CN220457646U - Soft and hard combined printed circuit board - Google Patents
Soft and hard combined printed circuit board Download PDFInfo
- Publication number
- CN220457646U CN220457646U CN202322070866.7U CN202322070866U CN220457646U CN 220457646 U CN220457646 U CN 220457646U CN 202322070866 U CN202322070866 U CN 202322070866U CN 220457646 U CN220457646 U CN 220457646U
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- Prior art keywords
- board
- flexible
- rigid
- soft
- printed circuit
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- 239000010410 layer Substances 0.000 claims description 40
- 239000011889 copper foil Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000008054 signal transmission Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model belongs to the technical field of electronic product manufacturing, and provides a soft and hard combined printed circuit board which comprises a plurality of laminated boards arranged in a laminated way; the laminated plate comprises more than two soft plates, a hard plate is arranged between the two soft plates, and the adjacent soft plates form a space region through the hard plate. The utility model has reasonable structural arrangement, and the hard plate is arranged in the middle to separate the two soft plates, so that the soft plates are divided into two parts, thereby not only solving the problem of thickness of the soft plates, but also improving the flexibility of the soft plates, and simultaneously enlarging the space area between the soft plates due to the division into the two soft plates, and effectively improving the signal interference.
Description
Technical Field
The utility model belongs to the technical field of electronic product manufacturing, and particularly relates to a soft and hard combined printed circuit board.
Background
With the continuous development of electronic technology and information technology, electronic devices, particularly communication products, are moving toward higher signal transmission rates, and also toward miniaturization and thinness. Thus, the flat-type assembly of previous electronic products is slowly replaced by the current stacked-type three-dimensional assembly. The flexible printed wiring board (Rigid-Flex Printed Board or F/R PWB, flexible printed wiring board) is a novel printed wiring board combining FPC (Flex Printed Circuits, flexible printed wiring board) and PCB (Printed Circuits Board, printed wiring board) to have both durability of Rigid PCB and adaptability of flexible PCB.
At present, the common soft and hard board combination mode is an upper hard board and a lower hard board, the soft board is clamped in the middle, and the soft board is clamped in the middle of the common soft and hard board combination mode. Because the soft board thickness is thin, and the interlayer distance is little, easily receives the interference, and the isolation is poor, ordinary soft and hard combined board is because of the centre presss from both sides the soft board, is not fit for making the multiply wood, if do the quantity of sheet layer too much will lose the bending property of soft board. Meanwhile, the number of the plate layers is limited, the number of signal transmission is very limited, and special signals are not suitable for mixed transmission with common signals.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a soft and hard combined printed circuit board.
The technical scheme adopted for solving the technical problems is as follows:
a rigid-flex printed circuit board comprising:
a plurality of laminated plates arranged in a laminated manner;
the laminated plate comprises more than two soft plates, a hard plate is arranged between two adjacent soft plates, and the adjacent soft plates form a space region through the hard plate.
Preferably, the flexible board is of a multi-layer structure and comprises a plurality of layers of flexible board base materials, a copper foil layer used for connection is arranged between the adjacent flexible board base materials, and the surface of the flexible board base material at the outermost end is provided with the copper foil layer.
Preferably, an ink protective layer is provided on the copper foil layer at the surface of the flexible board substrate at the outermost end.
Preferably, the number of the soft board base materials is not more than five.
Preferably, the hard board comprises a plurality of hard board layer substrates, a copper foil layer used for connection is arranged between every two adjacent hard board layer substrates, and the surface of the hard board layer substrate at the outermost end is provided with the copper foil layer.
Preferably, an ink protective layer is provided on the copper foil layer at the surface of the hard-sheet substrate at the outermost end.
Preferably, the soft board and the hard board are connected through adhesive in a pressing mode.
Preferably, the hard plate and the soft plate are provided with grounding holes for grounding.
Preferably, the surface of the hard board and the soft board is provided with surface layer circuits.
Compared with the prior art, the utility model has the beneficial effects that:
in summary, the structure of the utility model is reasonable, the hard board is arranged in the middle to separate the two soft boards, so that the soft boards are divided into two parts, the problem of thickness of the soft boards can be solved, the flexibility of the soft boards can be improved, and meanwhile, the space area between the soft boards is enlarged due to the division into the two soft boards, and the signal interference is effectively improved. Compared with the traditional soft and hard board combination mode, the board layer of the soft board can be added on the basis of ensuring the same board thickness, the flexible function of the soft board is improved, and more wiring plane space is provided for PCB wiring.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic diagram of the internal structure of the present utility model.
Wherein:
1-soft board, 2-hard board, 3-soft board base material, 4-hard board layer base material, 5-copper foil layer, 6-adhesive and 7-space region.
Detailed Description
In order that the above-recited objects, features and advantages of the present utility model will be more clearly understood, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description. In addition, embodiments of the present application and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, and the described embodiments are merely some, rather than all, embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, are intended to fall within the scope of the present utility model.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.
