DE102008013580A1 - Chip arrangement for multi-layer floor cover for controlling of e.g. suction robots, has reception and transmission unit provided for contactless reception of data and for transmission of data from sensors and chips to evaluation unit - Google Patents

Abstract

The arrangement has a power supply provided for sensors (11) and chips (15). An arrangement for contactless energy supply of an upper visible layer (2) of a floor cover (1) is formed in an underlayer (3), which is moved independent of the visible layer. A reception and transmission unit is provided for contactless reception of the data and for transmission of the data from the sensors and the chips to an evaluation unit. The sensors are arranged in planar intermediate spaces between the chips. The visible layer and the underlayer are designed for capacitive energy transmission.

Description

The The invention relates to an arrangement of chips connected to sensors in a multi-layered floor covering, the floor covering being in a visual position and one of them independently layable underlay, which continues to provide a power supply the sensors and chips is provided and in addition data can be transmitted to an evaluation unit are.

through Such arrangements include, for example, access controls in Entrance areas possible. The signals of over the applied flooring sensitized sensors are hereby transmitted to a preferably external evaluation. The flooring is further preferred here with a network of sensors and provided with these sensors connected chips. The transmission the data to an evaluation unit, for example, in the area a marginal edge side contacting surface of the floor covering. The view of the multi-layer flooring decreases the sensors and the associated Chips on and is on the visible side with a pile or hard flooring Mistake. About that can out provided by sensors and chips floor coverings of the type in question also for controlling, for example, autonomously operating suction devices, so-called Suction or sweeping robots serve.

in the With regard to the known prior art is a technical Problem of the invention seen therein, an arrangement of the subject in question Kind in manufacturing technology simple way in particular as regards the power supply of the sensors and chips as well as in terms of the transmission the data continues to improve.

These Problematic is first and substantially solved by the subject-matter of claim 1, wherein it is focused on that in the pad one for contactless Energy supply of the visual position serving arrangement is formed and further means are provided for contactless reception of the data and for forwarding the data to the evaluation unit. according to This design is a multi-layer flooring in question standing type given by a simplified installation distinguished. About that In addition, the effort to produce the flooring is simplified, there an elaborate Wiring of the sensors and chips in the viewing position to power them and for data transmission account for an evaluation. The power supply as well as the data transmission is only achieved by superimposing of pad and visual position, the pad on the one hand to a Supply source, such as a power supply unit operated by a power supply and is further connected to the external evaluation unit. For this purpose, the pad is further preferably designed over a large area, further the entire floor of a room or large areas of a room integrally covering. For example, the pad can be made in one piece with an area of cover several square meters. The view position, however, can be the embodiment of several, compared to the visual position smaller-scale individual elements exist, such as in the form of carpet or hard floor tiles. Next is in particular by the contactless design of the power supply and the Data forwarding simplifies the laying of flooring. The Visibility, for example in the form of flooring tiles can without consideration any plug contacts or without consideration of conductive connections free be laid on the base. So you can continue according to the in use arrangement superposed surfaces of visual position and surface be made non-conductive. In addition, by the inventive solution, for example a change of, for example, a defective visible side having flooring tiles without electrical contacting measures possible.

in the Further features are described, preferably in combination have meaning with the features of claim 1, but in principle also with only some features of claim 1 or alone meaning can have.

Thus, it is provided in a development of the subject invention that the visual position is formed multi-layer, wherein in a first position, the chips and in the areal spaces between the chips sensors are arranged and a second layer of the visual position is connected to the first layer, which second layer is designed for contactless energy transfer and data transmission with the pad. According to this embodiment, a sandwich-like arrangement of the relevant electronic components is achieved. Accordingly, a simple contacting of the chips or ICs and beyond the sensors can be achieved, which greatly simplifies the production of such a fitted floor covering or such a fitted visual position. The sensors are electrically connected to the chips in the first position of the visual position. For the power supply of the sensors and chips and for data transmission of the signals emitted by the sensors or chips, the second layer of the visual position, which is further firmly connected to the first layer, for example, adhesively bonded and beyond electrically connected. In a further embodiment, the chips and the sensors receiving the first layer may be formed in two layers, wherein in an upper, the visible side facing the layer facing the sensors and arranged in a layer underneath the chips are arranged, further this two layers firmly mitein connected to other. In this context, it is further preferred that interspaces between the chips form an insulating layer. This layer is correspondingly for example in the form of an insulating fabric with recesses for the chips. The height of the insulating layer receiving the chips is adapted to the chip height is accordingly about 1 mm to 3 mm, further about 2 mm and consists for example of polyurethane or polyamide material, further example of polypropylene as an insulating, pressure-resistant needle felt. In addition, the multi-layered visual position has a further floor covering layer connected to the sensor-receiving layer and via this layer connected to the chip-receiving layer, for example in the form of a carpet floor layer. This can also be single-layer, the sensors and chips formed receiving in a further embodiment. Sensors and optionally chips are further embedded in such a configuration, for example, within the usual carpet backing, which carpet back then forms the first layer of multilayer vision in the context of the invention and is firmly connected to the second designed for contactless power transmission and data transmission.

A possible Embodiment of the contactless energy transmission provides that the visual position and the underlay for capacitive energy transfer are designed. Further preferred are the visual position and the base for inductive energy transfer designed. As an alternative, the energy transmission can also be effected by means of far-field transmission be reached, so on, for example by means of WLAN instead of for near-field capacitive or inductive energy transmission.

The contactless data transmission from the sensors or chips to the evaluation unit is in a preferred Embodiment by means of modulation via the energy transmission path.

The Underlay of multilayer flooring forms an energy layer from or is provided with such. This energy layer is in electrical connection with a power supply or a the power supply of the energy layer controlling unit which can continue to accommodate the same evaluation unit. This document is in a development as such aufwickel bar, so further in particular windable into a coil and beyond on on Length or Width can be cut off.

The Energy layer, if appropriate, in a preferred embodiment interconnected, conductive Coils on. These are used in particular for inductive energy transfer. This conductive Coils are interconnected so electrically that a lengthening of the Pad to the desired Measure in predetermined by the coil sizes Size grid dimensions is possible. In an alternative embodiment, the energy layer optionally interconnected, meandering tracks on.

The provided conductive Coils or meander-shaped conductor tracks in the energy layer are in a further embodiment of the subject invention linearly connected in series, with several lines running parallel the entire area Cover the pad.

In the visual position is provided an energy layer. This is in the sense the invention, the second layer of the visual position. This energy layer has a dimensional stability in the plane, which is adapted to the above, stuck with the Energielayer connected first position of the visual position, that is adapted to the carpet layer comprising the sensors and chips. Corresponding the energy layer has a stiffness adapted to the first layer on.

Of the Energielayer points to the contactless power supply and the contactless data transmission interconnected, conductive Coils on, this more preferably in the context of a capacitive power transmission and a data transmission by modulation. Alternatively, the energy layer also with each other connected, meandering tracks exhibit.

at an embodiment of the sensors as capacitive sensor surfaces, these can for energy transfer be used by this designed loop-shaped or coil-shaped are. In such a proposed embodiment, the sensors preferably in the second position of the visual position, that is in the Energy layer arranged.

to optimal energy transfer and above addition to data transmission are the energy layer, ie the underlay and the energy layer, this means the second layer of the visual position substantially the same shape, wise correspondingly shaped conductive coils or meandering tracks on. When using loop-shaped trained sensors in the energy layer is adapted to the loop shape to the shape of the coils in the pad. This creates the energy layer in the pad an electromagnetic alternating field, wherein the here over in the energy layer layer of the view layer arranged coils induction loops molding.

In a further advantageous embodiment of the subject invention, it is provided that the second, the energy layer having layer is a film, whereby a protection against rising Moisture or from the top acting liquid is given. Preference is given here to a vapor-permeable design of the film, so that moisture can escape from the bottom up. The permeability is achieved for example by (micro) perforation or a fine hole pattern.

Around while Measurements, or in moments without power supply a voltage for the chip or IC to deliver, the chip has an energy storage, so for example in the form of a capacitor. This proves in particular then an advantage, if not a continuous energy transfer should take place, for example, for reasons of energy conservation. Furthermore is at least over one dependent on the energy storage Period of freedom where.

The arrangement is operated in the range of the safety extra-low voltage, that is to say below 50 volts, so further preferably with a voltage of 5 to 24 volts. The sensors used are capacitive, motion-sensing or temperature-dependent sensors. Further alternatively, a non-contact measurement by means of electromagnetic fields, so on, for example, using appropriately designed chips or IC's (integrated circuit on board bonded ICs customized), with which areas of, for example, 1 mm ² to 1 cm ² can be detected.

Further, in one embodiment, two to eight, preferably four sensors are provided per chip, each sensor covering an area of 10 cm × 10 cm up to 50 cm × 50 cm. For example, four to ten sensors or one to twenty-five chips are respectively positioned in the arrangement per m ² .

below the invention with reference to the accompanying drawings, which only embodiments represents, closer explained. It shows:

1 a floor covering of the type in question in a perspective exploded view;

2 a schematic cross-sectional view of the floor covering;

3 the section according to the line III-III in 2 through a lower layer of a visual position of the floor covering;

4 one of the 3 corresponding sectional view, however, concerning an alternative embodiment;

5 a schematic circuit arrangement for displaying the contactless power supply and contactless data transmission between a viewing position and a base of the floor covering;

6 a schematic arrangement of a chip and associated sensors for placement in the viewing position, relating to a further embodiment;

7 a schematic representation of the arrangement of the visual position and base in a further embodiment;

8th the schematic zoom out of the area VIII in 7 ;

9 the schematic section along the line IX-IX in 8th by a capacitive sensor of the visual position and associated coils of the substrate;

10 one of the 7 corresponding representation, however, concerning an alternative embodiment;

11 a schematic plan view of the pad with indicated raster-cut lines.

The flooring shown 1 is designed essentially two-ply, so with an upper viewing position 2 and a pad 3 ,

The underlay 3 is opposite the view 2 area designed larger, so on, if necessary, the floor to be occupied 4 over the entire surface, one-piece covering. The view 2 on the other hand, in the illustrated exemplary embodiment, the surface area is many times smaller than the base 3 chosen, thus representing a flooring tile. By juxtaposition of several such not connected to each other, forming the view layer flooring tiles is the floor 4 or the underlying document 3 fully coverable.

The view 2 is not, especially not manufacturing side with the pad 3 connected. Accordingly, the visual position 2 loose on the pad 3 to be in the mood. However, it is possible in this context, for example, a selective, preferably detachable determination, for example by gluing.

The according to the floor surface by cutting customizable pad 3 is, forming an energy layer S, a film layer. On this are connected in series, conductive coils 5 applied, so for example printed. These rows of coils 5 are at the edge of the base 3 led to not shown contacting zones, via which the coils 5 energized who the. The energy supply 6 is accordingly outside the pad 3 provided, for example in the form of a mains-powered low-voltage control unit 7 (see. 5 ).

The view 2 is essentially formed two layers, wherein a first upper layer forming the visible side in the illustrated embodiment, a carpet layer 8th is. This has a pile in the usual form 9 and a back coating 10 on. In the latter, sensors are in the illustrated embodiment 11 added. In the figures, sensor surfaces are capacitive sensors 11 shown.

The carpet layer 8th lies completely on a in 1 not shown insulation layer 12 on. insulation layer 12 and carpet layer 8th are firmly connected and together form the first location 13 the viewpoint 2 , In the isolation situation 12 are recesses 14 for chips 15 intended. The height of the insulation layer 12 is adjusted to the height of the chips 15 , corresponds to about 2 mm.

The recesses 14 for the chips 15 are placed so that the chips are in place 15 four areal adjacent sensors 11 to contact. Accordingly, a chip is used 15 for signal utilization of four adjacent sensors 11 ,

The second location 16 the viewpoint 2 is an energy layer L. This is designed as a film, here as a vapor-permeable film, the first layer 13 with the second layer 16 is firmly connected.

The energy layer L has corresponding to the energy layer S in the pad 3 electrically conductive coils 17 on. These too can be on the second layer 16 be printed. The spools 17 the second location 16 are also connected in series one behind the other and their size and arrangement adapted to the size and arrangement of the coils 5 the underlay 3 ,

In 3 are just the coils 17 the viewpoint 2 shown. The same arrangement and design of the coils can also be found in the pad 3 again. This also applies to the in 4 illustrated alternative embodiment of the energy layer L or the energy layer S, here meander-shaped interconnects 18 are applied.

The power supply of the chips 15 and the sensors 11 takes place without contact by the selected non-contact arrangement of pad 3 and sight 2 , About the external energy supply 6 gets into the underlay 3 lying coils 5 generates an alternating electromagnetic field. The coils arranged above 17 in sight 2 or in the energy layer L act in the manner of induction loops, whereby an inductive transmission of energy is achieved. The electric with the coils 17 contacted chips 15 become so energized. As an alternative to inductive transmission, the energy transmission can also be capacitive or by far-field transmission.

The evaluation of the sensor signals takes place in the associated chips 15 which modulates signal results via the contactless power supply device to the outside via the contact zones to the control unit 7 be directed. One in the control unit 7 intended evaluation unit 19 processes the signals transmitted by modulation (see also schematic diagram in 5 ).

Alternatively to the embodiment of the visible layer side energy layer L with coil 17 or meandering routed tracks 18 can also use the capacitive sensor surfaces 20 the sensors 11 be used for contactless energy transfer. These sensor surfaces are as in 6 shown schematically formed as loops and form in the context of energy transfer, the induction loops.

In every chip 15 is still an energy storage 21 integrated or assigned to this. This is, for example, a capacitor that provides sufficient voltage for the chip in times when there is no power supply 15 supplies. Especially in connection with sensor surfaces 20 , which are used for energy transmission, proves this arrangement of an energy storage 21 advantageous since, in a further preferred embodiment, the sensor surfaces 20 be used alternately for energy transfer and for sensory detection, so that no energy transfer takes place during sensory detection.

7 shows a schematic representation of a visual position 2 and a cover for this arranged underlay 3 , One chip at a time 15 are four capacitive sensors 11 assigned. The sensor surfaces each have a substantially square outline, with an edge length of 50-500 mm, preferably 250 mm. Correspondingly, four to four hundred, preferably sixteen, sensor surfaces account for every square meter of floor covering area. The selected size of the sensor surfaces depends on the desired resolution, with many smaller sensor surfaces leading to a higher resolution.

The spools 5 the underlay 3 are arranged meander-shaped in the illustrated embodiment, so on each starting from along a peripheral edge of the pad 3 running supply lines 22 , These are outside the Un terlage 3 to the power supply 6 connected.

In the illustrated embodiment, at right angles to the supply lines 22 Starting from the meandering shaped coils extend 5 each over two adjacent pairs of sensors 11 which pairs of sensors each one chip 15 assigned.

The capacitive sensors 11 are further designed so that they also serve as receiving antennas for the inductive power supply alternately.

Through the respective connection of the coils 5 to the supply lines 22 is a cut of the pad 3 in the extension direction of the supply lines 22 considered, so on in the distance range of two coils 5 to each other.

In 7 is shown a coupling of antenna and power supply. The evaluation unit 19 containing a demodulator, tells that about the coils 5 and the supply line 22 transmitted data signal for further processing.

Alternatively, as further in 10 represented, a separation of antenna and power supply to be achieved, including the evaluation 19 or the demodulator has a separate from the power supply antenna network. This consists essentially of a parallel to the supply lines in the illustrated embodiment 22 extending signal line 23 of which in the illustrated embodiment in plan view at right angles antenna cables 24 going out in the areas between two adjacent coils 5 the power supply einliegen.

According to the pitch grid of the coils 5 the power supply is also the signal line 23 with the antenna cables 24 to the desired length adjustment of the pad 3 Can be shortened without interruption.

8th shows in a schematic single representation of a capacitive sensor 11 the viewpoint 2 , This sensor 11 is crossed in the representation of three, from coils 5 the underlay 3 resulting lines, over which, as in 9 shown schematically, induction fields F for contactless power supply of the sensor 11 and the connected chip 15 be generated.

For transmission of the assigned chip 15 recorded data affects the sensor 11 by the coil-shaped arrangement of the sensor track as an antenna for contactless data transmission to the supply lines 22 Alternatively to the according to the embodiment in 10 separate antenna cable 24 ,

The meandering, on supply lines 22 connected coils 5 according to the embodiment in 7 are to a segment 26 summarized. A variety of such segments 26 forms in Nebeneinanderanord voltage, the energy layer S, wherein further the supply lines 22 the segments 26 over ground supply lines 25 to the power supply 6 are connected.

