CN220029001U

CN220029001U - Laser processing device for manufacturing display device

Info

Publication number: CN220029001U
Application number: CN202321644192.0U
Authority: CN
Inventors: 李浚政; 元载雄; 朴大星; 李东柱
Original assignee: Meere Co Inc
Current assignee: Meere Co Inc
Priority date: 2022-06-29
Filing date: 2023-06-27
Publication date: 2023-11-17
Anticipated expiration: 2033-06-27

Abstract

The utility model discloses a laser processing device, which is used for forming an open area on a display panel for installing a component on the front surface, the laser processing device according to one embodiment comprises: a placement section for placing a display panel; a processing hole configured at the placement part; a supporting portion for supporting the placement portion; a suction line formed at the support portion and connected to the processing hole; and a pressure preventing hole formed to have one end opened to the outside through a side surface of the placement portion and the other end penetrated to the processing hole, thereby exhausting gas, smoke and foreign matter generated during laser processing.

Description

Laser processing device for manufacturing display device

Technical Field

The present disclosure provides a laser processing apparatus for manufacturing a display apparatus.

Background

A screen (screen) included in a smart phone (smart phone), a tablet pc (tablet), a smart TV (smart TV), a smart monitor (smart monitor), a smart watch (smart watch), or the like is configured with front-end components such as a front-end camera, an illuminance sensor, a microphone, and a speaker in a partial region of the screen in order to raise the screen ratio to a limit. In order to arrange these front-end components, it is necessary to form an open space (e.g., punched hole) for exposing the corresponding components in the display panel. Such an open space can be realized by forming a punched hole or the like in the display panel using a laser processing apparatus.

Korean laid-open patent publication No. 10-2021-0136946, which is the disclosure of the present inventors, discloses a laser processing system and a laser processing method. However, when an open space is formed in a display panel by a laser processing apparatus including such a general processing table, there is a problem in that gas, smoke, and foreign matter generated in a laser processing process are fixed to the display panel, resulting in occurrence of defects in the final product.

Disclosure of Invention

Technical problem to be solved by the utility model

The utility model discloses a laser processing device for manufacturing a display device and various embodiments related to a processing table included in the laser processing device. The technical problems to be solved by the present embodiment are not limited to the above-described technical problems, and other technical problems can be deduced from the following embodiments.

Technical proposal

As a technical means for solving the above technical problem, a first aspect of the present disclosure is a laser processing apparatus, comprising: a placement part including an upper surface, a lower surface and a side surface, having a thickness, and placing a display panel requiring processing of a through hole on the upper surface; a support portion having a main surface and an opposite surface, and the placement portion being disposed on the main surface; a processing hole which is arranged in the placement part and penetrates the placement part along the thickness direction or is formed by recessing from the upper surface to the lower surface of the placement part, wherein the processing hole comprises a processing supporting part which is arranged in an island shape in the center and is arranged in a mode corresponding to the position of the through hole of the display panel to be processed; a suction line disposed on the support portion and having one side open to the outside and the other side connected to the processing hole; and a pressure preventing hole disposed in the placement portion and having one end opened to the outside through a part of a side surface of the placement portion and the other end penetrating to the processing hole.

Advantageous effects

According to the solution to the problems of the present disclosure described above, it is possible to minimize the problem that gas, smoke, and foreign matter generated when the display panel forms an open area are fixed to the display panel. In addition, it is possible to solve the problem that the display panel is bent by suction pressure when the display panel is placed on a processing table of a laser processing apparatus, and to perform precise laser processing, reduce the risk of generating cracks (cracks) at the time of laser processing, and reduce the reject ratio of the final product.

Drawings

Fig. 1 shows several forms of an open area formed in a display panel of a smart phone.

Fig. 2 is a conceptual diagram illustrating contents forming an open space in a display panel.

Fig. 3 is a diagram illustrating a laser processing system according to an embodiment of the present utility model.

Fig. 4 is a perspective view showing the structure of a processing table according to an embodiment of the present utility model.