Examples:
as shown in fig. 1-2, the present embodiment provides a soft and hard combined printed circuit board, which includes:
a rigid-flex printed circuit board comprising:
a plurality of laminated plates arranged in a laminated manner;
the laminated board comprises two soft boards 1, a hard board 2 is arranged between the two soft boards 1, and the adjacent soft boards 1 form a space area 7 through the hard board 2.
In this embodiment, the flexible board 1 is divided into two parts, the hard board 2 is arranged in the middle to separate the two flexible boards 1, so that the flexible board 1 is divided into two parts, which not only solves the problem of thickness of the flexible board 1, but also improves the flexibility of the flexible board 1, and meanwhile, the space area 7 between the flexible boards 1 is enlarged due to the division into the two flexible boards 1, thereby effectively improving signal interference. Meanwhile, the two soft boards 1 which are divided into two parts can realize signal splitting of special signals and common signals in a space area 7 between the soft boards 1, and can effectively prevent interference between different signals. Compared with the traditional soft and hard board combination mode, on the basis of guaranteeing the same board thickness, the number of the board layers of the soft board 1 is increased, the flexible function of the soft board 1 is improved, and more wiring plane space is provided for PCB wiring.
Specifically, the flexible board 1 has a multilayer structure, including a plurality of layers of flexible board substrates 3, a copper foil layer 5 for connection is arranged between adjacent flexible board substrates 3, and the surface of the flexible board substrate 3 at the outermost end is provided with the copper foil layer 5.
Specifically, an ink protective layer is provided on the copper foil layer 5 at the surface of the outermost flexible board substrate 3.
Specifically, the number of the flexible board base materials 3 is not more than five. The soft board is a multi-layer structure, and the number is determined according to the bending requirement.
Specifically, the hard board 2 includes a plurality of hard board layer substrates 4, a copper foil layer 5 for connection is disposed between adjacent hard board layer substrates 4, and the surface of the hard board layer substrate 4 at the outermost end is provided with the copper foil layer 5.
Specifically, an ink protective layer is provided on the copper foil layer 5 at the surface of the outermost hard sheet substrate 4.
Specifically, the soft board 1 and the hard board 2 are connected by pressing through an adhesive 6.
Specifically, the hard plate 2 and the soft plate 1 are provided with ground holes for grounding.
Specifically, the surfaces of the hard board 2 and the soft board 1 are provided with surface layer circuits.
The method and the device can be suitable for different signal transmission types, can be used for layering and dividing the signal transmission, and can effectively avoid signal crosstalk and the like.
The utility model provides an utilize hard board 2 to locate the centre to separate two soft boards 1, can improve signal interval between two soft boards 1, utilize the space region 7 that the difference in height of hard board 2 brought to improve signal isolation.
Finally, the present application may allow for more flexible copper foil selection for the mid-position stiffener 2, a variety of alternative applications that may be split, copper foil isolatable, and co-sitable.
The present utility model is not limited to the preferred embodiments, and any modifications, equivalent variations and modifications made to the above embodiments according to the technical principles of the present utility model are within the scope of the technical proposal of the present utility model.
Claims (9)
1. A rigid-flex printed circuit board, comprising:
a plurality of laminated plates arranged in a laminated manner;
the laminated plate comprises more than two soft plates, a hard plate is arranged between two adjacent soft plates, and the adjacent soft plates form a space region through the hard plate.
2. The flexible-rigid printed circuit board according to claim 1, wherein the flexible board has a multi-layer structure and comprises a plurality of layers of flexible board base materials, a copper foil layer for connection is arranged between adjacent flexible board base materials, and the surface of the flexible board base material at the outermost end is provided with the copper foil layer.
3. The flexible-rigid printed circuit board according to claim 2, wherein an ink protective layer is provided on the copper foil layer at the surface of the flexible board base material at the outermost end.
4. The flexible-rigid printed circuit board according to claim 2, wherein the number of the flexible board substrates is not more than five.
5. The flexible-rigid printed circuit board according to claim 1, wherein the rigid board comprises a plurality of rigid board layer substrates, a copper foil layer for connection is arranged between the adjacent rigid board layer substrates, and the surface of the rigid board layer substrate at the outermost end is provided with the copper foil layer.
6. The rigid-flex printed circuit board according to claim 5, wherein an ink protective layer is provided on a copper foil layer at a surface of said rigid-board layer substrate at an outermost end.
7. The flexible-rigid printed circuit board according to claim 1, wherein the flexible board and the rigid board are connected by bonding with an adhesive.
8. The flexible-rigid printed circuit board according to claim 1, wherein the rigid board and the flexible board are provided with a ground hole for grounding.
9. The flexible-rigid printed circuit board according to claim 1, wherein the surfaces of the rigid board and the flexible board are provided with surface layer circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322070866.7U CN220457646U (en) | 2023-08-02 | 2023-08-02 | Soft and hard combined printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322070866.7U CN220457646U (en) | 2023-08-02 | 2023-08-02 | Soft and hard combined printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220457646U true CN220457646U (en) | 2024-02-06 |
Family
ID=89729577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322070866.7U Active CN220457646U (en) | 2023-08-02 | 2023-08-02 | Soft and hard combined printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220457646U (en) |
-
2023
- 2023-08-02 CN CN202322070866.7U patent/CN220457646U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |