CZ197098A3 - Process for producing chip card for contactless operation - Google Patents

Abstract

In the chip cards to be produced, besides the integrated circuit components (chip 2 and/or electronic module 12) and coupling means (coil 6, capacitor coatings 8) for contactless power and/or data transmission there is also at least one label (1) forming the outer surface of the card. The coupling means (6, 8) are applied to the inner side of said label. The label (1), thus prepared, is then inserted into an injection mould. The separately prepared integrated circuit components (12) are then positioned accurately in the mould via terminals in the coupling means (6, 8) and contacted with them. Finally the card body is moulded on the label (1) by the injection moulding process and the integrated circuit components (2, 12) are moulded into the card body. Electric connections between the coupling means (6, 8) and the integrated circuit components (12) are produced in the mould itself by various means.

Description

Technical field

The present invention relates to a method of manufacturing a smart card which provides for inductive and / or capacitive coupling elements for contactless transmission of energy and / or data, as well as integrated circuits (in the form of at least one chip and / or electronic module) associated with the coupling elements. at least one outer surface of the card is formed by a label.

BACKGROUND OF THE INVENTION

In addition to known smart cards having a contact field on their outer side and communicating with the reader (and writer) thereon, various so-called contactless smart cards are also known. With these cards, there is no need (at least for data exchange) to establish a galvanic contact between the card and the reader. The wireless transmission is realized by means of coupling elements, which are built into the card and the reader. Depending on the application, a distinction is made between the close coupling, for which the card must be loaded into the reader, and the medium coupling, or the remote coupling, which allows • • φ * ♦ φφφφ φφφ φφφφ φ φ φ φ komunikaci komunikaci komunikaci komunikaci komunikaci komunikaci komunikaci komunikaci komunikaci ”komunikaci komunikaci” ”komunikaci” ”” ”komunikaci” komunikaci ”” ”” ”” ”” ”komunikaci” ”komunikaci” ”” ”” In addition to the prevailing inductive coupling, which, in addition to data transmission, should also allow contactless power supply to the circuit of the card (chip), a capacitive coupling is also known, but is considered only suitable for data transmission. Non-contact cards that have a conventional external contact field (so-called hybrid or combination cards) may also be considered. Elektronik 1989, Volume 25, pages 66-78.

In practice, the diverse uses of contactless smart cards are already known and corresponding, high-quality transmission and circuit systems, chips and software have also been developed. However, as far as the production or construction of similar cards is concerned, only very few solutions are known which take advantage of the particular characteristics of wireless transmission.

The first solution envisages a laminated card construction with a plurality of welded layers (inter alia with a printed cover film or label), wherein the underlying substrate film is provided with conductive tracks including two small transfer coils (for short-range transmission) and chips. The ring encircling the ring serves as a mechanical protection (see publication above, pages 75, 76, figure 8 right and figure 10). Whatever the necessity

9 • 999 9 · spatially accurate co-location of a larger number of foils, large-area welding also proves to be at least problematic, since stored chips and also printed foils are very sensitive design elements.

Another solution envisages one single 4 * 4 mm chip with a hybrid circuit and a high-frequency antenna coil located on the back of the chip. As with the previous solution, the card consists of a bundle of multiple foils, the chip having to be housed in a recess of the foil located inside the bundle. (R. Jurisch: mic3 - Die Neue Kontaktlose Chipkartentechnologie. Card-Forum 1995, Volume 3, pages 82-84). With regard to the multilayer foil construction, the above remarks apply; above all, however, the chip offers too limited an area to accommodate the antenna coil, which should in any case exclude the use for long distance transmissions.

EP-A-0 682 321 discloses a method for manufacturing a smart card which comprises inductive couplers for wireless transmission of energy and / or data, as well as integrated circuits associated with the couplers in the form of at least one chip and / or electronic module. For at least one outer surface of the card there is used a covering layer or a label, on whose side that faces away from the spare side of the printed outer side, said binding elements are located . In this case of the prior art, the card body is formed by laminating a plurality of stacked foils.

SUMMARY OF THE INVENTION

The method according to the invention should allow for rational, low-cost and reliable serial production of contactless smart cards, taking into account the particular requirements of coupling elements for contactless operation and also minimizing the risk to expensive special chips by the manufacturing process as much as possible.

According to the invention, this object is achieved by a production process with the characteristics of claim 1.

The labels used are preferably already printed on the outside, but white labels may also be used and the finished cards may additionally be printed as required. Both coupling coils and capacitor stickers can be used as coupling elements, inductive and capacitive coupling elements can also be used in one card. In this context, an electronic module is understood to mean a pre-assembled, card-embedded unit comprising at least one chip with a protective case and connection contacts. If a single label is provided on each outside of the card, both or just one of the labels may be prepared in the manner described for placement.

