CR20160441A - Miembro de circuito y estructura de montaje que tiene espacio hueco, y procedimiento para la fabricación de la estructura de montaje - Google Patents

Miembro de circuito y estructura de montaje que tiene espacio hueco, y procedimiento para la fabricación de la estructura de montaje

Info

Publication number
CR20160441A
CR20160441A CR20160441A CR20160441A CR20160441A CR 20160441 A CR20160441 A CR 20160441A CR 20160441 A CR20160441 A CR 20160441A CR 20160441 A CR20160441 A CR 20160441A CR 20160441 A CR20160441 A CR 20160441A
Authority
CR
Costa Rica
Prior art keywords
assembly structure
procedure
manufacture
circuit
hollow space
Prior art date
Application number
CR20160441A
Other languages
English (en)
Inventor
Takayuki; Hashimoto
Takuya; Ishibashi
Masatoshi; Fujimoto
Original Assignee
Nagase Chemtex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagase Chemtex Corp filed Critical Nagase Chemtex Corp
Publication of CR20160441A publication Critical patent/CR20160441A/es

Links

Classifications

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

Un miembro de circuito que incluye: un elemento que tiene una región funcional; una cubierta de tabla dispuesta opuesta a la región funcional; y una nervadura formada para rodear la región funcional, para proporcionar un espacio entre la región funcional y la cubierta. L a cubierta incluye una lámina S que tiene un espesor de 100 micras o menos. La lámina S tiene un módulo de tracción elástica Es a 175° C de la lámina S es preferiblemente 20GPa o más.
CR20160441A 2014-03-31 2015-03-31 Miembro de circuito y estructura de montaje que tiene espacio hueco, y procedimiento para la fabricación de la estructura de montaje CR20160441A (es)

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PCT/JP2015/001860 WO2015151514A1 (ja) 2014-03-31 2015-03-31 中空部を有する回路部材および実装構造体、ならびに実装構造体の製造方法

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Families Citing this family (11)

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Publication number Priority date Publication date Assignee Title
CN104576964A (zh) * 2014-12-17 2015-04-29 深圳市华星光电技术有限公司 透明柔性封装衬底及柔性oled封装方法
KR101931508B1 (ko) * 2015-03-27 2018-12-21 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치, 통신 모듈 기기 및 탄성파 장치의 제조 방법
KR102513134B1 (ko) 2017-09-29 2023-03-24 나가세케무텍쿠스가부시키가이샤 실장 구조체의 제조 방법 및 이것에 이용되는 시트
JP7224296B2 (ja) * 2017-10-31 2023-02-17 ナガセケムテックス株式会社 実装構造体の製造方法およびこれに用いられるシート
CN110229488A (zh) * 2018-03-05 2019-09-13 科思创德国股份有限公司 热塑性复合材料制件及其制备方法和用途
US10497566B1 (en) * 2018-06-19 2019-12-03 Macronix International Co., Ltd. Layout design for fanout patterns in self-aligned double patterning process
US11777465B2 (en) 2018-08-30 2023-10-03 Skyworks Solutions, Inc. Packaged surface acoustic wave devices
EP3863388A4 (en) * 2018-10-05 2022-06-15 Kabushiki Kaisha Toshiba SEMICONDUCTOR HOUSING
US11938688B2 (en) * 2018-12-18 2024-03-26 Resonac Corporation Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate
JP7243186B2 (ja) * 2018-12-27 2023-03-22 住友ベークライト株式会社 封止用樹脂組成物、中空パッケージおよびその製造方法
WO2022065496A1 (ja) * 2020-09-28 2022-03-31 昭和電工マテリアルズ株式会社 回路接続用接着剤フィルム、無機フィラー含有組成物、並びに、回路接続構造体及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6861757B2 (en) * 2001-09-03 2005-03-01 Nec Corporation Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
JP2005210045A (ja) * 2003-12-24 2005-08-04 Kyocera Corp 光半導体装置
JP4131330B2 (ja) * 2004-07-27 2008-08-13 松下電工株式会社 光半導体装置
JP2006237405A (ja) * 2005-02-25 2006-09-07 Toshiba Corp 電子部品装置
JP4986545B2 (ja) * 2006-08-31 2012-07-25 京セラクリスタルデバイス株式会社 水晶振動子
WO2009057699A1 (ja) * 2007-10-30 2009-05-07 Kyocera Corporation 弾性波装置
JP2009226571A (ja) * 2008-02-28 2009-10-08 Nippon Kayaku Co Ltd マイクロデバイス及びその製造方法
JP2010199474A (ja) * 2009-02-27 2010-09-09 Kyocera Chemical Corp 電子部品用中空パッケージ、電子部品用中空パッケージの接着シート、および蓋体、ならびに電子部品の製造方法
JP5444833B2 (ja) * 2009-05-18 2014-03-19 日立化成株式会社 感光性樹脂組成物、リブパターンの形成方法及び電子部品
JP5425005B2 (ja) * 2009-08-19 2014-02-26 日本電波工業株式会社 圧電部品及びその製造方法
WO2011145750A1 (ja) 2010-05-20 2011-11-24 日立化成工業株式会社 感光性樹脂組成物、感光性フィルム、リブパターンの形成方法、中空構造とその形成方法及び電子部品
JP2012084954A (ja) * 2010-10-07 2012-04-26 Panasonic Corp 弾性波素子とこれを用いた電子機器
WO2012144370A1 (ja) * 2011-04-19 2012-10-26 京セラ株式会社 電子部品および弾性波装置
JP5660985B2 (ja) * 2011-07-13 2015-01-28 日東電工株式会社 貼着型制振材
JPWO2013042751A1 (ja) * 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
WO2013128823A1 (ja) * 2012-02-28 2013-09-06 パナソニック株式会社 弾性波装置およびその製造方法
JP2013178526A (ja) 2013-04-01 2013-09-09 Hitachi Chemical Co Ltd 中空構造体及びその製造方法
US10224260B2 (en) * 2013-11-26 2019-03-05 Infineon Technologies Ag Semiconductor package with air gap

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CN106170854A (zh) 2016-11-30
EP3128545A1 (en) 2017-02-08
KR20160140744A (ko) 2016-12-07
EP3128545A4 (en) 2018-02-28
US20170117874A1 (en) 2017-04-27
TW201601260A (zh) 2016-01-01

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