DE102009056290A1 - Device for cooling e.g. micro processor, arranged on printed circuit board i.e. graphic card, of computer, has connecting unit i.e. blind hole, cooperating with another connecting unit i.e. thread, for removable mounting of coolers - Google Patents

Abstract

The device has a metallic heat dissipation plate (4) firmly connected with a printed circuit board (1). The dissipation plate has a side (5), which is turned towards the electronic components (2, 3) and is parallel to the printed circuit board and housings (6, 7) of the components. The dissipation plate comprises a connecting unit (9) i.e. blind hole, at another side (8), which is turned towards to the board, in a region (14) of the dissipation plate with strong heat input. The connecting unit cooperates with another connecting unit (13) i.e. thread, for removable mounting of coolers (10, 11).

Description

The invention relates to a device for cooling electronic components arranged on a printed circuit board according to the preamble of claim 1.

It is well known that electronic components are mounted on printed circuit boards of computers and interconnected to logic circuits or functional units. The electronic components are, for example, microprocessors and voltage transformers, the operation of which produces a considerable waste heat. This impairs above an individual limit temperature, the performance of the respective electronic component, which is why they are usually passively or actively cooled by means of radiator or heat sink.

For example, what are known as rib coolers are used as passive coolers, which have a contact plate and a plurality of cooling ribs arranged thereon. These passive radiators, which are usually made of a light metal, sit with their contact plate directly or with the interposition of a heat conducting agent (for example a thermal compound) on the electronic component to be cooled and remove the excess heat by radiation and convection to the surrounding air.

As an active cooler, for example, so-called water cooler are used, the contact plate is also directly or via a heat conducting with the top of the electronic component in contact. The water cooler directs the waste heat of the electronic component from the contact plate in a cooling liquid, which is usually water. The water then transports the waste heat to a heat exchanger, which releases the waste heat to the surrounding air and returns the cooled water by means of a pump to the water cooler.

Against this background, many devices have already become known for cooling electronic components arranged on a printed circuit board, for example of a computer. This is what the US 6,421,240 B1 and the DE 694 30 159 T2 ( EP 0 641 023 B1 ) Cooling devices for arranged on a printed circuit board electronic components in which surface parallel to the printed circuit board and the housings of the electronic components, a Wärmeabführplatte is arranged whose side facing the electronic components have a topography, which is adapted to the height of the respective electronic components. As a result, a comparatively small distance is available for these components, in which a heat conduction can be placed. In this way, the waste heat of the electronic components can be introduced in a particularly short way in the heat dissipation plate arranged above the printed circuit board. The heat dissipation from this Wärmeabführplatte done by means formed in the same or attached cooling channels, which carry a coolant that releases the waste heat through a heat exchanger to the ambient air.

A similar structure shows from the DE 689 18 442 T2 ( EP 0 409 918 B1 ) Become known liquid cooling device for a multi-chip circuit module in which, however, on each waste heat-generating electronic component of a printed circuit board, a thermally conductive body is placed, which are in accordance with one embodiment individually individually with rib heat sinks in contact, which emit the waste heat to a cooling liquid.

It is also known that technological progress in the field of electronic components, in particular those used in computers, is proceeding very rapidly. Thus, for example, for home computers, ie those computers that are used by private individuals for office applications and / or computer games, new graphics cards are developed and offered for sale in relatively short time intervals, each distinguished from the previous model by a faster and better operation and always can produce more realistic-looking graphics animations.

With all of these graphics card models, the coolers mentioned above are necessary in order to be able to remove the heat generated during operation of the electronic components there from their area. Although these printed circuit boards of a computer are already equipped by the manufacturer with sufficiently sized coolers on the electronic components, the owners of such computers often have the desire to improve the performance of the computer by further lowering the operating temperature of the electronic components with the same possible increased clock frequency of the same, especially the microprocessor, to lift. In addition, the use of more powerful coolers not infrequently achieves a significantly quieter operation of the computer and allows it to operate above allowed ambient temperatures.

In order to realize these improved operating characteristics of their computer, the coolers originally present on the printed circuit boards are dismantled by the owners of the computers and replaced by more powerful coolers. Usually, larger passive coolers or actively ventilated passive coolers are used, or existing passive coolers are replaced by active coolers, for example water coolers.

