CN220895843U

CN220895843U - Multilayer substrate and antenna module

Info

Publication number: CN220895843U
Application number: CN202322394037.4U
Authority: CN
Inventors: 川边健太朗
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2022-09-13
Filing date: 2023-09-04
Publication date: 2024-05-03
Anticipated expiration: 2033-09-04

Abstract

The utility model provides a multilayer substrate and an antenna module, which reduce the difference between the radiation modes of a first high-frequency signal and a second high-frequency signal and inhibit the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from inclining from the normal direction of the main surface of a radiation conductor layer. The first wiring layer is electrically connected to the first radiation conductor layer at a first power supply point located closest to the first straight line in the first outer edge, and does not orthogonally intersect the first straight line when viewed in the Z-axis direction. The second wiring layer is electrically connected to the first radiation conductor layer at a second power supply point located closest to the second straight line in the first outer edge, and does not orthogonally intersect the second straight line when viewed in the Z-axis direction.

Description

Multilayer substrate and antenna module

Technical Field

The present utility model relates to a multilayer substrate including a radiation conductor layer and an antenna module.

Background

As a conventional invention related to a multilayer substrate, an antenna module described in patent document 1 is known. The antenna module is provided with a radiation conductor layer, a first power supply point and a second power supply point. The first high-frequency signal is input to the radiation conductor layer via the first power supply point. The radiation conductor layer radiates the first high-frequency signal. The second high frequency signal is input to the radiation conductor layer via the second power supply point. The radiation conductor layer radiates the second high frequency signal. Further, the direction of the polarized wave of the first high frequency signal is different from the direction of the polarized wave of the second high frequency signal.

Prior art literature

Patent literature

Patent document 1: japanese patent application laid-open No. 2021-83121

Disclosure of utility model

Problems to be solved by the utility model

However, in the field of the antenna module described in patent document 1, there are the following desires: it is desirable to reduce the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal, and to suppress the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the normal direction of the main surface of the radiation conductor layer.

Accordingly, an object of the present utility model is to provide a multilayer substrate and an antenna module capable of reducing a difference between a radiation pattern of a first high-frequency signal and a radiation pattern of a second high-frequency signal and suppressing a tilt of a radiation direction of the first high-frequency signal and a radiation direction of the second high-frequency signal from a normal direction of a main surface of a radiation conductor layer.

Means for solving the problems

The multilayer substrate according to one embodiment of the present utility model comprises:

A laminated body having a structure in which a plurality of insulator layers are laminated in the Z-axis direction;

A first radiation conductor layer provided on the laminate and having a first outer edge including a first straight line and a second straight line when viewed in the Z-axis direction;

A ground conductor layer that is provided on the laminate, is located on the negative side of the Z-axis with respect to the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in the Z-axis direction;

a first wiring layer which is provided on the laminate, is located on the negative side of the Z axis with respect to the first radiation conductor layer, is located on the positive side of the Z axis with respect to the ground conductor layer, is electrically connected to the first radiation conductor layer at a first power supply point located closest to the first straight line in the first outer edge, and does not intersect the first straight line orthogonally when viewed in the Z axis direction; and

And a second wiring layer which is provided on the laminate, is positioned on the negative side of the Z axis with respect to the first radiation conductor layer and on the positive side of the Z axis with respect to the ground conductor layer, is electrically connected to the first radiation conductor layer at a second power supply point positioned closest to the second straight line in the first outer edge, and is not orthogonal to the second straight line when viewed in the Z axis direction.

An antenna module according to an embodiment of the present utility model includes a first substrate and a flexible second substrate,

The first substrate includes:

a first laminate having a structure in which a plurality of insulator layers are laminated in the Z-axis direction;

A first radiation conductor layer provided on the first laminate and having a first outer edge including a first straight line and a second straight line when viewed in the Z-axis direction;

A first wiring layer which is provided on the first laminate, is located on the negative side of the Z-axis with respect to the first radiation conductor layer, is electrically connected to the first radiation conductor layer at a first power feeding point located closest to the first straight line in the first outer edge, and does not intersect the first straight line orthogonally when viewed in the Z-axis direction; and

A second wiring layer provided on the first laminate, located on the negative side of the Z-axis with respect to the first radiation conductor layer, electrically connected to the first radiation conductor layer at a second power feeding point located closest to the second straight line in the first outer edge, and intersecting the second straight line so as not to be orthogonal to each other when viewed in the Z-axis direction,

The second substrate includes:

A second laminate having a structure in which a plurality of insulator layers are laminated in the Z-axis direction;

A seventh wiring layer provided on the second laminate and electrically connected to the first wiring layer;

An eighth wiring layer provided on the second laminate and electrically connected to the second wiring layer; and

A ground conductor layer which is provided on the second laminate, is located on the negative side of the Z axis with respect to the seventh wiring layer and the eighth wiring layer, and overlaps the first radiation conductor layer, the seventh wiring layer, and the eighth wiring layer when viewed in the Z axis direction,

The length of the second substrate in the Z-axis direction is shorter than the length of the first substrate in the Z-axis direction,

The second substrate is positioned on the negative side of the Z axis from the first substrate, and has a region that does not overlap with the first substrate when viewed in the Z axis direction.

Effects of the utility model

According to the present utility model, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal can be suppressed from being inclined from the normal direction of the main surface of the radiation conductor layer.

Drawings

Fig. 1 is an exploded perspective view of a multilayer substrate 10.

Fig. 2 is a view when the multilayer substrate 10 is seen from above.

Fig. 3 is a cross-sectional view of the multilayer substrate 10.

Fig. 4 is a cross-sectional view of the multilayer substrate 10, 110.

Fig. 5 is a top view of the multilayer substrate 110.

Fig. 6 is a cross-sectional view of the multilayer substrate 110.

Fig. 7 is a plan view of the multilayer substrate 10 a.

Fig. 8 is a plan view of the multilayer substrate 10 b.

Fig. 9 is a plan view of the multilayer substrate 10 c.

Fig. 10 is a plan view of the multilayer substrate 10 d.

Fig. 11 is an exploded perspective view of the multilayer substrate 10 e.

Fig. 12 is a plan view of the multilayer substrate 10 e.

Fig. 13 is a plan view of the multilayer substrate 10 f.

Fig. 14 is an exploded perspective view of the multilayer substrate 10 g.

Fig. 15 is a cross-sectional view of the multilayer substrate 10 g.

Fig. 16 is an exploded perspective view of the multilayer substrate 10 h.

Fig. 17 is a cross-sectional view of the multilayer substrate 10 h.

Fig. 18 is a plan view of the multilayer substrate 10 i.

Fig. 19 is a plan view of the multilayer substrate 10 j.

Fig. 20 is a plan view of the multilayer substrate 10 k.

Fig. 21 is a cross-sectional view of the antenna module 100.

Fig. 22 is an exploded perspective view of the multilayer substrate 210.

Fig. 23 is a cross-sectional view of the antenna module 100 a.

Description of the reference numerals

10. 10A to 10j, 210a: a multilayer substrate;

12. 112: a laminate;

14a to 14f, 114a to 114c: an insulator layer;

15a to 15c, 115a, 115b: a protective layer;

16: a first radiation conductor layer;

20: a first wiring layer;

22: a second wiring layer;

24. 26, 124-127: an external electrode;

28: a ground conductor layer;

30: a ring-shaped ground conductor layer;

100. 100a: an antenna module;

120: a seventh wiring layer;

122: an eighth wiring layer;

128: a first ground conductor layer;

129: a second ground conductor layer;

216: a second radiation conductor layer;

220: a third wiring layer;

222: a fourth wiring layer;

316: a third radiation conductor layer;

320: a fifth wiring layer;

322: a sixth wiring layer;

A1: a first region;

a2: a second region;

A3: a rigid portion;

A4: a flexible portion;

E1: a first straight line;

E2: a second straight line;

e3: a third straight line;

E4: a fourth straight line;

E5: a fifth straight line;

e6: a sixth straight line;

EE1: a first outer edge;

EE2: a second outer edge;

EE3: a third outer edge;

EP1: a first portion;

EP2: a second portion;

EP3: a third section;

H. h1 and h2: an opening;

p1: a first power supply point;

p2: a second power supply point;

p3: a third power supply point;

P4: a fourth power supply point;

P5: a fifth power supply point;

P6: a sixth power supply point;

s: solder;

ST: a stub portion;

v1 to v18: and an interlayer connection conductor.

Detailed Description

(Embodiment)

[ Structure of multilayer substrate 10 ]

Hereinafter, a structure of a multilayer substrate 10 according to an embodiment of the present utility model will be described with reference to the drawings. Fig. 1 is an exploded perspective view of a multilayer substrate 10. Fig. 2 is a view when the multilayer substrate 10 is seen from above. Fig. 3 is a cross-sectional view of the multilayer substrate 10. Fig. 3 is a cross-sectional view at A-A of fig. 2.

Hereinafter, the lamination direction of the laminated body 12 is defined as the up-down direction. The up-down direction is consistent with the Z-axis direction. The upward direction is the positive direction of the Z axis. The downward direction is the negative direction of the Z-axis. When the laminated body 12 is viewed in the up-down direction, two directions in which the sides of the laminated body 12 extend are defined as the left-right direction and the front-rear direction, respectively. The left-right direction is orthogonal to the up-down direction. The front-rear direction is orthogonal to the up-down direction and the left-right direction. The left-right direction is consistent with the X-axis direction. The right direction is the positive direction of the X-axis. The left direction is the negative direction of the X-axis. The front-rear direction coincides with the Y-axis direction. The front direction is the positive direction of the Y-axis. The rear direction is the negative direction of the Y-axis. Thus, the X-axis, Y-axis and Z-axis are orthogonal to each other. The definition of the direction in this specification is an example. Therefore, the direction of the multilayer substrate 10 in actual use does not necessarily coincide with the direction in the present specification. In each of the drawings, the vertical direction may be reversed. Similarly, in each drawing, the left-right direction may be reversed. In each of the drawings, the front-rear direction may be reversed.

The multilayer substrate 10 is used for a wireless communication terminal such as a smart phone. As shown in fig. 1, the multilayer substrate 10 includes a laminate 12, a first radiation conductor layer 16, a first wiring layer 20, a second wiring layer 22, external electrodes 24 and 26, a ground conductor layer 28, a ring-shaped ground conductor layer 30, and interlayer connection conductors v1 to v8. The first radiation conductor layer 16, the first wiring layer 20, the second wiring layer 22, the external electrodes 24 and 26, the ground conductor layer 28, the annular ground conductor layer 30, and the interlayer connection conductors v1 to v8 are provided in the laminate 12, respectively.