Fig. 5 shows the perspective view of fig. 4 as a perspective view.

Fig. 6 is a cross-sectional perspective view showing a cross section of the processing table 130 of fig. 4 and 5 taken along line C-C'.

Fig. 7 is a cross-sectional view schematically showing a cross section of a processing table according to an embodiment of the present utility model.

Fig. 8 is a cross-sectional view schematically showing a cross section of a processing table according to another embodiment of the present utility model.

Fig. 9 and 10 show cross sections of a processing table according to a comparative example and a processing table according to an embodiment of the present utility model.

Description of the reference numerals

10: display panel

130: processing table

132: support part

131: placement part

133: machining holes

135: groove

136: suction line

Detailed Description

Hereinafter, embodiments of the present utility model will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present utility model. The utility model may, however, be embodied in many different forms and is not limited to the embodiments described herein. And for the purpose of clearly illustrating the present utility model in the drawings, parts irrelevant to the description are omitted, and like parts are given like reference numerals throughout the specification.

In the following embodiments, terms such as "first", "second", etc. are used to distinguish one component element from another component element without limitation.

In the following embodiments, singular expressions include plural expressions unless the context clearly indicates otherwise.

In the following embodiments, terms such as "comprising" or "having" mean that the features or components described in the specification are present, and the possibility of adding one or more other features or components is not previously excluded.

In the following embodiments, when a portion of a film, a region, a constituent element, or the like is on or over another portion, not only a case of directly on another portion but also a case of interposing another film, a region, a constituent element, or the like therebetween is included.

In the drawings, the size of the constituent elements may be exaggerated or reduced for convenience of explanation. For example, since the size and thickness of each of the structures shown in the drawings are arbitrarily shown for convenience of explanation, the present utility model is not necessarily limited to the drawings.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on an orthogonal coordinate system, and can be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

When the embodiments are implemented in other ways, the particular sequence of processes may be performed in a different manner than illustrated. For example, two processes described as being performed in succession may be executed substantially concurrently or the processes may be executed in the reverse order of the description.

Hereinafter, the present disclosure will be described in detail with reference to the accompanying drawings.

A screen (screen) included in a smart phone (smart phone), a tablet pc (tablet), a smart TV (smart TV), a smart monitor (smart monitor), a smart watch (smart watch), or the like is configured with front-end components such as a front-end camera, an illuminance sensor, a microphone, and a speaker in a partial region of the screen in order to raise the screen ratio to a limit. In order to arrange these front-facing components, an open space for exposing the corresponding components needs to be formed in the display panel 10. Such an open space may be variously implemented as a circular punch (hole), an oval hole, a notch (notch), an Island notch (Island notch), a straight line (straight line), or the like according to designs. In fig. 1, the open space in the form of the circular punched holes TH1 for disposing the cameras and the elliptical holes TH2 for disposing the various sensors is shown, but the shape of the open space is not limited to the illustrated form and may be designed in various forms.

Fig. 2 is a conceptual diagram illustrating the contents of the open space TH formed in the display panel 10.

In the present specification, the display panel 10 includes an Active Area (AA) of a display screen, and its cross-sectional structure may include a substrate 11, a driving element layer 12 formed on the substrate 11, and a display formed on the driving element layer 12The display element layer 13 and the cover layer 14 covering the display element layer 13. Among them, the display panel 10 may be an organic light emitting display panel (organic light emitting display panel), an inorganic light emitting display panel (inorganic light emitting display panel), a quantum dot light emitting display panel (quantum dot light emitting display panel), a liquid crystal display panel (Liquid crystal display panel), or a light emitting diode display panel (Light emitting diode display panel), etc., according to the type of display element, but is not limited to the listed types. On the other hand, the substrate base 11 may be composed of SiO-containing material ₂ The glass material as a main component is not limited thereto, and may be made of metal, plastic (e.g., polyimide), or a combination thereof.

