-to-roll process for patternable polymers for continuous replication of patterns, a roll-to-roll process with multiple nozzles for the simultaneous delivery of materials onto a film or a layer, etc. Other example processes include extrusion, curtain coating, 3D printing or additive manufacturing (e.g. melt flow coating, stereolithography, laser direct structuring with casting, etc.), frontal photopolymerization with photo mask and / or with soft master, CNC milling (computer-controlled numerical control ), Injection molding or compression molding (e.g. with thermoset molds etc.), soft molds (e.g. with preformed (cross-linked) PDMS molds etc.), UV systems with conveyor belts, thermoplastic replication, thermoset masters, thiols with a soft master, inkjetting (e.g. inkjetting of dielectrics on metal for insulation etc.), screen printing, spraying, laser welding of discrete layers (e.g., in different depths in different layers, etc.), laser structuring on polyimide film to enable plating (e.g. Cladding for FSS elements, etc.), casting, injection molding, rolling / forming processes, integrated parts that include pyramidal surfaces in the design, etc.

In an exemplary embodiment, a 3D printed mold insert can be used in conjunction with a compression or injection molding process. The model production can be carried out in a vacuum cabinet. For example, a printed 3D master can be placed on a sheet of metal. A flat composite sheet (e.g., carbon black filled polycaprolactone, etc.) made by compression molding can then be placed on top of the 3D printed master and surrounded by a bracket. A weight (e.g. a metal block, etc.) can be placed on the composite sheet. The pattern is created in the composite panel from the negative pattern of the 3D printing template, whereby the gravity of the weight on the composite panel is used. The materials are heated in an oven and then removed from the oven. The materials are cooled before the composite material is separated from the 3D printed template.

In an exemplary embodiment, a roll-to-roll process can be used to produce materials with patterns in filled dielectric systems. This process can contain roll-to-roll self-aligning self-patterning block copolymers with sufficient particle loading for good or satisfactory performance. A patterned PDMS tape can be used for patterning together with heating plates, e.g. in a tunnel oven etc. The patterned PDMS tape can contain several negatively patterned parts (e.g. silicone, etc.), the ends of which are glued or bonded together with PDMS. The PDMS can be cured along the joints between the ends of the negative patterned parts. The patterned PDMS tape is wrapped around reels. The rollers can be spaced a sufficient distance from one another to prevent the patterned PDMS tape from sagging.

During the roll-to-roll process, a carrier (e.g. aluminum carrier with a release liner, etc.) for an uncured mixture of PDMS and carbon black (or other filled dielectric system) is moved over the hot plate. The patterned PDMS tape contacts the uncured mixture of PDMS and carbon black. After sufficient contact time with the patterned PDMS tape to allow complete mold filling, the process of curing the uncured mixture of PDMS and carbon black can begin. The cured PDMS and soot can then be removed (e.g., peeled, etc.) from the patterned PDMS tape and carrier.

In an exemplary implementation, a gradual deposition process may be used to create patterns (e.g., pyramidal patterns as in FIG 1A-1E shown, non-pyramidal patterns, combination thereof, etc.) along of a material. In this exemplary embodiment, the process may include the gradual deposition of materials (eg, thermally conductive, electrically conductive, EMI absorbing, magnetic and / or dielectric materials, etc.) onto a functional carrier film. The functional carrier film can be a filled dielectric system, such as, for example, polydimethylsiloxane (PDMS) filled with carbon black, a filled block copolymer system, a filled elastomeric system (e.g. cured elastomers, thermoplastic elastomers (TPEs), thermoplastic Santoprene vulcanizate, etc.), a filled thermoplastic system (e.g. liquid silicone, urethane, polycarbonate, polyamide, polyester, polyolefin, polybutylene terephthalate, thermoplastic vulcanizate, thermoplastic elastomer, a mixture containing polyolefin, acrylonitrile-butadiene-styrene (ABS), polypropylene (PP), polyethylene (PE), etc.) , an injection molding resin filled with carbon nanotubes, a polymer resin filled with carbon nanotubes, etc.) The functional carrier film may include Kapton polyimide film, Mylar polyester film, thermoplastic film that can be printed with stereolithography (SLA), etc.

In exemplary embodiments, materials can be applied to the functional carrier film or otherwise applied by spraying, printing, additive manufacturing, etc. For example, materials can be applied to a functional carrier film by laser beam printing a first layer of material (e.g., electrically conductive and / or thermally conductive ink, etc.). A second layer of the same or a different material can be printed onto the first layer by means of a laser beam. This can be done as part of a roll-to-roll process to which a laser beam printer has been added.

In exemplary embodiments, a film or layer can be provided with materials of different thicknesses or heights to compensate for variations in the height of shorter and taller PCB components. For example, an additive manufacturing process can be used to apply a thermally conductive material of different thicknesses along a lower layer of a multilayer film structure so that the thicker and thinner thermally conductive material areas are arranged over the upper surfaces of shorter and higher PCB components respectively and these are under pressure when installing the multilayer film structure over the PCB components. As another example, additive manufacturing can be used to apply thermally conductive material along the top surfaces of shorter PCB components, thereby increasing the overall height of the shorter components and thermally conductive material.

In exemplary embodiments, a lower film or a lower layer of a multi-layer film structure can be configured so that the multi-layer film structure can be detached from and reattachable to a PCB, e.g., by tacking, gluing, mechanical attachment, etc. For example, the multi-layer film structure can be attached to the PCB PCB attached, removed from it (e.g. for access to the PVB components etc.) and attached again to the PCB without damaging the multilayer film structure (e.g. without cutting, without deformation by stretching etc.).

The methods described above can be used to produce a variety of patterns of different structural shapes (e.g., rectangular pyramids, pyramidal structures, non-pyramidal structures, combinations thereof, etc.), including the exemplary patterns of structures shown in FIG 5 to 15th to be shown. A pattern of structures can also be provided by other suitable methods. For example, a structural pattern may comprise a multilayer film, a single layer film, or a homogeneous layer / film with areas of continuous thickness designed for a particular performance as disclosed herein. Or a structural pattern can include metamaterial, for example.

In exemplary embodiments, a multilayer film (broadly a multilayer structure) includes multiple block copolymer films or layers with areas of continuous thickness. As an example, the block copolymer can be polystyrene-polyethylene block copolymer (e.g., polystyrene-block-poly (ethylene oxide) (PS-b-PEO), etc.), polystyrene-acrylate block copolymer (e.g., polystyrene and poly (methyl methacrylate) (PS-PMMA), etc.) .), Styrene-diene block copolymer (e.g. styrene-butadiene (SB) -diblock copolymer, styrene-isoprene-diblock copolymer, styrene-butadiene-styrene (SBS) -triblock copolymer, styrene-isoprene-styrene (SIS) -triblock copolymer, styrene-butadiene (SB) star block copolymer etc.), hydrogenated styrene-diene block copolymer (e.g. hydrogenated SBS-styrene (ethylene-butylene) -styrene etc.), segmented block copolymer (e.g. segmented polyester-polyether, segmented polyamide-polyether, etc.), polyolefinic block copolymer, ethylene oxide / propylene oxide block copolymer, organosilicon copolymer system (e.g., siloxane / polysulfone copolymers, siloxane / polyurethane, siloxane / polyurea copolymers, siloxane / polyamide copolymers, siloxane / polyimide copolymers, siloxane / polyamide / polyimide -Copolymers, siloxane / polyester copolymers, Si loxane / polycarbonate copolymers, siloxane / polystyrene copolymers, siloxane / epoxy resin networks, etc.), hard block copolymers, other block copolymers and / or combinations thereof. In an exemplary embodiment, the block copolymer films or layers comprise polystyrene-block-poly ( ethylene oxide) (PS-b-PEO) and / or polystyrene and poly (methyl methacrylate) (PS-PMMA), although other block copolymers can be used in other exemplary embodiments.

A specific filler (s) may preferably be added to an area, thereby enhancing a property of that area of the block copolymer film. In exemplary embodiments disclosed here, one or more fillers are added to areas of multiple block copolymer films, thereby tailoring the areas of the multiple block copolymer films to specific function (s) (e.g. thermal management, attenuation of electromagnetic interference (EMI), electrical conductivity , Thermal conductivity, EMI absorption, magnetic, dielectric and / or structural function, etc.).

The multiple block copolymer films with the tailored areas can be assembled (e.g., laminated, stacked, etc.) into a multi-layer structure (e.g., a laminate structure, etc.). The multilayer structure can be created by a roll-to-roll process, centrifugal casting, extrusion, curtain coating, 3D printing, additive manufacturing (e.g. fused deposition molding (FDM), stereolithography (SLA), laser direct structuring (LDS), etc. .), Casting, etc.

In exemplary embodiments, vertical orientation control and preferred segregation / dispersion of fillers (e.g. functional nanoparticles, nickel-cobalt, boron nitride, coated filler particles, etc.) can be used to cut areas with continuous thickness of individual films or layers so that they have specific electrical, have thermal, magnetic, dielectric and / or structural functions. By controlling the area size, shape and structure within the multiple films or layers, the areas can be configured to have a pattern (e.g., a macro pattern or a hierarchical pattern based on patterns in each layer, etc.) or a gradient ( e.g. an impedance gradient that is built up by filler loading over areas of the multilayer block copolymer films / layers etc.) etc.

The areas can be configured so that the multilayers have different functions. The areas within a layer can be configured differently or in the same way as the areas of one or more other layers (e.g. for controlled function etc.).

The multiple films or layers can be configured differently. For example, the films or layers can have different thicknesses, can contain different fillers (e.g. different materials, sizes and / or shapes, etc.), can be made from different base or matrix materials, can have differently configured areas (e.g. tailored to different functions, different sizes, different locations etc.) etc.

For example, a multilayer film structure can include a plurality of films or layers, at least one or more of which have a different base or matrix material and / or a different type of filler than at least one or more of the other films or layers. In this example, the multilayer film structure may comprise a first film or layer comprising a first base or matrix material and a first type of filler (e.g., thermally conductive filler, etc.). The multilayer film structure can further comprise a second film or a second layer comprising a second base or matrix material, which is different from the first base or matrix material, and a second type of filler (e.g. electrically conductive and / or EMI absorbing filler, etc.) ) different from the first type of filler.

Alternative exemplary embodiments may include polymer films / layers that are homogeneous or single-layer structures and / or that are not separate block copolymers. For example, a homogeneous or monolayer film structure may contain tailored regions of continuous thickness that are spaced from one another within the homogeneous or monolayer film structure to have specific electrical, thermal, magnetic, dielectric and / or structural properties. Vertical orientation control and preferred segregation / dispersion of fillers (e.g. functional nanoparticles, nickel-cobalt, boron nitride, coated filler particles, etc.) can be used to space and adjust the areas of continuous thickness within the homogeneous or single-layer film structure. By controlling the area size, shape and structure within the homogeneous or single-layer film structure, the areas can be configured to have a pattern (e.g., a macro-pattern or a hierarchical pattern based on patterns in the single layer, etc.) or a gradient (eg an impedance gradient that is built up over areas of the individual layer by filler loading, etc.) etc. The regions can be configured so that the various spaced apart portions of the homogeneous or single layer film structure serve different functions. The areas within the first and The second spaced-apart portion of the homogeneous or single-layer film structure can be configured differently or identically (eg for controlled function, etc.).

3 illustrates a multilayer film structure 300 according to an exemplary embodiment that embodies one or more aspects of the present disclosure. As shown, the multilayer includes film structure 300 four films or layers in each of the four layers 302 , 304 , 306 , 308 or areas with continuous thickness 310 , 312 , 314 , 316 . In alternative embodiments, the multi-layer film structure may be configured differently, e.g. with more or less than four layers, more or fewer areas of continuous thickness, etc.

The areas within the individual layers can be tailored to have certain features, properties, functions and / or performances, for example electrical, thermal, magnetic, dielectric and / or structural, etc. For example, areas 310 in the first or top layer 302 configured for the thermal function. The areas 312 , 314 in the respective second and third layer 304 , 306 can be configured for EMI attenuation, eg electrically conductive, EMI absorbing, magnetic, etc. The areas 316 in the fourth or lower layer 308 can be configured for the dielectric function.

The areas in each layer can create a pattern that is tailored to, or unique to, that particular layer. The patterns of the individual layers can work together to define or create a macro-pattern (e.g., through thickness, etc.) in the multilayer film structure. For example, areas of one layer can be vertically aligned with areas of another layer and / or at least partially overlap with these, so that the vertically aligned and / or at least partially overlapping areas within the layers interact to create a path (e.g. electrically conductive and / or thermally conductive path, passage, crevice, etc.) defined vertically through the thickness of the layers.