If the same computer is to be provided, for example, with a new graphics card after 1 to 2 years of operation, then the problem arises that the coolers mounted on the old graphics card can not be attached to the new graphics card for mechanical reasons. This is due, for example, to the fact that the electronic components which are heat-intensive in operation are arranged at different locations in the case of different graphics cards or mainboards (motherboard boards), but also because the fastening means on the coolers very often do not correspond geometrically to the fastening means corresponding thereto fit printed circuit boards. For this reason, when a replacement of the graphics card or the motherboard of a computer, the cooler mounted there are currently being removed and scrapped.

Since the radiators are relatively expensive and technically still fully functional, there is a need for a device that on the one hand ensures the cooling of the high heat generating electronic components of a circuit board of a computer, and on the other hand allows the reuse of existing coolers.

The solution of this technical problem is achieved by a device having the features of the main claim. Advantageous developments and refinements of the invention can be taken from the subclaims.

The invention is based on the finding that the stated object can be achieved if the known Wärmeabführplatte is designed as an adapter plate on the component distant upper side by a computer owner largely individually existing older, but still functional coolers are attachable to those places where due Activity of the underlying electronic components of the entry of large amounts of heat is expected in the Wärmeabführplatte.

The invention therefore relates to a device for cooling arranged on a printed circuit board electronic components, which has a firmly connectable to the circuit board metallic Wärmeabführplatte, which is arranged with its electronic components facing the first side largely parallel to the surface over the circuit board and the housings of the electronic components. To achieve the object, it is provided that the heat dissipation plate on its side facing away from the circuit board second side at least at areas with heavy waste heat input first connecting means which cooperate for exchangeable attachment of coolers with second connecting means.

The device according to the invention allows a computer owner to replace the replacement of an old computer circuit board against a new circuit board latter with the invention Wärmeabführplatte in the sense of an adapter plate, on the component remote top he then already in its inventory cooler, be it now Air or liquid cooler, attach and can save costs. The special construction of the top of the heat dissipation plate or the arrangement of the first connection means allows the user to attach the existing radiator in wide areas individually adapted to the waste heat technical conditions of the new circuit board to this.

According to a development of the device according to the invention it is provided that the first connecting means for interchangeable mounting of the radiator are formed as blind holes with threaded and the second connecting means as screws. Accordingly, the radiator are fastened by means of screw on the Wärmeabführplatte.

According to a variant, it is also possible that the heat dissipation plate has on its component-distant upper side only blind holes in the thread cutting screws can be screwed.

Sticking the radiator on the preferably continuously planning component remote upper side of the Wärmeabführplatte is also very possible, but this affects their ease of interchangeability.

In this context, it is preferably provided that the second connecting means designed as screws can be guided through receiving openings in the radiators or through receiving openings of fastening arms connected to the radiators. If the fastening arms are arranged pivotably on the respective radiator, the radiators themselves can be pivoted relative to the fixed bore positions of the first fastening means of the heat exhaust plate, and thus their position can be adapted largely optimally to the location of the heat source. This attachment of the radiator is preferably carried out by the purchaser of a Wärmeabführplatte invention, but it can also be sold Wärmeabführplatten already wear replaceable mounted radiator.

In a further embodiment of the Wärmeabführplatte can be provided that is formed on the Wärmeabführplatte between at least two of the first connecting means a footprint for placing at least one of the radiator. in the In the simplest case, this footprint is limited by two, three, four or more of the blind holes in their extension.

According to a preferred embodiment, it is provided that the formed as blind holes first connecting means are arranged on the heat dissipation plate in rows on the edge of each footprint. Thereby, the exact mounting location of the respective radiator can be particularly easily adapted to the exact position of the heat source on the Wärmeabführplatte. On such a heat dissipation plate, however, larger areas can be kept free, which are used for heat-transfer adhesive gluing of coolers.

Preferably, the Wärmeabführplatte is designed such that at this a plurality of air coolers and / or water coolers can be arranged and attached, adapted according to an embodiment, the concrete mounting locations of the radiator to the location of the particularly hot in operation electronic components of the respective circuit board or adapted is.

