DE102018108273A1 - Method for joining two packaging material substrate layers - Google Patents

Abstract

The invention relates to a method for bonding a first layer of a packaging material substrate and a second layer of a packaging material substrate through a coating material with a thermoplastic material using a nozzle with a fluid supply and a first electrode and a second electrode for generating a plasma within the nozzle. Plasma is generated within the nozzle by the first electrode and the second electrode. Plasma generated in the nozzle is deflected to the first layer of the substrate by supplying fluid through the fluid supply. The coating agent is fed into the plasma. In this case, the thermoplastic material softens through the plasma and applied to the first layer of the substrate. The second layer of the substrate is applied to the coated first layer of the substrate to bond the first layer of the substrate and the second layer of the substrate through the thermoplastic material. The invention further relates to a packaging machine.

Description

The invention relates to a method for connecting a first layer of a packaging material substrate to a second layer of a packaging material substrate by means of a coating material with a thermoplastic material. The invention further relates to an arrangement having a nozzle with a fluid supply and a first electrode and a second electrode for generating a plasma.

Packaging materials, in particular paper, cardboard, corrugated cardboard or cardboard can be produced inexpensively and are often used for deliveries as packaging material. However, these packaging materials are typically sheet-like materials that must be converted for packaging objects, for example, as a cuboid box. For this purpose, the packaging materials can be glued together from packaging blanks. The bonding of such packaging blanks requires adhesive material and energy to apply the adhesive material.

For bonding layers of a packaging, in particular a packaging material substrate, hot melt adhesives can be used. These have the advantage over cold glue that the initial adhesion of the joint is very high and the splice can be charged directly. The application of cold glue requires a relatively simple application system, comprising a pump or a pressure tank, one or more delivery lines, at least one adhesive application head, which applies the adhesive to the joints according to a pattern specification of a valve control. Such application systems are inexpensive and require relatively little energy during their operation. In addition, cold glue compounds form very strong compounds after setting, which are generally no longer soluble when using porous surfaces without destroying the adhesive layer. Cold glue has a relatively long gluing time. Adhesion time is the time that an adhesive spread is able to bond under specified conditions. The long gluing time therefore requires a long compression of the joints, as they can open again without prolonged pressure. For this reason, folding carton gluing machines have long pressing sections which require a lot of space and also increase the machine outlay.

From the publication EP 20 54 785 B1 a system for processing hot melt adhesives is known. Described herein are a hot glue application system and a method for controlling and monitoring the hot glue application system.

A hot melt adhesive application system may include a melter, one or more heatable delivery tubes. Other embodiments of hot melt adhesive application systems are known. Common to this is that the adhesive should be heated and kept at elevated temperatures throughout the processing. This requires a lot of equipment, and the elevated temperatures create dangers of burns in contact with the components of a hot melt adhesive application system and scalding in contact with the hot melt. In addition, hot melt adhesives tend to thermal degradation or coking with constant heating. Individual components of the adhesive burn and the burnt residues clog filters or adhesive application systems. For this reason, and because of the continuous heat load, hot melt adhesive systems have a higher maintenance susceptibility and a higher spare parts requirement than cold glue systems.

It is an object of the present invention to provide an efficient concept for joining a first layer of packaging material substrate to a second layer of packaging material substrate.

This object is solved by the features of the independent claims. Advantageous embodiments of the invention are the subject of the description, the drawings and the dependent claims.

The present invention is based on the finding that the above object can be achieved with a nozzle that generates a plasma, wherein in the plasma, a thermoplastic material of a coating agent is applied at least, which is applied to a first layer of a packaging material substrate.

• - Erzeugen von Plasma innerhalb der Düse durch die erste Elektrode und die zweite Elektrode;
• - Auslenken des erzeugten Plasmas auf die erste Lage des Substrats durch Zuführen von Fluid in die Düse mittels der Fluidzufuhr;
• - Zuführen des Beschichtungsmittels in das Plasma wobei das thermoplastische Material durch das Plasma erweicht und auf die erste Lage des Substrates aufgebracht wird;
• - Aufbringen der zweiten Lage des Substrates auf die beschichtete erste Lage des Substrates um die erste Lage des Substrates und die zweite Lage des Substrates durch das thermoplastische Material zu verbinden.

