DE102006030081A1 - Electrical module unit for sensor, e.g. inertia sensor, has two spraying bodies formed, so that each body surrounds number of conduction cables, and pressing grids freely running between spraying bodies and embedded in spraying bodies - Google Patents

Abstract

The unit has an integrated circuit with a die that is attached on a surface area. Two spraying bodies (30a, 30b) are formed such that each body surrounds a number of conduction cables (20). The integrated circuit is embedded in one of the spraying bodies, where the spraying bodies are formed at a distance from each other. Pressing grids (16) freely run between the spraying bodies and are embedded in the spraying bodies. Independent claims are also included for the following: (1) a sensor having an electrical module unit (2) a method of manufacturing an electrical module unit (3) a method of manufacturing a sensor having an electrical module unit.

Description

The The invention relates to a sensor and a method for the production a sensor.

One Sensor comprises a sensor circuit as the actual sensor element for determining a sensor value. Depending on the application must be in a sensor, the sensor circuit suitably positioned and electrically be connected.

At the Sensor according to the present Invention, the sensor circuit is part of an electrical module unit with an at least partially flat conductor grid with a number of wire strands and at least one surface area, on which an integrated sensor circuit is applied as Rohchip and is electrically connected to the cable strands.

The DE-A-198 04 170 shows an electrical modular unit and a corresponding one Production method. The production takes place by formation of the leadframes one piece as thin-walled Sheet metal stamping and the leadframe is then glued to a flat plastic carrier. Subsequently The leadframe is equipped with components, with capacitors, resistors, electrolytic capacitors and an ASIC soldered on become.

The Module unit can be used as a buckle sensor or inertial sensor be educated. A sensor is made by the module unit in a housing is attached. The housing can be overmoulded or filled with plastic compound.

Further is the formation of electrical module units by means of printed circuit boards known, on which strands of wire run and discrete electrical components as well as integrated Circuits hereby are electrically and mechanically connected.

For sensors, In particular magnetic sensors, is for many uses - in particular in the motor vehicle sector - one high mechanical strength required. In addition, the Sensor elements frequently be positioned very accurately. Therefore, exact positioning and exact dimensions required.

These Requirements can in particular by printed circuit boards not readily with the required Accuracy met become. In addition, the module units and sensors produced in this way are often relatively expensive or it is a complicated additional electrical wiring necessary.

It It is an object of the invention to provide a sensor that can be produced inexpensively is and where the actual sensor element accurately positioned is.

These Task is solved by a sensor according to claim 1 and the manufacturing method according to Claim 24. Dependent claims refer to advantageous developments of the invention.

at the sensor according to the invention is an electrical modular unit with a - at least in sections - flat Conduction grid made of a conductive Material, for example, as a thin Sheet metal punched part provided. The shape of the grid can be in Principle be arbitrary. The cable strands serve as electrical Connections between the elements realized by the module Circuit. additionally serve the cable strands also for mechanical cohesion of the module.

in this connection Explicitly refers to any form of insulator substrate waived. The cable strands of the line grid - before the mounting on the sensor - free.

Next a number of wire strands is at least one surface area provided on which a Rohchip (Die) of an integrated sensor circuit is applied. That is, it does not become one in one's own, separate one casing packed with connecting legs integrated circuit, but only the functional part thereof, namely the - for example made of silicon - raw chip applied and fixed, for example glued. This one gets electric with the cable strands connected, for example. About Bond wires or over others known joining techniques. The sensor circuit measures a physical Size, eg. in the case of a preferred Hall ASIC, a magnetic field, and outputs this as the electrical sensor value.

At the cable strands Discrete electrical components are attached, for example, resistors, (electrolytic) capacitors, Coils, transistors, diodes etc. Together with the integrated circuit form the electrical circuit of the module. Any necessary Circuitry of the integrated circuit may be through the device or the components are already integrated in the module, so that additional Wiring is reduced or eliminated.

Such an electrical modular unit has significant advantages in the production. Although it is in the raw state, ie quite sensitive before installation in the sensor, but also very cost-effective to produce in large quantities. For the Insert in a sensor, it can be easily formed in the desired manner, namely by appropriate bending of the line grid. By using a Rohchips a particularly simple structure, low cost and small size can be achieved.

