CN219304829U - Electronic equipment - Google Patents

Abstract

The disclosure relates to an electronic device, comprising a processor, a SIM card module and a power supply module; the processor transmits user data through the power supply module and the SIM card module; the power supply module is used for carrying out level conversion on the instruction data sent by the processor and then sending the instruction data to the SIM card module; the power supply module is also used for carrying out level inverse conversion on the user data sent by the SIM card module and then sending the user data to the processor; the instruction data and the user data are different in level. In this embodiment, the power module converts the data of the processor and the SIM card module, so that the converted data is matched with the level required by the data receiver, and therefore, the level conversion module is not required to be arranged between the processor and the SIM card module, hardware data can be reduced, and the cost of the electronic device is reduced.

Description

Electronic equipment

Technical Field

The disclosure relates to the field of control technologies, and in particular, to an electronic device.

Background

The electronic equipment has communication requirement, and is internally provided with a SIM card module for storing user information. The processor within the electronic device may communicate with the SIM card module to read the user information within the SIM card. In practical applications, as the Level of the output signal of the processor is lower, the processor and the SIM card module need a Level Shift circuit (Level Shift) to Shift the Level, so as to meet the Level requirements of the processor and the SIM card module. However, the addition of the level shift circuit in the related art increases the cost of the electronic device.

Disclosure of Invention

The present disclosure provides an electronic device to solve the deficiencies of the related art.

According to a first aspect of embodiments of the present disclosure, there is provided an electronic device including a processor, a SIM card module, and a power module; the processor transmits user data through the power supply module and the SIM card module;

the power supply module is used for carrying out level conversion on the instruction data sent by the processor and then sending the instruction data to the SIM card module;

the power supply module is also used for carrying out level inverse conversion on the user data sent by the SIM card module and then sending the user data to the processor; the instruction data and the user data are different in level.

Optionally, the power module comprises an input-output interface unit; and the processor transmits data with the SIM card module through the input/output interface.

Optionally, the input-output interface unit includes a first data input-output interface and a second data input-output interface; the first data input/output interface is electrically connected with the processor, and the second data input/output interface is electrically connected with the SIM card module;

the power supply module is used for acquiring instruction data sent by the processor through the first data input/output interface, performing level conversion on the instruction data and then sending the instruction data to the SIM card module through the second data input/output interface;

the power supply module is used for acquiring the user data sent by the SIM card module through the second data input/output interface, and sending the user data to the processor through the first data input/output interface after performing level inversion on the user data.

Optionally, the input/output interface unit includes a first data input interface, a second data input interface, a first data output interface, and a second data output interface; the first data input interface and the second data output interface are respectively and electrically connected with the processor, and the first data output interface and the second data input interface are respectively and electrically connected with the SIM card module;

the power supply module is used for acquiring instruction data sent by the processor through the first data input interface, performing level conversion on the instruction data and then sending the instruction data to the SIM card module through the first data output interface;

the power supply module is used for acquiring the user data sent by the SIM card module through the second data input interface, and sending the user data to the processor through the second data output interface after performing level inversion on the user data.

Optionally, the input/output interface unit includes a clock signal input interface and a clock signal output interface;

the clock signal input interface is electrically connected with the processor, and the clock signal output interface is electrically connected with the SIM card module;

the power supply module is used for acquiring a first clock signal sent by the processor through the clock signal input interface, performing level conversion on the first clock signal and then sending the first clock signal to the SIM card module through the clock signal output interface.

Optionally, the power module further includes an interface configuration unit; the interface configuration unit is electrically connected with the processor;

the interface configuration unit is used for configuring the data flow direction of each input/output interface in the input/output interface unit according to the configuration instruction of the processor.

Optionally, the power module includes an SPI communication interface, and the interface configuration unit obtains the configuration instruction of the processor through the SPI communication interface.

Optionally, the power module further includes a first level conversion unit and a second level conversion unit;

the first level conversion unit is used for performing level conversion on instruction data sent by the processor;

the second level conversion unit is used for performing level inverse conversion on the user data sent by the SIM card module.

Optionally, the first level shift unit includes a first switching device and a second switching device;

the control end of the first switching device is electrically connected with the processor, and the first end of the first switching device is electrically connected with the control end of the second switching device; a second end of the first switching device is grounded;

the first end of the second switching device is electrically connected with the first power supply and the SIM card module respectively, and the second end of the second switching device is grounded.