The laminated body 12 has a plate shape. As shown in fig. 1, the laminated body 12 has a rectangular shape when viewed in the up-down direction. The laminated body 12 has a structure in which insulator layers 14a to 14e and protective layers 15a, 15b are laminated in the up-down direction (Z-axis direction). The protective layer 15a, the insulator layers 14a to 14e, and the protective layer 15b are arranged in this order from the top down. The material of the insulator layers 14a to 14e is a thermoplastic resin such as polyimide or a liquid crystal polymer. The laminate 12 has flexibility. The protective layers 15a, 15b will be described later.

The first radiation conductor layer 16 radiates and/or receives the first high frequency signal. In the present embodiment, the first radiation conductor layer 16 is located on the upper main surface of the insulator layer 14 a. As shown in fig. 1, the first radiation conductor layer 16 has a quadrangular shape when viewed in the up-down direction. As shown in fig. 1, the first radiation conductor layer 16 has a diamond shape including diagonal lines extending in the front-rear direction and the left-right direction when viewed in the up-down direction.

Specifically, as shown in fig. 2, the first radiation conductor layer 16 has a first outer edge EE1 including a first straight line E1, a second straight line E2, and straight lines E101 and E102 (seventh straight line and eighth straight line) when viewed in the up-down direction (Z-axis direction). The first portion EP1 is a portion other than the first straight line E1 and the second straight line E2 in the first outer edge EE1. That is, the first portion EP1 is the straight lines E101, E102.

The first line E1 and the line E102 are parallel to each other. The second straight line E2 and the straight line E101 are parallel to each other. The second straight line E2 is orthogonal to the first straight line E1 when viewed in the up-down direction (Z-axis direction). The straight line E101 is orthogonal to the straight line E102 when viewed in the up-down direction (Z-axis direction). The right rear end (the positive side end of the X axis) of the first straight line E1 is connected to the right front end (the positive side end of the X axis) of the second straight line E2. The left front end of the first straight line E1 is connected to the right front end of the straight line E101. The left rear end of the second straight line E2 is connected to the right rear end of the straight line E102. The left rear end of the straight line E101 is connected to the left front end of the straight line E102.

The lengths of the first straight line E1, the second straight line E2, and the straight lines E101 and E102 are equal to each other. The lengths of the first straight line E1, the second straight line E2, and the straight lines E101 and E102 are, for example, 1/2 of the wavelength of the first high-frequency signal.

As shown in fig. 1 and 3, the ground conductor layer 28 is located below the first radiation conductor layer 16 (on the negative side of the Z axis). The ground conductor layer 28 is provided on the lower main surface of the insulator layer 14 e. As shown in fig. 1, the ground conductor layer 28 has a rectangular shape when viewed in the up-down direction. The long side of the ground conductor layer 28 extends in the left-right direction. The short sides of the ground conductor layer 28 extend in the front-rear direction. The ground conductor layer 28 overlaps the first radiation conductor layer 16 as viewed in the up-down direction. The ground conductor layer 28 is connected to a ground potential.

As shown in fig. 1 and 3, the annular ground conductor layer 30 is located above (on the positive side of the Z axis) the ground conductor layer 28. In the present embodiment, the position of the annular ground conductor layer 30 in the up-down direction is the same as the position of the first radiation conductor layer 16 in the up-down direction. Therefore, the annular ground conductor layer 30 is located on the upper main surface of the insulator layer 14 a.

The annular ground conductor layer 30 has an annular shape surrounding the periphery of the first radiation conductor layer 16 when viewed in the up-down direction (Z-axis direction). The outer and inner edges of the annular ground conductor layer 30 have a rectangular shape including two sides extending in the front-rear direction and two sides extending in the left-right direction. The annular ground conductor layer 30 is connected to a ground potential.

Here, as shown in fig. 2, distances L1 to L4 are defined as described below. The distance L1 (first distance), the distance L2 (second distance), the distance L3 (third distance), and the distance L4 (fourth distance) are equal to each other.

Distance L1: distance from center of first straight line E1 to annular ground conductor layer 30 in a direction orthogonal to first straight line E1

Distance L2: distance from center of second straight line E2 to annular ground conductor layer 30 in direction orthogonal to second straight line E2

Distance L3: a distance from the center of the straight line E101 (seventh straight line) to the annular ground conductor layer 30 in a direction orthogonal to the straight line E101 (seventh straight line)

Distance L4: a distance from the center of the straight line E102 (eighth straight line) to the annular ground conductor layer 30 in a direction orthogonal to the straight line E102 (eighth straight line)

As shown in fig. 1, the first wiring layer 20 is located below the first radiation conductor layer 16 (negative side of the Z axis) and above the ground conductor layer 28 (positive side of the Z axis). In the present embodiment, the first wiring layer 20 is located on the upper main surface of the insulator layer 14 d. The first wiring layer 20 has a line shape extending in the left-right direction when viewed in the up-down direction. The left end of the first wiring layer 20 overlaps the first radiation conductor layer 16 as viewed in the up-down direction. The right end of the first wiring layer 20 does not overlap the first radiation conductor layer 16 as viewed in the up-down direction. Thus, the first wiring layer 20 does not intersect the first line E1 perpendicularly when viewed in the vertical direction (Z-axis direction). In the present embodiment, the angle θ1 formed between the first wiring layer 20 and the first line E1 is 45 degrees. However, the angle θ1 is not limited to 45 degrees, and may be larger than 0 degrees and smaller than 90 degrees. The angle θ1 is, for example, 45 degrees ±22.5 degrees.

As shown in fig. 2, a region through which the first straight line E1 passes when the first straight line E1 is moved in a direction orthogonal to the first straight line E1 as viewed in the up-down direction (Z-axis direction) is defined as a first region A1. The first wiring layer 20 spans the first area A1 and an area outside the first area A1 when viewed in the up-down direction (Z-axis direction). The left end of the first wiring layer 20 is located in the first area A1 as viewed in the up-down direction. The right end of the first wiring layer 20 is located outside the first area A1 as viewed in the up-down direction.

The second wiring layer 22 is located below the first radiation conductor layer 16 (negative side of the Z axis) and above the ground conductor layer 28 (positive side of the Z axis). In the present embodiment, the second wiring layer 22 is located on the upper main surface of the insulator layer 14 d. The second wiring layer 22 is located at a position behind the first wiring layer 20 when viewed in the vertical direction. The second wiring layer 22 has a line shape extending in the left-right direction when viewed in the up-down direction. Thus, the second wiring layer 22 is parallel to the first wiring layer 20. The left end of the second wiring layer 22 overlaps the first radiation conductor layer 16 as viewed in the up-down direction. The right end of the second wiring layer 22 does not overlap the first radiation conductor layer 16 as viewed in the up-down direction. Thus, the second wiring layer 22 does not intersect the second straight line E2 orthogonally when viewed in the up-down direction (Z-axis direction). In the present embodiment, the angle θ2 formed by the second wiring layer 22 and the second straight line E2 is 45 degrees. However, the angle θ2 is not limited to 45 degrees, and may be larger than 0 degrees and smaller than 90 degrees. The angle θ2 is, for example, 45 degrees±22.5 degrees.

As shown in fig. 2, a region through which the second straight line E2 passes when the second straight line E2 is moved in a direction orthogonal to the second straight line E2 as viewed in the up-down direction (Z-axis direction) is defined as a second region A2. The second wiring layer 22 spans the second area A2 and an area outside the second area A2 when viewed in the up-down direction (Z-axis direction). The left end of the second wiring layer 22 is located in the second area A2 as viewed in the up-down direction. The right end of the second wiring layer 22 is located outside the second area A2 as viewed in the up-down direction.

As shown in fig. 1, the external electrodes 24 and 26 are provided on the lower main surface of the insulator layer 14 e. The external electrodes 24, 26 are not connected to the ground conductor layer 28. Thus, the external electrodes 24, 26 are located within openings provided in the ground conductor layer 28.

The external electrode 24 overlaps the right end portion of the first wiring layer 20 as viewed in the up-down direction. The external electrode 26 overlaps the right end portion of the second wiring layer 22 as viewed in the up-down direction. The first high-frequency signal is input or output with respect to the external electrode 24. The second high-frequency signal is input or output with respect to the external electrode 26.

The interlayer connection conductor v1 electrically connects the first radiation conductor layer 16 and the first wiring layer 20. More specifically, the interlayer connection conductor v1 penetrates the insulator layers 14a to 14c in the up-down direction. The upper end of the interlayer connection conductor v1 is in contact with the first radiation conductor layer 16 at the first power supply point P1. The first power supply point P1 is located in the first outer edge EE1 closest to the first straight line E1. In the present embodiment, the first power supply point P1 is located at a position closest to the midpoint of the first straight line E1 in the first straight line E1. The lower end of the interlayer connection conductor v1 is in contact with the left end portion of the first wiring layer 20. Thus, the first wiring layer 20 is electrically connected to the first radiation conductor layer 16 at the first power supply point P1.

The interlayer connection conductor v2 electrically connects the first radiation conductor layer 16 and the second wiring layer 22. More specifically, the interlayer connection conductor v2 penetrates the insulator layers 14a to 14c in the up-down direction. The upper end of the interlayer connection conductor v2 is in contact with the first radiation conductor layer 16 at the second power supply point P2. The second power supply point P2 is located in the first outer edge EE1 closest to the second straight line E2. In the present embodiment, the second power supply point P2 is located at a position closest to the midpoint of the second straight line E2 in the second straight line E2. The lower end of the interlayer connection conductor v2 is in contact with the left end portion of the second wiring layer 22. Thereby, the second wiring layer 22 is electrically connected to the first radiation conductor layer 16 at the second power supply point P2.

The interlayer connection conductor v3 electrically connects the first wiring layer 20 and the external electrode 24. More specifically, the interlayer connection conductor v3 penetrates the insulator layers 14d and 14e in the up-down direction. The upper end of the interlayer connection conductor v3 is in contact with the right end portion of the first wiring layer 20. The lower end of the interlayer connection conductor v3 is in contact with the external electrode 24.

The interlayer connection conductor v4 electrically connects the second wiring layer 22 with the external electrode 26. More specifically, the interlayer connection conductor v4 penetrates the insulator layers 14d and 14e in the up-down direction. The upper end of the interlayer connection conductor v4 is in contact with the right end portion of the second wiring layer 22. The lower end of the interlayer connection conductor v4 is in contact with the external electrode 26.

The interlayer connection conductors v5 to v8 electrically connect the ground conductor layer 28 and the annular ground conductor layer 30. More specifically, the interlayer connection conductors v5 to v8 penetrate the insulator layers 14a to 14e in the up-down direction. The upper ends of the interlayer connection conductors v5 to v8 are in contact with the annular ground conductor layer 30. The lower ends of the interlayer connection conductors v5 to v8 are in contact with the ground conductor layer 28.

