DE102014208958A1 - Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component - Google Patents

Abstract

The invention relates to a surface-mountable optoelectronic component having a mounting surface arranged on an electrically insulating structural element and a radiation surface of an optoelectronic chip arranged perpendicular to the mounting surface. The structural member has a recess that completely penetrates the structural member in a direction perpendicular to the mounting surface. In the recess of the chip is arranged. At least one side surface of the chip arranged perpendicular to the mounting surface is mechanically connected to a side surface of the recess arranged perpendicular to the mounting surface. On the structural element, a first and a second electrically conductive region are arranged, which are electrically isolated from each other. The first and second electrically conductive region are respectively arranged on the mounting surface and disposed perpendicular to the mounting surface and adjacent to the mounting surface contact surfaces and wherein the arranged on the mounting surface part of the electrically conductive regions connecting contacts for electrical and mechanical contacting of a circuit substrate forms and to the Contact surfaces arranged part electrically conductive areas contact the optoelectronic chips electrically.

Description

The subject matter described here relates to a surface-mountable optoelectronic component with a laterally arranged radiation surface. Furthermore, a method for producing a surface-mountable optoelectronic component with a laterally arranged radiation surface is described.

Optoelectronic components, such as light emitting diodes (LED), with laterally arranged radiation surfaces can be referred to as Sidelooker. These components can be mounted with their base on a circuit carrier, wherein the component generated by the device or to be detected by the device electromagnetic radiation is emitted or recorded on a perpendicular to the base surface arranged radiation surface.

Such components may be provided, for example, for backlighting a display, for example a screen of a mobile telephone. The sidelooker are arranged with their radiation surface on the side surfaces of a light distribution plate. The light distribution plate in turn is arranged behind the liquid crystal display. The light generated by the LEDs is coupled into the light distribution plate at the edges of the light distribution plate. The light distribution plate has coupling-out structures, with which the coupled-in light is uniformly coupled out and emitted in the direction of the liquid-crystal display. The light penetrating the liquid crystal display can be perceived by a viewer of the display.

With regard to the miniaturization of mobile terminals, the requirement is to provide the most compact possible components in order to reduce the thickness of the display. In particular, the height of the component is a relevant criterion. Previously used components, such as the Micro SIDELED from OSRAM Opto Semiconductors, for example, have a height of about 0.65 mm. It is therefore the object to provide an optoelectronic component with low height. Since the size and size of the components make it increasingly difficult to manufacture and process the components, there is also the task of providing a method for producing the optoelectronic components.

Suggested solution

To achieve the object, a surface-mountable optoelectronic component having a mounting surface arranged on an electrically insulating structural element and a radiation surface of an optoelectronic chip arranged perpendicular to the mounting surface is proposed. The structural member has a recess that completely penetrates the structural member in a direction perpendicular to the mounting surface. In the recess of the structural element of the optoelectronic chip is arranged. At least one side surface of the optoelectronic chip arranged perpendicular to the mounting surface is mechanically connected to a side surface of the recess arranged perpendicular to the mounting surface. On the electrically insulating structural element, a first and a second electrically conductive region are arranged, which are electrically isolated from each other. The first and second electrically conductive regions are respectively arranged on the mounting surface and on a contact surface arranged perpendicular to the mounting surface and adjacent to the mounting surface, wherein the part of the first and second electrically conductive regions arranged on the mounting surface forms connection contacts for the electrical and mechanical contacting of a circuit carrier and the part of the first and second electrically conductive regions arranged on the contact surfaces are provided for electrically contacting the optoelectronic chip.

The simple structure allows low height components to be provided. The arranged on the structural member electrically conductive regions allow a compact electrical contacting of the optoelectronic chip. Since the electrical contacting takes place through the electrically conductive regions, a component without vias or plated-through holes can be provided. By arranging the chip in the recess, the structural element can be designed in such a way that the electrical and mechanical functions provided by the structural element do not contribute to the height of the component. In simple terms, the structural elements and the recess are designed such that the chip is arranged next to the structural element. The component is suitable for different chip types. For example, if the device has a light emitting chip, a sapphire chip, a sapphire flip chip, or a thin film chip may be provided as the chip. Further, chips may be provided with two backside contacts, two topside contacts, or one top and one backside contact.

Furthermore, a method for producing a surface-mountable optoelectronic component is proposed for achieving the object. The method comprises providing a structural element carrier having a plurality of mechanically interconnected, electrically insulating structural elements, wherein the structural elements are arranged in rows and / or in columns and in each case at least one of the structural elements is complete have penetrating recess. Furthermore, the method comprises applying electrically conductive regions on at least two mutually perpendicular and mutually adjacent side surfaces of the structural elements; providing a plurality of optoelectronic chips; introducing the optoelectronic chips into the recesses of the structural elements; mechanically connecting the plurality of optoelectronic chips to the structure elements; and dividing the structural element carrier.

The common structural element carrier simplifies the production of the components, since instead of a plurality of individual structural elements, only one common structural element carrier has to be handled. In addition, the structural element carrier allows some of the process steps to be performed in parallel for a plurality of devices. For example, the electrically conductive regions may be simultaneously applied to a plurality of structural elements by a coating process. Further, the mechanical bonding of the chips to the features may be performed in parallel for a plurality of devices. The components can be produced without photographic technology. This simplifies the manufacture of the components.

Further embodiments

As material for the structural element ceramic may be provided. Furthermore, plastic can be provided as the material for the structural element. For example, a material whose coefficient of thermal expansion corresponds approximately to the thermal expansion coefficient of the chip may be used. Furthermore, a material can be used which has a high reflectivity for the electromagnetic radiation emitted or absorbed by the chip.

The proposed structure enables the provision of low-height devices. Thus, the height of the structural element can correspond approximately to the height of the optoelectronic chip. Furthermore, the total height of the surface-mountable optoelectronic component can be at most twice as large as the height of the optoelectronic chip. For example, devices may be provided in which the optoelectronic chip has a height of about 200 microns and the device has an overall height of 300 microns. It can thus be provided components whose total height corresponds to a maximum of 1.5 times the height of the chip. In some embodiments, devices may be provided in which the overall height of the device is approximately equal to the height of the radiating surface of the optoelectronic chip.