The label, which is practically always required, advantageously has a dual function in the process according to the invention. The binding members may be made in a variety of ways and placed on the label, thereby avoiding handling such as stacking, unloading and insertion into the mold. Binding elements have virtually the entire surface of the label or card, so it is possible to realize the coil cross sections and the number of turns required for long-distance transmission or capacitor stickers for capacitive coupling. Devices (manipulators) that have proven themselves in the production of conventional chip cards are available for spatially accurate placement of the module or chip in the mold. Injection molding is an economical technology for chip card production and guarantees a sensitive yet firm placement of chips and modules in the card body.

Special variants of the process according to the invention as defined in claim 1 are set out in the dependent claims.

• * · * · * · · · * · · · * · «« · «« «« «* * * * * · «· ··

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be further elucidated by means of examples and figures.

Giant. Figures 1 to 4 show various examples of labels with binding elements located on their inner side, which, after being placed in the injection mold, are fitted or contacted with integrated circuits in various ways.

Giant. 5 is a cross-sectional view of a portion of a die casting mold with interposed labels and integrated circuits, the mold being ready for die casting.

DETAILED DESCRIPTION OF THE INVENTION

1 to 4, the inner side of the label 1 as used in the production of smart cards to produce the outer surface of the card is always shown. It is a card-shaped plastic film with a thickness of, for example, 0.1 mm, which usually serves as a substrate for writing and / or image. Often, the two outer surfaces of the smart card are each formed by one similar label. Preferably, the outer side of the label is invisible in the figures, but additional printing of the finished card is also possible.

In all four exemplary embodiments, the side of the label that faces away from the outside is shown on the side of the label. The coupling elements 3, 6, 8 are placed for contactless operation of the card. As shown only in Fig. 1 on the left, the label thus prepared is stored in the lower part 20 of the injection mold (see also Fig. 5). Further, an integrated circuit is shown in the form of a semiconductor chip 2, 21, or an electronic module 12, 12 '. As also shown in FIG. 1 on the right, these components are separately prepared and are embedded in the injection mold on the label 7. In this case, their contact points (41 in FIG. 1) are positioned by means of a manipulator (not shown) exactly on the connections of the coupling elements and are contacted with them. The above procedure also applies to the exemplary embodiments of Figures 2 to 4 described later.

In the case of FIG. 1, the inductive coupling coil is wound as a wire coil 3. The reel has a rectangular shape which is adapted to the shape of the card and is glued to the label 1 along its edge. The chip 2 shown separately on the right ("underside") is provided with bond pads 4 'for spool 3_. For example, it is a single chip whose integrated circuit performs all functions of the card, including by means of a data communication coil 3. and power supply to the circuit. The connection of the ends of the coil to the chip 2 can be realized by means of the leads 4 and optionally by a wire bridge 5. (shown in the figures), the leads 4 being located on the label 1 and contacted with said contact points 41

The chip 2 can additionally be glued to the label 7.

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In the embodiment according to FIG. 2, the coupling coil 6 with the required number of turns is provided in the form of a printed circuit on the label 1. At the same time, the known technology makes it possible to conveniently shape the ends 7 of the coil for direct connection to the chip 2. In this case, the chip can preferably be positioned over the coil winding 6 as shown, so that a separate transfer of one end of the coil is eliminated. If the side of the chip 2 facing the coil winding is provided with an insulating passivation layer, no further action is necessary. If necessary, it is possible to provide the coil 6 with an insulating coating before storing the chip 2.

In the exemplary embodiment of FIG. 3, a printed circuit label 6 is applied to the printed circuit board 1 more or less in the form of a card filling spool 6. At the same time, capacitor stickers 8 are formed within the spool surface for capacitive bonding in the form of two conductive surfaces. The integrated circuit (chip 2) is contained here in the flat electronic module 12. It comprises contact points in the form of modular connections 13 for connecting both ends of the coil and both capacitor stickers 8 and is again conveniently positioned in such a way as to bridge the coil winding 6. .

The card's integrated circuits need not be concentrated in a single chip or module, but can be distributed in a known manner between two or more similar components. The printed conductive tracks can then be suitably applied to the label to interconnect said components with one another.

and / or to attach the coupling elements. A corresponding example is shown in Fig. 4. It is a chip card which, in addition to contactless operation, is also intended for connection by means of galvanic contacts. According to FIG. 4, in accordance with this example, inside the printed spool 6, on the label 1, a module 12 ' with contacts 15, but also a separate chip 2 '

For example, chip 2 ’is a so-called communication chip that unifies the wireless data transfer capabilities and possibly the card circuit power. As shown in the figures, it can be directly connected to one end of the coil and to the other end of the coil by means of a wire bridge 5. The electronic module 12 'is a similar component with a particularly flat structure, the contact field 15 of which is, for connection to a reader, located in one outer surface of the card (similar to the module described in EP-A-0 599 194 for example). ). The contacts of the outer contact field 15 comprise curved "legs" 16 which are placed on the label L. In addition, there are other contacts 17 on the module 12 'which are not accessible from the outside. They are connected to the printed conductor tracks 14 on the label and form a module 12 ' connection therewith to the chip 21 (see also FIG. 5) - or, if a separate communication chip is not envisaged, they are connected directly to the couplers. Of course, other connections via conductive paths 14 may, of course, be envisaged between the communication chip 21 and the module 12 '.

