DE102008051044A1 - Optoelectronic component - Google Patents

Abstract

In at least one embodiment of the optoelectronic component (1), this comprises a planar basic body (2) and at least one group (30) with at least two basic elements (3), each basic element (3) being designed with an optoelectronic semiconductor element (4). The basic elements (3) are mounted on a mounting surface (5) on an upper side (31) of the main body (2). Furthermore, the basic elements (3) of the group (30) are arranged in a row laterally adjacent to the mounting surface (5) and electrically connected in series. At least two basic elements (3) of the group (30) are made in one piece. The group (30) of the basic elements (3) is electrically contacted via spring and / or pressure contacts (6) with the base body (2).

Description

It an optoelectronic component is specified.

Optoelectronic Components such as light or photodiodes have a broad technical Application found. Some aspects of the spread of Such components are advancing their high efficiency and long life. Individual optoelectronic components, such as light-emitting diode chips, can be on many different Way to different light sources combine. associations from semiconductor chips in this case, for example, modular be constructed.

A to be solved task is a manageable specify optoelectronic component.

At least an embodiment of the optoelectronic device this one planar body. Planar can do this mean that the main body two opposing, just designed, parallel to each other oriented main pages having. The main pages can be about one Recess penetrated. The main body is particular mechanically rigid and self-supporting designed. The main body can, for example, have a square or rectangular floor plan exhibit. Also possible, for example, is a hexagonal or trigonal floor plan.

At least an embodiment of the optoelectronic component has this at least a group of basic elements. The group comprises at least two basic elements, preferably a plurality of Basic elements.

In accordance with at least one embodiment of the optoelectronic component, each base element is designed with one, in particular with exactly one, optoelectronic semiconductor element. By way of example, the base element comprises a substrate on which the semiconductor element is applied and with which it is electrically contacted. The semiconductor element is, for example, a light-emitting diode chip. The semiconductor element may be a thin-film chip or a substrateless light-emitting diode. Such semiconductor elements are in the document WO 2005/081919 A1 and in the publication DE 10 2007 004 304 A1 described, the disclosure of which is incorporated with respect to the semiconductor element described therein by reference.

At least an embodiment of the optoelectronic component has the main body has a mounting surface on an upper side on. The mounting surface is preferably planar and planar.

At least an embodiment of the optoelectronic device the basic elements on the mounting surface of the body appropriate. That may mean that the basic elements on the mounting surface glued or soldered. However, preferred are the basic elements reversibly mounted on the mounting surface, so that, for example, after the lifetime of a primitive, this can be replaced. Such attachment may be with spring, Clamping or compressive forces take place.

At least an embodiment of the optoelectronic device the basic elements of the group in a row laterally adjacent to arranged the mounting surface. Regarding a projection on the mounting surface overlap the basic elements not.

At least an embodiment of the optoelectronic device the basic elements of the group are electrically connected in series. That can mean that only two electrical connections necessary are to electrically connect the entire group of primitives.

At least an embodiment of the optoelectronic device at least two basic elements of the group made in one piece. Integral here means that a variety of basic elements has a common substrate on which all other components the basic elements, in particular the optoelectronic semiconductor elements, are applied. For example, a variety of basic elements in the wafer assembly with a wafer that can be designed with silicon, manufactured. The wafer can then be divided into parts be separated, that one of the parts at least two basic elements having.

At least an embodiment of the optoelectronic device the basic elements via spring and / or pressure contacts with the main body electrically contacted. The electrical contact takes place in particular via a reversible connection. to electrical contact between body and the Group of basic elements is for example no solder or no electrically conductive Glue needed. The contact is, for example, over a tension, compression or spring force, which is a component perpendicular to the mounting side may have realized. It is possible, that an electrically conductive spring that is connected to an electrical Conduction of the main body is connected to a conductor track of the base element presses and thus for electrical contact serves.

In at least one embodiment of the optoelectronic Component includes this a planar body and at least one group having at least two basic elements, wherein each basic element with an optoelectronic semiconductor element is designed. The basic elements are on a mounting surface attached to an upper side of the main body. Farther The basic elements of the group are laterally adjacent in a row the mounting surface arranged and electrically connected in series. At least two basic elements of the group are in one piece executed. The group of primitives is about Spring and / or pressure contacts with the main body electrically contacted.