The first radiation conductor layer 16, the first wiring layer 20, the second wiring layer 22, the external electrodes 24 and 26, the ground conductor layer 28, and the annular ground conductor layer 30 as described above are formed by patterning metal foils attached to the upper and lower main surfaces of the insulator layers 14a to 14 e. The metal foil is, for example, copper foil. The interlayer connection conductors v1 to v8 are formed by filling conductive paste into through holes penetrating the insulator layers 14a to 14e in the vertical direction, and curing the conductive paste by heating and pressurizing.

The protective layers 15a, 15b have a dielectric constant higher than that of the insulator layers 14a to 14 e. The protective layer 15a covers the upper main surface of the insulator layer 14 a. Thereby, the protection layer 15a protects the first radiation conductor layer 16 and the annular ground conductor layer 30. The protective layer 15b covers the lower main surface of the insulator layer 14 e. Thereby, the protective layer 15b protects the ground conductor layer 28. But the protective layer 15b is provided with an opening H. Thereby, the external electrodes 24 and 26 are exposed to the outside from the multilayer substrate 10 through the opening H.

In the multilayer substrate 10 as described above, the first radiation conductor layer 16 and the ground conductor layer 28 function as patch antennas that radiate or receive the first high-frequency signal and the second high-frequency signal. But the bias direction of the first high frequency signal is different from the bias direction of the second high frequency signal. Specifically, the first power supply point P1 is located near the first straight line E1. The second power supply point P2 is located near the second straight line E2. The first line E1 is orthogonal to the second line E2. Therefore, the bias direction of the first high frequency signal is orthogonal to the bias direction of the second high frequency signal. The bias direction at the time of receiving the first high-frequency signal and the second high-frequency signal is the same as the bias direction of transmitting the first high-frequency signal and the second high-frequency signal.

(Effect)

According to the multilayer substrate 10, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal can be suppressed from being inclined from the normal direction of the main surface of the radiation conductor layer. Hereinafter, the multilayer substrate 110 of the comparative example will be described as an example. Fig. 4 is a cross-sectional view of the multilayer substrate 10, 110. Fig. 4 is a cross-sectional view at B1-B1 of fig. 2, B2-B2 of fig. 2, and D-D of fig. 5. Fig. 5 is a top view of the multilayer substrate 110. Fig. 6 is a cross-sectional view of the multilayer substrate 110. Fig. 6 is a cross-sectional view at C-C of fig. 5.

The multilayer substrate 110 shown in fig. 5 is different from the multilayer substrate 10 in that the first wiring layer 20 is orthogonal to the first line E1. In the multilayer substrate 110, a first high-frequency signal is supplied to the first radiation conductor layer 16 via the first power supply point P1. Thereby, a standing wave is generated in the first straight line E1, and the first high-frequency signal is radiated. At this time, a power line E11 is generated from the first straight line E1 to the ground conductor layer 28. The power line E11 extends in a direction orthogonal to the first straight line E1 and in a downward direction.

Likewise, the second high-frequency signal is supplied to the first radiation conductor layer 16 via the second power supply point P2. Thereby, a standing wave is generated in the second straight line E2, radiating the second high frequency signal. At this time, the electric power line E12 is generated from the second straight line E2 to the ground conductor layer 28. The power line E12 extends in a direction orthogonal to the second straight line E2 and in a downward direction.

However, the first wiring layer 20 is orthogonal to the first line E1. Therefore, the first wiring layer 20 extends longer in the direction orthogonal to the first straight line E1. Therefore, as shown in fig. 6, the power line e11 is easily blocked by the first wiring layer 20. In this way, when the power line e11 is blocked by the first wiring layer 20, the radiation direction of the first high-frequency signal is inclined from the up-down direction toward the right-up direction.

In addition, the second wiring layer 22 is not orthogonal to the second straight line E2. Therefore, the second wiring layer 22 does not extend long in the direction orthogonal to the second straight line E2. Therefore, as shown in fig. 4, the power line e12 is hardly blocked by the second wiring layer 22. In this way, when the power line e12 is hardly shielded by the second wiring layer 22, the radiation direction of the second high-frequency signal is hardly inclined from the up-down direction. As a result, in the multilayer substrate 110, a difference is generated between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal.

In the multilayer substrate 10, the first wiring layer 20 does not intersect the first line E1 perpendicularly when viewed in the vertical direction (Z-axis direction). Further, the second wiring layer 22 does not intersect orthogonally with the second straight line E2 when viewed in the up-down direction (Z-axis direction). Thus, as shown in fig. 4, the power line e1 is hardly blocked by the first wiring layer 20. Further, as shown in fig. 4, the power line e2 is difficult to be blocked by the second wiring layer 22. As a result, the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal can be suppressed from being inclined from the normal direction (up-down direction) of the main surface of the first radiation conductor layer 16. Further, since the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal are suppressed from being inclined from the up-down direction, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal becomes small. In the present specification, the radiation direction of the high-frequency signal is the central axis of the radiation pattern of the high-frequency signal.

In the multilayer substrate 10, the first high-frequency signal reception direction and the second high-frequency signal reception direction are suppressed from being inclined from the vertical direction for the same reason as described above, and therefore, the difference between the first high-frequency signal reception mode and the second high-frequency signal reception mode is reduced.

According to the multilayer substrate 10, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal can be suppressed from being inclined from the normal direction of the main surface of the radiation electrode, for the following reasons. In more detail, the power line e1 is easily generated in the first area A1. The power line e2 is easily generated in the second area A2. Then, in the multilayer substrate 10, the first wiring layer 20 spans the first region A1 and the region outside the first region A1 when viewed in the up-down direction. Further, the second wiring layer 22 spans the second area A2 and an area outside the second area A2 when viewed in the up-down direction. Thereby, the length of the portion of the first wiring layer 20 located in the first region A1 becomes shorter. The length of the portion of the second wiring layer 22 located in the second region A2 becomes shorter. Thus, the power line e1 is hardly blocked by the first wiring layer 20. The power line e2 is hardly blocked by the second wiring layer 22. As a result, according to the multilayer substrate 10, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal can be suppressed from being inclined from the normal direction of the main surface of the radiation electrode.

According to the multilayer substrate 10, the distance L1, the distance L2, the distance L3, and the distance L4 are equal to each other. Thereby, the magnitude of the capacitance generated between the first straight line E1 and the annular ground conductor layer 30, the magnitude of the capacitance generated between the second straight line E2 and the annular ground conductor layer 30, the magnitude of the capacitance generated between the straight line E101 and the annular ground conductor layer 30, and the magnitude of the capacitance generated between the straight line E102 and the annular ground conductor layer 30 are close. As a result, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal can be suppressed from being inclined from the normal direction of the main surface of the radiation electrode.

(First modification)

The multilayer substrate 10a according to the first modification will be described below. Fig. 7 is a plan view of the multilayer substrate 10 a.

The multilayer substrate 10a is different from the multilayer substrate 10 in that it further includes a second radiation conductor layer 216, a third wiring layer 220, and a fourth wiring layer 222.

The second radiation conductor layer 216, the third wiring layer 220, and the fourth wiring layer 222 have the same structures as the first radiation conductor layer 16, the first wiring layer 20, and the second wiring layer 22, respectively. Specifically, the second radiation conductor layer 216 is provided on the laminated body 12. The second radiation conductor layer 216 has a second outer edge EE2 including a third straight line E3, a fourth straight line E4, a straight line E103, and a straight line E104 when viewed in the up-down direction (Z-axis direction). The fourth straight line E4 intersects the third straight line E3 when viewed in the up-down direction (Z-axis direction). The fourth straight line E4 is orthogonal to the third straight line E3 when viewed in the up-down direction (Z-axis direction). The ground conductor layer 28 overlaps the second radiation conductor layer 216 when viewed in the up-down direction (Z-axis direction).

The third wiring layer 220 is provided on the laminate 12. The third wiring layer 220 is located below the second radiation conductor layer 216 (negative side of the Z axis) and above the ground conductor layer 28 (positive side of the Z axis). The third wiring layer 220 is electrically connected to the second radiation conductor layer 216 at a third power supply point P3 located closest to the third straight line E3 in the second outer edge EE 2. The third wiring layer 220 does not intersect the third straight line E3 orthogonally when viewed in the up-down direction (Z-axis direction).

The fourth wiring layer 222 is provided on the laminate 12. The fourth wiring layer 222 is located below the second radiation conductor layer 216 (negative side of the Z axis) and above the ground conductor layer 28 (positive side of the Z axis). The fourth wiring layer 222 is electrically connected to the second radiation conductor layer 216 at a fourth power supply point P4 located closest to the fourth straight line E4 in the second outer edge EE 2. The fourth wiring layer 222 does not intersect the fourth straight line E4 orthogonally when viewed in the up-down direction (Z-axis direction).

The second radiation conductor layer 216 is located on the right side (positive side of the X axis) of the first radiation conductor layer 16. The first straight line E1 and the second straight line E2 are located on the right (positive side of the X axis) of the first portion EP1 other than the first straight line E1 and the second straight line E2 in the first outer edge EE 1. The third straight line E3 and the fourth straight line E4 are located to the left (negative side of the X axis) of the second portion EP2 other than the third straight line E3 and the fourth straight line E4 in the second outer edge EE 2. Other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted. The multilayer substrate 10a can provide the same operational effects as the multilayer substrate 10.

According to the multilayer substrate 10a, the first radiation conductor layer 16 and the second radiation conductor layer 216 are suppressed from being coupled to each other, and therefore, the gain of the first radiation conductor layer 16 and the second radiation conductor layer 216 is suppressed from being reduced. More specifically, in the first radiation conductor layer 16, the intensity of the electric field increases in the straight lines E101 and E102. In the second radiation conductor layer 216, the intensity of the electric field becomes high in the straight lines E103, E104. Therefore, the lines E101 and E102 are easily electrically coupled to the third wiring layer 220 and the fourth wiring layer 222. The straight lines E103 and E104 are easily coupled with the electric field of the first wiring layer 20 and the second wiring layer 22. In the multilayer substrate 10a, the first straight line E1 and the second straight line E2 are located on the right side of the first portion EP1 other than the first straight line E1 and the second straight line E2 in the first outer edge EE 1. The third straight line E3 and the fourth straight line E4 are located to the left of the second portion EP2 other than the third straight line E3 and the fourth straight line E4 in the second outer edge EE 2. Thus, the straight lines E101 and E102 are located away from the third wiring layer 220 and the fourth wiring layer 222. The straight lines E103 and E104 are located away from the first wiring layer 20 and the second wiring layer 22. Therefore, the first radiation conductor layer 16 and the second radiation conductor layer 216 are suppressed from being coupled to each other, and therefore, the gain of the first radiation conductor layer 16 and the second radiation conductor layer 216 is suppressed from being reduced.

(Second modification)

The multilayer substrate 10b according to the second modification will be described below. Fig. 8 is a plan view of the multilayer substrate 10 b.

