DE102016014994A1 - Inlay for an electronic identification document - Google Patents

Abstract

The invention relates to an inlay (10) for an electronic identification document (30; 40) which is provided with electronic components in the form of a chip module (20) and an antenna (22). According to the invention it is provided that the inlay (10) is formed in one layer and consists of a single layer (12) in which the chip module (20) and the antenna (22) are accommodated.

Description

The invention relates to an inlay for an electronic identification document, which is provided with electronic components in the form of a chip module and an antenna. The invention also relates to a manufacturing method for such an inlay and a book-type electronic identification document or an electronic identification card, which are equipped with such an inlay.

Current identification documents often contain electronic components, in particular a chip module and an antenna for contactless reading of data stored in the chip module. The electronic components are usually in a so-called inlay, which represents a composite of a carrier material, a chip module and an antenna. Depending on the application, the inlay may, for example, be in the form of a data page which is bound into a passbook, in the form of an envelope-like inlay which is glued to an outer cover flap of a passport booklet or in the form of a card layer which is laminated into an identification card.

Typically, inlays are made in a sandwich construction in multiple layers for later processing. The layers serve to protect the chip module and the antenna or are intended to support the further production process. Such multilayer inlays are for example from the document EP 2 487 029 A1 known.

One potential problem of such inlays is the bond strength of the sandwich construction. While some materials form a strong bond by pressure and heat alone, other materials must be bonded together with additives such as adhesives. In any case, a sufficiently high bond strength must be ensured to complicate or prevent splitting of the inlay.

Proceeding from this, the present invention seeks to provide an inlay of the type mentioned, which offers a high protection against splitting and ideally also is easy and inexpensive to manufacture. The invention is also intended to provide a method for producing such an inlay and a book-type electronic identification document or an electronic identification card with such an inlay.

This object is solved by the features of the independent claims. Further developments of the invention are the subject of the dependent claims.

According to the invention, it is provided in a generic inlay that the inlay is formed in one layer and consists of a single layer in which the chip module and the antenna are accommodated.

Since the inlay according to the invention consists only of a single layer, it is not fissile and thus perfectly protected against separation attacks. The single layer takes on all electronic components, so that additional layers to protect the components are not required. The single-layer design results in significant time and material savings in the production. Also, significantly thinner inlays for cards and passport products can be created. Inherent problems of low bond strength in sandwich constructions are avoided and also the overall adhesion of the finished product is improved by reducing the number of layers.

In an advantageous embodiment, the chip module and the antenna are each arranged in a surface region of the single layer of the inlay. Both the chip module and the antenna can each be arranged in a surface region of the same side of the single layer of the inlay. Alternatively, the chip module and the antenna may also be arranged in each case in a surface region of opposite sides of the single layer of the inlay. In both cases, the chip module and the antenna are preferably electrically connected to each other.

In a preferred embodiment, the chip module and the antenna are completely embedded in the single layer, so that the single layer advantageously has a smooth surface.

The chip module is expediently embedded in a recess extending at least partially into the thickness of the single layer.

Depending on the application, different materials, in particular Teslin® or polycarbonate, come into consideration as materials for single layer.

The invention also includes a book-type electronic identification document, in particular a passport booklet, with an inner part with a plurality of interconnected sides and an inlay of the type described, wherein the inlay is incorporated in the identification document or is connected to an outer envelope of the identification document.

The invention further includes an electronic identification card, in particular an identity card, in which a plurality of card layers together with an inlay of the type described connected, in particular zusammenlaminiert to form the card body of the identification card.

Finally, the invention also includes a method for producing an inlay of the type described, in which a single layer is provided and electronic components in the form of a chip module and an antenna are introduced into the single layer.

Preferably, the chip module and the antenna are introduced by means of UHF laying in the single layer, and thereby sink advantageously and completely in the single layer. The antenna and the chip module are advantageously introduced in two steps one after the other and preferably electrically connected to one another.

In an expedient development of the invention, after the introduction of the chip module and the antenna, the single layer is pressed under the action of pressure and / or heat in order to produce an inlay with a smooth surface.

Further exemplary embodiments and advantages of the invention are explained below with reference to the figures, in the representation of which a representation true to scale and proportion has been dispensed with in order to increase the clarity.

• 1 in Aufsicht eine schematische Darstellung eines zum Einbinden in einen elektronischen Pass bestimmten Inlays,
• 2 einen Querschnitt des Inlays der 1 entlang der Linie II-II,
• 3 in schematischer Explosionsdarstellung einen elektronischen Pass mit einem erfindungsgemäßen Inlay,
• 4 in schematischer Explosionsdarstellung eine elektronische Ausweiskarte mit einem erfindungsgemäßen Inlay, und
• 5 bis 7 weitere Möglichkeiten ein Chipmodul und eine Antenne in der Einzelschicht eines erfindungsgemäßen Inlays anzuordnen.

Show it:

• 1 in plan a schematic representation of an intended for incorporation into an electronic pass inlays,
• 2 a cross section of the inlay of 1 along the line II-II,
• 3 in a schematic exploded view of an electronic passport with an inlay according to the invention,
• 4 in a schematic exploded view of an electronic identity card with an inlay according to the invention, and
• 5 to 7 further possibilities to arrange a chip module and an antenna in the single layer of an inlay according to the invention.

The invention will now be explained in more detail using the example of passbook inlays. 1 shows in plan a schematic representation of an inlay 10 , which is intended for incorporation into an electronic passport. 2 shows a cross section of the inlay 10 along the line II-II of 1 ,

In the inlay 10 are the electronic components required for the electronic passport in the form of a chip module 20 and an antenna connected to the chip module 22 added. According to the invention, the inlay 10 thereby formed in one layer and consists in the embodiment of a single layer 12 from Teslin®.

As in the cross section of 2 to recognize, are the chip module 20 and the antenna 22 both in a surface region of the same side 50 the single layer 12 arranged. The chip module 20 and the antenna 22 are completely in the single layer 12 embedded, leaving the inlay 10 has a smooth surface without any elevations caused by the electronic components.

The chip module 20 in the present case comprises a connection frame 24 and a potting compound 26 into which the silicon chip of the chip module 20 is poured. The connecting wires 28 for the connection of chip module 20 and antenna 22 are also shown schematically in the figure. The entire chip module 20 is in a partially in the thickness of the single layer 12 extending recess 14 embedded.

In the production of the inlay 10 of the 2 becomes after providing the single layer 12 in a first step, only the antenna 22 and in a subsequent second step, the chip module 20 at a suitable point of the single layer 12 introduced and electrically connected to the antenna 22 connected. The insertion of the antenna 22 and the chip module 20 takes place advantageously by UHF laying, with the heat generated by the components 20 . 22 something in the Teslin® material of the single layer 12 sink in and are absorbed by this.

To the components 20 . 22 completely in the single layer 12 To embed, this was after the introduction of the chip module 20 and the antenna 22 pressed under the action of pressure and / or heat to produce an inlay 10 with a smooth, elevation-free surface. Such a smooth surface is particularly advantageous when the inlay 10 to be glued to a flexible outer envelope in which any elevations of the inlay could be undesirable.

In other applications where the inlay 10 For example, glued with a solid, thick cover or laminated in a card layer stack, any unevenness of the surface of the inlay can be compensated by an adjacent layer of the host document, so that can be dispensed with a surface smoothing of the inlay.

For illustration shows 3 in a schematic exploded view of an electronic passport 30 with an inner part having a plurality of interconnected sides 32 , a solid outer envelope lid 34 and an inlay 10 of the type described above. In the finished state of passport 30 is the inlay 10 with the cover 34 firmly glued. The chip module 20 and the antenna 22 are on the envelope cover 34 facing side of the single layer 12 arranged so that the electronic components on the one hand from the envelope cover 34 be additionally protected and on the other hand any unevenness of the inlay 10 from the adjacent fixed cover 34 be compensated. Such a solid cover 34 is realized, for example, the German passport.

Is it the envelope 34 By contrast, a soft, flexible envelope, such as the US passport, becomes the single layer 12 before gluing with the envelope 34 compressed advantageous to produce a smooth, elevation-free surface.

4 shows as another embodiment, an electronic identity card 40 in a schematic exploded view, in which several card layers 42 . 44 . 46 . 48 with an inlay 10 laminated to the card body of the ID card 40 to build. The inlay 10 consists in this embodiment of polycarbonate to an intimate connection with the usually also made of polycarbonate card layers 42 - 48 enter into. Since the adjacent card layers any unevenness of the inlay 10 compensate, a smoothing pressing of the inlay is not required in this embodiment.

5 to 7 show more possibilities the chip module 20 and the antenna 22 in the single shift 12 to arrange. While in the design of the 2 first the antenna 22 with the wiring 28 and only in a subsequent step, the chip module 20 was introduced, the order of introduction in the embodiment of 5 conversely, so in a first step, it was just the chip module 20 and in a subsequent second step, the antenna 22 with the wiring 28 into the single layer 12 brought in.

In the embodiments of 2 and 5 are the chip module 20 and the antenna 22 each in a surface region of the same side 50 the single layer 12 arranged. This page 50 Can both the top and the bottom of the finished inlay 10 represent.

However, it is also possible, the chip module 20 and the antenna 22 each in a surface region of opposite sides 50 . 52 the single layer 12 to arrange the inlay, as in the 6 and 7 illustrated. In the embodiment of 6 In a first step, only the chip module was used 20 on the bottom 52 the single layer 12 brought in. In a subsequent second step, the antenna became 22 placed on the top 50 and the wires 28 through the single layer 12 passed through to the chip module 20 and the antenna 22 electrically connect with each other.

In the embodiment of 7 In a first step, the antenna 22 was on top 50 introduced and the wiring 28 created to the bottom 52. In a subsequent second step, the chip module 20 was on the bottom 52 inserted and with the connecting wires 28 connected.

Also in the embodiments of the 5 to 7 the introduction of the components takes place 20 . 22 also advantageous by UHF laying to the components something in the single layer 12 to sink. Also, the inlays of the 5 to 7 after insertion of the chip module 20 and the antenna 22 Pressed under pressure and / or heat to produce smooth, elevation-free surfaces. It goes on to say that also in the embodiments of 5 to 7 the role of top and bottom can be reversed.

In all embodiments is due to the single-layered design of the inlay 10 as a single layer 12 made sure the inlay 10 not cleavable.

LIST OF REFERENCE NUMBERS

10

inlay

12

single layer

14

recess

20

chip module

22

antenna

24

lead frame

26

potting compound

28

leads

30

electronic passport

32

pages

34

outer cover

40

electronic identity card

42,44,46,48

map layers

50

top

52

bottom

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• EP 2487029 A1 [0003]

Claims (13)

Inlay for an electronic identification document, which is provided with electronic components in the form of a chip module and an antenna, characterized in that the inlay is formed in one layer and consists of a single layer, in which the chip module and the antenna are accommodated. Inlay after Claim 1 , characterized in that the chip module and the antenna are each arranged in a surface region of the single layer of the inlay. Inlay after Claim 1 or 2 , characterized in that the chip module and the antenna are each arranged in a surface region of the same side of the single layer of the inlay and are preferably electrically connected to each other. Inlay after Claim 1 or 2 , characterized in that the chip module and the antenna are each arranged in a surface region of opposite sides of the single layer of the inlay and are preferably electrically interconnected. Inlay after at least one of Claims 1 to 4 , characterized in that the chip module and the antenna are completely embedded in the single layer, so that the single layer advantageously has a smooth surface. Inlay after at least one of Claims 1 to 5 , characterized in that the chip module is embedded in an at least partially extending in the thickness of the single layer recess. Inlay after at least one of Claims 1 to 5 , characterized in that the single layer of Teslin® or polycarbonate is formed. Book-type electronic identification document, in particular passport booklet, with an inner part having a plurality of interconnected pages and an inlay according to one of Claims 1 to 7 wherein the inlay is incorporated in the identification document or is connected to an outer envelope of the identification document. Electronic identification card, in particular identity card, in which a plurality of card layers together with an inlay according to one of Claims 1 to 7 connected, in particular zusammenlaminiert to form the card body of the identification card. Process for producing an inlay according to one of Claims 1 to 7 in which a single layer is provided and electronic components in the form of a chip module and an antenna are introduced into the single layer. Method according to Claim 10 , characterized in that the chip module and the antenna are introduced by means of UHF laying in the single layer and thereby sink into the single layer. Method according to Claim 10 or 11 , characterized in that the antenna and the chip module are introduced in two steps successively and preferably electrically connected to each other. Method according to at least one of Claims 10 to 12 , characterized in that the single layer is pressed after the introduction of the chip module and the antenna under the action of pressure and / or heat to produce an inlay with a smooth surface.

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