CN2840166Y - Novel computer radiating system - Google Patents
Novel computer radiating system Download PDFInfo
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- CN2840166Y CN2840166Y CN 200520121938 CN200520121938U CN2840166Y CN 2840166 Y CN2840166 Y CN 2840166Y CN 200520121938 CN200520121938 CN 200520121938 CN 200520121938 U CN200520121938 U CN 200520121938U CN 2840166 Y CN2840166 Y CN 2840166Y
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Abstract
The utility model relates to a computer radiation system, which comprises a main board (7), cards (8), a hard disk (9), a cabinet (13) and a power supply (6), wherein a front panel of the cabinet (13) is provided with an air inlet (14), and the rear panel of the cabinet (13) is provided with an air outlet (15). The utility model also comprises a radiation module which comprises a set of front fans (1) and a set of rear fans (12), wherein the front fans (1) and the rear fans (12) which are respectively arranged in corresponding positions of the front and the back panels of the cabinet are matched and connected with an air inlet (14) and an air outlet (15) on the cabinet (13), and the air flow directions of the front fans (1) and the rear fans (12) are same. The utility model has the advantages that the radiation condition of a computer, particularly a small-size computer can be improved, and the noise of the computer can be reduced further.
Description
Technical field
The utility model relates to cooling system, particularly relates to a kind of computer heat radiation system.
Background technology
Raising along with computer speed, central processing unit (CPU) (CPU), video card, component capabilities such as mainboard constantly promote, its power is also improving constantly, in present computing machine (PC) system, the power of processor is about 100W, therefore, the trend that its thermal value also linearly rises, overclocking is in vogue for a time in recent years in addition, whether what computer to dissipate heat designed rationally seems important to system day by day, if cooling system is inferior, can't discharge the heat in the machine fully, will make the interior thermal accumlation of computing machine get off to cause the increase in temperature of total system, finally cause computer stability to descend, crash even burn serious consequence such as hardware, bring very burden for our work.
In general, computing machine integral heat sink effect depends on the indoor design of cooling system, manufactured materials, and the framework of cooling system, whether the headspace of each parts is reasonable.
A heat radiation good heat radiating system can in time discharge heat, avoids heat accumulation, and lower system temperature not only can improve the operation stability of computing machine, more can prolong the serviceable life of various accessories.
Effectively the cooling system solution is the interactive heat dissipation channel of two-pass type at present: radiator fan is all installed in the front and back at cabinet, the fan of cabinet front portion sucks the Cryogenic air of cabinet outside in the cabinet, after various integrated circuit boards, hard disk, central processing unit (CPU) heat radiation, discharge cabinet through the rear portion blower fan, this design can be taken away the heat of cabinet interior 80%.
China publication CN1407421A discloses a kind of desk computer that adopts direct heat radiating layout system structure, include parts such as mainboard, central processing unit, memory bar, chipset, hard disk, outer plug-in card and system fan, at least one system fan is arranged on a side of mainframe box; Air outlet be arranged on mainframe box with system fan over against opposite side.Preferably, system fan is arranged on the side of close central processing unit of mainframe box.Other main heater elements and hard disk and plug-in card are operated in safe temperature range on its assurance superelevation dominant frequency central processing unit (CPU), the mainboard, and it is less to design size, and the very powerful desk computer system of function.
But, the desk computer of this layout, fan is bigger, ventilation is little, is not suitable for undersized computing machine, that is to say, can not use reduced size, more slow-revving fan to solve heat dissipation problem, and, owing to adopt the fan of large-size, therefore be unfavorable for reducing the noise of cooling system.
Summary of the invention
The object of the present invention is to provide a kind of novel computing machine (PC) cooling system, it can improve computing machine, and the heat radiation situation of small size computing machine particularly further reduces the noise of computing machine simultaneously.
For solving the problem that existing cooling system exists, achieve the above object, the utility model provides a kind of computer heat radiation system, comprise mainboard, integrated circuit board, hard disk, cabinet, power supply, air inlet is arranged on the case front panel, there is air outlet cabinet rear panel upper back, also comprise the heat radiation module, described heat radiation module comprises one group of preposition fan and one group of rearmounted fan, described preposition fan and rearmounted fan lay respectively at the corresponding position of cabinet front and back panel, matching with air outlet with air inlet on the described cabinet is connected, and air-flow direction is identical.
