CN219435165U - Rearview mirror module, rearview mirror, electronic equipment and vehicle-mounted terminal - Google Patents
Rearview mirror module, rearview mirror, electronic equipment and vehicle-mounted terminal Download PDFInfo
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- CN219435165U CN219435165U CN202320136277.1U CN202320136277U CN219435165U CN 219435165 U CN219435165 U CN 219435165U CN 202320136277 U CN202320136277 U CN 202320136277U CN 219435165 U CN219435165 U CN 219435165U
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Abstract
The application discloses rear-view mirror module, rear-view mirror, electronic equipment and vehicle-mounted terminal, wherein the rear-view mirror module includes: the upper glass module and the lower glass module are arranged, and the lower glass module comprises a lower glass substrate layer, a metal conducting layer and a lower ITO layer; the upper glass module comprises an upper glass substrate layer, an upper ITO layer, a metal conducting frame and an insulating layer; an epoxy resin layer is also arranged at the edge of the opposite surface of the upper glass module and the lower glass module; the epoxy resin layer, the lower ITO layer, the insulating layer and the upper ITO layer jointly enclose a hole area, and the hole area is an EC electrolyte layer. By arranging the insulating layer between the EC electrolyte layer and the metal conductive frame, the corrosion phenomenon of the EC electrolyte to the metal conductive frame is avoided.
Description
Technical Field
The application relates to the technical field of display, in particular to a rearview mirror module, a rearview mirror, electronic equipment and a vehicle-mounted terminal.
Background
Currently, a rearview mirror (for example, an automobile rearview mirror) in the market generally adopts a rearview mirror in an LCD (liquid crystal display) mode, and the rearview mirror in the mode has the problem of dazzling imaging light, so that a reflection film is usually required to be attached to solve the problem of dazzling imaging light, but the manufacturing cost is increased.
In order to solve the technical problem that the manufacturing cost is increased due to the fact that the reflective film is attached, the EC electrolyte is used, the color is deepened by utilizing the electrochromic characteristic of the EC electrolyte, and meanwhile the reflective film is not required to be attached when soft imaging is achieved. However, the EC electrolyte is corrosive, and when the EC electrolyte is electrified for a long time, there is a problem of corroding the metal conductive film, if the metal conductive film is corroded, the technical problem of imaging failure is caused.
The technical problems mentioned above have become the technical problems to be solved in the industry.
Disclosure of Invention
In order to solve the technical problem at least, an object of the present application is to provide a rearview mirror module, which avoids the occurrence of corrosion phenomena of an EC electrolyte to a metal conductive frame by arranging an insulating layer between the EC electrolyte layer and the metal conductive frame.
In order to achieve the above object, the present application provides a rearview mirror module, including:
an upper glass module and a lower glass module which are oppositely arranged; the lower glass module includes:
a lower glass substrate layer for use as a substrate of a lower glass module;
the metal conducting layer is arranged on one side of the lower glass substrate layer, which faces the glass module;
the lower ITO layer is arranged on the metal conducting layer and is back to one side of the glass substrate layer;
the upper glass module comprises:
an upper glass substrate layer for use as a substrate for an upper glass module;
the upper ITO layer is arranged on one side of the upper glass substrate layer facing the glass substrate layer;
the metal conductive frame is arranged on the upper ITO layer and faces one side of the lower glass substrate layer;
the insulating layer covers the metal conductive frame and closes the metal conductive frame together with the upper ITO layer;
the insulating layer protrudes from the upper ITO surface;
the upper glass module and the lower glass module are also included:
the epoxy resin layer is annularly arranged at the edge of the opposite surfaces of the upper glass module and the lower glass module;
the epoxy resin layer, the lower ITO layer, the insulating layer and the upper ITO layer jointly enclose a hole area, and the hole area is an EC electrolyte layer.
Further, the epoxy layer includes openings for pouring the EC electrolyte.
Further, the EC electrolyte layer connects the upper glass module and the lower glass module.
Further, the upper glass module covers the lower glass module, and the area of the upper glass substrate layer is larger than that of the lower glass substrate layer.
Further, the flexible printed circuit board also comprises an FPC, and the FPC is connected with the metal conductive frame.
Further, the width of the insulating layer is greater than the width of the metal conductive frame by 10-40 microns.
Further, the width of the insulating layer is greater than the width of the metal conductive frame by 20 micrometers.
To achieve the above object, the present application further provides a rearview mirror, including: the rearview mirror module is provided.
In order to achieve the above object, the present application further provides a vehicle-mounted terminal, including: the rearview mirror module is provided.
To achieve the above object, the present application further provides an electronic device, including: the rearview mirror module is provided.
The rearview mirror module of this application embodiment includes:
an upper glass module and a lower glass module which are oppositely arranged; the lower glass module includes:
a lower glass substrate layer for use as a substrate of a lower glass module;
the metal conducting layer is arranged on one side of the lower glass substrate layer, which faces the glass module;
the lower ITO layer is arranged on the metal conducting layer and is back to one side of the glass substrate layer;
the upper glass module comprises:
an upper glass substrate layer for use as a substrate for an upper glass module;
the upper ITO layer is arranged on one side of the upper glass substrate layer facing the glass substrate layer;
the metal conductive frame is arranged on the upper ITO layer and faces one side of the lower glass substrate layer;
the insulating layer covers the metal conductive frame and closes the metal conductive frame together with the upper ITO layer;
the insulating layer protrudes from the upper ITO surface;
the upper glass module and the lower glass module are also included:
the epoxy resin layer is annularly arranged at the edge of the opposite surfaces of the upper glass module and the lower glass module;
the epoxy resin layer, the lower ITO layer, the insulating layer and the upper ITO layer jointly enclose a hole area, and the hole area is an EC electrolyte layer. By arranging the insulating layer on the metal conductive frame, direct contact of the EC electrolyte in the EC electrolyte layer to the metal conductive frame is isolated, and further, the corrosion phenomenon of the EC electrolyte to the metal conductive frame is avoided. The long-term safe and stable operation of the rearview mirror module containing the EC electrolyte is realized, the service life is prolonged, and the market competitiveness is improved.
Drawings
For a clearer description of one or more embodiments of the present description or of the solutions of the prior art, reference will be made below to the accompanying drawings which are used in the description of one or more embodiments or of the prior art, it being apparent that the drawings in the description below are only some of the embodiments described in the description, from which, without inventive faculty, other drawings can also be obtained for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a rearview mirror module according to an embodiment of the disclosure.
Reference numerals illustrate:
101-a lower glass substrate layer; 102-a metal conductive layer; 103-a lower ITO layer; 104-an epoxy resin layer; 105-an insulating layer; 106-a metal conductive frame; 107-an upper ITO layer; 108-upper glass substrate layer; 109-EC electrolyte layer.
Detailed Description
Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present application are shown in the drawings, it is to be understood that the present application may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and examples of the present application are for illustrative purposes only and are not intended to limit the scope of the present application.
It should be understood that the various steps recited in the method embodiments of the present application may be performed in a different order and/or performed in parallel. Furthermore, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the present application is not limited in this respect.
The term "including" and variations thereof as used herein are intended to be open-ended, i.e., including, but not limited to. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments. Related definitions of other terms will be given in the description below.
It should be noted that references to "one" or "a plurality" in this application are intended to be illustrative rather than limiting, and those of ordinary skill in the art will appreciate that "one or more" is intended to be interpreted as "one or more" unless the context clearly indicates otherwise. "plurality" is understood to mean two or more.
The embodiment of the application provides a rearview mirror module, include:
an upper glass module and a lower glass module which are oppositely arranged; the lower glass module includes:
a lower glass substrate layer for use as a substrate of a lower glass module;
the metal conducting layer is arranged on one side of the lower glass substrate layer, which faces the glass module;
the lower ITO layer is arranged on the metal conducting layer and is back to one side of the glass substrate layer;
the upper glass module comprises:
an upper glass substrate layer for use as a substrate for an upper glass module;
the upper ITO layer is arranged on one side of the upper glass substrate layer facing the glass substrate layer;
the metal conductive frame is arranged on the upper ITO layer and faces one side of the lower glass substrate layer;
the insulating layer covers the metal conductive frame and closes the metal conductive frame together with the upper ITO layer;
the insulating layer protrudes from the upper ITO surface;
the upper glass module and the lower glass module are also included:
the epoxy resin layer is annularly arranged at the edge of the opposite surfaces of the upper glass module and the lower glass module;
the epoxy resin layer, the lower ITO layer, the insulating layer and the upper ITO layer jointly enclose a hole area, and the hole area is an EC electrolyte layer.
Example 1
Fig. 1 is a schematic structural diagram of a rearview mirror module according to an embodiment of the present application, and in detail, the rearview mirror module according to an embodiment of the present application is described below with reference to fig. 1.
The rearview mirror module of this application embodiment includes: an upper glass module and a lower glass module.
In some exemplary embodiments, the upper and lower glass modules are disposed opposite each other.
In some exemplary embodiments, the upper and lower glass modules are arranged in parallel.
In some exemplary embodiments, the lower glass module includes: a lower glass substrate layer 101.
In some exemplary embodiments, the lower glass substrate layer 101 is used as a substrate for a lower glass module.
In some exemplary embodiments, the lower glass module includes: a metal conductive layer 102.
In some exemplary embodiments, the metal conductive layer 102 is disposed on a side of the lower glass substrate layer 101 facing the upper glass module.
In some exemplary embodiments, the metal conductive layer 102 includes a metal conductive layer 102 formed by plating a metal conductive substance on the surface of the lower glass substrate layer 101 (i.e., plating a metal conductive substance on the side of the lower glass substrate layer 101 facing the upper glass module).
In some exemplary embodiments, the lower glass module includes: a lower ITO layer 103.
In some exemplary embodiments, the lower ITO layer 103 is disposed on the metal conductive layer 102 on a side facing away from the lower glass substrate layer 101 (i.e., the lower ITO layer 103 is disposed on the metal conductive layer 102 on a side facing the upper glass module).
In some exemplary embodiments, the upper glass module includes: and an upper glass substrate layer 108.
In some exemplary embodiments, the upper glass substrate layer 108 is used as a substrate for an upper glass module.
In some exemplary embodiments, the upper glass module includes: and an upper ITO layer 107.
In some exemplary embodiments, the upper ITO layer 107 is disposed on a side of the upper glass substrate layer 108 that faces the lower glass substrate layer 101.
In some exemplary embodiments, the upper glass module includes: a metal conductive frame 106.
In some exemplary embodiments, a metal conductive frame 106 is disposed on the upper ITO layer 107, facing one side of the lower glass substrate layer 101.
In some exemplary embodiments, the metal conductive frame 106 includes a metal conductive material plated on a surface of the upper ITO layer 107.
In some exemplary embodiments, the metal conductive frame 106 is annularly disposed at an edge of a single side of the upper ITO layer 107 (it is understood that the metal conductive frame 106 surrounds a circle of a side edge region disposed on a side of the upper glass substrate layer 108 facing the lower glass substrate layer 101).
In some exemplary embodiments, the upper glass module includes: an insulating layer 105.
In some exemplary embodiments, the insulating layer 105 covers the metal conductive frame 106.
In some exemplary embodiments, the insulating layer 105 and the upper ITO layer 107 together enclose the metal conductive frame 106 (it is understood that the insulating layer 105 surrounds the metal conductive frame 106 on three sides, and the insulating layer 105 and the upper ITO layer 107 form a closed space, thereby enclosing the metal conductive frame 106).
In some exemplary embodiments, the width of the insulating layer 105 is 10-40 microns greater than the width of the metal conductive frame 106.
In some exemplary embodiments, the width of the insulating layer 105 is 15 microns, 20 microns, 25 microns, 30 microns, 35 microns greater than the width of the metal conductive frame 106.
In some exemplary embodiments, the width of the insulating layer 105 is greater than the width of the metal conductive frame 106, and the size thereof may be adjusted according to actual needs.
In some exemplary embodiments, the metal conductive frame 106 protrudes from the upper ITO surface.
In some exemplary embodiments, the insulating layer 105 protrudes from the upper ITO surface.
In some exemplary embodiments, insulating layer 105 includes the use of OCA optical cement for insulation.
In some exemplary embodiments, OCA, (Optically Clear Adhesive).
In some exemplary embodiments, the upper glass module and the lower glass module further include: an epoxy layer 104.
In some exemplary embodiments, the epoxy layer 104 is annularly disposed at the edge of the facing surface of the upper and lower glass modules (it is understood that the epoxy layer 104 is disposed on the lower ITO layer 103 of the lower glass module facing the edge region of the upper glass module, or the epoxy layer 104 is disposed on the insulating layer 105 of the upper glass module facing the edge region of the lower glass module).
In some exemplary embodiments, the epoxy layer 104 includes openings (the size of the openings may be designed according to actual needs).
In some exemplary embodiments, the epoxy (Phenolic epoxy resin) layer 104 takes advantage of many of the unique advantages of epoxy, such as high insulating properties, high structural strength, and good sealing properties.
In some exemplary embodiments, the epoxy layer 104, together with the lower ITO layer 103, the insulating layer 105, and the upper ITO layer 107, encloses a hole region.
In some exemplary embodiments, the hole region is referred to as an EC electrolyte layer 109.
In some exemplary embodiments, the EC electrolyte layer 109 is used to perfuse the EC electrolyte.
In some exemplary embodiments, the EC electrolyte is injected through the openings of the epoxy layer 104, thereby forming an EC electrolyte layer 109.
In some exemplary embodiments, the opening is closed after the EC electrolyte infusion is completed.
In some exemplary embodiments, the EC electrolyte, i.e., ethylene carbonate.
In some exemplary embodiments, the upper ITO layer 107 is formed by plating ITO.
In some exemplary embodiments, the lower ITO layer 103 is formed by plating ITO.
In some exemplary embodiments, ITO (Indium Tin Oxide), which is a metal compound having good transparent conductive properties, has characteristics of forbidden bandwidth, high light transmittance in the visible spectrum, low resistivity, and the like.
In some exemplary embodiments, an FPC is also included, which is connected to the metal conductive frame 106 (the connection includes an electrical connection).
In some exemplary embodiments, the FPC (Flexible Printed Circuit, flexible circuit board) is a flexible printed circuit board made of polyimide or mylar as a base material, which has high reliability and is excellent.
In some exemplary embodiments, the FPC has characteristics of high wiring density, light weight, thin thickness, and good flexibility.
In some exemplary embodiments, the upper glass substrate layer 108 covers the lower glass substrate layer 101, and the area of the upper glass substrate layer 108 is greater than the area of the lower glass substrate layer 101 (i.e., it will be understood that from the perspective of the upper glass substrate layer 108, the lower glass substrate layer 101 is completely obscured by the upper glass substrate layer 108 due to the smaller size of the lower glass substrate layer 101 than the upper glass substrate layer 108).
Example 2
Embodiment 2 is a display device including the rearview mirror module of the above embodiment.
Example 3
Embodiment 3 is an electronic device including the rearview mirror module of the above embodiment.
In some exemplary embodiments, the electronic device may further optionally include a display device of the foregoing embodiments.
Example 4
Embodiment 4 is a rearview mirror comprising the rearview mirror module of the above embodiment.
In some exemplary embodiments, the rearview mirror may be a rearview mirror of a motor vehicle or a non-motor vehicle, or may be a rearview mirror of any desired device.
Example 5
Embodiment 5 is a vehicle-mounted terminal including the rearview mirror module of the above embodiment.
In some exemplary embodiments, the vehicle-mounted terminal includes the rearview mirror of the above-described embodiment.
In some exemplary embodiments, the vehicle-mounted terminal includes the display device of the above embodiment.
In some exemplary embodiments, the vehicle-mounted terminal includes the electronic device of the foregoing embodiment.
Although the embodiments of the present utility model are described above, the present utility model is not limited to the embodiments which are used for understanding the present utility model. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is to be determined by the appended claims.
Claims (10)
1. A rearview mirror module, comprising: an upper glass module and a lower glass module which are oppositely arranged; the lower glass module includes:
a lower glass substrate layer used as a substrate of the lower glass module;
the metal conducting layer is arranged on one side of the lower glass substrate layer facing the upper glass module;
the lower ITO layer is arranged on the metal conducting layer and is opposite to one side of the lower glass substrate layer;
the upper glass module comprises:
an upper glass substrate layer used as a substrate of the upper glass module;
the upper ITO layer is arranged on one side of the upper glass substrate layer facing the lower glass substrate layer;
the metal conductive frame is arranged on the upper ITO layer and faces one side of the lower glass substrate layer;
the insulating layer covers the metal conductive frame and closes the metal conductive frame together with the upper ITO layer;
the insulating layer protrudes out of the upper ITO surface;
the upper glass module and the lower glass module are arranged between the upper glass module and the lower glass module, and the lower glass module comprises:
the epoxy resin layer is annularly arranged at the edge of the opposite surfaces of the upper glass module and the lower glass module;
the epoxy resin layer, the lower ITO layer, the insulating layer and the upper ITO layer jointly enclose a hole area, and the hole area is an EC electrolyte layer.
2. The rearview mirror module of claim 1, wherein the epoxy layer includes an opening for pouring EC electrolyte.
3. The rearview mirror module of claim 2, wherein the EC electrolyte layer connects the upper glass module and the lower glass module.
4. A rearview mirror module as claimed in claim 3, wherein the upper glass module covers the lower glass module, the upper glass substrate layer having an area greater than the area of the lower glass substrate layer.
5. The rearview mirror module of claim 4, further comprising an FPC, the FPC being connected to the metal conductive frame.
6. The rearview mirror module of claim 5, wherein the width of the insulating layer is greater than the width of the metallic conductive frame by between 10 and 40 microns.
7. The rearview mirror module of claim 6, wherein the width of the insulating layer is greater than the width of the metal conductive frame comprises 20 microns.
8. A rear view mirror comprising a rear view mirror module according to any one of claims 1-6.
9. A vehicle terminal comprising a mirror module according to any one of claims 1-6, or a mirror according to claim 8.
10. An electronic device, characterized in that it comprises a rear view mirror module according to any one of claims 1-6, or a rear view mirror according to claim 8, or an in-vehicle terminal according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320136277.1U CN219435165U (en) | 2023-01-28 | 2023-01-28 | Rearview mirror module, rearview mirror, electronic equipment and vehicle-mounted terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320136277.1U CN219435165U (en) | 2023-01-28 | 2023-01-28 | Rearview mirror module, rearview mirror, electronic equipment and vehicle-mounted terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219435165U true CN219435165U (en) | 2023-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320136277.1U Active CN219435165U (en) | 2023-01-28 | 2023-01-28 | Rearview mirror module, rearview mirror, electronic equipment and vehicle-mounted terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219435165U (en) |
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2023
- 2023-01-28 CN CN202320136277.1U patent/CN219435165U/en active Active
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