CN220438911U - Touch control panel and electronic equipment - Google Patents

Abstract

The utility model provides a touch pad and include electronic equipment of this touch pad, the touch pad includes circuit board, first apron, second apron, living hinge, mechanical micro-motion module and control unit. The circuit board comprises a hard board area, a soft board area and a connection area. The mechanical micro-motion module is used for outputting a feedback signal when the first cover plate or the second cover plate is pressed by external force. The control unit is electrically connected with the circuit board and the mechanical micro-motion module. When the movable hinge is in a bending state, the hard plate area and the soft plate area are arranged at intervals along the thickness direction of the circuit board, and when the movable hinge is in an extending state, the hard plate area and the soft plate area are arranged at intervals along the length direction of the circuit board, and the control unit is used for determining the force application size on the first cover plate or the second cover plate according to the feedback signal. The change of operation scope is realized through buckling the touch control plate, and then the user can use the touch control plate to control electronic equipment in suitable scope.

Description

Touch control panel and electronic equipment

Technical Field

The application relates to the field of touch panels, in particular to a touch panel and electronic equipment.

Background

A portable personal computer (Personal Computer, PC) is an important electronic device for office and study, and a touch pad is generally disposed for facilitating man-machine interaction. At present, a conventional touch pad is generally fixed on a main body of a PC, moves along with the main body of the PC, is externally arranged on the surface of an operation panel, and has to be positioned and sized in consideration of the screen and keyboard dimensions of the PC. So that the user can operate within a proper range. Thus, the operation space of the touch pad is limited, for example, a relatively fixed size from the screen is required, so that the hand placement position of the user during the operation is limited. Therefore, how to increase the operation space of the touch pad, so that a user can use the touch pad to control the PC in a proper range is a technical problem to be solved currently.

Disclosure of Invention

In view of the foregoing, it is necessary to provide a touch pad and an electronic device, which can increase the operation space of the touch pad, and facilitate the user to use the touch pad to control the PC in a suitable range.

In a first aspect, the present application provides a touch pad, the touch pad including a circuit board, a first cover plate, a second cover plate, a movable hinge, a mechanical micro-motion module, and a control unit. The circuit board comprises a hard board area, a soft board area and a connection area, wherein the connection area is connected with the hard board area and the soft board area. The first cover plate is arranged on the first side of the soft board area. The second cover plate is arranged on the first side of the hard plate area. The movable hinge is arranged on the surface of the connecting area. The mechanical micro-motion module is arranged on the second side of the hard board area and is used for outputting a feedback signal when the first cover board or the second cover board is pressed by external force. The control unit is arranged between the mechanical micro-motion module and the hard board area and is electrically connected with the circuit board and the mechanical micro-motion module. When the movable hinge is in a bending state, the hard plate area and the soft plate area are arranged at intervals along the thickness direction of the circuit board, and the control unit is used for determining the force application size on the first cover plate according to the feedback signal. When the movable hinge is in an extending state, the hard board area and the soft board area are arranged at intervals along the length direction of the circuit board, and the control unit is used for determining the force application size on the second cover plate according to the feedback signal.

With reference to the first aspect, in one possible implementation manner, the mechanical micromotion module includes a support, a pressure sensor and a vibration motor. The support piece is arranged on the second side of the hard board area, and the control unit is arranged between the support piece and the hard board area. The pressure sensor is arranged between the supporting piece and the hard board area, and the pressure sensor is electrically connected with the control unit. The vibration motor is arranged between the supporting piece and the hard board area, and the vibration motor is used for applying acting force to the pressure sensor through the supporting piece when external force is applied. The pressure sensor is used for outputting a feedback signal according to the magnitude of the acting force.

