CN219106111U

CN219106111U - Electrostatic chuck

Info

Publication number: CN219106111U
Application number: CN202221941392.8U
Authority: CN
Inventors: 刘斌
Original assignee: Guangdong Haituo Innovation Technology Co ltd
Current assignee: Guangdong Haituo Innovation Technology Co ltd
Priority date: 2022-07-26
Filing date: 2022-07-26
Publication date: 2023-05-30
Anticipated expiration: 2032-07-26

Abstract

The utility model discloses an electrostatic chuck which comprises an adsorption layer, wherein the adsorption layer comprises a dielectric layer and an insulating layer, the dielectric layer and the insulating layer are bonded through an adhesive, a plurality of electrode groups are arranged between the dielectric layer and the insulating layer, a buffer layer is arranged at the lower end of the insulating layer, and a reinforced substrate is arranged at the lower end of the buffer layer. The electrostatic chuck has strong design adaptability, and can meet the box forming process of the LCD high-generation ultrathin panel; the damage of the electrostatic chuck is reduced, and the service life is prolonged; the use cost of the electrostatic chuck is reduced.

Description

Electrostatic chuck

Technical Field

The utility model relates to the technical field of electrostatic chucks, in particular to an electrostatic chuck.

Background

The electrostatic chuck is a new clamping device suitable for use in atmosphere or vacuum environment, and is used in clamping wafer and other processed object during the manufacture of semiconductor integrated circuit and panel display, and has no limitation of atmospheric pressure, low power consumption, accurate control via power on and power off, homogeneous adsorption force, no local stress, etc.

In order to improve the production efficiency and reduce the cost, the flat panel display industry rapidly develops to the high-generation line, the 10.5-generation line and the 11-generation line are put into production successively, and the sizes of the TFT and CF glass substrates are over 3000mm, and the thickness is as low as 0.3mm. LCD panels are being developed in a thin and precise direction, and thus performance requirements for the electrostatic chuck are becoming higher.

A typical case of an electrostatic chuck is a ceramic electrostatic chuck. The ceramic electrostatic chuck is generally obtained by using materials such as alumina ceramic, aluminum nitride ceramic and the like as a first insulating substrate, printing, sputtering, embedding and the like on the first insulating substrate to realize a wiring electrode layer, and then superposing a non-wiring second insulating substrate on the first insulating substrate printed with the wiring electrode group, and co-firing the first insulating substrate. The ceramic substrate and the metal electrode group have different thermal expansion coefficients, and the problems of gaps, deformation and the like are easy to occur in the middle-temperature and high-temperature co-firing process. The existing ceramic electrostatic chuck co-firing equipment has smaller size, and other large-scale non-ceramic electrostatic chuck special co-firing equipment chambers are too large to realize accurate temperature curve management, so that the existing production process and conditions cannot meet the requirement of large-area ceramic electrostatic chuck co-firing.

The polyimide electrostatic chuck is characterized in that a polyimide film is used as a first insulating layer, a copper foil material is generally adopted as an electrode group, the electrode group is arranged between the first insulating layer and a second insulating layer, and the polyimide electrostatic chuck is formed by laminating after using a solid hot melt adhesive. The polyimide film has lower surface tension, can not be effectively combined with the adhesive, and can generate an air release phenomenon after the adhesive is heated and melted, so that bubbles invisible to naked eyes exist in the first insulating layer and the second insulating layer, and the bubbles are influenced by pressure to expand in a high vacuum atmosphere, so that the insulating effect of the electrode group is weakened, and the electrode group can not bear high-frequency and high-voltage. The existing polyimide electrostatic chuck can meet the requirement of ODF liquid crystal dripping in the high-generation flat panel display box-forming process, but is easy to damage by CF and TFT glass in the use process, and has short service life and high price.

Disclosure of Invention

Aiming at the problems in the related art, the utility model provides an electrostatic chuck which solves the existing problems.

In order to achieve the technical purpose, the technical scheme of the utility model is as follows:

the utility model provides an electrostatic chuck, includes the adsorbed layer, the adsorbed layer includes dielectric layer and insulating layer, the dielectric layer with the insulating layer passes through the adhesive bonding, the dielectric layer with be equipped with a plurality of electrode groups between the insulating layer, the lower extreme of insulating layer is equipped with the buffer layer, the lower extreme of buffer layer is equipped with reinforcing base plate.

Further, the dielectric layer and the insulating layer are polyimide films; the buffer layer is a structural layer with strong kinetic energy buffer absorption and deformation recovery capacity; the reinforced substrate is a structural layer with stronger hardness and insulating property.

Further, the electrode group comprises a plurality of electrode layers, two adjacent electrode layers are bonded through the adhesive, and the upper surface and the lower surface of each electrode layer are two symmetrical corrugated surfaces.