Optionally, the second level converting unit includes a third switching device and a fourth switching device;

the control end of the third switching device is electrically connected with the SIM card module, and the first end of the third switching device is electrically connected with the control end of the fourth switching device; the second end of the third switching device is grounded;

the first end of the fourth switching device is electrically connected with the second power supply and the processor respectively, and the second end of the fourth switching device is grounded.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

the electronic equipment provided by the embodiment of the disclosure comprises a processor, a SIM card module and a power supply module; the processor transmits user data through the power supply module and the SIM card module; the power supply module is used for carrying out level conversion on the instruction data sent by the processor and then sending the instruction data to the SIM card module; the power supply module is also used for carrying out level inverse conversion on the user data sent by the SIM card module and then sending the user data to the processor; the instruction data and the user data are different in level. Like this, through the data conversion of power module for both treater and SIM card module in this embodiment for the required level phase-match of data receiver after the conversion, thereby need not to set up the level conversion module between treater and SIM card module, can reduce hardware data, be favorable to reducing electronic equipment's cost.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a block diagram of an electronic device, according to an example embodiment.

Fig. 2 is a block diagram of another electronic device, shown in accordance with an exemplary embodiment.

Fig. 3 is a block diagram of yet another electronic device, shown in accordance with an exemplary embodiment.

Fig. 4 is a block diagram illustrating an input-output interface unit according to an exemplary embodiment.

Fig. 5 is a block diagram illustrating a power module according to an exemplary embodiment.

Fig. 6 is a circuit schematic diagram of a first level shift unit according to an exemplary embodiment.

Fig. 7 is a circuit schematic diagram of a second level shift unit according to an exemplary embodiment.

Fig. 8 is a block diagram of an electronic device, according to an example embodiment.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The embodiments described by way of example below are not representative of all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus consistent with some aspects of the disclosure as detailed in the accompanying claims. The features of the following examples and embodiments may be combined with each other without any conflict.

The electronic equipment has communication requirement, and is internally provided with a SIM card module for storing user information. The processor within the electronic device may communicate with the SIM card module to read the user information within the SIM card. In practical applications, as the Level of the output signal of the processor is lower, the processor and the SIM card module need a Level Shift circuit (Level Shift) to Shift the Level, so as to meet the Level requirements of the processor and the SIM card module. However, the addition of the level shift circuit in the related art increases the cost of the electronic device.

In order to solve the technical problems, an embodiment of the present disclosure provides an electronic device. Fig. 1 is a schematic structural view of an electronic device, according to an exemplary embodiment, referring to fig. 1, an electronic device includes: a processor 11, a power module 12 and a SIM card module 13. The processor 11 transmits user data through the power module 12 and the SIM card module 13.

The power module 12 is used for performing level conversion on instruction data sent by the processor and then sending the instruction data to the SIM card module;

the power supply module 12 is further configured to perform level inversion on the user data sent by the SIM card module 13, and send the user data to the processor 11; the levels of instruction data and user data are different.

In this example, the processor 11 may include, but is not limited to, a data signal processing chip, a single chip microcomputer, an FPGA chip, etc., where communication with the SIM card module 13 can be implemented, the type of the processor may be selected according to a specific scenario, and a corresponding scheme falls within the protection scope of the present disclosure.

In this example, the power module 12 is a chip or circuit or the like that can provide power to the SIM card module. In one possible example, the power module 12 may be implemented using a power management integrated circuit, and the power module 12 may be implemented using a high pass PM8350 chip. A technician may select a corresponding circuit implementation according to a specific scenario, and a corresponding scheme falls within the protection scope of the present disclosure.

In this example, the SIM card module 13 includes a SIM card and a circuit for holding the SIM card in an operating state.

It should be noted that, to ensure that the SIM card module 13 works normally, the processor 11 may control the power module 12 to provide a voltage of 1.8V or 3.3V to the SIM card module 13. For the clock signal (CLK) and the DATA signal (DATA) between the processor 11 and the SIM card module 13, a separate Level Shift circuit (Level Shift) needs to be provided in the related art, but in the example of the present disclosure, the Level Shift circuit may be omitted by taking the spare pins in the power module 12.

The level conversion process means that the initial level is converted into a target level equal to or higher than the initial level, for example, the instruction data before the level conversion (i.e., the initial level) is 1.8V, and the instruction data after the level conversion (i.e., the target level) is 3.3V; the level inversion refers to an inversion of an initial level to a target level equal to or lower than the initial level, for example, user data before the level inversion (i.e., the initial level) is 3.3V and user data after the level inversion (i.e., the target level) is 1.8V. Of course, initially

The level and target level may be equal and the level shift (or reverse shift) principle may be seen in shift process 5 above.

It is understood that the target level is increased or decreased in the same direction as the initial level at the time of the level shift process or the level inverse shift process in this example. For example, when the instruction data is changed from 0V to 1.8V, the level-converted instruction data is changed from 0V to 3.3V. As another example, when the instruction data is changed from 1.8V to 0V, the level-converted instruction data is converted from 3.3 to 0V.

0 in one example, the power module 12 includes an input-output interface unit. Referring to FIG. 2, a processor may

To transmit data with the SIM card module 13 through the i/o interface unit 21 in the power module 12.

Wherein the data includes clock signals, instruction data, and user data.

In one example, referring to FIG. 3, the I/O interface unit 21 includes a first data I/O interface

A port 31 and a second data input output interface 32; the first data input/output interface 31 is electrically connected with the processor 115, and the second data input/output interface 32 is electrically connected with the SIM card module 13;

the power module 12 is configured to obtain the instruction data sent by the processor 11 through the first data input/output interface 31, and send the instruction data to the SIM card module 13 through the second data input/output interface 32 after performing level conversion on the instruction data;

the power module 12 is configured to obtain, through the second data input/output interface 32, user data sent by the SIM card module 0 group 13, and send the user data to the processor 11 through the first data input/output interface 31 after performing level inversion on the user data.

The power module 12 further includes an interface configuration unit in consideration of the fact that data transmission between the processor 11 and the SIM card module 13 is bi-directional. With continued reference to FIG. 3, the interface configuration unit 33 is electrically connected to the processor 11

And (5) connection. The interface configuration unit 33 is configured to configure the data flow of the input-output interface 5 unit 21 according to the configuration instruction of the processor 11. In one example, power module 12 includes SPI communication interface 34, an interface

The configuration unit 33 acquires the configuration instruction of the processor 11 through the SPI communication interface 34.

Taking the configuration of the first data input output interface 31 and the second data input output interface 32 as an example, when the interface configuration unit 33 determines that the configuration instruction includes the first configuration instruction (e.g., 01), the first data input output interface 31 is configured as an input interface and the second data input output interface 32 is configured as an output interface; when the interface configuration unit 33 determines that the second configuration instruction (e.g., 10) is included in the configuration instructions, the first data input output interface 31 is configured as an output interface and the second data input output interface 32 is configured as an input interface.

In another example, referring to fig. 4, the input output interface unit 21 includes a first data input interface 41, a second data input interface 43, a first data output interface 42, and a second data output interface 44. The first data input interface 41 and the second data output interface 44 are electrically connected to the processor 11, and the first data output interface 42 and the second data input interface 43 are electrically connected to the SIM card module 13. The power module 12 is configured to obtain, through a first data input interface 41, instruction data sent by the processor 11, and perform level conversion on the instruction data, and send the instruction data to the SIM card module 13 through the first data output interface 42; the power module 12 is configured to obtain the user data sent by the SIM card module 13 through the second data input interface 43, and send the user data to the processor 11 through the second data output interface 44 after performing level inversion on the user data.

When the input interface and the output interface in the input/output interface unit 21 shown in fig. 4 have a large number of free interfaces and meet the data transmission requirements of the processor 11 and the SIM card module 13, each interface may be directly used as an input interface and an output interface, respectively. In an example, with continued reference to fig. 4, the power module 12 includes an interface configuration unit 33, which interface configuration unit 33 is similar in function to the interface configuration unit 33 shown in fig. 3, i.e., the interface configuration unit 33 may configure the data flow of the first data input interface 41, the second data input interface 43, the first data output interface 42, and the second data output interface 44. In this example, the interface only needs to be configured once, so that the calculation amount of the processor in the data transmission process can be reduced.

In an example, referring to fig. 5, the power module 12 includes a first level shift unit 51 and a second level shift unit 52. The first level conversion unit 51 is configured to level-convert the instruction data sent by the processor 11 and output the level-converted instruction data to the SIM card module 13. The second level conversion unit 52 is configured to perform level inversion on the user data sent by the SIM card module 13, and output the user data to the processor 11. The first and second level shifting units 51 and 52 illustrated in fig. 5 may be adapted to the power supply module 12 illustrated in fig. 3 and/or 4.