According to a first aspect, the invention relates to a method for connecting a first layer of a packaging material substrate to a second layer of a packaging material substrate in a packaging machine by a coating material with a thermoplastic material using a nozzle with a fluid supply and a first electrode and a second electrode for generating a Plasma inside the nozzle, with:

• Generating plasma within the nozzle through the first electrode and the second electrode;
• Deflecting the generated plasma onto the first layer of the substrate by supplying fluid into the nozzle by means of the fluid supply;
• - supplying the coating agent into the plasma wherein the thermoplastic material is softened by the plasma and applied to the first layer of the substrate;
• - Applying the second layer of the substrate to the coated first layer of the substrate to connect the first layer of the substrate and the second layer of the substrate by the thermoplastic material.

The substrate, d. H. The packaging material substrate may comprise a packaging blank and / or a packaging. The plasma is in particular atmospheric pressure plasma, ie plasma which is produced under atmospheric pressure.

The method may be performed by a packaging machine. The nozzle may be part of a packaging machine. Packaging machines are for example in the Standard EN 415-1: 2014 "Terminology and classification of names for packaging machinery and related equipment". Such packaging machines include filling and dosing machines, capping machines, labeling, decorating and coding machines, inspection machines, container and component handling machines, forming machines, cartoning machines, wrapping machines, box packing machines, machines for producing, dissolving and securing pallet loads or other loading units.

Such packaging machines can be used to package packaged goods. Such a packaging machine may comprise at least one adhesive applicator which serves to join parts of the package together. Packaging, i. Packaging parts, packaging blanks or substrate parts can thus be joined together. Packaging machines can also produce precursors, such as cartons or other forms of packaging that can be filled and sealed by a packaging machine. These include folding box machines, but also machines for bag and bag production. For the purposes of this application, the term "packaging machines" is to be understood equally for packaging machines and machines of packaging production.

An advantage of hot melt adhesive systems is that they produce an adhesive bond almost immediately after pressing the surfaces and the joint is no longer openable. The packaging can be loaded immediately after joining. The packaging usually has a content, the product, at the time of joining in packaging machines. This additionally loads the joint, as a result of which a rapid production of a reliable adhesive bond is required.

The thermoplastic material is a thermoplastic component of the coating material and may be a hot melt adhesive. A hot melt adhesive includes thermoplastic natural or plastic, resin, wax, or other materials capable of bonding two layers together after heat activation.

An advantage of the method is that the material selection can be chosen further than in comparison with a conventional hot melt adhesive application method. It can e.g. Thermoplastics are selected with higher softening temperatures, since the temperature of the plasma jet is adjustable, in particular between 100 ° C and 600 ° C. The risk that a package unintentionally opens at an elevated ambient temperature is no longer due to a higher softening temperature. When the plasma jet impinges on the first layer of the packaging material substrate, the plasma may have a temperature below 200 ° C., in particular between 80 ° C. and 160 ° C., for example 140 ° C.

Different thermoplastics can be used. Due to the high range of materials for thermoplastics, it is possible to choose materials that contribute less to migration and / or odor formation than in conventional processes. Migration of components from the hot melt adhesive or odor formation can therefore be avoided. This is desirable, for example, in the food and pharmaceutical industries.

One advantage is that a process is provided which melts the hot melt adhesive as needed at the time of application, i. a melt-on-demand process. There is no permanent heating of the hot melt adhesive. The risk of burning or coking of the adhesive is thus not given. The supplied adhesive, i. the supplied thermoplastic material does not have to be completely melted. Failure to completely melt through the thermoplastic material may have the advantage that the molten material maintains a certain height and does not spread completely on the substrate. A higher adhesive application allows a better bridging of the joint gap. Asperities of the substrate are more balanced. Therefore, less energy must be used than if the adhesive were melted through. Melting would in this case require an increased plasma temperature, which may entail a burning of the adhesive and / or the heat-sensitive packaging material substrate, in particular paper substrate or cardboard substrate.

