CN219288040U

CN219288040U - Heat radiation structure of string inverter

Info

Publication number: CN219288040U
Application number: CN202320075654.5U
Authority: CN
Inventors: 许颇; 王一鸣; 杨雄鹏; 梅汉文; 林万双
Original assignee: Ginlong Technologies Co Ltd
Current assignee: Ginlong Technologies Co Ltd
Priority date: 2023-01-09
Filing date: 2023-01-09
Publication date: 2023-06-30
Anticipated expiration: 2033-01-09

Abstract

The application discloses a radiating structure of a string inverter, which comprises an air duct structure and a fan group, wherein the air duct structure is arranged in a chassis and is in a T shape; the direct current inductance component, the IGBT module and the alternating current inductance component are sequentially installed in the air duct structure; the fan set is suitable for inputting the air flow for heat dissipation from the first end of the air duct structure, and respectively discharging the air flow along the two symmetrical second ends of the air duct structure after passing through the direct current inductance component, the IGBT module and the alternating current inductance component. The beneficial effects of this application: by arranging the T-shaped air duct structure in the chassis, the overall heat dissipation structure of the chassis can be ensured to be compact; meanwhile, the T-shaped air duct structure can be used for guiding the flow of the air flow for heat dissipation, so that the number of fans in the fan group can be effectively reduced, and noise and heat dissipation cost generated during heat dissipation are reduced.

Description

Heat radiation structure of string inverter

Technical Field

The application relates to the technical field of heat dissipation, in particular to a heat dissipation structure of a string inverter.

Background

In the string inverter, the IGBT module and the inductor are main heating devices, and scientific temperature control is carried out on the main heating devices, so that the overall performance and the service life of the inverter are determined. When the IGBT module and the AC/DC inductance high-loss device of the existing high-power string inverter dissipate heat, separate fans and air channels are required to be arranged for cooling and heat dissipation respectively. This results in a larger number of fans for heat dissipation, so that the noise of the whole machine is larger when heat dissipation is performed; meanwhile, the structure of the air duct is complex and staggered, so that the whole radiating structure is large in size, and the radiating cost is further increased.

Disclosure of Invention

One of the purposes of the present application is to provide a heat dissipation structure that has a simple structure and is conducive to heat dissipation of a string inverter.

In order to achieve at least one of the above objects, the technical scheme adopted in the application is as follows: a heat radiation structure of a string inverter comprises an air duct structure and a fan group, wherein the air duct structure is arranged in a chassis and is in a T shape; a plurality of direct current inductance components, IGBT modules and a plurality of alternating current inductance components are respectively arranged in the air duct structure; the fan set is suitable for inputting air flow for heat dissipation from the first end of the air duct structure, and the air flow is discharged along the two second ends of the air duct structure after passing through all the direct current inductance components, the IGBT module and the alternating current inductance components.

Preferably, the IGBT module is mounted between the dc inductance assembly and the ac inductance assembly; the fan set is suitable for enabling air flow for heat dissipation to sequentially pass through the direct current inductance assembly, the IGBT module and the alternating current inductance assembly along the air channel structure.

Preferably, the IGBT module is mounted between the dc inductance assembly and the ac inductance assembly; the fan set is suitable for enabling air flow for heat dissipation to sequentially pass through the alternating current inductance assembly, the IGBT module and the direct current inductance assembly along the air channel structure.

Preferably, the air duct structure comprises a first air duct, a second air duct and a third air duct which are sequentially communicated; the direct current inductance component is arranged in the first air duct, the IGBT module is arranged in the second air duct, and the alternating current inductance component is arranged in the third air duct; the first air channel and the third air channel are communicated with the outside, and the fan set is suitable for sucking air flow from the first air channel and discharging the air flow from the two ends of the third air channel after the air flow passes through the second air channel.

Preferably, the fan set is mounted on the first air duct, so that the fan set generates air flow passing through the first air duct, the second air duct and the third air duct in sequence.

Preferably, the fan set is mounted on a side of the first air duct, which is close to the second air duct, so that the direct current inductance component is located on a negative pressure side of the fan set, and the second air duct and the third air duct are both located on a positive pressure side of the fan set.

Preferably, the fan set is mounted on the second air duct, and the fan set is located on one side, close to the first air duct, of the second air duct, so that the first air duct is located on the negative pressure side of the fan set, the IGBT module is located on the positive pressure side first stage of the fan set, and the third air duct is located on the positive pressure side second stage of the fan set.

Preferably, the IGBT module includes a plurality of IGBT modules, a radiator, and a plurality of heat pipes, and the radiator, the heat pipes, and the fan group cooperate to radiate heat from the IGBT modules.