The open space TH is used to expose front components such as a front camera, an illuminance sensor, a microphone, and a speaker disposed at the lower portion of the display panel 10. The open space TH may be formed to penetrate the entire display panel 10 in the thickness direction of the display panel 10. That is, the open space TH may be represented as a through hole, a via hole (via), an opening, or the like. The open space TH may be formed by a non-contact method, and according to an embodiment of the present utility model, the open space TH may be formed using a laser processing system 100 described later.

Hereinafter, for convenience of explanation, a laser processing system for performing laser processing will be described with reference to the content of the open space TH in the form of the circular punched hole TH1 shown in fig. 1.

Fig. 3 is a diagram illustrating a laser processing system 100 according to an embodiment of the present utility model.

The laser processing system 100 according to an embodiment of the present utility model may be utilized for various laser processing such as laser cutting laser drilling, laser writing (laser writing), laser patterning (laser patterning), laser scribing (laser scribing), and the like. Hereinafter, however, for convenience of explanation, the laser processing system 100 will be explained as being utilized for laser cutting processing.

Referring to fig. 3, the laser oscillator 110 may include a laser source capable of generating and outputting a laser beam of a specific wavelength. Laser beam output from laser oscillator 110The type of (c) is not particularly limited and may be appropriately selected according to the type of the workpiece W or the machining mode. For example, the laser beam output from the laser oscillator 110 may be any one of the following laser beams: solid laser beams including a ruby laser beam, a Nd: YAG laser beam, a Ti: sapphire laser beam, and the like; a liquid laser beam including a pigment laser beam and the like; comprising CO ₂ Laser beams, he—ne laser beams, ar+ laser beams, gas laser beams of excimer laser beams, and the like. The laser oscillator 110 is connected to the controller 150. Characteristics of the laser beam output from the laser oscillator 110, such as output power, intensity, period, output timing (timing), etc., of the laser beam may be controlled by a signal generated by the controller 150.

The processing stage 130 may be configured to face the direction of laser irradiation. The processing table 130 has a placement portion on which the workpiece W is placed, and is movable in a preset direction in a state in which the workpiece W is placed. For example, the processing table 130 may be movable in each direction of the X-axis, the Y-axis, and the Z-axis, and may be rotatable about the Z-axis. The operation of the processing table 130, for example, the operation of the fixing member for fixing the workpiece W, or the moving speed or rotational speed, moving direction, moving distance, etc. of the processing table 130 may be controlled by the controller 150.

According to an embodiment of the present utility model, the processing table 130 is configured such that the upper surface of the object to be processed W placed on the processing table 130 in the laser processing process is placed flat and such that gas, fumes and foreign substances generated in the processing process are not fixed to the concave portion or the hole portion of the processing table 130, thereby facilitating maintenance, management and repair of the laser processing system and preventing occurrence of defects in the final product due to foreign substances generated in the processing process.

The mirror 121 may control the optical path of the laser beam La output from the laser oscillator 110. The number of mirrors 121 included in the laser processing system 100 is not particularly limited, and the mirrors 121 may be Galvano mirrors (Galvano-mirrors), and the mirrors may be connected to a Galvano scanner (Galvano-scanner). The action of the mirror 121, for example, the tilt angle (tilt angle) and the tilt speed (tilt speed) of the mirror 121, etc., may be controlled by the controller 150.

The lens 122 may be disposed between the processing stage 130 and the mirror 121. The lens 122 condenses the laser beam Lb reflected from the mirror 121, and irradiates the laser beam L to the workpiece W. In one embodiment of the utility model, the lens 122 may be an f-theta lens. In the drawings, the lens 122 is shown as one, but is not limited thereto. For example, the lens 122 may be constituted by a plurality of spherical lenses or planar lenses.

The mirror 121 and the lens 122 may constitute the optical unit 120. The optical unit 120 can irradiate the laser beam L to a desired position on the workpiece W by adjusting the optical path of the laser beam La output from the laser oscillator 110. In other words, the optical unit 120 and the laser oscillator 110 are arranged in a direction perpendicular to the upper surface of the placement portion 131, and constitute a laser irradiation portion 140 for irradiating laser light to the workpiece W placed on the upper surface of the placement portion 131. The operation and position of the laser irradiation unit 140 and the plurality of constituent units constituting the laser irradiation unit can be controlled by the controller 150.

The specific configuration of the processing table 130 included in the laser processing system 100 will be described below with reference to the drawings.

Fig. 4 is a perspective view showing the structure of the processing table 130 according to an embodiment of the present utility model. Fig. 5 shows the perspective view of fig. 4 as a perspective view. Fig. 6 is a cross-sectional perspective view showing a cross section of the processing table 130 of fig. 4 and 5 taken along line C-C'.

Referring to fig. 4 to 6, the processing table 130 according to an embodiment of the present utility model may include a support portion 132 and a placement portion 131.

The support portion 132 has a main surface and an opposite surface corresponding to a frame constituting the processing table 130, and the placement portion 131 is disposed on a flat main surface of the support portion 132. However, the present utility model is not limited thereto, and the supporting portion 132 and the placing portion 131 may be implemented in an integrated manner. However, in this specification, for convenience of description, it is indicated by different reference numerals and denoted by different names.

The placement portion 131 includes an upper surface, a lower surface, and side surfaces, and has a thickness, and can place the work W, i.e., the display panel 10, requiring the work of the open space TH on the flat upper surface. The placement portion 131 is provided with a processing hole 133 and a groove 135.

The processing hole 133 may be a hole or a groove formed through or recessed from the upper surface to the lower surface of the placement portion 131 in the thickness direction of the placement portion 131. The processing holes 133 are arranged in a manner corresponding to positions of the open spaces TH to be processed in the display panel 10. In other words, the processing holes 133 are arranged so as to correspond to the processing region of the display panel 10. The machining region refers to a region corresponding to machining coordinates of an ablation (ablation) laser beam to form an open space TH in the effective region AA of the display panel 10, and may be a line to be cut. As shown, fig. 4 to 6 show a processing hole 133 corresponding to the circular punched hole TH1 and a sensor processing hole 133s corresponding to the elliptical hole TH2 in order to process the circular punched hole TH1 and the elliptical hole TH2 of fig. 1. However, the present utility model is not limited to the illustration, and a plurality of forms, sizes, and numbers of processing holes may be disposed in the placement portion 131 to form a plurality of open spaces TH.

The processing hole 133 includes a processing support portion 133a in the center. The processing support portion 133a is arranged in an island shape at the center of the processing hole 133. In other words, the processing support portion 133a is disposed at a predetermined distance from the inner surface of the processing hole 133. The process support portion 133a supports a virtual area to be removed from the display panel 10 in order to generate the open space TH. The dummy region is a portion that is removed from the display panel 10 as a dummy (dummy) after the laser processing process on the display panel 10 to create the open space TH.

A laser irradiation part 140 is provided at a vertical direction upper portion of the processing table 130 to irradiate a laser beam to a processing region that is an edge of the open space TH of the display panel 10. When the laser beam is irradiated to the processing region, a virtual object separated from the display panel 10 is generated. After the step of removing the generated virtual object from the display panel 10, an open space TH is formed in the display panel 10.

In this laser processing step, in order to prevent damage to the processing table 130 by the laser beam and damage to the display panel 10 other than the processing region, the processing hole 133 is disposed in the processing table 130 corresponding to the processing region of the display panel 10, and the processing support portion 133a is disposed corresponding to the virtual region. The processing support portion 133a prevents cracks from occurring in the display panel due to uneven separation of dummy objects in the laser processing process, and ensures stable processing of the processing region by supporting the dummy region. In the figure, the sensor processing support 133sa is arranged so as to correspond to the sensor processing hole 133s. The planar shape of the processing support portion 133a may be realized in a manner corresponding to the planar shape of the processing hole 133.