It is thus a plurality of semiconductor elements via primitives mounted on a base body. The plurality of semiconductor elements may thus be handled in a network. In other words, that serves Basic element as a kind of standardized subcarrier, which comprises, for example, the semiconductor element. Because the main body bigger Dimensions as a single primitive or a single Semiconductor element, handling is simplified and the sensitivity of the opto-electronic component against damage, about during assembly, reduced.

At least an embodiment of the optoelectronic device all basic elements of the group are made in one piece. So all basic elements, for example, have a common Substrate on. The basic elements of the group are, for example, barren arranged. Because all the basic elements are one-piece are executed, is a high positioning accuracy of the semiconductor elements relative to each other, since the semiconductor elements for example, in the wafer composite on, for example, the basic elements common Substrate can be applied. A high positioning accuracy of the semiconductor elements relative to one another may be an image of facilitate optoelectronic component generated radiation.

At least an embodiment of the optoelectronic device is located the mounting surface in a recess of the body. The recess in particular penetrates the upper side of the main body. Due to the recess formed boundary surfaces of the Basic body, in plan view of the top of the main body are considered to belong to the top. The recess can be designed so that a fitting fit the basic elements of a group in the recess is made possible. This is also a good thermal contact between the base element and basic body guaranteed. For example can be achieved through the recess that is itself in the recess located on the mounting surface basic elements at least with respect to two, in particular as regards three lateral directions are mechanically fixed. A recess also facilitates contacting via spring and / or Pressure contacts, since the basic elements in the recess, for example to Edge regions of the recess, with comparatively high accuracy can be positioned relative to the base body. With others In words, the edge region of the recess, at least in places, forms a stop for at least one basic element, so that the base element touches the edge region of the recess.

At least an embodiment of the optoelectronic device takes place a mechanical contacting of the group of basic elements on the body by the spring and / or pressure contacts. For example, the Basic elements of the group through the spring contacts on the mounting surface pressed and thereby fixed. Preferably, the mechanical Attaching the group of basic elements via the spring and / or pressure contacts. That is, the group of primitives can without the aid of adhesion promoters such as adhesives or solders in particular be reversibly attached to the body. Is in operation of the optoelectronic component, a group of the basic elements about failed, so this can be replaced without much effort.

At least an embodiment of the optoelectronic device takes place an electrical connection between two adjacent basic elements the group over a one-piece, areal configured conductor track facing away from the base body Basic element top. The track is not in particular direct contact with the main body. Are the basic elements manufactured in wafer composite, so the interconnects cross elemental element also be made in Waferverbund.

At least an embodiment of the optoelectronic device the individual basic elements, in the context of manufacturing tolerances, identically designed. In other words, the basic elements are the same each other. This makes it possible that the optoelectronic Component can be modular. For example, the number to basic elements comprising a group, thereby to simple Type varies and / or customized. Also different basic body are easily combined with the basic elements.

In accordance with at least one embodiment of the optoelectronic component, the semiconductor elements have electrical contacts which are located on mutually opposite main surfaces of the Semiconductor elements are located. The semiconductor elements are therefore not designed in particular as flip-chips.

At least an embodiment of the optoelectronic device the spring contacts designed with spring clips. spring clip allow a comparatively high mechanical contact pressure the basic elements on the mounting surface. Furthermore can relatively over spring clips large lateral tolerances with respect to the electrical Contacting of the basic elements with the basic body accepted become.

At least an embodiment of the optoelectronic device protrude the semiconductor elements the base body, in a direction perpendicular to the mounting surface, at least partially. In particular, overshoot the semiconductor elements complete the body. This means in particular that the semiconductor elements not in a volume formed by the recess or Cavity are located.

At least an embodiment of the optoelectronic device between at least two basic elements of the group attached a joint. The joint serves to compensate for different thermal expansion coefficients of basic elements and basic body. For example more than ten or more than 50 basic elements in one piece executed, so may during operation of the optoelectronic device resulting heat to thermally induced voltages between lead the basic elements and the body. Over a Fugue these thermal stresses can be reduced. The joint can be realized by making two non-integral executed basic elements abut each other directly. Preferably, the gap is filled with air. Likewise possible But it is also that a buffer material, such as a silicone, the Fugue at least partially fills. Because the lateral dimensions of the optoelectronic component are in the range of mm to cm, it is sufficient that the joint has a width in the range of 1 micron to 200 .mu.m, in particular between 5 .mu.m and 35 .mu.m. It is also possible that the joint has two adjacent primitives not completely separated from each other. So the fugue can also a local reduction of a thickness of the basic elements common Substrate, in a direction perpendicular to the mounting surface, represent. However, the neighboring basic elements are preferred completely separated from each other.

At least an embodiment of the optoelectronic device this at least two groups of primitives. This can a matrix or array-like structure of the optoelectronic Component be realized. The optoelectronic component can also be a have pixel-like structure.

At least an embodiment of the optoelectronic device the at least two groups of the component, perpendicular in one direction to a longitudinal extent of the groups, laterally side by side arranged. For example, the groups of primitives are strip-like designed.

Become several strips with respect to the longitudinal extent placed next to each other, so is an array-like structure of the optoelectronic Component facilitated.

At least an embodiment of the optoelectronic device at least two basic elements of the group on marginal surfaces dicing tracks on. Edge surfaces are in particular such surfaces, the one connection between a body facing the base Create the main page of the primitives with the primitive top. The singulation traces can be applied to a saw, Laser or crushing process due.

At least an embodiment of the optoelectronic device this designed without bond wires. Bond wires can be mechanically loaded only weak, without a Causing destruction of the bond wires. As well is the application of bonding wires comparatively expensive.

At least an embodiment of the optoelectronic device is made this from the main body, the group of basic elements, the Spring and / or pressure contacts and electrical cables. The electrical Cables can in this case electrical contacts of the semiconductor element, conductor tracks the main body or the basic elements and / or vias include. The optoelectronic component has no particular Frame on which the basic elements and / or the semiconductor elements border. Nor does the component have a cover, approximately in shape a glass plate, or a potting body surrounding the semiconductor element on. As a result, a particularly compact optoelectronic component can be realized.

In accordance with at least one embodiment of the optoelectronic component, a thickness of the component, in a direction perpendicular to the mounting surface, is less than 500 μm, in particular less than 300 μm, preferably less than 200 μm. If the semiconductor elements have a thickness of at most 20 μm and the base elements have a substrate with a thickness of at most 200 μm, and the substrate of the basic elements is completely or nearly completely in the recess, so a mechanically stable base body with a thickness of several 100 microns can be used to realize such an optoelectronic device. The thickness of the component can thus be determined essentially by the thickness of the base body.

At least an embodiment of the optoelectronic device the group has at least six basic elements that run in one piece are.

At least an embodiment of the optoelectronic device a ratio of the lateral extent of the basic elements, in a direction parallel to the mounting surface, smaller than 4, in particular less than 2.5. That is, a long side of the primitive is at most 2.5 times, respectively four times longer than a lateral side of the primitive. Prefers the ratio of the lateral expansions is in the range between 1.5 and 2.5.

At least an embodiment of the optoelectronic device the main body with a ceramic, a metal core board or a semiconductor material, in particular with silicon. Such materials can have a high thermal conductivity of more than 50 W / (m K).

At least an embodiment of the optoelectronic device the group of basic elements with exactly two spring and / or pressure contacts contacted. Preferably, the group of basic elements is about the spring and / or pressure contacts also attached to the body.

Some Areas of application in which optoelectronic Components can be used, for example, the backlight of Displays or displays. Furthermore, the Optoelectronic components described here also in lighting devices be used. The optoelectronic components described here For example, in projectors, in headlights, in particular used in vehicle headlamps, or in light emitters. As well is it possible that the optoelectronic described here Components in the field of general lighting, in particular for large-area lighting equipment used become.

following An optoelectronic device described herein will be referenced explained in more detail with reference to exemplary embodiments. The same reference numerals indicate the same elements in the individual Figures on. However, they are not to scale Covers shown, rather, individual elements shown in an exaggerated way for a better understanding be.

It demonstrate:

1 a schematic plan view (A) and a schematic sectional view (B) of an embodiment of an optoelectronic device described herein, and

2 a schematic sectional view of an embodiment of an optoelectronic device described herein with two groups of basic elements.

In 1 is an embodiment of an optoelectronic device 1 shown. A basic body 2 , which is designed with a metal core board or provided with electrical leads ceramic, has a recess 7 on. Through the recess 7 is a top 9 of the basic body 2 penetrated. A major surface of the recess 7 forms a mounting surface 5 , On the mounting surface 5 is a group 30 of basic elements 3 appropriate. According to 1 is the group 30 of six basic elements which are arranged laterally adjacent to a longitudinal extent L. The number of basic elements 3 the group 30 is scalable here. The group 30 the basic elements 3 is precisely in the recess 7 brought in.