The Production of a modular unit is preferably carried out using the leadframe technique. Here are from a strip element of conductive material (preferably by punching) formed a number of conductor grids. On surface areas This wiring grid is a Rohchip an integrated circuit applied and electrically contacted, for example by bonding. discrete Components are glued example. With conductive adhesive. Being free dancing removed further parts of the strip element, so that only the cable strands needed to form the electrical circuit remain and the module unit is released from the strip element.

A Such electrical module unit according to the invention with a Basic element connected to a sensor. At the primitive can it may, for example, be a housing and / or carrier element. It can act as a carrier for the serve electrical module unit and / or this in the manner of a housing completely or partially cover. The basic element can be one-piece, two-piece or be multi-part. It can be a mounting device (eg Anschraubhülse) for Assemble the sensor at its place of use.

According to the invention the basic element at least partially made of plastic. The attachment the modular unit on the base element takes place in such a way that the module unit with the provided thereon integrated sensor circuit on Grundele element embedded in the plastic material. This is preferably done in the injection molding process. Thus, the basic element can be created entirely or partially by injection molding with the module unit embedded. It is preferred provided the primitive, then the module unit on the primitive positioned and preferably completely encapsulated there. So will the Components of the module unit, i. Raw chip, discrete component and strands of wire, fixed in position to each other and in their position on the base element. By embedding in the plastic material they are protected from external influences. For the overmolding The module unit is a thermoset preferred.

One Such sensor with basic element and module unit injected thereon let yourself especially inexpensive finished. By dispensing with any insulator carrier (such as For example, a printed circuit board) are the number of processing steps reduced to a minimum. Nevertheless arises - after the embedding of the module - such a mechanically very resistant, exact working sensor.

The discrete components can be wired components or SMD components. The latter will preferably with the strands of wire over one Glued conductive adhesive. Zer recording and better retention of the discreet Components can Parts of the line grid bent out of the plane of the strip element be so that they projections - retaining tabs - for the discrete Form components.

The Contacting of the integrated circuit with the line grid is preferably done by bonding. When injecting the module unit on the sensor also the bond wires in the Embedded plastic material of the base element. At the wire mesh the module unit can several surface areas for applying a plurality of integrated circuits be.

The Basic element preferably has a plug connection. The arranged on the base module unit is then electrically with connected to the plug connection.

According to one Development of the invention are flat conductor elements at least partially embedded at the base element and connect the module unit with the plug connection.

By the embedded in plastic, preferably injected flat Conductor elements is a connection in a particularly simple manner from the plug connection to Module unit created. This can be the geometric conditions Bear in mind, wherein the conductor elements one or more angled are. Such a sensor is particularly advantageous in the production, because the basic element with the conductor elements cost and manufactured exactly by injection molding and then with the module unit can be connected.

According to one Development of the invention is at least one of the flat holder elements welded to at least one of the cable strands of the line grid. Prefers are all Conductor elements welded to corresponding cable strands, so that the line grid on the one hand safely contacted electrically and on the other hand by the firmly embedded conductor elements also mechanically securely connected is.

With regard to the material for the conductor grid, it has been found that available materials made of copper with an Sn-containing tarnish protection on the surface, in particular during welding, can be problematic. Therefore, it is preferred that the conductor grid be made of copper or a copper alloy (preferably with more than 50% copper). exists and has a Sn-free tarnish protection. The tarnish protection preferably comprises one or more layers of palladium, gold and / or silver. In this case, the lower layer is preferably made of palladium with a layer thickness of 0.2 μm-5 μm, preferably 0.5 μm-2 μm. The outermost layer is preferably thinner, for example as a gold layer with a layer thickness of 10 nm-1 μm, preferably 50 nm-0.5 μm. Between the copper material and the tarnish protection, a barrier layer of nickel (layer thickness 0.5-5 microns, preferably 1.5-3 microns) may be provided.

According to one Development of the invention differ in the basic element Embedded flat conductor elements from the grid of the module unit in that they are considerably thicker, preferably at least twice as thick as the strands of wire of the conductor grid. The flat conductor elements are preferred a thickness of 0.3-1.2 mm more preferably 0.5-1 mm. You can, for example, made of brass or bronze (or an alloy with predominant, i.e. more than 70% share). In this case they are particularly good with the copper conductor grid with Sn-free tarnish protection to weld. The conductor elements can protrude in the plug as contacts, so that they simultaneously contacts and form lines.

