CN219320485U - Transmitting module and electronic equipment - Google Patents

Abstract

The utility model provides a transmitting module and electronic equipment, which can reduce the module cost and meet the development trend of high performance and low cost in industry under the condition of high heat dissipation performance and high precision. The emission module comprises a circuit board assembly, a light source chip, a heat dissipation base and a beam shaping element. The circuit board assembly comprises an electronic circuit board and a semiconductor circuit board, wherein the electronic circuit board comprises a circuit board body with a through hole and an electronic component which is surface-mounted on the circuit board body, and the semiconductor circuit board is surface-mounted on the circuit board body so as to cover the through hole. The light source chip is surface-mounted on the semiconductor circuit board so as to be positioned in the through hole. The heat dissipation base comprises a heat conduction plate with a groove, and the semiconductor circuit board is arranged in the groove of the heat conduction plate in a heat-conducting mode. The beam shaping element is disposed on the light emitting side of the light source chip.

Description

Transmitting module and electronic equipment

Technical Field

The utility model relates to the technical field of 3D, in particular to a transmitting module and electronic equipment.

Background

With the rapid development of 3D technology, more and more 3D cameras are embedded into electronic devices such as AR/VR, sweeping robots, service robots, and human verification, for implementing various functions such as mapping, obstacle avoidance, human body recognition, object recognition, and human-computer interaction. With the benefit of the continued perfection of 3D technology, in Time of flight (Time of flight), TOF) ranging and structured light ranging are becoming the dominant schemes for 3D vision. However, no matter TOF ranging or structured light ranging is adopted, an emission module (such as a laser emission module) with an active modulation light source needs to be assembled in the active ranging module, but the performance of the existing laser emission module can be degraded along with the increase of temperature, which is specifically reflected in the reduction of photoelectric conversion efficiency.

Aiming at the problem, one method commonly used in the industry at present is to fix a light source emission chip on a conventional circuit board by using adhesive media such as glue and the like, and conduct heat in a large-area copper exposure mode, but the scheme has lower heat conduction efficiency, is only suitable for the scene of low emission power or larger heat dissipation space of the whole machine, and is not beneficial to the development trend of high power and miniaturization; the other way is to replace the conventional circuit board with a novel semiconductor circuit board such as an aluminum substrate or a ceramic substrate for heat conduction so as to meet the miniaturization requirement, but the novel semiconductor circuit board adopted by the scheme is insufficient in signal integrity control on high-speed electric transmission signals (the speed is greater than 50 MHz) and is not suitable for scenes with higher precision requirements. In addition, in order to solve the problems of heat dissipation and precision, even if a whole ceramic substrate is used as a substrate or is reinforced for electric signal and heat conduction in some schemes, a large size and a large number of circuit board laminates are often needed, so that the cost is high, and the large-scale popularization is not facilitated.

Disclosure of Invention

One advantage of the present utility model is to provide a transmitting module and an electronic device, which can reduce the module cost and meet the development trend of high performance and low cost in industry under the condition of high heat dissipation performance and high precision.

Another advantage of the present utility model is to provide an emission module and an electronic device, where in one embodiment of the present utility model, the emission module can simultaneously combine the advantages of mature process and good signal integrity of a conventional circuit board with the advantages of high thermal conductivity and good heat dissipation performance of a semiconductor circuit board, so as to meet the use requirements of high precision and high power while having good heat dissipation performance.

Another advantage of the present utility model is to provide a transmitting module and an electronic device, where in one embodiment of the present utility model, the transmitting module can reduce the size of a semiconductor circuit board by means of element separation, and the number of electrical signals on the semiconductor circuit board is reduced to one or two, which is helpful to reduce the overall BOM cost of the module, and is convenient for large-area popularization and use.

The utility model further provides the transmitting module and the electronic equipment, wherein in one embodiment of the utility model, the transmitting module can integrate two poles of the light source chip on the same circuit board, the process manufacturing difficulty is low, the overall manufacturing yield of the module is higher, and the large-area popularization is facilitated.

Another advantage of the present utility model is to provide an emission module and an electronic device, in which, in one embodiment of the present utility model, the emission module can embed a light source chip into a through hole of an electronic circuit board, so as to reduce the overall size of the module, and meet the miniaturization development trend of the device.

Another advantage of the present utility model is to provide a transmitting module and an electronic device, wherein in one embodiment of the present utility model, the transmitting module can hang a semiconductor circuit board in a heat dissipation base, so as to reduce the size of the semiconductor circuit board, and thus the cost is greatly reduced.

Another advantage of the present utility model is to provide an emission module and an electronic device, where in one embodiment of the present utility model, the emission module can be provided with a grid structure in a heat dissipation space, so as to increase a contact area with air, and facilitate further improvement of heat dissipation performance of the module.

Another advantage of the present utility model is to provide a transmitting module and an electronic device in which a complex system is not required in the present utility model in order to achieve the above advantages. The utility model thus successfully and effectively provides a solution that not only provides a simple transmitting module and electronic device, but also increases the practicality and reliability of the transmitting module and electronic device.

To achieve at least one of the above or other advantages and objects of the utility model, there is provided a transmitting module including:

the circuit board assembly comprises an electronic circuit board and a semiconductor circuit board, wherein the electronic circuit board comprises a circuit board body with a through hole and an electronic component which is surface-mounted on the circuit board body, and the semiconductor circuit board is surface-mounted on the circuit board body so as to cover the through hole;

a light source chip surface-mounted to the semiconductor circuit board so as to be located in the through hole, and an anode and/or a cathode of the light source chip is electrically connected to the electronic circuit board through the semiconductor circuit board;

a heat dissipation base including a heat conductive plate having a recess, the semiconductor circuit board being heat-transmissibly disposed within the recess of the heat conductive plate; and

and a beam shaping element provided on a light emitting side of the light source chip for shaping a light beam emitted via the light source chip.

According to one embodiment of the present application, the electronic circuit board is one of a flexible circuit board, a printed circuit board and a soft and hard combined board; the semiconductor circuit board is one of an aluminum substrate, a ceramic substrate and a copper substrate.

According to one embodiment of the application, the electronic component is attached to the front surface of the circuit board body in an SMT mode, and the semiconductor circuit board is attached to the back surface of the circuit board body in an SMT mode.

According to one embodiment of the present application, the positive or negative electrode chip of the light source chip is bonded to the front surface of the semiconductor wiring board, and the negative or positive electrode gold wire of the light source chip is bonded to the semiconductor wiring board or the circuit within the wiring board.

According to one embodiment of the application, the recess of the heat dissipation base is recessed from the front surface of the heat conduction plate to support the electronic circuit board through the heat conduction plate.

According to one embodiment of the application, the depth of the groove is greater than the thickness of the semiconductor circuit board, and the semiconductor circuit board is connected to the heat conducting plate in a heat-conducting manner by a heat conducting medium.

According to one embodiment of the present application, the heat dissipation base further includes at least one support arm protruding from the back surface of the heat conduction plate to form a heat dissipation space on the back side of the semiconductor wiring board.

According to one embodiment of the present application, the heat dissipation base further includes a heat dissipation grill extending convexly from the back surface of the heat conduction plate to protrude into the heat dissipation space.

According to one embodiment of the application, the grooves penetrate through the front and back surfaces of the heat conducting plate, and the semiconductor circuit board is connected with the heat dissipating grid in a heat-conducting manner through the heat conducting medium.

According to another aspect of the present application, an embodiment of the present application further provides an electronic device, including:

the emission module of any one of the above, configured to actively emit a light beam to a target scene; and

and the receiving module is correspondingly arranged with the transmitting module and is used for receiving the light beam reflected by the target scene so as to acquire depth information.

According to one embodiment of the application, the receiving module comprises a printed circuit board, a receiving sensor attached to the printed circuit board, an optical lens seat fixedly attached to the printed circuit board, and an optical lens assembled to the optical lens seat; the radiating base of the transmitting module is fixedly arranged on the printed circuit board, and the electronic circuit board of the transmitting module is electrically connected to the printed circuit board.

Drawings

FIG. 1 is a schematic perspective view of an electronic device according to one embodiment of the present application;

fig. 2 shows an exploded schematic view of an electronic device according to the above-described embodiment of the present application;

fig. 3 shows a schematic cross-sectional view of an electronic device according to the above-described embodiments of the present application;

fig. 4 shows a first example of a transmitting module in an electronic device according to the above-described embodiment of the present application;

fig. 5 shows a circuit schematic of a semiconductor circuit board in a transmitting module according to the above first example of the present application;

fig. 6 shows a second example of a transmitting module in an electronic device according to the above-described embodiment of the present application;

FIG. 7 illustrates a flow diagram of a method of manufacturing an emission module according to one embodiment of the present application;

fig. 8 is a schematic flow chart of step S200 in the method for manufacturing the emission module according to the above embodiment of the present application.

Description of main reference numerals: 1. a transmitting module; 10. a circuit board assembly; 11. an electronic circuit board; 1101. a through hole; 1102. a via hole; 111. a circuit board body; 112. an electronic component; 12. a semiconductor wiring board; 120. SMT welding spots; 20. a light source chip; 21. a positive electrode; 22. a negative electrode; 30. a heat dissipation base; 301. a groove; 302. a heat dissipation space; 31. a heat conductive plate; 32. a heat-conducting medium; 33. a support arm; 34. a heat-dissipating grille; 40. a beam shaping element; 50. a shield; 6. a receiving module; 61. a printed wiring board; 62. a receiving sensor; 63. an optical lens base; 64. an optical lens; 65. an optical filter.

The foregoing general description of the utility model will be described in further detail with reference to the drawings and detailed description.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the utility model. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the utility model defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the utility model.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present utility model.

In the present utility model, the terms "a" and "an" in the claims and specification should be understood as "one or more", i.e. in one embodiment the number of one element may be one, while in another embodiment the number of the element may be plural. The terms "a" and "an" are not to be construed as unique or singular, and the term "the" and "the" are not to be construed as limiting the amount of the element unless the amount of the element is specifically indicated as being only one in the disclosure of the present utility model.

In the description of the present utility model, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through a medium. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Considering that in order to avoid the influence of temperature rise on the performance of the laser emission module, there are two common methods in the industry: one is to leak copper on the back of the conventional circuit board in a large area; the other is to use a novel circuit board with better heat dissipation performance to conduct auxiliary heat dissipation. However, in any case, the method cannot fully meet the development trend of high performance, low cost and miniaturization in the industry. Therefore, the application provides a transmitting module and electronic equipment, which can reduce the module cost under the condition of high heat dissipation performance and high precision, and meet the development trend of high performance and low cost in industry.

Specifically, referring to fig. 1 to 3 of the drawings in the specification of the present application, an electronic device according to an embodiment of the present application may include a transmitting module 1 for actively transmitting a light beam to a target scene and a receiving module 6 disposed corresponding to the transmitting module 1 for receiving the light beam reflected back through the target scene to collect depth information, thereby 3D vision functions. It is to be understood that the electronic device of the present application may be implemented as, but not limited to, a 3D camera such as a TOF camera or a structured light camera, and may also be implemented as other electronic devices configured with a 3D camera, such as an AR/VR, a sweeping robot, a service robot, or a terminal device such as a personal verification.

More specifically, as shown in fig. 2 and 3, the emission module 1 may include a circuit board assembly 10, a light source chip 20, a heat dissipation base 30, and a beam shaping element 40. The circuit board assembly 10 includes an electronic circuit board 11 and a semiconductor circuit board 12, the electronic circuit board 11 includes a circuit board body 111 having a through hole 1101 and an electronic component 112 surface-mounted to the circuit board body 111, and the semiconductor circuit board 12 is surface-mounted to the circuit board body 111 to cover the through hole 1101. The light source chip 20 is surface-mounted to the semiconductor wiring board 12 so as to be located in the through hole 1101, and the positive and/or negative electrodes of the light source chip 20 are electrically connected to the electronic wiring board 11 through the semiconductor wiring board 12. The heat dissipation base 30 includes a heat conduction plate 31 having a groove 301, and the semiconductor wiring board 12 is heat-transmissibly disposed in the groove 301 of the heat conduction plate 31. The beam shaping element 40 is provided at the light emitting side of the light source chip 20 for shaping the light beam emitted via the light source chip 20 to better illuminate the target scene.

Note that the electronic circuit board 11 mentioned in the present application refers to a conventional circuit board on which electronic components 112 such as resistors, capacitors, or driving chips are mounted, such as a flexible circuit board (FPC), a Printed Circuit Board (PCB), or a hard-flex circuit board (RFPC); meanwhile, the semiconductor wiring board 12 referred to herein refers to an irregular wiring board having a high heat conduction efficiency, such as an aluminum substrate, a ceramic substrate, or a copper substrate. In addition, the light source chip 20 mentioned in the present application may be implemented as, but not limited to, a Vertical-Cavity Surface-Emitting Laser (VCSEL) for short.

Thus, in the transmitting module 1 of the present application, since the various electronic components 112 and the semiconductor circuit board 12 are both surface-mounted on the circuit board body 111 of the electronic circuit board 11, and the light source chip 20 is surface-mounted on the semiconductor circuit board 12, the electrical signal data on the semiconductor circuit board 12 is sharply reduced to one or two types (positive electrical signal and/or negative electrical signal), so that the semiconductor circuit board 12 can meet the electrical signal transmission requirement only by using a single-layer substrate, and compared with the prior art which may require two or more layers of substrates, the cost of the semiconductor circuit board 12 of the present application is reduced. Meanwhile, the semiconductor circuit board 12 is arranged in the groove 301 of the heat conducting plate 31 in a heat-transferring manner, so that the size of the semiconductor circuit board 12 is reduced, the cost of the semiconductor circuit board 12 is further reduced, and the problems that the cost is high due to the use of the semiconductor circuit board with a large size and a multi-layer substrate in the prior art and the large-scale popularization is not facilitated are solved. It is understood that the surface mount mentioned in this application refers to assembly by means of surface mount technology (english Surface Mounted Technology, abbreviated as SMT) to achieve a fixed and electrical connection between the two.

In addition, the emission module 1 of the present application not only electrically connects the light source chip 20 and the electronic circuit board 11 through the conductive property of the semiconductor circuit board 12 to drive or control the light source chip 20 to perform light emitting operation through the electronic circuit board 11, but also thermally connects the light source chip 20 and the heat dissipation base 30 through the heat conduction property of the semiconductor circuit board 12 to dissipate heat generated by the light source chip 20 through the heat dissipation base 30; in other words, the transmitting module 1 of the present application can simultaneously consider the advantages of mature process and good signal integrity of the electronic circuit board 11 (conventional circuit board) and the advantages of high thermal conductivity and good heat dissipation of the semiconductor circuit board 12 (non-conventional circuit board), so as to meet the use requirements of high precision and high power while having good heat dissipation.

As shown in fig. 1 to 3, a TOF module is taken as an example of the electronic device: the TOF module includes the above-mentioned transmitting module 1 and receiving module 6, wherein the receiving module 6 may include a printed circuit board 61, a receiving sensor 62 mounted on the printed circuit board 61, an optical lens 63 fixedly mounted on the printed circuit board 61, and an optical lens 64 assembled on the optical lens 63, so that a light beam reflected by a target scene is modulated by the optical lens 64 first, and then received by the receiving sensor 62 to obtain depth information. The heat dissipation base 30 of the transmitting module 1 is fixed on the printed circuit board 61, and the electronic circuit board 11 of the transmitting module 1 is electrically connected to the printed circuit board 61.

Optionally, as shown in fig. 2 and 3, the receiving module 6 may further include a filter 65 assembled to the optical lens holder 63, and the filter 65 is located between the optical lens 64 and the receiving sensor 62, so that the light beam passing through the optical lens 64 is filtered by the filter 65 and then received by the receiving sensor 62.

Alternatively, the electronic circuit board 11 and the semiconductor circuit board 12 in the emission module 1 are respectively implemented as a soft and hard combined circuit board and a ceramic substrate.

Optionally, in the first example of the present application, as shown in fig. 4 and 5, the electronic component 112 is attached to the front surface of the circuit board 111 by SMT, so as to electrically connect the electronic component 112 with the circuit in the circuit board 111; the semiconductor circuit board 12 is attached to the back surface of the circuit board body 111 by SMT to electrically connect the circuits in the semiconductor circuit board 12 with the circuits in the circuit board body 111. Specifically, the positive electrode 21 of the light source chip 20 is bonded to the front surface of the semiconductor circuit board 12 to electrically connect the positive electrode 21 of the light source chip 20 with the circuit in the semiconductor circuit board 12; and the negative electrode 22 of the light source chip 20 is gold wire-bonded to the circuit in the semiconductor wiring board 12, so that both the positive electrode 21 and the negative electrode 22 of the light source chip 20 are indirectly electrically connected to the circuit in the wiring board body 111 of the electronic wiring board 11 through the circuit in the semiconductor wiring board 12. Thus, the positive and negative poles of the light source chip 20 are integrated on the same circuit board (namely the semiconductor circuit board 12), so that the process manufacturing difficulty is reduced, the overall manufacturing yield of the module is higher, and the large-area popularization is facilitated.

It is understood that the chip bonding referred to in this application refers to electrical connection through the D/B (Die Bonding) process; the gold wire bonding mentioned in the application refers to electrical connection through a W/B (Wire Bonding) process; in addition, in other examples of the present application, the negative electrode 22 of the light source chip 20 may be die-bonded to the front surface of the semiconductor wiring board 12 to electrically connect the negative electrode 22 of the light source chip 20 with the circuits within the semiconductor wiring board 12; and the positive electrode 21 of the light source chip 20 is gold wire-bonded to the circuit in the semiconductor wiring board 12, so that both the positive electrode 21 and the negative electrode 22 of the light source chip 20 are indirectly electrically connected to the circuit in the wiring board body 111 of the electronic wiring board 11 through the circuit in the semiconductor wiring board 12.

It should be noted that, in the second example of the present application, as shown in fig. 6, the positive electrode 21 of the light source chip 20 is still chip-bonded to the front surface of the semiconductor circuit board 12, so as to electrically connect the positive electrode 21 of the light source chip 20 with the circuit in the semiconductor circuit board 12; the negative electrode 22 of the light source chip 20 is a circuit with gold wire bonded in the circuit board 111, so that the positive electrode 21 of the light source chip 20 is indirectly and electrically connected to the circuit in the circuit board 111 of the electronic circuit board 11 through the circuit in the semiconductor circuit board 12, and the negative electrode 22 of the light source chip 20 is directly and electrically connected to the circuit in the circuit board 111 of the electronic circuit board 11 through gold wire. Thus, the front surface of the semiconductor circuit board 12 does not need to be additionally provided with a gold wire pad for electrically connecting with the negative electrode 22 of the light source chip 20, so that the size of the through hole 1101 on the circuit board body 111 is conveniently reduced, further the size of the semiconductor circuit board 12 is further reduced, further cost reduction is facilitated, and the module volume is reduced.

It can be appreciated that, compared to the above-mentioned first example in which the semiconductor circuit board 12 needs to transmit two kinds of electrical signals (i.e., the positive electrical signal and the negative electrical signal), the semiconductor circuit board 12 in the second example of the present application needs to transmit only one kind of electrical signal (i.e., the positive electrical signal), which is helpful for further simplifying the circuit structure of the semiconductor circuit board 12, so that the BOM cost of the whole module is lower, and is beneficial for large-area popularization and use. In addition, the minimum size of the through hole 1101 of the present application is the smallest size that allows the light beam emitted from the light source chip 20 to pass therethrough, which is not described herein.

Optionally, as shown in fig. 4 to 6, the front surface of the semiconductor circuit board 12 is provided with SMT pads 120; the circuit board body 111 of the electronic circuit board 11 is provided with a via 1102 (metallized hole) so that the SMT pads 120 contact the via 1102 when the semiconductor circuit board 12 is attached to the back surface of the circuit board body 111 for soldering to achieve electrical connection. It will be appreciated that the back side of the circuit board body 111 and the front side of the semiconductor circuit board 12 of the present application may be uniformly arranged with a certain size and number of BGA ball arrays so that the circuit board body 111 and the semiconductor circuit board 12 are electrically connected by the ball arrays.

According to the above embodiments of the present application, the heat conductive plate 31 of the heat dissipation base 30 may be, but is not limited to, made of a high heat conductive material such as aluminum or alloy, so that the heat dissipation base 30 has good heat dissipation performance.

Alternatively, as shown in fig. 2 and 3, the groove 301 of the heat dissipation base 30 is recessed from the front surface of the heat conduction plate 31, such that when the semiconductor circuit board 12 is placed in the groove 301, the front surface of the heat conduction plate 31 is adapted to be attached to the back surface of the circuit board body 111 of the electronic circuit board 11 to support the electronic circuit board 11 through the heat conduction plate 31.

Alternatively, as shown in fig. 3, the depth of the groove 301 on the heat conductive plate 31 is slightly larger than the thickness of the semiconductor wiring board 12, and the semiconductor wiring board 12 may be heat-transmissibly connected to the heat conductive plate 31 through a heat conductive medium 32 such as heat conductive slurry or heat conductive glue, so that the semiconductor wiring board 12 can efficiently transfer heat with the heat conductive plate 31 while being embedded in the groove 301 to increase a heat dissipation area by the heat conductive plate 31, improving heat dissipation efficiency. It will be appreciated that the number of components, the heat-conducting medium 32 referred to in the present application is not electrically conductive; in addition, when the ceramic substrate is fixed in the groove 301 of the heat conductive plate 31 by the heat conductive medium 32, the front surface of the ceramic substrate is preferably flush or slightly lower than the front surface of the heat conductive plate 31.

Optionally, as shown in fig. 2 and 3, the heat dissipation base 30 further includes at least one support arm 33 protruding from the back surface of the heat conduction plate 31 to form a heat dissipation space 302 at the back side of the semiconductor circuit board 12. In other words, the heat conducting plate 31 is lifted up under the supporting action of the supporting arm 33 to form a heat dissipation space 302 between the heat conducting plate 31 and the printed circuit board 61, so that air flows in the heat dissipation space 302 to enhance the heat exchange efficiency of the semiconductor circuit board 12, and further enhance the heat dissipation efficiency. It will be appreciated that the support arm 33 may be secured to the printed wiring board 61 by glue.

Alternatively, the supporting arm 33 is integrally connected to the heat-conducting plate 31, that is, the supporting arm 33 and the heat-conducting plate 31 may be made of the same high heat-conducting material, so that the supporting arm 33 can radiate the heat conducted by the heat-conducting plate 31 into a space far away from the light source chip 20, which is helpful for increasing the heat radiation area and improving the heat radiation efficiency.

Optionally, as shown in fig. 1 and 2, the heat dissipation base 30 further includes a heat dissipation grill 34, and the heat dissipation grill 34 extends convexly from the back surface of the heat conduction plate 31 to increase the heat dissipation area and enhance the heat dissipation effect.

Preferably, the lateral dimension of the heat dissipating grille 34 is slightly larger than the lateral dimension of the printed circuit board 61, so as to limit the printed circuit board 61 by using the heat dissipating grille 34.

It should be noted that, although the heat dissipating grill 34 may be located outside the support arm 33 in the embodiment of the present application, the heat dissipating grill 34 may be located inside the support arm 33 in other examples of the present application. For example, in the above-described first and second examples of the present application, as shown in fig. 4 and 6, the heat dissipation grill 34 is located at the inner side of the support arm 33, and the heat dissipation grill 34 is convexly extended from the back surface of the heat conduction plate 31 to protrude into the heat dissipation space 302, further increasing the heat dissipation area of the heat dissipation base 30, and further improving the heat dissipation efficiency.

Preferably, as shown in fig. 4 and 6, the grooves 301 penetrate through the front and back surfaces of the heat conductive plate 31, and the semiconductor wiring board 12 is heat-conductively connected to the heat dissipating grill 34 through the heat conductive medium 32. Thus, the heat generated by the light source chip 20 during operation can sequentially pass through the semiconductor circuit board 12 with high heat conduction efficiency, the heat conducting medium 32 and the heat dissipating grille 34, so that the heat is dissipated to the air or the whole machine end through the heat dissipating grille 34, the heat accumulation of the module end is reduced, and the module performance is enhanced.

It should be noted that, in order to be able to project a light beam satisfying the requirements, the beam shaping element 40 of the emission module 1 of the present application may be implemented as, but not limited to, an optical beam expanding element such as a Diffuser (Diffuser), a light homogenizing sheet or a Diffractive Optical Element (DOE).

Optionally, as shown in fig. 1 to 6, the emission module 1 may further include a shielding case 50 disposed on the electronic circuit board 11 to cover the electronic component 112 and the light source chip 20 through the shielding case 50. It will be appreciated that the shield 50 is fabricated from a metallic material to shield electromagnetic interference. In addition, the size of the shielding case 50 is determined by completely covering all the electronic components 112 on the electronic circuit board 11.

Alternatively, the shield can 50 may be mounted on the front surface of the circuit board body 111 of the electronic circuit board 11 by, but not limited to, SMT or glue bonding.

Alternatively, the beam shaping element 40 may be, but is not limited to, fixed within the shielding case 50 by glue to hold the beam shaping element 40 in the emission light path of the light source chip 20 by the shielding case 50.

In summary, conventional TOF module designs typically mount the VCSEL and electronic driver on the same circuit board, but because the designs often employ conventional FR4 substrate circuit boards, the heat transfer efficiency is low, and the designs are often only suitable for scenes with low transmit power or large module space. In order to solve the problem, although the prior art proposes to use a substrate with high heat conductivity such as a ceramic substrate to replace the conventional circuit board for auxiliary heat dissipation, the manufacturing cost and the electrical integrity transmission performance of the circuit board are different from those of the conventional circuit board due to the fact that the manufacturing process of the circuit board is still not mature.

To solve this problem, the present application proposes a new solution: the VCSEL with higher thermal power consumption is independently arranged on a ceramic substrate, devices with higher requirements on signal transmission, such as an electronic driver, are independently arranged on a soft and hard combined circuit board, a through hole is reserved in the middle of the soft and hard combined circuit board, the size of the device is in order to allow the VCSEL to be attached, the device and the circuit board are connected through SMT welding spots, gold wires and the like, the advantages of the circuit boards with two different materials are fully combined in the mode, and the device meets the development trend of high power and miniaturization of modules. In particular, ceramic substrate cost is higher embody in the two aspects that the cost is higher and the size is big with high costs are multi-layer structure, this application is in order to further reduce high-power TOF module cost, preferably proposes the mode of ceramic substrate embedded installation and two kinds of different material circuit boards laminating installation: on one hand, the ceramic substrate is embedded, and the heat dissipation base is used for assisting in heat dissipation, so that the transverse size of the ceramic substrate can be further reduced, and the BOM cost of the module is reduced; on the other hand, the ceramic substrate is only provided with one to two electric signals by using the bonding mode of the two circuit boards, and the double-layer or even single-layer circuit board meets the use requirement, so that the cost disadvantage caused by the increase of the stacking structure can be further eliminated.

It should be noted that fig. 7 illustrates a method for manufacturing an emission module according to an embodiment of the present application, which may include the steps of:

s100: a semiconductor circuit board is attached to a circuit board body of the electronic circuit board on the surface so as to cover the through hole of the circuit board body through the semiconductor circuit board;

s200: a light source chip is attached to the semiconductor circuit board on the surface so that the light source chip is positioned in the through hole, and the anode and/or the cathode of the light source chip is electrically connected to the electronic circuit board through the semiconductor circuit board;

s300: the semiconductor circuit board is arranged in the groove of the heat conducting plate of the heat dissipation base in a heat-conducting manner; and

s400: a beam shaping element is disposed on the light emitting side of the light source chip.