Further, the wave crest and the wave trough of the two adjacent wave surfaces of the two adjacent electrode layers are opposite.

A method of manufacturing an electrostatic chuck, comprising the steps of: s1, carrying out surface modification on contact surfaces of the dielectric layer, the electrode group and the insulating layer which are in contact with each other through a potassium permanganate solution with a certain proportion;

s2, obtaining a raw material adhesive solution containing one or more components of ethylene and vinyl acetate by a high-temperature high-pressure method, and adding a proper amount of organic or inorganic adhesion-promoting and modifying solvents capable of providing adhesiveness and insulating strength into the raw material adhesive solution to obtain the adhesive;

s3, pre-compounding the dielectric layer (2) and the electrode group (3) by adopting a coating method or a spraying method, then bonding the dielectric layer (2) and the electrode group (3) in a vacuum hot-pressing chamber in a vacuum hot-pressing mode, bonding the insulating layer (4) and the adhesive (5), and finally bonding a bonding body formed by the dielectric layer (2) and the electrode group (3) and a bonding body formed by the insulating layer (4) and the adhesive (5);

and S4, sequentially attaching the buffer layer and the enhancement substrate to the lower end of the insulating layer.

Further, the vacuum atmosphere pressure of the vacuum hot-pressing chamber ranges from-0.08 Mpa to-0.8 Mpa, the temperature in the chamber ranges from 200 ℃ to 280 ℃, and the pressing pressure ranges from 3 tons to 8 tons.

Further, the thickness of the electrode layer is smaller than or equal to 0.02mm, and the distance between two adjacent electrode layers is smaller than or equal to 0.02mm.

The utility model has the beneficial effects that: the electrostatic chuck has strong design adaptability, and can meet the box forming process of the LCD high-generation ultrathin panel; the damage of the electrostatic chuck is reduced, and the service life is prolonged; the use cost of the electrostatic chuck is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a cross-sectional view of an electrostatic chuck according to the present utility model;

FIG. 2 is a cross-sectional view of an electrode assembly according to the present utility model;

fig. 3 is a cross-sectional view of two adjacent electrode layers according to the present utility model.

In the figure:

1. an ultra-thin glass substrate; 2. a dielectric layer; 3. an electrode group; 3-1, electrode layer; 3-1-1, wave crest of corrugated surface; 3-1-2, wave trough of corrugated surface; 4. an insulating layer; 5. an adhesive; 6. a buffer layer; 7. the substrate is reinforced.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.

As shown in fig. 1 to 3, an electrostatic chuck according to an embodiment of the present utility model includes an adsorption layer, the adsorption layer includes a dielectric layer 2 and an insulating layer 4, the dielectric layer 2 and the insulating layer 4 are bonded by an adhesive 5, a plurality of electrode groups 3 are disposed between the dielectric layer 2 and the insulating layer 4, a buffer layer 6 is disposed at a lower end of the insulating layer 4, and a reinforcing substrate 7 is disposed at a lower end of the buffer layer 6.

In one embodiment of the present utility model, the buffer layer 6 may be made of polyurethane, and the reinforced substrate 7 with strong kinetic energy buffering absorption and deformation recovery capability may be made of aluminum alloy through foaming treatment, precise machining and surface oxidation treatment, and has strong hardness and certain insulation performance.

In one embodiment of the present utility model, the dielectric layer 2 and the insulating layer 4 are mainly untreated polyimide films. The contact surfaces of the dielectric layer 2, the electrode group 3 and the insulating layer 4, which are in contact with each other, are subjected to surface modification by using a potassium permanganate solution with a certain proportion, so that the adhesion performance of the contact surfaces of the dielectric layer 2, the electrode group 3 and the insulating layer 4, which are in contact with each other, is enhanced.

In one embodiment of the utility model, a raw material adhesive solution containing one or more components of ethylene and vinyl acetate is obtained by a high-temperature and high-pressure method, an appropriate amount of organic or inorganic adhesion-promoting and modifying solvent capable of providing adhesiveness and insulating strength is mixed into the raw material adhesive solution to obtain an adhesive 5, a coating method or a spraying method is used for pre-compounding the dielectric layer 2 and the electrode group 3, the dielectric layer 2 and the electrode group 3 are bonded in a vacuum hot-pressing chamber by a vacuum hot-pressing method, the electrode group 3 is made into a pattern structure as shown in fig. 2 by etching and the like, the thickness of the pattern structure is less than or equal to 0.02mm, and the interval is less than or equal to 0.02mm, and an electrostatic chuck of the pattern structure is called a bipolar structure or a coulombic electrostatic chuck. Then, the lamination step is repeated again for the insulating layer 4 and the adhesive 5, and then the composite body of the dielectric layer 2 and the electrode group 3 obtained in the above-described manner is pre-laminated.

In one embodiment of the utility model, the specified thickness is obtained through a plurality of repeated treatments such as adhesive, vacuum lamination, vacuum hot pressing and the like, and the conditions such as materials, adhesive, pressing sequence, thickness and the like do not accord with the set values, so that the problems such as reduced adsorption force, deformation, surface flatness and the like after the power supply is disconnected occur; the above-mentioned steps are preferably carried out under a vacuum atmosphere having a pressure of-0.08 to-0.8 MPa, a chamber temperature of 200 to 280 ℃ and a pressing pressure of 3 to 8 tons. The pressure, temperature and pressing pressure of the vacuum atmosphere are lower than the set values, so that the problems of bubbles, degumming under the vacuum atmosphere, surface flatness deterioration and the like are caused.

In one embodiment of the utility model, as shown in fig. 2-3, the electrode group 3 comprises a plurality of electrode layers 3-1, two adjacent electrode layers 3-1 are bonded through an adhesive 5, the upper surface and the lower surface of the electrode layer 3-1 are two symmetrical corrugated surfaces, the corrugated surface wave crest 3-1-1 and the corrugated surface wave trough 3-1-2 of the two adjacent corrugated surfaces of the two adjacent electrode layers 3-1 are opposite, and the adhesive 5 is a mixed heat curing adhesive, so that the structural strength of the adsorption layer can be enhanced, and the stability performance under the conditions of ultrahigh vacuum degree and high frequency and high voltage can be met.

In one embodiment of the present utility model, the thickness of the adsorption layer obtained in the above manner is 0.1mm to 0.3mm after processing, and the unsupported surface of the flexible material cannot be kept in a horizontal state. In addition, the ultra-thin glass substrate 1 may be entrained with foreign matters or change in bonding pressure during the cutting process in the upper process. Therefore, the adsorption and lamination functions of the ultrathin glass substrate 1 can not be realized by simply using the adsorption layer, the application selects the buffer layer 6, so that the buffer capacity of the adsorption layer is enhanced, the buffer layer 6 is in a double-sided back adhesive form and is laminated with the enhanced substrate 7, and the electrostatic chuck in a complete form can be obtained.

When the device is specifically used, the adsorption layer is provided with a plurality of through gas channels, the lower ends of the gas channels are provided with gas flow control units through the vacuum chambers and are connected with a positive pressure gas source, the adsorption layer is also provided with a plurality of through holes of the jacking device, the adsorption layer is arranged on the jacking device, the jacking device is connected with a lower end driving power device, a control unit, a gas flow control unit, a negative pressure gas source and other components, the ultra-thin glass substrate 1 is fed to a set position, the jacking device stretches out of the plane of the dielectric layer 2, the head of the jacking device is provided with a vacuum element and is in contact with the ultra-thin glass substrate 1, negative pressure adsorption is started, the jacking device descends to enable the ultra-thin glass substrate 1 to be in contact with the dielectric layer 2, and electrostatic force generated by applying direct current high voltages with opposite polarities at two ends of the adjacent electrode layers 3-1 by an electrostatic chuck power supply is adsorbed on the dielectric layer 2. The vacuum treatment device finishes the treatment of the ultrathin glass substrate 1, the head vacuum element of the jacking device is contacted with the ultrathin glass substrate 1, negative pressure adsorption is started, opposite polarity direct current high voltage is applied to two ends of the adjacent electrode layer 3-1 to release, and the ultrathin glass substrate 1 is separated from the dielectric layer 2 under the action of the jacking device.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims

1. The utility model provides an electrostatic chuck, its characterized in that includes the adsorbed layer, the adsorbed layer includes dielectric layer (2) and insulating layer (4), dielectric layer (2) with insulating layer (4) are through adhesive (5) bonding, dielectric layer (2) with be equipped with a plurality of electrode group (3) between insulating layer (4), the lower extreme of insulating layer (4) is equipped with buffer layer (6), the lower extreme of buffer layer (6) is equipped with reinforcing base plate (7).

2. An electrostatic chuck according to claim 1, characterized in that the dielectric layer (2) and the insulating layer (4) are polyimide films; the buffer layer (6) is made of polyurethane material and is subjected to foaming treatment; the reinforced substrate (7) is made of aluminum alloy material and is subjected to surface oxidation treatment.

3. An electrostatic chuck according to claim 1, wherein the electrode assembly (3) comprises a plurality of electrode layers (3-1), two adjacent electrode layers (3-1) being bonded by the adhesive (5), the upper and lower surfaces of the electrode layers (3-1) being two symmetrical corrugated surfaces.

4. An electrostatic chuck according to claim 3, characterized in that the corrugation plane peaks (3-1-1) and corrugation plane valleys (3-1-2) of two adjacent corrugation planes of two adjacent electrode layers (3-1) are opposite.