DE102016012755A1 - Method and device for producing a card body with a chip and card body with a chip - Google Patents

Abstract

A method of making a card body with a chip, the method comprising the steps of: providing a bridge layer having two recesses, wherein dimensions of a surface portion between the two recesses are at least as dimensioned as dimensions of a surface portion of the chip; providing an antenna layer, wherein one surface the antenna layer comprises an antenna structure having two antenna terminals, each of the two antenna terminals being at least partially aligned with one of the two recesses of the bridge layer; providing a die, the chip being mounted on a surface of the die, and two laterally Layers of the bridge layer and the antenna layer, wherein the two antenna terminals of the antenna layer are at least partially aligned with the two recesses of the bridge layer, introducing an electrically conductive (adhesive) Cloths in the recesses of the bridge layer, until they are at least partially filled with the electrically conductive (adhesive) material layers of the die and the bridge layer, wherein the chip of the chip layer facing the surface portion between the two recesses of the bridge layer and is positioned thereon.

Description

background

Here, a method for manufacturing a card body with a chip, for example, in the form of a flip chip will be described. Furthermore, an apparatus for manufacturing a card body with a chip and a card body with a chip will be described. The card body can have different standards: ID1 format, see "Bank Card" ISO / IEC7813 , "Memory Card" see ISO / IEC 7811 , "ID1 Identity Card" see ISO / IEC 7816, "Identity Card" see ISO / IEC 14443 , The chip can also have different standards: "Full-size" see ISO / IEC 7810: 2003 , ID-1 "Mini-SIM" see ISO / IEC 7810: 2003 . ID-000, "Mirco-SIM" see ETSI TS 102 221 V9.0.0 = "Mini-UICC" . "Nano-SIM" see ETSI TS 102 221, TS 102 221 V11.0.0 , and "Embedded SIM" see JEDEC Guide 4.8 ,

Usually, the card bodies are made of plastic that includes the chip. Often, one or more layers of the card body are laminated to form a solid composite of the various layers of the card body. The aim and purpose of the network is, on the one hand, to protect the chip inside the card from unauthorized access and, on the other hand, data exchange with the chip should be possible. The data exchange can take place by contacting or non-contact. For the latter variant, the card body has an antenna structure, wherein antenna terminals of the antenna structure are connected to metal contact elements of the chip.

When attempting to dissolve the composite, the chip is damaged and thus unusable. Thus, on-chip and sensitive information such as bank information, personal information and other sensitive data can be protected. Due to the antenna structure, it is possible to allow a data exchange between the chip and a device provided for data exchange.

Since the metal pads of the chip have small areas, most of which are in the micrometer range, a corresponding arrangement of the metal pads with respect to the antenna terminals is prone to spatial disposition, mechanical stress, and short circuit risk. To account for this in the manufacture of the card body, there are various methods to safely ensure electrical contact with the chip without destroying the metal contact surfaces.

State of the art

From the DE 103 24 043 B4 a method is known in which in a first step, a first plastic film is provided with a first opening, wherein contact elements of a conductor pattern protrude into the opening. In a second step, a second plastic film is provided with a second opening and applied to one side of the first plastic film with the contact elements, such that both openings are exactly opposite. The contact elements can then be deformed by means of a punch to carry a Funktionsinlett and electrically connect to the conductor track structure. Subsequently, in each case a further plastic film is applied to the first plastic film and the second plastic film in order to form an overall composite and protect the Funktionsinlett from external influences.

From the DE 10 2005 058 101 A1 a method is known in which in a first step, a chip is arranged on a cover layer and which is received by a receiving position with a recess. In a further step, a substrate with an antenna device is applied to the receiving layer, wherein the contacts of the antenna device are pressed with a punch in the recess of the receiving layer such that they contact laterally located terminals of the chip. The composite formed in this way can then be supplemented by further layers.

Both documents disclose a method in which the contacts of the antenna are mechanically deformed to connect them to the chip. This involves the risk that either the chip or the contacts of the antenna can be damaged or that the mechanical connection dissolves again.

Underlying task

The object is to provide a cost-effective, fast and durable to be produced arrangement for a card body with a chip. The object is also to provide a simple and inexpensive method for producing the card body with the chip and a device for producing the card body with the chip.

Suggested solution

The object is achieved by a method and a device for producing a card body, in which by the arrangement proposed here, the connections of the antennas and the recesses for connecting the antenna terminals the antennas with the chip of a separate stepwise mechanical connection is avoided and an electrical connection is reliably made.

1. a) Bereitstellen einer Brückenlage mit zwei Aussparungen, wobei Abmessungen eines Flächenabschnitts zwischen den zwei Aussparungen mindestens so bemessen sind, wie Abmessungen eines Flächenabschnitts des Chips;
2. b) Bereitstellen einer Antennenlage, wobei eine Oberfläche der Antennenlage eine Antennenstruktur mit zwei Antennenanschlüssen umfasst, wobei jeder der zwei Antennenanschlüsse angeordnet ist, um jeweils mit einer der zwei Aussparungen der Brückenlage wenigstens teilweise zu fluchten;
3. c) Bereitstellen einer Chiplage, wobei auf einer Oberfläche der Chiplage der Chip befestigt ist, und wobei zwei seitlich über den Chip hinausragende elektrische Leiter vorgesehen sind;
4. d) Schichten der Brückenlage und der Antennenlage, wobei die zwei Antennenanschlüsse der Antennenlage wenigstens teilweise mit den zwei Aussparungen der Brückenlage fluchten;
5. e) Einbringen eines elektrisch leitenden (Kleb-) Stoffs in die Aussparungen der Brückenlage, bis diese wenigstens teilweise mit dem elektrisch leitenden (Kleb-) Stoff aufgefüllt sind;
6. f) Schichten der Chiplage und der Brückenlage, wobei der Chip der Chiplage dem Flächenabschnitt zwischen den zwei Aussparungen der Brückenlage zugewandt und auf diesem positioniert wird.