In an exemplary embodiment, the regions of the various layers may contain vertically oriented thermally conductive and / or electrically conductive fillers that create a vertical, through-thickness conductive path through the various layers. For example, a thermal path can be provided that has a relatively high thermal conductivity that can be sufficiently high to perform well even when the multilayer film structure has a relatively high contact resistance. Depending on the contact resistance of the multi-layer film structure, a relatively thin, soft and conformable thermally conductive layer can be added to reduce the contact resistance and achieve better thermal performance.

Block copolymer can be used as a base or matrix material 320 for one or more of the four in 3 films shown 302 , 304 , 306 , 308 be used. For example, polystyrene block poly (ethylene oxide) (PS-b-PEO) can be used as the base or matrix material 320 for only one, two, three or all films of the multilayer film structure 300 be used. Or, for example, polystyrene and poly (methyl methacrylate) (PS-PMMA) can be used as the base or matrix material 320 for only one, two, three or all films of the multilayer film structure 300 be used. Instead, another polymer can be chosen that allows larger area sizes than the area sizes achievable with polystyrene block poly (ethylene oxide) (PS-b-PEO) and / or polystyrene and poly (methyl methacrylate) (PS-PMMA). In other embodiments, other base or matrix materials can be used for one or more of the films, such as polystyrene-polyethylene block copolymer, another polystyrene-acrylate block copolymer, styrene-diene block copolymer (e.g., styrene-butadiene (SB) diblock copolymer , Styrene-isoprene diblock copolymer, styrene-butadiene-styrene (SBS) triblock copolymer, styrene-isoprene-styrene (SIS) triblock copolymer, styrene-butadiene (SB) star block copolymer, etc.), hydrogenated styrene-diene block copolymer (e.g. hydrogenated SBS-styrene- (ethylene-butylene) -styrene, etc.), segmented block copolymer (e.g. segmented polyester-polyether, segmented polyamide-polyether, etc.), polyolefinic. Block copolymer, ethylene oxide / propylene oxide block copolymer, organosilicon copolymer system (e.g., siloxane / polysulfone copolymers, siloxane / polyurethane, siloxane / polyurea copolymers, siloxane / polyamide copolymers, siloxane / polyimide copolymers, siloxane / polyamide / polyimide Copolymers, siloxane / polyester copolymers, siloxane / polycarbonate copolymers, siloxane / polystyrene copolymers, siloxane / epoxy resin networks, etc.), hard block copolymers, other block copolymers and / or combinations thereof.

A variety of fillers can be incorporated into the base or matrix material 320 of a film can be incorporated in order to adapt, modify and / or functionally adjust the properties of the resulting film. The fillers can contain functional nanoparticles, electrically conductive fillers, thermally conductive fillers, EMI or microwave absorbing fillers, magnetic fillers, dielectric fillers, coated fillers, combinations thereof and so on. The fillers can be added to a bulk material including the base or matrix material and mixed, thereby providing a mixture of the filler and the base or matrix material. Examples of fillers include carbon black, boron nitride, nickel-cobalt, air-filled microballoons, air-filled microbubbles, air-filled microspheres, carbonyl iron, iron silicide, iron particles, iron-chromium compounds, silver, an alloy containing 85% iron, 9.5% silicon and 5. 5% aluminum, an alloy containing about 20% iron and 80% nickel, ferrites, magnetic alloys, magnetic powders, magnetic flakes, magnetic particles, nickel-based alloys and powders, chromium alloys, aluminum oxide, copper, zinc oxide, aluminum oxide, aluminum, Graphite, ceramic, silicon carbide, manganese zinc, glass fiber, carbon nanotubes (e.g., single-walled carbon nanotubes, multi-walled carbon nanotubes and / or carbon nanostructures, etc.), combinations thereof, etc. The fillers can be one or more grains, spheroids, microspheres , Ellipsoids, irregular spheroids, strands, flakes, powders, nanotubes and / or a combination of one or all of these shapes . In addition, exemplary embodiments may also include different grades (e.g., different sizes, different purities, different shapes, etc.) of the same (or different) fillers.

In an exemplary embodiment, the films may be of a multilayer film structure (e.g., the films 302 , 304 , 306 and or 308 the in 3 multilayer film structure shown 300 etc.) by casting, film extrusion, lamination, etc.

4th Figure 10 shows an exemplary embodiment of a multilayer film structure 400 (e.g., a four-layer film structure, etc.) in accordance with an exemplary embodiment that embodies one or more aspects of the present disclosure. In this exemplary embodiment, the filler density per layer decreases in one direction from the top layer 402 to the lower layer 408 to, as indicated by the arrow. Accordingly, the lower layer has 408 the highest filler density while the top layer 402 has the lowest filler density. With regard to the two intermediate layers 404 , 406 between the top and bottom layers 402 , 408 has the lower intermediate layer 406 a higher filler density than the top intermediate layer 406 . The overall thickness or height dimension of the multilayer film structure 400 can be about 1.7 millimeters (mm). However, this 1.7 mm dimension is for illustrative purposes only, as multilayer film structures in other embodiments can be thicker or thinner than 1.7 mm. In addition, the in 4th multilayer film structure shown 400 four layers 402 , 404 , 406 , 408 , but other exemplary embodiments may include a multilayer film structure with more or less than four layers.

In exemplary embodiments, a multilayer film structure may include films with functionality in discrete discrete areas, e.g., for electrical, thermal, absorber, magnetic, dielectric, and / or structural applications, etc. For example, a multilayer film structure may include films configured to they have thermal management functionality, EMI shielding functionality and EMI absorbing functionality in discrete discrete areas of the multilayer film structure.

A multilayer film structure may have different charges within the layers or films for different performance, effects, etc. For example, a multilayer film structure may have a different charge from layer to layer, using this different charge to attenuate EMI (e.g., absorbing high frequency EMI, etc.) in a manner similar to EMI attenuation by the pyramidal or non-pyramidal structures shown in 5-15 and 21st shown and described here can work.

In exemplary embodiments, a multilayer film structure and / or structured material can be provided with a carrier, e.g. by a metallization process, lamination, tape casting, vacuum deposition, other suitable methods, combinations thereof, etc. The carrier can be one or more metals (e.g. aluminum, copper, etc.) .), coated metals (e.g. nickel-coated aluminum, etc.), clad metals, metallized polymer films / plastics, aluminized biaxially oriented Mylar polyethylene terephthalate (BoPET), other carrier materials, a combination thereof, etc. For example, a substrate containing metal (e.g., aluminum, copper, etc.) (e.g., by a metallization process, etc.) may be placed along an outer exposed surface of a multilayer film structure, such as the bottom of the multilayer film structure 300 and or 400 , as in 3 or. 4th shown, etc., can be provided. Or, for example, a substrate containing metal (e.g. aluminum, copper, etc.) can be provided along the underside of a patterned material (e.g. by a metallization process, etc.), such as the underside of the patterned material 500 , 600 and or 2100 , as in 5 or. 6th or 21st etc. shown.

In exemplary embodiments, a multilayer film structure and / or a patterned material may be used depending on those used Materials have a relatively high contact resistance. Or the multilayer film structure and / or the structured material can be provided, for example, with one or more thermally conductive columns or pillars (generally sections) with very high thermal conductivity in order to compensate for and / or overcome a relatively high contact resistance.

In exemplary embodiments, one or more thermal compensation materials, heat spreaders, thermoelectric modules, etc. having a multilayer film structure and / or a patterned material can be used. For example, a heat spreader (e.g., a graphite heat spreader, etc.) can be placed along the multilayer film structure (e.g., laminated to the films, sealed between the films by laser welding, etc.). Or, for example, a thermoelectric module can be arranged along the multilayer film structure.

As another example, one or more thermal compensation materials can be disposed along a top and / or bottom of the multilayer film structure. In this latter example, the thermal compensation material (s) can help compensate for differences in the height of shorter and taller PCB components. For example, thermal compensation materials can be placed along a bottom of a multilayer film structure so that the thermal compensation materials are placed over the tops of the PCB components and contact them under pressure when the multilayer film structure is installed over the PCB components. Thermal compensation materials can also be placed along a top surface of a multilayer film structure so that the thermal compensation materials contact a heat spreader (e.g., an outer housing or device housing, etc.) under pressure. Examples of thermal compensation materials include thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbers or hybrid thermal / EMI absorbers, thermal greases, thermal paste, thermal putties, dispensable thermal compensation materials, thermal paths, etc.

Exemplary embodiments may include one or more radiating antenna elements defined or created by regions in one or more layers or films of a multilayer film structure, a homogeneous film structure, or a single layer film structure. Exemplary embodiments may include a film structure (e.g., a multilayer film structure, a homogeneous film structure, a single-layer film structure, etc.) having one or more layers or films configured (e.g., with areas being laid out, etc.) to accommodate the Protect the environment (e.g. vapor or oxygen barriers, etc.). Exemplary embodiments may include one or more waveguides defined or created by regions in one or more layers or films of a multilayer film structure, a homogeneous film structure, or a single layer film structure. Accordingly, example embodiments may include multi-layer film structures with multiple layers or films with regions configured to provide one or more radiating antenna elements, one or more waveguides, EMI attenuation, thermal management, dielectric properties, structure and / or environmental protection, etc. . Exemplary embodiments may also include homogeneous or single layer film structures with a single or individual layer or film with regions configured to include one or more radiating antenna elements, one or more waveguides, EMI attenuation, thermal management, dielectric properties, structure and / or provide environmental protection, etc.

5-15 and 21st Illustrate example structures (eg, pyramidal structures, non-pyramidal structures, etc.) configured for EMI attenuation (eg, absorbing radio frequencies, etc.) according to example embodiments that embody one or more aspects of the present disclosure. In exemplary embodiments (e.g. 7-15 etc.) the structures can be arranged lengthways (e.g., glued etc.) and protrude outwardly from a portion of a plate level shield (BLS). For example, the structures may protrude outward from an inner and / or outer surface of a top, a cover, a lid, one or more side walls, a fence, a frame, etc. of a BLS. The BLS can be configured (e.g., made of metal, shaped, sized, etc.) to attenuate (e.g., block, reflect, etc.) low frequency EMI. The structures can be configured (e.g., made from EMI absorbing materials, shaped, dimensioned, etc.) to attenuate (e.g., absorb, etc.) high frequency EMI.

5-15 and 21st exemplify pyramidal structures that are rectangular pyramids. The rectangular bases of adjacent pyramids can contact one another with essentially no gaps or spaces between the rectangular bases. This helps avoid reflections that could otherwise occur if there were gaps between the rectangular bases of the pyramidal structures. Other exemplary embodiments may not- be pyramidal structures that taper from the tip (e.g. from a point etc.) to the base or decrease in width (e.g. generally curve gently etc.). For example illustrate 14th and 15th exemplary embodiments using non-pyramidal structures 1400 or. 1500 contain. Alternative exemplary embodiments may include structures with non-rectangular bases, such as hexagonal bases, triangular bases, etc. Accordingly, the present disclosure is not intended to be limited to rectangular pyramidal structures only, as other exemplary embodiments may include structures with different three-dimensional geometric shapes.

In exemplary embodiments, the sides of the structures may not be perfectly smooth or may not define a perfectly straight line from top to bottom. For example, the pages may have a stepped configuration when enlarged. But the sides of the pyramidal or non-pyramidal structures may preferably be relatively smooth (e.g., without appreciably large steps, etc.) in order to reduce or avoid reflection of EMI events on the structures. In addition, the structures can be configured to have a different slope or taper (e.g., at least two or more gradations, etc.) along the sides. For example, a pyramidal structure may have a relatively gradual taper from the base to a central portion, a greater taper from the central portion up to the top, and then less taper from there to the top of the structure.

In the 5-15 and 21st The structures shown in 2A-2E methods shown and described above. In the 5-15 and 21st The structures shown may include a filled dielectric, such as a carbon black-filled polydimethylsiloxane (PDMS), a filled block copolymer system, a filled elastomeric system, a filled thermoplastic system, and so on. Alternatively, the in 5-15 and 21st The structures shown can be produced from other materials and / or by other suitable methods (eg a step-wise deposition of material on a functional carrier film, etc.). The structures can have one or more first structures along a first layer and one or more second structures along a second layer. The first and second structures can be configured differently, e.g. different shapes, different heights, made of different materials, etc.