The groove 135 may be a linear hole or groove disposed in the placement portion 131 and penetrating in the thickness direction of the placement portion 131 or recessed from the upper surface to the lower surface of the placement portion 131. The groove 135 is disposed in a region corresponding to an edge of the display panel 10. In other words, the grooves 135 are arranged in a manner corresponding to the positions where the cutting lines are to be processed in the display panel 10. Here, the cutting line divides the effective area AA and the boundary (board) area of the display panel 10, and is an area corresponding to processing coordinates of the irradiation ablation laser beam, and may be a cutting scheduled line. When the laser beam is irradiated along the cutting line, the center portion corresponds to the effective area AA and the outline portion corresponds to the boundary area, separated with reference to the cutting line. On the other hand, as shown in fig. 5, the processing table 130 may further include a groove suction line 136g connected to the groove 135 and discharging gas, fumes and foreign substances in the groove to the outside, and a groove suction line connection 134g. However, the present utility model is not limited thereto, and the groove suction line 136g and the groove suction line connection portion 134g may be implemented in a combined integrated manner.

The processing table 130 according to an embodiment of the present utility model includes a suction line 136 and a pressure preventing hole 137.

The suction line 136 may be formed at the supporting part 132 or the placing part 131. One side of the suction line 136 is opened to the outside, and the other side is connected to the processing hole 133.

The suction line 136 is configured to be opened to the outside through an edge surface, an opposite surface, or a main surface of the support 132 when penetrating in a length direction or a width direction of the support 132. The other side is connected to the processing hole 133, and various gases, fumes, and foreign substances flowing into the processing hole 133 can be discharged to the outside of the processing table 130. Also, when the suction line 136 is disposed at the supporting portion 132, a connection portion 134 may be further included, the connection portion 134 being connected to the processing hole 133 disposed at the placing portion 131. Of course, the suction line 136 configured to penetrate in the length or width direction of the support portion 132 may be connected to the processing hole 133 of the placement portion 131 through the connection portion 134, or may be connected to the processing hole 133 of the placement portion 131 by bending the suction line 136 itself in the direction of the processing hole 133.

Fig. 5 shows the sensor suction line 136s and the sensor connection 134s separately, which are connected to the sensor processing hole 133s. However, the present utility model is not limited thereto, and the suction line 136 and the sensor suction line 136s may be implemented in a combined integrated manner.

On the other hand, when the suction line 136 is configured to penetrate in the length direction or the width direction of the placement portion 131, one side may be opened to the outside through the side surface or the lower surface of the placement portion 131. The other side is connected to the processing hole 133, and various gases, fumes, and foreign materials flowing into the processing hole 133 can be discharged to the outside of the processing table.

The pressure preventing hole 137 is disposed in the placement portion 131 in which the processing hole 133 is disposed. The pressure preventing hole 137 is a through hole including one end and the other end. One end of the pressure preventing hole 137 is opened to the outside through a part of the side surface, the upper surface, or the lower surface of the placement portion 131, and the other end is disposed so as to penetrate the processing hole 133. That is, the pressure preventing hole 137 is realized as a through hole that opens the processing hole 133 to the outside.

The processing table 130 according to another embodiment of the present utility model includes a pressure preventing hole 137 formed through the groove 135. In this case, the pressure preventing hole 137 is configured such that one end is opened to the outside through a portion of the side surface, the upper surface, or the lower surface of the placement portion 131, and penetrates the groove 135 at the central portion of the pressure preventing hole 137 such that the other end penetrates the processing hole 133. Fig. 4 to 6 show the pressure preventing hole 137 formed through the groove 135.

Fig. 7 is a cross-sectional view schematically showing a cross section of the processing table 130 according to an embodiment of the present utility model. Fig. 8 is a cross-sectional view schematically showing a cross section of a processing table 130a according to another embodiment of the present utility model.

Referring to fig. 7, a processing station 130 according to an embodiment of the present utility model is connected to a vacuum pump 138. In detail, a vacuum pump 138 may be connected to one side of the suction line 136 opened to the outside, the vacuum pump 138 being used to perform suction from the process hole 133 or decompression of the inside of the process hole. The vacuum pump 138 sucks the laser beam from the processing hole 133 or decompresses the inside of the processing hole 133, thereby effectively discharging gas, mist, and foreign matters generated in the laser beam processing step from the laser beam processing apparatus.