The multilayer substrate 10b is different from the multilayer substrate 10a in that it further includes a third radiation conductor layer 316, a fifth wiring layer 320, and a sixth wiring layer 322.

The third radiation conductor layer 316 is provided on the laminated body 12. The third radiation conductor layer 316 has a third outer edge EE3 including a fifth straight line E5, a sixth straight line E6, a straight line E105, and a straight line E106 when viewed in the up-down direction (Z-axis direction). The sixth straight line E6 intersects the fifth straight line E5 as viewed in the up-down direction (Z-axis direction). The sixth straight line E6 is orthogonal to the fifth straight line E5 when viewed in the up-down direction (Z-axis direction). The ground conductor layer 28 overlaps the third radiation conductor layer 316 when viewed in the vertical direction (Z-axis direction).

The fifth wiring layer 320 is provided on the laminate 12. The third wiring layer 220 is located below the third radiation conductor layer 316 (negative side of the Z axis) and above the ground conductor layer 28 (positive side of the Z axis). The fifth wiring layer 320 is electrically connected to the third radiation conductor layer 316 at a fifth power supply point P5 located closest to the fifth straight line E5 in the third outer edge EE 3. The fifth wiring layer 320 does not intersect the fifth straight line E5 orthogonally when viewed in the up-down direction (Z-axis direction).

The sixth wiring layer 322 is provided on the laminate 12. The sixth wiring layer 322 is located below the third radiation conductor layer 316 (negative side of the Z axis) and above the ground conductor layer 28 (positive side of the Z axis). The sixth wiring layer 322 is electrically connected to the third radiation conductor layer 316 at a sixth power supply point P6 located closest to the sixth straight line E6 in the third outer edge EE 3. The sixth wiring layer 322 does not intersect the sixth straight line E6 orthogonally when viewed in the up-down direction (Z-axis direction).

The third radiation conductor layer 316 is located on the right side (positive side of the X-axis) of the second radiation conductor layer 216. The fifth line E5 and the sixth line E6 are located on the right (positive side of the X axis) of the third portion EP3 other than the fifth line E5 and the sixth line E6 in the third outer edge EE 3. Other structures of the multilayer substrate 10b are the same as those of the multilayer substrate 10a, and therefore, description thereof is omitted. The multilayer substrate 10b can provide the same operational effects as the multilayer substrate 10 a.

In addition, according to the multilayer substrate 10b, the third wiring layer 220 and the fourth wiring layer 222 are separated from the fifth wiring layer 320 and the sixth wiring layer 322. As a result, the second radiation conductor layer 216 and the third radiation conductor layer 316 are suppressed from being coupled.

(Third modification)

The multilayer substrate 10c according to the third modification will be described below. Fig. 9 is a plan view of the multilayer substrate 10 c.

The multilayer substrate 10c differs from the multilayer substrate 10b in the positions of the first radiation conductor layer 16, the second radiation conductor layer 216, and the third radiation conductor layer 316. In more detail, the second radiation conductor layer 216 is located on the right side (positive side of the X axis) of the first radiation conductor layer 16. The third radiation conductor layer 316 is located on the right side (positive side of the X-axis) of the second radiation conductor layer 216. The first straight line E1, the third straight line E3, and the fifth straight line E5 are parallel to the left-right direction (X axis). The second straight line E2, the fourth straight line E4, and the sixth straight line E6 overlap each other when viewed in the left-right direction (X-axis direction). The right end (positive side end of X axis) of the first straight line E1 is connected to the front end (positive side end of Y axis) of the second straight line E2. The right end (the positive end of the X axis) of the third straight line E3 is connected to the front end (the positive end of the Y axis) of the fourth straight line E4. The right end (positive side end of X axis) of the fifth straight line E5 is connected to the front end (positive side end of Y axis) of the sixth straight line E6. Other structures of the multilayer substrate 10c are the same as those of the multilayer substrate 10b, and therefore, description thereof is omitted.

The multilayer substrate 10c can bring the degree of coupling of the first radiation conductor layer 16 and the second radiation conductor layer 216 and the degree of coupling of the second radiation conductor layer 216 and the third radiation conductor layer 316 close. More specifically, in the first radiation conductor layer 16, the intensity of the electric field increases in the straight lines E101 and E102. In the second radiation conductor layer 216, the intensity of the electric field becomes high in the straight lines E103, E104. In the third radiation conductor layer 316, the intensity of the electric field becomes high in the straight lines E105, E106. Then, the second straight line E2 is opposite to the straight line E103. The fourth straight line E4 is opposite to the straight line E105. This makes it possible to bring the degree of coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 and the degree of coupling between the second radiation conductor layer 216 and the third radiation conductor layer 316 close to each other. As a result, the high-frequency signal radiated from the entire first radiation conductor layer 16, the second radiation conductor layer 216, and the third radiation conductor layer 316 can be suppressed from being inclined from the normal direction of the main surface of the radiation conductor layer.

(Fourth modification)

The multilayer substrate 10d according to the fourth modification will be described below. Fig. 10 is a plan view of the multilayer substrate 10 d.

The multilayer substrate 10d differs from the multilayer substrate 10b in the positions of the first radiation conductor layer 16, the second radiation conductor layer 216, and the third radiation conductor layer 316. In more detail, the second radiation conductor layer 216 is located on the right side (positive side of the X axis) of the first radiation conductor layer 16. The third radiation conductor layer 316 is located on the right side (positive side of the X-axis) of the second radiation conductor layer 216.

The first straight line E1 and the second straight line E2 are located on the left (negative side of the X axis) of the first portion EP1 other than the first straight line E1 and the second straight line E2 in the first outer edge EE 1. The third straight line E3 and the fourth straight line E4 are located at positions further rearward (on the negative side of the Y axis) than the second portion EP2 other than the third straight line E3 and the fourth straight line E4 in the second outer edge EE 2. The fifth straight line E5 and the sixth straight line E6 are located to the left (negative side of the X axis) of the third portion EP3 other than the fifth straight line E5 and the sixth straight line E6 in the third outer edge EE 3. Other structures of the multilayer substrate 10d are the same as those of the multilayer substrate 10b, and therefore, description thereof is omitted.

(Fifth modification)

The multilayer substrate 10e of the fifth modification will be described below. Fig. 11 is an exploded perspective view of the multilayer substrate 10 e. Fig. 12 is a plan view of the multilayer substrate 10 e.

The multilayer substrate 10e is different from the multilayer substrate 10 in that it further includes a second radiation conductor layer 216, a third wiring layer 220, and a fourth wiring layer 222. The second radiation conductor layer 216 is provided on the laminated body 12. The second radiation conductor layer 216 is located below (on the negative side of the Z-axis) the first radiation conductor layer 16. The second radiation conductor layer 216 overlaps the first radiation conductor layer 16 as viewed in the up-down direction (Z-axis direction). The second radiation conductor layer 216 has a second outer edge EE2 including a third straight line E3 and a fourth straight line E4 when viewed in the up-down direction (Z-axis direction).

The right end (the positive side end of the X axis) of the third straight line E3 is connected to the right end (the positive side end of the X axis) of the fourth straight line E4. The third line E3 is parallel to the first line E1. The fourth straight line E4 is parallel to the second straight line E2.

The first wiring layer 20 does not intersect the first line E1 and the third line E3 perpendicularly when viewed in the vertical direction (Z-axis direction). The second wiring layer 22 does not intersect the second straight line E2 and the fourth straight line E4 orthogonally when viewed in the up-down direction (Z-axis direction). Other structures of the multilayer substrate 10e are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted. The multilayer substrate 10e can provide the same operational effects as the multilayer substrate 10.

According to the multilayer substrate 10e, the first radiation conductor layer 16 and the second radiation conductor layer 216 are suppressed from being coupled to each other, and therefore, the gain of the first radiation conductor layer 16 and the second radiation conductor layer 216 is suppressed from being reduced. More specifically, in the first radiation conductor layer 16, the intensity of the electric field increases in the straight lines E101 and E102. In the second radiation conductor layer 216, the intensity of the electric field becomes high in the straight lines E103, E104. Therefore, the lines E101 and E102 are easily electrically coupled to the third wiring layer 220 and the fourth wiring layer 222. The straight lines E103 and E104 are easily coupled with the electric field of the first wiring layer 20 and the second wiring layer 22.

Then, in the multilayer substrate 10E, the first straight line E1 is parallel to the third straight line E3. The second line E2 is parallel to the fourth line E4. The right end of the first straight line E1 is connected to the right end of the second straight line E2. The right end of the third straight line E3 is connected to the right end of the fourth straight line E4. Thus, the first wiring layer 20 and the second wiring layer 22 are no longer located in the vicinity of the straight lines E103, E104. The third wiring layer 220 and the fourth wiring layer 222 are no longer located in the vicinity of the straight lines E101, E102. This suppresses the mutual coupling of the first radiation conductor layer 16 and the second radiation conductor layer 216, and therefore suppresses the decrease in gain of the first radiation conductor layer 16 and the second radiation conductor layer 216.

The first wiring layer 20 and the second wiring layer 22 of the second radiation conductor layer 216 are led out so as to be away from the straight lines E101 and E102 in which the intensity of the electric field generated by the first radiation conductor layer 16 is high. This suppresses the coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216, and can reduce the gain drop of the first radiation conductor layer 16 and the second radiation conductor layer 216.

(Sixth modification)

The multilayer substrate 10f according to the sixth modification will be described below. Fig. 13 is a plan view of the multilayer substrate 10 f.

The multilayer substrate 10f differs from the multilayer substrate 10c in the configuration of the second radiation conductor layer 216. More specifically, the rear end (the negative end of the Y axis) of the third straight line E3 is connected to the left end (the negative end of the X axis) of the fourth straight line E4. Other structures of the multilayer substrate 10f are the same as those of the multilayer substrate 10c, and therefore, description thereof is omitted.

(Seventh modification)

The multilayer substrate 10g of the seventh modification will be described below. Fig. 14 is an exploded perspective view of the multilayer substrate 10 g. Fig. 15 is a cross-sectional view of the multilayer substrate 10 g.

The multilayer substrate 10g is different from the multilayer substrate 10 in that it has a rigid portion A3 and a flexible portion A4 and further includes a first ground conductor layer 128 and interlayer connection conductors v9 to v 12.

As shown in fig. 14 and 15, the rigid portion A3 is a portion having a length in the up-down direction (Z-axis direction) longer than that of the flexible portion A4. In the present modification, the rigid portion A3 overlaps the protective layer 15a when viewed in the up-down direction (Z-axis direction). The flexible portion A4 is a portion having a length in the up-down direction (Z-axis direction) shorter than that of the rigid portion A3. In the present modification, the flexible portion A4 is located on the right side of the rigid portion A3. The first wiring layer 20 spans the rigid portion A3 and the flexible portion A4. The second wiring layer 22 spans the rigid portion A3 and the flexible portion A4. The ground conductor layer 28 spans the rigid portion A3 and the flexible portion A4. In the rigid portion A3, no ground conductor is provided between the annular ground conductor layer 30 and the ground conductor layer 28. The external electrodes 24, 26 and the opening H are provided in the flexible portion A4. Other structures of the rigid portion A3 are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted. The structure of the flexible portion A4 will be described in detail below.

