DE102008042150A1 - Sensor arrangement for determining a parameter of a fluid medium - Google Patents

Abstract

The invention relates to a sensor arrangement (110) for determining at least one parameter of a fluid medium (116) flowing with a flow direction (118), in particular an intake air mass of an internal combustion engine flowing through a flow pipe. The sensor arrangement (110) has at least one sensor chip (120) for determining the at least one parameter, which comprises at least one sensor surface (122). The sensor arrangement (110) furthermore has a sensor carrier (112) to which the sensor chip (120) is connected such that the sensor surface (122) is overflowed by the fluid medium (116). The sensor carrier (112) is at least partially designed as a multilayer structure (124). The multilayer structure (124) has at least two substrate layers (126) and electrical structures (130) in at least two different layer planes of the multilayer structure (124).

Description

State of the art

The The invention is based on devices for measuring at least one Parameters of a flowing fluid medium, in particular a fluid flowing through a flow tube Medium, as known from various fields of technology are. So in many processes, for example on the field of process engineering, chemistry or mechanical engineering, defines fluid media, in particular gas masses (eg an air mass) with certain properties (for example, temperature, pressure, Flow velocity, mass flow, volume flow etc.) be supplied. These include in particular combustion processes, which take place under controlled conditions.

An important application example is the combustion of fuel in internal combustion engines of motor vehicles, in particular with subsequent catalytic exhaust gas purification, in which regulated a certain air mass per unit time (air mass flow) must be supplied. Various types of sensors are used to measure the air mass flow rate. One type of sensor known from the prior art is the so-called hot film air mass meter (HFM), which is used, for example, in US Pat DE 196 01 791 A1 in one embodiment. Such a hot-film air mass meter typically uses a sensor chip which, for example, has a thin sensor membrane or another sensor surface, for example a silicon sensor chip. The sensor core typically has at least one heating resistor surrounded by two or more temperature sensing resistors. In an air flow, which is guided over the membrane, the temperature distribution changes, which in turn can be detected by the temperature measuring resistors and can be evaluated by means of a control and evaluation circuit. Thus, for example, from a difference in resistance of the temperature measuring resistors, an air mass flow can be determined. Various other variants of this type of sensor are known in the art. The present invention is not limited to the described sensor type of Heißfileinuftmassenmessers, but can in principle be used for most types of sensors that are used as a permanently installed sensors or, for example, as a replaceable plug-in sensor in a flowing medium.

A technical challenge with known sensor arrangements, such as hot-film air mass meters, in many cases represents the mounting of the sensor chip. For example, in known hot-film air mass meters a sensor carrier is used, which is designed, for example, as a metal bag or by means of a plastic part. In a separate housing, a control and evaluation is provided, which is connected by appropriate bonding techniques with associated terminals on the sensor chip. The sensor chip is introduced, for example, in a recess of the sensor carrier. An embodiment of such assemblies of sensor chips in recesses of the sensor carrier and associated connection techniques by means of wire bonding is in DE 195 24 634 A1 described. The recess for receiving the sensor chip may be designed flat on its underside, but may also have, for example, channel-shaped recesses or other structures.

A In particular, there is the challenge of known sensor arrangements in that these sensor arrangements comparatively complicated assembly techniques require. In particular, the described wire bonding methods, by means of which the control and evaluation circuits with the sensor chips are connected, are technically complex and include one high assembly costs. In addition, the sensor arrangements are comparatively space-consuming, because space for the wire connections and the control and evaluation must be provided.

Disclosure of the invention

It Therefore, a sensor arrangement for determining at least one Parameters of flowing with a flow direction proposed fluid medium, which has the disadvantages of the state the art known sensor arrangements at least largely avoids. The sensor arrangement can in particular for measuring a by a Flow tube flowing intake air mass one Internal combustion engine are used, in particular after the above described Heißfileinuftmassenmesser principle. Others too However, arrangements and / or measured parameters are basic conceivable.

One The basic idea of the present invention is the sensor carrier the sensor arrangement at least partially to design a multilayer structure or multilayer substrates as carrier substrates for recording to use the sensor chips.

From the electrical engineering multilayer techniques are generally known, for example, from the production of printed circuit boards. For example, multilayer circuit boards are used to realize high density electronic circuits. Under a multilayer structure are there understood in general constructions in which at least two, preferably three, four or more substrates are connected flat to each other to form a multi-layer structure. The substrates can be configured, for example, as plastic and / or ceramic substrates. On the surfaces of these substrates, in layer planes between the substrates and / or on the substrates, electrical structures may be provided which comprise, for example, conductor tracks, electrical components, connection contacts or the like. Also within the substrates themselves, electrical structures may be arranged, for example electrical vias, interconnects, electrical components or the like.