With reference to the first aspect, in one possible implementation manner, the circuit board includes a substrate layer, a ground layer, and a composite electrode layer. The ground layer is formed on the first surface of the substrate layer. The composite electrode layer is formed on the second surface of the substrate layer, at least part of the composite electrode layer is formed in the soft board area, and the first surface of the substrate layer and the second surface of the substrate layer are arranged in a back-to-back mode. The touch pad comprises a first bonding layer, wherein the first bonding layer is formed on the surface of one side, far away from the substrate layer, of the composite electrode layer and is positioned in the soft board area, and the first cover plate is formed on the surface of one side, far away from the substrate layer, of the first bonding layer. The composite electrode layer is used for forming a first induction capacitor together with the first cover plate, and the control unit is used for determining the position of a finger positioned on the surface of the first cover plate according to the change of the capacitance of the first induction capacitor.

With reference to the first aspect, in one possible implementation manner, the circuit board includes a first dielectric layer and a control circuit layer. The first dielectric layer is formed on the surface of the side, away from the substrate layer, of the ground layer and is located in the hard board area. The control circuit layer is formed on the surface of one side of the first dielectric layer, which is far away from the substrate layer, the control unit and the pressure sensor are attached to the control circuit layer, and the control unit is electrically connected with the grounding layer through the control circuit layer.

With reference to the first aspect, in one possible implementation manner, the composite electrode layer extends from the soft board area to the connection area and the hard board area. The circuit board comprises a first conducting post and a second conducting post. At least part of the first conducting posts penetrate through the substrate layer and are connected with the composite electrode layer located in the hard plate area and the grounding layer located in the hard plate area. The second conductive post passes through the first dielectric layer and is connected with the grounding layer and the control circuit layer.

With reference to the first aspect, in one possible implementation manner, the circuit board includes a first electrode layer, a second dielectric layer, and a second electrode layer. The first electrode layer is formed on the second surface of the substrate layer and is located in the hard board area. The second dielectric layer is formed on the surface of the first electrode layer, which is far away from the substrate layer. The second electrode layer is formed on the surface of the second dielectric layer, which is far away from the substrate layer. The touch pad comprises a second bonding layer, wherein the second bonding layer is formed on the surface of one side, far away from the substrate layer, of the second electrode layer, and the second cover plate is formed on the surface of one side, far away from the substrate layer, of the second bonding layer. The circuit in the first electrode layer and the circuit in the second electrode layer are arranged in a crossing mode, the first electrode layer, the second electrode layer and the second cover plate form a second induction capacitor together, and the control unit is used for determining the position of a finger on the surface of the second cover plate according to the change of capacitance of the second induction capacitor.

With reference to the first aspect, in one possible implementation manner, the circuit board includes a third conductive pillar, and the third conductive pillar penetrates through the second dielectric layer and connects the first electrode layer and the second electrode layer.

With reference to the first aspect, in one possible implementation manner, the circuit board includes a power layer, and the power layer is disposed on the same layer as the ground layer.

With reference to the first aspect, in one possible implementation manner, the touch pad includes a wireless communication unit, where the wireless communication module is disposed between the support member and the hard board area, and the wireless communication unit is electrically connected with the control unit.

In a second aspect, the present application provides an electronic device. The electronic device comprises a display and a touch pad, wherein the touch pad is used for detecting the touch position of a finger and the applied pressure when the finger touches or presses. The touch control panel comprises a circuit board, a first cover plate, a second cover plate, a movable hinge, a mechanical micro-motion module and a control unit. The circuit board comprises a hard board area, a soft board area and a connection area, wherein the connection area is connected with the hard board area and the soft board area. The first cover plate is arranged on the first side of the soft board area. The second cover plate is arranged on the first side of the hard plate area. The movable hinge is arranged on the surface of the connecting area. The mechanical micro-motion module is arranged on the second side of the hard board area and is used for outputting a feedback signal when the first cover board or the second cover board is pressed by external force. The control unit is arranged between the mechanical micro-motion module and the hard board area and is electrically connected with the circuit board and the mechanical micro-motion module. When the movable hinge is in a bending state, the hard plate area and the soft plate area are arranged at intervals along the thickness direction of the circuit board, and the control unit is used for determining the force application size on the first cover plate according to the feedback signal. When the movable hinge is in an extending state, the hard board area and the soft board area are arranged at intervals along the length direction of the circuit board, and the control unit is used for determining the force application size on the second cover plate according to the feedback signal.