According to one Development of the invention, the line grid of the module unit at least one hole on and at least one pin of the base element grabs the hole. This is a particularly simple positioning and mechanical support of the module allows. The hole can be in the wire mesh with very high precision relative to the components, in particular the integrated sensor circuit be introduced. Its relative positioning, in particular thus to the actual sensor element, is very accurate. At a corresponding Tenon of the primitive it can be easily positioned and center yourself. Such a holder can in particular in conjunction with other fasteners a simple and accurate attachment allow the module to the primitive. In particular, here at the mounting an initial positioning and provisional Bracket before attaching other fasteners (welding, injection molding, etc.).

A especially good positioning is through several holes and reached corresponding pin. The mechanical fixation can advantageously be improved by retaining tabs that in at least one of the holes protrude. When a pin penetrates, the retaining tabs deform, so that one Pinching and blocking effect occurs. This can be especially good as a temporary fixation before the subsequent Serve overmold.

Often the actual must Sensor element placed in an exposed position. To make this easy guaranteed can be, it is preferred that the basic element is an elongated Carrier body has, at the end of the integrated sensor circuit is arranged. The line grid is in this case bent so that at least a portion of the line strands along the Carrier body run. A such arrangement is especially for Magnetic sensors advantageous in which the integrated magnetic sensor then arranged frontally at the end.

following Be exemplary embodiments of Invention described in more detail with reference to drawings. In the drawings demonstrate:

1 a schematic representation of an apparatus for producing an electrical assembly;

2 in perspective view of a strip material as the starting product of the manufacturing process 1 ;

3 in perspective view of the strip material 2 after a punching step;

4a - 4e in perspective view in each case a first embodiment of an element according to the processing steps of the method according to 1 ;

5a - 5c in plan view alternative embodiments of an electrical assembly;

6a . 6b perspective views of a stamped grid and a preform for the production of a first embodiment of a sensor;

7 an exploded perspective view of the first embodiment of a sensor;

8th a perspective view of the sensor 7 ;

9 a longitudinal section of the sensor 7 and

10a . 10b in a schematic cross-sectional view of two embodiments of a layer structure on the surface of a sheet material.

A basic idea of the present invention is, in simple electrical units, in particular sensor modules and Sensors hereby to reduce the previously common use of printed circuit boards or completely avoided. Instead, the required electrical components are to be produced very efficiently and inexpensively as modules with electrical circuits as complete as possible on the basis of a leadframe. These can easily be brought into the desired geometric shape for the production of sensors and attached to the sensor accurately and mechanically reliable and safely contact electrically. The modules are manufactured by dispensing with supporting or connecting insulator structures such as carrier plates (printed circuit boards) or injection-molded insulator-carrier structures.

manufacturing of electrical module units in the leadframe method

The production of the electrical components takes the form of modules, as shown schematically in 1 shown in succession on a strip, which in principle is endless, are produced in different steps and only separated at the end.

Starting point is a in 2 shown thin sheet metal strip, for example copper (or copper-containing alloy), steel, nickel silver or brass sheet having a thickness of 0.1 to 1 mm, preferably less than 0.5 mm, better less than 0.3 mm, particularly preferably 0, 18 to 0.2 mm. The stripe 10 has side transport strips 11 on where he is between the stations 1 - 4 is transported. This strip 10 will, as in 1 symbolically shown, processed one after another in different workstations. These include the workstation 1 (Punching), workstation 2 (Raw chip placement, bonding), workstation 3 (Components equip) and workstation 4 (Punching out).

In the workstations 1 - 4 be on the strip electrical components 12 formed and processed this so that they after the last processing step as finished electrical modules 14 available.

The arrangement of the units 12 inside the strip 10 is like in 3 shown endless as possible directly behind each other to achieve the best possible utilization. As far as the processing requires or permits, it is of course also possible, on the strip next to each other several rows of units 12 to form at the same time, or between the building units 12 on the strip 10 Leave gaps.