The feeding of the coating agent can be done by a compressed air supply or a suction conveyor. The thermoplastic material can be transported as a powder, granules or other particulate form as a solid.

Due to the large number of possible components used as an adhesive, i. can be applied as a thermoplastic material, an operator is not necessarily bound to an adhesive manufacturer, but can choose from a wide range of substances and select them on the open market according to cost and quality standards. It can thus be used in the context of the invention, any thermoplastic material which has a sticky surface after melting or melting or after the application to the substrate forms one. The term hot-melt adhesive also broadly encompasses those substances having the stated properties.

The plasma in the nozzle can be generated by the first electrode and the second electrode, in particular by an arc between the two electrodes. The fluid supply in the nozzle can supply a fluid which flows out of a nozzle opening and carries the plasma. In particular, the fluid supply may include the supply of a gas which deflects the plasma from the nozzle. The deflected plasma may then be in contact with the first layer of the substrate.

In one embodiment, softening the thermoplastic material includes melting the thermoplastic material.

Molten thermoplastic material is liquid and can conform to unevenness in the surface of the substrate. The molten thermoplastic material may be melted so that it is completely liquid. Melting may also include thickening of the coating agent.

In one embodiment, the packaging material substrate comprises paper or cardboard.

The use of paper or cardboard enables the production of cheap and lightweight packaging.

In one embodiment, the deflection of the plasma comprises bundling the plasma. Here, the nozzle is adapted to focus the plasma to direct a collimated plasma jet at the first layer of the substrate.

The nozzle may be shaped so that the plasma output forms a narrow beam so that a pattern can be traced. The nozzle may in this case, for example, have an outlet opening of about 0.4 mm to 1 mm. Through the nozzle, the plasma can be bundled deflected. With the bundled deflected plasma, the thermoplastic material is deflected bundled and so applied the adhesive layer on a limited area on the packaging material substrate.

• - Abfahren eines vorbestimmten Musters, während das Beschichtungsmittel dem Plasma zugeführt wird, um das thermoplastische Material gemäß dem vorbestimmten Muster auf der ersten Lage des Substrats aufzubringen.

In one embodiment, the following step is additionally carried out before applying the second layer of the substrate:

• Traversing a predetermined pattern as the coating agent is supplied to the plasma to apply the thermoplastic material according to the predetermined pattern on the first layer of the substrate.

The application of the coating agent on a pattern saves coating agent compared to a surface application.

• - Abfahren des Musters während das Plasma aus der Düse gelenkt wird und bevor das Beschichtungsmittel dem Plasma zugeführt wird, um die Oberfläche der ersten Lage des Substrates vorzubehandeln.

In one embodiment, the following additional step is performed:

• - Shutting down the pattern while the plasma is directed out of the nozzle and before the coating agent is supplied to the plasma to pretreat the surface of the first layer of the substrate.

The plasma strikes the first layer of the substrate. As a result, the surface of the substrate is activated. This can increase the surface energy of the substrate. The adhesion of the adhesive layers is higher, which can compensate for a material property of some adhesives that have a certain surface adhesion. So strong adhesive bonds can be made, which can be solved only destructively again. Manipulation of packaging is made difficult or even impossible.

In one embodiment, the following step is additionally performed before the steps of the shutdown:

- Specifying the pattern by a pattern control.

The worn pattern can be determined by a controller, in particular a pattern controller. The pattern control may in this case be part of the packaging machine in which the nozzle is arranged. The pattern control can also be an external component. Pattern control can also be done mechanically or in software design. For example, the nozzle can be moved by a mechanism. The pattern controller may include an input-output interface through which parameters or operational data may be entered. Likewise, these values can be specified via a separate control, for example, not only the nozzle parameters but also controls the entire packaging machine. This allows the programmed or entered adhesive pattern to be processed. Here, the application device may be controlled to apply the adhesive pattern to the substrate at the location and in the amount as the pattern dictates.