A reflector layer may be arranged on the mounting surface of the structural element and / or on an upper side of the structural element opposite the mounting surface. Through the reflector layer, the efficiency of the device can be increased. The reflector layer may be part of a film applied to the structural element. Furthermore, the reflector layer may be a reflective potting compound.

In the beam path of the chip, a film may be arranged parallel to the radiation surface, wherein a phosphor is applied to the film. In further embodiments, a phosphor can be applied directly to the radiation surface of the optoelectronic chip. For example, a phosphor embedded in potting compound may be filled in a cavity formed by films and the structural member. For the filling of the phosphor into the cavity formed by the foils and the structural element, dispensing may be provided, for example. Furthermore, the phosphor can also be sprayed onto the radiation surface of the chip.

The first and second electrically conductive region can be superficially applied to the structural element. For example, structures which have been applied to the structural element by means of a coating process can be referred to as superficially applied. For example, the first and second electrically conductive regions may be layers that have been applied to the structural element. The layer thickness can be less than 10 microns. In further embodiments, the layer thickness may be 2 microns.

The structural element can surround the optoelectronic chip at three side surfaces arranged perpendicular to the mounting surface. Accordingly, the structural element may be substantially U-shaped. For example, a function of the two legs of the U-shaped structural element may be to provide sufficient area for a mechanical and electrically conductive connection between the device and a circuit carrier. For example, one function of the crosspiece of the U-shaped structural element may be to mechanically interconnect the two legs of the structural element.

In a further embodiment, at least two components can be combined to form a multiple component. The individual components of a multiple component can be connected to one another mechanically and electrically conductively via an electrically conductive foil. The electrically conductive foil may be an example of a circuit carrier. The individual components of the multiple component can be arranged in an electrical series circuit.

The electrically conductive foil may be arranged on the mounting surface and / or the upper side of the structural element. The electrically conductive foil may have a reflector layer. Furthermore, films arranged on the mounting surface and on the upper side can project beyond the radiation surface and form a cavity together with the structural element. In this case, at least one of the films may be an electrically conductive film. In the cavity, a phosphor can be introduced. As an alternative or in addition to at least two components mechanically and / or electrically interconnected via a foil, at least two structural elements of a multiple component can be mechanically connected to one another. The interconnected structural elements may be integrally formed. The mechanically interconnected structural elements can connect the optoelectronic chips of the multiple component electrically conductive. For example, a first electrically conductive region and a second electrically conductive region may form a common electrically conductive region. Due to the larger dimensions, a multiple device can be processed more easily compared to a single device, for example.

In a further embodiment, the component or the multiple component may be part of a backlight device. The backlighting device may be configured to illuminate the background of a liquid crystal display of a display screen. The backlighting device may comprise a light distribution plate, wherein the component or the multiple component may be arranged on at least one side surface of the light distribution plate that is perpendicular to a light outcoupling surface of the light distribution plate.

In a further embodiment, the components can be connected only mechanically to one another via a film arranged on the mounting surface and / or the upper side. Only mechanically connected to one another can mean that there is no electrically conductive connection between the components. The mechanically interconnected components can then be separated from each other immediately prior to application to a circuit carrier. The foil may have a reflector layer. The interconnected by the film components can be easily handled, transported and processed.

The electrically conductive regions can be applied in a structured manner to the structural element carrier. The structured application of the electrically conductive regions can be carried out, for example, by a coating method. For example, a shadow mask may be provided for the structured application.

For the splitting of the structural element carrier, a material removal along a first trench can be provided. The removal of material along the first trench can also be referred to as row division in a simplified manner below. The series division may be provided for a structural element carrier in which the structural elements are arranged in rows and columns. With the row splitting, a structural element carrier can be provided which has only a single row of structural elements.

For the splitting of the structural element carrier, a material removal between two structural elements arranged in a row can furthermore be provided. This material removal can also be referred to as column division below. The column division may be provided after the row division. For example, with spade partitioning, a structural element support having a single row of structural elements may be divided into individual structural elements or into groups having at least two structural elements.

The structural elements can be applied to a film after dividing the structural element carrier. Furthermore, a structural element support having a single row of structural elements may also be applied without prior partitioning to the foil. The film may be provided to mechanically bond a plurality of structural elements together. The film with the applied components can be wound up on a roll. The wound on a roll film may be provided as a transport packaging.

Furthermore, a film with a plurality of components can be divided into individual components or in groups with at least two components. For dividing the film and the mechanically interconnected via the film components can be provided for example laser cutting or cutting.

Brief description of the figures

Exemplary embodiments will be explained in more detail below with reference to the figures. The same reference numerals are used for similar or equivalent elements or properties in all figures. The figures are not to scale.

Show it:

1a a schematic plan view of a first surface mountable optoelectronic device;

1b a schematic side view of the in 1a illustrated component;

1c a schematic sectional view of a second surface mountable optoelectronic device;

1d a schematic sectional view of a third surface mountable optoelectronic device;

1e a schematic sectional view of a fourth surface mountable optoelectronic device;

2a a schematic plan view of a fifth surface mountable optoelectronic device;

2 B a schematic sectional view of the in 2a illustrated component;

3a a schematic plan view of a structural element carrier;

3b a schematic side view of the in 3a illustrated Strukturelementträgers;

4a - 4e schematic representations between individual processing steps;

5 a schematic representation of a first multiple component;

6 a schematic representation of a second multiple component.

Detailed description of embodiments

The term "optoelectronic component" may, for example, comprise components that are configured to emit electromagnetic radiation and / or to detect electromagnetic radiation. The proposed solution is explained below using the example of a light-emitting diode (LED), wherein the features explained for one LED can also be provided in other optoelectronic components.