The 4a - 4e show a single unit 12 , each after processing by the stations 1 - 4 :
From the metal strip 10 is in the first processing station by punching a punched grid 16 with a surrounding frame 18 , a number of strands 20 , a Diepad (surface area) 22 as well as contact areas 24 (smaller areas) formed by removing the intermediate material. The resulting punched grid is still flat and over the frame 18 Part of the strip 10 , The punched grid 16 has two positioning holes each for later positioning and fixation in a sensor 15a and mounting holes 15b on. The positioning holes 15a are bounded in a circle, so that they center themselves when receiving a suitable pin. The mounting holes 15b however, are irregularly bounded, so that in the opening projecting tabs are formed, which bend when receiving a pin out of the plane and thus can form a fixture. Such locking receptacle of a pin is, for example. Of locking discs known.

In the second processing station 2 becomes the unit 12 equipped with a Rohchip (Die). As in 4b is shown on the Diepad 22 a die 26 an integrated circuit applied and fixed by gluing.

In the same processing station, as in 4b shown contacting the integrated circuit 26 with the grid 16 via bond wires 28 , The contacting of integrated circuits by means of bonding wires is known per se to the person skilled in the art and will therefore not be explained in more detail here.

In the third processing station discrete components are fitted, as the wiring of the integrated circuit 26 serve. As in 4c As shown here, these are SMD capacitors C ₁ , C ₂ , C ₃ and C ₄ . In the example shown, these SMD components are glued with conductive (silver) adhesive to the grid 16 connected. Alternatively, an attachment by laser welding is possible.

In the fourth processing station a free punching and separating of the unit takes place 12 to a module 14 , as in 4d shown. Remaining bridges between the strands 20 are removed by punching.

The module is bent in a final processing step ( 4e ), where the area 22 with the integrated circuit 26 90 ° out of the plane of the stamped grid 16 is bent out. The remaining cable webs of the thin stamped grid 16 are easily bendable. Thus, a module ready for installation in a sensor is prepared 14 manufactured, the mechanical joints (positioning / mounting holes 15a . 15b ) and adapted for later use on the sensor, curved shape.

The module thus produced 14 includes a complete electrical circuit that comes from the integrated circuit 26 and the associated connection or protective circuit is formed from the discrete components C ₁ -C ₄ . The circuit includes left-over leftover contacts 32 of which, in the example shown, the middle contact is a ground contact, the upper contact is a power supply for the integrated circuit 26 and the lower contact an output terminal of the integrated circuit 26 represents. The mechanical connection of the module 14 is given by the through the components 26 , C ₁ -C ₄ formed connections between the strands 20 ,

In the integrated Schaltang 26 it is a sensor IC, in the example shown a special ASIC with a Hall sensor and a digital evaluation circuit. This ASIC is used, for example, in a speed sensor (crankshaft sensor), which will be explained in more detail below. The integrated Schaltang 26 During operation, the data of a time-variant magnetic field recorded by the integrated Hall sensor is converted into sensor output data, which, for example, can correspond to a speed value given a corresponding sensor arrangement.