In the flexible portion A4, the laminated body 12 has a structure in which the insulator layers 14c to 14e and the protective layers 15b, 15c are laminated in the up-down direction (Z-axis direction). The protective layer 15c, the insulator layers 14c to 14e, and the protective layer 15b are arranged in this order from the top down.

The first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14 c. The first ground conductor layer 128 has a rectangular shape when viewed in the up-down direction. The long side of the first ground conductor layer 128 extends in the left-right direction. The short sides of the first ground conductor layer 128 extend in the front-rear direction. The first ground conductor layer 128 overlaps the first wiring layer 20 and the second wiring layer 22 when viewed in the up-down direction. The first ground conductor layer 128 is connected to a ground potential.

The interlayer connection conductors v9 to v12 electrically connect the first ground conductor layer 128 and the ground conductor layer 28. More specifically, the interlayer connection conductors v9 to v12 penetrate the insulator layers 14c to 14e in the up-down direction. The upper ends of the interlayer connection conductors v9 to v12 are in contact with the first ground conductor layer 128. The lower ends of the interlayer connection conductors v9 to v12 are in contact with the ground conductor layer 28.

The first ground conductor layer 128 is formed by patterning a metal foil attached to the upper main surface of the insulator layer 14 c. The metal foil is, for example, copper foil. The interlayer connection conductors v9 to v12 are formed by filling conductive paste into through holes penetrating the insulator layers 14c to 14e in the vertical direction, and curing the conductive paste by heating and pressurizing.

The protective layer 15c has a dielectric constant higher than that of the insulator layers 14a to 14 e. In the flexible portion A4, the protective layer 15c covers the upper main surface of the insulator layer 14 c. Thereby, the protective layer 15c protects the first ground conductor layer 128.

The structures of the external electrodes 24, 26 and the opening H are the same as those of the multilayer substrate 10, and therefore, the description thereof is omitted. Other structures of the multilayer substrate 10g are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted.

The multilayer substrate 10g can provide the same operational effects as the multilayer substrate 10.

(A) According to the multilayer substrate 10g, bending processing of the multilayer substrate 10g is easy. More specifically, the multilayer substrate 10g has a rigid portion A3 and a flexible portion A4. The length of the flexible portion A4 in the up-down direction (Z-axis direction) is shorter than the length of the rigid portion A3 in the up-down direction (Z-axis direction). Therefore, the flexible portion A4 is more easily deformed than the rigid portion A3. That is, the flexible portion A4 is easily bent. This makes it possible to easily bend the multilayer substrate 10 g. As a result, the multilayer substrate 10g is easily subjected to bending.

(B) According to the multilayer substrate 10g, the length of the rigid portion A3 in the up-down direction (Z-axis direction) can be shortened. More specifically, in the rigid portion A3, the first wiring layer 20 and the second wiring layer 22 are located below the annular ground conductor layer 30 and above the ground conductor layer 28, respectively. Accordingly, the annular ground conductor layer 30 and the ground conductor layer 28 suppress noise from entering the inside of each of the first wiring layer 20 and the second wiring layer 22.

(C) According to the multilayer substrate 10g, compared to the case where the ground conductor is provided between the annular ground conductor layer 30 and the ground conductor layer 28, the capacitance generated between the first radiation conductor layer 16 and the ground conductor can be suppressed.

(Eighth modification)

The multilayer substrate 10h according to the eighth modification will be described below. Fig. 16 is an exploded perspective view of the multilayer substrate 10 h. Fig. 17 is a cross-sectional view of the multilayer substrate 10 h.

The multilayer substrate 10h differs from the multilayer substrate 10 in that it has the rigid portion A3 and the flexible portion A4, and further includes the seventh wiring layer 120, the eighth wiring layer 122, the first ground conductor layer 128, and the interlayer connection conductors v9 to v12, v15, and v16, and further includes the interlayer connection conductor v13, and further includes the interlayer connection conductor v 14.

As shown in fig. 16 and 17, the rigid portion A3 is a portion having a length in the up-down direction (Z-axis direction) longer than that of the flexible portion A4. In the present modification, the rigid portion A3 overlaps the protective layer 15a when viewed in the up-down direction (Z-axis direction). The flexible portion A4 is a portion having a length in the up-down direction (Z-axis direction) shorter than that of the rigid portion A3. In the present modification, the flexible portion A4 is located on the right side of the rigid portion A3. First, the structure of the rigid portion A3 will be described in detail. Next, the structure of the flexible portion A4 will be described in detail.

In the rigid portion A3, the laminated body 12 has a structure in which the insulator layers 14a to 14f and the protective layers 15a, 15b are laminated in the up-down direction (Z-axis direction). The protective layer 15a, the insulator layers 14a to 14f, and the protective layer 15b are arranged in this order from the top down. The material of the insulator layer 14f is a thermoplastic resin such as polyimide or a liquid crystal polymer. The laminate 12 has flexibility.

In the present modification, the first wiring layer 20 and the second wiring layer 22 are located on the upper main surface of the insulator layer 14 b. The interlayer connection conductors v1 and v2 penetrate the insulator layer 14a in the up-down direction. The ground conductor layer 28 is provided on the lower main surface of the insulator layer 14 f. The protective layer 15b covers the lower main surface of the insulator layer 14 f. Thereby, the protective layer 15b protects the ground conductor layer 28.

The seventh wiring layer 120 is provided on the laminate 12. The seventh wiring layer 120 is located below the first wiring layer 20 (negative side of the Z axis) and above the ground conductor layer 28 (positive side of the Z axis). In the present modification, the seventh wiring layer 120 is located on the upper main surface of the insulator layer 14 e. In addition, the seventh wiring layer 120 has a line shape extending in the left-right direction when viewed in the up-down direction. The seventh wiring layer 120 spans the rigid portion A3 and the flexible portion A4. In addition, the seventh wiring layer 120 does not overlap with the first radiation conductor layer 16 when viewed in the up-down direction.

The eighth wiring layer 122 is provided on the laminate 12. The eighth wiring layer 122 is located below (negative side of the Z axis) the second wiring layer 22 and above (positive side of the Z axis) the ground conductor layer 28. In the present modification, the eighth wiring layer 122 is located on the upper main surface of the insulator layer 14 e. The eighth wiring layer 122 is located at a position later than the seventh wiring layer 120 when viewed in the vertical direction. The eighth wiring layer 122 has a line shape extending in the left-right direction when viewed in the up-down direction. The eighth wiring layer 122 spans the rigid portion A3 and the flexible portion A4. In addition, the eighth wiring layer 122 does not overlap with the first radiation conductor layer 16 when viewed in the up-down direction.

The interlayer connection conductor v13 electrically connects the first wiring layer 20 and the seventh wiring layer 120. More specifically, the interlayer connection conductor v13 penetrates the insulator layers 14b to 14d in the up-down direction. The upper end of the interlayer connection conductor v13 is in contact with the right end portion of the first wiring layer 20. The lower end of the interlayer connection conductor v13 is in contact with the left end portion of the seventh wiring layer 120. Thus, the seventh wiring layer 120 is electrically connected to the first wiring layer 20.

The interlayer connection conductor v14 electrically connects the second wiring layer 22 and the eighth wiring layer 122. More specifically, the interlayer connection conductor v14 penetrates the insulator layers 14b to 14d in the up-down direction. The upper end of the interlayer connection conductor v14 is in contact with the right end portion of the second wiring layer 22. The lower end of the interlayer connection conductor v14 is in contact with the left end portion of the eighth wiring layer 122. Thereby, the eighth wiring layer 122 is electrically connected to the second wiring layer 22.

The interlayer connection conductors v13 and v14 are formed by filling conductive paste into through holes penetrating the insulator layers 14b to 14d in the vertical direction, and curing the conductive paste by heating and pressurizing.

The ground conductor layer 28 spans the rigid portion A3 and the flexible portion A4. The external electrodes 24, 26 and the opening H are provided in the flexible portion A4. Other structures of the rigid portion A3 are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted. The structure of the flexible portion A4 will be described in detail below.

In the flexible portion A4, the laminated body 12 has a structure in which the insulator layers 14d to 14f and the protective layers 15b, 15c are laminated in the up-down direction (Z-axis direction). The protective layer 15c, the insulator layers 14d to 14f, and the protective layer 15b are arranged in this order from the top down.

In the flexible portion A4, the first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14 d. The first ground conductor layer 128 overlaps the seventh wiring layer 120 and the eighth wiring layer 122 when viewed in the up-down direction. Other structures of the first ground conductor layer 128 are the same as those of the multilayer substrate 10g, and therefore description thereof is omitted.

In the flexible portion A4, the interlayer connection conductors v9 to v12 penetrate the insulator layers 14d to 14f in the up-down direction. Other structures of the interlayer connection conductors v9 to v12 are the same as those of the multilayer substrate 10g, and therefore description thereof is omitted.

The interlayer connection conductor v15 electrically connects the seventh wiring layer 120 with the external electrode 24. More specifically, the interlayer connection conductor v15 penetrates the insulator layers 14e and 14f in the up-down direction. The upper end of the interlayer connection conductor v15 is in contact with the right end of the seventh wiring layer 120. The lower end of the interlayer connection conductor v15 is in contact with the external electrode 24.

The interlayer connection conductor v16 electrically connects the eighth wiring layer 122 with the external electrode 26. More specifically, the interlayer connection conductor v16 penetrates the insulator layers 14e and 14f in the up-down direction. The upper end of the interlayer connection conductor v16 is in contact with the right end portion of the eighth wiring layer 122. The lower end of the interlayer connection conductor v16 is in contact with the external electrode 26.

The interlayer connection conductors v15 and v16 are formed by filling conductive paste into through holes penetrating the insulator layers 14e and 14f in the vertical direction, and curing the conductive paste by heating and pressurizing.

The protective layer 15c has a dielectric constant higher than that of the insulator layers 14a to 14 e. In the flexible portion A4, the protective layer 15c covers the upper main surface of the insulator layer 14 d. Thereby, the protective layer 15c protects the first ground conductor layer 128.

The external electrodes 24 and 26 are provided on the lower main surface of the insulator layer 14 f. Other structures of the external electrodes 24 and 26 are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted.

The structure of the opening H is the same as that of the multilayer substrate 10, and therefore, description thereof is omitted. Other structures of the multilayer substrate 10h are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted.

The multilayer substrate 10h can provide the same operational effects as the multilayer substrate 10. Further, according to the multilayer substrate 10h, the effects of (a) to (c) can be achieved.

(D) According to the multilayer substrate 10h, by adjusting the length (width) of each of the first wiring layer 20 and the second wiring layer 22 in the direction orthogonal to the vertical direction, the characteristic impedance can be matched at a position close to the first radiation conductor layer 16. Thereby, loss can be reduced, and the reflected wave can be supplied to the first radiation conductor layer 16.

(Ninth modification)

The multilayer substrate 10i according to the ninth modification will be described below. Fig. 18 is a plan view of the multilayer substrate 10 i.

The multilayer substrate 10i differs from the multilayer substrate 10 in that the first wiring layer 20 and the second wiring layer 22 include the matching portion PMC. In this modification, the length of the matching portion PMC of the first wiring layer 20 in the front-rear direction is longer than the length of the portion other than the matching portion PMC of the first wiring layer 20 in the front-rear direction. The length of the matching portion PMC of the second wiring layer 22 in the front-rear direction is longer than the length of the portion other than the matching portion PMC of the second wiring layer 22 in the front-rear direction. The matching portion PMC does not overlap the first radiation conductor layer 16 when viewed in the up-down direction (Z-axis direction).

The multilayer substrate 10i can provide the same operational effects as the multilayer substrate 10. In addition, according to the multilayer substrate 10i, the coupling of the matching portion PMC and the first radiation conductor layer 16 is suppressed. More specifically, since the matching unit PMC is provided near the first radiation conductor layer 16, the loss can be reduced and the reflected wave can be supplied to the first radiation conductor layer 16, it is preferable to provide the matching unit PMC to the first wiring layer 20 and the second wiring layer 22. Here, the matching portion PMC does not overlap with the first radiation conductor layer 16 when viewed in the up-down direction (Z-axis direction). Therefore, the matching portion PMC can be located away from the first radiation conductor layer 16. As a result, according to the multilayer substrate 10i, the coupling of the matching section PMC and the first radiation conductor layer 16 is suppressed.

(Tenth modification)

The multilayer substrate 10j of the tenth modification will be described below. Fig. 19 is a plan view of the multilayer substrate 10 j.

The multilayer substrate 10j differs from the multilayer substrate 10 in that the first wiring layer 20 and the second wiring layer 22 include the stub portion ST. In the present modification, the stub portion ST is an open stub that is not connected to the ground potential. The stub portion ST has a line shape extending in the front-rear direction when viewed in the up-down direction. The stub portion ST does not overlap with the first radiation conductor layer 16 when viewed in the up-down direction (Z-axis direction).

The multilayer substrate 10j can provide the same operational effects as the multilayer substrate 10. In addition, according to the multilayer substrate 10j, the stub portion ST is suppressed from being coupled with the first radiation conductor layer 16. More specifically, by providing the stub portion ST at a position close to the first radiation conductor layer 16, it is possible to reduce loss and supply reflected waves to the first radiation conductor layer 16, and therefore, it is preferable to provide the stub portion ST to the first wiring layer 20 and the second wiring layer 22. Here, the stub portion ST does not overlap with the first radiation conductor layer 16 when viewed in the up-down direction (Z-axis direction). Therefore, the stub portion ST can be located at a position distant from the first radiation conductor layer 16. As a result, according to the multilayer substrate 10i, the stub portion ST is suppressed from being coupled with the first radiation conductor layer 16.

(Eleventh modification)

The multilayer substrate 10k according to the eleventh modification will be described below. Fig. 20 is a plan view of the multilayer substrate 10 k.

The multilayer substrate 10k is different from the multilayer substrate 10h in that the seventh wiring layer 120 is orthogonal to the first straight line E1 when viewed in the up-down direction (Z-axis direction). Other structures of the multilayer substrate 10k are the same as those of the multilayer substrate 10h, and therefore, description thereof is omitted.

The multilayer substrate 10k can provide the same operational effects as the multilayer substrate 10 h. In addition, according to the multilayer substrate 10k, the distance between the seventh wiring layer 120 and the first radiation conductor layer 16 is larger than the distance between the first wiring layer 20 and the first radiation conductor layer 16. Therefore, if the first wiring layer 20 does not intersect the first straight line E1 orthogonally when viewed in the up-down direction (Z-axis direction), and the second wiring layer 22 does not intersect the second straight line E2 orthogonally when viewed in the up-down direction (Z-axis direction), the seventh wiring layer 120 may also intersect the first straight line E1 orthogonally when viewed in the up-down direction (Z-axis direction).

(E) According to the multilayer substrate 10k, the degree of freedom of wiring layout is improved. More specifically, the seventh wiring layer 120 may be orthogonal to the first line E1 when viewed in the vertical direction (Z-axis direction). The eighth wiring layer 122 may be orthogonal to the second line E2 when viewed in the vertical direction (Z-axis direction).

(Twelfth modification)

The antenna module 100 according to the twelfth modification will be described below. Fig. 21 is a cross-sectional view of the antenna module 100. Fig. 22 is an exploded perspective view of the multilayer substrate 210.

The antenna module 100 is used for a wireless communication terminal such as a smart phone. The antenna module 100 includes a multilayer substrate 10 and a multilayer substrate 210.

As shown in fig. 21, the multilayer substrate 210 is located lower (negative side of the Z axis) than the multilayer substrate 10. The multilayer substrate 210 has a region AR1 that overlaps the multilayer substrate 10 when viewed in the up-down direction (Z-axis direction) and a region AR2 that does not overlap the multilayer substrate 10 when viewed in the up-down direction (Z-axis direction). Hereinafter, the structure of the multilayer substrate 210 will be described in detail.

The multilayer substrate 210 includes the laminate 112, the seventh wiring layer 120, the eighth wiring layer 122, the external electrodes 124 to 127, the first ground conductor layer 128, the second ground conductor layer 129, and the interlayer connection conductors v9 to v12, v15 to v18. As shown in fig. 22, the seventh wiring layer 120, the eighth wiring layer 122, the external electrodes 124 to 127, the first ground conductor layer 128, the second ground conductor layer 129, and the interlayer connection conductors v9 to v12, v15 to v18 are provided in the laminate 112, respectively. The multilayer substrate 10 corresponds to a "first substrate" of the present utility model. The multilayer substrate 210 corresponds to a "second substrate" of the present utility model. The laminated body 12 corresponds to a "first laminated body" of the present utility model. Laminate 112 corresponds to the "second laminate" of the present utility model.

The laminated body 112 has a plate shape. The laminated body 112 has a rectangular shape when viewed in the up-down direction. The laminated body 112 has a structure in which insulator layers 114a to 114c and protective layers 115a and 115b are laminated in the up-down direction (Z-axis direction). The length of the laminated body 112 in the up-down direction is shorter than the length of the laminated body 12 in the up-down direction. Thus, the length of the multilayer substrate 210 in the up-down direction (Z-axis direction) is shorter than the length of the multilayer substrate 10 in the up-down direction (Z-axis direction). The protective layer 115a, the insulator layers 114a to 114c, and the protective layer 115b are arranged in this order from the top down. The material of the insulator layers 114a to 114c is a thermoplastic resin such as polyimide or a liquid crystal polymer. The laminate 112 has flexibility. The multilayer substrate 210 has flexibility. The protective layers 115a, 115b are described later.

The first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14 a. The first ground conductor layer 128 has a rectangular shape when viewed in the up-down direction. The long side of the first ground conductor layer 128 extends in the left-right direction. The short sides of the first ground conductor layer 128 extend in the front-rear direction. The first ground conductor layer 128 overlaps the seventh wiring layer 120 and the eighth wiring layer 122 when viewed in the up-down direction. The first ground conductor layer 128 is connected to a ground potential.

The external electrodes 124 and 126 are provided on the upper main surface of the insulator layer 114 a. The external electrodes 124, 126 are not connected to the first ground conductor layer 128. Thus, the external electrodes 124, 126 are located within openings provided in the first ground conductor layer 128. In addition, the external electrode 124 overlaps the left end portion of the seventh wiring layer 120 when viewed in the up-down direction. In addition, the external electrode 126 overlaps the left end portion of the eighth wiring layer 122 when viewed in the up-down direction.

The seventh wiring layer 120 is located below the first ground conductor layer 128 and above the second ground conductor layer 129. In the present modification, the seventh wiring layer 120 is located on the upper main surface of the insulator layer 114 b. The seventh wiring layer 120 has a line shape extending in the left-right direction when viewed in the up-down direction. As shown in fig. 21, in the antenna module 100, the left end of the seventh wiring layer 120 overlaps the first wiring layer 20 when viewed in the up-down direction. In the antenna module 100, the right end of the seventh wiring layer 120 does not overlap with the first wiring layer 20. The seventh wiring layer 120 does not overlap the first radiation conductor layer 16 when viewed in the up-down direction. In addition, the distance between the seventh wiring layer 120 and the first radiation conductor layer 16 is larger than the distance between the first wiring layer 20 and the first radiation conductor layer 16.

As shown in fig. 22, the eighth wiring layer 122 is located below the first ground conductor layer 128 and above the second ground conductor layer 129. In the present modification, the eighth wiring layer 122 is located on the upper main surface of the insulator layer 114 b. The eighth wiring layer 122 is located at a position later than the seventh wiring layer 120 when viewed in the vertical direction. The eighth wiring layer 122 has a line shape extending in the left-right direction when viewed in the up-down direction. As shown in fig. 21, in the antenna module 100, the left end of the eighth wiring layer 122 overlaps the second wiring layer 22 as viewed in the up-down direction. In the antenna module 100, the right end of the eighth wiring layer 122 does not overlap with the second wiring layer 22. The eighth wiring layer 122 does not overlap the first radiation conductor layer 16 when viewed in the up-down direction. In addition, the distance between the eighth wiring layer 122 and the first radiation conductor layer 16 is larger than the distance between the second wiring layer 22 and the first radiation conductor layer 16.

As shown in fig. 22, the second ground conductor layer 129 is provided on the lower main surface of the insulator layer 114 c. Therefore, the second ground conductor layer 129 is located lower (negative side of the Z axis) than the seventh wiring layer 120 and the eighth wiring layer 122. The second ground conductor layer 129 has a rectangular shape when viewed in the up-down direction. The long side of the second ground conductor layer 129 extends in the left-right direction. The short side of the second ground conductor layer 129 extends in the front-rear direction. The second ground conductor layer 129 overlaps the seventh wiring layer 120 and the eighth wiring layer 122 when viewed in the up-down direction (Z-axis direction). As shown in fig. 21, the second ground conductor layer 129 overlaps the first radiation conductor layer 16 when viewed in the up-down direction (Z-axis direction). That is, the second ground conductor layer 129 spans the region AR1 overlapping the multilayer substrate 10 and the region AR2 not overlapping the multilayer substrate 10. The second ground conductor layer 129 is connected to a ground potential. The second ground conductor layer 129 corresponds to the "ground conductor layer" of the present utility model.