Compared with the prior art, the application has at least the following beneficial effects: the touch control plate can be bent through the movable hinge, and further the change of the operation range of the touch control plate is realized. Thus, a user of the electronic device can use the touch pad to control the electronic device in a proper range.

Drawings

Fig. 1 is a schematic diagram of a touch pad in an unfolded state according to an embodiment of the present application.

Fig. 2 is a schematic diagram of the touch pad shown in fig. 1 in a bent state.

Fig. 3 is a schematic diagram of an electronic device according to an embodiment of the present application.

Fig. 4 is another schematic diagram of an electronic device according to an embodiment of the present application.

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Description of the main reference signs

Touch pad 100 soft board area AA

Hard board region BB connection region CC

Substrate layer 11 of circuit board 10

First conductive via 111 is grounded 12

Composite electrode layer 13 first electrode layer 14

Second dielectric layer 15 third conductive pillar 151

Second electrode layer 16 first dielectric layer 17

Second conductive pillar 171 controls circuit layer 18

First cover plate 20 first adhesive layer 21

Second cover plate 30 second adhesive layer 31

Control unit 50 for living hinge 40

Mechanical micromotion module 60 support 61

Pressure sensor 62 vibrates motor 63

Wireless communication unit 70 electronic device 200

Display unit 210 and display 211

First surface 221 of support portion 220

Second side 222 border 223

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

In the description of the present application, it should be understood that the terms "upper," "lower," "vertical," "horizontal," "transverse," "longitudinal," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1, an embodiment of the present application provides a touch pad 100, and the touch pad 100 can be applied to an electronic device. The electronic device 200 may be a portable PC.

The touch pad 100 includes a circuit board 10, a first cover 20, a second cover 30, a movable hinge 40, a control unit 50, and a mechanical micro-motion module 60.

The circuit board 10 includes a soft board area AA, a hard board area BB, and a connection area CC that connects the soft board area AA and the hard board area BB. The circuit board 10 includes a first side and a second side disposed opposite each other.

The first cover 20 is disposed on the first side of the soft board area AA, and the second cover 30 is disposed on the first side of the hard board area BB. The first cover plate 20 and the second cover plate 30 may be, but are not limited to, plastic sheets such as polyvinyl chloride (PVC) or glass, etc., and preferably have a thickness of 0.05mm to 1mm.

The living hinge 40 is disposed at a surface of the connection region CC, i.e., the living hinge 40 is disposed at a first side and a second side of the connection region CC. That is, the connection region CC is covered by the living hinge 40. The thickness of the circuit board 10 is preferably 0.2mm to 0.5mm.

The mechanical micro-motion module 60 is disposed on the second side of the hard board area BB, and the mechanical micro-motion module 60 is configured to output a feedback signal when the first cover 20 or the second cover 30 is pressed by an external force.

The control unit 50 is disposed between the mechanical micromotion module 60 and the hard board area BB. The control unit 50 is electrically connected to the circuit board 10 and the mechanical micromotion module 60.

Referring to fig. 2, the circuit board 10 can be bent by the movable hinge 40 to change the arrangement of the hard board area BB and the soft board area AA from the same layer arrangement to the stacked arrangement. Specifically, when the living hinge 40 is in the bent state, the hard board area BB and the soft board area AA are disposed at intervals in the thickness direction of the circuit board 10, and when the living hinge 40 is in the extended state, the hard board area BB and the soft board area AA are disposed at intervals in the length direction of the circuit board 10.

When the hard board area BB and the soft board area AA are disposed at intervals along the thickness direction of the circuit board 10, the control unit 50 is configured to determine the magnitude of the force applied to the first cover 20 according to the feedback signal. When the hard board area BB and the soft board area AA are disposed at intervals along the length direction of the circuit board 10, the control unit 50 is configured to determine the magnitude of the applied force on the second cover 30 according to the feedback signal.