The basic elements 3 are in the context of manufacturing tolerances, designed to be identical to each other and have a ratio of longitudinal to transverse side of about 2.4. On a primitive top 31 are tracks 8th and an electrical contact 17b appropriate. The individual basic elements 3 are above the tracks 8th electrically connected in series. The tracks 8th are by a primitive boundary 15 not physically interrupted.

On the one with the primitive top 31 in contact electrical contact 17b there is an optoelectronic semiconductor element 4 , The semiconductor element 4 is designed as a substrateless LED chip and has a thickness of less than 20 microns. At one the substrate 13 remote light exit surface 14 of the semiconductor element 4 there is another electrical contact 17a , About the electrical contacts 17a . 17b the current is fed into the semiconductor element 4 , The electrical conductors 8th are on the one hand with the contact 17b and on the other hand, over a bridge 12 , with the electrical contact 17a at the light exit surface 14 electrically connected.

The substrate 13 of the primitive 3 is located almost completely in the recess 7 , The semiconductor element 4 dominates the body 2 . in a direction perpendicular to the mounting surface 5 , Completely.

The six basic elements 3 the group 30 are made in one piece. That is, all the basic elements 3 have the same, the basic elements 3 overarching substrate 13 , The substrate 13 can be designed with silicon. Individual basic elements 3 are through the primitive boundary 15 separated from each other. The primitive boundary 15 is preferably a fictitious line which is a kind of unit cell with respect to the basic elements 3 indicates.

The group 30 the basic elements 3 can be generated in the wafer composite. This will be done on the substrate 13 the tracks 8th and optionally the electrical contacts 17b , for example via a photolithographic process. Subsequently, the optoelectronic semiconductor elements 4 , for example via a wafer transfer process, on the substrate 13 applied. By the wafer transfer process, a high positioning accuracy of the semiconductor elements can be ensured relative to each other. The relative positioning accuracy is substantially the accuracy of a photolithographic manufacturing process in the manufacture of the semiconductor elements 4 ,

About creating bridges 12 a contact takes place at the light exit surface 14 of the semiconductor elements 4 , The bridges 12 can be designed with an electrically insulating paint in conjunction with a metallization thereon.

In a subsequent process step, the substrate 13 into individual bars or bars, about about sawing, to be cut. The dicing preferably takes place along the primitive boundaries 15 , The longitudinal extent L of a group 30 and thus the number of their basic elements 3 is in such a group produced 30 in principle only by the diameter of the substrate 13 about which the basic elements 3 are produced, limited. By thus separating the substrate 13 comprehensive wafers have at least edge surfaces 11 of, with respect to the longitudinal extent L, the first and last basic element 3 Singling traces on.

The group 30 the basic elements 3 is via spring clips designed with spring contacts 6 electrically with the main body 2 contacted and also via the spring contacts 6 mechanically on the base body 2 attached. The main body 2 points in 1 not shown electrical lines, with which an electrical connection between an external, not part of the optoelectronic device and not shown device or carrier and the basic elements 3 the group 30 can be produced. Depending on the specific application, the basic body 2 have different shapes. By using the group 30 of basic elements 3 can in different basic bodies 2 designed for various concrete applications, the same basic elements 3 and / or semiconductor elements 4 be used. In particular, the number of primitives 3 that a group 30 includes and the number of groups 30 on a base 2 be adapted in this way efficiently and with little effort.

About such a designed optoelectronic component 1 So different modules can be built, the same basic elements 3 , optionally in different numbers, and different basic body 2 include.

Indicates the group 30 the basic elements 3 a large number of basic elements 3 on, for example, 50 or more primitives 3 , so in the operation of the optoelectronic device 1 Stresses due to different thermal expansion coefficients of the material of the body 2 and the basic elements 3 , in particular of the substrate 13 , occur. In this case, unlike in 1A shown the group 30 be separated by a joint, not shown in two subgroups. Through the joint are two adjacent primitives 3 separated from each other. The group 30 So it can be made of two joined, single, strip-shaped bars of basic elements 3 consist. The joint preferably has a width to the longitudinal extent L of the group 30 , of about 10 μm.

Optionally, unlike in 1A Illustrated, the group 30 the basic elements 3 with more than two spring and / or pressure contacts 6 electrically and / or mechanically contacted or fastened. It is sufficient in this case if the electrical contacting only two opposite, short sides of the group 30 and thus with respect to the longitudinal extent L first and last primitive 3 electrically contacted. The additional spring and / or pressure contacts can only serve for mechanical fastening.