In 1a is a surface mount optoelectronic device 10 shown schematically. The 1a is a plan view of a mounting surface of the surface mountable optoelectronic device 10 , The 1b is a schematic plan view of the radiation surface 20 of the component 10 , As a surface mountable component 10 are referred to components which are suitable for surface mounting on a circuit carrier, such as a printed circuit board. This component form can also be referred to as SMD (Surface Mounted Device). In surface mounting, the components are placed with a mounting surface on the circuit board. The components are then connected by gluing or soldering, for example reflow soldering or with an electrically conductive adhesive, mechanically and electrically conductive to the circuit carrier.

That in the 1a and 1b illustrated component 10 comprises a structural element 12 and an opto-electronic chip 16 , The illustrated optoelectronic chip 16 has approximately the shape of a cuboid. The chip 16 is in a recess of the structural element 12 arranged. The illustrated structural element 12 borders on three side surfaces of the chip 16 at. The recess penetrates the structural element 12 in the vertical direction - ie in the representation of 1a perpendicular to the drawing plane - complete. The recess is not on one side by the structural element 12 limited. This page can also be referred to below as the open side of the recess. Thus, the first structural element surrounds 12 the chip 16 essentially U-shaped. The shape of the recess is the shape of the male optoelectronic chip 16 customized. For example, a thin-film chip with two top-side contacts may be provided for the illustrated embodiment.

The chip 16 points to a side surface, so one perpendicular to the mounting surface 18 arranged surface a radiation surface 20 on. The radiation surface 20 In the illustrated example of the LED, the electromagnetic radiation generated by the chip is provided from the chip 16 decouple. The layer sequence of the chip provided for the generation of radiation 16 is parallel to the radiation surface 20 arranged. The radiation surface 20 is arranged on the open side of the recess. As the radiation surface 20 in the device 10 perpendicular to the mounting surface 18 is arranged, that of the component 10 emitted light emitted laterally. This design can be called Sidelooker. Sidelooker can be provided, for example, to couple light laterally in a light distribution plate.

In the illustrated device 10 is the chip 16 on three sides of the structural element 12 Surrounded in a U-shape. A first to the radiation surface 20 adjacent side surface of the chip 16 is located on a first side surface of the structural element arranged in the recess 12 at. A second to the radiation surface 20 adjacent side surface of the chip 16 is located on a second arranged in the recess side surface of the structural element 12 at. One of the radiation surface 20 opposite back of the chip 16 is due to a third Side surface of the structure element 12 at. The chip 16 is mechanical with the structural element 12 connected. For the mechanical connection is between at least one side surface of the chip 16 and at least one of the side surfaces of the structural element disposed in the recess, a connecting means 21 intended. As connecting means 21 For example, adhesive, electrically conductive adhesive or solder may be provided.

The structural element 12 is formed of an electrically insulating material such as plastic or ceramic. As a plastic, for example, polybutylene terephthalate (PBT) or polycarbonate (PC) may be provided. As a ceramic, for example Al ₂ O ₃ may be provided. Furthermore, a machinable glass ceramic can be provided. Further, the material of the structural element may be chosen to be that of the chip 16 emitted radiation has a high reflectivity. For example, materials that appear white to a viewer may be used.

On the electrically insulating structural element 12 are a first electrically conductive area 22 and a second electrically conductive region 23 arranged. The first and second electrically conductive area 22 . 23 are superficial on the structural element 12 applied. The superficial application of the electrically conductive regions can be effected by a coating method. For example, a physical vapor deposition method such as sputter deposition or thermal evaporation or a chemical vapor deposition method such as plasma enhanced chemical vapor deposition may be provided. Furthermore, thermal spraying or electroplating may be provided. The coating can also be applied in two stages. For example, in a first step, for example by sputter deposition, a seed layer may be applied. In a second step, the layer thickness can be increased, for example, by electroplating. In particular for plastic molded structural elements 12 can the structural element 12 and the electrically conductive areas 22 . 23 also be produced with a manufacturing method for injection-molded circuit carriers (Molded interconnect devices). As materials for the electrically conductive areas 22 . 23 For example, gold, silver, copper, nickel, titanium and / or an alloy containing these materials may be provided.

The electrically conductive areas 22 . 23 In each case layers can be, which with substantially constant layer thicknesses the underlying contours of the structural element 12 cover. The electrically conductive regions may have one or more layers arranged one above the other. If superimposed layers are provided, these layers can have different materials. By way of a plurality of layers of different materials arranged one above another, for example, the adhesion of the electrically conductive material to the structural element 12 be improved. Furthermore, the quality of the electrical and mechanical connections between the structural element 12 and a circuit carrier and / or between the structure element 12 and the chip 16 be improved. For example, the electrically conductive regions may comprise a titanium layer, a platinum layer, a nickel layer, a copper layer and / or a gold layer. The layer thicknesses may be, for example, 100 nm for the titanium layer, 100 nm for the platinum layer and 100 nm for the gold layer. The layer thicknesses for the copper and nickel layer can be 1-2 μm. The thickness of the electrically conductive region may generally be less than 10 μm.

The first and second electrically conductive area 22 . 23 are electrically isolated from each other. For example, the first and second electrically conductive regions 22 . 23 such on the structural element 12 be arranged so that they do not touch or overlap. Furthermore, the first and second electrically conductive region 22 . 23 be arranged on the structural element that they with a single coating step on the structural element 12 can be applied.

The first and second electrically conductive regions 22 . 23 are on two, substantially perpendicular surfaces of the structural element 12 arranged. In addition, the electrically conductive areas cover 22 . 23 the edge, which is located between the mutually perpendicular surfaces. In the illustrated embodiment, the electrically conductive regions cover 22 . 23 a part of the mounting surface 18 , as well as next to the radiation surface 20 arranged bonding surfaces 32 . 36 , The perpendicular to the mounting surface 18 arranged surfaces of the electrically conductive regions 22 . 23 may be referred to generally below as contact surfaces. Additionally or alternatively, as a contact surfaces, two separate surfaces may be provided on the third side surface of the recess. Furthermore, the first and the second electrically conductive region 22 . 23 also arranged in the recess first and second side surface of the structural element 12 and / or an end face 38 of the structure element 12 cover. The contact surfaces are for electrical contacting of the chip 16 intended. The electrical contacting of the chip 16 can be done for example by solder joints, electrically conductive adhesive bonds and / or bonding wire connections.

The perpendicular to the mounting surface 18 arranged contact surfaces are in 1b shown. The edge of the structure element 12 between the mounting surface 18 and the contact surfaces may be rounded or bevelled. For example, a rounded or bevelled edge can improve the quality of the edge coverage. The on the mounting surface 18 arranged portions of the first and second electrically conductive region 22 . 23 form a first and a second connection contact 24 . 26 , The first and second connection contact 24 . 26 are for surface mounting of the device 10 intended. The connection contacts 22 . 23 are suitable to be connected by soldering or gluing, mechanically and electrically conductive to a circuit carrier.

In the in the 1a and 1b illustrated embodiment are for electrical contacting of the chip 16 at least two bonding wires 28 intended. It connects a first bonding wire 28 one on the radiation surface 20 of the chip 16 arranged first bonding pad 30 with the on the structural element 12 arranged first bonding surface 32 , A second bonding wire 28 connects a second on the radiation surface 20 of the chip 16 arranged bondpad 34 with the on the structural element 12 arranged second bonding surface 36 , The first and second bonding surfaces 32 . 36 and the radiation surface 20 are compared to the substantially parallel to the radiating surface 20 of the chip 16 arranged face 38 of the component 10 placed back. Due to the recessed arrangement of the bonding surfaces 32 . 36 the bonding wires protrude 28 not over the face 38 out.

On the radiation surface 20 can be a fluorescent 40 be upset. In the representations of the 1a and 1b is the phosphor 40 hatched shown. The phosphor 40 is meant to be that of the chip 16 at least partially converting radiation emitted in a first wavelength range into radiation having a second wavelength range, such that an observer perceives the emitted radiation as "white" light, for example. The bonding wires 28 can at least partially into the phosphor 40 be embedded. The phosphor 40 may for example have a thickness of 20 microns.

The 1c is a schematic sectional view through a second component 42 , The second component 42 is a variant of in conjunction with the 1a and 1b shown first component 10 , The second component 42 differs from the first component by one on an upper side 44 of the component 42 arranged first slide 46 , Furthermore, the in 1c illustrated second component stages 47 on.

The top 44 of the component is opposite to the mounting surface. The first slide 46 has several layers. At the in 1b illustrated embodiment includes the first film 46 an adhesive layer 48 , an insulation layer 49 and a reflector layer 50 , The insulation layer 49 is between the adhesive layer 48 and the reflector layer 50 arranged. The insulation layer 49 is not electrically conductive. In addition to the electrical insulation, the insulation layer 49 also for mechanical stabilization of the first film 46 be provided. As material for the insulation layer 49 For example, polyimides or polymethylmethacrylates may be provided. The reflector layer 50 is made of a material that for the chip 16 emitted electromagnetic radiation has a high reflectance. As material for the reflector layer 50 For example, silver or aluminum may be provided. The reflector layer 50 for example, on the insulation layer 49 be applied by means of a coating. Furthermore, over the reflector layer 50 still further layers such as a second insulating layer may be arranged. The first slide 46 For example, it may have a thickness of less than 50 μm.

The first slide 46 is with the adhesive layer 48 on the top 44 of the structure element 12 attached. In addition to the reflective properties, the first film 46 mechanically stabilize the device. The first slide 46 can be up to the face 38 of the device. The first slide 46 may be in the area of the recess over the recessed bonding surfaces 32 . 36 and the chip 16 survive. The protruding section of the first slide 46 In addition to mechanical stabilization and reflection of radiation, it can further limit the introduction of the phosphor 40 be provided.

On the structural element 12 of the second component 42 are stages 47 arranged. The steps 47 may be provided, for example, to adjust the height of the device to a desired height can. At the in 1c illustrated component 42 is on the top of a protruding step 47a and on the mounting surface 18 a recessed level 47b arranged. The arrangement of 1c is exemplary. In further embodiments, for example, only one stage, two protruding stages or two recessed stages may be provided. The steps 47 can, for example, when separating the structural elements 12 be generated.

The 1d is a schematic sectional view through a third component 52 , The third component 52 is a variant of in conjunction with the 1a and 1b shown first component 10 , The third component 52 differs from the first component 10 thereby, that on the top 44 a first slide 46 and on the mounting surface 18 a second slide 66 is arranged. The second slide 66 can essentially be the first slide 46 correspond. The second slide 66 already has one in connection with 1c said second insulation layer 51 on. The second insulation layer 51 corresponds to the first insulation layer 49 , The second insulation layer 49 is on the reflector layer 50 arranged.

The first and second slide 46 . 66 are in the area of the recess on the recessed bonding surfaces 32 . 36 and the chip 16 above. On the second slide 66 are openings for those on the mounting surface 18 arranged first and second terminal contact 24 . 26 intended. The protruding first and second slides 46 . 66 form together with the structural element 12 a cavity, the radiation surface 20 and the bonding surfaces 32 . 36 form the bottom of the cavity. In this cavity, for example, a phosphor particles having potting compound 40 be filled.

The 1e is a schematic sectional view through a fourth component 54 , The fourth component 54 is a variant of in conjunction with the 1a and 1b shown first component 10 , The fourth component 54 differs from the first component 10 in that at the top 44 and / or the mounting surface 18 a reflective potting compound 56 is arranged. The reflective potting compound 56 For example, it may be a titanium dioxide particle filled silicone resin. The reflective potting compound 56 can form a reflector layer. At the mounting surface 18 of the fourth component 54 are the connection contacts 24 . 26 arranged.

In the 2a and 2 B is a fifth surface mount optoelectronic device 60 shown. The 2a is a plan view of the mounting surface 18 the surface mount optoelectronic device 60 , The 2 B is a schematic sectional view along in 2a represented line AA. The fifth component 60 differs from the first component 10 in particular in that, instead of a thin-film chip with two upper-side contacts, a sapphire flip-chip 61 is provided, whose contacts are provided on the back. Accordingly, the electrical contacting of the chip 61 no bonding wires required. The at the back of the chip 61 arranged contacts are via two connecting means 21 each with the arranged on the third side surface of the recess contact surfaces of the first and second electrically conductive region 22 . 23 electrically connected. For example, may be provided as a connecting means, a brazing alloy whose brazing temperature is above 250 ° C.

Furthermore, in which in the 2a and 2 B illustrated embodiment on the top 44 of the structure element 12 the first slide 46 and on the mounting surface 18 the second slide 66 arranged. The slides are in the representation of 2a shown dashed and transparent, otherwise the chip 16 is covered by the slides. The slides can already be used in conjunction with 1d correspond explained foils. In the presentation of 2a and 2 B are the first and second slide 46 . 66 over a foil web 74 connected with each other. The foil path 74 is at the height of the face 38 parallel to the radiation surface 20 arranged. On the foil path 74 can be a fluorescent 80 be upset. This is in the presentation of 2 B characterized by the hatched area. The foil path 74 can for example consist of an insulation layer 49 or a carrier layer of the film. Furthermore, the foil gate 74 for the of the chip 16 and / or the phosphor 80 emitted radiation transparent.

The in conjunction with the 1 and 2 explained features are independent. For example, even with the first component 10 that in conjunction with the 2a and 2 B explained second slide 66 be provided. In addition, mixed forms are possible, so for example, a thin-film chip with a top contact and a back contact can be provided. Accordingly, at the radiation surface 20 of the chip 16 a in conjunction with the 1a and 1b described bonding wire 28 for electrical contacting of the top side contact and on the back side of the chip 16 one in conjunction with the 2a and 2 B be described solder joint arranged for electrical contacting of the rear side contact. Furthermore, the fifth component 60 Also features of the second, third and / or fourth component 42 . 52 . 54 exhibit.

With the components 10 . 42 . 52 . 54 60 corresponds to the height "hc" of the chips 16 . 61 approximately the height of the structural element 12 , Because through the slides 46 . 66 the total height "hg" of the device is only slightly increased, a device can be provided whose total height "hc" is at most twice as large as the height "hc" of the chip 16 . 61 , It can be provided a component whose total height "hg" is smaller than 0.5 mm. For example, components can 10 be provided with a height in the range between 0.3 mm and 0.15 mm. In one embodiment, the total height "hg" of the device may be 200 μm. The total length "lg" of the components 10 . 60 may for example be between 0.8 mm and 2.5 mm. The total width "bg" of the components 10 . 60 may for example be between 0.3 mm and 1 mm.

In the 3a and 3b is a structural element carrier 102 shown. The 3a is a schematic plan view of the structural element carrier 102 , The 3b is a schematic side view of the structural element carrier 102 , The structural element carrier is provided to allow easy manufacture of the device in conjunction with the 1 and 2 allow explained components.

On the structural element carrier 102 is a variety of interconnected structural elements 12 arranged. For a clearer illustration, the individual structural elements 12 in the 3a and 3b shown dotted. The dashed lines indicate in the representation of 3a and 3b Dividing lines, along which the individual structural elements can be separated. The structural elements 102 are along columns 104 and / or rows 106 arranged. In the presentation of 3a and 3b are rows 106 provided, with in each row 106 two structural elements each 12 are arranged. In the structural element carrier 102 are first trenches 108 and second trenches 110a . 110b brought in. The first trenches 108 are parallel to the rows 106 arranged. The second trenches 110a . 110b are parallel to the columns 104 arranged. The second trenches 110a . 110b are perpendicular to the first trenches 108 arranged. In the presentation of 3a superimposed the first ditch 108 the second trenches 110a . 110b , Accordingly, in the presentation of the 3a the first ditch 108 deeper introduced into the material of the structural element carrier than the second trenches 110a . 110b , In addition to the illustrated structural element carrier 102 in which the structural elements are arranged in columns and rows, it is also possible to provide structural element carriers in which the structural elements are arranged only in one row 106 are arranged. Structural element carriers consisting of structural elements arranged along a row have correspondingly no first trenches.

In the in the 3a and 3b illustrated structural element carrier 102 are different second trenches 110a . 110b shown. The in the 3a and 3b left second trench 110a is longer and shallower than the second trench on the right 110b , Furthermore, the left arranged second trench 110a Gradations on. These gradations form the bonding surfaces 32 . 36 the later component. The left second ditch 110a and the right second ditch 110b are intended to accommodate different types of chips. The left structural element is for receiving a chip 16 provided with surface contacts. The right structural element is for receiving a chip 61 provided with backside contacts. In addition to the in the 3a and 3b illustrated structural element carrier 102 can also structural element carrier 102 with the same second trenches 110 be provided. Furthermore, structural element carriers can be provided, in which the structural elements each have only one step. Such structural elements may be provided for receiving a chip having a top side contact and a rear side contact.

The structural element carrier 102 can be produced for example by transfer molding. For ceramic structural elements, for example, hot isostatic pressing may be provided. In general, manufacturing processes can be provided with which already during the molding of the structural element carrier 102 first and second trenches can be introduced. Further, the first and second trenches 108 . 110a . 110b by a material removal such as sawing and / or grinding in the structural element carrier 102 be introduced.

Based on 4a - 4e a method for producing optoelectronic components is explained. The 4a - 4e are schematic representations of the components between individual processing steps.