In exemplary embodiments, the configuration (e.g., height, shape, location, etc.) of the structures may not be randomized or randomized (e.g., by a computerized randomization process, etc.). Randomizing the height of the structures along a BLS interior can help reduce or avoid cavity resonances under the BLS. Exemplary embodiments may be rectangular pyramidal structures with the same base size, but one or more of the rectangular pyramidal structures may have a different height than one or more other rectangular pyramidal structures. For example, taller pyramids can be along the edges or the outer perimeter, while shorter pyramids can be located in a central or inner area that is spaced inwardly from the edges or the outer perimeter.

Structures of different heights can be used to accommodate for variations in the height of shorter and taller PCB components. For example, taller and shorter structures can be placed along an inner surface of a BLS cover or lid so that the taller and shorter structures are generally placed over shorter and taller PCB components, respectively, when the BLS is installed over the PCB components . The different heights of the structures can also help avoid or reduce cavity resonance under the BLS.

5 shows the filled dielectric 538 including the pyramidal structures 540 according to an exemplary embodiment 500 that embodies one or more aspects of the present disclosure. As shown, contain the pyramidal structures 540 air-filled particles 542 (e.g., air-filled microballoons, air-filled microbubbles, air-filled microspheres, etc.) within the filled dielectric 538 . The air-filled particles 542 add the pyramidal structures 540 Air is added, as a result of which the dielectric constant is reduced (e.g. controllably reduced, etc.). With the air-filled particles 542 this can be the dielectric constant of the pyramidal structures 540 approximate the dielectric constant of foam and / or approximate the dielectric properties of foam.

Additionally or alternatively to loading or filling with air-filled particles 542 Pyramidal and / or non-pyramidal structures can be used in other exemplary embodiments with polymer that contains air-filled particles (e.g. air-filled microballoons, air-filled microbubbles, air-filled microspheres, hollow glass, plastic and / or ceramic microspheres, other microspheres, etc. ) covered or coated. An exemplary embodiment can, for example, be pyramidal Include structures coated or covered with microballoon-filled polymer, e.g. for environmental resistance, etc. In this example, the microballoon-filled polymer can cover the pyramidal structures and define a planarization layer to fill the spaces between the pyramidal structures. The inverse pyramidal structures of the microballoon-filled planarization polymer layer can nest or intertwine with the pyramidal structures such that the combined pyramidal structures and the microballoon-filled planarization polymer layer have a generally flat, sheet-like configuration. The planarization polymer layer filled with microballoons can prevent or avoid the filling of the spaces, pores, openings, gaps, etc. between the pyramidal structures by dirt and / or other impurities. For example, the polymer filled with microballoons can have a low dielectric loss, a low dielectric constant (e.g. less than 10, between 1 and 2, less than 1, etc.), material like Laird's LoK with low dielectric loss, material with low dielectric constant that thermoset plastic or silicone rubber and hollow glass microspheres, etc. Alternatively, other materials (e.g. including materials that do not have low dielectric loss, materials with low dielectric constant and / or that do not contain hollow glass microspheres, etc.) can be used for the formation of a planarization layer and / or for the covering or coating of pyramidal and / or Non-pyramidal structures can be used to prevent or prevent dirt and / or other contaminants from filling the spaces, pores, openings, gaps, etc. between the pyramidal and / or non-pyramidal structures in other exemplary embodiments. Accordingly, aspects of the present disclosure include methods of preventing or preventing dirt and / or other contaminants from filling the spaces, pores, openings, gaps, etc. between the pyramidal and / or non-pyramidal structures disclosed herein.

6th shows an EMI absorber 644 with pyramidal structures 640 , a planarization layer 646 and a multi-layer frequency selective surface structure (FSS) 648 according to an exemplary embodiment 600 that embodies one or more aspects of the present disclosure. As shown, the EMI absorber can 644 and the pyramidal structures 640 Polydimethylsiloxane (PDMS) filled with carbon black, a filled block copolymer system, a filled elastomeric system (e.g. hardened elastomers, thermoplastic elastomers (TPE), thermoplastic Santoprene vulcanisate etc.), a filled thermoplastic system (e.g. polyamide, acrylonitrile-butadiene-styrene (ABS ), Polypropylene (PP), polyethylene (PE), etc.), injection molding resin filled with carbon nanotubes, polymer resin filled with carbon nanotubes, etc.

As in 6th illustrated, contains or defines the planarization layer 646 inverse, downwardly protruding pyramidal structures 650 for filling in the spaces between the upwardly protruding pyramidal structures 640 of the EMI absorber 644 . The inverse pyramidal structures 650 the planarization layer 646 can deal with the pyramidal structures 640 nest or intertwine so that the combination of the EMI absorber 644 and the planarization layer 646 has a generally flat, sheet-like configuration.

The planarization layer 646 may comprise a dielectric material (e.g., graded dielectric for impedance matching, a uniform dielectric planarization layer, etc.), a thermally conductive material, an electrically conductive material, etc. The planarization layer 646 can help strengthen the pyramidal structures before breaking the pyramidal structures 640 to protect, provide adhesion, provide rigidity or structure for fastening purposes and / or adjust the modulus of elasticity and / or prevent or avoid dirt and / or other contaminants from entering the spaces, pores, openings, gaps, etc. between the pyramidal structures 640 to complete. The planarization layer 646 can be provided with different thicknesses to compensate for variations in the height of shorter and taller components of a PCB, SIP, etc.

In exemplary embodiments in which the planarization layer is electrically conductive, one or more dielectric materials (e.g., a thin dielectric layer, etc.) may be provided along exposed outer surface portions of the planarization layer in order to avoid shorting adjacent device components through the electrically conductive planarization layer . As a further example, dielectric material can be embedded in a thermal compensation material (TIM) if the TIM is used as a planarization layer (e.g. injection molded, etc.). The planarization layers described here (e.g. 646 , shown in 6th etc.) can also be used in other exemplary embodiments that include EMI absorbing structures (e.g. 5 , 7-15 and 21st etc.).

In the 6th Multi-layer frequency-selective surface structure (FSS) shown 648 contains several (e.g. three etc.) layers of FSS elements 652 . Alternative embodiments may include an FSS structure with more or less than three layers, e.g., a single layer, two layers, four layers, etc. 19th For example, Figure 3 shows an exemplary embodiment 1900 a multi-layer FSS structure 1948 with four layers 1902 , 1904 , 1906 , 1908 of FSS elements 1952 . Exemplary embodiments may include, for example, a single layer of FSS elements, multiple coplanar rings in a single plane, an electrically conductive metamaterial in a pattern on a dielectric along a bottom of a BLS and / or along a ground plane, and so on. Accordingly, the present disclosure is not intended to be limited to only three or four layer FSS structures.

As in 6th and 19th shown, the layers of the multilayer frequency selective surface structure (FSS) contain 648 , 1948 , each sample of FSS elements 652 , 1952 . The FSS elements can comprise electrically conductive material, EMI-absorbing material and / or metamaterial.

In the illustrated embodiments of 6th and 19th assign the FSS elements 652 , 1952 ring-shaped elements (e.g. circular rings, generally round ring elements, etc.) with open areas or openings. The open areas or openings can contain, for example, perforations or holes that are punched into the layers before or after the FSS elements are provided for the air flow (e.g. patterned onto layers with lasers, etc.). Or the open areas or openings can be formed, for example, by etching or washing away hardened / uncured polymer from the FSS elements. As another example, the FSS layers can be fabricated using a mold configured to form the open areas or openings.

As in 6th shown, the multiple layers of the multilayer FSS structure 648 in a stacked arrangement (e.g. laminate structure, etc.) so that the FSS elements 652 the FSS elements in each layer 652 overlap in the other layers and align vertically with them. The openings or open areas of each layer are thus vertically aligned with the openings or open areas of the other layers. Accordingly, the FSS elements 652 can be used to attenuate EMI without completely blocking air and / or liquid flow through the multi-layer FSS structure, as air and / or liquid can flow within the vertically oriented openings or open areas. Alternative embodiments may include a multilayer FSS structure (e.g. 1948, shown in FIG 19th etc.) that is configured so that any FSS elements do not overlap and are not vertically aligned with other FSS elements, and / or contain FSS elements configured without the openings or open areas.

In exemplary embodiments, the films or layers may have a multilayer FSS structure (e.g. 648 ( 6th ), 1948 ( 19th ) etc.) from block copolymer, polydimethylsiloxane (PDMS), thermoplastic films, which have been produced by the methods specified here, etc.

A multilayer FSS structure (e.g. 648 ( 6th ), 1948 ( 19th ), etc.) may include multiple films or layers of FSS elements provided by a method disclosed herein. As an example, an FSS structure can include FSS elements comprising copper and films or layers comprising biaxially oriented Mylar polyethylene terephthalate (BoPET). In this example, copper patterns from FSS elements can be etched onto the Mylar BoPET films or layers using FR4 / PCB manufacturing processes. As another example, FSS elements can be provided along the films or layers by 3D printing or additive manufacturing (e.g., enamel deposit molding, stereolithography, laser direct structuring with molds (molding), etc.). Or FSS elements can have, for example, electrically conductive ink (for example ink with silver and / or copper etc.) which is applied along the films or layers by means of inkjet printing (for example via a microjet inkjet printer etc.). As another example, impregnated plastic films may contain areas that become electrically conductive after being struck by a laser, these electrically conductive areas defining electrically conductive FSS elements. As another example, films or layers of a multilayer FSS structure can be impregnated with one or more materials, embedded therein and / or printed with one or more materials to create areas of electrical conductivity that pattern the FSS surfaces (e.g. Define rings, etc.). Other methods can also be used to provide a film or sheet of FSS elements.

The films with the electrically conductive FSS elements can be assembled (e.g., stacked, laminated, etc.) to form the multilayer FSS structure. The FSS elements can be stored with absorber (s) in order to reduce the absorber frequency.

In exemplary embodiments, an FSS structure (e.g. 648 ( 6th ), 1948 ( 19th ) etc.) operated to block energy over one or more specific frequency (s) or frequency range (s) while at the same time allowing the passage of one or more different specific frequency (s) or frequency ranges. In this case the FSS structure can be used as a single band or multiband bandpass waveguide and / or as a structure for EMI attenuation.

In exemplary embodiments, one or more FSS elements may have a different shape and / or size than one or more other FSS elements. Another exemplary embodiment can include, for example, an FSS structure with FSS ring elements of different thicknesses and / or different radii.

In exemplary embodiments, the layers of a multilayer FSS structure can be any shape (e.g., rectangular, circular, triangular, etc.) and / or size, e.g., to operate at multiple frequencies and / or over a wider bandwidth, etc. an FSS structure reflecting, absorbing, blocking and / or redirecting signals at almost grazing incidence (90 degrees deviation from normal) in order to stop energy.

7th illustrates the pyramidal structures 740 along an area (e.g. the top, cover, lid, side walls, fence, frame, etc.) of a panel level shield (BLS) 754 according to an exemplary embodiment 700 that embodies one or more aspects of the present disclosure. In the in 7th The example shown are the pyramidal structures 740 rectangular pyramids with a rectangular base. The pyramidal structures 740 may be along the outer surface (s) and / or inward of the inner surface (s) of a top and / or side wall (s) of the BLS (e.g. 11 , 12 and 13th , etc.) and protrude / be extended from these outwards and / or inwards, etc. The pyramidal structures 740 can be configured to attenuate (e.g. absorb, etc.) high frequency EMI. The BLS 754 can be configured (e.g. made of metal, etc.) to attenuate (e.g. block, etc.) low frequency EMI.

8th illustrates pyramidal structures 840 along an area (e.g. top, lid, cover, side walls, fence, frame, etc.) of a shield at panel level (BLS) 854 according to an exemplary embodiment 800 that embodies one or more aspects of the present disclosure. In the in 8th The example shown are the pyramidal structures 840 rectangular pyramids with a rectangular base. The pyramidal structures 840 are not all the same size in this example. For example, the two inner pyramidal structures are shown as having different heights, both of which are less than the heights of the two outer pyramidal structures. The pyramidal structures 840 can be configured to attenuate (e.g. absorb, etc.) high frequency EMI. The BLS 854 can be configured (e.g. made of metal, etc.) to attenuate (e.g. block, etc.) low frequency EMI.

9 illustrates the pyramidal structures 940 along an area (e.g. top, lid, cover, side walls, fence, frame, etc.) of a shield at panel level (BLS) 954 according to an exemplary embodiment 900 that embodies one or more aspects of the present disclosure. In the in 9 In the example shown, air-filled microballoons, microspheres, microbubbles, 942 etc. are contained in the pyramid-shaped structures. The ones through the microballoons, microspheres or microbubbles 942 added air reduces the dielectric constant of the pyramidal structures 940 . The pyramidal structures 940 are rectangular pyramids with a rectangular base. The pyramidal structures 940 can be configured to attenuate (e.g. absorb, etc.) high frequency EMI. The BLS 954 can be configured (e.g. made of metal, etc.) to attenuate (e.g. block, etc.) low frequency EMI.

10 shows pyramidal structures 1040 along an area (e.g. top, lid, cover, side walls, fence, frame, etc.) of a shield at panel level (BLS) 1054 according to an exemplary embodiment 1000 embodying one or more aspects of the present disclosure. In the in 10 The example shown is at least one or more of the pyramidal structures 1040 multilayered. As in 10 shown, the filler density per layer of the multilayer pyramidal structure increases 1040 in a direction from the top layer to the bottom layer as indicated by the arrow. Accordingly, the lower layer has the highest filler density, while the upper layer has the lowest filler density. With regard to the two intermediate layers between the upper and lower layers, the lower intermediate layer has a higher filler density than the upper intermediate layer. The pyramidal structures 1040 can be configured to attenuate (e.g. absorb, etc.) high frequency EMI. The BLS 1054 can (e.g. made of metal, etc.) for Attenuation (e.g. blocking, etc.) of low frequency EMI can be configured.

Just as an example: the multilayer pyramidal structure can have an overall height of about 2 mm or less and layers about 100 microns thick. However, these dimensions are given for illustrative purposes only, as the multilayer pyramidal structure may have a different overall height and / or layers with a different thickness. In the 10 multilayer pyramidal structure shown 100 also includes four layers, but other exemplary embodiments may include a multilayer pyramidal structure with more or less than four layers. For multi-layer film absorber structures (e.g. multi-layer pyramidal structure 1040 , etc.) different gradients of filler material can be used. Multi-layer film absorber structures (e.g. multi-layer pyramidal structure 1040 etc.). may be flexible enough to be wrapped around at least a portion of a shield, device, etc.

11 , 12 and 13th illustrate the pyramidal structures 1140 , 1240 or. 1340 along the top and side walls of a panel-level shield (BLS) 1154 , 1254 , 1354 according to the exemplary embodiments 1100 , 1200 , 1300 that embody one or more aspects of the present disclosure. The BLS is generally installed over an integrated circuit (IC) (generally a component or heat source) on a PCB (generally a substrate). The pyramidal structures can be configured to attenuate (e.g. absorb, etc.) high frequency EMI. The BLS can be configured (e.g. made of metal, etc.) to attenuate (e.g. block, etc.) low frequency EMI.

In the in 11 illustrated exemplary embodiment 1100 are pyramidal structures 1140 shown coming from the inner surfaces of the BLS top 1156 and the BLS sidewalls 1158 protrude inward in a direction common to the integrated circuit 1160 on the PCB 1162 shows.

In the in 12 illustrated exemplary embodiment 1200 are pyramidal structures 1240 shown coming from the outer surfaces of the BLS top 1256 and the BLS sidewalls 1258 outward in a direction generally away from the integrated circuit 1260 on the PCB 1262 protrude.

In the in 13th illustrated exemplary embodiment 1300 are the pyramidal structures 1340 along both the inside and outside surfaces of the BLS top 1356 and the BLS sidewalls 1358 shown so that the pyramidal structures 1340 in opposite directions relative to the BLS 1354 and the integrated circuit 1360 on the PCB 1362 protrude inwards and outwards.

14th shows a pyramidal structure 1440 and non-pyramidal structures 1464 along an area (e.g. top, lid, cover, side walls, fence, frame, etc.) of a shield at panel level (BLS) 1454 according to an exemplary embodiment 1400 that embodies one or more aspects of the present disclosure. The pyramidal and non-pyramidal structures 1440 , 1464 can be configured to attenuate (e.g. absorb, etc.) high frequency EMI. The BLS 1454 can be configured (e.g. made of metal, etc.) to attenuate (e.g. block, etc.) low frequency EMI. As in 14th shown have the non-pyramidal structures 1464 different slopes or tapers along their sides.

15th illustrates structures 1564 along an area (e.g. the top, cover, lid, side walls, fence, frame, etc.) of a panel level shield (BLS) 1554 according to an exemplary embodiment 1500 that embodies one or more aspects of the present disclosure. The structures 1564 can be configured to attenuate (e.g. absorb, etc.) high frequency EMI. The BLS 1554 can be configured (e.g. made of metal, etc.) to attenuate (e.g. block, etc.) low frequency EMI.

As in 15th illustrated is any forest 1564 generally upright and extends generally perpendicular to the area of the BLS 1554 . Any structure 1564 contains pyramids along both sides 1566 , being the pyramids 1566 from the structure 1564 generally extending outward in a direction generally parallel to the BLS area 1554 runs. Through the pyramids 1566 along both sides of the structures 1564 can the in 15th shown double-sided structures 1564 have improved deflection and reduced contact resistance.

In exemplary implementations, EMI absorbing protruding structures (e.g. 5-15 and 21st , etc.) along one or more exposed and / or flat surfaces (e.g. glued, etc.). In such embodiments, an inert, non-functional material (e.g., a protective layer, etc.) can be applied (e.g., coated, etc.) over the EMI-absorbing protruding structures. The Inert non-functional material can be configured to protect the EMI-absorbing protruding structures from deformation (and loss of performance) and / or to allow the EMI-absorbing protruding structures to be pressed onto a surface without affecting the functionality or performance of the EMI-absorbing to affect protruding structures (e.g. without noticeable degradation, etc.).

An exemplary embodiment includes a method of adhering EMI absorbing protruding structures to a surface. In this exemplary embodiment, the method may include applying a protective layer over the three-dimensional shapes of the EMI absorbing protruding structures. The method can further comprise applying a compressive force against the protective layer in order to ensure high adhesive strength (or PSA adhesion) on a surface. The protective layer can be removable and / or inert (e.g. dielectric, non-absorbent, etc.).

Also disclosed herein are exemplary embodiments of device components that include (e.g., include, fabricate from, etc.) multi-layer film structures, patterned materials, metamaterials, and / or functional films. In exemplary embodiments, a multi-layer film structure, patterned material, metamaterial and / or functional film can be integrated into a device component and / or used as such, such as an outer housing, a back wall, a center plate, a sieve plate, an inner plate, an outer skin a device, an interposer, an IC package, etc. In such embodiments, the device component may retain its original functionality, but also have additional functionality (e.g., EMI mitigation, thermal management, dielectric, magnetic, and / or structural, etc.) implemented by the multilayer film structure, the patterned material, the metamaterial and / or the functional film is provided. For example, a multi-layer film structure, patterned material, metamaterial and / or functional film can be integrated into the outer skin of a device, such as a smartphone, a game system console, a smart watch, a 5G antenna in the housing (AlP) etc., and / or as Housing or outer skin can be used.

In exemplary embodiments, a multilayer film structure, patterned material, metamaterial, and / or functional film can be used to transfer heat from one or more hotter areas or areas of a device (e.g., PCB components, etc.) to one or more cooler areas or areas (e.g., other PCB components, unused areas of the PCB, etc.). By looking at a device as a whole for thermal management, rather than treating each individual component separately and transferring heat on a per-component basis, example embodiments may enable more uniform device temperature and improved thermal properties of the device, even when individual components are transferred by heat can be heated by other components. Accordingly, example embodiments may include the use of other parts of an electronic device as heat sinks so that heat is transferred from one component or components to another component or to other components or unused parts of the PCB. For example, an inner panel of an electronic device may have a multilayer film structure, patterned material, metamaterial, and / or a functional film that is used to provide thermal management. The multilayer film structure, the patterned material, the metamaterial and / or the functional film of the inner plate can extract the waste heat from one or more areas and transfer / distribute the waste heat to one or more other areas, thereby creating one or more other areas of the electronic Device heated and the temperature can be increased. This in turn can lead to a more uniform temperature of the device and enable more uniform heat dissipation.

16 Figure 11 illustrates an external device housing 1668 that is a multi-layer film structure (e.g., four-layer film structure, etc.) and / or metamaterial 1670 according to an exemplary embodiment 1600 that embodies one or more aspects of the present disclosure. In the in 16 exemplary embodiment shown 1600 contains the outer device housing 1668 four layers 1602 , 1604 , 1606 , 1608 that can be configured to have one or more electrical conductors 1672 , a waveguide 1674 , an EMI absorber 1676 , a thermal compensation material (TIM) 1678 and a dielectric 1680 provide.

The waveguide 1674 due to the multilayer film structure and / or the metamaterial 1670 can be provided for waveguiding from a PCB component 1681 on a PCB 1662 can be used. The thermal compensation material 1678 due to the multilayer film structure and / or the metamaterial 1670 can be used to create a thermally conductive thermal path from a PCB component 1682 to an outside of the outer device housing 1668 serve.

The multilayer film structure and / or the metamaterial 1670 can be configured to pass wanted signals (e.g. bandpass, etc.) while rejecting and preventing the passage of other unwanted signals (e.g. bandstop, etc.) at the device or external device level. The multilayer film structure and / or the metamaterial 1670 can be used to mitigate EMI through directional signal control in the outer device housing 1668 be used.

The outer device housing 1668 can also or alternatively be an FSS structure (e.g. 648 ( 6th ), 1948 ( 19th ) etc.) within or along a portion of the outer device housing 1668 contain. For example, electrically conductive metamaterial can be in a pattern along an inner surface of the outer device housing 1668 be arranged.

Accordingly, example embodiments disclosed herein may include an outer device housing 1668 included, which is multifunctional in that the outer device housing 1668 its original functionality as an external device housing 1668 maintains. The outer device housing 1668 however, it also contains additional functionality, such as that with the waveguide 1674 and the thermal compensation material 1678 related functionality provided by the multilayer film structure and / or the metamaterial 1670 provided. In the in 16 The illustrated embodiment includes the outer device housing 1668 four layers 1602 , 1604 , 1606 , 1608 , but other exemplary embodiments may include an outer device housing with more or less than four layers.

17th represents an interposer 1768 is a multi-layer film structure (e.g. a four-layer film structure, etc.) and / or metamaterial 1770 according to an exemplary embodiment 1700 that embodies one or more aspects of the present disclosure. In the in 17th exemplary embodiment shown 1700 is the multilayer film structure and / or the metamaterial interposer 1770 between two PCB's 1762 and 1763 positioned or pinched.

The multilayer film structure and / or the metamaterial interposer 1770 can / can be configured to have one or more electrical conductors 1772 , a waveguide 1774 , an EMI absorber 1776 , a thermal compensation material (TIM) 1778 and a dielectric 1780 between the two lower and upper PCB's 1762 , 1763 provide. The multilayer film structure and / or the metamaterial interposer 1770 may be a selectively functional structure, e.g. to sandwich the two PCBs, make electrical connections, provide EMI shielding and / or provide thermally conductive paths, etc. The multilayer film structure and / or the metamaterial interposer 1770 may contain an area with a relatively high dielectric constant so that the two PCB's 1762 , 1763 are capacitively coupled via the interposer area with the high dielectric constant.

In an exemplary embodiment, an interposer is provided for connecting two PCBs or SIPs to components by molding (e.g. injection molding, etc.) of functional block copolymer with electrical connection traces between the SIPs. In the in 17th The exemplary embodiment shown includes the interposer 1768 four layers 1702 , 1704 , 1706 , 1708 , but other exemplary embodiments may include an interposer with more or less than four layers.

The interposer 1768 can be configured to connect between PCBs as needed 1762 , 1763 while having charged EMI properties. The interposer 1762 , 1763 can between two PCBs 1762 , 1763 are positioned, each at least one component 1781 , 1782 , 1783 , 1784 included on it. The interposer 1768 may comprise a block copolymer of at least two polymers and one or more fillers as disclosed herein. The interposer 1768 may contain at least one electrical trace passing through the interposer 1768 runs to produce at least one electrical connection between at least one component on one circuit board with at least one component on the other circuit board. For example, the in 17th shown interposers 1768 an electrical connection between the PCB component 1781 , 1782 on the lower PCB 1762 with the corresponding PCB component 1783 , 1784 on the top PCB 1763 produce.

Exemplary embodiments may include structuring functionality in a multilayer film structure to accommodate a layout of components on two or more PCBs. When the PCB's are sandwiched, the patterned multilayer film structure can provide electrical connections and other functions between the components on the PCB's. In example embodiments, patterned films can be created to provide electrical connections for system in package (SIPs). In exemplary embodiments, a multilayer film structure comprising block copolymer films can be used as a substrate material for a PCB.