Possible modifications of the modular unit manufacturing process

• – Verschiedene Abfolge der Schritte/Zusammenfassung bzw. Aufteilung von Bearbeitungsschritten Die Reihenfolge der Schritte im oben dargestellten Verfahren kann je nach Bedarf auch abgewandelt werden, und es können ggf. auch mehrere Schritte zusammengefaßt oder Bearbeitungsschritte in Teilschritte unterteilt werden. Es sei darauf hingewiesen, daß es zwar bevorzugt ist, wie beschrieben das Bestücken von diskreten Bauelementen einerseits und dem Die 26 andererseits wegen der für die Handhabung des Die 26 notwendigen Reinheitsbedingungen zu trennen. Alternativ kann die Bestückung auch parallel erfolgen. In diesem Fall verringert sich die Anzahl der notwendigen Bearbeitungsstationen entsprechend.
• – Herstellung von verschiedenen Schaltungen durch selektives Stanzen In 5a ist ein alternatives Stanzgitter 16 gezeigt, das ebenfalls mit dem oben beschriebenen Hall-ASIC bestückt ist. Dieser ASIC ist so ausgelegt, daß die Sensorausgangsdaten auf verschiedene Weise ausgegeben werden können, bspw. als Analogsignal (Spannungssignal), PWM-Signal oder anderes Signal. Hierfür sind am ASIC verschiede ne Signalausgänge 34a, 34b, 34c, 34d vorgesehen, die alle im Betrieb gleichermaßen aktiv sind. Beim letzten Schritt des oben erläuterten Herstellungsverfahrens kann nun durch gezieltes Stanzen entschieden werden, welcher der Ausgänge 34a–34d für das fertige Modul 14 verwendet werden soll. In den 5b, 5c sind beispielhaft alternative Ausführungen des Moduls 14 gezeigt. Hierbei ist die Beschaltung in den alternativen Ausführungen nach 5b, 5c unterschiedlich. Bei der Ausführungsform nach 5b sind die Signalausgänge 34a, 34b gegen Masse kurzgeschlossen. Dies kann sinnvoll sein, um eine Abstrahlung und entsprechende EMV-Problematik zu vermeiden. Signalausgang 34c ist angeschlossen, während Signalausgang 34d unbeschaltet bleibt. Demgegenüber ist in der Variante nach 5c nur der Signalausgang 34b beschaltet, während die übrigen Signalausgänge unbeschaltet bleiben. Auf diese Weise können durch Variation des oben erläuterten Herstellungsverfahrens nur im letzten Schritt unterschiedliche Typen des Moduls 14 erzeugt werden.
• – Verschiedene Schaltungen/Bauelemente Die in den Figuren gezeigte Schaltung dient hier nur als ein Beispiel einer elektrischen Schaltung. Mit dem Verfahren können die unterschiedlichsten Schaltungen hergestellt werden. Auch die dargestellte Beschaltung mit lediglich vier diskreten SMD-Kondensator-Bauelementen stellt nur ein Beispiel dar. Alternativ können verschiedene diskrete Bauelemente, beispielsweise Widerstände, Induktivitäten sowie Halbleiter-Bauelemente wie Transistoren, Dioden etc. verwendet werden, wie im jeweiligen Einsatzfall benötigt. Diese können als SMD-Bauelemente oder auch als bedrahtete Bauelemente vorliegen. Dabei sollte dem Fachmann klar sein, daß die jeweils erwähnten Herstellungsschritte, Bauelemente und sonstigen Merkmale der einzelnen Ausführungsformen jeweils hier nur beispielhaft kombiniert sind und auch andere Kombinationen hiervon ebenfalls möglich sind.

To the described and in 1 - 4e There are a number of possible modifications and additions to the methods shown:

• - Different sequence of steps / summary or division of processing steps The order of the steps in the above-described method can also be modified as needed, and if necessary, several steps can be combined or processing steps are divided into sub-steps. It should be noted that although it is preferred, as described, the loading of discrete components on the one hand and the die 26 on the other hand because of the handling of the die 26 necessary purity conditions to separate. Alternatively, the assembly can also be done in parallel. In this case, the number of necessary processing stations decreases accordingly.
• - Production of various circuits by selective punching 5a is an alternative punched grid 16 shown, which is also equipped with the Hall ASIC described above. This ASIC is designed so that the sensor output data can be output in various ways, for example, as an analog signal (voltage signal), PWM signal or other signal. For this purpose, different signal outputs are available at the ASIC 34a . 34b . 34c . 34d provided, all of which are equally active in operation. In the last step of the above-described manufacturing process can now be decided by targeted punching, which of the outputs 34a - 34d for the finished module 14 should be used. In the 5b . 5c are exemplary alternative versions of the module 14 shown. Here, the wiring in the alternative versions after 5b . 5c differently. In the embodiment according to 5b are the signal outputs 34a . 34b shorted to ground. This can be useful to avoid radiation and corresponding EMC problems. signal output 34c is connected while signal output 34d remains unconnected. In contrast, in the variant 5c only the signal output 34b wired, while the remaining signal outputs remain unconnected. In this way, by varying the above-described manufacturing method only in the last step different types of the module 14 be generated.
• Various Circuits / Components The circuit shown in the figures is only an example of an electrical circuit here. With the method, a variety of circuits can be produced. Also, the circuit shown with only four discrete SMD capacitor components is only one example. Alternatively, various discrete components, such as resistors, inductors and semiconductor devices such as transistors, diodes, etc. can be used, as needed in the particular application. These can be present as SMD components or as leaded components. It should be clear to those skilled in the art that the respective mentioned manufacturing steps, components and other features of the individual embodiments are each only combined here by way of example and other combinations thereof are also possible.