Further, described preposition fan and rearmounted fan are over against answering.
Described preposition fan or rearmounted fan can be two fan groups that fan is arranged side by side.
Described preposition fan and rearmounted fan also can be respectively two fan groups that fan is arranged side by side.
Be arranged in order the CPU of mainboard behind the described preposition fan, north bridge and south bridge, hard disk, back I/O, rearmounted fan; CPU is positioned at mainboard central authorities near preposition fan one side on the described mainboard, and I/O is positioned at the mainboard edge behind the mainboard; Described internal memory is positioned at the CPU left side, and CPU transformation module is positioned at the CPU right side; Described integrated circuit board is positioned at hard disk and I/O right side, back.
Described CPU top is covered by cpu heat.
The gap that keeps 10～30mm between described hard disk and the mainboard.
The invention has the beneficial effects as follows: by arranging of each component locations in the computing machine, and the layout of position of components on the mainboard, important heat generating components all is positioned among the wind path of radiator fan, thereby these parts can be dispelled the heat fully, and the path of air flow is smooth and easy in the system, and air flow is not vulnerable to the influence of wire rod etc. in the cabinet.When the power of some parts increases, just can adjust the air mass flow of cooling off these parts by the perforate of adjusting on the wind scooper, make the heating power of air mass flow and these parts be complementary.
Description of drawings
Fig. 1 is the schematic layout pattern of computing machine holonomic system of the present invention;
Fig. 2 is the air flow direction figure of computing machine holonomic system of the present invention;
Fig. 3 is the computer heat radiation system stereoscopic arrangement figure of present embodiment;
Fig. 4 is the computing machine wind scooper synoptic diagram of present embodiment;
Fig. 5 is the system layout figure after the computing machine of present embodiment adds wind scooper; Among the figure
The preposition fan of 1-; 2-CPU; 3-CPU transformation module; 4-north bridge and south bridge;
The 5-internal memory; The 6-power supply; The 7-mainboard; The 8-integrated circuit board;
The 9-hard disk; I/O behind the 10-; The 11-power supply fan; The rearmounted fan of 12-;
The 13-cabinet; The 14-air inlet; The 15-air outlet; 16-power supply air outlet;
The 20-wind scooper; 21-air outlet A; 22-air outlet B; 23-air outlet C;
Embodiment
Describe novel computer cooling system of the present invention and effect thereof in detail below in conjunction with accompanying drawing.
Shown in Fig. 1-5, the described computer heat radiation system of present embodiment comprises mainboard 7, integrated circuit board 8, heat radiation module, hard disk 9, cabinet 13, power supply 6, CD-ROM drive (not marking).
Air inlet 14 is arranged on the described case front panel, air outlet 15 is arranged behind the cabinet rear panel.
Described heat radiation module comprises the rearmounted fan 12 of one group of preposition fan 1 and a group, and preposition fan 1 and rearmounted fan 12 lay respectively at the cabinet front and back panel and face the position of answering, and matching with air outlet 15 with air inlet 14 on the cabinet is connected, and air-flow direction is identical.
Be arranged in order the CPU2 of mainboard behind the preposition fan 1, north bridge and south bridge 4, hard disk 9, back I/O10, rearmounted fan 12;
CPU2 is positioned at mainboard 7 central authorities near preposition fan 1 one sides on the mainboard, and back I/O10 is at mainboard 7 edges;
Internal memory 5 is positioned at the CPU2 left side, and CPU transformation module (VRM) 3 is positioned at the CPU2 right side;
The CPU2 top is covered by cpu heat, and the effect of cpu heat is to distribute the heat that CPU2 sends.
Preposition fan 1 is to the blowing of CPU2 direction, and the wind that preposition fan 1 blows out can blow to parts such as internal memory 5, CPU2, CPU transformation module 3, helps these parts distribute heats.
Described fan can be an aerofoil fan, as the fan of the EFB7015HHB model of Delta company.
The air-flow direction of rearmounted fan 12 is identical with preposition fan 1, so it can strengthen air that preposition fan 1 blows out to the flowing of rearmounted fan 12 directions, the hot-air suction that will cool off parts such as CPU2, internal memory 5 is from mainboard 7 zones.
Spatially, the gap that keeps 10～30mm between hard disk 9 and the mainboard 7 is so that air-flow can pass through.