4a is a schematic plan view of in conjunction with 3a and 3b explained structural element carrier 102 , Combined with 4a An application of an electrically conductive material is explained. The electrically conductive material can be applied, for example, by means of anisotropic metallization. This is in 4a indicated by the arrows shown. For example, processes of physical or chemical vapor deposition may be provided for metallization of the structural element support. Furthermore, the metallization can also be done for example by thermal spraying. The coating allows all surfaces arranged parallel to the plane of the drawing to be coated. In the illustrated embodiment, these are the end faces 38 , the bonding surfaces 32 . 38 , the bottom surface of the first trenches 108 and the bottom surfaces of the second trenches 110a . 110b , In addition, at least a part of the surfaces of the structural elements 12 coated in the representation of the 4a are arranged perpendicular to the plane of the drawing. For example, the later mounting surface 18 of the device in the representation of 4a arranged perpendicular to the plane of the drawing. The metallization can, for example, with a layer thickness of 2 microns on the structural element carrier 102 be applied. For the metallization, it is also possible to apply a plurality of overlapping layers of different materials, as has already been explained, for example, in connection with the first component. In a further embodiment, the structural element carrier 102 and metallization too a manufacturing method for injection-molded circuit carriers (MID method) are produced.

For structuring the electrically conductive regions 22 . 23 can a shadow mask 111 be provided. In the illustrated embodiment, the shadow mask 111 elongated structures 112 exhibit. The elongated structures have a constant thickness and extend substantially parallel to the coating direction and the second trenches 110a . 110b , Furthermore, the metallization can be structured by a material removal. For material removal, machining processes such as sawing or grinding can be used. For example, by sawing along the second trenches 110a . 110b one on the bottom surface of the second trench 110a . 110b applied metallization are removed again to produce separate electrically conductive regions. The structured metallization or the structured metallization form the electrically conductive regions 22 . 23 the later component.

The 4b is a schematic representation of a section through the structural element carrier 102 along the in 4a shown line BB. The structural elements 12 are through the under the first ditch 108 arranged material interconnected.

The hatched areas 114 in 4b show the electrically conductive areas 22 . 23 , Due to the structured application of the metallization, the first electrically conductive region 22 and the second electrically conductive region 23 separated from each other. Part of the mounting surface is thus not affected by the electrically conductive areas 22 . 23 covered. In addition to the in 4b shown surfaces cover the electrically conductive areas and the end faces 38 and the bonding surfaces 32 . 36 , As contact surfaces for electrical contacting of the chip are in the structural element 12 with the left second ditch 110a the bonding surfaces 32 . 36 intended. As contact surfaces for electrical contacting of the chip is in the structural element 12 with the right second ditch 110b the bottom surface of the right second trench 110b intended. On the bottom surface of the right second trench 110b two electrically insulated from each other electrically conductive surfaces are provided.

In 4c is a structural element carrier 102 shown in the chips 16 . 61 were introduced. Before inserting the chips 16 . 61 can solder or adhesive on at least one of the arranged in the recess side surfaces of the structural elements 12 and / or on a side surface of the chips 16 . 61 to be ordered. For example, the second trenches may be 15 microns longer than the chips 16 . 61 , The one in the left second ditch 110a introduced chip 16 can, for example, with an electrically insulating adhesive on its back with the bottom surface of the left second trench 110a be mechanically connected. For electrical contacting are the surface contacts of the chip 16 over the bonding wires 28 with the bonding surfaces 32 . 36 connected. The in the right second ditch 110b introduced chip 61 For example, with an electrically conductive adhesive over its back with the bottom surface of the right second trench 110b be connected mechanically and electrically conductive. For electrical contacting of the two back contacts are two connecting means 21 intended. After inserting the chips 16 . 61 For example, by supplying heat energy between the chips 16 . 61 and the structural element carrier 102 cured adhesive or brazed a solder alloy.

On the radiation surface of the introduced into the structural element carrier chips 16 . 61 can be a fluorescent 40 be sprayed. The phosphor 40 is applied in a structured manner. For example, the electrically conductive regions 22 . 23 of the device are covered by a shadow mask. In other embodiments, the phosphor can also be applied later.

Furthermore, in the first trenches 108 a reflective potting compound to be filled in the 1e to provide structure shown. On the electrically conductive areas 22 . 23 For example, before the filling of the reflective potting compound, a layer can be applied which, after a division of the components, removes the potting compound from the connection contacts 24 . 26 facilitated.

In 4d dashed lines are shown. The dividing lines are in the first trenches 108 arranged. The structural element carrier 102 may be due to a material removal along the first trenches 108 be split. The splitting of the structural element carrier 102 along the first ditch 108 may also be referred to as a row split below. Sawing, grinding or laser cutting can be provided for the removal of material, for example. The material removal can be done for example from above or from below. With the top material removal can be referred to, which is essentially from the side of the structural element carrier 102 takes place, on which the chips are arranged. From below may refer to a material removal, which is substantially from the side of the structural element carrier 102 takes place, which is opposite to the recesses. By the row division, the in 1c illustrated stages 47 on the mounting surface 18 and / or the surface 44 be generated. The steps may be provided, for example, to adjust the height of the components to a desired value. In this case, by a material removal from above a projecting stage 47 be generated. As the previous stage 47 In this case, a stage can be designated, which via the connection contacts 24 . 26 protrudes. Material removal from below can create protruding or recessed steps. The reset can be a stage where material has been removed from the mounting surface. In embodiments in which structural element carriers are used, only a number of structural elements are used 12 have, the series division can be omitted.

After a series division, material removal may be provided to separate structural elements arranged in a row. A corresponding Trennline is in 4e shown. This material removal can be referred to below as column division. By splitting the columns, individual components or groups of at least two components can be provided. For splitting, for example, loops, saws, sheaths or laser cutting can be provided.

In 4e is a set of structural elements 12 with a first and second foil 46 . 66 shown. For example, the series of structural elements 12 after singling on the first or the second foil 46 . 66 placed. After applying the structural elements 12 on the first or the second slide 46 . 66 the other film can be applied. In the presentation of 4e has the second slide 66 Openings for the connection contacts 24 . 26 on.