It can be appreciated that in the present embodiment, the touch pad 100 can be bent by the movable hinge 40, so as to change the operation range of the touch pad 100, for example, the operation range is transferred from the area of the first cover 20 to the area of the second cover 30. Thus, a user of the electronic device can use the touch pad to control the electronic device in a proper range.

It can be understood that in the present embodiment, the first cover 20, the soft board area AA of the circuit board 10, the mechanical micro-motion module 60, and the control unit 50 together form a first set of touch control systems, and the second cover 30, the hard board area BB of the circuit board 10, the mechanical micro-motion module 60, and the control unit 50 together form a second set of touch control systems. That is, the control unit 50 and the mechanical micro-motion module 60 belong to two sets of touch control systems at the same time, and the two sets of touch control systems can be folded for use as required, thereby saving space.

In the embodiment of the present application, the mechanical micromotion module 60 comprises a support 61, a pressure sensor 62 and a vibration motor 63. The support 61 is disposed on the second side of the hard board area BB. The control unit 50 is disposed between the support 61 and the hard board area BB. A pressure sensor 62 is provided between the support 61 and the hard board area BB, the pressure sensor 62 being electrically connected to the control unit 50. The vibration motor 63 is provided between the support 61 and the hard board area BB, and the vibration motor 63 is configured to apply a force to the pressure sensor 62 through the support 61 when an external force is applied. The pressure sensor 62 is configured to output a feedback signal according to the magnitude of the applied force.

It will be appreciated that the support member 61 is generally made of a hard material, and the vibration motor 63 is abutted between the support member 61 and the circuit board 10, so that when the finger on the first cover 20 or the second cover 30 is pressed, the vibration motor 63 receives an external force and applies a force to the pressure sensor 62 by elastically deforming the support member 61. The pressure sensor 62 is capable of outputting a feedback signal to the control unit 50 in response to the applied force, i.e. a signal indicative of the amount of force applied by a user of the electronic device to the surface of the first cover plate 20 or the second cover plate 30.

In some embodiments, the circuit board 10 includes a base material layer 11, a ground layer 12, and a composite electrode layer 13 that are positioned in the flexible board area AA and are stacked in the thickness direction of the circuit board 10. The substrate layer 11 includes a first surface and a second surface disposed opposite each other. The ground layer 12 is formed on the first surface of the substrate layer 11, i.e. the surface of the side far from the first cover plate 20. The composite electrode layer 13 is formed on the second surface of the substrate layer 11, i.e. the surface near the side of the first cover 20, and at least part of the composite electrode layer 13 is formed in the soft board area AA.

In some embodiments, the material of the substrate layer 11 may be a flexible insulating material, such as but not limited to Polyimide (PI), polypropylene (PP), liquid Crystal Polymer (LCP), polyetheretherketone (PEEK), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN), etc.

The ground layer 12 and the composite electrode layer 13 may be transparent conductive films having good conductive properties, such as, but not limited to, indium tin oxide, indium zinc oxide films, etc., or organic conductive material films, such as polyethylene dioxythiophene (PEDOT), etc.

It is understood that the touch pad 100 further includes a first adhesive layer 21. The first adhesive layer 21 is formed on the surface of the composite electrode layer 13 on the side far away from the substrate layer 11 and is located in the soft board area AA. The first cover plate 20 is formed on a surface of the first adhesive layer 21 on a side away from the base material layer 11. It is understood that the first cover plate 20 can be adhered to the circuit board 10 by the first adhesive layer 21.

Illustratively, the composite electrode layer 13 includes a first direction line and a second direction line, wherein the first direction line and the second direction line are disposed to intersect, for example, disposed to intersect vertically. The composite electrode layer 13 is used to form a first sensing capacitor together with the first cover 20 for detecting the pressure of the finger pressing the touch pad 100. Specifically, when the user approaches the finger to the first cover 20, the capacitance of the first sensing capacitor is changed, and the control unit 50 is used to determine the position of the finger on the surface of the first cover 20 according to the change of the capacitance of the first sensing capacitor. Illustratively, the control unit 50 is capable of converting the change in capacitance of the first sensing capacitor into coordinates to determine the position of the finger.