4 4 4 4 4 4 4

444 4 4 4 · 4 44

4 * 4 4 4 4 4

4,444 4 * 4 * 444 4 * * 44 44 44 44

It is understood that the binding elements on the label may be formed in accordance with the requirements of the card system, in particular, two binding coils may be placed side by side. Although the examples of FIGS. 1 to 4 relate to a single label 1, it is also possible to provide the binding elements in the case of cards in which each outer side consists of one label. For example, one or more coils may be placed on one card label and a capacitor label on the other. Alternatively, each of the two labels can be provided with one capacitor coating, etc. The integrated circuits then have to be provided with corresponding contact points or modular connections on both sides for the connection of the coupling elements on both labels.

The prepared labels (or only one for each card) and integrated circuits are, as already mentioned, gradually placed into the injection mold. FIG. 5 is a schematic representation of a similar mold with both halves 20 and 21, and the injection channel 22 is shown schematically in the dividing line. In the illustrated example, the prepared label of FIG. 4 is used. A second label 1b is received in the upper mold half 21. This top label 1b has (as is known per se) a rectangular recess 18 into which the contact field 15 of the module 12 * is stored. The other module contacts 17 do not lie freely on the outer surface of the card, but are covered by the lower label 1 a.

After the label (s) and also the integrated circuit (s) and / or the integrated circuit (s) are inserted into the die casting mold and after the mold is closed (example of FIG. 5), the card body is formed such that the mold cavity 23 is the die casting technology. filled with plastic. The injected material is then connected to the inside of the label or labels. At the same time, the integrated circuits are absorbed by the material, that is, they are embedded in the card body. Then it is possible to remove the finished chip card with all the components necessary for contactless operation.

In order to form electrically conductive joints between the integrated circuits and the coupling elements or the conductive paths in the die casting mold, various already known methods can be used, such as joining with a locally applied, electrically conductive adhesive. However, a direct metal-to-metal connection can also be formed by mere mechanical contact pressure, but in any case supported by ultrasonic welding. As can be seen from the example of FIG. 5, in the case of using a module 12 ' which extends over virtually the entire thickness of the card, its contacts 17 are pressed in the closed mold 20, 21 against the conductive tracks 14, contributing to contact within the mold. In the manufacture of the joints, it is possible to utilize the great forces which during injection molding act on the cast parts due to the high pressure in the injection molding material. The high temperatures that occur during injection molding can also be advantageously used for making contacts by use

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φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ na na φ φ φ φ φ φ φ φ φ φ φ φ φ φ It is also possible to envisage contacting by preforming batches of soft solder (preforms) which melt in the injection mold.

It represents

Claims (5)

PATENT CLAIMS A method of manufacturing a smart card comprising inductive and / or capacitive coupling elements (3, 6, 8) for contactless transmission of energy and / or data as well as integrated circuits (2, 12) associated with the coupling elements in the form of at least one chip and / or electronic module, - wherein, for at least one outer surface of the card, a label (1) is used on whose side facing away from the outer face to be printed or to be printed, said binding elements (3, 6, 8) are located, - the label thus prepared (1) being placed in a die casting mold (20, 21), - wherein the separately prepared contact circuits (4 ', 13) for the coupling elements (3, 6, 8) provided with the integrated circuits (2, 12) are placed in the injection mold (20, 21) on the label (1) and the contact points (4 ', 13) are positioned exactly on the connections (4, 7) of the coupling elements and are contacted with them, - whereby the card body is molded on the label (1) by injection molding technology and the integrated circuits (2, 12) are embedded in the card body at the same time • 9 · ♦ ► ·· »9 · < - and wherein the electrically conductive connections between the coupling elements (3, 6, 8) and the integrated circuits (2, 12) are formed in the injection mold (20, 21) by mechanical contact pressure, electrically conductive adhesive and / or low temperature brazing. Method according to claim 1, characterized in that on the label (1) at least one coil for inductive coupling in the form of a flat coil (3) with wire coil is placed. Method according to claim 1, characterized in that the binding elements (6, 8) are formed on the label (1) in the form of a printed circuit. Method according to claim 3, characterized in that in the case of using a printed coil (6), the chip (2) or the electronic module (12) is arranged transversely across its windings and the outer and inner ends of the coil are contacted therewith. Method according to one of the preceding claims, characterized in that printed conductive tracks (4, 14) are provided on the label (1) for connecting the coupling elements (3, 6, 8) to the integrated circuits (2, 3, 4).