In an example, referring to fig. 6, the first level converting unit 51 includes a first switching device 61 and a second switching device 62. A control terminal of the first switching device 61 is electrically connected to the processor 11, and a first terminal of the first switching device 61 is electrically connected to a control terminal of the second switching device 62; the second terminal of the first switching device 61 is grounded GND. The first end of the second switching device 62 is electrically connected to the first power supply VDD1 (e.g. 3.3V) and the SIM card module 13, respectively, and the second end of the second switching device 62 is grounded GND. The first level converting unit 51 operates on the principle that:

when the designation data of the processor 11 is at a low level, the first switching device 61 is turned on, and at this time, the second switching device 62 is turned on, and the first terminal of the second switching device 62 is grounded, that is, the second switching device 62 outputs a low level.

When the designation data of the processor 11 is at a high level, the first switching device 61 is turned off, the second switching device 62 is turned off, and the first terminal of the second switching device 62 is electrically connected to the first power source, and at this time, the second switching device 62 outputs a high level.

In an example, referring to fig. 7, the second level converting unit 52 includes a third switching device 71 and a fourth switching device 72. A control end of the third switching device 71 is electrically connected with the SIM card module 13, and a first end of the third switching device 71 is electrically connected with a control end of the fourth switching device 72; the second terminal of the third switching device 71 is grounded GND. The first terminal of the fourth switching device 72 is electrically connected to the second power supply VDD2 (e.g., 1.8V) and the processor 11, respectively, and the second terminal of the fourth switching device 72 is grounded GND. The second level converting unit 52 operates on the principle that:

when the user data of the SIM card module 13 is at a low level, the third switching device 71 is turned on, and at this time the fourth switching device 72 is turned on, the first terminal of the fourth switching device 72 is grounded, that is, the fourth switching device 72 outputs a low level to the processor 11.

When the specified data of the SIM card module 13 is at a high level, the third switching device 71 is turned off, the fourth switching device 72 is turned off, and the first end of the fourth switching device 72 is electrically connected to the second power supply, and at this time, the fourth switching device 72 outputs a high level to the processor 11.

It should be noted that, when the power module 12 is a power management chip, the first level conversion unit 51 and the second level conversion unit 52 may be integrated into the power module 12, so as to reduce the number of modules in the electronic device.

The electronic equipment provided by the embodiment of the disclosure comprises a processor, a SIM card module and a power supply module; the processor transmits user data through the power supply module and the SIM card module; the power supply module is used for carrying out level conversion on the instruction data sent by the processor and then sending the instruction data to the SIM card module; the power supply module is also used for carrying out level inverse conversion on the user data sent by the SIM card module and then sending the user data to the processor; the instruction data and the user data are different in level. Like this, through the data conversion of power module for both treater and SIM card module in this embodiment for the required level phase-match of data receiver after the conversion, thereby need not to set up the level conversion module between treater and SIM card module, can reduce hardware data, be favorable to reducing electronic equipment's cost.

Fig. 8 is a block diagram of an electronic device, according to an example embodiment. For example, electronic device 800 may be a smart phone, computer, digital broadcast terminal, tablet device, medical device, exercise device, personal digital assistant, or the like.

Referring to fig. 8, an electronic device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, a communication component 816, and an image acquisition component 818.

The processing component 802 generally controls overall operation of the electronic device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 802 can include one or more processors 820 to execute computer programs. Further, the processing component 802 can include one or more modules that facilitate interactions between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the electronic device 800. Examples of such data include computer programs, contact data, phonebook data, messages, pictures, videos, and the like for any application or method operating on electronic device 800. The memory 804 may be implemented by any type or combination of volatile or nonvolatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk. In one example, the memory 804 includes the SIM card module shown in fig. 1.

The power supply component 806 provides power to the various components of the electronic device 800. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the electronic device 800. The power supply assembly 806 may include a power chip and the controller may communicate with the power chip to control the power chip to turn on or off the switching device to power the motherboard circuit with or without the battery. In one example, the power supply assembly 806 includes the power supply module 12 shown in fig. 1.

The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the target object. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input information from a target object. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensor may sense not only the boundary of a touch or sliding action, but also the duration and pressure associated with the touch or sliding operation.

The audio component 810 is configured to output and/or input audio file information. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio file information when the electronic device 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio file information may be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio file information.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be a keyboard, click wheel, buttons, etc.

The sensor assembly 814 includes one or more sensors for providing status assessment of various aspects of the electronic device 800. For example, the sensor assembly 814 may detect an on/off state of the electronic device 800, a relative positioning of the components, such as a display and keypad of the electronic device 800, the sensor assembly 814 may also detect a change in position of the electronic device 800 or one of the components, the presence or absence of a target object in contact with the electronic device 800, an orientation or acceleration/deceleration of the electronic device 800, and a change in temperature of the electronic device 800. In this example, the sensor assembly 814 may include a magnetic force sensor, a gyroscope, and a magnetic field sensor, wherein the magnetic field sensor includes at least one of: hall sensors, thin film magneto-resistive sensors, and magnetic liquid acceleration sensors.

The communication component 816 is configured to facilitate communication between the electronic device 800 and other devices, either wired or wireless. The electronic device 800 may access a wireless network based on a communication standard, such as WiFi,2G, 3G, 4G, 5G, or a combination thereof. In one exemplary embodiment, the communication component 816 receives broadcast information or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, ultra Wideband (UWB) technology, bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the electronic device 800 can be implemented by one or more Application Specific Integrated Circuits (ASICs), digital information processors (DSPs), digital information processing devices (DSPDs), programmable Logic Devices (PLDs), field Programmable Gate Arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic elements.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. An electronic device is characterized by comprising a processor, a SIM card module and a power supply module; the processor transmits user data through the power supply module and the SIM card module;

the power supply module is used for carrying out level conversion on the instruction data sent by the processor and then sending the instruction data to the SIM card module;

the power supply module is also used for carrying out level inverse conversion on the user data sent by the SIM card module and then sending the user data to the processor; the instruction data and the user data are different in level.

2. The electronic device of claim 1, wherein the power module comprises an input-output interface unit; and the processor transmits data with the SIM card module through the input/output interface.

3. The electronic device of claim 2, wherein the input-output interface unit comprises a first data input-output interface and a second data input-output interface; the first data input/output interface is electrically connected with the processor, and the second data input/output interface is electrically connected with the SIM card module;

the power supply module is used for acquiring instruction data sent by the processor through the first data input/output interface, performing level conversion on the instruction data and then sending the instruction data to the SIM card module through the second data input/output interface;

the power supply module is used for acquiring the user data sent by the SIM card module through the second data input/output interface, and sending the user data to the processor through the first data input/output interface after performing level inversion on the user data.

4. The electronic device of claim 2, wherein the input-output interface unit comprises a first data input interface, a second data input interface, a first data output interface, and a second data output interface; the first data input interface and the second data output interface are respectively and electrically connected with the processor, and the first data output interface and the second data input interface are respectively and electrically connected with the SIM card module;

the power supply module is used for acquiring instruction data sent by the processor through the first data input interface, performing level conversion on the instruction data and then sending the instruction data to the SIM card module through the first data output interface;

the power supply module is used for acquiring the user data sent by the SIM card module through the second data input interface, and sending the user data to the processor through the second data output interface after performing level inversion on the user data.

5. The electronic device of claim 2, wherein the input-output interface unit comprises a clock signal input interface and a clock signal output interface;

the clock signal input interface is electrically connected with the processor, and the clock signal output interface is electrically connected with the SIM card module;

the power supply module is used for acquiring a first clock signal sent by the processor through the clock signal input interface, performing level conversion on the first clock signal and then sending the first clock signal to the SIM card module through the clock signal output interface.

6. The electronic device according to any one of claims 2 to 5, wherein the power supply module further comprises an interface configuration unit; the interface configuration unit is electrically connected with the processor;

the interface configuration unit is used for configuring the data flow direction of each input/output interface in the input/output interface unit according to the configuration instruction of the processor.

7. The electronic device of claim 6, wherein the power module comprises an SPI communication interface through which the interface configuration unit obtains configuration instructions for the processor.

8. The electronic device of claim 1, wherein the power module further comprises a first level shift unit and a second level shift unit;

the first level conversion unit is used for performing level conversion on instruction data sent by the processor;

the second level conversion unit is used for performing level inverse conversion on the user data sent by the SIM card module.

9. The electronic device of claim 8, wherein the first level-shifting unit comprises a first switching device and a second switching device;

the control end of the first switching device is electrically connected with the processor, and the first end of the first switching device is electrically connected with the control end of the second switching device; a second end of the first switching device is grounded;

the first end of the second switching device is electrically connected with the first power supply and the SIM card module respectively, and the second end of the second switching device is grounded.

10. The electronic device of claim 8, wherein the second level-shifting unit includes a third switching device and a fourth switching device;

the control end of the third switching device is electrically connected with the SIM card module, and the first end of the third switching device is electrically connected with the control end of the fourth switching device; the second end of the third switching device is grounded;

the first end of the fourth switching device is electrically connected with the second power supply and the processor respectively, and the second end of the fourth switching device is grounded.

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