The individual substrates with the already applied thereto electrical Structures and / or with the later applied thereto electrical structures, for example, surface glued together or otherwise flat with each other be connected. Electrical components can, for example on a front and / or a back of the multilayer construction be applied flat on the multilayer structure. The Contour of the individual layers or layers of the multilayer structure can always be the same with each other, or it can also different contours can be provided.

Corresponding This basic idea of the present invention comprises the sensor arrangement at least a sensor chip for determining the at least one parameter of the fluid medium. This sensor chip has at least one sensor surface. For example, this one Sensor chip designed as a silicon sensor chip. Especially the sensor chip can continue to act as a hot-film air mass sensor chip be configured, such as those described in the introduction Prior art disclosed hot film air mass sensor chips. The sensor surface can, for example, on a membrane arranged on the sensor chip or on a surface a porous region of the sensor chip, ie an area, which has a low thermal mass overall. Others too Embodiments are possible. On the sensor surface For example, corresponding sensor elements can be provided, such as temperature sensors, heating resistors or similar for the function of the determination of the at least one parameter required contours. Also more complex Embodiments of the sensor chip are conceivable.

Farther the sensor arrangement has a sensor carrier, wherein the sensor chip is connected to the sensor carrier in such a way, the sensor surface can be overflowed by the fluid medium is or is overflowed in use. This can, as known from the prior art, for example realized thereby be that the sensor carrier in whole or in part as a wing is configured, which is adapted to the use of the sensor arrangement into a flow of the fluid medium. For example This wing can be in a bypass of a plug-in sensor be arranged, in which this one of a main stream the fluid medium diverted partial flow overflowed becomes. In this case, the wing, for example, on both sides of the fluid medium to be overflowed, so that in total the wing a comparatively low pressure drop in causes the flowing fluid medium. Also other arrangements, in which the sensor surface is overflowed by the fluid medium, are however conceivable in principle.

As shown above, while the sensor carrier is at least partially designed as a multilayer structure. In particular, should That part of the sensor carrier, which with the sensor chip is connected to be designed as such multilayer structure. As As shown above, this multilayer structure has at least two Substrate layers and electrical structures in at least two different layer levels of multilayer construction. The electrical Structures can, as shown above, for example electrical tracks, bushings, electrical components, Contact pads or other types of electrical structures include.

Of the Sensor chip can in particular in a depression of the multilayer structure be arranged. For example, this depression, apart of required tolerances and air gaps, for example in their lateral dimensions correspond to the dimensions of the sensor chip. For example, this depression can be configured rectangular.

The In particular, recess can have at least one free punch in the top layer of the multilayer structure include. Under a free cut is thereby to understand an arrangement in which in the layer before or after mounting the multilayer structure a corresponding opening is produced. Such openings can be, for example, by Laser cutting, milling, sawing, etching or easily generate similar techniques. Preferably is not only the top layer of the multilayer structure, ie the layer, which allocates to the flowing fluid medium, but also at least one further, deeper layer of the multilayer structure, for example, the second and third, on the top layer following layer, with such a cutout for production the depression provided. The depression can accordingly over the uppermost layer and optionally further layers extend into the depth of the multilayer structure.

The proposed sensor arrangement has over the known Sensor arrangements on a variety of advantages. So can which require electrical structures on the individual Layers of multilayer construction cost-effective in use be realized in parallel. This can be done, for example, before connecting the individual layers to the multilayer structure, for example by gluing, laminating or the like Connection techniques, done. The depression can easily on the dimensions and shape of the sensor chip can be adjusted and is basically freely selectable.

The electrical structures of the multilayer construction can also be used during assembly as an aid. So can these as parser structures by means of an image recognition for position detection for an adhesive application during assembly of the sensor chip on the multilayer structure as well as for a setting process of the Sensor chips used with sufficient positioning accuracy become. The orientation and positioning of the sensor chip can to the boundary conditions in the plane of the layers of the multilayer structure be adjusted freely.