The pattern controller may receive a start signal that serves to synchronize the operations. Starting from the start signal, a track controller calculates the location of the adhesive application, taking speed signals into account. These speed signals can come from a rotary encoder which is attached to a part of the packaging machine which is moving in proportion to the machine speed. The start signal may be from a sensor, e.g. a light reflex sensor, which detects the leading edge of the substrate. Alternatively, the start signal may also be taken from the control of the packaging machine or from a sensor, such as a printer. a print mark sensor, which detects a feature of the substrate.

The liquid metering pattern represents a series of dispensing cycles that produce a pattern of sticky traces of material on the substrate. The patterns may be a sequence of dots and / or beads. The pattern is often presented by numeric values or values that are in a pattern memory. The pattern also includes distance values from a feature of the substrate, e.g. the leading edge of the substrate.

The pattern controller may control the delivery of the carrier liquid or the adhesive solid or the suspension or dispersion into the application device. The supply is clocked. The plasma jet can be generated continuously here. The application of the sticky substance is then controlled only by switching on or off the supply. Alternatively, the plasma jet can additionally or alternatively be clocked. The plasma jet may be activated in time prior to the delivery of the adhesive solid or suspension or dispersion by the controller.

The system controller may adjust the delivery of the adhesive solid or suspension or dispersion according to the product speed. With increasing production speed more substance or suspension or dispersion of the application device can be supplied with less production speed. Here, the applied amount per unit area of the substrate can be kept within narrow limits.

The system controller may adjust the plasma temperature of the amount of adhesive solid or suspension or dispersion supplied. The plasma temperature can alternatively or additionally be adjusted depending on the production speed, since the temporal thermal load of the substrate per unit area increases with increasing production speed and vice versa. A burning of the substrate surface is thus avoided and at the same time an optimal melting or melting of the sticky substance, in particular of the thermoplastic material is achieved. The plasma temperature can i.a. be controlled by the driving frequency (pulse train) of the electrical excitation of the plasma generation.

As a plasma-capable medium that is supplied to the application device, a gas, a mixture of different gases, a liquid, a mixture of different liquids or even a mixture of one or more gases (s) with one or more liquid (s) can be used. The gases and / or liquids used can be targeted to the particular application, e.g. the supplied material, be turned off and be optimally adapted to the adhesive task. The medium supplied to the application device can be tempered. This can be done, for example, with a resistance heater. This can also be adapted by the control to the production conditions alternatively or in addition to the plasma temperature control.

The temperature of the plasma jet may be in a temperature range between 100 and 600 ° C at the time of formation. The temperature on the substrate may be lower to avoid thermal damage to the substrate. The plasma jet does not necessarily have to hit the substrate with its tip. The plasma can also serve only to melt or melt the thermoplastic material. Advantageously, the plasma jet hits the substrate with its tip in order to simultaneously achieve a pretreatment effect. The temperature control can ensure that the surfaces to be treated are not overheated by the plasma jet and that the substrate surface is not destroyed. This helps the cooling that bring the introduction of the adhesive solid or the suspension or dispersion with it. In addition, the thermal load per unit of time decreases with increasing production speed, so that higher plasma temperatures can be selected at high production speeds. The controller may have characteristics or other characteristics that describe the relationships between the production conditions and the operating data of the application device, such as the plasma temperature. The characteristics can also be the data of the supplied adhesive solid or the suspension or dispersion, such as melting and / or Softening temperature or evaporation parameters of the suspension or dispersion carrier liquid.

The temperature of the plasma jet can be effected by changing the electrical control parameters of the generation of the plasma jet and / or by a timing or frequency adaptation of the plasma jet. The temperature control can also be done additionally or solely by the transport fluid (gas and / or liquid) is brought by coolant to different temperature levels. In this case, all customary tempering devices or temperature control can be used.

In one embodiment, the pattern is traversed by a movement of the nozzle and / or a movement of the first layer of the substrate.

To shut off the pattern, the nozzle or the substrate can be moved. Likewise, both components can be moved against each other, which allows less movement of each component to coat the same distance.

In one embodiment, the feeding of the coating agent and / or the supply of the fluid are based on the speed of the movement.

The application of the coating agent with the thermoplastic material depends on the speed of movement. In order to uniformly apply the coating agent, the supply of the coating agent and / or the fluid can be varied. In this case, the supply of the fluid can influence the exit velocity of the plasma, so that the exit takes place at a higher speed.