Preferably, the two sides of the middle part of the case are provided with the partition plates, so that a first area, a second area and a third area which are communicated in an I shape are formed in the case; the first air channel, the second air channel and the third air channel are respectively located in the first area, the second area and the third area.

Preferably, the first area and the third area are both positioned at the side part of the chassis, and air inlets are arranged on the side wall of the chassis positioned in the first area; and the side walls of the case, which are positioned at the two ends of the third area, are provided with exhaust holes.

Preferably, along the height direction of the chassis, the first area is located at the bottom of the chassis, and the third area is located at the top of the chassis; so that the air flow enters the interior of the case from the bottom of the case and is discharged from the two sides of the top of the case.

Compared with the prior art, the beneficial effect of this application lies in:

by arranging the T-shaped air duct structure in the chassis, the overall heat dissipation structure of the chassis can be ensured to be compact; meanwhile, the T-shaped air duct structure can be used for guiding the flow of the air flow for heat dissipation, so that the number of fans in the fan group can be effectively reduced, and noise and heat dissipation cost generated during heat dissipation are reduced.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the present utility model.

In the figure: the air conditioner comprises a case 100, a first area 101, an air inlet 1010, a second area 102, a third area 103, an air outlet 1030, a partition 110, a direct current inductance assembly 200, an IGBT module 300, an alternating current inductance assembly 400 and a fan set 500.

Detailed Description

The present application will be further described with reference to the specific embodiments, and it should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.

In the description of the present application, it should be noted that, for the azimuth terms such as terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present application and simplifying the description, and it is not to be construed as limiting the specific protection scope of the present application that the device or element referred to must have a specific azimuth configuration and operation, as indicated or implied.

It should be noted that the terms "first," "second," and the like in the description and in the claims of the present application are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

In one preferred embodiment of the present application, as shown in fig. 1, a heat dissipation structure of a string inverter includes an air duct structure disposed in a chassis 100 and a fan set 500. The air duct structure is in a T-shaped arrangement, and a plurality of dc inductance components 200, IGBT modules 300 and a plurality of ac inductance components 400 are respectively installed in the air duct structure. The fan set 500 is also located in the air duct structure, so that the fan set 500 can input the air flow for heat dissipation from the first end of the air duct structure, and the air flow is discharged along the two symmetrical second ends of the air duct structure after passing through all the dc inductance assembly 200, the IGBT module 300 and the ac inductance assembly 400.

It will be appreciated that since the duct structure is T-shaped, the duct structure has three end positions in total. The three end positions may be divided into a first end and two second ends, the two second ends being symmetrically arranged.

Meanwhile, by arranging the T-shaped air duct structure inside the case 100, the compactness of the whole heat dissipation structure inside the case 100 can be ensured compared with the traditional open heat dissipation structure. Meanwhile, the T-shaped air duct structure can be used for guiding the flow of the air flow for heat dissipation, so that the number of fans in the fan set 500 can be effectively reduced, and noise and heat dissipation cost generated during heat dissipation are reduced.

In this embodiment, there are various ways to mount the dc inductor assembly 200, the IGBT module 300 and the ac inductor assembly 400 to each other, including but not limited to the following two ways.

Mode one: as shown in fig. 1, the IGBT module 300 is mounted between the dc inductance assembly 200 and the ac inductance assembly 400. Therefore, the fan set 500 can sequentially pass through the dc inductance assembly 200, the IGBT module 300 and the ac inductance assembly 400 along the air duct structure, thereby implementing heat dissipation to all components in the chassis 100.

In the second mode, the IGBT module 300 is mounted between the dc inductance assembly 200 and the ac inductance assembly 400. Therefore, the fan set 500 can sequentially pass through the ac inductance assembly 400, the IGBT module 300, and the dc inductance assembly 200 along the air duct structure, thereby implementing heat dissipation for all components in the chassis 100.

It can be appreciated that the high temperature resistance of the inductor device is better than that of the IGBT module 300; therefore, when the device is mounted, it is only necessary to ensure that the IGBT module 300 is located at the optimal heat dissipation position. The first and second modes are to install the IGBT module 300 between the ac inductance assembly 400 and the dc inductance assembly 200, which can meet the heat dissipation requirement of the IGBT module 300. For convenience of description, the first mode is adopted for the mutual installation positions of the dc inductance component 200, the IGBT module 300 and the ac inductance component 400 in the present application.

In this embodiment, as shown in fig. 1, the air duct structure includes a first air duct, a second air duct, and a third air duct that are sequentially connected. The direct current inductance assembly 200 is arranged in the first air channel, the IGBT module 300 is arranged in the second air channel, and the alternating current inductance assembly 400 is arranged in the third air channel; the first air channel and the third air channel are all communicated with the outside, so that the fan set 500 can suck air flow from the first air channel and discharge the air flow from the two ends of the third air channel after passing through the second air channel.