18th illustrates the packaging 1868 an integrated circuit (IC) for an IC die 1881 having a multilayer film structure and / or metamaterial 1870 according to an exemplary embodiment 1800 that embodies one or more aspects of the present disclosure. As in 18th shown, the multilayer film structure and / or the metamaterial 1870 be configured to have one or more electrical conductors / connectors 1872 , a waveguide 1874 , an EMI absorber 1876 , a thermal compensation material (TIM) 1878 and a dielectric 1880 provides.

The multilayer film structure and / or the metamaterial 1870 can be configured to direct energy or electromagnetic radiation, etc. The multilayer film structure and / or metamaterial IC packaging can be a selectively functional structure, e.g. part EMI shielding, part TIM, part EMI absorber, part waveguide and / or part electrical connector, etc. The multilayer Film structure and / or the metamaterial 1870 can be configured to provide a 3-D structure (e.g., IC packaging substrate, etc.) including interconnections that are waveguide or coaxial structures and / or vertical and multilayer, etc., is provided. In the in 18th The embodiment shown contains the IC package 1868 four layers 1802 , 1804 , 1806 , 1808 , but other exemplary embodiments may include IC packages with more or less than four layers.

20th represents a metamaterial TIM 2085 in a device (e.g. a smartphone, etc.) according to an exemplary embodiment 2000 is positioned and embodies one or more aspects of the present disclosure. As in 20th shown, the metamaterial is TIM 2085 between (e.g., compressed, temporarily stored, etc.) an outer device housing / heat spreader 2086 and a PCB 2062 with a grouping 2087 of antenna elements 2088 positioned. In this exemplary embodiment, the metamaterial is TIM 2085 configured so that there is a thermally conductive thermal path generally between the PCB 2062 and the outer device housing / heat spreader 2086 provides. As shown by the arrows, the metamaterial is TIM 2085 also configured so that there are signals (e.g. millimeter wave signals etc.) from the antenna elements 2088 to the reflectors 2089 can guide or direct. The reflectors 2089 can then reflect the signals upward, avoiding high dielectric constant problems that affect antenna performance.

Metamaterial patterning (e.g., FSS, etc.) can be used in a device housing or receptacle to route signals to reduce EMI and to eliminate or reduce sidelobes / side lobes. For example, a metamaterial FSS can be used inside a radome, which allows the radome thickness to be reduced, e.g. from about 3 millimeters to ½ millimeter, etc.

21A and 21B show an example of flexible material 2100 containing filled dielectric pyramidal structures which, according to the in 2A-2E The methods shown can be made in accordance with an exemplary embodiment that embodies one or more aspects of the present disclosure. The filled dielectric can comprise carbon black filled polydimethylsiloxane (PDMS), a filled block copolymer system, a filled elastomeric system, a filled thermoplastic system, and so on. The pyramidal structures may include rectangular pyramids configured to be used for EMI attenuation as disclosed herein.

As in 21B shown can the material 2100 with the filled dielectric pyramidal structures sufficiently flexible and conformal to be wrapped around a component, device, etc. Accordingly, the flexible material 2100 have a functional sleeve (e.g., for EMI mitigation, etc.) that can be wrapped around at least one area (e.g., around both sides, etc.) of a PCB.

Conventional board-level shields are used to contain EMI energy by forming an electrically conductive Faraday metal cage around one or more device components. The metal shield often also serves to trap thermal energy underneath. This thermal energy needs to be released so that EMI reduction and heat transfer affect each other. Conventional board-level shields have a rectangular construction of electrically conductive metal with five sides. The sixth side of the Faraday shield is formed by the ground plane of the PCB.

In exemplary embodiments disclosed herein, one (or more) metal sidewall (s) of a BLS is replaced with absorber material. As an example, the absorber material can comprise one or more multilayer film structures and / or patterned materials disclosed herein, such as a multilayer film structure comprising block copolymer films with regions (e.g. 3 and 4th , etc.), an FSS structure containing FSS elements (e.g. 6th and 19th , etc.) Material with pyramidal and / or non-pyramidal structures (e.g. 1 , 2 , 5-15 and 21st , etc.), etc.

By controlling the absorber thickness and arrangement, a high-resistance wall can be created that blocks or prevents the passage of electromagnetic energy through the absorber. This can generally be frequency specific. The absorber material can comprise a thermally conductive absorber material to facilitate heat transfer in a hybrid EMI / thermal device.

In exemplary embodiments, one or more BLS sidewalls may be made of absorber material configured to direct or control different frequencies in different directions so that some frequencies can be attenuated while the remaining frequencies are not.

22nd illustrates board level shielding (BLS) 2254 according to an exemplary embodiment 2200 that embodies one or more aspects of the present disclosure. The BLS 2254 includes a top 2256 and four side walls. The BLS top 2256 and three side walls 2258 consist of electrically conductive metal (e.g. sheet metal, etc.). The fourth side wall 2259 consists of an absorber material 2290 instead of the electrically conductive metal that is used on the BLS top 2256 and the other three side walls 2258 was used.

The fourth side wall 2259 can be made of a thermally conductive absorber material 2290 are made so that the fourth side wall is thermally conductive. In this case, the fourth side wall 2259 can be used to absorb EMI while also enabling thermal heat transfer. The side walls 2258 and 2259 can be configured (e.g. with mounting feet etc.) so that they can be installed on a PCT 2262 or another substrate (e.g. by soldering, etc.).

23 is a line graph showing the simulated reduction in total emitted power in decibels (dB) as a function of frequency in gigahertz (GHz) for the circuit board shield in 22nd shows, where the position of the absorber differs in two cases, with a shift in the frequency of the maximum reduction in the total radiated power.

Exemplary embodiments may contain a laser-cured doping catalyst (e.g. Specks, etc.) within a film that causes the dopant to crystallize and thereby offers improved performance, e.g., thermal management, attenuation of electromagnetic interference (EMI), electrical conductivity, thermal conductivity, EMI absorption, magnetic , dielectric and / or structural performance, etc. Other exemplary embodiments may include pouring adhesive tape through inkjet printing material into openings (e.g., perforations, cutouts, holes, etc.) in films to create electrical connections and / or thermal paths.

Exemplary embodiments may include methods of using at least one shape (e.g., foil, other extension or projection, etc.), one or more areas of a multilayer block copolymer film structure, doping and / or patterning to provide EMI attenuation (e.g., EMI shielding, EMI Absorption, etc.) and / or thermal management. The shape can include a pyramidal structure (e.g. a rectangular pyramid, etc.) and / or a non-pyramidal structure.

In an exemplary embodiment, a method of making a multilayer thermal management and / or electromagnetic interference (EMI) mitigation material may include making block copolymer films with areas by adding one or more fillers or additives to one or more properties, features, functions and / or change performance of the areas, e.g. thermal management, electromagnetic interference (EMI) attenuation, electrical conductivity, thermal conductivity, EMI absorbing, magnetic, dielectric and / or structural performance, etc.

In an exemplary embodiment, a method of making a film may include determining a functionality pattern, selecting a first polymer with first properties, selecting a second polymer with second properties, selecting a functional material (e.g., predefined, in a predetermined shape, etc.) ) with third properties (e.g., thermally conductive, electrically conductive, EMI absorbing, dielectric, structural, etc.), and using the first and second polymer and functional material to make films using block copolymer processes so that the films follow the pattern of the Exhibit functionality when put together (e.g., stacked and laminated into a multi-layer structure, etc.). The pattern of functionality can include the height of the columns, the width of the columns, the spacing of the columns, the loadability of the filler and / or the density of the filler in the columns, and so on.

In an exemplary embodiment, a multilayer structure includes a base layer, that includes structures (e.g., cast with, etc.) (e.g., pyramidal structures, non-pyramidal structures, etc.) protruding therefrom along at least a first side of the base layer. Located along the first side is a planarization layer that forms a substantially planar surface opposite a second side of the base layer.

The planarization layer may comprise a dielectric material (e.g., a graded dielectric for impedance matching, a uniform dielectric planarization layer, etc.), a thermally conductive material, an electrically conductive material, and so on. At least one film layer may be disposed (e.g., glued, etc.) along the planarization layer opposite the base layer.

The multilayer structure may include frequency selective surface elements (FSS) (e.g., electrically conductive rings, etc.) generally disposed between the film layer and the planarization layer. For example, the FSS elements may have electrically conductive rings in a pattern. The multilayer structure may comprise multiple FSS layers or films (e.g., in a stacked arrangement, etc.) containing FSS elements, e.g., electrically conductive rings, printed along or embedded in multiple layers or films. The FSS elements of one layer can overlap FSS elements in another layer. The FSS elements can contain a base layer of EMI absorbing material.

In exemplary embodiments, areas with increased or decreased magnetic properties can be created within a multilayer film structure and / or a patterned material. For example, areas of magnetic attraction and repulsion can be used when loaded copolymer resin polymerizes into a film during extrusion or calendering.

In exemplary embodiments in which a thermal compensation material may be applied to and / or used in conjunction with a multilayer film structure and / or patterned material, a wide variety of thermal compensation materials may be used. Examples of thermal compensation materials are thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbers or hybrid thermal / EMI absorbers, thermal greases, thermally conductive pastes, thermal putties, dispensable thermal compensation materials, heat cushions, etc.

In exemplary embodiments that include or include circuit board level shielding, a wide variety of materials may be used for circuit board level shielding (shielding in a broader sense) or part thereof, such as cold-rolled steel, nickel-silver alloys, copper-nickel Alloys, stainless steel, tinned cold-rolled steel, tinned copper alloys, carbon steel, brass, copper, aluminum, copper-beryllium alloys, phosphor bronze, steel, alloys thereof, a plastic material coated with electrically conductive material or other suitable electrically conductive and / or magnetic materials. The materials disclosed in this application are provided here for illustrative purposes only, as different materials can be used depending, for example, on the particular application.

Exemplary embodiments may include a multilayer film structure and / or patterned material that has at least one area (e.g., an area of continuous thickness of a block copolymer film, etc.) with a high thermal conductivity (e.g., within a range of about 1 W / mK (watts per meter per Kelvin) up to about 6 W / mK, etc.), depending on the particular materials used to make the multilayer film and / or patterned material and the percentage of the thermally conductive filler, if any. These thermal conductivities are only examples, as other embodiments may include a multilayer film and / or a patterned material containing at least one area with a thermal conductivity of more than 6 W / mK, less than 1 W / mK or between 1 and 6 W / mK.

In exemplary embodiments, at least a portion of a multilayer film structure and / or patterned material may be thermally conductive (eg, a thermally conductive portion of a block copolymer film, etc.) with a relatively high thermal conductivity. In such embodiments, the thermally conductive region of the multilayer film structure and / or patterned material can be used to define or provide a portion of a thermally conductive thermal path from a heat source to a heat dissipation / heat dissipation structure or component. For example, the thermally conductive area of the multi-layer film structure and / or the patterned material can be used to dissipate thermal energy (e.g. heat, etc.) from a heat source of an electronic device. The thermally conductive area of the multilayer film structure and / or the patterned material can generally be between a heat source and a heat dissipation / heat distribution structure or - component can be positioned to create a thermal connection, interface, path, or thermally conductive thermal path along which heat can be transferred (e.g., conducted) from the heat source to the heat dissipation / distribution structure or component. During operation, the thermally conductive area of the multilayer film structure and / or the patterned material can function in such a way that the heat from the heat source can be transferred (e.g., conduct heat etc.) along the thermally conductive path to the heat dissipation / heat distribution structure or the component. In exemplary embodiments in which the multilayer film structure and / or the patterned material contains at least one area for attenuating EMI (e.g. an electrically conductive and / or EMI absorbing area of a block copolymer film, etc.), the multilayer film structure and / or the patterned material also serve to attenuate EMI (e.g., absorption, blocking, reflection, etc.) incident on the EMI-attenuating area of the multilayer film structure and / or the patterned material.

The exemplary embodiments disclosed herein can be used with a variety of heat sources, electronic devices (e.g., smartphones, etc.) and / or heat dissipation / distribution structures or components (e.g., a heat spreader, heat sink, heat pipe, vapor chamber, a device outer shell or housing, etc.). A heat source can, for example, have one or more heat-generating components or devices (e.g. a CPU, a chip in the underfill, a semiconductor component, a flip-chip component, a graphics processing unit (GPU), a digital signal processor (DSP), a multiprocessor system, an integrated Circuit (IC), a multi-core processor, etc.). In general, a heat source can include any component or device that is at a higher temperature than the thermally conductive area of the multilayer film structure and / or the patterned material or that otherwise gives off or transfers heat to the thermally conductive area of the multilayer film structure and / or the patterned material regardless of whether the heat is generated by the heat source or is only transferred through or via the heat source. Accordingly, the aspects of the present disclosure should not be limited to use with a single type of heat source, electronic device, heat dissipation / distribution structure, and so on.