manufacturing a sensor

Hereinafter will be described on embodiments, such as the modules described above 14 can be used for the production of sensors. The sensors each comprise a base body. This can be designed as a carrier body, which will later carry the electrical module. Likewise, the main body can also form a housing completely or partially, in which the electric module is later accommodated. The sensors usually include a plug for electrical connection. The modules are now at the bottom body mechanically fixed on the one hand, where it depends on exact positioning of the actual sensor element. The previously related only to the components of the cable grating are stabilized by the inclusion of the base element and subsequent encapsulation. On the other hand, they are electrically contacted and connected to the plug.

First, it becomes a basic body 116 produced. It becomes a preform 110 ( 6b ), in which a metal punched grid 112 ( 6a ) is injected. The metal punched grid 112 is made of a metal sheet, preferably made of bronze. Alternatively, it can also be made of brass, possibly also of steel. It has a thickness of 0.3 mm to 1.2 mm, preferably 0.5 mm to 1 mm. The material of the stamped grid 112 is preferably thicker than the material of the leadframe 16 , more preferably at least twice as thick. end up 114 of the punched grid serve as plug contacts in the later sensor. Opposite ends 115 of the punched grid are bent.

Around the pre-molded part 110 becomes in a further injection molding step, the main body 116 formed as a carrier body. The main body 116 has a connector housing 118 on that the ends 114 of the stamped grid 112 surrounds in the distance. At the base body 116 is still a Anschraubhülse 120 for later attachment of the sensor at its place of use available. Next has the main body 116 over a recording area 122 at which the bent ends 115 of the stamped grid 112 are contactable. At the reception area 122 are protruding pins 124 intended.

A sensor 130 will be like in 7 shown assembled by putting on the receiving area 122 an electrical sensor module 14 whose preparation is described above, is set up. The pens grip 124 of the recording area 122 into the positioning holes 15a and the mounting holes 15b one. This is an exact positioning of the module 14 at the base body 116 achieved on the one hand and a first fixation on the other. The contact surfaces 32 of the module 14 be with the bent ends 115 of the stamped grid 112 welded, on the one hand to create an electrical connection and on the other hand, a further mechanical fixation.

The recording area 122 with the module 14 is then encapsulated. So is at the top of the sensor 130 a spray body 128 formed, covering the entire reception area 122 with the module 14 embeds. 8th shows the finished sensor in a perspective view; 9 shows a longitudinal section. The cable strands 20 of the conductor grid 16 and the components attached thereto 26 , C ₁ -C ₄ are embedded in the plastic mass and thereby mechanically held and protected.

When positioning the module 14 comes the integrated sensor circuit 26 due to the bending of the module 14 on the front side of the receiving area 122 to lie. The Hall sensor contained therein is so flat front side just below the frontal closure of the injection molding 128 positioned.

The production of the sensor 130 is very cost effective, since only a few, well to be automated manufacturing steps are necessary. Nevertheless, the accuracy in the positioning of the actual sensor element, namely the Hall sensor 26 , high. The module 14 is at the cones 124 exactly aligned. By welding to the contacts 115 of the stamped grid, it is electrically securely contacted and mechanically fixed.

For the spray body 128 who is the module 14 embedding, a thermoplastic can be used. Particularly preferred is the injection molding 128 but formed from a thermoset, as this results in a lower thermal and mechanical stress on the components.

Suitable for welding Structure of the punched grid

As described in the above embodiment, the connection of the module takes place 14 with the punched grid 112 preferably by welding. It has been found that during welding of conventional leadframe materials made of copper with a thin tarnish protection of pure tin (Sn), welding problems can occur.

For good welds Therefore, the use of other leadframe materials is proposed. These wise continue to use copper as the base material. On the surface are but applied other materials that are used in welding pose less problematic.

In a first embodiment ( 10a ) is on the surface of a copper sheet 140 as tarnish a thin layer 144 made of palladium (1μ) applied. On this is a very thin layer of gold 146 (0.1μ) applied.

In a second embodiment ( 10b ) is in addition between the copper material 140 and the palladium layer 144 as barrier layer, an intermediate layer (2.5μ) of nickel is applied.

The palladium layer 144 has a thickness of 0.2μ to 5μ, preferably 0.5μ to 2μ. The gold layer 146 is very thin, for example. 10 nm to 1 .mu.m, more preferably 50 nm to 0.5 microns. The optional Nickel barrier layer may be, for example, 0.5μ to 5μ, preferably 1.5μ to 3μ thick. Instead of gold, the thin final layer can also consist of silver.

Such a constructed sheet material can be very well with a stamped grid 112 of the same material or of another metal, for example brass (CuZn) or bronze (CuSn).

additions and alternatives to the embodiments

It are a number of additions or alternatives to the embodiments shown possible. For example. can some wiring harnesses of the grille for strain relief strain loops or a meander shape exhibit. In terms of the possibilities to provide a plug connection on the one hand, as in connection with the first embodiment a sensor shown the possibility of that Wiring grid (usually a very small sheet thickness of eg. Less than 0.25 m) to weld to plug contacts. on the other hand it is possible, that this Wiring grid - if necessary after one or more folds - directly serves as a plug contact. These two options - as well like other details of the embodiments shown here respectively shown only once in connection with a particular embodiment have been let also be transferred in any way to other embodiments and combine.

Claims (27)