At this point it should be noted that the invention comparatively thick heat dissipation plate has a relatively large heat capacity due to their dimensions. As a result, the waste heat is distributed from locally tightly limited heat sources advantageously on a larger area in the Wärmeabführplatte. In addition, in a Wärmeabführplatte with a comparatively large wall thickness whose thermal resistance is reduced to the physically smallest possible value.

In order to enable a largely arbitrary arrangement of the radiator on the component remote side of the Wärmeabführplatte, this has, according to a specific embodiment, a large number of first connection means which are arranged in a grid shape distributed in the form of intersecting columns and rows over large areas of the Wärmeabführplatte ,

The heat dissipation plate is preferably made of an aluminum alloy coated or anodized with copper or nickel. Although aluminum has a lower thermal conductivity compared to the material copper, a Wärmeabführplatte made of an aluminum alloy but has a higher heat capacity and is relatively easy and inexpensive to produce. Due to their low weight, a heat dissipation plate made of an aluminum alloy also does not load the holder of the printed circuit board so strongly with which it is fastened to the computer housing.

In a further embodiment it can be provided that the electronic components facing first side of the Wärmeabführplatte has a topography, which is adapted to the heights of the respective electronic components. As a result, a comparatively small distance between the heat dissipation plate to the housing top side of the electronic components is possible, which facilitates the heat transfer into the Wärmeabführplatte. Further, it is possible by this construction that between the respective upper sides of the housing of the electronic components and the Wärmeabführplatte a thin layer of a heat conducting agent is attached, whereby the heat conduction is further improved.

In another variant of the device according to the invention it is provided that the Wärmeabführplatte consists of two individual, surface-parallel interconnectable plates that in at least one of these two plates at least one groove is formed, that this at least one groove to form a channel from the other Plate is covered, and that this groove or channel is guided over those areas of the associated circuit board, in which compared to cooler neighboring areas by the operation of the electronic components, an increased heat input is expected.

With this construction, it is possible to cool the heat dissipation plate from the inside, in addition to the coolers to be arranged on the component distant side of the heat dissipation plate. For this purpose, the at least one coolant channel is selectively guided through those regions of the heat removal plate, which are arranged above the electronic components to be cooled of the associated printed circuit board. The overall device thus formed can bring the electronic components even in very hot rooms or environments on advantageous low operating temperatures by the extensive coolant. Thus, the use of such a cooling device according to the invention, for example, also makes sense in computers consisting of only one circuit board, which must be used locally at very hot production processes.

In connection with the just mentioned variant of the invention, it is preferably provided that the groove or the channel in the two-part Wärmeabführplatte in the areas with increased heat input or in the region of the mounting points has a meandering course, whereby concentrated at this location heat dissipation surface of at least one channel per unit area is advantageously increased.

Further, it is preferably provided that the groove or the channel in the two-part Wärmeabführplatte via a feed connection with a coming from a separate liquid cooler Supply line and a discharge port with a leading to the separate liquid cooler discharge line is connectable. Of course, these lines can also be connected to a liquid cooler, which is mounted directly on the two-part Wärmeabführplatte. An electric pump transports the coolant.

Moreover, it is considered advantageous if it is provided that the Wärmeabführplatte is formed for fixed connection with a designed as a graphics card or motherboard board of a computer circuit board, and that the Wärmeabführplatte there has a section where directly to the circuit board separate cooler is arranged for a microprocessor. Due to this construction, the particularly high cooling requirement of a microprocessor which can be cooled by means of a separate high-performance cooler which can not be removed from the printed circuit board is advantageously taken into account.

According to another embodiment of the device according to the invention it is provided that the printed circuit board is arranged largely parallel to the surface between two Wärmeabführplatten and fixed thereto. In this case, the first heat dissipation via first heat conduction in contact with waste heat generating electronic components, while the second heat dissipation via second heat conduction with those points of the circuit board in heat conductive contact, which are located on the circuit board opposite the mounting locations of the waste heat generating electronic components.

Thus, the circuit board is sandwiched between two heat dissipation plates. The first heat dissipation plate is the top and the second heat dissipation plate is associated with the bottom of the circuit board. Although the second Wärmeabführplatte with the waste heat generating electronic components only indirectly, namely with the interposition of the material of the circuit board in thermal engineering contact, but this is sufficient to remove additional waste heat from hot spots of the circuit board.

The heat conduction means mentioned may be formed as thermal paste or as thermal pad, wherein the thermal compound is used there, where a heat dissipation plate is arranged directly opposite the electronic component to be cooled. Wärmeleitkissen are particularly well where a Wärmeabführplatte is only indirectly in contact with the electronic waste heat, so preferably for pressing against the back of a circuit board.

According to another embodiment, it is provided that the second heat dissipation plate, ie the one which is preferably assigned to the underside of the printed circuit board, has a surface topography with depressions and elevations. These sinks and elevations are used for fastening of heat-conducting, which are electrically insulating and can be pressed at the hot spots of the circuit board against the bottom or arranged there electronic components.

Finally, it should be mentioned that the two Wärmeabführplatten preferably each have a thickness of 3 mm to 5 mm, so that they have a fairly large heat capacity and rigidity.

The invention will be further explained with reference to embodiments shown in a drawing. Herein shows

1 3 shows a schematic longitudinal section through a printed circuit board equipped with electronic components and a cooling device with heat removal plate and coolers attached thereto,

2 a representation like in 1 but with a two-part heat dissipation plate,

3 the circuit board and the cooling device according to 1 in a plan view,

4 the circuit board and the cooling device according to 2 in a plan view, and

5 a schematic longitudinal section through a populated with electronic components circuit board, which is enclosed on both sides between two Wärmeabführplatten.

Accordingly, shows 1 in a schematic longitudinal section, a circuit board 1 involving electronic components 2 . 3 is equipped. Here are the components 2 designed as such, which produce relatively low waste heat during operation, while the components 3 are those that produce comparatively much waste heat. The electronic components 2 . 3 have a housing 6 . 7 on, from the contact legs in a known manner 25 protrude. These contact legs are through the circuit board 1 plugged and soldered there with invisible traces.

Opposite with the electronic components 2 . 3 equipped printed circuit board 1 is a heat dissipation plate 4 arranged such that their to the components 2 . 3 pointing page 5 largely parallel to the surface of the top of the circuit board 1 and to the top of the component housing 6 . 7 is aligned. The heat dissipation plate 4 has to allow for a heat transfer to the same advantageously small distance to the electronic components 2 . 3 On the component side, a surface topography corresponding to the surface topography of the components 2 . 3 equipped printed circuit board 1 is adjusted. Accordingly, the component housing 6 . 7 at least partially in depressions in that side 5 the heat dissipation plate 4 taken to the circuit board 1 shows.

To improve the heat transfer between the component housings 6 . 7 and the heat dissipation plate 4 is between these a thin layer of heat conduction 16 , For example, a thermal paste, arranged.

Like the little waste heat generating electronic component 2 illustrates, is at this no heat conduction 16 appropriate.

The heat dissipation plate 4 has at least one connection area at its peripheral end 27 on, with these on the top of the circuit board 1 seated. This connection area 27 is preferably annular and protrudes on the Wärmeabführplatte 4 furthest towards the circuit board 1 in front. The heat dissipation plate 4 and the circuit board 1 have to connect the same holes 39 . 43 on, through the screws 28 stuck and each with a mother 29 are connected.

As the 1 and 2 clarify, assigns the circuit board 1 and thus also the heat dissipation plate 4 areas 14 on when operating the electronic components 2 . 3 because of their heat generation are hotter than the adjacent areas 21 , According to the invention, the heat dissipation plate 4 Deviating from the prior art designed such that in the areas 14 with large heat radiator radiator 10 . 11 are exchangeable fastened. These hotter areas 14 may depend on the arrangement of the electronic components 2 . 3 on the printed circuit board underneath 1 different sizes and at different locations of the circuit board or the Wärmeabführplatte 4 be arranged.

The coolers 10 are doing as a rib cooler with a contact plate 26 and projecting cooling fins formed during the only in this embodiment, liquid cooler 11 a hollow and provided with heat exchange surfaces housing also with a contact plate 26 as well as with a supply connection 32 and a drain connection 33 having for a coolant leading lines.

The coolers 10 . 11 sit with their contact plates 26 on their installation surfaces 15 plan on the component distant second page 8th the heat dissipation plate 4 , wherein for improving the heat transfer between the contact plates 26 and the second page 8th the heat dissipation plate 4 a thermal grease 16 can be arranged.

In the embodiments shown in the figures, the radiators have 10 . 11 via attachment arms 30 . 31 at right angles or at an angle other than 90 ° to the contact plates 26 the cooler 10 . 11 are arranged fixed or pivotable. In addition, the attachment arms 30 . 31 Holes or slots 35 on.

For fixing the radiator 10 . 11 on the heat dissipation plate 4 are in this embodiment at the component remote second page 8th first connection means 9 formed in the form of blind holes with screw threads in the formed as threaded screws second connecting means 13 can be screwed. These screws 13 be through the mentioned holes or slots 35 the attachment arms 30 . 31 stuck and in the blind holes 9 the heat dissipation plate 4 screwed. The long holes 35 in the attachment arms 30 . 31 allow to a certain extent a displacement of the radiator 10 . 11 on the heat dissipation plate 4 so that these are optimal in the areas 14 can be positioned with the largest heat radiation. Of course, but also cooler with fixed holes for the passage of the threaded screws can be used.

As the 1 and 2 can illustrate, different cooler 10 . 11 in different places 14 . 21 on the heat dissipation plate 4 be attached. This can be new or existing coolers 10 . 11 used, for example, those that a computer owner already has in his inventory. The attachment arms 30 . 31 and the slots 35 on the coolers 10 . 11 allow a fairly accurate positioning of the radiator 10 . 11 above the comparatively much waste heat generating electronic components 2 . 3 , It may well happen that the footprint 15 the radiator 10 or 11 smaller or larger than a technically optimal footprint is. Importantly, the computer owner already has existing coolers 10 . 11 Can save costs again. Also the heat dissipation plate 4 does not need optimal on the firmly connected to her circuit board 1 or the locations of the electronic components mounted thereon 2 . 3 be adapted.

As 3 and 4 show, the heat dissipation plate 4 preferably a section 22 on, the place for a separate high-performance cooler 23 lets that stuck to the circuit board 1 is connected and only the cooling of one on the circuit board 1 arranged main microprocessor 24 serves.

2 shows opposite 1 a second embodiment according to the invention, in which the Wärmeabführplatte 4 ' is formed in two parts and from the two plates 17 and 18 consists. The to the electronic components 2 . 3 distant plate 17 has at least one groove on its component-near side 19 on, through the component-distant side of the component-near plate 18 closed down. This is at least one channel 20 in the two-piece heat dissipation plate 4 ' formed by one between the two plates 17 . 18 Edge-clamped sealing ring 40 is sealed. Through the channel 20 is a coolant such as water feasible, so that the two-piece Wärmeabführplatte 4 ' beside the ones on their component remote side 8th arranged coolers 10 . 11 having an internal heat exchanger. A groove for receiving the sealing ring 40 is also in the lid-like top plate 17 educated.

As the 2 and 4 show is the groove 19 or the channel 20 at those points or area of the heat dissipation plate 4 ' formed, in which an increased heat transfer from under the Wärmeabführplatte 4 ' arranged electronic components 3 . 4 is to be expected. Especially 4 shows that the groove 19 or the channel 20 starting from a feed port 41 for the coolant meandering in those areas 14 the heat dissipation plate 4 ' are formed, in which the largest waste heat of the electronic components 2 . 3 is to be expected. Preferably, the groove 19 or the channel 20 designed so that the areas 14 be supplied with the greatest waste heat in parallel to each other with cool coolant.

It can also be seen that the at least one groove 19 or the at least one channel 20 on the outlet side with a discharge connection 42 on the heat dissipation plate 4 ' connected is. The mentioned connections 41 and 42 the heat dissipation plate 4 ' are about a pump 34 , a discharge line 37 and a supply line 38 with an external liquid cooler 12 connected to the heat dissipation plate 4 ' dissipated heat via a heat exchanger to the ambient air. But it is also possible that the lines 37 and 38 on a liquid cooler 11 are connected, which directly on the Wärmeabführplatte 4 ' on a footprint 15 for a liquid cooler 11 is fastened, as in the 1 and 2 is shown.