In one embodiment, generating the plasma includes generating plasma at a predetermined temperature, wherein the predetermined temperature is dependent on the velocity of the movement.

The temperature of the plasma can be controlled by a plasma control. The plasma control may be part of the packaging machine. The plasma control can also be done externally. The predetermined temperature may be selected so that the material of the packaging material substrate is not burned. Likewise, the temperature can be selected so that the coating composition, in particular the thermoplastic material, is not coked. At higher nozzle or substrate speeds, a higher temperature can be selected because the contact is shorter, thus reducing the risk of fire.

In one embodiment, the coating composition is introduced into a carrier liquid, in particular a suspension or a dispersion or dissolved in the liquid.

Solids are easy to store. A suspension or a dispersion can be easily conveyed. Even when dissolved in the liquid, the coating agent can be easily conveyed. The carrier liquid can be water. It may be delivered to the application device by means of a pumping device, i. the nozzle to be transported. In this case, the carrier liquid can evaporate in the plasma.

In one embodiment, the thermoplastic material is einstoffig. A one-material material is easy to store, which can save costs.

In one embodiment, the step of supplying comprises a clocking.

When the supply of coating agent is clocked, i. if the supply of the coating agent has interruptions, individual points on the first layer of the packaging material substrate can be coated. For this purpose, a valve can be controlled, which regulates the supply of the coating agent. The supply can be interrupted regularly or irregularly.

In one embodiment, the step of generating the plasma comprises a clocking.

The timing can be done for example by controlling the plasma, in particular the generation of the plasma and so also the plasma exit. This allows patterns to be traversed intermittently. The generation can be interrupted regularly or irregularly.

According to a second aspect, the invention relates to a packaging machine. The packaging machine comprises a nozzle having a fluid supply and a first electrode and a second electrode for generating a plasma within the nozzle. The packaging machine is adapted to carry out a method of the type described above.

list of figures

• 1 eine schematische Darstellung einer Packstoffanordnung gemäß einer Ausgestaltung der Erfindung;
• 2 eine schematische Darstellung einer Anordnung mit einer Düse gemäß einer Ausgestaltung der Erfindung;
• 3 eine weitere schematische Darstellung einer Anordnung mit einer Düse gemäß einem weiteren Ausführungsbeispiel;
• 4 eine schematische Darstellung einer Anordnung mit einer Düse gemäß einem weiteren Ausführungsbeispiel; und
• 5 ein schematisches Flussdiagramm für ein Verfahren gemäß einer Ausgestaltung der Erfindung.

Further embodiments will be explained with reference to the accompanying drawings. Show it:

• 1 a schematic representation of a packaging material arrangement according to an embodiment of the invention;
• 2 a schematic representation of an arrangement with a nozzle according to an embodiment of the invention;
• 3 a further schematic representation of an arrangement with a nozzle according to another embodiment;
• 4 a schematic representation of an arrangement with a nozzle according to another embodiment; and
• 5 a schematic flowchart for a method according to an embodiment of the invention.

Aspects and embodiments will be described with reference to the drawings, wherein like reference numerals generally refer to like elements.

1 shows a schematic representation of a packaging material arrangement 100 , 1 shows a first location 101 a packaging material substrate. In the exemplary embodiment shown, the packaging material substrate is the first layer 101 a box. In other embodiments, the packaging material substrate may include paper, paperboard or other packaging material substrates. The packaging material substrate may also comprise a cardboard or paper, which is partially or completely laminated with a metallic and / or a plastic film. The packaging material substrate can also be a corrugated cardboard.

On the first layer of Packstoffsubstrats is a coating agent 102 applied. The coating agent 102 comprises a thermoplastic material. The thermoplastic material is an adhesive.

On the coating agent 102 is a second location 103 a Packstoffsubstrats applied. In the embodiment shown, the second layer 103 from the same packaging material substrate as the first layer 101 , In another embodiment, the packaging material substrates differ. For example, this plastic is applied to cardboard. The coating agent 102 with the thermoplastic material connects the first layer 101 of the packaging material substrate with the second layer 103 of the packaging material substrate.

The coating agent 102 on the first location 101 the Packstoffsubstrats apply can be done by means of a nozzle.

2 shows an arrangement with a nozzle 200 according to an embodiment of the invention. The nozzle 200 In particular, it is a plasma nozzle that is adapted to plasma 205 deflect.

The nozzle 200 has a first electrode 201 and a second electrode 202 on. The first electrode 201 and the second electrode 202 can create an arc by applying to the first electrode 201 and the second electrode 202 a voltage is applied which is large enough to resist the resistance between the first electrode 201 and the second electrode 202 to bridge. The arc is created between the first electrode 201 and the second electrode 202 the plasma 205 ,

The nozzle 200 has a fluid supply 203 on. The fluid supply 203 is in the illustrated embodiment, a port from which a gas can flow. The gas flows through the fluid supply 203 in the direction of an outlet opening 204 the nozzle 200 , Lies between the first electrode 201 and the second electrode 202 apply a voltage, leaving an arc between the first electrode 201 and the second electrode 202 is generated, so this plasma 205 of the arc due to the gas coming from the fluid supply 203 flows, in the direction of the outlet opening 204 crowded and through the outlet opening 204 from the nozzle 200 deflected.

In 2 is also a first location 101 of a packaging material substrate. The first location 101 of the packaging material substrate corresponds to the first layer 101 of the packaging material substrate according to 1 , That from the nozzle 200 deflected plasma 205 is from the gas from the fluid supply 203 on the first location 101 of the packaging material substrate. The plasma 205 in this case has contact with a surface of the first layer 101 of the packaging material substrate.

The nozzle 200 has a feed channel 206 on. The feed channel 206 serves as a coating agent 102 into the plasma 205 the nozzle 200 initiate. Im too 2 described embodiment, the coating agent 102 inside the nozzle 200 into the plasma 205 initiated.

The feed channel 206 is connected to a feeder (not shown) containing the coating agent 102 from a coating agent reservoir promotes. The promotion is a pressure boosting, in another embodiment, the promotion is a suction conveyor. The feed channel 206 has an opening in the nozzle 200 that enter the plasma 205 protrudes when this is out of the nozzle 200 is deflected.

The coating agent 102 is through the plasma 205 anschmelzbar. The coating agent 102 is through the plasma 205 so it softens when it's the plasma 205 is supplied. Depending on the temperature of the plasma 205 and the duration, the the coating agent 102 in the plasma 205 spends it to the first location 101 the packaging material substrate is applied, the coating agent 102 also melted, in particular melted.

The coating agent 102 Contains a thermoplastic material that is used to bond two packaging material substrate layers 101 . 103 serves.

3 shows a further embodiment of an arrangement with a nozzle 300 , Here are parts of the nozzle 300 which are essentially the parts of the nozzle 200 from the embodiment of 2 correspond, provided with the same reference numerals. However, this should not be understood as limiting, in particular the parts provided with the same reference numbers may be omitted, replaced or modified in further embodiments.

The generation of the plasma 205 inside the nozzle 300 corresponds to the generation of the plasma 205 inside the nozzle 200 how to 2 described. The plasma 205 is between the first electrode 201 and the second electrode 202 generated and by a fluid from the fluid supply 203 from the outlet opening 204 deflected.

In contrast to the previously described embodiment too 2 includes the nozzle 300 a first feed channel 206 and a second feed channel 207 , In further embodiments, the number of feed channels may also vary and be between one and a greater number. The first feed channel 206 and the second feed channel 207 are outside the nozzle 300 arranged so that through both feed channels 206 . 207 the coating agent 102 only then into the plasma 205 is introduced when the plasma 205 the interior of the nozzle 300 already left. In another embodiment, at least one opening is one of the feed channels 206 . 207 in the nozzle 300 ,

4 shows a further schematic representation of an arrangement with a nozzle 400 according to a further embodiment. The nozzle 400 also has a first electrode as described for the two previous embodiments 201 and a second electrode 202 on that an arc and thus a plasma 205 produce. The plasma 205 is through an outlet opening 204 from the nozzle 400 discharged. The discharged plasma 205 then hits the surface of the first bearings 101 of the packaging material substrate.