Sensor with - an electrical module unit ( 14 ) - with an at least partially flat conductor grid ( 16 ) with a number of line strands ( 20 ) and at least one surface area ( 22 ), - where on the area ( 22 ) a Rohchip an integrated sensor circuit ( 26 ) is applied to determine a sensor value and electrically connected to the line strands ( 20 ), and wherein at the line strands ( 20 ) at least one discrete electrical component (C ₁ , C ₂ , C ₃ , C ₄ ) is mounted - and a basic element ( 116 ), which consists at least partly of plastic, - wherein the electrical module unit ( 14 ) at least in part on the basic element ( 116 ) is embedded so that the integrated sensor circuit ( 26 ), the strands ( 20 ) and the discrete component (C ₁ , C ₂ , C ₃ , C ₄ ) in the plastic material ( 128 ) are embedded. Sensor according to Claim 1, in which the discrete component or the discrete components (C ₁ , C ₂ , C ₃ , C ₄ ) are SMD components whose contacts with the line strands ( 20 ) are glued, welded or soldered. Sensor according to Claim 1, in which the discrete component or the discrete components are wired components, the wire terminals being connected to the line strands ( 20 ) are connected. Sensor according to one of the preceding claims, wherein the - at the cable strands from their area bent out retaining tabs for at least one discrete component are provided. Sensor according to one of the preceding claims, in which - the integrated circuit ( 26 ) via bond wires ( 28 ) with the line strands ( 20 ) is electrically connected, - wherein the bonding wires ( 28 ) in the plastic material ( 128 ) of the primitive ( 116 ) are embedded. Sensor according to one of the preceding claims, wherein the - two surface areas are provided, wherein on each of the surface areas a Rohchip a integrated circuit is applied. Sensor according to one of the preceding claims, in which - the basic element ( 116 ) a plug connection ( 118 ), - wherein the electrical module unit ( 14 ) electrically connected to the plug connection ( 118 ) connected is. Sensor according to one of the preceding claims, in which - flat conductor elements ( 112 ) provided at least partially at the base element ( 116 ) and the module unit ( 14 ) with the plug connection ( 118 ) electrically connect. Sensor according to Claim 8, in which - at least one of the flat conductor elements ( 112 ) with at least one of the strands ( 20 ) of the line grid ( 16 ) is welded. Sensor according to one of claims 8, 9, in which - the conductor grid ( 16 ) consists of copper or a copper alloy with a Sn-free tarnish protection on the surface. Sensor according to claim 10, in which - the tarnish protection comprises one or more layers ( 144 . 146 ) of palladium, gold and / or silver. Sensor according to Claim 11, in which - the tarnish protection comprises a first layer ( 144 ) from Pal the layer thickness is 0.3 μm-5 μm, and the tarnish protection on the first layer ( 144 ) applied second layer ( 146 ) of gold, wherein the layer thickness is 10 nm-1 micron. Sensor according to one of claims 11, 12, in which - the tarnish protection between the copper or copper alloy material and one of the layers ( 144 ) of palladium, gold and / or silver a barrier layer ( 142 ) of nickel. Sensor according to one of claims 8-13, wherein - the flat conductor elements ( 112 ) have a thickness of 0.3-1.2 mm. Sensor according to claim 14, in which - the flat conductor elements ( 112 ) have a thickness of 0.5-1 mm. Sensor according to one of claims 8-15, wherein - the flat conductor elements ( 112 ) are at least twice as thick as the strands ( 20 ) of the line grid ( 16 ). Sensor according to one of claims 8-16, in which - the flat conductor elements ( 112 ) consist at least predominantly of brass or bronze. Sensor according to one of claims 8-17, in which - the flat conductor elements ( 112 ) in the plug connection ( 118 ) as contacts ( 114 ) protrude. Sensor according to one of claims 8-17, in which - the flat conductor elements ( 112 ) in the course of the plug connection ( 118 ) to the electrical module unit ( 14 ) are angled at least once across their surface. Sensor according to one of the preceding claims, in which - the conductor grid ( 16 ) at least one hole ( 15a . 15b ), in which at least one pin ( 124 ) of the primitive ( 116 ) intervenes. Sensor according to claim 20, in which - at least at one hole ( 15b ) are provided in the transverse direction flexible, inwardly projecting retaining tabs. Sensor according to one of the preceding claims, in which - the integrated sensor circuit ( 26 ) has a magnetic field sensor. Sensor according to one of the preceding claims, in which - the basic element ( 116 ) an elongate carrier body ( 122 ), at the end of which the integrated sensor circuit ( 26 ), wherein the line grid ( 20 ) is bent so that line strands ( 20 ) along the carrier body ( 122 ). Method for producing a sensor, in which - an electrical module unit ( 14 ) is provided, which has at least - an at least partially flat line grid ( 16 ) with a number of line strands ( 20 ) and at least one surface area ( 22 ), - where on the area ( 22 ) the Rohchip an integrated sensor circuit ( 26 ) is applied to determine a sensor value and electrically connected to the line strands ( 20 ), and wherein at the line strands ( 20 ) at least one discrete electrical component (C ₁ , C ₂ , C ₃ , C ₄ ) is mounted - and a basic element ( 116 ), wherein - the basic element ( 116 ) is at least partially made of plastic, - and the basic element ( 116 ) a plug connection ( 118 ), - and conductor elements ( 112 ) at least partially on the basic element ( 116 ) and with the plug connection ( 118 ), wherein the electrical module unit ( 14 ) at the basic element ( 116 ), the line strands ( 20 ) of the electrical module unit ( 14 ) with conductor elements ( 112 ) and the electrical module unit ( 14 ) is at least partially encapsulated, so that the integrated sensor circuit ( 26 ), the strands ( 20 ) and the discrete component (C ₁ , C ₂ , C ₃ , C ₄ ) in the plastic material ( 128 ) are embedded. Method according to Claim 24, in which - the electrical modular unit ( 14 ) at the basic element ( 116 ) is coated with a thermosetting plastic. Method according to one of Claims 24 to 25, in which - at least one of the conductor elements ( 112 ) with at least one of the strands ( 20 ) of the line grid ( 16 ) is welded. Method according to one of Claims 24 to 26, in which the module unit is produced by - a strip element ( 10 ) is provided from a conductive material, - a first material removal step for creating a number of adjacent conductor grids ( 16 ) on the strip element ( 10 ), each line grid ( 16 ) a number of wire strands ( 20 ) and at least one surface area ( 22 ), a raw chip of an integrated circuit ( 26 ) on the surface area ( 22 ) and electrical contacts between the integrated circuit ( 26 ) and the line strands ( 20 ), - at least one discrete electrical component (C ₁ , C ₂ , C ₃ , C ₄ ) on the line strands ( 20 ) and a second material removal step for removing further parts of the strip element ( 10 ) is carried out, wherein the electrical module unit ( 14 ) of the strip element ( 10 ) is isolated.