In exemplary embodiments, EMI absorbing structures or EMI absorbers can be located outside or along the outside of a cavity or chamber. The EMI absorbers or structures can be configured (e.g., conical, pyramidal, etc.) to reduce the likelihood of the reflection of incident radiation (e.g., high-frequency radiation at wide angles, radiation with scattering frequencies, etc.) through an opening (e.g., the opening of a Car radars, etc.) into the cavity or chamber, suppress or decrease. The placement of the EMI absorber can thus enable improved performance of the electronics (e.g. ADVICS (ADVanced Intelligent Chassis Systems), etc.) within the cavity or chamber and remove stray frequencies.

24 Figure 3 shows an exemplary device component 2400 and structures 2404 (e.g., EMI absorbing pyramidal structures, etc.) along the outside of the device component 2400 in accordance with an exemplary embodiment that embodies one or more aspects of the present disclosure. The structures 2404 are configured for EMI attenuation (e.g., absorbing high frequency EMI, etc.).

The structures 2404 can be arranged lengthways (e.g., glued, etc.) and from one or more outer regions of the device component 2400 protrude outwards. In this illustrated embodiment, there are structures 2404 along an exterior or exterior surface of the top wall or area 2408 the device arranged. Structures 2404 are also along the outer or outer surface of the side or side walls 2412 the device arranged.

The device component 2400 can be an interior space, cavity or chamber 2416 and a hole or opening 2420 (e.g. automotive radar aperture, non-automobile radar aperture, other radar aperture, etc.) into the chamber 2416 define. In this illustrated embodiment, the structures are 2404 along the entire surface 2408 the device component 2400 arranged and / or define this, which in turn is the opening 2420 into the chamber 2416 Are defined. The structures are accordingly 2404 around the entire perimeter of the opening 2420 arranged. In alternative implementations, the EMI absorbing structures can also be along one or more interior surfaces of the device component in the chamber 2416 be arranged. In such alternative designs, EMI absorbing structures 2404 (e.g., pyramidal structures, etc.) along both the inner and outer surfaces of the device component 2400 be arranged so that EMI absorbing structures inward and outward in opposite directions relative to the device component 2400 protrude.

The device component 2400 may include an electronics housing, board level shield (BLS), other device component, and so on. The device component 2400 can be configured (e.g., metal, shaped, sized, etc.) to attenuate (e.g., block, reflect, etc.) low frequency EMI. The structures 2404 can be configured (e.g., made of EMI absorbing materials, shaped, dimensioned, etc.) to attenuate (e.g., absorb, etc.) high frequency EMI.

The placement of the structures 2404 along the outside of the device component 2400 can reduce the likelihood of incident radiation passing through the opening 2420 into the interior, the chamber or the cavity 2416 is reflected. The structures 2404 can serve to prevent the reflection of incident radiation through the opening 2420 into the cavity or chamber 2416 to suppress or prevent.

For example, the structures 2404 be configured to emit radio frequency radiation at wide angles to the opening 2420 suppress. The placement of the EMI absorbing structures 2404 may improve the performance of the electronics (e.g. ADVICS (ADVanced Intelligent Chassis Systems), etc.) within the cavity or chamber 2416 enable and remove radiation at scatter frequencies.

The EMI absorbing structures 2404 can have rectangular pyramids (e.g. rectangular pyramid 2504 , shown in 25th , etc.). The rectangular bases of adjacent pyramids can contact each other with essentially no gaps or spaces between the rectangular bases. This helps avoid reflections that might otherwise occur with gaps between the rectangular bases of the pyramidal structures. Other exemplary embodiments may be non-pyramidal structures that taper or decrease in width (eg, generally gently curve, etc.) from the tip (eg, from a point, etc.) to the base. Alternative exemplary embodiments may include structures with non-rectangular bases, such as hexagonal bases, triangular bases, etc. Accordingly, the present disclosure is not intended to be limited to rectangular pyramidal structures only, as other exemplary embodiments may include structures with different three-dimensional geometric shapes.

In exemplary embodiments, the sides of the structures 2404 not be perfectly smooth or not define a perfectly straight line from top to bottom. For example, the pages may have a stepped configuration when enlarged. However, the sides of the pyramidal or non-pyramidal structures can preferably be relatively smooth (e.g., without appreciably large steps, etc.) in order to reduce or avoid reflection of EMI incursions on the structures. In addition, the structures can be configured to have a different slope or taper (eg, at least two or more gradations, etc.) along the sides. For example, a pyramidal structure may have a relatively gradual taper from the base to a central area, more taper from the central area towards the apex, and then less taper from there to the apex of the structure.

The structures 2404 , 2504 may contain a filled dielectric, such as a polydimethylsiloxane (PDMS) filled with carbon black, another filled block copolymer system, a filled elastomeric system, a filled thermoplastic system, an injection molding resin filled with carbon nanotubes, a polymer resin filled with carbon nanotubes, etc. Alternatively, the structures 2404 , 2504 can also be produced from other materials and / or by other suitable processes (e.g. step-by-step deposition of material on a functional carrier film, etc.).

In exemplary embodiments, the configuration (eg height, shape, position, etc.) of the structures 2404 be non-randomized or randomized (e.g. by a computer-aided randomization process, etc.). The randomization of the height of the structures 2404 along the outside of the device component 2400 can help reduce cavity resonances under the device housing in which the device component is located 2400 is housed, to reduce or avoid. Exemplary embodiments may be rectangular pyramidal structures with the same base size, but one or more of the rectangular pyramidal structures may have a different height than one or more other rectangular pyramidal structures.

Structures of different heights can be used to compensate for differences in the height of shorter and taller adjacent components. For example, higher and shorter structures can be relative to the device component 2400 be arranged so that the taller and shorter structures 2404 are aligned with shorter or taller components when the device component 2400 installed in an electronic device. The different heights of the structures can contribute to cavity resonance within the device housing in which the device component is located 2400 is housed, to avoid or reduce.

The pyramidal structures may contain air-filled particles (eg, air-filled microballoons, air-filled microbubbles, air-filled microspheres, etc.) in order to controllably reduce the dielectric constant of the pyramidal structures. The air-filled particles add air to the pyramid-shaped structures, as a result of which the dielectric constant is reduced (eg approaching foam, approaching foam properties, etc.).

25th represents a pyramidal structure 2504 for an EMI absorber (e.g. EMI absorber 2404 , etc.) according to an exemplary embodiment that embodies one or more aspects of the present disclosure. Just as an example can the pyramidal structure 204 have the following parameters, e.g. a flat base that is about 2.5 millimeters (mm) thick, a wedge thickness of about 2 mm, a wedge or pyramid height of about 3 mm, a truncated top of the pyramid that is about 0.5 mm, a value height of 0.5 mm and a permittivity of 11-j3.3. In this example, the height of the pyramid is 3mm, but the base of the pyramid 2504 is located within the flat base at a distance below the top of the "valley height", which is 0.5 mm. This was done to control the "valley" during modeling. A value of 0 for "Valley Height" would result in the pyramid base being in the same position as the top of the flat base. The top of the pyramid is cut off by a value equal to "blunt" (0.5 mm). With a value of 0 for "blunt", the pyramid would come to a point with the value of the "wedge height" (3 mm). Although better electromagnetic performance can be obtained when "stump" and "valley" are zero, resulting in sharp pyramids and sharp valleys, non-zero values for "stump" and "valley" may be due to manufacturing capabilities.

Exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details, such as examples of specific components, devices, and methods, are set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be used, that the exemplary embodiments can be embodied in many different ways, and that neither should be construed to limit the scope of the disclosure. In some exemplary embodiments, well-known methods, well-known device structures, and well-known technologies are not described in detail. In addition, advantages and improvements that may be achieved with one or more exemplary embodiments of the present disclosure are provided for illustrative purposes only and do not limit the scope of the present disclosure, since exemplary embodiments disclosed herein may and may not provide all or any of the aforementioned advantages and improvements still fall within the scope of the present disclosure.

Specific dimensions, specific materials, and / or specific shapes disclosed herein are exemplary in nature and do not limit the scope of the present disclosure. The disclosure of specific values and specific value ranges for given parameters does not exclude other values and value ranges that may be useful in one or more of the disclosed examples. Furthermore, it is contemplated that any two particular values for a specific parameter set forth herein may define the endpoints of a range of values that may be appropriate for the given parameter (ie, disclosure of a first value and a second value for a given parameter should be interpreted as a disclosure that any value between the first and second values could also be used for the given parameter). If, for example, the parameter X has the value A here, for example, and also has the value Z, for example, provision is made for the parameter X to have a value range from approximately A to approximately Z It is also contemplated that the disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping, or separate) summarize any possible combination of ranges for the value that could be claimed using endpoints of the ranges disclosed. For example, if the parameter X here has exemplary values in the range from 1-10 or 2-9 or 3-8, it is also provided that the parameter X can have other value ranges, the 1-9, 1-8, 1-3 , 1-2, 2-10, 2-8, 2-3, 3-10 and 3-9.

The terminology used herein is used only to describe certain exemplary embodiments and is not intended to be limiting. As used herein, the singular forms “a” and “an” are intended to include the plural forms as well, unless clearly stated otherwise. The terms “comprising”, “comprising”, “comprising” and “having” are inclusive and therefore specify the presence of disclosed devices, integers, steps, operations, elements and / or components, but include the presence or addition of one or more other facilities, integers, steps, operations, elements, components and / or groups thereof. The method steps, methods and operations described here, unless specifically specified as an order of execution, are not necessarily to be interpreted in such a way that they are required to be executed in the particular order discussed or illustrated. It will also be understood that additional or alternative steps can be used.

When an element or layer is referred to as “on,” “engaged with,” “connected to,” or “coupled to” another element or layer, it may refer directly to, engaged with, connected, or coupled with the other element or layer, or there may be elements or layers therebetween. Conversely, when an element or layer is referred to as “directly on,” “directly engaged with,” “directly connected to,” or “directly coupled to” another element or layer, no elements or layers may be used be present in between. Other words used to describe the relationship between elements (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.) should be construed in a similar manner. As used herein, the term “and / or” includes any or all combinations of one or more of the associated listed items.

The term “about”, when applied to values, indicates that the calculation or measurement allows for a slight inaccuracy in the value (with some approximation of the exactness of the value; approximately or halfway close to the value; almost). Unless the inaccuracy provided by “about” is otherwise understood in the art for some other reason, then “about” with that common meaning as used herein indicates at least fluctuations resulting from common measurement methods or the use of such parameters. For example, the terms “generally,” “about,” and “substantially” may be used herein to mean within manufacturing tolerances.

While the terms first, second, third, etc. may be used herein to describe various elements, components, areas, layers, and / or sections, these elements, components, areas, layers, and / or sections should not be limited by these terms will. These terms can only be used to distinguish one element, component, area, layer and / or section from another area, layer or section. Terms such as “first”, “second” and other numerical terms, when used herein, do not imply any sequence or order unless the context clearly indicates this. Thus, a first element, component, region, layer, or portion could be referred to as a second element, component, region, layer, or portion without departing from the teachings of the exemplary embodiments.

Relative spatial terms such as "inside", "outside", "below", "below", "lower", "above", "upper" and the like may be used here to describe the relationship of an element for the sake of simplicity of description or a device to another element (s) or a device (s) as shown in the figures. In addition to the orientation depicted in the figures, relative spatial terms are intended to include various orientations of the device in use or in operation. For example, if the device in the figures is upside down, elements described as "below" or "below" other elements or devices would then be oriented "above" the other elements or devices. Thus, the example term “under” can include both an orientation above and below. The device may otherwise be oriented (rotated 90 degrees or in other orientations) and the relative spatial descriptors described herein may be interpreted accordingly.