The Recess for receiving the sensor chip, which also as a cavern can be designated, can be described by the above Easily cutting free the layers of the multilayer structure, in contrast to, for example, known injection molding processes and / or milling processes. The number of for this Deepening layers to be cut free of the multilayer structure, for example by the height of the sensor chip and the strength the individual layers, taking into account intermediate layers such as adhesive layers. Especially preferred it is when the sensor surface is substantially flush is arranged with a surface of the multilayer structure. Under "essentially flush" can it also deviations from a flush arrangement, for example not more than 20%, preferably not more than 10% or not more than 5%, the height of the sensor chip can be tolerated. The Recess for the sensor chip recording can, as above described, consist of at least one or more layers. The free cuts or cutouts for this depression may be prior to joining the individual layers to the multilayer structure be introduced into the individual layers.

By This multilayer structure can be applied to the use of metal bags or plastic parts, as they usually do be used in Heißfileinuftmassenmessern, preferably as sensor carrier completely abstain. Overall, the sensor arrangement and in particular the sensor carrier designed so very compact become.

Around to further increase the compactness of the sensor arrangement, can also be an optional electrical Ansteuer- and Evaluation circuit for controlling and evaluating the sensor chip or the sensor arrangement wholly or partly in the multilayer structure be integrated. For example, the control and evaluation electronics be fully integrated in the multilayer. alternative However, only a part of this control and evaluation electronics be present in the multilayer, whereas other parts, for example Parts which require more electrical components include, may be implemented externally, for example in other components of the sensor arrangement and / or within an external control. The use of the multilayer arrangement for the transmitter as a sensor recording can under Use of provided electrical structures in the multilayer structure carried out, for example, corresponding tracks, bushings, Terminal contacts, vias or the like, and optionally using applied and / or incorporated electrical components, such as passive or active electrical Components. These structures can also be between the be accommodated individual layers, for example, the Height of the tracks and / or electrical structures in addition to the heights of the individual layers and Schichtverklebungen or layer connections in the dimensioning of the multilayer structure is to be considered.

Further preferred embodiments of the invention relate on the connection between the sensor element and the multilayer structure. A preferred form of the compound is adhesive bonding using at least one adhesive. This adhesive can be used as an insulating adhesive be designed or may also be wholly or partially conductive Be configured adhesive, for example, electrical connections between electrical structures on the multilayer structure and the Sensor chip produce. Alternatively or additionally also completely or partially a connection by means of conventional Connection techniques, for example by means of wire bonding done.

In such a connection by means of an adhesive technique, in many cases there is the difficulty that certain areas of the sensor element and / or the multilayer structure may not be contaminated with adhesive. This can be the case, for example, if, in the case of the mechanical connection of the sensor element to the multilayer structure, for example within the recess, only a part of the connection surface on the sensor element and / or within the Deepening may be fixed.

Accordingly is proposed in a gluing of the sensor chip with the Multilayer construction the multilayer construction with at least one flow barrier in the form of at least one recess in the multilayer structure equip. This recess can in particular in the form of at least one trench be designed and can prevent that, except the at least a partial area of the sensor chip or of the multilayer structure, on which the gluing is to take place, further surfaces be glued.

These Recess may, for example, at least one upper or lower layer of the multilayer structure partially or preferably fully enforce. This interspersed layer may, for example be a top layer of the multilayer construction, or, if the Sensor chip arranged in a recess of the multilayer structure is the layer of the multilayer construction which forms the bottom of the well forms.

The Recess may be configured for example as a free cut and, for example, again before connecting the individual Layers of multilayer construction in the corresponding layers be introduced, for example, again by appropriate Free-cutting processes, such as milling, sawing, Drilling, laser cutting or similar. The flow cutting edge can for example be designed as a trench and can basically be shaped as desired.

such Flow barriers are also in use in large-scale Scale economically feasible. The flow barrier can in the shape of the component, in particular to the sensor element, and be adapted to its positioning. The flow barrier is on a surface mount on the multilayer structure as a connection to a layer of an intermediate layer feasible.

The Flow barrier can be used in particular to prevent that due to a full-surface bonding me in other, unwanted surfaces mechanical Build up voltages in the sensor arrangement. Furthermore, the Contamination of sensitive areas by the adhesive and / or a Adhesion promoters are prevented. Especially with flat Connections is the partial land use over the amount of adhesive or the process parameters usually insufficiently manageable. The aforementioned flow barriers between the part surface as a connection surface and The other surfaces to be released define the surface geometry between the sensor chip and the connection surface.