The external electrodes 125 and 127 are provided on the lower main surface of the insulator layer 114 c. The external electrodes 125 and 127 are not connected to the second ground conductor layer 129. Accordingly, the external electrodes 125 and 127 are positioned in the openings provided in the second ground conductor layer 129. In addition, the external electrode 125 overlaps the right end portion of the seventh wiring layer 120 when viewed in the up-down direction. In addition, the external electrode 127 overlaps the right end portion of the eighth wiring layer 122 when viewed in the up-down direction.

The interlayer connection conductors v9 to v12 electrically connect the first ground conductor layer 128 and the second ground conductor layer 129. More specifically, the interlayer connection conductors v9 to v12 penetrate the insulator layers 114a to 114c in the up-down direction. The upper ends of the interlayer connection conductors v9 to v12 are in contact with the first ground conductor layer 128. The lower ends of the interlayer connection conductors v9 to v12 are in contact with the second ground conductor layer 129.

The interlayer connection conductor v15 electrically connects the external electrode 124 and the seventh wiring layer 120. More specifically, the interlayer connection conductor v15 penetrates the insulator layer 114a in the up-down direction. The upper end of the interlayer connection conductor v15 is in contact with the external electrode 124. The lower end of the interlayer connection conductor v15 is in contact with the left end portion of the seventh wiring layer 120.

The interlayer connection conductor v16 electrically connects the external electrode 126 and the eighth wiring layer 122. More specifically, the interlayer connection conductor v16 penetrates the insulator layer 114a in the up-down direction. The upper end of the interlayer connection conductor v16 is in contact with the external electrode 126. The lower end of the interlayer connection conductor v16 is in contact with the left end portion of the eighth wiring layer 122.

The interlayer connection conductor v17 electrically connects the seventh wiring layer 120 and the external electrode 125. More specifically, the interlayer connection conductor v17 penetrates the insulator layers 114b and 114c in the up-down direction. The upper end of the interlayer connection conductor v17 is in contact with the right end of the seventh wiring layer 120. The lower end of the interlayer connection conductor v15 is in contact with the external electrode 125.

The interlayer connection conductor v18 electrically connects the eighth wiring layer 122 to the external electrode 127. More specifically, the interlayer connection conductor v18 penetrates the insulator layers 114b and 114c in the up-down direction. The upper end of the interlayer connection conductor v18 is in contact with the right end portion of the eighth wiring layer 122. The lower end of the interlayer connection conductor v18 is in contact with the external electrode 127.

The protective layers 115a and 115b have a dielectric constant higher than that of the insulator layers 114a to 114 c. The protective layer 115a covers the upper main surface of the insulator layer 114 a. Thereby, the protective layer 115a protects the first ground conductor layer 128. But the protective layer 115b is provided with an opening h1. Thereby, the external electrodes 124 and 126 are exposed to the outside from the multilayer substrate 210 through the opening h1. In addition, the protective layer 115b covers the lower main surface of the insulator layer 114 c. Thereby, the protective layer 115b protects the second ground conductor layer 129. But the protective layer 115b is provided with an opening h2. Thereby, the external electrodes 125 and 127 are exposed to the outside from the multilayer substrate 210 through the opening h2.

The multilayer substrate 210 is mounted on the multilayer substrate 10. Specifically, the external electrode 124 is fixed to the external electrode 24 by means of solder S. Thus, the seventh wiring layer 120 is electrically connected to the first wiring layer 20. Accordingly, the first high frequency signal is input or output with respect to the external electrode 125. The external electrode 126 is fixed to the external electrode 26 by solder S. Thereby, the eighth wiring layer 122 is electrically connected to the second wiring layer 22. Accordingly, the second high frequency signal is input or output with respect to the external electrode 127.

The antenna module 100 can function and effect the same as the multilayer substrate 10. Further, according to the antenna module 100, the effects (d) and (e) can be achieved.

(F) According to the antenna module 100, bending processing of the antenna module 100 is easy. More specifically, the multilayer substrate 210 has a region AR1 that overlaps the multilayer substrate 10 when viewed in the up-down direction (Z-axis direction) and a region AR2 that does not overlap the multilayer substrate 10 when viewed in the up-down direction (Z-axis direction). The length of the multilayer substrate 210 in the up-down direction (Z-axis direction) is shorter than the length of the multilayer substrate 10 in the up-down direction (Z-axis direction). Therefore, the region AR2 of the multilayer substrate 210 is easily deformed as compared with the multilayer substrate 10. That is, the region AR2 of the multilayer substrate 210 is easily bent. Thereby, the antenna module 100 can be easily bent. As a result, bending of the antenna module 100 is easy.

(Thirteenth modification)

The antenna module 100a according to the thirteenth modification will be described below. Fig. 23 is a cross-sectional view of the antenna module 100 a.

The antenna module 100a is different from the antenna module 100 in that it includes a multilayer substrate 10l and a multilayer substrate 210 a. The multilayer substrate 10l is different from the multilayer substrate 10 in that the ground conductor layer 28 and the interlayer connection conductors v5 to v8 are not provided.

As shown in fig. 23, the multilayer substrate 210a is different from the multilayer substrate 210 in that the first ground conductor layer 128 is located only in the region AR2 when viewed in the up-down direction. The first ground conductor layer 128 does not overlap with the first radiation conductor layer 16 when viewed in the up-down direction. In the present modification, the first ground conductor layer 128 is not located in the region AR1 when viewed in the vertical direction. In this modification, the other structures of the antenna module 100a are the same as those of the antenna module 100, and therefore, the description thereof is omitted. In the antenna module 100a as described above, the first radiation conductor layer 16 and the second ground conductor layer 129 function as patch antennas that radiate or receive the first high-frequency signal and the second high-frequency signal.

The antenna module 100a can function and effect the same as those of the antenna module 100.

(G) According to the antenna module 100a, the length of the region AR1 in the up-down direction (Z-axis direction) can be shortened. In more detail, there is no first ground conductor layer 128 opposing the first radiation conductor layer 16. The capacitance generated between the first radiation conductor layer 16 and the ground conductor is governed by the capacitance generated between the first radiation conductor layer 16 and the second ground conductor layer 129. Therefore, when forming a desired capacitance, the length of the region AR1 in the up-down direction (Z-axis direction) can be shortened.

(Other embodiments)

The multilayer substrate of the present utility model is not limited to the multilayer substrates 10, 10a to 10k, and can be modified within the scope of the gist thereof. The multilayer substrates 10, 10a to 10k may be arbitrarily combined.

The antenna module of the present utility model is not limited to the antenna modules 100 and 100a, and can be modified within the scope of the gist thereof. The structures of the antenna modules 100 and 100a may be arbitrarily combined. The antenna module 100 may also include the multilayer substrates 10a to 10l.

The annular ground conductor layer 30 is not an essential constituent.

The first wiring layer 20 and the second wiring layer 22 may not be parallel. The third wiring layer 220 and the fourth wiring layer 222 may not be parallel. The fifth wiring layer 320 and the sixth wiring layer 322 may not be parallel.

In the multilayer substrate 10a, the first straight line E1 and the second straight line E2 may be positioned to the left (the negative side of the X axis) of the first portion EP1 other than the first straight line E1 and the second straight line E2 in the first outer edge EE1, and the third straight line E3 and the fourth straight line E4 may be positioned to the right (the positive side of the X axis) of the second portion EP2 other than the third straight line E3 and the fourth straight line E4 in the second outer edge EE 2.

The second straight line E2 may intersect the first straight line E1 when viewed in the vertical direction, or may not intersect the first straight line E1. The fourth straight line E4 may intersect the third straight line E3 when viewed in the vertical direction, or may not intersect the third straight line E3. The sixth straight line E6 may intersect the fifth straight line E5 when viewed in the vertical direction, or may be non-orthogonal to the fifth straight line E5.

The first straight line E1 and the second straight line E2 may not intersect each other when viewed in the vertical direction.

The first power supply point P1 may be located at a point other than the midpoint of the first straight line E1, which is closest to the first straight line E1.

The second power supply point P2 may be located at a point other than the midpoint of the second straight line E2, which is closest to the second straight line E2.

The third power supply point P3 may be located at a point other than the midpoint of the third straight line E3 closest to the third straight line E3.

The fourth power supply point P4 may be located at a point other than the midpoint of the fourth straight line E4, which is closest to the fourth straight line E4.

The fifth power supply point P5 may be located at a point other than the midpoint of the fifth line E5, which is closest to the fifth line E5.

The sixth power supply point P6 may be located at a point other than the midpoint of the sixth straight line E6, which is closest to the sixth straight line E6.

The rigid portion A3 may not overlap with the protective layer 15a when viewed in the vertical direction (Z-axis direction).

The first ground conductor layer 128 is not an essential constituent element.

The seventh wiring layer 120 and the eighth wiring layer 122 may overlap the first radiation conductor layer 16 when viewed in the vertical direction. However, since the coupling between the seventh wiring layer 120 and the eighth wiring layer 122 and the first radiation conductor layer 16 is suppressed by increasing the distance between the seventh wiring layer 120 and the eighth wiring layer 122 and the first radiation conductor layer 16, it is preferable that the seventh wiring layer 120 and the eighth wiring layer 122 do not overlap the first radiation conductor layer 16 when viewed in the vertical direction.

The matching unit PMC may be included in the seventh wiring layer 120 and the eighth wiring layer 122.

Even when the matching portion PMC is provided separately from the first wiring layer 20, the second wiring layer 22, the seventh wiring layer 120, and the eighth wiring layer 122, the matching portion PMC preferably does not overlap the first radiation conductor layer 16 when viewed in the vertical direction. In this case, the matching unit PMC may be formed of an electronic component such as a chip capacitor constituting a matching circuit for matching the characteristic impedance.

The stub portion ST may be included in the seventh wiring layer 120 and the eighth wiring layer 122. The stub portion ST may be a short stub connected to the ground potential.

The present utility model has the following structure.

(1)

A multilayer substrate is provided with:

And a second wiring layer which is provided on the laminate, is located on the negative side of the Z axis with respect to the first radiation conductor layer and on the positive side of the Z axis with respect to the ground conductor layer, is electrically connected to the first radiation conductor layer at a second power feeding point located closest to the second straight line in the first outer edge, and does not intersect the second straight line orthogonally when viewed in the Z axis direction.

(2)

The multilayer substrate according to (1), wherein,

When viewed in the Z-axis direction, a region through which the first straight line passes when the first straight line is moved in a direction orthogonal to the first straight line is defined as a first region,

The first wiring layer spans the first region and a region outside the first region when viewed in the Z-axis direction,

Defining a region through which the second straight line passes when the second straight line is moved in a direction orthogonal to the second straight line as a second region when viewed in the Z-axis direction,

The second wiring layer spans the second region and a region outside the second region when viewed in the Z-axis direction.