The foregoing description of the embodiments has been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the disclosure. Individual elements, planned or set forth uses, or features of a particular embodiment are generally not limited to that particular embodiment, but are, where applicable, interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same can be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Claims (123)

A composition for an electromagnetic interference (EMI) absorber, the composition comprising carbon nanotubes within a polymer resin. Composition according to Claim 1 wherein the composition is for absorbing noise and / or operable to reflect signals thereby obstructing the passage or transmission of the signals through the assembly. Composition according to Claim 1 or 2 wherein the carbon nanotubes have one or more of the following components: single-walled carbon nanotubes; and / or multi-walled carbon nanotubes; and / or carbon nanostructures comprising a branched network of crosslinked carbon nanotube structures. Composition according to Claim 1 or 2 wherein the polymer resin comprises a thermoplastic resin, and wherein the carbon nanotubes comprise one or more of the following components: single-walled carbon nanotubes within the thermoplastic resin; and / or multi-walled carbon nanotubes within the thermoplastic resin; and / or carbon nanostructures that have a branched network of crosslinked carbon nanotube structures within the thermoplastic resin. Composition according to Claim 4 wherein the thermoplastic resin comprises one or more of liquid silicone, urethane, polycarbonate, polyamide, polyester and / or polyolefin. Composition according to Claim 4 or 5 wherein the thermoplastic resin comprises one or more of polybutylene terephthalate, polypropylene, thermoplastic vulcanizate, thermoplastic elastomer and / or a mixture containing polyolefin. Composition according to Claim 1 or 2 wherein the polymer resin comprises an injection moldable resin, and wherein the carbon nanotubes comprise one or more of the following components: single-walled carbon nanotubes within the injection moldable resin; multi-walled carbon nanotubes within the injection moldable resin; and / or carbon nanostructures that have a branched network of crosslinked carbon nanotube structures within the injection moldable resin. Composition of Claim 1 or 2 wherein: the polymer resin comprises polypropylene and thermoplastic santoprene vulcanizate; and the carbon nanotubes have carbon nanostructures. Composition according to Claim 8 wherein the composition contains: about 29.5 volume percent or less of the thermoplastic santoprene vulcanizate; about 69.5 volume percent or more of the polypropylene; and about 0.5 volume percent or less of the carbon nanostructures. Composition according to Claim 8 wherein the composition contains: about 10 volume percent or less of the thermoplastic santoprene vulcanizate; about 89 volume percent or more of the polypropylene; and about 0.3 volume percent or less of the carbon nanostructures. Composition according to one of the Claims 1 to 3 wherein the polymer resin comprises a two-part silicone composition containing a silicone part A and a silicone part B, and wherein the ratio of weight percent of silicone part A to weight percent of silicone part B is in a range of about 1: 1 to about 10: 1. Composition according to one of the Claims 1 to 3 wherein the polymer resin has a two part urethane composition comprising ureth part A and ureth part B, and wherein a ratio of weight percent urethane A to weight percent urethane B is in a range of about 1: 1 to about 10: 1. Composition according to one of the Claims 1 to 3 wherein: the polymer resin comprises a silicone or urethane resin; and the composition includes about 99.4 percent by weight of the silicone or urethane resin and about 0.6 percent by weight of the carbon nanotubes within the silicone or urethane resin. Composition according to one of the Claims 1 to 13th wherein the composition contains: from about 98 to about 99 percent by weight of the polymer resin; and about 2 percent by weight or less of the carbon nanotubes. Composition according to one of the Claims 1 to 14th wherein the composition contains about 1 volume percent or less of carbon nanotubes. Composition according to one of the Claims 1 to 15th wherein the composition is configured to provide greater than 15 decibels of return loss at frequencies from about 40 gigahertz (GHz) to about 120 GHz and / or frequencies of about 60 GHz up to about 90 GHz and / or frequencies from about 70 GHz to about 85 GHz can be operated. Composition according to one of the Claims 1 to 16 wherein the composition contains about 0.5 volume percent or less of the carbon nanotubes. Composition according to one of the Claims 1 to 17th wherein the composition is configured to operate with greater than 15 decibels of return loss at a frequency of about 77 GHz. Composition according to one of the Claims 1 to 18th , further comprising one or more fillers and / or additives within the polymer resin, wherein the one or more fillers and / or additives include one or more pigments, plasticizers, processing aids, flame retardants, extenders, tackifiers, EMI absorbers, electrically conductive fillers and / or have magnetic particles. EMI absorber that has the composition according to one of the Claims 1 to 19th having. EMI absorber obtained from the composition according to one of the Claims 1 to 19th is injection molded so that the EMI absorber has a monolithic, one-piece construction. EMI absorbers having a pattern of EMI absorbing structures that have the composition according to one of the Claims 1 to 19th exhibit. EMI absorber Claim 22 wherein the EMI absorbing structures include rectangular pyramidal structures with rectangular bases configured such that the rectangular bases of adjacent rectangular pyramidal structures contact one another with substantially no gaps or spaces between the rectangular bases of the adjacent rectangular pyramidal structures. EMI absorber Claim 22 , wherein the pattern of EMI absorbing structures is a pattern of pyramidal structures, a pattern of non-pyramidal structures, a pattern that includes a combination of pyramidal structures and non-pyramidal structures, and / or a pattern of structures that includes at least two Contains structures of different heights that are predetermined or randomized. EMI absorber according to one of the Claims 22 to 24 wherein the EMI absorbing structures protrude outwardly along a first portion of the EMI absorber, and tissue is disposed along a second portion of the EMI absorber opposite the first portion along which the EMI absorbent structures protrude outward. EMI absorber Claim 25 wherein: the fabric comprises one or more of a flame retardant meta-aramid material and / or an openly woven polymeric fabric; and / or the fabric has a fabric layer along the second portion of the EMI absorber; and / or the fabric is configured to provide reinforcement and mechanical strength to the EMI absorber. EMI absorber according to one of the Claims 20 to 26th , wherein the EMI absorber is an EMI absorbing film. A radar mount that is injection molded from the composition of any of the Claims 1 to 19th is made. EMI-absorbing radar mount comprising the composition of any of Claims 1 to 19th wherein the EMI absorbing radar mount is configured to be positionable relative to a radar device, whereby reflection loss modifies the radiation surrounding the radar device. Radar mount having a pattern of EMI absorbing structures that have the composition according to one of the Claims 1 to 19th and protrude outwardly along at least a portion of the radar mount. Motor vehicle having the radar bracket Claim 28 , 29 or 30th . Motor vehicle component having the composition according to one of the Claims 1 to 19th . Motor vehicle having the motor vehicle component after Claim 32 . Material for thermal management and EMI mitigation that the composition according to one of the Claims 1 to 19th and is configured to be multifunctional with a first functionality of EMI attenuation and a second functionality of thermal management. Material for attenuating EMI that the composition according to one of the Claims 1 to 19th wherein the EMI mitigation material has a multilayer film structure formed by a plurality of layers with different filler densities and / or concentrations is defined. Material for attenuating EMI that the composition according to one of the Claims 1 to 19th wherein the EMI mitigation material comprises a multilayer film structure defined by a plurality of layers having fillers dispersed in the layers to define areas of continuous thickness and / or discrete areas within the layers. EMI absorber comprising carbon nanotubes in a polymer resin. EMI absorber Claim 37 wherein the EMI absorber is an EMI absorbing sheet comprising the carbon nanotubes within the polymer resin. EMI absorber Claim 37 or 38 wherein the EMI absorber is operable to absorb noise and / or to reflect signals, thereby obstructing the passage or transmission of the signals through the EMI absorber. EMI absorber according to one of the Claims 37 to 39 wherein the carbon nanotubes have one or more of the following components: single-walled carbon nanotubes; and / or multi-walled carbon nanotubes; and / or carbon nanostructures that have a branched network of crosslinked carbon nanotube structures. EMI absorber according to one of the Claims 37 to 39 wherein the polymer resin comprises a thermoplastic resin, and wherein the carbon nanotubes comprise one or more of the following components: single-walled carbon nanotubes within the thermoplastic resin; and / or multi-walled carbon nanotubes within the thermoplastic resin; and / or carbon nanostructures that comprise a branched network of crosslinked carbon nanotube structures within the thermoplastic resin. EMI absorber Claim 41 wherein the thermoplastic resin comprises one or more of liquid silicone, urethane, polycarbonate, polyamide, polyester and / or polyolefin. EMI absorber Claim 41 or 42 wherein the thermoplastic resin comprises one or more of polybutylene terephthalate, polypropylene, thermoplastic vulcanizate, thermoplastic elastomer and / or a mixture containing polyolefin. EMI absorber according to one of the Claims 37 to 39 wherein the polymer resin comprises an injection moldable resin, and wherein the carbon nanotubes comprise one or more of the following components: single-walled carbon nanotubes within the injection moldable resin; and / or multi-walled carbon nanotubes within the injection moldable resin; and / or carbon nanostructures that have a branched network of crosslinked carbon nanotube structures within the injection moldable resin. EMI absorber according to one of the Claims 37 to 39 wherein: the polymer resin comprises polypropylene and a thermoplastic santoprene vulcanizate; and the carbon nanotubes have carbon nanostructures. EMI absorber Claim 45 wherein the EMI absorber contains: about 29.5 volume percent or less of the thermoplastic santoprene vulcanizate; about 69.5 volume percent or more of the polypropylene; and about 0.5 volume percent or less of the carbon nanostructures. EMI absorber Claim 45 wherein the EMI absorber contains: about 10 volume percent or less of the thermoplastic santoprene vulcanizate; about 89 volume percent or more of the polypropylene; and about 0.3 volume percent or less of the carbon nanostructures. EMI absorber according to one of the Claims 37 to 40 wherein the polymer resin comprises a two part silicone composition containing silicone part A and silicone part B, and wherein the ratio of weight percent silicone part A to weight percent silicone part B is in a range of about 1: 1 to about 10: 1. EMI absorber according to one of the Claims 37 to 40 wherein the polymer resin has a two part urethane composition comprising ureth part A and ureth part B, and wherein a ratio of weight percent urethane A to weight percent urethane B is in a range of about 1: 1 to about 10: 1. EMI absorber according to one of the Claims 37 to 40 , in which: the polymer resin comprises a silicone or urethane resin; and the EMI absorber contains about 99.4 percent by weight of the silicone or urethane resin and about 0.6 percent by weight of the carbon nanotubes within the silicone or urethane resin. EMI absorber according to one of the Claims 37 to 50 wherein the EMI absorber comprises: about 98 to about 99 percent by weight of the polymer resin; and about 2 percent by weight or less of the carbon nanotubes. EMI absorber according to one of the Claims 37 to 51 , wherein the EMI absorber contains about 1 volume percent or less carbon nanotubes. EMI absorber according to one of the Claims 37 to 52 , wherein the EMI absorber is configured to provide more than 15 decibels of return loss at frequencies from about 40 gigahertz (GHz) to about 120 GHz and / or frequencies from about 60 GHz to about 90 GHz and / or frequencies from about 70 GHz to about 85 GHz can be operated. EMI absorber according to one of the Claims 37 to 53 wherein the EMI absorber contains about 0.5 volume percent or less of the carbon nanotubes. EMI absorber according to one of the Claims 37 to 54 where the EMI absorber is configured to operate with more than 15 decibels of return loss at a frequency of approximately 77 GHz. EMI absorber according to one of the Claims 37 to 55 , wherein the EMI absorber further comprises one or more fillers and / or additives within the polymer resin, wherein the one or more fillers and / or additives one or more pigments, plasticizers, processing aids, flame retardants, extenders, tackifiers, EMI-absorbing fillers , electrically conductive fillers and / or magnetic particles. EMI absorber according to one of the Claims 37 to 56 wherein the EMI absorber is injection molded from the carbon nanotubes within the polymer resin so that the EMI absorber has a monolithic, one-piece construction. EMI absorber according to one of the Claims 37 to 57 wherein the EMI absorber has a pattern of EMI absorbing structures including the carbon nanotubes within the polymer resin. EMI absorber Claim 58 wherein the pattern of EMI absorbing structures is formed from the carbon nanotubes within the polymer resin. EMI absorber Claim 58 or 59 wherein the EMI absorbing structures include rectangular pyramidal structures with rectangular bases configured such that the rectangular bases of adjacent rectangular pyramidal structures contact one another with substantially no gaps or spaces between the rectangular bases of the adjacent rectangular pyramidal structures. EMI absorber Claim 58 or 59 , wherein the pattern of EMI absorbing structures is a pattern of pyramidal structures, a pattern of non-pyramidal structures, a pattern that includes a combination of pyramidal structures and non-pyramidal structures, and / or a pattern of structures that includes at least two Contains structures of different heights that are predetermined or randomized. EMI absorber according to one of the Claims 58 to 61 wherein the EMI absorbing structures protrude outwardly along a first portion of the EMI absorber and tissue is disposed along a second portion of the EMI absorber opposite the first portion along which the EMI absorbent structures protrude outward. EMI absorber