It can be understood from the foregoing that, in the heat dissipation process, it is necessary to ensure heat dissipation of the IGBT module 300 first, so that the IGBT module 300 is mounted on the second air duct, and the positive pressure side of the fan set 500 can be ensured to face the IGBT module 300. That is, the strong heat dissipation airflow generated by the fan set 500 directly dissipates heat of the IGBT module 300.

Specifically, in order to ensure that the IGBT module 300 faces the fan set 500, the fan set 500 is mounted in two ways.

The first installation mode is that the fan set 500 is installed in first wind channel, and the fan set 500 is located one side that the first wind channel is close to the second wind channel, so that direct current inductance assembly 200 is located the negative pressure side of fan set 500, second wind channel and third wind channel are located the positive pressure side first level and the second level of fan set 500 respectively, and then fan set 500 can inhale the air current by first wind channel through the negative pressure side, then the air current blows to in second wind channel and the third wind channel by the positive pressure side of fan set 500, in order to realize the heat dissipation to IGBT module 300 and alternating current inductance assembly 400, the air current is discharged along the both ends of third wind channel at last.

The second installation mode is that the fan set 500 is installed in the second air duct, and the fan set 500 is located at one side of the second air duct close to the first air duct, so that the first air duct is located at the negative pressure side of the fan set 500, the second air duct is located at the positive pressure side first stage of the fan set 500, and the third air duct is located at the positive pressure side second stage of the fan set 500. And then the fan set 500 can suck air flow from the first air channel through the negative pressure side, and then the air flow is blown into the second air channel and the third air channel through the positive pressure side of the fan set 500, so as to realize heat dissipation of the IGBT module 300 and the alternating current inductance assembly 400, and finally the air flow is discharged along two ends of the third air channel.

It is understood that the fan set 500 includes a plurality of fans connected in series, and the fans are arranged in order, and the specific structure of the fans is well known to those skilled in the art, and axial fans are generally used.

Meanwhile, as can be seen from the foregoing, the inductor device is more resistant to high temperature than the IGBT module 300; therefore, the inductance devices can be respectively arranged at the air outlet ends of the negative pressure side and the positive pressure side of the fan, so that the fan set 500 can simultaneously meet the temperature requirements of all the cooled devices at the upper and lower sides of the air duct structure.

In this embodiment, the IGBT module 300 includes a plurality of IGBT modules, a heat sink, and a plurality of heat pipes. Namely, the positive pressure side of the fan set 500 faces the IGBT module at the first stage, so that the fan set 500 can cooperate with the radiator and the heat pipe to radiate heat from all the IGBT modules.

In one embodiment of the present application, as shown in fig. 1, the overall cross-sectional shape of the chassis 100 is rectangular, and both sides of the middle of the chassis 100 are provided with the partition plates 110 inward, so that the interior of the chassis 100 forms a first area 101, a second area 102 and a third area 103 that are communicated in an "i" shape. Whereby the first air duct, the second air duct and the third air duct are located within the first region 101, the second region 102 and the third region 103, respectively; the direction of the airflow may be further achieved by the partition 110 and the side walls of the chassis 100.

In this embodiment, as shown in fig. 1, the first area 101 and the third area 103 are located on two sides of the chassis 100, respectively. And the side walls of the case 100 located in the first area 101 are provided with air inlets 1010; the side walls of the cabinet 100 at both ends of the third region 103 are provided with air discharge holes 1030.

It will be appreciated that, in order to ensure that the fan assembly 500 generates sufficient heat dissipation air flow, the air intake holes 1010 may be disposed on three sidewalls of the first area 101, and the number of air intake holes 1010 may be plural on each sidewall.

Specifically, the first region 101, the second region 102, and the third region 103 are arranged in various ways. Including but not limited to the two below.

In the first arrangement mode, the first area 101, the second area 102 and the third area 103 are all arranged at the same horizontal height; i.e., the height of the cabinet 100 is relatively low, so that the first, second and

third regions

101, 102 and 103 can only be mounted to the bottom plane of the cabinet 100.

In the second arrangement, along the height direction of the casing 100, the first area 101 is located at the bottom of the casing 100, the second area 102 is located at the middle of the casing 100, and the third area 103 is located at the top of the casing 100. So that the fan assembly 500 can suck air flow from the bottom of the cabinet 100 into the interior of the cabinet 100 and then discharge the air flow from both sides of the top of the cabinet 100.

It can be appreciated that the above-mentioned first and second arrangements avoid adopting the conventional structure of air flow entering from bottom to top, so that the protection of the chassis 100 is higher than that of the conventional form of straight-through air duct entering from bottom to top, and the exhaust hole 1030 can be effectively protected from the falling objects such as bird droppings.