In Another preferred embodiment, which also the improvement of bonding between the sensor chip and multilayer structure, the multilayer structure has at least one reservoir for receiving excess Adhesive when bonding the sensor chip with the multilayer structure on. This reservoir can be used in particular if the multilayer structure a recess for receiving the sensor chip having. In this case, the reservoir in particular within be arranged in this recess. The reservoir can, for example realized as a trench, bore or other groove or recording in the multilayer structure be, for example, in the bottom of the recess. Especially preferred It is there if the reservoir by over-sizing a recess for generating the recess in at least one deeper layer layer of the multilayer structure relative to Free cut in at least one higher layer layer of the multilayer structure is made. Such a reservoir leaves technically very easy to produce, as the free cuts in the individual layer planes, for example, before connecting the Layer layers are made for multilayer structure. For example uses a rectangular recess for receiving the sensor chip, so, for example, in the deepest layer plane, which still a free cut for generating the recess comprises, this free cut as a rectangle with at least one dimension higher Edge length as the or the free cuts in overlying Layer planes be configured. This way it forms in this layer plane around the sensor chip preferably a - for example circulating channel, in which, for example, liquid excess Dodge adhesive when inserting the sensor chip into the recess can. In this way, for example, dosage tolerances when dosing the adhesive before applying the sensor chip compensate. The tolerances of the sensor arrangements, which by such variations of the manufacturing process are conditional leave minimize itself thereby.

Brief description of the drawings

embodiments The invention is illustrated in the drawings and in the following Description explained in more detail.

It demonstrate

1A a perspective view of a portion of a sensor arrangement according to the invention;

1B a sectional view through the sensor arrangement according to 1A ;

2 a sectional view of an 1B alternative embodiment of a sensor arrangement;

3A a schematic perspective view of the bonding of a sensor chip on a multilayer structure with only partial bonding;

3B a sectional view of the arrangement according to 3A with a flow barrier; and

4 a sectional view of an 3B alternative embodiment of a sensor arrangement with a flow barrier in a recess for receiving the sensor chip.

In the 1A and 1B is a first embodiment of a sensor arrangement according to the invention 110 shown in partial view. It shows 1A a perspective view of a sensor carrier 112 the sensor arrangement 110 , whereas 1B a sectional view through this sensor carrier 112 along a virtual, in 1A with the reference number 114 designated section line shows. Both representations will be referred to below.

The sensor carrier 112 For example, it can be designed as a measuring wing, which protrudes into the flow of a fluid medium. The fluid medium is symbolic in both figures with the reference numeral 116 designated. For example, this fluid medium flows with one in the figures by the reference numeral 118 designated flow direction, mutatis mutandis, the flow rate can be vanishingly small to zero.

The sensor arrangement 110 also has a sensor chip 120 on. This sensor chip 120 For example, it can be configured as a silicon chip and can be mounted on a flowing fluid medium 116 assigning sensor surface 122 For example, have sensor structures. These sensor structures may, for example, have one or more heating resistors, one or more temperature sensors or the like. For example, the sensor chip 120 according to one of the sensor chips known from the prior art described above.

The sensor carrier 112 is according to the invention as a multilayer structure 124 designed. This multilayer construction can be as though 1B it can be seen, a plurality of substrate layers 126 include. These substrate layers may be made, for example, from substrates having plastic materials, ceramic materials or other materials or composite materials or combinations of materials. These can, for example, by means of adhesive layers 128 be glued together and can in different layer planes, for example, on each one or more surfaces of the substrate layers 126 , electrical structures 130 exhibit. These electrical structures 130 are in 1B merely hinted. These electrical structures 130 For example, tracks, feedthroughs, vias, contact pads, active and / or passive electrical devices, or other types of electrical structures, or combinations of the foregoing and / or other elements may be used to drive and evaluate circuitry 132 the sensor arrangement 110 wholly or partly in the multilayer structure 124 to realize. This control and evaluation circuit 132 can, for example, electrical components 134 include, which in 1B are also indicated only symbolically and which, for example, on the front 136 and / or on the back 138 of the multilayer construction 124 can be applied.

The sensor chip 120 is in the in the 1A and 1B illustrated embodiment in a recess 140 in the multilayer construction 124 arranged. This recess is as in 1B recognizable, in the form of rectangular cutouts 142 in the multilayer construction 124 designed. These free cuts 142 which are configured rectangular in the illustrated embodiment and substantially to the shape of the sensor chip 120 are adapted, for example, before connecting the individual substrate layers 126 to the multilayer construction 124 in these substrate layers 126 be cut. Subsequently, the substrate layers 126 according to the multilayer structure 124 be laminated.

Before inserting the sensor chip 120 can be an adhesive 144 into the depression 140 are introduced, that is, for example, on the bottom surface of the recess 140 , which through the top, not cut-free layer (in 1B the third layer, from the front 136 looked at). Then the sensor chip 120 on this glue 144 be applied so that the sensor chip 120 with the multilayer construction 124 is glued. Also, another type of connection technique may be provided. Furthermore, in addition to an adhesive 144 , Other substances are introduced, for example, a bonding agent.

Because the glue 144 during insertion of the sensor chip 120 must dodge the pages is in 2 one too 1B similar embodiment of the sensor arrangement according to the invention 110 shown, which allows or facilitates such evasion. This embodiment can basically analogous to the embodiment according to 1B be configured, so that in many parts to the above description can be referenced.

In contrast to the embodiment in 1B indicates the depression 140 in the embodiment according to 2 but a reservoir 146 to pick up excess adhesive. This reservoir is in the illustrated embodiment, for example, as a circumferential groove or as a circumferential cavity in, from the front 136 considered, second substrate layer 126 of the multilayer construction 124 built up. This cavity is created by the free cut in this second cut is dimensioned larger than the cutout in the overlying, the front 136 assigning first substrate layer 126 , Also other embodiments of the reservoir 146 are basically conceivable and can be used alternatively or additionally. For example, the reservoir 146 Ditches, gutters, grooves, holes or the like at the bottom of the depression 140 exhibit. The illustrated embodiment of the reservoir 146 according to 2 However, it is technically particularly easy to implement, since this requires only a larger dimensioning of the second free cutting before the substrate layers 126 to the multilayer construction 124 get connected.

It should be noted that the structure of the embodiments in the 1A and 1B as in 2 merely by way of example. So can the recess 140 , in contrast to the free cuts shown here in two substrate layers 126 , also comprise only one free cut in one layer or in more than two layers. Furthermore, from the 1B and 2 recognizable that the sensor surface 122 of the sensor chip 120 slightly set back from the surface of the front 136 , This is not mandatory. So it is also possible, for example, for fluidic reasons, this sensor surface 122 flush with the front 136 of the multilayer construction 124 embody.

Further preferred embodiments relate, as explained above, details of the bonding by means of the adhesive 144 , So are in the 3A and 3B as in 4 shown two embodiments, which no full-surface adhesion of the sensor chip 120 with the multilayer construction 124 include, but only a partial bonding.

It shows 3A a perspective view of a third embodiment of a sensor arrangement 110 with Teilverklebung, whereas 3B again, similar to 1B , a sectional view along the section line 114 in 3A shows.

This embodiment takes into account the fact that different sensor arrangements 110 , in particular sensor arrangements with sensor chips 120 in the form of micromechanical sensors, the introduction of mechanical stresses and the contamination of sensitive areas by the adhesive 140 and / or a bonding agent is not allowed.

Especially with area connections, the partial land use is over however, the quantity and / or the process parameters are insufficient manageable.

Therefore, in the embodiment according to the 3A and 3B only a partial area 148 as a usable area and as a connection surface with the multilayer structure 124 bonded. The remaining areas of the sensor chip 120 On the other hand, they are self-supporting and not on the sensor carrier 112 tethered.

To prevent, already when applying the adhesive 144 and / or later when placing the sensor chip 120 , Adhesive 144 on the rest, outside the connection area 148 lying surfaces of the sensor element 120 is in the in 3A and 3B illustrated embodiment, a flow barrier 150 in the form of a ditch 152 intended. This flow barrier 150 is for example by a free cut in the top and / or in further substrate layers 126 of the multilayer construction 124 realized. This free cut can be, for example, again before connecting the substrate layers 126 to the multilayer construction 124 verzeugen. The flow barrier 150 acts as yield point for the adhesive 144 and / or the bonding agent. The width and / or the other dimensions such as the depth, the flow barrier 150 can be adapted to the boundary conditions, for example the dimensions of the sensor chip 120 , the amount and / or the viscosity of the adhesive 144 or similar boundary conditions. The width of the flow barrier 150 For example, it can be 0.7 mm and its depth 0.3 mm. However, other dimensions are possible in principle. If the width is at a given thickness of the substrate layers 126 can not be realized at a sufficient distance, can be further substrate layers 126 of the multilayer construction 124 use. Generally, the at least one trench should 152 the flow barrier 150 for example, parallel to the desired boundary lines of the connection surface 148 run.

