CN220855405U

CN220855405U - LED backlight source structure with stable heat dissipation

Info

Publication number: CN220855405U
Application number: CN202322461702.7U
Authority: CN
Inventors: 彭欣雅
Original assignee: Shenzhen Jianjie Photoelectric Co ltd
Current assignee: Shenzhen Jianjie Photoelectric Co ltd
Priority date: 2023-09-07
Filing date: 2023-09-07
Publication date: 2024-04-26
Anticipated expiration: 2033-09-07

Abstract

The utility model discloses an LED backlight source structure with stable heat dissipation, which comprises a substrate and LED chips, wherein the upper wall surface of the substrate is provided with a reflective ink layer, the substrate is provided with a concave positioning groove, the LED chips are arranged in the concave positioning groove, the LED chips are arranged at intervals and form a dense area and a loose area, the dense area is arranged in the middle of the substrate, and the loose area is arranged at the periphery of the dense area; the LED chip is provided with a lens, the lens comprises a first lens and a second lens, the first lens is arranged on the LED chip in the dense area, and the second lens is arranged on the LED chip in the loose area. By changing the number of the LED chips in the substrate in the same area and by changing the lens structure of the LED chips, the display effect is ensured, and meanwhile, the power consumption is reduced, and the heating of the opposite backlight source is also reduced, so that the stable operation of the liquid crystal display is ensured.

Description

LED backlight source structure with stable heat dissipation

Technical Field

The utility model relates to the field of liquid crystal displays, in particular to an LED backlight source structure with stable heat dissipation.

Background

A backlight is a light source located behind a liquid crystal display, and its luminous effect directly affects the visual effect of the liquid crystal display module. The liquid crystal display itself does not emit light, it displays graphics or it is the result of modulating light.

When the LED chip is installed, the existing backlight source is generally formed by sequentially installing and arranging single individuals on a substrate, and then paving a reflecting layer, so that the light source can irradiate in a preset direction, and the light source can display preset color and brightness effects.

However, the existing LED chips are generally regularly arranged, when the LED chips are irregularly arranged (for example, the shape, structure and lighting requirements of the display are different, etc.), the hole site design of the reflective layer needs to be customized additionally (meanwhile, back glue needs to be arranged or glue needs to be coated), although the processing number of a single product of the liquid crystal display is generally larger, the situation of individual customization is not excluded, and the production cost of the relative liquid crystal display is also larger; meanwhile, along with the lamination of the reflecting layer and the substrate, the heat dissipation effect of the substrate is also reduced, and the thickness is also increased, so that the customer experience is affected.

Disclosure of utility model

The utility model mainly aims to provide an LED backlight source structure with stable heat dissipation, which aims to improve the layout of LED chips, and the LED chips are matched with lenses, so that similar light source effects can be realized while the relative number of the LED chips is reduced, and meanwhile, the structures of a substrate and a reflecting layer are improved, so that the heat dissipation effect is improved, and meanwhile, the applicability of the reflecting layer is improved.

In order to achieve the above object, the present utility model provides an LED backlight structure with stable heat dissipation, comprising:

the upper wall surface of the base plate is provided with a reflective ink layer, and the base plate is provided with a concave positioning groove;

The LED chips are arranged in the positioning grooves at intervals to form dense areas and loose areas, the dense areas are arranged in the middle of the substrate, and the loose areas are arranged on the periphery of the dense areas;

The LED chip is provided with a lens, the lens comprises a first lens and a second lens, the first lens is arranged on the LED chip in the dense area, and the second lens is arranged on the LED chip in the loose area.

In the technical scheme of the utility model, in actual design, firstly, the reflective layer of the attaching structure is set as the reflective ink layer, the thickness and the processing stability are higher, the thickness of the substrate is reduced, and the heat dissipation effect is also improved; then, by changing the number of the LED chips in the substrate in the same area and changing the lens structure of the LED chips, the display effect is ensured, and meanwhile, the power consumption is reduced, and the heating of the opposite backlight source is also reduced, so that the stable operation of the liquid crystal display is ensured;

Meanwhile, the thinner the thickness of the substrate is, the higher the heat dissipation performance is, the service life of the LED chip is guaranteed, the arrangement of the reflective ink layer is compatible with different types of liquid crystal display screens, the design is simple, the implementation is easy, and the application prospect is good.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

fig. 2 is a schematic diagram of the present utility model in a sectional state.

In the figure, 1 is a substrate, 11 is a reflective ink layer, 12 is a positioning groove, 2 is an LED chip, 21 is a dense area, 22 is a loose area, 31 is a first lens, and 32 is a second lens.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, in the embodiment of the present utility model, directional indications (such as up, down, left, right, front, back, top, bottom, inner, outer, vertical, lateral, longitudinal, counterclockwise, clockwise, circumferential, radial, axial … …) are referred to, and the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first" or "second" etc. in the embodiments of the present utility model, the description of "first" or "second" etc. is only for descriptive purposes, and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

As shown in fig. 1 to 2, an LED backlight structure with stable heat dissipation, includes:

a substrate 1, wherein a reflective ink layer 11 is arranged on the upper wall surface of the substrate 1, and the substrate 1 is provided with a concave positioning groove 12;

The LED chips 2 are arranged in the positioning groove 12, the LED chips 2 are arranged at intervals to form a dense area 21 and a loose area 22, the dense area 21 is arranged at the middle position of the substrate 1, and the loose area 22 is arranged at the periphery of the dense area 21;

The LED chips 2 are provided with lenses, the lenses comprise a first lens 31 and a second lens 32, the first lens 31 is arranged on the LED chips 2 in the dense area 21, and the second lens 32 is arranged on the LED chips 2 in the loose area 22.