In some embodiments, the circuit board 10 further includes a first dielectric layer 17 and a control circuit layer 18 that are positioned in the hard board region BB and are stacked in the thickness direction of the circuit board 10. The first dielectric layer 17 is formed on the surface of the ground layer 12 on the side far away from the base material layer 11, and is located in the hard board region BB. The control circuit layer 18 is formed on the surface of the first dielectric layer 17 far away from the substrate layer 11, the control unit 50 and the pressure sensor 62 are attached to the control circuit layer 18, and the control unit 50 is electrically connected to the ground layer through the control circuit layer 18.

Illustratively, the material of the first dielectric layer 17 may be polypropylene (PP) or FR4.

In one possible implementation, the composite electrode layer 13 extends from the soft board area AA to the connection area CC and the hard board area BB. The circuit board 10 includes a first conductive post 111 and a second conductive post 171. Part of the first via 111 passes through the substrate layer 11 and connects the composite electrode layer 13 located in the hard board region BB and the ground layer 12 located in the hard board region BB. The second conductive via 171 passes through the first dielectric layer 17 and connects the ground layer 12 and the control circuit layer 18.

It will be appreciated that the change in capacitance of the first sensing capacitor can be transferred to the control unit 50 through the lines in the composite electrode layer 13, the first conductive via 111, the lines in the ground layer 12, the second conductive via 171, and the lines in the control circuit layer 18 in this order.

It can be understood that the touch control system where the first cover 20 is located realizes the detection of the finger position on the surface of the first cover 20 through the composite electrode layer 13, and can reduce the thickness of the circuit board 10 in the soft board area AA, thereby reducing the space of the touch pad 100 and realizing the light and thin touch pad 100.

In some embodiments, the circuit board 10 includes a first electrode layer 14, a second dielectric layer 15, and a second electrode layer 16 that are located in the hard board region BB and are sequentially stacked in the thickness direction of the circuit board 10. Specifically, the first electrode layer 14 is formed on the second surface of the substrate layer 11 and is located in the hard board area BB. The second dielectric layer 15 is formed on the surface of the first electrode layer 14 on the side away from the base material layer 11. The second electrode layer 16 is formed on the surface of the second dielectric layer 15 on the side away from the base material layer 11.

The first electrode layer 14 and the second electrode layer 16 are transparent conductive films having good conductive properties, such as, but not limited to, indium tin oxide, indium zinc oxide films, etc., or organic conductive material films, such as polyethylene dioxythiophene (PEDOT), etc.

Illustratively, the material of the second dielectric layer 15 may be polypropylene (PP) or FR4.

The touch pad 100 further includes a second adhesive layer 31. The second adhesive layer 31 is formed on a surface of the second electrode layer 16 on a side away from the base material layer 11, and the second cover plate 30 is formed on a surface of the second adhesive layer 31 on a side away from the base material layer 11.

Wherein the lines in the first electrode layer 14 cross the lines in the second electrode layer 16 at an angle. For example, the wiring in the first electrode layer 14 is disposed perpendicularly to the wiring in the second electrode layer 16. The first electrode layer 14, the second electrode layer 16 and the second cover 30 together form a second sensing capacitor for detecting the pressure of the finger pressing on the touch pad 100. Specifically, when the user approaches the finger to the second cover 30, the capacitance of the second sensing capacitor is changed, and the control unit 50 is used to determine the position of the finger on the surface of the second cover 30 according to the change of the capacitance of the second sensing capacitor. Illustratively, the control unit 50 is capable of converting the change in capacitance of the second sensing capacitor into coordinates to determine the position of the finger.

In one possible implementation, the circuit board 10 includes a third via post 151, and the third via post 151 passes through the second dielectric layer 15 and connects the first electrode layer 14 and the second electrode layer 16. It will be appreciated that the first via 111, which partially passes through the substrate layer 11, is used to connect the first electrode layer 14 and the ground layer 12.