CD-ROM drive be positioned at power supply 6 directly over.
Cooling system in the present embodiment is to use the requirement of the big ventilation of preposition fan 1 and rearmounted fan 12 realization systems.
In the present embodiment, preposition fan 1 and rearmounted fan 12 respectively have 2 fans, by simulation analysis of computer, in the time of can calculating the system ventilation amount that reaches identical in this system, use rotating speed, the noise contrast of 1 fan and 2 fans, and concrete outcome is as follows:
| Sequence number | Preposition fan | Rearmounted fan | The system ventilation amount | Fan noise |
| 1 | 2× | 2×4500rpm | 16.17cfm | 36.5 |
| 2 | 2×5400rpm | N/A | 16.06cfm | 49.5dBA |
| 3 | 1×5400rpm | 1×5200rpm | 16.48cfm | 47.1 |
| 4 | 1×6000rpm | N/A | 16.2cfm | 51.1dBA |
Can analyze by the data of last table:
From having only 2,4 and existing preposition fan of preposition fan, there is 1,3 of rearmounted fan to compare again, the preposition fan 1 that the cooling system of present embodiment is mentioned, the design of rearmounted fan 12 all have good effect in the effect aspect heat radiation, the noise.
Have only a fan to compare side by side with 1,2 two fan from 3,4, two fans that the cooling system of present embodiment is mentioned design arranged side by side all has good effect in the effect aspect heat radiation, the noise.
Preferably, preposition fan 1 can for the fan of 2 70mm * 70mm * 20mm specification side by side, CPU2 is in preposition fan 1 back, rearmounted fan 12 is above cabinet back mainboard 7, air-flow direction is served as reasons down upwards.
Internal memory 5, CPU2, hard disk 9, CD-ROM drive, CPU transformation module 3 all are positioned at the wind path the inside of the formation of preposition fan 1 formation, so preposition fan 1 can provide good heat radiation for these parts.
In the present embodiment, the effect of rearmounted fan 12 is to make negative pressure, reduce the impedance that air flows in system, make the back pressure of preposition fan 1 working point reduce, rearmounted fan 12 exists as system fan, do not have bigger parts to stop on the path of rearmounted fan 12 air flow, the working point impedance is less.And, because forward and backward corresponding its blast of fan group is the effect of stack, so during this fan group associated working, under lower rotating speed, just can reach bigger blast.
In the present invention, do not influencing under the situation that vitals arranges, the position of power supply 6 can flexible arrangement, and the design of the heat dissipation design of power supply 6 and system main wind path is independence mutually, that is to say, as long as power supply 6 can satisfy self-radiating.
Preferably, power supply fan 11 is positioned at power supply 6 front portions, and power supply fan 11 is drawn onto low temperature from the external world air directly flows to power supply 6, discharges by the exhaust outlet 16 of power supply then, and the heat radiation of power supply 6 and system are independent.
In the present embodiment, also comprise one with the air quantity of front-end system the wind scooper between front-end system fan and heat radiator 20 to the distribution of each parts.
As shown in Figure 4, wind scooper 20 is installed on the case front panel, have air vent on the case front panel and pass air into preposition fan 1, wind scooper 20 is between preposition fan 1 and each component of computer, preposition fan 1 is installed in the front portion of wind scooper 20, at the rear portion of wind scooper 20, has 3 air outlets, air outlet A21 is positioned at internal memory 5 the place aheads, is used for internal memory 5 heat radiations; In the middle of air outlet B22 is positioned at, be used for the heat radiation of CPU2, CPU transformation module 3, hard disk 9, the air by A, B is provided by preposition fan 1; Air outlet C23 is positioned at the right side, in power supply air inlet front, makes the space that forms sealing between the air inlet of power supply fan 11 and case front panel, and the air intake that guarantees power supply 6 is to come from the outer lower air of temperature of cabinet 13.
As seen, when working in the system, the air-flow that fan produces is important heat generating components: CPU, internal memory, CPU transformation module, north bridge and south bridge, hard disk etc. in the cooling system fully, and in the system flow field simple (the air-flow direction unification is by behind the forward direction), can adjust air mass flow eaily, so the heat radiation of intrasystem parts is all right through each parts.