Referring to fig. 8, the processing table 130 according to another embodiment of the present utility model is connected to an air pump 139 in addition to the vacuum pump 138. In detail, the air pump 139 for blowing air into the processing hole 133 and the groove 135 may be further connected to one end of the pressure preventing hole 137 opened to the outside. The vacuum pump 138 performs suction from the processing hole 133 or decompression inside the processing hole 133 while the air pump 139 injects air (air) into the pressure preventing hole 137, thereby pushing out gas, smoke and foreign matter generated in the laser processing process through the air and effectively discharging from the laser processing device, and can push out gas, smoke and foreign matter formed in the groove through the air and effectively discharging from the laser processing device in addition to the processing hole 133.

Hereinafter, a laser processing process performed at a processing station according to an embodiment of the present utility model will be described with reference to fig. 7.

In step 10, the display panel 10 as the workpiece W is placed on the upper surface of the placement portion 131 of the processing table 130. The processing region of the display panel 10, which is a portion where the open space TH is to be formed, is placed in a manner corresponding to the processing hole 133 of the placement portion 131.

In step 11, after the display panel 10 is placed, a vacuum pump 138 connected to the process table 130 performs an operation and sucks air inside the process hole 133 through a suction line 136. The operation of the vacuum pump 138 may be started before the display panel 10 is placed, or may be started when the laser beam is irradiated from the laser irradiation part 140, but the present utility model is not limited thereto.

In step 12, the laser beam L is irradiated from the laser irradiation section 140 provided at the upper portion in the vertical direction of the processing table 130 to the processing region of the processing surface of the display panel 10.

In step 13, the display panel 10 is ablated by the irradiated laser beam L, and gas, smoke, and foreign matter are generated. At the start of the laser processing, gas or fumes generated on the surface of the display panel 10 are removed for the first time by an upper suction unit (not shown) located between the lens (122 of fig. 3) and the processing table 130, and in order to prevent foreign matters, ash (ash) and fumes generated by perforating the display panel 10 from being fixed or attached to the rear surface of the display panel 10, are sucked into the processing hole 133 by a suction pressure formed inside the processing hole 133 of the processing table 130 according to an embodiment of the present utility model and discharged to the outside of the processing table 130 through a suction line 136.

On the other hand, since the pressure preventing hole 137 is formed through the groove 135 in the processing table 130, gas, smoke and foreign matter generated during irradiation of the laser beam L are not fixed to the groove, but are sucked into the processing hole 133 through the pressure preventing hole 137, and finally discharged to the outside of the processing table 130 through the suction line 136.

Further, according to the embodiment of fig. 8, since the pressure preventing hole 137 is connected to the external air pump 139, the air, smoke, and foreign matter that may remain in the groove 135 due to the air flowing in from the outside can be more effectively sucked into the processing hole 133.

Fig. 9 and 10 show cross sections of a processing table 130C according to a comparative example and a processing table 130 according to an embodiment of the present utility model. It should be noted that the processing table 130C according to the comparative example of fig. 9 and 10 does not include a pressure preventing hole.

Referring to the comparative example of fig. 9 (a), when the display panel 10 is placed on the placing portion 131 of the processing table 130C of the comparative example, a vacuum pump connected to the processing table performs an operation to suck air inside the processing hole 133 through the suction line 136. When the pressure inside the processing hole 133 is reduced, a portion of the display panel 10 corresponding to the processing hole 133 is sucked and bent in the direction of the processing hole 133. If the laser processing is performed in this state, there is a problem in that the processing is performed on an area other than the processing area to be processed due to the curved display panel, or there is a problem in that cracks which may cause defects to the final product are generated due to a large suction pressure in the processing step.

However, with the processing table 130 according to the embodiment of the present utility model of fig. 9 (b), since the pressure preventing hole 137 is present, suction pressure is prevented from being excessively applied to the display panel 10, and thus, a problem of bending of a portion of the display panel 10 corresponding to the processing hole 133 does not occur. Therefore, the precision of laser processing is improved, and the problem of poor occurrence of cracks caused by suction pressure is solved.