It will be appreciated that the change in capacitance of the first sensing capacitor can be transferred to the control unit 50 through the wiring in the second electrode layer 16, the third via 151, the wiring in the first electrode layer 14, the first via 111, the wiring in the ground layer 12, and the wiring in the control circuit layer 18.

It can be appreciated that, by simultaneously disposing the first electrode layer 14 and the second electrode layer 16 respectively to realize the detection of the finger position on the surface of the second cover plate 30, the capacitance change of the second sensing capacitor is more obvious when the finger touches the surface of the second cover plate 30, so as to improve the sensitivity of the touch pad 100 for detecting the finger position.

In some embodiments, the circuit board 10 further includes a power plane. The power plane is used for connecting a power supply source, such as power supply of an access PC. In one possible implementation, the lines in the power plane are also used to pass control signals output by the control unit 50 to the PC. In one possible implementation, the power plane is co-located with the ground plane 12.

In some embodiments, the touch pad 100 further includes a wireless communication unit 70. The wireless communication unit 70 is disposed between the support 61 and the hard board area BB of the circuit board 10. It is understood that the wireless communication unit 70 may be, for example, a bluetooth module or a wifi module.

The wireless communication unit 70 is electrically connected to the control unit 50, and the wireless communication unit 70 is used for connecting to external electronic devices, i.e., other electronic devices than the electronic device to which the non-touch pad 100 belongs. The external electronic device establishes a connection with the touch pad 100 through the wireless communication unit 70, and a user can then control the external electronic device by operating on the touch pad 100.

It is understood that the touch pad 100 can be used with external electronic devices by providing the wireless communication unit 70. In this way, the use scenario of the touch pad 100 is increased.

Referring to fig. 3 and fig. 4 together, an embodiment of the present application further provides an electronic device 200. The electronic device 200 may be a personal computer.

The electronic device 200 includes a display portion 210 and a support portion 220. The display portion 210 and the support portion 220 can be connected by wired or wireless means. The display section 210 includes a display 211. The supporting part 220 includes the touch pad 100 in the above embodiment. It will be appreciated that the support 220 may also include other components, such as a keyboard.

The support 220 includes a first face 221 and a second face 222. The first face 221 and the second face 222 are connected by a bezel 223. The touch pad 100 is disposed at an edge of the supporting portion 220. Specifically, the first cover 20 is formed on the first surface 221. When the touch pad 100 is bent by the movable hinge 40, the second cover 30 is formed on the second surface 222, and the movable hinge 40 is formed on the frame 223. When the living hinge 40 is unfolded, as shown in fig. 4, the second cover plate 30 can be turned around the living hinge 40 to be away from the supporting portion 220 until being substantially parallel to the first cover plate 20. In this way, the user can perform finger operation on the surface of the second cover 30 to implement manipulation of the electronic device 200.

It can be appreciated that in the present embodiment of the application, bending is achieved through the movable hinge 40, so that the operation range of the touch pad 100 is changed, and a user of the electronic device 200 can use the touch pad 100 to control the electronic device 200 in a proper range.

It will be appreciated by persons skilled in the art that the above embodiments have been provided for the purpose of illustration only and not as a definition of the limits of the application, and that appropriate modifications and variations of the above embodiments should be within the scope of the application as claimed.

Claims (10)

1. A touch pad, the touch pad comprising:

the circuit board comprises a hard board area, a soft board area and a connection area, wherein the connection area is connected with the hard board area and the soft board area;

the first cover plate is arranged on the first side of the soft board area;

the second cover plate is arranged on the first side of the hard plate area;

the movable hinge is arranged on the surface of the connecting area;

the mechanical micro-motion module is arranged on the second side of the hard board area and is used for outputting a feedback signal when the first cover board or the second cover board is pressed by external force;

the control unit is arranged between the mechanical micro-motion module and the hard board area and is electrically connected with the circuit board and the mechanical micro-motion module;

when the movable hinge is in a bending state, the hard plate area and the soft plate area are arranged at intervals along the thickness direction of the circuit board, and the control unit is used for determining the force application on the first cover plate according to the feedback signal; when the movable hinge is in an extending state, the hard board area and the soft board area are arranged at intervals along the length direction of the circuit board, and the control unit is used for determining the force application size on the second cover plate according to the feedback signal.

