DE202015103801U1 - 3D-MID printer - Google Patents

Abstract

3D printer for the production of a spatial component, which contains at least one electrical functional element (5), with a first processing head (1), the plastic-containing base material for producing a semi-finished component matrix (3) without electrical functional element (5) can thermally soften , characterized in that at least one second machining head (2) is present, which can introduce the electrical functional element (5) into the space-shaped volume structure of the semi-finished component matrix (3) produced by the first machining head (1), and in that the first machining head ( 1) is designed such that it by thermal softening of further plastic-containing base material by the second machining head (2) introduced electrical functional element (5) in the component matrix (3) can embed.

Description

The invention relates to a printer for three-dimensionally extended printed products (= "3D printer") for the production of a space-shaped component containing at least one electrical functional element, with a first processing head, the plastic-containing base material for producing a semi-finished component matrix without electrical functional element thermally can soften.

Background of the invention

Such 3D printers are described in numerous articles, for example in
D. Ifland et al., "Generative Manufacturing for Direct Integration of Microelectronic Components and Contact Structures", Lasers in Electronics Production & Precision Engineering, Proceedings: LEF 2014 , or about in
Amit Joe Lopes et al; "Integrating stereolithography and direct print technologies for 3D structural electronics fabrication"; Rapid Prototyping Journal, Volume 18, Number 2, 2012, 129-143 ,

Embedded circuit carriers have already been realized by means of the additive methods of stereolithography.

In addition, the first approaches to applying solder traces and traces have already been published on a copper or silver paste based on 3D printed substrates.

However, all 3D printers known so far can thermally soften a plastic-containing base material exclusively by means of a first and so far also single machining head and from this produce a semi-finished component matrix-namely without any functional element. This component matrix can then be equipped, usually manually, with functional elements, in particular with electrical functional elements.

Object of the invention

Object of the present invention is in contrast to improve a generic 3D printer of the type described above with as simple and generally available technical means as well as economically priced to go that fast and flexible 3d printing hybrid, mechatronic components and an automatable Embedding electronic, but also mechanical and optical functional components as well as other raumförmlichen assemblies is possible.

Brief description of the invention

According to the invention, this object is considered to be surprisingly simple and effective in a surprisingly simple and effective manner in that at least one second machining head is provided which can introduce the electrical functional element into the spatial volume structure of the semifinished component matrix produced by the first machining head. and that the first machining head is designed such that it can embed the introduced by the second processing head electrical functional element in the component matrix by thermal softening of further plastic-containing base material.

General mode of operation of the invention

The present invention enables a novel additive process chain for the rapid and flexible production of spatial electronic assemblies (= "3D-MID") with integrated functional elements. This also enables validation of the process chain. In contrast to 3D-MID production by means of injection molding, for which expensive molding tools are necessary, the component production takes place via a 3D printing process, which is called Fused Deposition Modeling (= "FDM"). The conductor track production is also realized additively. For this purpose, various inline-capable manufacturing methods are possible that require no subsequent metallization. The following are preferably used: The wire feed-controlled laser beam melting of solder wire - as described in US Pat DE 10 2005 058 308 B4 or the EP 1 795 292 B1 the applicant is described, the dispensing and subsequent laser beam sintering of conductive adhesive and solder paste and the 3D printing of intrinsically conductive plastics. Subsequently, components are contacted on the tracks and protected by embedding by means of FDM from environmental influences.

The approach proposed according to the invention pursues the production of 3D mechatronic circuit carriers by means of 3D printing and the integration of printed conductors (2D and 3D) and electronic components within the component matrix. This is achieved by a short time interruption of the building process, which is subsequently continued with an application of the conductor tracks in the component matrix again.

In addition, temperature-stable materials such as ABS / PC or PA are to be used, which are currently standard in electrical engineering, but not yet in 3D printing, because the high melting points of the plastics in the area of the extruder nozzle in 3D printers still complications to lead.

Another aspect of the present invention is that products can (and should) be made that conform to an industrial standard. Here, a high component accuracy and reproducibility is achieved and it creates components that are hermetically sealed. This will be achieved through product qualification using standardized testing methods.

Preferred embodiments of the invention

Very particularly preferred is a class of embodiments of the 3D printer according to the invention, which are characterized in that the second processing head comprises an arrangement for wire feed-controlled melting of solder wire. By using fine strip and wire geometries as well as solder wire of different diameters as low and high melting alloys, the electrical tracks and conductor tracks can be adapted to the innovative requirements of the 3D-MID products. Due to the continuous production of the strip and wire-guided processes, the dimensioning of the spatial products is free from mechanical and electrical limits. The wire ends can be truncated or fused to their starting or ending point.

In practice, very special developments of this class of embodiments prove themselves, which are characterized in that the arrangement for melting solder wire has a feed device for linearly advancing a wire along an axial direction by means of a conveyor which comprises a feed wheel driven by a propulsion motor, which presses with its rotating circumference against the wire to be conveyed transversely to the axial direction, wherein on the opposite side of the wire, a secondary wheel is arranged as a counter-pressure pinion, which receives the pressing force of the feed wheel on the continuous wire rotating, with a control unit, which transmits, in particular regulates, a control signal to the conveying device which influences, in particular regulates, the linear displacement of the wire caused by the conveying device, wherein the feed device comprises a holder on which, on the one hand, a wire spool is mounted, from which the wire to be conveyed is unwound, and to which the propulsion motor is attached, wherein the wire end free in the conveying direction of the wire impinges in the conveying direction on a counter surface while receiving a force acting in the opposite direction to the conveying direction of pressure reaction and forwards in the axial direction along the wire wherein a sensor unit is provided for measuring the pressure reaction force received by the wire, the sensor unit comprising an electromechanical sensor rigidly connected to the feed device via the holder and generating an electronic measurement signal in response to the measured pressure reaction force which is input to the controller or control unit is forwarded, and wherein the control or regulating unit due to the measured pressure reaction force, a drive signal for controlling or caused by the conveyor linear displacement of the wire Send it to the conveyor.

This is a mechanically inexpensive, spatially compact and inexpensive to produce feed device with a sensitive and permanently reliable, insensitive to external disturbances such as pollution and mechanical friction feed control as a function of acting in the conveying direction pressure reaction force available.

Such arrangements for wire feed-controlled melting of solder wire are known from the DE 10 2005 058 308 B4 or the EP 1 795 292 B1 the applicant. In combination with the present invention, they are particularly advantageous.

A second class of particularly preferred embodiments of the invention is characterized in that the second processing head comprises a device for dispensing and subsequent sintering of metal particle-containing material. By using dispensing material in various designs as low-melting and high-melting alloys, the electrical paths to the 3D-MID products can be adapted to meet innovative requirements. Due to the endless production of dispensing processes, the dimensioning of the spatial products is free of mechanical and electrical limits. The dispensing surfaces can be set on or off at their start or end points. The molecular crosslinking of the materials can form an electrically conductive primer.

These embodiments can be further improved by further developments in which a solder paste, a conductive adhesive or an intrinsically conductive plastic paste, in particular with embedded carbon particles or metal fibers, is used as the metal particle-containing material. The molecular cross-linking of electrically conductive structures forms the optimum degree of freedom for the developmental potential of 3D-MID products. This customization finds as one field of application especially in medical technology your product innovation. Just imagine the sheer endless variety of 3D-MID ergonomically adapted ear implants that can be created from a combination of 3D printing with integrated trace and electrical component embedding.

Embodiments of the 3D printer according to the invention in which at least part of the thermal processing, in particular the melting of solder wire and the sintering of metal particle-containing material by means of a laser beam arrangement, are also particularly advantageous. This non-contact point, circle, line or free-form beam path can be coupled in a distance-controlled, temperature-pyrometrically and process-controlled manner to the desired 3D-MID shape. Through arbitrary focal distances, very different product topographies with integrated electrical functionality can be constructed without interference edges.

A third class of supplementary or alternatively alternative embodiments is characterized in that a third machining head is provided which can introduce further electrical and / or electronic functional elements into the semi-finished component matrix before being embedded by the first machining head. This allows an even higher complexity of the manufacturing process can be realized.

In a fourth class of embodiment of the 3D printer according to the invention, a fourth processing head is provided, which can introduce electrical conductor tracks into the semi-finished component matrix before being embedded by the first processing head.

Another class of embodiment of the 3D printer according to the invention is characterized in that a machining head is provided which is designed as a mounter, in particular as a mechanical and / or pneumatic gripper.

Embodiments of the invention are also particularly preferred, which are characterized in that a machining head is provided which is constructed as a robot unit and therefore can be operated fully automatically and possibly even without operating personnel.

Finally, embodiments of the 3D printer according to the invention are also very advantageous, in which a plurality of the machining heads, preferably the second machining head and the third machining head and / or the fourth machining head are spatially constructed as a unit, which makes the system significantly more compact overall.

Further advantages of the invention will become apparent from the description and the drawings. Likewise, according to the invention, the above-mentioned features and those which are still further developed can each be used individually for themselves or for a plurality of combinations of any kind. The embodiments shown and described are not to be understood as exhaustive enumeration, but rather have exemplary character for the description of the invention.

Detailed description of the invention and drawing

In the schematic drawing an embodiment of the invention is shown, which will be explained in more detail in the following detailed description.

The - only - figure shows a very schematic representation of the operation of the 3D printer according to the invention for the production of a raumförmlichen component, which at least one electrical functional element 5 contains, with a first processing head 1 , the plastic-containing base material for producing a semifinished component matrix 3 - First differently than shown in the drawing, where already the fully assembled component is shown - without electrical functional element 5 can soften thermally. This 3D printer is inventively characterized in that at least a second machining head 2 is present, which is the electrical functional element 5 in the space-shaped volume structure of the first processing head 1 produced, in this state still half-finished component matrix 3 can bring, and that the first processing head 1 is formed such that it by thermal softening of further plastic-containing base material from the second processing head 2 introduced electrical functional element 5 into the component matrix 3 can embed, with electrical conductors 4 either in a previous, in a subsequent or in the same step in the component matrix 3 be introduced.

The second machining head 2 may comprise an arrangement for wire feed-controlled melting of solder wire, in particular an automatable arrangement, such as the DE 10 2005 058 308 B4 or the EP 1 795 292 B1 is described.

Also, the second machining head 2 comprise a device for dispensing and subsequent sintering of metal particle-containing material, wherein here the use of a solder paste, a conductive adhesive or an intrinsically conductive plastic paste, in particular with embedded carbon particles or metal fibers, recommends as a metal particle-containing material.

At least a portion of the thermal processing, in particular the melting of solder wire and the sintering of metal particle-containing material can be effected by means of a laser beam arrangement.

In - not shown in the drawing - further embodiments of the 3D printer according to the invention may also be present a third processing head, the other electrical and / or electronic functional elements 5 before embedding through the first processing head 1 into the semi-finished component matrix 3 can contribute.

• – ein vierter Bearbeitungskopf vorhanden ist, der elektrische Leiterbahnen vor dem Einbetten durch den ersten Bearbeitungskopf 1 in die halbfertige Bauteil-Matrix 3 einbringen kann;
• – ein Bearbeitungskopf vorhanden ist, der als Bestücker, insbesondere als mechanischer und/oder pneumatischer Greifer, ausgelegt ist;
• – ein Bearbeitungskopf vorhanden ist, der als Robotereinheit aufgebaut ist;
• – mehrere der Bearbeitungsköpfe, vorzugsweise der zweite Bearbeitungskopf 2 und der dritte Bearbeitungskopf und/oder der vierte Bearbeitungskopf räumlich als eine Einheit aufgebaut sind.