Meanwhile, since the first region 101, the second region 102 and the third region 103 are in an "i" shape, in order to ensure heat dissipation of the ac inductance assembly 400 located in the third region 103, the side walls at two ends of the third region 103 may be provided with the air exhaust holes 1030, so that after the air flows into the third region 103 through the second region 102, the air flows in two end directions of the third region 103 respectively, and all the ac inductance assemblies 400 in the whole third region 103 can be ensured to be passed by the air flow.

It should be noted that the direction indicated by the dashed arrow in the figure is the flow direction of the air stream, as shown in figure 1. In order to further improve the heat dissipation effect of the dc inductance assembly 200 and the ac inductance assembly 400, the extending direction of the heat dissipation ribs disposed outside the dc inductance assembly 200 and the ac inductance assembly 400 may be parallel to the air flow direction.

The foregoing has outlined the basic principles, main features and advantages of the present application. It will be appreciated by persons skilled in the art that the present application is not limited to the embodiments described above, and that the embodiments and descriptions described herein are merely illustrative of the principles of the present application, and that various changes and modifications may be made therein without departing from the spirit and scope of the application, which is defined by the appended claims. The scope of protection of the present application is defined by the appended claims and equivalents thereof.

Claims

1. The heat radiation structure of the string inverter is characterized by comprising a T-shaped air duct structure and a fan group, wherein the T-shaped air duct structure is arranged in a chassis; a plurality of direct current inductance components, IGBT modules and a plurality of alternating current inductance components are respectively arranged in the air duct structure; the fan set is suitable for inputting air flow for heat dissipation from the first end of the air duct structure, and the air flow is discharged along the two second ends of the air duct structure after passing through all the direct current inductance components, the IGBT module and the alternating current inductance components.

2. The heat dissipation structure of the string inverter as defined in claim 1, wherein: the IGBT module is arranged between the direct current inductance component and the alternating current inductance component; the fan set is suitable for enabling air flow for heat dissipation to sequentially pass through the direct current inductance assembly, the IGBT module and the alternating current inductance assembly along the air channel structure.

3. The heat dissipation structure of the string inverter as defined in claim 1, wherein: the IGBT module is arranged between the direct current inductance component and the alternating current inductance component; the fan set is suitable for enabling air flow for heat dissipation to sequentially pass through the alternating current inductance assembly, the IGBT module and the direct current inductance assembly along the air channel structure.

4. The heat dissipation structure of the string inverter as defined in claim 2, wherein: the air duct structure comprises a first air duct, a second air duct and a third air duct which are sequentially communicated; the direct current inductance component is arranged in the first air duct, the IGBT module and the fan set are arranged in the second air duct, and the alternating current inductance component is arranged in the third air duct; the first air channel and the third air channel are communicated with the outside, and the fan set is suitable for sucking air flow from the first air channel and discharging the air flow from the two ends of the third air channel after the air flow passes through the second air channel.

5. The heat dissipation structure of the string inverter as defined in claim 4, wherein: the fan set is installed in the first air duct, and the fan set is located in one side of the first air duct, which is close to the second air duct, so that the direct current inductance component is located in the negative pressure side of the fan set, and the second air duct and the third air duct are located in the positive pressure side first stage and the positive pressure side second stage of the fan set respectively.

6. The heat dissipation structure of the string inverter as defined in claim 4, wherein: the fan set is installed in the second air duct, and the fan set is located the second air duct is close to one side of the first air duct, so that the first air duct is located the negative pressure side of the fan set, the IGBT module is located the positive pressure side first stage of the fan set, and the third air duct is located the positive pressure side second stage of the fan set.

7. The heat radiation structure of the string inverter according to any one of claims 1 to 6, wherein: the IGBT module comprises a plurality of IGBT modules, a radiator and a plurality of heat pipes, wherein the radiator, the heat pipes and the fan group are cooperated to radiate the IGBT modules.

8. The heat dissipation structure of the string inverter as defined in claim 4, wherein: the two sides of the middle part of the case are provided with partition plates, so that a first area, a second area and a third area which are communicated in an I shape are formed in the case; the first air channel, the second air channel and the third air channel are respectively located in the first area, the second area and the third area.

9. The heat dissipation structure of the string inverter as defined in claim 8, wherein: the first area and the third area are both positioned at the side part of the case, and air inlets are arranged on the side wall of the case positioned in the first area; and the side walls of the case, which are positioned at the two ends of the third area, are provided with exhaust holes.

10. The heat dissipation structure of the string inverter as defined in claim 8, wherein: the first area is positioned at the bottom of the case and the third area is positioned at the top of the case along the height direction of the case; so that the air flow enters the interior of the case from the bottom of the case and is discharged from the two sides of the top of the case.