Claim 62 wherein: the fabric comprises one or more of a flame retardant meta-aramid material and / or an openly woven polymeric fabric; and / or the fabric has a fabric layer along the second portion of the EMI absorber; and / or the fabric is configured to provide reinforcement and mechanical strength to the EMI absorber. EMI absorber according to one of the Claims 37 to 63 wherein the EMI absorber has a multilayer film structure which is defined by a plurality of layers with different filler densities and / or concentrations. EMI absorber according to one of the Claims 37 to 63 wherein the EMI absorber has a multilayer film structure defined by a plurality of layers containing fillers distributed within the layers to define areas of continuous thickness and / or discrete areas within the layers. Radar bracket, having the EMI absorber according to one of the Claims 37 to 65 . Motor vehicle component having the EMI absorber according to one of the Claims 37 to 65 . Motor vehicle having at least one component that the EMI absorber according to one of the Claims 37 to 65 contains. Automotive component with an EMI absorber, where: the EMI absorber comprises an injection moldable resin and carbon black and / or carbon nanotubes within the injection moldable resin; and / or the EMI absorber is configured to provide more than 15 decibels of return loss at frequencies from about 40 gigahertz (GHz) to about 120 GHz and / or frequencies from about 60 GHz to about 90 GHz and / or frequencies from about 70 GHz to about 85 GHz can be operated. Motor vehicle component according to Claim 69 , wherein the motor vehicle component is a radar mount having the EMI absorber. Motor vehicle component according to Claim 69 or 70 wherein the automotive component is configured to be positionable relative to a radar device, whereby reflection loss modifies the radiation surrounding the radar device. Motor vehicle component according to one of the Claims 69 to 71 wherein the EMI absorber contains the carbon nanotubes within the injection moldable resin, and wherein the carbon nanotubes comprise one or more of the following components: single-walled carbon nanotubes within the injection moldable resin; and / or multi-walled carbon nanotubes within the injection moldable resin; and / or carbon nanostructures that have a branched network of crosslinked carbon nanotube structures within the injection moldable resin. Motor vehicle component according to one of the Claims 69 to 72 wherein the EM I absorber contains the injection moldable resin comprising the polypropylene and the thermoplastic santoprene vulcanizate, and carbon nanostructures within the injection moldable resin. Motor vehicle component according to Claim 73 wherein the EMI absorber contains: about 29.5 volume percent or less of the thermoplastic santoprene vulcanizate; about 69.5 volume percent or more of the polypropylene; and about 0.5 volume percent or less of the carbon nanostructures. Motor vehicle component according to Claim 73 wherein the EMI absorber contains: about 10 volume percent or less of the thermoplastic santoprene vulcanizate; about 89 volume percent or more of the polypropylene; and about 0.3 volume percent or less of the carbon nanostructures. Motor vehicle component according to one of the Claims 69 to 72 wherein the EMI absorber contains the injection moldable resin that has a two-part silicone composition that contains silicone part A and silicone part B, and wherein a ratio of weight percent of silicone part A to weight percent of silicone part B is in a range of about 1: 1 to about 10 : 1 lies. Motor vehicle component according to one of the Claims 69 to 72 wherein the EMI absorber contains the injection moldable resin that has a two-part urethane composition that includes Ureth Part A and Ureth Part B, and wherein a ratio of weight percent urethane A to weight percent urethane B is in a range from about 1: 1 to about 10 : 1 lies. Motor vehicle component according to one of the Claims 69 to 72 wherein the EMI absorber contains the carbon nanotubes within the injection-moldable resin that a silicone or urethane resin comprises, so that the EMI absorber is about 99.4 percent by weight of the silicone or urethane resin and about 0.6 percent by weight of the carbon nanotubes inside the silicone or urethane resin. Motor vehicle component according to one of the Claims 69 to 78 wherein the EMI absorber contains the carbon nanotubes within the injection moldable resin such that the EMI absorber contains about 98 to about 99 weight percent of the injection moldable resin and about 2 weight percent or less of the carbon nanotubes. Motor vehicle component according to one of the Claims 69 to 79 wherein the EMI absorber contains the carbon nanotubes within the injection moldable resin such that the EMI absorber contains about 1 percent by volume or less of the carbon nanotubes. Motor vehicle component according to one of the Claims 69 to 80 , where the EMI absorber is configured to work with more than 15 decibels Loss of reflection can operate at a frequency of about 77 GHz. Motor vehicle component according to one of the Claims 69 to 81 wherein the EMI absorber contains about 0.5 volume percent or less of the carbon nanotubes. Motor vehicle component according to one of the Claims 69 to 82 , further comprising one or more fillers and / or additives within the injection moldable resin, wherein the one or more fillers and / or additives include one or more pigments, plasticizers, processing aids, flame retardants, extenders, tackifiers, EMI-absorbing fillers, electrically conductive fillers and / or have magnetic particles. Motor vehicle component according to one of the Claims 69 to 83 wherein the automotive component is injection molded from the carbon black and / or the carbon nanotubes within the injection moldable resin so that the automotive component has a monolithic, one-piece construction. Motor vehicle component according to one of the Claims 69 to 84 wherein the EMI absorber has a pattern of EMI absorbing structures including the carbon black and / or the carbon nanotubes within the injection moldable resin. Motor vehicle component according to Claim 85 wherein the EMI absorbing structures include rectangular pyramidal structures with rectangular bases configured such that the rectangular bases of adjacent rectangular pyramidal structures contact one another with substantially no gaps or spaces between the rectangular bases of the adjacent rectangular pyramidal structures. Motor vehicle component according to Claim 85 or 86 , wherein the pattern of EMI absorbing structures is a pattern of pyramidal structures, a pattern of non-pyramidal structures, a pattern that includes a combination of pyramidal structures and non-pyramidal structures, and / or a pattern of structures that includes at least two Contains structures of different heights that are predetermined or randomized. Motor vehicle component according to one of the Claims 85 to 87 wherein the EMI absorbing structures protrude outwardly along a first portion of the EMI absorber, and tissue is disposed along a second portion of the EMI absorber opposite the first portion along which the EMI absorbent structures protrude outward. The motor vehicle component according to Claim 88 wherein: the fabric comprises one or more of a flame retardant meta-aramid material and / or an openly woven polymeric fabric; and / or the fabric comprises a fabric layer along the second portion of the EMI absorber; and / or the fabric is configured to provide reinforcement and mechanical strength to the EMI absorber. Motor vehicle component according to one of the Claims 69 to 89 wherein the EMI absorber has a multilayer film structure which is defined by a plurality of layers with different filler densities and / or concentrations. Motor vehicle component according to one of the Claims 69 to 89 wherein the EMI absorber has a multilayer film structure defined by a plurality of layers containing fillers distributed within the layers to define areas of continuous thickness and / or discrete areas within the layers. Motor vehicle having the motor vehicle component according to one of the Claims 69 to 91 . A composition for an injection moldable EMI absorber, the composition comprising carbon black and / or carbon nanotubes within an injection moldable resin. Composition according to Claim 93 wherein the composition is operable to absorb noise and / or reflect signals, thereby obstructing the passage or transmission of the signals through the composition. Composition according to Claim 93 or 94 wherein the composition includes the carbon nanotubes within the injection moldable resin, and wherein the carbon nanotubes comprise one or more of the following components: single-walled carbon nanotubes; multi-walled carbon nanotubes; and / or carbon nanostructures that have a branched network of crosslinked carbon nanotube structures. Composition according to one of the Claims 93 to 95 wherein: the injection moldable resin comprises thermoplastic polypropylene and santoprene vulcanizate; and the composition includes carbon nanostructures within the injection moldable resin. Composition according to Claim 96 wherein the composition contains: about 29.5 volume percent or less of the thermoplastic santoprene vulcanizate; about 69.5 volume percent or more of the polypropylene; and about 0.5 volume percent or less of the carbon nanostructures. The composition according to Claim 96 wherein the composition contains: about 10 volume percent or less of the thermoplastic santoprene vulcanizate; about 89 volume percent or more of the polypropylene; and about 0.3 volume percent or less of the carbon nanostructures. Composition according to one of the Claims 93 to 95 wherein the injection moldable resin has a two part silicone composition including silicone part A and silicone part B, and wherein a ratio of weight percent silicone part A to weight percent silicone part B is in a range of about 1: 1 to about 10: 1. Composition according to one of the Claims 93 to 95 wherein the injection moldable resin has a two part urethane composition including urethane A and urethane B, and wherein a ratio of weight percent urethane A to weight percent urethane B is in a range from about 1: 1 to about 10: 1. Composition according to one of the Claims 93 to 100 wherein the composition includes the carbon nanotubes within the injection moldable resin such that the composition includes about 98 to about 99 weight percent of the injection moldable resin and about 2 weight percent or less of the carbon nanotubes. Composition according to one of the Claims 93 to 101 wherein the composition includes the carbon nanotubes in the injection moldable resin such that the composition contains about 1 volume percent or less of the weight of the carbon nanotubes. Composition according to one of the Claims 93 to 102 , wherein the composition is configured to provide more than 15 decibels of return loss at frequencies from about 40 gigahertz (GHz) to about 120 GHz and / or frequencies from about 60 GHz to about 90 GHz and / or frequencies from about 70 GHz to about 85 GHz can be operated. Composition according to one of the Claims 93 to 103 wherein the composition contains about 0.5 volume percent or less of the carbon nanotubes. Composition according to one of the Claims 93 to 104 wherein the composition is configured to operate with greater than 15 decibels of return loss at a frequency of about 77 GHz. Composition according to one of the Claims 93 to 105 , further comprising one or more fillers and / or additives within the injection moldable resin, wherein the one or more fillers and / or additives include one or more pigments, plasticizers, processing aids, flame retardants, extenders, tackifiers, EMI absorbers, electrically conductive fillers and / or have magnetic particles. EMI absorber having the composition according to one of the Claims 93 to 106 . EMI absorber obtained from the composition according to one of the Claims 93 to 106 is injection molded so that the EMI absorber has a monolithic, one-piece construction. EMI absorbers having a pattern of EMI absorbing structures that have the composition according to one of the Claims 93 to 106 exhibit. EMI absorber Claim 109 wherein the EMI absorbing structures include rectangular pyramidal structures with rectangular bases configured such that the rectangular bases of adjacent rectangular pyramidal structures contact one another with substantially no gaps or spaces between the rectangular bases of the adjacent rectangular pyramidal structures. EMI absorber Claim 109 , wherein the pattern of EMI absorbing structures is a pattern of pyramidal structures, a pattern of non-pyramidal structures, a pattern that includes a combination of pyramidal structures and non-pyramidal structures, and / or a pattern of structures that includes at least two Contains structures of different heights that are predetermined or randomized. EMI absorber according to one of the Claims 109 to 111 wherein the EMI absorbing structures protrude outwardly along a first section of the EMI absorber and fabric along a second section of the EMI absorber opposite the first section along which the EMI absorbent structures protrude outwards, is arranged. EMI absorber from Claim 112 wherein: the fabric comprises one or more of a flame retardant meta-aramid material and / or an openly woven polymeric fabric; and / or the fabric has a fabric layer along the second portion of the EMI absorber; and / or the fabric is configured to provide reinforcement and mechanical strength to the EMI absorbing sheet. EMI absorber according to one of the Claims 107 to 113 , wherein the EMI absorber is an EMI absorbing film. Radar mount injected from the composition of one of the Claims 93 to 106 . EMI-absorbing radar mount comprising the composition of any of Claims 93 to 106 wherein the EMI absorbing radar mount is configured to be positionable relative to a radar device, whereby reflection loss modifies the radiation surrounding the radar device. Radar mount with a pattern of EMI absorbing structures that have the composition according to one of the Claims 93 to 106 and protrude outwardly along at least a portion of the radar mount. Motor vehicle having the radar bracket Claim 115 , 116 or 117 . Motor vehicle component having the composition according to one of the Claims 93 to 106 . Motor vehicle having the motor vehicle component after Claim 119 . Thermal management and EMI mitigation material that has the composition according to one of the Claims 93 to 106 and configured to be multifunctional, with a first functionality of EMI attenuation and a second functionality of thermal management. Material for attenuating EMI, having the composition of any of Claims 93 to 106 wherein the EMI mitigation material has a multilayer film structure defined by a plurality of layers having different filler densities and / or concentrations. Material for attenuating EMI, having the composition of any of Claims 93 to 106 wherein the EMI attenuation material comprises a multilayer film structure defined by a plurality of layers containing fillers distributed in the layers to define areas of continuous thickness and / or discrete areas within the layers.

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