4 clarifies that on the heat dissipation plate 4 . 4 ' as blind holes provided with screw thread first connecting means 9 preferably arranged in rows between which set-up surfaces 15 for the coolers 10 . 11 available. Here are the rows of blind holes 9 parallel to each other and the side edges of the Wärmeabführplatte 4 . 4 ' or at an angle to each other and / or to the side edges of the Wärmeabführplatte 4 . 4 ' be arranged. In combination with the slotted holes 35 in the attachment arms 30 . 31 the cooler 10 . 11 These can be in the range of a comparatively large footprint 15 be placed in different and ultimately thermally optimal positions. The release of the installation surfaces 15 on the heat dissipation plate 4 . 4 ' for the coolers 10 . 11 towards the hot spots of the circuit board 1 can therefore be carried out relatively inexpensively comparatively inaccurate.

In an embodiment of the inventive idea to the extreme can be provided that large areas of the component distant side 8th the heat dissipation plate 4 . 4 ' with many, grid-shaped threaded blind holes 9 are provided, allowing a user his existing cooler 10 . 11 pinpoint within the holes 9 predetermined grid on the heat dissipation plate 4 . 4 ' can place.

Finally, in 5 a schematic longitudinal section through a with electronic components 2 . 3 . 49 . 50 equipped printed circuit board 1 shown between two heat dissipation plates 4 . 44 arranged and firmly connected with these. The arrangement of the circuit board 1 and the upper heat dissipation plate 4 is largely similar to the structure of the device according to 1 , In addition, a second heat dissipation plate 44 present with the circuit board 1 and the first heat dissipation plate 4 is firmly connected. As connecting means here are screws 28 through through holes 39 . 43 and 45 the two heat dissipation plates 4 . 44 and the circuit board 1 plugged in and end with one nut each 29 are bolted.

The proposal for the arrangement of a second Wärmeabführlatte 44 on the circuit board 1 is based on the knowledge that during operation hotter electronic components 3 emit their waste heat in all spatial directions, including in the direction of the circuit board 1 , This will make this circuit board 1 at the locations of these electronic components 3 on the side facing away from the component 53 comparatively hot, so that even there cooling devices can be sensibly used.

According to the embodiment of the 5 is therefore the second Wärmeabführplatte 44 provided, the bottom 53 the circuit board 1 is assigned and this covers largely parallel to the surface. The second heat dissipation plate 44 points to its component-related, largely planed side 48 as well as the top 52 the circuit board 1 associated first Wärmeabführplatte 4 each a topography with sinks 46 . 47 and surveys 55 on, the height of the respective electronic components 2 . 3 . 49 . 50 is adjusted. There are sinks 47 provided for the absorption of thermal less active electronic components, such as RAM memory devices 49 serve as well as other sinks 46 that are locally assigned to electronic components that become quite warm during operation.

In these latter sinks 46 are in the in 5 shown embodiment as Wärmeleitkissen 51 trained Wärmeleitmittel arranged with their component near side against the bottom 53 the circuit board 1 Press and so a fairly good Wärmeleitkontakt to the circuit board 1 produce. These heat conduction pads 51 are preferably formed electrically insulating, so that these harmless also on electrical resistors 50 can rest on the bottom 53 the double-sided printed circuit board 1 are attached to printed conductors, not shown. If desired, of course, the RAM memory modules 49 be covered with a thermal paste or a Wärmeleitkissen.

The second heat dissipation plate 44 points to its component-near top 48 also surveys 55 on, where also heat transfer 51 are arranged, which with the circuit board 1 are in thermal engineering contact. This thermal contact between the circuit board 1 and the second heat dissipation plate 44 exists at those locations of the circuit board 1 in which these are due to the waste heat production of electronic components 3 gets particularly hot. Therefore, these become electronic components 3 actually cooled from two sides, namely from the top 52 through the first heat dissipation plate 4 with their coolers 10 . 11 as well as from their underside 53 over the circuit board 1 and the second heat dissipation plate 44 ,

To improve the cooling effect of the second heat dissipation plate 44 this is just like the first Wärmeabführplatte 4 at the component remote or circuit board remote page 54 with first connection means 9 formed in the form of blind holes in the screws 13 can be screwed as a second connection means. These screws 13 fix separate cooler 10 on this second heat dissipation plate 44 in particular at those places which are the places of the printed circuit board which become particularly hot during operation 1 lie opposite.

LIST OF REFERENCE NUMBERS

1

circuit board

2

Electronic component

3

Electronic component

4

Wärmeabführplatte

4 '

Two-piece heat dissipation plate

5

First side of the heat dissipation plate

6

Housing of an electronic component

7

Housing of an electronic component

8th

Second side of the heat dissipation plate

9

First connecting means

10

Cooler, air cooler

11

Cooler, water cooler

12

Separate water cooler

13

Second connecting means

14

Area of heat dissipation plate with large heat radiation

15

Installation surface for a radiator

16

Thermal interface

17

First plate of the heat dissipation plate 4 '

18

Second plate of heat dissipation plate 4 '

19

groove

20

channel

21

Cooler area of heat dissipation plate

22

Cutout on the heat dissipation plate

23

Cooler for the microprocessor

24

Mirko processor

25

Contact leg of an electronic component

26

Contact plate of a radiator 10 . 11

27

Connection area of the heat dissipation plate

28

screw

29

mother

30

Mounting Arm

31

Mounting Arm

32

Supply connection on the radiator 11

33

Discharge port on the radiator 11

34

pump

35

Long hole

36

Meandering course of a channel in the heat dissipation plate

37

Outlet line outside the heat dissipation plate

38

Feed line outside the heat dissipation plate

39

Through hole in the heat dissipation plate 4

40

seal

41

Feed port for the duct on the heat exhaust plate

42

Drain port for the duct on the heat exhaust plate

43

Through hole in the circuit board 1

44

Wärmeabführplatte

45

Through hole in the heat dissipation plate 44

46

Valley in the heat dissipation plate 44

47

Valley in the heat dissipation plate 44

48

Component near top of the heat dissipation plate 44

49

Memory module, RAM

50

Electrical resistance

51

Heat transfer pad (electrically insulating)

52

Top of the circuit board

53

Bottom of the circuit board

54

Component remote underside of the heat dissipation plate 44

55

Elevation at the heat dissipation plate 44

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• US 6421240 B1 [0005]
• DE 69430159 T2 [0005]
• EP 0641023 B1 [0005]
• DE 68918442 T2 [0006]
• EP 0409918 B1 [0006]

Claims (18)

Device for cooling on a printed circuit board ( 1 ) arranged electronic components ( 2 . 3 . 49 ), which one with the circuit board ( 1 ) firmly connectable metallic Wärmeabführplatte ( 4 . 44 ) with their electronic components ( 2 . 3 . 49 ) facing first side ( 5 ) largely parallel to the surface over the printed circuit board ( 1 ) and the housings ( 6 . 7 ) of the electronic components ( 2 . 3 . 49 ), characterized in that the Wärmeabführplatte ( 4 . 4 ' . 44 ) at her from the circuit board ( 1 ) groundbreaking second page ( 8th . 54 ) at least in areas ( 14 ) with strong waste heat input first connection means ( 9 ), which are used for the interchangeable attachment of coolers ( 10 . 11 ) with second connection means ( 13 ) interact. Device according to claim 1, characterized in that the first connection means ( 9 ) for exchangeable mounting of the radiator ( 10 . 11 ) as blind holes with or without thread and the second connecting means ( 13 ) are designed as screws. Device according to claim 1 or 2, characterized in that the second connecting means (16) designed as screws 13 ) through receiving openings of the radiator ( 10 . 11 ) or through receiving openings of the radiators ( 10 . 11 ) associated fastening arms ( 30 . 31 ) are guided. Device according to one of the preceding claims, characterized in that on the Wärmeabführplatte ( 4 . 4 ' ) between at least two of the first connecting means ( 9 ) a footprint ( 15 ) for placing at least one of the radiator ( 10 . 11 ) is trained. Device according to one of the preceding claims, characterized in that the first connecting means ( 9 ) on the heat dissipation plate ( 4 . 4 ' . 44 ) in rows at the edge of each footprint ( 15 ) are arranged. Device according to one of the preceding claims, characterized in that the Wärmeabführplatte ( 4 . 4 ' . 44 ) for mounting and fixing a plurality of air coolers ( 10 ) and / or water coolers ( 11 ), wherein the mounting locations of the radiator ( 10 . 11 ) to the location of the particularly hot electronic components ( 2 . 3 . 49 ) of the respective printed circuit board ( 1 ) are adjusted. Device according to one of the preceding claims, characterized in that the Wärmeabführplatte ( 4 . 4 ' . 44 ) is made of an aluminum alloy coated or anodized with copper or nickel. Device according to one of the preceding claims, characterized in that the electronic components ( 2 . 3 . 49 ) facing first page ( 5 . 48 ) of the heat dissipation plate ( 4 . 4 ' . 44 ) has a topography which corresponds to the heights of the respective electronic components ( 2 . 3 . 49 ) is adjusted. Device according to one of the preceding claims, characterized in that the electronic components ( 2 . 3 . 49 ) facing side ( 5 . 48 ) of the heat dissipation plate ( 4 . 4 ' . 48 ) to the electronic components ( 2 . 3 . 49 ) maintains a small distance, which by means of a heat conduction ( 16 . 51 ) is refillable. Device according to one of the preceding claims, characterized in that the Wärmeabführplatte ( 4 ' ) of two individual, surface-parallel connectable plates ( 17 . 18 ), that in at least one of these two plates ( 17 ) at least one groove ( 19 ) is formed, that this at least one groove ( 19 ) to form a channel ( 20 ) from the other plate ( 18 ) and that this groove ( 19 ) or this channel ( 20 ) about those areas ( 14 ) of the associated printed circuit board ( 1 ), in which compared to cooler neighboring areas ( 21 ) by the operation of the electronic components ( 2 . 3 ) an increased heat input is expected. Apparatus according to claim 10, characterized in that the groove ( 19 ) or the channel ( 20 ) in the fields of ( 14 ) with increased heat input or in the region of the attachment locations ( 15 ) has a meandering course. Device according to one of claims 10 to 11, characterized in that the groove ( 19 ) or the channel ( 20 ) in the two-part heat removal plate ( 4 ' . 17 . 18 ) via a feed connection ( 41 ) with one of a liquid cooler ( 12 ) incoming supply line ( 38 ) and via a discharge port ( 42 ) with a to the liquid cooler ( 12 ) leading discharge line ( 37 ) is connectable. Device according to one of claims 10 to 12, characterized in that on the component distant side ( 8th ) of the heat dissipation plate ( 4 . 4 ' ) a large number of first connection means ( 9 ) grid-shaped over large areas of the heat dissipation plate ( 4 . 4 ' ) are formed distributed. Device according to one of the preceding claims, characterized in that the Wärmeabführplatte ( 4 . 4 ' . 44 ) for fixed connection with a graphics card or as a motherboard board of a computer formed circuit board ( 1 ) is formed, and that the heat dissipation plate ( 4 . 4 ' . 44 ) there is a section ( 22 ), where directly at the Printed circuit board ( 1 ) a separate cooler ( 23 ) for a microprocessor ( 24 ) is arranged. Device according to one of the preceding claims, characterized in that the printed circuit board ( 1 ) largely parallel to the surface between two Wärmeabführplatten ( 4 . 4 ' . 44 ) is arranged and fixed, wherein the first Wärmeabführplatte ( 4 . 4 ' ) via first heat conducting means ( 16 ) in contact with waste heat producing electronic components ( 2 . 3 . 49 ), and in which the second heat dissipation plate ( 44 ) via second heat conducting means ( 51 ) with those parts of the printed circuit board ( 1 ) is in heat conductive contact, which opposite the mounting locations of the waste heat generating electronic components ( 2 . 3 . 49 ). Device according to claim 15, characterized in that the heat conducting means ( 16 . 51 ) are formed as a thermal paste or as a heat-conducting pad. Apparatus according to claim 15 or 16, characterized in that the second Wärmeabführplatte ( 44 ) Reduce ( 46 ) and surveys ( 55 ) for the attachment of Wärmeleitkissen ( 51 ), which are formed electrically insulating and to the underside of the printed circuit board ( 1 ) and / or to electronic components arranged there can be pressed. Device according to one of claims 15 to 17, characterized in that the two Wärmeabführplatten ( 4 . 4 ' . 44 ) each have a thickness of 3 mm to 5 mm.

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