Referring to the processing table 130C according to the comparative example of fig. 10 (a), the laser beam L is irradiated from the laser irradiation portion at the upper portion of the processing table to the processing region of the processing surface of the display panel 10. The display panel 10 is ablated by the irradiated laser beam L, and generates gas, smoke, and foreign matter. The gas, fumes and foreign matter generated at this time are sucked into the processing hole 133 by the suction pressure formed inside the processing hole 133 and discharged to the outside of the processing table through the suction line 136. However, since there is no pressure preventing hole for connecting the groove 135 and the processing hole 133, gas, smoke and foreign matter permeated into the groove 135 cannot be discharged. The gas, smoke and foreign matter in the groove 135 are fixed to the display panel and increase the defective rate of the final product.

However, with the processing table 130 according to the embodiment of the present utility model of fig. 10 (b), since there is the pressure preventing hole 137 penetrating the groove 135 and the processing hole 133, gas, smoke and foreign substances permeated into the groove 135 are sucked into the processing hole 133 through the pressure preventing hole 137 and discharged to the outside of the processing table 130. Accordingly, it is possible to prevent gas, smoke, and foreign matter penetrating into the groove 135 from being fixed to the display panel 10, and to reduce the defective rate of the final product.

The steps constituting the method according to the present utility model may be performed in an appropriate order unless the order is explicitly described or stated to the contrary. The present utility model is not limited to the order of the steps described above. All example or exemplary terms (e.g., etc.) used in the present utility model are merely for the purpose of describing the present utility model in detail, and the scope of the present utility model is not limited by the above example or exemplary terms unless limited by the claims. Also, it will be understood by those skilled in the art that various modifications, combinations, and alterations may be made depending on design conditions and factors within the scope of the appended claims or equivalents thereof.

The inventive concept should therefore not be limited to the embodiments described above, but the following claims and all equivalents and modifications coming within the scope of the inventive concept.

Claims

1. A laser processing apparatus, comprising:

a placement section having a thickness, including an upper surface, a lower surface, and a side surface, on which a display panel requiring processing of a through hole is placed;

a support portion having a main surface and an opposite surface, and the placement portion being disposed on the main surface;

a processing hole which is arranged in the placement part, penetrates through the placement part along the thickness direction or is formed by recessing from the upper surface to the lower surface of the placement part, is provided with a processing support part arranged in an island shape in the center, and is arranged in a manner corresponding to the position of the through hole of the display panel to be processed;

a suction line disposed on the support portion and having one side open to the outside and the other side connected to the processing hole; and

and a pressure preventing hole disposed in the placement portion and having one end opened to the outside through a part of a side surface of the placement portion and the other end penetrating the processing hole.

2. The laser processing apparatus according to claim 1, wherein,

the laser processing apparatus further includes:

a groove which is arranged on the placement part and penetrates along the thickness direction of the placement part or is concavely formed from the upper surface to the lower surface of the placement part and is arranged in a mode corresponding to the edge of the display panel,

the pressure preventing hole opens a part of a side surface of the placement portion, and penetrates the groove and the processing hole.

3. The laser processing apparatus according to claim 2, wherein,

the laser processing apparatus further includes:

and an air pump connected to one end of the pressure preventing hole and blowing air into the groove and the processing hole through the pressure preventing hole.

4. The laser processing apparatus according to claim 1, wherein,

the laser processing apparatus further includes:

and a vacuum pump connected to one side of the suction line and performing suction from the process hole through the suction line.

5. The laser processing apparatus according to claim 1, wherein,

the laser processing apparatus further includes:

and a laser irradiation unit which is arranged in a direction perpendicular to the upper surface of the placement unit and irradiates the upper surface of the placement unit with laser light.

6. The laser processing apparatus according to claim 1, wherein,

the processing holes are arranged in a plurality at the placement part,

a plurality of pressure preventing holes are provided for each of the plurality of processing holes.