If no phosphor has been applied, after the application of the first and second film 46 . 66 , Phosphor 40 on the radiation surface 40 be applied. For example, phosphor particles embedded in encapsulant may be in one through the supernatant first and second films 46 . 66 as well as the structural element 12 formed cavity on the radiation surface 40 be applied. Furthermore, it is possible that the first and second film 46 . 66 about one in conjunction with the 2a and 2 B explained film path 74 connected to each other. In this case, the phosphor 80 on the foil path 74 be arranged. For the first components 10 which have no film, which can in conjunction with 4d explained applying the first and second film 46 . 66 omitted.

The division of the columns can be done before or after application to the first and / or second film. Thus, for example, the components after the column division individually to the film 44 . 66 be applied. This can be provided, for example, if during the further processing of the components, a large distance between the individual components is desired.

When splitting the columns after applying the components to the film, the components can be divided by the division of the columns together with the film 44 . 66 be split. In addition to these two variants, mixed forms are also possible.

For example, prior to the application of the components to the film, a column division may be provided, in which the structural element carrier 102 is divided into groups of at least two components and after applying the groups of components to the film 46 . 66 a redistribution of columns may be provided to separate the components. This can be provided, for example, to simplify the handling of the components during manufacture or further processing.

The foil 44 . 66 with the applied components can be wound up on a roll. The roll with the plurality of interconnected components can be delivered to a customer. The column splitting step may then be performed by a customer, for example immediately prior to applying the devices to a circuit carrier. If the separation of the components is provided immediately before the application of the components on a circuit board, the handling and transport of the components can be simplified. This is particularly advantageous for components with small dimensions.

5 is a schematic representation of a first multiple component 500 , The multiple component 500 includes at least two components 502 . 504 , The at least two components 502 . 504 are over an electrically conductive foil 506 mechanically and electrically connected to each other. The components 502 . 504 are spaced along one direction of each other on the electrically conductive foil 506 applied. The spaces between the individual components can remain free or be filled with silicone, for example.

The electrically conductive foil 506 is different from the first and second slide 46 . 66 at least in that in addition to the adhesive layer 48 , the insulation layer 49 and the reflector layer 50 at least one further insulation layer and electrical conductor tracks 510 are provided. The electrical conductors 510 For example, you can choose between two layers of insulation 49 be embedded. The electrical conductors 510 can on the of the structural elements 12 opposite side of the electrically conductive film 506 disposed be. The electrically conductive film can be based on the structural element 12 an adhesive layer 48 , an insulation layer 49 , a reflector layer 50 , an insulation layer 49 , electrical conductors 510 , and another insulation layer 49 exhibit. Furthermore, the electrically conductive foil 506 vias 512 on. The vias 512 penetrate part of the insulation layers 49 and the reflector layer 50 and form an electrically conductive connection between the electrical conductor tracks 510 and the connection contacts 24 . 26 the individual components. The reflector layer may openings for the vias 512 exhibit. The vias 512 For example, with an electrically conductive adhesive or by a solder connection to the terminals 24 . 26 be electrically connected. The electrically conductive foil may, for example, have a thickness of less than 100 μm.

Furthermore, the electrically conductive foil 506 a first and a second external connection contact 514 . 516 on. The first and second external connection contacts 514 . 516 are provided to the multiple component 500 to contact electrically. In the illustrated embodiment, the first external terminal contact 514 via an electrical conductor 510 with a first connection contact 24 of the component 502 electrically connected. The second connection contact 26 of the component 502 is via an electrical conductor 510 with the first connection contact 24 of the component 504 electrically connected. The second connection contact 26 of the component 506 is via an electrical conductor 510 with the second external connection contact 516 electrically connected. The components 504 . 506 of the multiple component 500 are electrically connected in series. In addition to the electrically conductive foil 506 On the other side of the components, one of the most associated with the 1c . 1d . 2a . 2 B described films 46 . 66 be provided. Further, on the top and the bottom of the components, an electrically conductive foil 506 be arranged. The multiple component 500 differs from, for example, arranged on a roll individual components in particular by the fact that the components of the multiple component 500 electrically conductively connected to each other.

6 is a schematic representation of a second multiple device 600 , This in 6 illustrated second multiple component 600 is different from the one in 5 shown first multiple component 500 in that the structural elements 12 mechanically and electrically conductively connected to each other. The multiple component 600 For example, a series of the in 4c schematically indicated structural element carrier 102 exhibit. In contrast to the representation of the schematic representation of 4c can the second multiple component 600 only have chips of one type. Furthermore, the second multiple component 600 for example a row of the structural element carrier 102 with three recesses and three chips arranged in the recesses 16 exhibit.

The second multiple component 600 has common electrically conductive areas 602 on. The common electrically conductive areas 602 have a first electrically conductive region provided for contacting a first chip 22 and a second electrically conductive region provided for contacting a second chip arranged adjacent thereto 23 on.

On the top 44 and / or the mounting surface 18 the structural elements 12 can a slide 46 . 66 be arranged. The foil 46 . 66 has a reflector layer 50 on. Through the reflector layer 50 can be deflected laterally from the component emitted light in the direction of the radiation surface. Accordingly, the film 46 . 46 provide a light-guiding function.

By combining at least two components into a multiple component, the handling of the components during further processing can be simplified.

The components and the multiple components may be provided, for example, for coupling light into a light distribution plate. For example, the multiple device and the light distribution plate may be part of a backlight of a display, such as a liquid crystal display. The components can with their radiation surface 20 be arranged on a side surface of the light distribution plate. The side surface of the light distribution plate may be arranged perpendicular to a light output surface of the light distribution plate. The light path between the radiating surface and the side surface of the light distribution plate may be adjustable. Adjustable, for example, mean that the length of the light path can be set to a desired value. The desired value may be less than 100 μm, for example. The length of the light path can be, for example, via the depth of the second trenches relative to the end face 38 be set. Furthermore, the length of the light path can be determined by the thickness of a phosphor arranged on the radiation surface 40 be set.