It should be noted that, in the method for manufacturing the transmitting module of the present application, the steps S100, S200, S300 and S400 are not limited to the sequence of each step, and a person skilled in the art can adjust the sequence of each step according to the actual process requirement, which is not repeated in the present application.

Optionally, in one embodiment of the present application, as shown in fig. 8, step S200 of the manufacturing method of the emission module may include the steps of:

s210: bonding a positive electrode or a negative electrode chip of the light source chip to a circuit in the semiconductor circuit board; and

s220: and bonding the negative electrode or positive electrode gold wire of the light source chip to the semiconductor circuit board or a circuit in the circuit board body.

Optionally, in an embodiment of the present application, step S300 of the manufacturing method of the emission module may include the steps of:

the semiconductor circuit board is connected to the heat conduction plate and/or a heat radiation grille extending convexly from the back surface of the heat conduction plate in a heat-conducting manner by a heat conduction medium.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (11)

1. The transmission module, its characterized in that includes:

the circuit board assembly comprises an electronic circuit board and a semiconductor circuit board, wherein the electronic circuit board comprises a circuit board body with a through hole and an electronic component which is surface-mounted on the circuit board body, and the semiconductor circuit board is surface-mounted on the circuit board body so as to cover the through hole;

a light source chip surface-mounted to the semiconductor circuit board so as to be located in the through hole, and an anode and/or a cathode of the light source chip is electrically connected to the electronic circuit board through the semiconductor circuit board;

a heat dissipation base including a heat conductive plate having a recess, the semiconductor circuit board being heat-transmissibly disposed within the recess of the heat conductive plate; and

and a beam shaping element provided on a light emitting side of the light source chip for shaping a light beam emitted via the light source chip.

2. The transmitting module of claim 1, wherein the electronic circuit board is one of a flexible circuit board, a printed circuit board, and a rigid-flex board; the semiconductor circuit board is one of an aluminum substrate, a ceramic substrate and a copper substrate.

3. The transmitting module of claim 1, wherein the electronic component is attached to the front surface of the circuit board body in an SMT manner, and the semiconductor circuit board is attached to the back surface of the circuit board body in an SMT manner.

4. The emission module according to claim 3, wherein a positive electrode or a negative electrode chip of the light source chip is bonded to a front surface of the semiconductor wiring board, and a negative electrode or a positive electrode gold wire of the light source chip is bonded to the semiconductor wiring board or a circuit within the wiring board.

5. The transmitting module of any one of claims 1 to 4, wherein the recess of the heat dissipation base is recessed from a front surface of the heat conduction plate to support the electronic circuit board through the heat conduction plate.

6. The emission module of claim 5, wherein the depth of the groove is greater than the thickness of the semiconductor circuit board, and the semiconductor circuit board is thermally conductively connected to the thermally conductive plate by a thermally conductive medium.

7. The emitter module of claim 6, wherein the heat dissipation base further comprises at least one support arm protruding from a back surface of the heat conductive plate to form a heat dissipation space on a back side of the semiconductor circuit board.

8. The emitter module of claim 7, wherein the heat sink base further comprises a heat sink grill extending convexly from a back surface of the heat conductive plate to protrude into the heat sink space.

9. The emitter module of claim 8, wherein the grooves penetrate through the front and back surfaces of the heat conductive plate, and the semiconductor circuit board is heat-transmissibly connected to the heat dissipation grill through the heat conductive medium.

10. An electronic device, comprising:

the emission module of any one of claims 1 to 9 for actively emitting a light beam to a target scene; and

and the receiving module is correspondingly arranged with the transmitting module and is used for receiving the light beam reflected by the target scene so as to acquire depth information.

11. The electronic device of claim 10, wherein the receiving module comprises a printed wiring board, a receiving sensor mounted to the printed wiring board, an optical lens mount mounted to the printed wiring board, and an optical lens assembled to the optical lens mount; the radiating base of the transmitting module is fixedly arranged on the printed circuit board, and the electronic circuit board of the transmitting module is electrically connected to the printed circuit board.

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