In addition to by the spacing of the coils 5 within a segment 26 mutually given screening (represented by the lines a in 11 ) for uninterrupted reduction of the energy layer S in the extension direction of the supply lines 22 arise between the segments 26 perpendicular to the grid lines a extending grid lines b, which is a reduction of the energy layer S in the extension direction of the basic supply line 25 allows.

According to the proposed embodiment for contactless power supply of the visual position 2 as well as the contactless data transmission from the visual position 2 to the evaluation unit 19 is a flooring 1 created, which can be installed in the simplest way. It requires no electrical contact of visual position 2 and underlay 3 , Next is in training the view 2 as a tile-like laying floor covering, for example, a defective tile exchangeable without effort.

In addition, the visual position 2 without changing the pad 3 against a different view 2 be exchanged, which is particularly related to in the visual position 2 arranged chips 15 proves advantageous which chips 15 Information about the visibility 2 For example, the type of flooring and / or cleaning information that is attached to the flooring 1 cleaning, autonomously operating suction device to be transmitted.

Furthermore, viewing layer sections with different sensors and / or different chips, possibly defining regions of the surface, can be defined in the simplest way, optionally on a continuous base 3 be positioned.

All disclosed features are (for itself) essential to the invention. In the disclosure of the application will hereby also the disclosure content of the associated / attached priority documents (Copy of the advance notice) fully included, too for the purpose, features of these documents in claims present Registration with.

1

Flooring

2

Sichtlage

3

document

4

floor

5

Do the washing up

6

power supply

7

control unit

8th

carpet Exposure

9

pile

10

backing

11

sensors

12

insulation layer

13

first location

14

recesses

15

crisps

16

second location

17

Do the washing up

18

conductor tracks

19

evaluation

20

sensor surfaces

21

energy storage

22

supply lines

23

signal line

24

aerial cable

25

Basic supply line

26

segment

F

induction hobs

L

power layer

S

power coating

a

grid line

b

grid line

Claims (17)

Arrangement of with sensors ( 11 ) connected chips ( 15 ) in a multi-layer flooring ( 1 ), the flooring ( 1 ) from a viewpoint ( 2 ) and an independently applicable document ( 3 ), wherein further a power supply of the sensors ( 11 ) and chips ( 15 ) and in addition data to an evaluation unit ( 19 ), characterized in that in the base ( 3 ) one for non-contact power supply of the visual position ( 2 ) arrangement is formed and further means are provided for contactless receiving the data and for forwarding the data to the evaluation unit ( 19 ). Arrangement according to claim 1 or in particular according thereto, characterized in that the visual position ( 2 ) is formed in multiple layers, wherein in a first position ( 13 ) the chips ( 15 ) and in the areas between the chips ( 15 ) Sensors ( 11 ) and a second layer ( 16 ) the visual position ( 2 ) with the first layer ( 13 ), which second layer ( 16 ) for contactless energy transmission and data transmission with the support ( 3 ) is designed. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the visual position ( 2 ) and the base ( 3 ) are designed for capacitive energy transfer. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the visual position ( 2 ) and the base ( 3 ) are designed for inductive energy transfer. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the energy transfer by far-field transmission is reached. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the contactless data transmission achieved by modulation. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that in the base ( 3 ) an energy layer (S) is provided. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the energy layer (S) interconnected, conductive coils ( 5 ) having. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the energy layer (S) interconnected, meander-shaped conductor tracks ( 18 ) having. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that in the visual position ( 2 ) an energy layer (L) is provided. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the energy layer (L) interconnected, conductive coils ( 17 ) having. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the energy layer (L) interconnected, meander-shaped conductor tracks ( 18 ) having. Arrangement according to one or more of the preceding claims or in particular there according to, characterized in that the energy layer (L) by loop-shaped sensors ( 11 ) is formed. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the energy layer (S) and the energy layer (L) formed substantially gleichgeformt are. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the second layer having the energy layer (L) ( 16 ) is a foil. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the film is vapor-permeable. Arrangement according to one or more of the preceding claims or in particular according thereto, characterized in that the chip ( 15 ) an energy store ( 21 ), for powering the chip ( 15 ) and / or the sensor ( 11 ).