The nozzle 400 according to the in 4 described embodiment has a combined fluid supply and Zuführkanalöffnung 401 on. The combined opening 401 serves on the one hand, a fluid in the nozzle 400 Introduce the plasma 205 from an outlet opening 204 rejects them. At the same time serves the combined opening 401 to the coating agent 102 in the nozzle 400 and thus into the plasma 205 introduce. In the embodiment shown is through the combined opening 401 a coating agent 102 introduced in a liquid, in particular a suspension. In other embodiments, it may be a dispersion. The fluid is made by contact with the plasma 205 at least partially evaporated, whereby the coating agent 102 is separated from the fluid. In another embodiment, the fluid is a gas containing the coating agent 102 carries with it and after exiting the combined opening and the plasma 205 from the nozzle 400 directs.

The coating agent 102 gets along with the fluid through the nozzle 400 passed and thus with the plasma 205 from the outlet opening 204 deflected.

5 shows a flowchart 500 the method steps for a method according to an embodiment. In one step 501 a pattern is set. The pattern is a pattern that determines where coating agents are 102 on the first location 101 is applied. The pattern definition takes place by a pattern control. Pattern control is software control that resides in a control unit outside the nozzle 200 . 300 . 400 is arranged. In another embodiment, the pattern control is in the nozzle 200 . 300 . 400 arranged or mechanically executed, in particular by a slotted guide. On the step 501 can be omitted, whereby no pattern is set.

In step 502 becomes plasma 205 generated. For this purpose, a voltage between the first electrode 201 and the second electrode 202 created so that between the first electrode 201 and the second electrode 202 the nozzle 200 . 300 . 400 an arc is generated.

In step 503 becomes the plasma 205 from the nozzle 200 . 300 . 400 deflected. This is due to the fluid supply 203 , or through the combined opening 401 a fluid in the nozzle 200 . 300 . 400 initiated. The introduced fluid leaves the nozzle 200 . 300 . 400 through the outlet opening 204 , In this case, the plasma is due to the fluid flow 205 taken along and from the place of production between the electrodes 201 . 202 also from the outlet opening 204 the nozzle 200 . 300 . 400 deflected.

The deflected plasma 205 meets the surface of the first layer 101 of the packaging material substrate. In the described embodiment, the Fluid a gas. In another embodiment, it is a liquid. The liquid is at least partially evaporated by the plasma.

In step 504 will that be in the step 501 specified pattern, if not on the step 501 was waived. The pattern is traversed by a movement of the nozzle 200 . 300 . 400 relative to the first location 101 of the packaging material substrate. In the described embodiment, the nozzle 200 . 300 . 400 emotional. In further embodiments, the first layer 101 alone or in cooperation with the nozzle 200 . 300 . 400 emotional. While the pattern is being traversed, the generation of the plasma is 205 clocked, ie the plasma 205 is temporarily interrupted so that not every part of the surface of the first layer 101 of the packaging material substrate from the plasma 205 is touched. This allows patterns to be intermittent, such as a pattern with dots. In another embodiment, the plasma 205 continuously generated and not interrupted. By doing that the plasma 205 in a pattern on the first layer 101 is applied, the surface is activated. This is not yet the coating agent 102 and thus not yet on the first situation 101 applied.

In step 505 becomes the coating agent 102 fed. The coating agent 102 is through the feed channel 206 the nozzle 200 fed. In a further embodiment, the coating agent 102 through the feed channels 206 and 207 the nozzle 300 fed or through the common opening 401 the nozzle 400 fed. In all cases, the coating agent 102 the plasma 205 fed. The plasma 205 softens a thermoplastic material in the coating agent 102 so that it melts or melts, that is partially or completely liquefied.

Melting comprises complete liquefaction of the thermoplastic material in the coating composition 102 , Together with the plasma becomes the coating agent 102 on the surface of the first layer 101 of the packaging material substrate. Because the surface in step 504 has been activated, the coating material adheres well to the surface of the first layer 101 , Alternatively, the step 504 eliminated and the surface of the situation 101 of the packaging material substrate is not activated.

In step 506 the pattern is run again if a pattern in step 501 was determined. This will be the same pattern as in step 504 left. Thus, the coating agent becomes 102 on the first location 101 applied. In particular, the coating agent comprises 102 the thermoplastic material having adhesive properties. Thus, by the application of the coating agent 102 an adhesive on the first layer 101 the Packstoffsubstrates applied. Will on the step 504 waived, so is in the step 506 The pattern was traced the first time.

In step 507 becomes the second location 103 a Packstoffsubstrats on the first layer 101 of the packaging material substrate. In the described embodiment, it is in both layers 101 . 103 around the same packaging material substrate, in particular cardboard. In other embodiments, the layers may include different packaging material substrates. The second location 103 will be on the first location 101 applied, so, as in 1 shown, a layer sequence is created, which is the first layer 101 , the coating agent 102 and the second location 103 includes. Here is the coating agent 102 in the places between the first location 101 and the second location 103 arranged during the Musterabfahrens under supply of the coating agent 102 were driven off. The connection of the two layers 101 . 103 can be done by pressing the two layers 101 . 103 be increased to each other.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• EP 2054785 B1 [0004]

Cited non-patent literature

• Standard EN 415-1: 2014 [0011]

Claims (13)

Method for bonding a first layer (101) of a packaging material substrate to a second layer (103) of a packaging material substrate in a packaging machine by a coating material (102) with a thermoplastic material using a nozzle (200, 300, 400) with a fluid supply (203) and a first electrode (201) and a second electrode (202) for generating a plasma (205) within the nozzle (200, 300, 400), comprising: - generating plasma (205) within the nozzle (200, 300, 400) through the first electrode (201) and the second electrode (202); - deflecting the generated plasma (205) onto the first layer (101) of the substrate by supplying fluid into the nozzle (200, 300, 400) by means of the fluid supply (203); - feeding the coating agent (102) into the plasma (205) wherein the thermoplastic material is softened by the plasma (205) and applied to the first layer (101) of the substrate; - applying the second layer (103) of the substrate to the coated first layer (101) of the substrate to connect the first layer (101) of the substrate and the second layer (103) of the substrate through the thermoplastic material. Method according to Claim 1 wherein softening the thermoplastic material comprises melting the thermoplastic material. The method of any one of the preceding claims, wherein deflecting the plasma (205) comprises bundling the plasma (205), and wherein the nozzle (200, 300, 400) is adapted to focus the plasma (205) around a collimated plasma jet to direct to the first layer (101) of the substrate. Method according to one of the preceding claims, wherein additionally the following step is carried out before the application of the second layer (103) of the substrate: - traversing a predetermined pattern while the coating agent (102) is supplied to the plasma (205) to apply the thermoplastic material according to the predetermined pattern on the first layer (101) of the substrate. Method according to Claim 4 wherein additionally the following step is performed: - tracing the pattern while directing the plasma (205) out of the nozzle (200, 300, 400) and before the coating agent (102) is supplied to the plasma (205) to clean the surface of the pretreating the first layer (101) of the substrate. Method according to one of Claims 4 or 5 In addition, wherein the following step is performed before the steps of the shutdown: - Specifying the pattern by a pattern control. Method according to one of Claims 4 to 6 wherein the movement of the pattern is effected by a movement of the nozzle (200, 300, 400) and / or a movement of the first layer (101) of the substrate. Method according to Claim 7 wherein the feeding of the coating agent (102) and / or the supply of the fluid is based on the speed of the movement. Method according to Claim 7 or 8th wherein generating the plasma (205) comprises generating plasma (205) at a predetermined temperature, wherein the predetermined temperature is dependent on the velocity of the movement. Method according to one of the preceding claims, wherein the coating agent (102) is introduced into a carrier liquid. A method according to any one of the preceding claims, wherein the thermoplastic material is monosubstituted. The method of any one of the preceding claims, wherein the step of supplying comprises clocking. The method of any one of the preceding claims, wherein generating the plasma (205) comprises clocking.

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