In practical design, firstly, the reflective layer of the attaching structure is set as the reflective ink layer 11, so that the thickness and the processing stability are higher, the thickness of the substrate 1 is reduced, and the heat dissipation effect is improved; then, by changing the number of the LED chips 2 in the substrate 1 in the same area and changing the lens structure of the LED chips 2 in order to ensure the uniformity of the light source, the power consumption is reduced while the display effect is ensured, and the heating of the opposite backlight source is also reduced, so that the stable operation of the liquid crystal display is ensured;

Meanwhile, the thinner the thickness of the substrate 1 is, the higher the heat dissipation performance is, the service life of the LED chip 2 is guaranteed, the arrangement of the reflective ink layer 11 is compatible with different types of liquid crystal display screens, the design is simple, the implementation is easy, and the application prospect is good.

Specifically, the reflective ink layer 11 is integrally painted with the substrate 1 or painted on the substrate 1 after the LED chip 2 is mounted, wherein the cost of integrally painting the reflective ink layer 11 is the lowest, but the light source reflection effect at the root of the opposite LED chip 2 is reduced;

When the LED chip 2 is arranged and then coated on the substrate 1, the light source at the root of the LED chip 2 can reflect to the greatest extent, and meanwhile, the diffusion of the light source can be reduced, and the irradiation uniformity of the light source is improved.

More specifically, the substrate 1 is a ceramic aluminum substrate 1, that is, a special process board directly bonded to the surface (single/double) of an alumina (AI 2O 3) or Alumina (ALN) ceramic substrate under a copper foil. The ultrathin manufactured substrate 1 has excellent electrical insulation performance, high heat conduction property, excellent soldering property and high adhesion strength, can etch various patterns like a PCB, and has great current carrying capacity. Therefore, the ceramic substrate 1 has become a base material for high-power electronic circuit structure technology and interconnection technology.

In the embodiment of the present utility model, the positioning groove 12 is formed by etching the substrate 1 and/or the reflective ink layer 11 by laser, and of course, the concave positioning groove 12 is also formed on a specific substrate 1 portion, and when the reflective ink layer 11 is integrally formed, both the two needs to be etched.

Further, the loose area 22 is U-shaped, so that the heat flow can also form a guide, thereby realizing rapid heat dissipation, for example, a heat dissipation structure or a heat dissipation device is arranged at the upper end of the substrate 1; wherein the loose region 22 is a visually ignored region, i.e. when the eyes watch the television, the viewing angle thereof is watched in the central direction, so that the viewing angle of the loose region 22 has less influence on realizing the display effect; under the condition that the overall brightness of the backlight source is guaranteed to be uniform through the matching of the lenses, the picture quality qualification rate can also be guaranteed, the thickness of the substrate 1 is thin, the heat dissipation performance is high, and the service life of the LED chip 2 is guaranteed.

In an embodiment of the present utility model, the lens is a convex lens.

Specifically, the diffusion angle of the first lens 31 is 120 degrees, the diffusion angle of the second lens 32 is 170 degrees, and the loose area 22 has a smaller number of LED chips 2, so that the diffusion range of the light source is changed, thereby realizing a relative display effect.

More specifically, the lens is U-shaped, and the lens is mounted on the substrate 1 or integrally formed with the LED chip 2, where the mounting of the lens belongs to the prior art, and is not described herein in detail.

The foregoing description is only of the preferred embodiments of the present utility model, and is not intended to limit the scope of the utility model, but rather, the equivalent structural changes made by the description of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. An LED backlight structure with stable heat dissipation, comprising:

2. The LED backlight structure with stable heat dissipation according to claim 1, wherein: the reflective ink layer and the substrate are integrally coated and molded or coated on the substrate after the LED chip is mounted.

3. The LED backlight structure with stable heat dissipation according to claim 1, wherein: the substrate is a ceramic aluminum substrate.

4. The LED backlight structure with stable heat dissipation according to claim 1, wherein: the positioning groove is formed by etching the base plate and/or the reflective ink layer by laser.

5. The LED backlight structure with stable heat dissipation according to claim 1, wherein: the loosening area is U-shaped.

6. The LED backlight structure with stable heat dissipation according to claim 1, wherein: the lens is a convex lens.

7. The LED backlight structure with stable heat dissipation as set forth in claim 6, wherein: the diffusion angle of the first lens is 120 degrees, and the diffusion angle of the second lens is 170 degrees.

8. The LED backlight structure with stable heat dissipation according to claim 1, wherein: the lens is U-shaped, and the lens is mounted on the substrate or integrally formed with the LED chip.