The optoelectronic component and the method for producing an optoelectronic component have been described to illustrate the underlying idea based on some embodiments. The embodiments are not limited to specific feature combinations. Although some features and configurations have been described only in connection with a particular embodiment or individual embodiments, they may each be combined with other features from other embodiments. It is also possible to omit or add in individual embodiments illustrated features or particular embodiments, as far as the general technical teaching is realized.

Although the steps of the method of manufacturing the optoelectronic device are described in a particular order, it is to be understood that any of the methods described in this disclosure may be performed in any other meaningful order, including but not limited to, method steps. unless deviated from the basic idea of the technical teaching described.

Claims (17)

Surface-mountable optoelectronic component ( 10 . 42 . 52 . 54 . 60 ) with one on an electrically insulating structural element ( 12 ) arranged mounting surface ( 18 ) and one perpendicular to the mounting surface ( 18 ) arranged radiation surface ( 20 ) of an optoelectronic chip ( 16 . 61 ), wherein - the structural element ( 12 ) has a recess which the structural element ( 12 ) in a direction perpendicular to the mounting surface ( 18 ) completely penetrates; - in the recess of the structural element ( 12 ) the optoelectronic chip ( 16 . 61 ) is arranged; At least one perpendicular to the mounting surface ( 18 ) arranged side surface of the optoelectronic chip ( 16 . 61 ) with a perpendicular to the mounting surface ( 18 ) arranged side surface of the recess is mechanically connected; On the electrically insulating structural element ( 12 ) a first and a second electrically conductive region ( 22 . 23 ) are arranged, which are electrically isolated from each other; The first and second electrically conductive region ( 22 . 23 ) at the mounting surface ( 18 ) and arranged perpendicular to the mounting surface and to the mounting surface ( 18 ) is arranged adjacent contact surfaces, and wherein - arranged on the mounting surface part of the first and second electrically conductive regions ( 22 . 23 ) Terminal contacts for the electrical and mechanical contacting of a circuit carrier form and arranged on the contact surfaces part of the first and second electrically conductive region ( 22 . 23 ) the optoelectronic chips ( 16 . 61 ) contact electrically. Component according to claim 1, wherein a height of the structural element ( 12 ) about a height (hc) of the optoelectronic chip ( 16 . 61 ) corresponds. Component according to claim 1 or 2, wherein the total height (hg) of the component is at most twice as large as the height (hc) of the optoelectronic chip ( 16 . 61 ). Component according to one of claims 1 to 3, wherein on the mounting surface ( 18 ) of the structural element ( 12 ) and / or on one of the mounting surface ( 18 ) opposite top ( 44 ) of the structural element ( 12 ) a reflector layer ( 50 . 56 ) is arranged. Component according to one of claims 1 to 4, wherein in the beam path of the chip ( 16 . 61 ) parallel to the radiation surface ( 20 ) a film ( 74 ) is arranged on the film and a phosphor ( 80 ) is applied. Component according to one of claims 1 to 4, wherein on the mounting surface ( 18 ) and the top ( 44 ) one over the radiation surface ( 20 ) projecting film ( 46 . 66 ) and in a through the overhanging film ( 46 . 66 ) and the structural element ( 12 ) formed cavity phosphor ( 40 ) is arranged. Component according to one of claims 1 to 6, wherein the first and second electrically conductive region ( 22 . 23 ) superficially on the structural element ( 12 ) are applied. Component according to one of claims 1 to 7, wherein the structural element ( 12 ) the optoelectronic chip ( 16 . 61 ) at three perpendicular to the mounting surface ( 18 ) arranged side surfaces surrounds. Multiple component ( 500 ) with at least two of the components described in claims 1 to 8 ( 10 . 42 . 52 . 54 . 60 . 502 . 504 ), wherein the at least two components via an electrically conductive foil ( 506 ) are electrically connected to each other. Multiple component ( 600 ) with at least two of the components described in claims 1 to 8 ( 10 . 42 . 52 . 54 . 60 . 502 . 504 ), the structural elements ( 12 ) are mechanically connected to each other and wherein a first electrically conductive region and a second electrically conductive region ( 23 ) a common electrically conductive region ( 602 ) form. Component transport arrangement with a plurality of components ( 10 . 42 . 52 . 54 ) according to one of claims 1 to 8, wherein the plurality of components ( 10 . 42 . 52 . 54 ) via at least one film ( 46 . 66 ) are mechanically interconnected. Background illumination device for a display device, wherein the backlight device at least one of the components ( 10 . 60 ) according to one of claims 1 to 10 and a light distribution plate, wherein the at least one component ( 10 . 42 . 52 . 56 . 60 ) with the radiation surface ( 20 ) is arranged on a side surface of the light distribution plate, and wherein the side surface of the light distribution plate is arranged perpendicular to a light output surface of the light distribution plate. Method for producing a surface-mountable optoelectronic component with provision of a structural element carrier ( 102 ) with a plurality of mechanically interconnected, electrically insulating structural elements ( 12 ), the structural elements ( 12 ) are arranged in rows and / or in columns and each having at least one structure element completely penetrating recess; Applying electrically conductive areas on at least two mutually perpendicular and adjacent side surfaces of the structural elements ( 12 ); Providing a plurality of optoelectronic chips ( 16 . 61 ); Introducing optoelectronic chips ( 16 . 61 ) in the recesses of the structural elements ( 12 ); mechanically connecting the plurality of optoelectronic chips ( 16 . 61 ) with the structural elements ( 12 ); Splitting the structural element carrier ( 102 ). The method of claim 13, wherein the electrically conductive regions structured on the structural element carrier ( 102 ) are applied. A method according to claim 13 or 14, wherein for the splitting of the structural element carrier ( 102 ) a material removal along a first trench ( 108 ) is provided and / or a material removal between two arranged in a row structural elements is provided. Method according to one of claims 13 to 15, wherein the structural elements ( 12 ) after splitting the structural element carrier ( 102 ) on a foil ( 46 . 66 . 506 ) are applied. The method of claim 16, wherein the film ( 46 . 66 . 506 ) with the applied structural elements ( 12 ) is wound up on a roll.

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