2. The touch pad of claim 1, wherein the mechanical micro-motion module comprises:

the support piece is arranged on the second side of the hard board area, and the control unit is arranged between the support piece and the hard board area;

the pressure sensor is arranged between the supporting piece and the hard board area and is electrically connected with the control unit; and

A vibration motor disposed between the support and the hard board region, the vibration motor for applying a force to the pressure sensor through the support when an external force is applied thereto;

the pressure sensor is used for outputting the feedback signal according to the magnitude of the acting force.

3. The touch pad of claim 2, wherein the circuit board comprises:

a substrate layer comprising a layer of a polymer,

a ground layer formed on the first surface of the substrate layer; and

the composite electrode layer is formed on the second surface of the substrate layer, at least part of the composite electrode layer is formed in the soft board area, and the first surface of the substrate layer and the second surface of the substrate layer are arranged in a back-to-back mode;

the touch pad comprises a first bonding layer, wherein the first bonding layer is formed on the surface of one side, far away from the substrate layer, of the composite electrode layer and is positioned in the soft board area, and the first cover plate is formed on the surface of one side, far away from the substrate layer, of the first bonding layer;

the composite electrode layer is used for forming a first induction capacitor together with the first cover plate, and the control unit is used for determining the position of a finger positioned on the surface of the first cover plate according to the change of the capacitance of the first induction capacitor.

4. The touch pad of claim 3, wherein the circuit board comprises:

the first dielectric layer is formed on the surface of one side, far away from the substrate layer, of the grounding layer and is positioned in the hard board area;

the control circuit layer is formed on the surface of one side, far away from the substrate layer, of the first dielectric layer, the control unit and the pressure sensor are attached to the control circuit layer, and the control unit is electrically connected with the grounding layer through the control circuit layer.

5. The touch pad of claim 4, wherein the composite electrode layer extends from the soft board region to the connection region and the hard board region;

the circuit board includes:

a first conductive pillar, at least part of which passes through the substrate layer and connects the composite electrode layer located in the hard board area and the grounding layer located in the hard board area;

and the second conducting column penetrates through the first dielectric layer and is connected with the ground layer and the control circuit layer.

6. The touch pad of claim 3, wherein the circuit board comprises:

the first electrode layer is formed on the second surface of the substrate layer and is positioned in the hard board area;

the second dielectric layer is formed on the surface of the first electrode layer, which is far away from the side of the substrate layer; and

the second electrode layer is formed on the surface of the second dielectric layer, which is far away from the side of the substrate layer;

the touch pad comprises a second bonding layer, wherein the second bonding layer is formed on the surface of one side, far away from the substrate layer, of the second electrode layer, and the second cover plate is formed on the surface of one side, far away from the substrate layer, of the second bonding layer;

the circuit in the first electrode layer and the circuit in the second electrode layer are arranged in a crossing mode, the first electrode layer, the second electrode layer and the second cover plate jointly form a second induction capacitor, and the control unit is used for determining the position of a finger positioned on the surface of the second cover plate according to the change of the capacitance of the second induction capacitor.

7. The touch pad of claim 6, wherein the circuit board includes a third conductive post that passes through the second dielectric layer and connects the first electrode layer and the second electrode layer.

8. The touch pad of claim 3, wherein the circuit board comprises a power plane, the power plane being co-planar with the ground plane.

9. The touch pad of claim 2, wherein the touch pad comprises a wireless communication unit disposed between the support and the hard board area, the wireless communication unit being electrically connected to the control unit.

10. An electronic device, comprising:

a display; and

The touch pad according to any one of claims 1 to 9, for detecting a touch position of a finger and an amount of pressure applied when the finger touches or presses.