According to a first aspect, a method of manufacturing the card body with the chip is provided. For this purpose, the method has the following steps:

1. a) providing a bridge layer with two recesses, wherein dimensions of a surface portion between the two recesses are at least as dimensioned as dimensions of a surface portion of the chip;
2. b) providing an antenna layer, wherein a surface of the antenna layer comprises an antenna structure having two antenna terminals, each of the two antenna terminals being arranged to at least partially align with one of the two recesses of the bridge layer;
3. c) providing a chip layer, wherein on a surface of the chip layer, the chip is fixed, and wherein two laterally over the chip protruding electrical conductor are provided;
4. d) layers of the bridge layer and the antenna layer, wherein the two antenna terminals of the antenna layer are at least partially aligned with the two recesses of the bridge layer;
5. e) introducing an electrically conductive (adhesive) substance in the recesses of the bridge layer until they are at least partially filled with the electrically conductive (adhesive) material;
6. f) layers of the chip layer and the bridge layer, wherein the chip of the chip layer facing the surface portion between the two recesses of the bridge layer and is positioned thereon.

This procedure allows the production of a card body with a chip in a few steps, with an electrical connection between the contacts of the chip and the antenna connections is guaranteed.

One of the two electrical conductors of the chip layer can be connected to one of the two antenna connections of the antenna layer via the electrically conductive (adhesive) material located in the two recesses. Such an adhesive may be a metallic paste or an anisotropic conductive anisotropic conductive adhesive.

The two recesses of the bridge layer can be provided as edge-limited recesses in the bridge layer.

In another variant, step a) and step b) can be carried out before step d), step b) and step c) before step f). Step e) may be performed after step b) or after step d) and before step f), or after step f) and before step d).

The dimensions of the surface portion between the two recesses of the bridge layer may be larger than the dimensions of the surface portion of the chip of the chip layer.

The antenna layer and / or the chip layer can be laminated successively or simultaneously to the bridge layer. Preferably, the lamination is done by hot lamination.

The antenna structure of the antenna layer can have a printed, lasered, milled or a wire antenna on the antenna layer.

The antenna structure of the antenna layer can be partially introduced into the substrate in order to provide the smoothest possible surface of the antenna layer. In the cases of the lasered and milled antenna structure, prior to forming the antenna structure, at least at the location of the later antenna structure, the substrate was coated with a conductive coating, e.g. an aluminum coating, and then patterned with a milling cutter or a laser. If an aluminum coating is provided at the location of the later antenna structure, the resulting antenna structure after structuring is an aluminum antenna.

Each of the two antenna terminals may each have a cross-sectional shape corresponding to a cross-sectional shape of the two recesses. Alternatively, the antenna terminals of the wire antenna may have a meandering shape, each of the two meandering antenna terminals each having a cross sectional shape corresponding to the cross sectional shape of the two recesses.

The two recesses of the bridge layer may be considered as passages from one surface to the opposite surface of the bridge layer. The cross-sectional shape of the two recesses of the bridge layer can be defined as a surface that is parallel to the two surfaces of the bridge layer and laterally bounded by orthogonal to the two surfaces edge surfaces of the recesses.

The term "to curse" means that the antenna terminals of the antenna layer are at least partially roofed or recessed by the recesses of the bridge layer or the antenna terminals of the antenna layer at least partially immersed in the recesses of the bridge layer or at least partially roofed, regardless of whether a cross-sectional shape of the recesses equal a cross-sectional shape of the antenna terminals is or not.

The recesses of the bridge layer can be produced by a stamping process, laser process or cutting process. Since the dimensions of the cross-sectional shape can demand the highest precision, a laser for producing the recesses of the bridge layer may be preferred. The dimensions of the cross-sectional shape of the recesses of the bridge layer may correspond to at least one cross-sectional shape of the antenna terminals. Alternatively, the dimensions of the cross-sectional shape of the recesses of the bridge layer may be larger or smaller than the dimensions of the cross-sectional shape of the antenna terminals.

The bridge layer may comprise a material which is suitable for at least partially flowing around under heat supply the chip and / or partially the two electrical conductors of the chip layer, and / or the two antenna connections and / or the antenna structure of the antenna layer and a connection between the antenna layer and to form the chip layer.

The bridge, antenna and / or die layer may comprise one of polyvinyl chloride (PVC), polyethylene terephthalate (PET), glycol modified polyethylene terephthalate (glycol PET) or polycarbonate (PC). Alternatively or optionally, the bridge layer may comprise an insulating material.

The bridge, the antenna and / or the chip layer may have an ID1 format. The antenna layer and / or the chip layer may have a thickness between 100 μm and 300 μm, preferably between 150 μm and 200 μm.

The bridge layer may have a thickness which is equal to the thickness of the antenna or chip layer or between 50 .mu.m and 150 .mu.m, preferably between 50 .mu.m and 100 .mu.m.

Providing the bridge layer may include that the bridge layer is transparent and / or the antenna layer and / or the chip layer are opaque.

The method may include a further step of forming at least one circular or oval inlet into the antenna layer on a surface of the antenna layer opposite the antenna structure and / or the chip layer on a chip surface opposite to the chip, and a further step of introducing at least one security feature into the antenna comprise at least one circular or oval inlet.

The chip of the chip layer can be attached to the surface of the chip layer by means of an adhesive. The two electrical conductors extending laterally beyond the chip may be applied before or after the chip has been attached to the die.

According to a second aspect, an apparatus for manufacturing the card body with the chip is provided. The apparatus includes a first dispensing unit configured to provide a bridge ply as a first ply web, wherein the bridge ply has two recesses and dimensions of a surface portion between the recesses are at least as large as dimensions of a surface portion of the chip. Furthermore, the device comprises a first contacting area for applying an antenna layer with two antenna terminals of a second donation unit to the bridge layer, wherein the two antenna terminals of the antenna layer are at least partially aligned in the two recesses of the bridge layer. An injection unit is designed to introduce an electrically conductive (adhesive) substance into the two recesses of the bridge layer until they are at least partially filled with the electrically conductive (adhesive) material. The device comprises a second contacting region for applying a chip layer to the chip of a third donation unit on the bridge layer, wherein the chip of the chip layer faces the surface portion between the two recesses of the bridge layer and is positioned thereon, wherein a surface on which the chip is mounted, has two laterally projecting beyond the chip electrical conductor, which protrude at least partially into each one of the two recesses of the bridge layer.

The second dispensing unit may be disposed adjacent the first ply sheet and substantially longitudinally to the conveying direction, and / or the third dispensing unit may be disposed adjacent the first ply sheet and substantially longitudinally of the conveying direction.

The first and the second contacting region may be arranged opposite and transverse to the conveying direction of the first layer web, wherein the first layer web is arranged between the first and the second contacting region.

The first contacting region may be used to laminate the bridge layer onto the antenna layer, and / or the second contacting region may be used for Laminating the chip layer may be formed on the bridge layer. Alternatively or additionally, the first and / or the second contacting region may be designed for hot lamination.

The first, second, and / or donor units may be configured to provide the antenna, bridge, and / or die layers in the form of a layer matrix having a predetermined number of rows and columns, with the layers between predetermined breaking points or Have predetermined separation points.

The device may further comprise a separating device which is designed to separate each layer of the provided layer matrices of the first, the second and / or the third dispensing unit at the predetermined breaking points or predetermined breaking points.

The apparatus may further comprise a molding apparatus configured to form at least one circular or oval inlet on a surface opposite the chip surface and / or on a surface opposite the surface of the antenna structure. The apparatus further comprises a marking device configured to mark the circular or oval inlet with a security feature.

According to a third aspect, a card arrangement is provided, which comprises the card body produced by a device according to one of the present variants of the device, wherein additionally on the surface opposite to the chip surface of the chip layer and the surface opposite the surface with the antenna layer each having a transparent Location is appropriate.

According to a fourth aspect, a card body is provided with a chip, wherein the card body is a layer of an antenna and a chip layer with a bridge position between the two cards and the bridge layer has two recesses. The dimensions of a surface portion between the two recesses correspond to dimensions of a surface portion of the chip. A surface of the antenna layer comprises an antenna structure with two antenna terminals, wherein the two antenna terminals are at least partially aligned with the two recesses. On a surface of the chip layer of the chip is fixed, wherein two laterally beyond the chip protruding electrical conductor are provided. The chip of the chip layer faces the surface portion between the two recesses of the bridge layer and positioned thereon. Each one of the two electrical conductors is connected to one of the two antenna terminals via electrically conductive (adhesive) material located in each of the two recesses.

list of figures

• 1 zeigt einen Kartenkörpers mit einem Chip in einer Schnittansicht.
• 2 - 4 zeigen eine schematische Draufsicht verschiedener Lagen, die den Kartenkörper aus 1 bilden.
• 5 - 8 zeigen schematisch Schritte eines Herstellungsverfahrens eines Kartenkörpers mit einem Chip.
• 9 zeigt mögliche Ausführungen der Kontaktierung einzelner Metallkontaktflächen eines Chips.
• 10 zeigt schematisch eine Maschine, in der die in den 1-7 veranschaulichten Schritte ausgeführt werden.

Other objects, features, advantages and applications will become apparent from the following description of some embodiments and associated drawings. All described and / or illustrated features alone or in any combination form the subject matter disclosed herein, also independent of their grouping in the claims or their relationships.

• 1 shows a card body with a chip in a sectional view.
• 2 - 4 show a schematic plan view of different layers that make up the card body 1 form.
• 5 - 8th schematically show steps of a method of manufacturing a card body with a chip.
• 9 shows possible embodiments of contacting individual metal contact surfaces of a chip.
• 10 schematically shows a machine in which the in the 1 - 7 illustrated steps are executed.

Detailed description

In 1 is a multilayer card body 100 more precisely, a three-layer card body 100 with a chip 133 illustrated in a sectional view.

Here are the chip 133 and two laterally from the chip 133 protruding electrical conductors 131 . 132 on a chip 130 appropriate. At the chip 133 it may be, for example, a flip-chip. The two of the chip 133 protruding electrical conductor 131 . 132 may be provided in the form of metallic electrical conductors or conductive adhesive surfaces. The two electrical conductors 131 . 132 Contact the chip on a possible metal contact surface 134 . 135 . 136 (please refer 9 ). The chip situation 130 forms in the in 1 illustrated card body 100 an upper layer.

The two sides of the chip 133 protruding electrical conductor 131 . 132 are arranged such that the two electrical conductors 131 . 132 with two recesses 121 . 122 a bridge position 120 at least partially aligned. The bridge position 120 forms in the in 1 shown card body 100 a middle layer. In this case, a surface section between the two recesses corresponds 121 . 122 Dimensions of a surface portion of the chip 133 , According to the in 1 shown card body 100 can the chip location 130 and the bridge position 120 Simply put together in which the chip 133 is positioned on the surface portion between the two recesses 121, 122. The area between the recesses 121 . 122 may have a smaller thickness than the bridge layer 120 to a height of the chip 133 compensate.

In the two recesses 121 . 122 becomes an electrically conductive (adhesive) substance 123 . 124 introduced until at least partially with the electrically conductive (adhesive) substance 123 . 124 are filled up. The electrically conductive (adhesive) material 123 . 124 serves as an electrical conductor to antenna terminals 111 . 112 an antenna structure of an antenna layer 110 , The two recesses 121 . 122 the bridge position 120 are in the 1 and 3 as margins limited recesses 121 . 122 in the bridge position 120 shown.

A lower layer of the in 1 illustrated card body 100 forms the antenna layer 110 , The antenna position 110 has the antenna structure with the two antenna terminals 111 . 112 where each of the two antenna ports 111 . 112 is arranged, in each case with one of the two recesses 121 . 122 the bridge position 120 at least partially to be aligned. If the antenna position 110 on the bridge position 120 is layered, each one of the antenna terminals 111 . 112 through the electrically conductive (adhesive) material 123 . 124 corresponding to one of the two laterally over the chip 133 protruding electrical conductor 131 . 132 electrically connected.

Like from the 1 is apparent, located between the two antenna terminals 111 . 112 an antenna conductor 113 and two more antenna conductors 114 next to the antenna connection 111 , The antenna structure shown here can be, for example, a printed, lasered or milled antenna structure in which the antenna conductor tracks can not have an outer insulating layer so that the antenna conductor tracks should not overlap. Accordingly, the antenna connection 112 are considered as a first end of the antenna structure, the antenna traces 113 . 114 in a narrowing circular array on the antenna layer 110 are arranged and thus one or more antenna conductors 113 between the antenna connector 112 and the antenna connector 111 and next to the second antenna connector 111 form. Accordingly, the antenna connection 111 be regarded as a second end of the antenna structure (see also 2 ).

Like from the 1 is apparent, are the chip 133 with the two laterally protruding ladders 131 . 132 and the antenna structure with the two antenna terminals 111 . 112 and the antenna traces 113 . 114 on the corresponding surfaces of the chip layer 130 and the antenna layer 110 provided. Optionally, the chip 133 with the two laterally protruding ladders 131 . 132 and the antenna structure with the two antenna terminals 111 . 112 and the antenna traces 113 . 114 in the chip position 130 and the antenna layer 110 be provided so that the chip location 130 and the antenna location 110 a smooth surface on the side on which the chip 130 with the two laterally protruding ladders 131 . 132 or the antenna structure are provided. Optionally, the chip 133 and / or the antenna connections 111 . 112 at least partially from the die 133 and the antenna layer protrude. The bridge position 120 may consist of a material which, under the supply of mechanical pressure or heat, the chip layer 130 and the antenna location 110 flows around. In this case, the bridge position 120 a positive connection with the outstanding elements, such as the chip 133 and / or the antenna conductors 113 . 114 and / or the antenna connections 111 . 112 form. When the bridge position 120 the antenna position 110 and / or the chip layer flows around, the material may condense at the locations of the circumscribed elements so as not to form any unevenness on a surface opposite the circumscribed elements.

Alternatively, additional inlets in the bridge position 120 be provided, wherein the inlets are arranged to communicate with the antenna conductor tracks 113 . 114 and / or the chip 133 to flee.

The antenna position 110 , Bridge position 120 and the chip location 130 are in the 2 to 4 for a better illustration in a plan view. As already for 1 described, the antenna location 110 the antenna conductors 113 . 114 on. It should be noted that in the present embodiment, the antenna tracks 113 . 114 do not overlap or touch. Accordingly, it is expedient that the antenna connection 112 an outer end of the antenna structure and the antenna terminal 111 form an inner end of the antenna structure.

According to the arrangement of the antenna structure on the antenna layer 110 are the recesses 121 . 122 the bridge position 120 , as well as the chip 133 and the two laterally over the chip 133 protruding electrical conductor 131 . 132 arranged. This back reference is also possible, starting from the position of the chip 133 as well as the dimensions of the surface portion of the chip 133 on the chip 130 or the arrangement of the two recesses 121 . 122 the bridge position 120 ,

The antenna structure of the antenna layer 110 can also be provided in the form of a wire antenna. The wire antenna can have an insulation, which is a superimposition of the antenna conductor tracks 113 . 114 allows. Furthermore, this allows both antenna ports 111 . 112 can be arranged within the antenna structure. According to this embodiment, the two recesses 121 . 122 the bridge position 120 , as well as the chip 133 and the two laterally over the chip 133 protruding electrical conductors 131,132 of the chip layer 130 adapted to provide.

2 to 4 shows the map layers in an ID1 format, where the map layers can be provided in any other suitable formats.

The antenna connections 111 . 112 the antenna structure are in 2 shown in a generalized quadrangular shape to a cross-sectional shape of the two antenna terminals 111 . 112 to illustrate. This can be the antenna connections 111 . 112 be formed spiral or meandering to provide an enlarged cross-sectional shape. According to the cross sectional shape of the two antenna terminals 111 . 112 can be smaller, equal or larger dimensions of a cross-sectional shape of the two recesses 121 . 122 to get voted. Alternatively, the antenna connections 111 . 112 present in a straight line, so that a cross-sectional shape of the two recesses 121 . 122 can be chosen correspondingly small.

The cross-sectional shape of the two recesses 121 . 122 the bridge position 120 is there as one to the in 3 shown surface parallel surface passing through edges of the recesses 121 . 122 is limited. Preferably, the cross-sectional shape of the recesses 121 . 122 even, so their dimensions and their orientation do not change. The cross-sectional shape of the antenna connections 111 . 112 is similar to the cross-sectional shape of the two recesses 121 . 122 the bridge position 120 one to the in 2 shown surface of the antenna layer 110 parallel area, which is due to the lateral dimensions of the antenna connections 111 . 112 is limited. The cross-sectional area of the two recesses 121 . 122 the bridge position 120 and the cross-sectional area of the two antenna terminals 111 . 112 the antenna position 110 can be parallel to each other.

The dimensions of a surface section between the two recesses 121 . 122 the bridge position 120 in 3 correspond at least to the dimensions of the surface portion of the chip 133 in 4 , The chip 133 is generally illustrated in a quadrangular form. The shape of the chip 133 however, may also have a rectangular shape with acute angles or rounded corners. There are also other possible forms of the chip possible. Next it is possible to use the chip 133 in different orientations on the chip situation 130 to install. According to the orientation of the chip 133 on the chip 130 The dimensions of the surface section between the two recesses 121 . 122 be provided appropriately. It is also possible to measure the dimensions of the area between the two recesses 121 . 122 large enough to choose so that different sized chips can always be positioned on the surface portion between the two recesses 121, 122 without having different bridge locations 120 with differently adapted dimensions of the surface portion between the two recesses 121 . 122 the bridge position 120 must be provided.

Are the dimensions of the surface section between the two recesses 121 . 122 for example, larger than the dimensions of the surface portion of the chip 133 chosen, then a correspondingly selected length and / or a width of the two laterally over the chip 133 protruding electrical conductors 131,133 are selected that an electrical connection from the chip 133 down to the recesses 121 . 122 comes about.

In the 5 to 8th is a possible variant of a method for producing a card body with a chip illustrated.

According to 5 becomes the provided bridge position 120 on the provided antenna position 110 layered. The two antenna connections are aligned 111 . 112 the antenna position 110 with the two recesses 121 . 122 the bridge position 120 at least partially.

Like in the 5 can be seen, the antenna conductors 113 . 114 the antenna position 110 through the bridge position 120 bathed. This is possible if, as already explained, the bridge position 120 is made of a material that flows around the antenna layer under pressure or heat.

According to the in 6 The step shown becomes the electrically conductive (adhesive) fabric 122 . 123 in the already partially through the antenna connections 111 . 112 the antenna position 110 filled recesses 121, 122 of the bridge position 120 introduced until the two recesses 121 . 122 at least partially filled. The two recesses 121 . 122 the bridge position 120 may alternatively be complete with the electrically conductive (adhesive) material 122 . 123 be filled. Accordingly, by filling the electrically conductive (adhesive) substance 122 . 123 the bridge position 120 be electrically "bridged".

The electrically conductive (adhesive) material may have a certain surface tension, so that, alternatively before the in 5 Step shown the glue in the two recesses 121 . 122 can be introduced. Due to the sufficiently large surface tension, the electrically conductive (adhesive) substance remains in the recesses, regardless of an orientation of the bridge layer 120 to the direction of gravity. Accordingly, the step of introducing the electrically conductive (adhesive) substance into 6 eliminated.

In the in 7 The step shown then becomes the provided die 130 with the chip 133 and the two laterally over the chip 133 protruding electrical conductors 131 . 132 on the bridge position 120 layered. This is the chip location 130 with a surface on which the chip 133 is appropriate, the bridge position 120 facing. The chip 133 is on the surface section between the two recesses 121 . 122 positioned so that the chip 133 not over the area between the two recesses 121 . 122 into the recesses 121 . 122 protrudes.

As already for the flow around the antenna layer 110 through the bridge position 120 explained, the bridge position 120 the chip situation 130 also circulate under pressure or heat.

Be the antenna location 110 and / or the chip layer 130 provided such that the antenna layer 110 and / or the chip layer 130 have a flat surface, then the step of flowing around the antenna layer 110 and the chip location 130 be omitted.

After the chip situation 130 on the bridge position 120 was layered, learns the chip 133 one electrical contact across the two laterally across the chip 133 protruding electrical conductors 131,132, and over in the recesses 121 . 121 located electrically conductive (adhesive) material 123 . 124 to the antenna connections 111 . 112 , It should be noted that the chip 133 not in electrical contact with the one in the two recesses 121 . 122 located (adhesive) fabric 123 . 124 located.

In an intermediate step, the antenna position 110 on the bridge position 120 be laminated, or prefixed by local heat input, in particular in the region of the recesses 121,122, for example by means of a welding station or a Heizstempels. In a further intermediate step, the chip layer 130 on the bridge position 120 be laminated. As an alternative to the two individual intermediate steps of lamination, lamination may be simultaneous on the antenna layer 110 and the chip location 130 on the bridge position 120 take place after the card body 100 by layers of the antenna layer 110 , the bridge situation 120 and the chip location 130 was formed. Preferably, the lamination is done by hot lamination. The step of laminating may also be with the reflow of the antenna layer 110 and the bridge position 130 be combined, since by the lamination pressure and / or heat is applied.

In a further step in 8th be on one of the surface with the chip 133 opposite surface of the chip layer 130 and on one of the surface with the antenna layer 110 each surface opposite a transparent layer 140 . 150 appropriate.

At least one of the transparent layers 140 . 150 At least one security feature 141 exhibit. Optionally or alternatively, those of the surface may be with the chip 133 opposite surface of the chip layer 130 and / or the surface with the antenna layer 110 have opposite surface at least one security feature. The security feature may be a signature strip, color-printed guilloches, micro-fonts, a hologram, a passport photograph or a multiple laser image (MLI).

That in the 5 to 7 The method illustrated merely represents one possible sequence of the method for producing the card body 100 with the chip 133 However, this should not be construed as limiting to exactly this sequence of steps. As can be seen, the step sequences can be varied.

In the in the 5 to 8th The methods shown are the antenna layer 110 , the bridge situation 120 and the chip location 130 already provided. Alternatively, the antenna layer 110 , the bridge situation 120 and the chip location 130 be produced in one or more correspondingly timed production steps.

The antenna structure of the antenna layer 110 can be printed on a substrate, lasered, milled or applied as a wire antenna on the antenna layer. The antenna structure of the antenna layer 110 can be partially introduced into the substrate, as smooth as possible surface of the antenna layer 110 provide. In the cases of the lasered and milled antenna structure, prior to forming the antenna structure, the substrate became at least at the location of the later antenna structure with a conductive coating and then structured with a milling device or a laser.

The recesses 121 . 122 the bridge position 120 can be produced by a stamping process, laser process or mechanical cutting process. Because the dimensions of the cross-sectional shape of the recesses 121 . 122 To demand the highest precision, a laser can be used to make the recesses 121 . 122 the bridge position 120 be preferred. Dimensions of the cross-sectional shape of the recesses 121 . 122 the bridge position 120 can at least dimensions of the cross-sectional shape of the antenna terminals 111 . 112 correspond. Alternatively, the dimensions of the cross-sectional shape of the recesses 121 . 122 the bridge layer 120 may be larger or smaller than the dimensions of the cross-sectional shape of the antenna terminals 111 . 112 ,

The chip 133 the chip situation 130 can with the help of a (glue) fabric on the surface of the chip layer 130 be attached. The two side over the chip 133 protruding electrical conductor 131 . 132 can be installed before or after the chip 133 at the chip location 130 was attached.

The step of applying the transparent layers 140 . 150 can be divided into two different steps. Accordingly, in a first step, the transparent situation 140 on the chip 130 applied and in a second step, which does not have to follow immediately after the first step, the transparent layer 150 on the antenna layer 110 applied. The application of the one or more transparent layers 140 . 150 After various steps, the method for producing the card body 100 with the chip 133 be executed.

In 9 are the three metal contact surfaces 134 . 135 . 136 of the chip 133 in an enlarged section of the chip layer 130 shown, in 9 just for purposes of simplicity, only three metal contact surfaces 134 . 135 . 136 are shown. The chip 133 may include at least one or more metal pads along one side of the chip 133 exhibit.

It is the side over the chip 133 protruding electrical conductors 132 with the metal contact surface 135 connected. Alternatively, the side over the chip 133 protruding electrical conductors 132 with the metal contact surface 134 or 136 be connected.

The recesses 121 . 122 the bridge position 120 may have dimensions of the inner surfaces, each having dimensions of a surface of one of the metal contact surfaces of the chip 133 the chip situation 130 correspond.

As already apparent from the previous description, the two are laterally across the chip 133 protruding electrical conductor 131 . 132 intended. In each case one of the laterally projecting electrical conductors 131 . 133 is electrical with a metal contact surface 134 . 135 . 136 connected. Is it the antenna structure of the antenna layer 110 around a printed, lasered or milled antenna structure, run between the two antenna ports 111 . 112 Antenna conductor tracks 113 , Thus, one of the protruding electrical conductors 131 . 132 on a first side of the chip 133 and another of the protruding electrical conductors 131 . 132 provided on a second side opposite the first side.

Is it the antenna structure of the antenna layer 110 around a wire antenna, so can the two Antennenanschlüsen 111 . 112 lie within the antenna structure or the antenna conductor tracks. According to the in 9 shown embodiment, for example, the side over the chip 133 protruding electrical conductors 132 with the metal contact surface 135 and the side over the chip 133 protruding electrical conductors 131 with the metal contact surface 136 be connected.

10 shows a device 200 for producing the card body 100 with the chip 133 , For this purpose, the device comprises a first, second and third donation unit 210 . 220 . 230 , a first and second contacting region 230 . 260 and an injection unit ( 250 ).

The first donation unit 220 represents a bridge position 120 with two recesses 121 . 122 ready, with the bridge position 120 as a first layer web 221 along a direction of conveyance (see directional arrow) from the donation unit 220 in the direction of a first contacting region 240 is deducted. In this case, dimensions of a surface section between the two recesses correspond 121 . 122 at least dimensions of a surface portion of a chip 133 ,

A second donation unit 210 represents an antenna layer 110 with two antenna connections 111 . 112 ready, with the antenna layer 110 as a second layer web 211 in the direction of the first contacting area 240 is pulled.

The first contact area 240 is formed, the antenna position 110 on the bridge position 120 apply, with the two antenna connections 111 . 112 the antenna position 110 each in one of the two recesses 121 . 122 the bridge position are aligned. The first contacting area is in the 10 represented as a double roller, wherein the bridge layer 120 and the antenna location 110 be pulled between the two rolls of the double roll and applied to each other by the mechanical pressure. Alternatively, it may be in the first contacting area 240 to act a simple roller, wherein the simple roller opposite a counterpart is provided, so from the roller to the bridge and antenna position 120 . 110 a pressure can be applied. In a variant, it may be in the first contact area 240 to act around a welding station or a heating stamp, around the antenna location 110 and the bridge position 120 connect in places and thus pre-fix each other.

After passing through the first contacting area 240 form the antenna layer 110 and the bridge position 120 already a composite, which further in the direction of a second contacting area 260 is pulled. The injection unit 250 then brings an electrically conductive (adhesive) substance in the two recesses 121 . 122 the bridge position 120 until they are at least partially filled with the electrically conductive (adhesive) substance.

A third donation unit 230 puts a chip layer 110 with the chip 133 ready, with the chip location 130 as a third layer track 231 in the direction of the second contacting region 260 is pulled. The chip situation 110 further points two laterally over the chip 133 protruding electrical conductors 131 . 132 on.

The second contacting area 260 is trained to the chip location 130 on the bridge position 120 applied. In this case, the second contacting area 260 in 10 also a double roller like the first contacting area 240 , Alternatively, the second contacting region may be a simple roller. When applying the chip layer 130 on the bridge position 120 becomes the chip 133 the surface portion between the two recesses 121 . 122 the bridge position 120 facing and positioned on this. Next, the two laterally protrude over deb chip 133 protruding ladder 131 . 132 each at least partially in one of the two recesses 121 . 122 , so that an electrical contact between one of the electrical conductors 131 . 132 and an antenna connection 111 . 112 arises over the electrically conductive (adhesive) substance.

Alternatively to the in 10 In the embodiment shown, the second layer web 211 the second donation unit 210 to the first layer railway 221 the first donation unit 220 adjacent and substantially in the longitudinal direction to the conveying direction of the first layer web 221 be arranged. Alternatively or additionally, the third layer web 231 the third donation unit 230 to the first layer railway 221 the first donation unit 220 adjacent and substantially in the longitudinal direction to the conveying direction of the first layer web 221 be arranged.

The first and the second contacting area 240 . 260 can be arranged opposite and transverse to the conveying direction. It is advantageous if the first and the second contacting area 240 . 260 simple roller so that they serve as a counterpart to the applied pressure on the layers.

The first and / or the second contacting area 240 . 260 may be formed for lamination, preferably for hot lamination.

The first, the second and / or the third donation unit 210 . 220 . 230 For example, the sheets may provide in the form of a sheet matrix having a predetermined number of rows and columns, with predetermined breaking points or predetermined breaking points between each sheet. For this purpose, the device may further comprise a separating device (not shown), which is designed to separate the layers at the predetermined breaking points or predetermined breaking points. In this case, the separation device, the layers already after donations by the first, the second and the third donation unit 210 . 220 . 230 and before application to the first contacting region, before the second contacting region, or after the second contacting region.

In addition, the apparatus may include a molding apparatus (not shown) configured to have at least one circular or oval inlet 141 on one of the surface with the chip 133 opposite surface of the chip layer 130 and / or on a surface opposite the antenna structure. The circular or oval inlet 141 can serve to introduce a security feature. For this, the device may further comprise a marking device, which is formed, the circular or oval inlet 141 to mark with a security feature.

The foregoing variations of the method and apparatus described are merely for the better understanding of the structure, operation, and characteristics of the solution presented; they do not restrict the revelation to the exemplary embodiments. The figures are schematic, essential features and effects being shown, in part, clearly enlarged, in order to clarify the functions, operating principles, technical configurations and features. In this case, each mode of operation, every principle, every technical embodiment and every feature which is / are disclosed in the figures or in the text can be associated with all claims, every feature in the text and in the other Figs., other functions, principles, technical features and features contained in or arising from this disclosure are combined freely and arbitrarily so that all conceivable combinations are attributed to the described solution. Combinations between all individual versions in the text, ie in each section of the description, in the claims and also combinations between different variants in the text, in the claims and in the figures are included.

The above-explained device and method details are indeed shown in context; It should be noted, however, that they are independent of each other and can also be freely combined with each other. The ratios of the individual parts and sections thereof to one another and their dimensions and proportions shown in the figures are not to be understood as limiting. Rather, individual dimensions and proportions may differ from those shown.

Also, the claims do not limit the disclosure and thus the combination options of all identified features with each other. All features shown are also explicitly disclosed herein and in combination with all other features.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 10324043 B4 [0005]
• DE 102005058101 A1 [0006]

Cited non-patent literature

• ISO / IEC7813 [0001]
• ISO / IEC 7811 [0001]
• ISO / IEC 14443 [0001]
• ISO / IEC 7810: 2003 [0001]
• ID-000, "Mirco-SIM" see ETSI TS 102 221 V9.0.0 = "Mini-UICC" [0001]
• "Nano-SIM" see ETSI TS 102 221, TS 102 221 V11.0.0 [0001]
• "Embedded SIM" see JEDEC Guide 4.8 [0001]

Claims (21)

A method of manufacturing a card body (100) with a chip (133), the method comprising the steps of: a) providing a bridge layer (120) with two recesses (121, 122), wherein dimensions of a surface portion between the two recesses are at least as dimensioned as dimensions of a surface portion of the chip; b) providing an antenna layer (110), wherein a surface of the antenna layer comprises an antenna structure having two antenna terminals (111, 112), each of the two antenna terminals arranged to at least partially align with one of the two recesses of the bridge layer; c) providing a chip layer (130), wherein on a surface of the chip layer, the chip is fixed, and wherein two laterally beyond the chip protruding electrical conductors (131, 132) are provided; d) layers of the bridge layer and the antenna layer, wherein the two antenna terminals of the antenna layer are at least partially aligned with the two recesses of the bridge layer; e) introducing an electrically conductive (adhesive) substance (123, 124) in the recesses of the bridge layer, until they are at least partially filled with the electrically conductive (adhesive) material; f) layers of the chip layer and the bridge layer, wherein the chip of the chip layer facing the surface portion between the two recesses of the bridge layer and is positioned thereon. Method according to Claim 1 wherein each one of the two electrical conductors of the chip layer is connected via the located in the two recesses electrically conductive (adhesive) material with one of the two antenna terminals of the antenna layer. Method according to Claim 1 or 2 wherein step a) and step b) are carried out before step d), step b) and step c) before step f), and step e) after step b), or after Step d) and before step f), or after step f) and before step d). Method according to one of the preceding claims, wherein the dimensions of the surface portion between the two recesses of the bridge layer are greater than the dimensions of the surface portion of the chip of the chip layer. Method according to one of the preceding claims, wherein the antenna structure of the antenna layer has a printed, lasered, milled or a wire antenna on or at least partially on the antenna layer. A method according to any of the preceding claims, wherein each of the two antenna terminals each has a cross sectional shape corresponding to a cross sectional shape of the two recesses, or the antenna terminals of the wire antenna have a meandering shape, each of the two meandering antenna terminals each having a cross sectional shape corresponding to the cross sectional shape of two recesses corresponds. Method according to one of the preceding claims, wherein the bridge layer comprises a material which is suitable for at least partially enclosing the chip and / or in part the two electrical conductors of the chip layer, and / or the two antenna connections and / or the antenna structure of the antenna layer Form connection between the antenna layer and the chip layer. Method according to one of the preceding claims, wherein the bridge, antenna and / or chip layer of at least one of polyvinyl chloride (PVC), polyethylene terephthalate (PET), glycol modified polyethylene terephthalate (glycol PET) or polycarbonate (PC) and / or the bridge layer having insulating material. Method according to one of the preceding claims, wherein the bridge, the antenna and / or the chip layer have the ID1 format, and / or the antenna layer and / or the chip layer has a thickness between 100 .mu.m and 300 .mu.m, preferably between 150 .mu.m and 200 microns have. Method according to one of the preceding claims, wherein the bridge layer has a thickness which is equal to the thickness of the antenna or chip layer or between 50 .mu.m and 150 .mu.m, preferably between 50 .mu.m and 100 .mu.m. Method according to one of the preceding claims, wherein the provision of the bridge layer comprises that the bridge layer is transparent, and / or the provision of the antenna layer and / or the chip layer comprises that the antenna layer and / or the chip layer are opaque. Method according to one of the preceding claims, comprising the further step of forming at least one circular or oval inlet (141) in the antenna layer on a surface of the antenna layer opposite the antenna structure and / or the chip layer on a chip surface opposite to the chip, and with the further step of introducing at least one security feature into the at least one circular or oval inlet. Apparatus for manufacturing a card body (100) having a chip (133) with a first dispensing unit (220) for providing a bridge layer (120) as a first layer web (221), the bridge layer having two recesses (121, 122), wherein dimensions of a surface portion between the two recesses are at least as dimensioned as dimensions of a surface portion of the chip, a first contacting portion (240) for applying an antenna layer (110) with two antenna terminals (111, 112) of a second dispensing unit (210) the bridge layer, wherein the two antenna terminals of the antenna layer are at least partially aligned in the two recesses of the bridge layer, an injection unit (250) for introducing an electrically conductive (adhesive) material (123, 124) into the two recesses of the bridge layer until at least partially are filled with the electrically conductive (adhesive) substance, a second contacting region (260) for applying a Chip layer (130) having the chip of a third donor unit (230) on the bridge layer, wherein the chip of the chip layer faces the surface portion between the two recesses of the bridge layer and is positioned thereon, wherein a surface on which the chip is mounted, two laterally beyond the chip protruding electrical conductor (131, 132), which protrude at least partially into each one of the two recesses of the bridge position. Device after Claim 13 wherein the second dispensing unit is disposed adjacent to the first ply sheet and substantially longitudinally of the conveying direction, and / or wherein the third dispensing unit is disposed adjacent to the first ply sheet and substantially longitudinally of the conveying direction. Device after Claim 13 or 14 wherein the first and second contacting regions are disposed opposite and transverse to the conveying direction of the first layer web, the first layer web being disposed between the first and second contacting regions. Device according to one of Claims 13 to 15 wherein the first contacting region is formed for laminating the bridge layer on the antenna layer, and / or wherein the second contacting region is formed for laminating the chip layer on the bridge layer, and / or wherein the first and / or the second contacting region are preferably formed for hot lamination. Device according to one of Claims 13 to 16 wherein the first, second and / or third dispensing units are configured to provide the antenna, bridge and / or die layers in the form of a layered matrix having a predetermined number of rows and columns, the layer having predetermined breaking points therebetween or have predetermined separation points. Device after Claim 17 , further comprising a separating device, which is designed to separate each layer of the provided layer matrices of the first, the second and / or the third dispensing unit at the predetermined breaking points or the predetermined separating points. Device according to one of Claims 13 to 18 , further comprising a molding apparatus, configured to form at least one circular or oval inlet (141) on a surface opposite the chip surface and / or on a surface opposite the surface with the antenna structure, and a marking device, designed to mark the circular or oval inlet with a security feature. A card assembly comprising the card body (100) made by a device according to any one of Claims 13 to 19 , wherein in each case a transparent layer (140, 150) is in each case attached to the surface opposite to the surface of the chip layer and the surface opposite the surface with the antenna layer. Card body (100) with a chip (130) wherein the card body is a layer of an antenna (110) and a chip layer (130) with a bridge layer (120) between the two layers, wherein the bridge layer has two recesses (121, 122 wherein the dimensions of a surface portion between the two recesses correspond to dimensions of a surface portion of the chip, wherein one surface of the antenna layer comprises an antenna structure having two antenna terminals (111, 112), each of the two antenna terminals being at least partially aligned with one of the two recesses, wherein the chip is mounted on a surface of the chip layer, wherein two laterally over the chip protruding electrical conductor (131, 132) are provided, wherein the chip of the chip layer facing the surface portion between the two recesses of the bridge layer and is positioned thereon each one of the two electrical conductors in each of the two A electrical savings conductive (adhesive) material (123, 124) is connected to one of the two antenna terminals.

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