Simultaneously, in acoustics, if the sound pressure level of 2 sound sources is identical, the sound pressure level ratio after then synthesizing is the high 3dBA of sound pressure level of 1 sound source wherein, if the sound pressure level of 2 sound sources differs 8～10dBA, the sound pressure level after then synthesizing is approaching with the sound pressure level of bigger sound source.
For the tubeaxial fan that often uses in the computer system, the general relationship of its various performance parameters and rotating speed is as follows:
(1) ventilation:
Wherein, Q1, Q2 are respectively the ventilation of fan 1,2;
Rpm1, rpm2 are respectively the rotating speed of fan 1,2.
(2) noise:
Wherein, SPL, Sound Presser Level, i.e. sound pressure level, Δ SPL refers to that acoustic pressure is differential.
Shown in formula (1), (2), if realize the purpose that ventilation doubles, realize by the mode that improves rotation speed of the fan, rotation speed of the fan will improve 60～70% at least just may be realized, fan noise will increase more than the 10dBA like this, if and realize that by increasing by 1 fan then fan noise only increases 3dBA.
In the present embodiment, preposition fan 1 and/or rearmounted fan 12 can adopt the mode of 2 fan parallel connections, and preferably, preposition fan 1, rearmounted fan 12 all adopt the form of 2 fan parallel connections, and 1 fan noise is lower than using.Can further reduce the system noise value like this.
The utility model is arranged by each component locations in the system, and the layout of each component locations on the mainboard 7, important heat generating components all is positioned among the wind path of radiator fan, thereby these parts can be dispelled the heat fully, and the path of air flow is smooth and easy in the system, and air flow is not vulnerable to the influence of wire rod etc. in the cabinet.When the power of some parts increases, just can adjust the air mass flow of cooling off these parts by the perforate of adjusting on the wind scooper, make the heating power of air mass flow and these parts be complementary.
Above-mentioned embodiment is only for describing the technical solution of the utility model in detail; be not to restriction of the present utility model, the variation person that those skilled in the art is done under the situation of the purport that does not break away from technical solutions of the utility model is in protection domain of the present utility model.
Claims (10)
1. computer heat radiation system, comprise mainboard (7), integrated circuit board (8), hard disk (9), cabinet (13), power supply (6), on cabinet (13) front panel air inlet (14) is arranged, behind cabinet (13) rear panel air outlet (15) is arranged, it is characterized in that, also comprise the heat radiation module, described heat radiation module comprises one group of preposition fan (1) and one group of rearmounted fan (12), described preposition fan (1) and rearmounted fan (12) lay respectively at the corresponding position of cabinet (13) front and back panel, matching with air outlet (15) with air inlet (14) on the described cabinet is connected, and air-flow direction is identical.
2. computer heat radiation system according to claim 1 is characterized in that, described preposition fan (1) and rearmounted fan (12) are over against answering.
3. computer heat radiation system according to claim 1 is characterized in that, described preposition fan (1) or rearmounted fan (12) are two fan groups that fan is arranged side by side.
4. computer heat radiation system according to claim 1 is characterized in that, described preposition fan (1) and rearmounted fan (12) are respectively two fan groups that fan is arranged side by side.
5. according to the described computer heat radiation system of claim 1 to 4, it is characterized in that, be arranged in order the CPU (2) of mainboard (7) behind the described preposition fan (1), north bridge and south bridge (4), hard disk (9), back I/O (10), rearmounted fan (12); Described mainboard (7) is gone up CPU (2) and is positioned at mainboard (7) middle part near preposition fan (1) one side, and back I/O (10) is positioned at mainboard (7) edge; Described internal memory (5) is positioned at CPU (2) left side, and CPU transformation module (3) is positioned at CPU (2) right side; Described integrated circuit board (8) is positioned at hard disk (9) and I/O (10) right side, back.
6. computer heat radiation system according to claim 5 is characterized in that, described CPU (2) top is covered by cpu heat.
7. computer heat radiation system according to claim 6 is characterized in that, the gap that keeps 10～30mm between described hard disk (9) and the mainboard (7).
8. computer heat radiation system according to claim 7, it is characterized in that, described power supply (6) comprises the power supply fan (11) that is positioned at the power supply front portion, and described power supply fan (11) is drawn onto low temperature from the external world air directly flows to power supply (6), discharges by the exhaust outlet (16) of power supply then.