Also not shown in the drawings are embodiments of the invention in which

• - There is a fourth processing head, the electrical traces before embedding by the first processing head 1 into the semi-finished component matrix 3 can bring in;
• - A machining head is present, which is designed as a mounter, in particular as a mechanical and / or pneumatic gripper;
• - There is a machining head, which is constructed as a robot unit;
• - Several of the processing heads, preferably the second processing head 2 and the third processing head and / or the fourth processing head are spatially constructed as a unit.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102005058308 B4 [0008, 0015, 0027]
• EP 1795292 B1 [0008, 0015, 0027]

Cited non-patent literature

• D. Ifland et al., "Generative Fabrication for Direct Integration of Microelectronic Components and Contact Structures", Lasers in Electronics Production & Precision Engineering, Proceedings: LEF 2014 [0002]
• Amit Joe Lopes et al; "Integrating stereolithography and direct print technologies for 3D structural electronics fabrication"; Rapid Prototyping Journal, Volume 18, Number 2, 2012, 129-143 [0002]

Claims (11)

3D printer for the production of a spatial component which has at least one electrical functional element ( 5 ), with a first processing head ( 1 ), the plastic-containing base material for producing a semifinished component matrix ( 3 ) without electrical functional element ( 5 ) can soften thermally, characterized in that at least one second processing head ( 2 ) is present, which the electrical functional element ( 5 ) into the spatial volume structure of the first processing head ( 1 ) generated half-finished component matrix ( 3 ), and that the first processing head ( 1 ) is formed such that it by thermal softening of further plastic-containing base material from the second processing head ( 2 ) introduced electrical functional element ( 5 ) into the component matrix ( 3 ) can embed. 3D printer according to claim 1, characterized in that the second processing head ( 2 ) comprises an arrangement for wire feed controlled melting of solder wire. 3D printer according to claim 2, characterized in that the arrangement for melting solder wire comprises a feed device for linearly advancing a wire along an axial direction by means of a conveyor comprising a driven by a propulsion motor feed wheel, which with its rotating circumference against the to be conveyed Pressing wire transversely to the axial direction, wherein on the opposite side of the wire, a secondary wheel is arranged as a counter-pressure pinion, which receives the pressing force of the feed wheel to the continuous wire rotating, with a control unit which outputs a drive signal to the conveyor, which affects the linear displacement of the wire caused by the conveyor, in particular regulates, wherein the feed device comprises a holder on which on the one hand a wire spool is mounted, from which the wire to be conveyed is unwound, and on the other to the Vortrie bsmotor is fixed, wherein the free in the conveying direction of the wire wire end impinges in the conveying direction on a counter surface while receiving a direction opposite to the conveying direction pressure reaction force and forwards in the axial direction along the wire, wherein a sensor unit for measuring the pressure absorbed by the wire pressure reaction force is provided the sensor unit comprises an electromechanical sensor which is rigidly connected to the feed device via the holder and generates an electronic measurement signal as a function of the measured pressure reaction force, which is forwarded as an input signal to the control or regulation unit, and wherein the control or regulation unit due to the measured pressure reaction force emits a drive signal for controlling or regulating the caused by the conveyor linear displacement of the wire to the conveyor. 3D printer according to one of claims 1 to 3, characterized in that the second processing head ( 2 ) comprises means for dispensing and then sintering metal particle-containing material. 3D printer according to claim 4, characterized in that a solder paste, a conductive adhesive or an intrinsically conductive plastic paste, in particular with embedded carbon particles or metal fibers, is used as the metal particle-containing material. 3D printer according to one of claims 2 to 5, characterized in that at least a part of the thermal processing, in particular the melting of solder wire and the sintering of metal particle-containing material by means of a laser beam arrangement takes place. 3D printer according to one of the preceding claims, characterized in that a third processing head is provided, the further electrical and / or electronic functional elements ( 5 ) prior to embedding by the first processing head ( 1 ) into the semi-finished component matrix ( 3 ) can contribute. 3D printer according to one of the preceding claims, characterized in that a fourth processing head is provided, the electrical conductor tracks before embedding by the first processing head ( 1 ) into the semi-finished component matrix ( 3 ) can contribute. 3D printer according to one of the preceding claims, characterized in that a machining head is provided which is designed as a mounter, in particular as a mechanical and / or pneumatic gripper. 3D printer according to one of the preceding claims, characterized in that a machining head is provided, which is constructed as a robot unit. 3D printer according to one of claims 7 to 10, characterized in that a plurality of the machining heads, preferably the second machining head ( 2 ) and the third processing head and / or the fourth processing head are spatially constructed as a unit.

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