While the embodiment according to the 3A and 3B a sensor arrangement 110 shows in which the sensor chip 120 on the front 136 of the multilayer construction 124 is applied, shows 4 an analogous embodiment, which is similar to the embodiment in the 1A and 1B is designed. Again, in this embodiment, a recess 140 in the form of free cuts 142 in the uppermost substrate layers 126 of the multilayer construction 124 intended. For the possible embodiments of this depression 140 can be made to the description of the above embodiments.

Analogous to the embodiment in the 3A and 3B however, is again only a partial area 148 as a bonding surface via an adhesive 144 optionally with a primer, to the bottom of the well 140 tethered. Analogous to the embodiment in the 3A and 3B is again at least one flow barrier 150 provided, for example, again in the form of a trench 152 which, for example, at the bottom of the recess 140 can be provided and which prevents adhesive 144 and / or adhesion promoter on surfaces of the sensor chip 140 and / or multilayer construction 124 reaches where they are undesirable. The flow barrier 150 can also be used, for example, with one or more reservoirs 146 combine, for example, the in 2 shown embodiment of a reservoir 146 , In this way, the faces can be 148 exactly define what should be used as a connection surface, with excess adhesive 144 in the at least one reservoir 146 can escape without getting into unwanted areas. In this respect, the embodiment according to the invention offers a high degree of process stability and reproducibility of the sensor arrangements produced therewith 110 ,

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - DE 19601791 A1 [0002]
• - DE 19524634 A1 [0003]

Claims (10)

Sensor arrangement ( 110 ) for determining at least one parameter of one with a flow direction ( 118 ) flowing fluid medium ( 116 ), in particular a flowing through a flow tube intake air mass of an internal combustion engine, wherein the sensor arrangement ( 110 ) at least one sensor chip ( 120 ) for determining the at least one parameter with at least one sensor surface ( 122 ), wherein the sensor arrangement ( 110 ) a sensor carrier ( 112 ), wherein the sensor chip ( 120 ) in such a way with the sensor carrier ( 112 ), that the sensor surface ( 122 ) of the fluid medium ( 116 ) is flowed over, wherein the sensor carrier ( 112 ) at least partially as a multilayer structure ( 124 ), wherein the multilayer structure ( 124 ) at least two substrate layers ( 126 ) and electrical structures ( 130 ) in at least two different layer levels of the multilayer structure ( 124 ) having. Sensor arrangement ( 110 ) according to the preceding claim, wherein the sensor chip ( 120 ) with the multilayer structure ( 124 ) on at least one partial surface ( 148 ) is glued, wherein the multilayer structure ( 124 ) at least one flow barrier ( 150 ) in the form of at least one recess, in particular in the form of at least one trench, in order to prevent adhesion of further surfaces. Sensor arrangement ( 110 ) according to the preceding claim, wherein the recess has at least one upper or lower layer of the multilayer structure ( 124 ) completely interspersed. Sensor arrangement ( 110 ) according to one of the preceding claims, wherein the sensor chip ( 120 ) in a depression ( 140 ) of the multilayer structure ( 124 ) is arranged. Sensor arrangement ( 110 ) according to the preceding claim, wherein the recess ( 140 ) at least one free cut in the uppermost substrate layer ( 126 ) of the multilayer structure ( 124 ) and preferably in at least one further substrate layer ( 126 ) of the multilayer structure ( 124 ). Sensor arrangement ( 110 ) according to one of the two preceding claims, wherein the sensor chip ( 120 ) flat on a receiving surface of a deeper layer of the multilayer structure ( 124 ) is fixed. Sensor arrangement ( 110 ) according to one of the preceding claims, wherein the multilayer structure ( 124 ), in particular a depression ( 140 ) for receiving the sensor chip ( 120 ), at least one reservoir ( 146 ) for receiving excess adhesive when sticking the sensor chip ( 120 ) with the multilayer structure ( 124 ) having. Sensor arrangement ( 110 ) according to the preceding claim, wherein the reservoir ( 146 ) by over-dimensioning a free-cutting in at least one lower-lying substrate layer ( 126 ) of the multilayer structure ( 124 ) relative to at least one higher substrate layer ( 126 ) of the multilayer structure ( 124 ) is generated. Sensor arrangement ( 110 ) according to one of the preceding claims, wherein the sensor surface ( 122 ) substantially flush with a surface of the multilayer structure ( 124 ) is arranged. Sensor arrangement ( 110 ) according to one of the preceding claims, wherein the sensor arrangement ( 110 ) an electrical control and evaluation circuit ( 132 ) for controlling and / or evaluating the sensor chip ( 120 ), wherein the drive and evaluation circuit ( 132 ) at least partially in the multilayer structure ( 124 ) is integrated.