Another embodiment of an optoelectronic device 1 is in 2 shown. In the recess 7 There are two groups 30a . 30b of basic elements 3 , Every group 30a . 30b has its own substrate 13 on, about the belonging to the respective group basic elements 3 are integrally connected to each other. To simplify the illustration is only a spring contact 6 concerning the group 30b in 2 shown. A thickness D of the component 1 , in a direction perpendicular to the assembly area 5 , is about 300 microns.

Unlike in 2 It is also possible that all basic elements are shown 3 of the groups 30a . 30b on a common, the entire recess 7 filling substrate 13 are applied.

The The invention described herein is not by the description limited to the embodiments. Much more For example, the invention includes every novel feature as well as every combination of features, in particular any combination of features in the patent claims, even if this feature or this combination itself is not explicitly stated in the claims or embodiments is given.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• WO 2005/081919 A1 [0006]
• - DE 102007004304 A1 [0006]

Claims (14)

Optoelectronic component ( 1 ) with - a planar basic body ( 2 ), - at least one group ( 30 ) with at least two basic elements ( 3 ), each basic element ( 3 ) with an optoelectronic semiconductor element ( 4 ), whereby - the basic elements ( 3 ) on a mounting surface ( 5 ) on a top side ( 9 ) of the basic body ( 2 ), - the basic elements ( 3 ) the group ( 30 ) in a row laterally adjacent to the mounting surface ( 6 ) are arranged and electrically connected in series, - at least two basic elements ( 3 ) the group ( 30 ) are made in one piece, and - the group ( 30 ) of the basic elements ( 3 ) via spring and / or pressure contacts ( 6 ) with the basic body ( 2 ) is electrically contacted. Optoelectronic component ( 1 ) according to claim 1, wherein all the basic elements ( 3 ) the group ( 30 ) are made in one piece. Optoelectronic component ( 1 ) according to claim 1 or 2, wherein the mounting surface ( 5 ) in a recess ( 7 ) of the basic body ( 2 ) is located. Optoelectronic component ( 1 ) according to one of the preceding claims, in which a mechanical contacting of the group ( 30 ) of the basic elements ( 3 ) on the base body ( 2 ) by the spring and / or pressure contacts ( 6 ) he follows. Optoelectronic component ( 1 ) according to one of the preceding claims, in which an electrical connection between two adjacent basic elements ( 3 ) the group ( 30 ) via a one-piece, areal-shaped conductor track ( 8th ) on one of the basic body ( 2 ) facing away from the top element ( 31 ) he follows. Optoelectronic component ( 1 ) according to one of the preceding claims, in which the semiconductor elements ( 4 ) electrical contacts ( 17 ) on opposite major surfaces of the semiconductor elements ( 4 ) exhibit. Optoelectronic component ( 1 ) according to one of the preceding claims, in which the spring contacts ( 6 ) are designed with a spring clip. Optoelectronic component ( 1 ) according to one of the preceding claims, in which the semiconductor elements ( 4 ) the basic body ( 2 ), at least in part, in a direction perpendicular to the mounting surface ( 5 ). Optoelectronic component ( 1 ) according to one of the preceding claims, in which between at least two basic elements ( 3 ) the group ( 30 ) a joint for compensating different thermal expansion coefficients of basic elements ( 3 ) and basic body ( 2 ) is attached. Optoelectronic component ( 1 ) according to any one of the preceding claims, comprising at least two groups ( 30 ) of basic elements ( 3 ), where the groups ( 30 ), in a direction perpendicular to a longitudinal extent (L) of the groups ( 30 ), are arranged laterally side by side. Optoelectronic component ( 1 ) according to one of the preceding claims, in which at least two basic elements ( 3 ) the group ( 30 ) on edge surfaces ( 11 ) Have singling tracks. Optoelectronic component ( 1 ) according to one of the preceding claims, which is designed without bond wires. Optoelectronic component ( 1 ) according to one of the preceding claims, consisting of the basic body ( 2 ), the group ( 30 ) of basic elements ( 3 ), the spring and / or pressure contacts ( 6 ) and electrical wiring. Optoelectronic component ( 1 ) according to one of the preceding claims, in which - the group ( 30 ) at least six basic elements ( 3 ), which are made in one piece, - the optoelectronic semiconductor element ( 4 ) is designed as a light-emitting diode chip, - the main body ( 2 ) is designed with a ceramic or a metal core board, and - the group ( 30 ) of the basic elements ( 3 ) with exactly two spring contacts ( 6 ) with the basic body ( 2 ) is electrically and mechanically contacted.