9. computer heat radiation system according to claim 8 is characterized in that, also comprises one with the air quantity of preposition fan (1) the wind scooper (20) between preposition fan (1) and the each component of computer of being positioned to the distribution of each parts of computer-internal.
10. computer heat radiation system according to claim 9 is characterized in that, the rear portion of described wind scooper has 3 air outlets, and air outlet A (21) is positioned at internal memory (5) the place ahead, is used for internal memory (5) heat radiation; In the middle of air outlet B (22) is positioned at, be used for the heat radiation of CPU (2), CPU transformation module (3), hard disk (9); Air outlet C (23) is positioned at power supply air inlet front, makes the space that forms sealing between the air inlet (14) of power supply fan (11) and case front panel, to power supply (6) air intake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520121938 CN2840166Y (en) | 2005-09-22 | 2005-09-22 | Novel computer radiating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520121938 CN2840166Y (en) | 2005-09-22 | 2005-09-22 | Novel computer radiating system |
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| Publication Number | Publication Date |
|---|---|
| CN2840166Y true CN2840166Y (en) | 2006-11-22 |
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| CN 200520121938 Expired - Fee Related CN2840166Y (en) | 2005-09-22 | 2005-09-22 | Novel computer radiating system |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950195A (en) * | 2010-09-06 | 2011-01-19 | 浪潮(北京)电子信息产业有限公司 | Low-noise case |
| CN102193605A (en) * | 2010-03-15 | 2011-09-21 | 联想(北京)有限公司 | Computing device |
| CN102455757A (en) * | 2010-10-28 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Computer case |
| CN104216485A (en) * | 2014-09-22 | 2014-12-17 | 中南林业科技大学 | Computer case |
| CN102830779B (en) * | 2012-09-07 | 2016-08-17 | 浪潮电子信息产业股份有限公司 | The method for designing that a kind of optimizing computer system radiating is energy-conservation |
| CN106354231A (en) * | 2016-11-02 | 2017-01-25 | 宋治远 | High-efficiency constant-temperature cooling case |
| CN107247493A (en) * | 2017-06-06 | 2017-10-13 | 郑州云海信息技术有限公司 | A kind of heat spreader structures for MINI PC products |
| CN109491469A (en) * | 2018-12-21 | 2019-03-19 | 郑州云海信息技术有限公司 | A kind of casing structure conducive to Hard disk heat radiation |
| CN110012649A (en) * | 2019-05-08 | 2019-07-12 | 苏州浪潮智能科技有限公司 | A kind of power supply heat sinking control method and system |
-
2005
- 2005-09-22 CN CN 200520121938 patent/CN2840166Y/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102193605A (en) * | 2010-03-15 | 2011-09-21 | 联想(北京)有限公司 | Computing device |
| CN102193605B (en) * | 2010-03-15 | 2013-03-20 | 联想(北京)有限公司 | Computing device |
| CN101950195A (en) * | 2010-09-06 | 2011-01-19 | 浪潮(北京)电子信息产业有限公司 | Low-noise case |
| CN101950195B (en) * | 2010-09-06 | 2012-12-26 | 浪潮(北京)电子信息产业有限公司 | Low-noise case |
| CN102455757A (en) * | 2010-10-28 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Computer case |
| CN102830779B (en) * | 2012-09-07 | 2016-08-17 | 浪潮电子信息产业股份有限公司 | The method for designing that a kind of optimizing computer system radiating is energy-conservation |
| CN104216485A (en) * | 2014-09-22 | 2014-12-17 | 中南林业科技大学 | Computer case |
| CN106354231A (en) * | 2016-11-02 | 2017-01-25 | 宋治远 | High-efficiency constant-temperature cooling case |
| CN106354231B (en) * | 2016-11-02 | 2023-07-21 | 广东福雪莱电气有限公司 | High-efficient constant temperature cooling machine case |
| CN107247493A (en) * | 2017-06-06 | 2017-10-13 | 郑州云海信息技术有限公司 | A kind of heat spreader structures for MINI PC products |
| CN109491469A (en) * | 2018-12-21 | 2019-03-19 | 郑州云海信息技术有限公司 | A kind of casing structure conducive to Hard disk heat radiation |
| CN110012649A (en) * | 2019-05-08 | 2019-07-12 | 苏州浪潮智能科技有限公司 | A kind of power supply heat sinking control method and system |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061122 Termination date: 20140922 |
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| EXPY | Termination of patent right or utility model |