(3)

The multilayer substrate according to (1) or (2), wherein,

The multilayer substrate further comprises:

A second radiation conductor layer provided on the laminate and having a second outer edge including a third straight line and a fourth straight line when viewed in the Z-axis direction;

a third wiring layer which is provided on the laminate, is located on the negative side of the Z axis with respect to the second radiation conductor layer and on the positive side of the Z axis with respect to the ground conductor layer, is electrically connected to the second radiation conductor layer at a third power feeding point located closest to the third straight line in the second outer edge, and does not intersect the third straight line orthogonally when viewed in the Z axis direction; and

A fourth wiring layer provided on the laminate and located on the negative side of the Z axis with respect to the second radiation conductor layer and on the positive side of the Z axis with respect to the ground conductor layer, and electrically connected to the second radiation conductor layer at a fourth power feeding point located closest to the fourth straight line in the second outer edge and intersecting the fourth straight line so as not to be orthogonal to each other when viewed in the Z axis direction,

The ground conductor layer overlaps the second radiation conductor layer when viewed in the Z-axis direction.

(4)

The multilayer substrate according to (3), wherein,

The second radiation conductor layer is located on the positive side of the X-axis of the first radiation conductor layer,

The X-axis is orthogonal to the Z-axis,

The first straight line and the second straight line are located on the positive side of the X axis than a first portion other than the first straight line and the second straight line in the first outer edge,

The third straight line and the fourth straight line are located on the negative side of the X-axis than a second portion other than the third straight line and the fourth straight line within the second outer edge.

(5)

The multilayer substrate according to (3) or (4), wherein,

The multilayer substrate further comprises:

A third radiation conductor layer provided on the laminate and having a third outer edge including a fifth straight line and a sixth straight line when viewed in the Z-axis direction;

a fifth wiring layer provided on the laminate, located on the negative side of the Z axis with respect to the third radiation conductor layer and on the positive side of the Z axis with respect to the ground conductor layer, electrically connected to the third radiation conductor layer at a fifth power feeding point located closest to the fifth straight line in the third outer edge, and intersecting the fifth straight line in a non-orthogonal manner when viewed in the Z axis direction; and

A sixth wiring layer provided on the laminate and located on the negative side of the Z axis with respect to the third radiation conductor layer and on the positive side of the Z axis with respect to the ground conductor layer, and electrically connected to the third radiation conductor layer at a sixth power feeding point located closest to the sixth straight line in the third outer edge and intersecting the sixth straight line so as not to be orthogonal to the sixth straight line when viewed in the Z axis direction,

The ground conductor layer overlaps the third radiation conductor layer when viewed in the Z-axis direction.

(6)

The multilayer substrate according to (5), wherein,

The third radiation conductor layer is located on the positive side of the X-axis of the second radiation conductor layer,

The X-axis is orthogonal to the Z-axis,

The third straight line and the fourth straight line are located on the negative side of the X-axis than a second portion other than the third straight line and the fourth straight line in the second outer edge,

The fifth straight line and the sixth straight line are located on the positive side of the X axis than a third portion other than the fifth straight line and the sixth straight line in the third outer edge.

(7)

The multilayer substrate according to (5), wherein,

The X-axis is orthogonal to the Z-axis,

The Y axis is orthogonal to the X axis and the Z axis,

The first straight line, the third straight line and the fifth straight line are parallel to the X axis,

The second straight line, the fourth straight line and the sixth straight line are mutually overlapped when being observed along the X-axis direction,

The positive side end of the X axis of the first straight line is connected to the positive side end of the Y axis of the second straight line,

The positive side end of the X axis of the third straight line is connected to the positive side end of the Y axis of the fourth straight line,

The positive side end of the X axis of the fifth line is connected to the positive side end of the Y axis of the sixth line.

(8)

The multilayer substrate according to (5), wherein,

The X-axis is orthogonal to the Z-axis,

The Y axis is orthogonal to the X axis and the Z axis,

The first straight line, the fourth straight line and the fifth straight line are parallel to the X axis,

The second straight line, the third straight line and the sixth straight line are mutually overlapped when being observed along the X-axis direction,

The end of the negative side of the Y axis of the third straight line is connected with the end of the negative side of the X axis of the fourth straight line,

(9)

The multilayer substrate according to (5), wherein,

The X-axis is orthogonal to the Z-axis,

The Y axis is orthogonal to the X axis and the Z axis,

The first straight line and the second straight line are located on the negative side of the X-axis than a first portion other than the first straight line and the second straight line in the first outer edge,

The third straight line and the fourth straight line are located on the negative side of the Y axis than a second portion other than the third straight line and the fourth straight line in the second outer edge,

The fifth straight line and the sixth straight line are located on the negative side of the X-axis than a third portion other than the fifth straight line and the sixth straight line within the third outer edge.

(10)

The multilayer substrate according to (1) or (2), wherein,

The multilayer substrate further comprises:

A second radiation conductor layer that is provided on the laminate, is positioned on the negative side of the Z axis with respect to the first radiation conductor layer, overlaps the first radiation conductor layer when viewed in the Z axis direction, and has a second outer edge including a third straight line and a fourth straight line when viewed in the Z axis direction;

The ground conductor layer overlaps the second radiation conductor layer when viewed in the Z-axis direction,

The first straight line is parallel to the third straight line,

The second straight line is parallel to the fourth straight line,

The X-axis is orthogonal to the Z-axis,

The positive side end of the X-axis of the first straight line is connected to the positive side end of the X-axis of the second straight line,

The positive side end of the X axis of the third straight line is connected to the positive side end of the X axis of the fourth straight line,

The first wiring layer does not orthogonally intersect the first straight line and the third straight line when viewed in the Z-axis direction,

The second wiring layer does not orthogonally intersect the second straight line and the fourth straight line when viewed in the Z-axis direction.

(11)

The multilayer substrate according to any one of (1) to (10), wherein,

The multilayer substrate further includes an annular ground conductor layer provided on the laminate and located on the positive side of the Z axis with respect to the ground conductor layer,

The annular ground conductor layer has an annular shape surrounding a periphery of the first radiation conductor layer when viewed in the Z-axis direction.

(12)

The multilayer substrate according to (11), wherein,

The first radiation conductor layer includes the first straight line, the second straight line, a seventh straight line, and an eighth straight line when viewed in the Z-axis direction, and has a quadrangular shape when viewed in the Z-axis direction,

A distance from a center of the first straight line to the annular ground conductor layer in a direction orthogonal to the first straight line is defined as a first distance,

A distance from a center of the second straight line to the annular ground conductor layer in a direction orthogonal to the second straight line is defined as a second distance,

A distance from a center of the seventh straight line to the annular ground conductor layer in a direction orthogonal to the seventh straight line is defined as a third distance,

A distance from a center of the eighth straight line to the annular ground conductor layer in a direction orthogonal to the eighth straight line is defined as a fourth distance,

The first distance, the second distance, the third distance, and the fourth distance are equal to each other.

(13)

The multilayer substrate according to any one of (1) to (12), wherein,

The first wiring layer and the second wiring layer include a matching portion,

The matching section does not overlap with the first radiation conductor layer when viewed in the Z-axis direction.

(14)

The multilayer substrate according to any one of (1) to (12), wherein,

The first wiring layer and the second wiring layer include a stub portion,

The stub portion does not overlap with the first radiation conductor layer when viewed in the Z-axis direction.

(15)

The multilayer substrate according to any one of (1) to (14), wherein,

The multilayer substrate has a rigid portion and a flexible portion,

The length of the flexible portion in the Z-axis direction is shorter than the length of the rigid portion in the Z-axis direction.

(16)

The multilayer substrate according to (15), wherein,

The annular ground conductor layer has an annular shape surrounding a periphery of the first radiation conductor layer when viewed in the Z-axis direction,

In the rigid portion, a ground conductor is not provided between the annular ground conductor layer and the ground conductor layer.

(17)

The multilayer substrate according to (15) or (16), wherein,

The multilayer substrate further comprises

A seventh wiring layer provided on the laminate, located on the negative side of the Z axis with respect to the first wiring layer and on the positive side of the Z axis with respect to the ground conductor layer, and electrically connected to the first wiring layer; and

And an eighth wiring layer which is provided on the laminate, is located on the negative side of the Z axis with respect to the second wiring layer, is located on the positive side of the Z axis with respect to the ground conductor layer, and is electrically connected to the second wiring layer.

(18)

The multilayer substrate according to (17), wherein,

The seventh wiring layer and the eighth wiring layer do not overlap with the first radiation conductor layer when viewed in the Z-axis direction.

(19)

An antenna module includes a first substrate and a flexible second substrate,

The first substrate includes:

The second substrate includes:

Claims

1. A multilayer substrate is characterized by comprising:

2. The multilayer substrate according to claim 1, wherein,

3. The multilayer substrate according to claim 1 or 2, wherein,

The multilayer substrate further comprises:

4. The multilayer substrate according to claim 3, wherein,

The X-axis is orthogonal to the Z-axis,

5. The multilayer substrate according to claim 3, wherein,

The multilayer substrate further comprises:

6. The multilayer substrate according to claim 5, wherein,

The X-axis is orthogonal to the Z-axis,

7. The multilayer substrate according to claim 5, wherein,

The X-axis is orthogonal to the Z-axis,

The Y axis is orthogonal to the X axis and the Z axis,

8. The multilayer substrate according to claim 5, wherein,

The X-axis is orthogonal to the Z-axis,

The Y axis is orthogonal to the X axis and the Z axis,

9. The multilayer substrate according to claim 5, wherein,

The X-axis is orthogonal to the Z-axis,

The Y axis is orthogonal to the X axis and the Z axis,

10. The multilayer substrate according to claim 1 or 2, wherein,

The multilayer substrate further comprises:

The first straight line is parallel to the third straight line,

The second straight line is parallel to the fourth straight line,

The X-axis is orthogonal to the Z-axis,

11. The multilayer substrate according to claim 1 or 2, wherein,

12. The multilayer substrate of claim 11, wherein,

13. The multilayer substrate according to claim 1 or 2, wherein,

The first wiring layer and the second wiring layer include a matching portion,

14. The multilayer substrate according to claim 1 or 2, wherein,

The first wiring layer and the second wiring layer include a stub portion,

15. The multilayer substrate according to claim 1 or 2, wherein,

The multilayer substrate has a rigid portion and a flexible portion,

16. The multilayer substrate of claim 15, wherein,

17. The multilayer substrate of claim 15, wherein,

The multilayer substrate further comprises

18. The multilayer substrate of claim 17, wherein,

19. An antenna module includes a first substrate and a flexible second substrate,

The first substrate includes:

The second substrate includes: