CN218865147U

CN218865147U - CPU-based heat dissipation device and test equipment

Info

Publication number: CN218865147U
Application number: CN202223213257.4U
Authority: CN
Inventors: 張海峰; 李想; 刘海波
Original assignee: Testron Technology Jiangsu Co ltd
Current assignee: Testron Technology Jiangsu Co ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-04-14
Anticipated expiration: 2032-11-30

Abstract

The utility model relates to a CPU-based heat dissipation device and test equipment, which comprises a bottom plate and a heat dissipation module, wherein the bottom plate is provided with an object placing hole, a mounting rack is arranged above the object placing hole, and the CPU is positioned in the mounting rack; the heat dissipation module comprises an air guide groove, the air guide groove is inserted on the mounting frame, a first fan is installed at one end of the air guide groove, the other end of the air guide groove is located on one side of the CPU, the two ends of the air guide groove are arranged in a closed mode, a second fan is installed on one side of the air guide groove, the second fan is arranged on the mounting frame and located above the CPU, and an air flow channel is formed among the first fan, the air guide groove and the second fan. The utility model discloses can realize the air current circulation, avoid the heat to exert an influence to CPU once more, CPU obtains effectual heat dissipation, reduces because of the heat leads to the probability that test equipment system collapse crashes, and then improves efficiency of software testing, avoids damaging test element, reduce cost.

Description

CPU-based heat dissipation device and test equipment

Technical Field

The utility model belongs to the technical field of the radiating technique of electron device and specifically relates to indicate a heat abstractor and test equipment based on CPU.

Background

Along with the development of test equipment, the diversification of test function is provided with the multiunit CPU in the test equipment, and CPU whole calorific capacity is bigger and bigger. If effective heat dissipation measures are not taken, system crash and crash of the test equipment can be caused quickly, and even hardware is damaged. In the current CPU heat dissipation method, a fan is installed on one side of a CPU to directly perform blowing heat dissipation on the CPU, and the blown heat returns to the CPU. In the mode, partial heat of the CPU near the fan is only taken away, and a plurality of groups of CPUs cannot be effectively radiated, so that the system of the test equipment is crashed, the test efficiency is influenced, and even the tested element can be damaged.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model aims to solve the technical problem that the CPU radiating mode is for at a CPU side-mounting fan among the overcoming prior art test equipment, directly blows the heat dissipation to CPU, and the heat of blowing can return to CPU, just takes away near fan CPU's heat, and the CPU other parts can not obtain effectual heat dissipation, and then leads to test equipment's system collapse crash to crash etc. influence efficiency of software testing's defect.

In order to solve the technical problem, the utility model provides a heat abstractor based on CPU, include

The CPU comprises a base plate, a CPU and a CPU, wherein the base plate is provided with a storage hole, a mounting rack is arranged above the storage hole, and the CPU is positioned in the mounting rack;

the heat dissipation module comprises an air guide groove, the air guide groove is inserted in the mounting frame, a first fan is installed at one end of the air guide groove, the other end of the air guide groove is located on one side of the CPU, the two ends of the air guide groove are arranged in a sealed mode, a second fan is installed on one side of the air guide groove, the second fan is arranged on the mounting frame and located above the CPU, and an air flow channel is formed among the first fan, the air guide groove and the second fan.

In an embodiment of the present invention, the mounting rack includes a support frame installed on two sides of the article placing hole, and an article placing frame is disposed on the support frame, and a first placing hole for clamping the air guiding groove and a second placing hole for installing the second fan are disposed on the article placing frame.

In an embodiment of the present invention, a plurality of bar-shaped holes are provided between the first placing hole and the second placing hole.

In an embodiment of the present invention, the bottom plate is disposed on one side of the mounting frame, and the PCB is mounted on the other side of the mounting frame, the plurality of groups of CPUs are disposed on the PCB, and the plurality of groups of CPUs pass through the object placing hole located in the mounting frame.

The utility model discloses an in one embodiment, the guide duct includes first wind gap and second wind gap, first wind gap installation first fan, the second wind gap cover in one side of CPU.

In an embodiment of the present invention, the width of the first tuyere is greater than the width of the second tuyere, and one side of the air guiding groove is an inclined plane.

In an embodiment of the present invention, the first fan is an induced draft fan, and the second fan is a blowing fan.

In an embodiment of the present invention, the first fan is a blowing fan, and the second fan is a suction fan.

A test apparatus comprising a CPU-based heat sink as described in any preceding embodiment.

The utility model discloses an in one embodiment, including the test cabinet, be provided with the anchor clamps case on the test cabinet, be provided with in the anchor clamps incasement the heat abstractor based on CPU.

Compared with the prior art, the technical scheme of the utility model have following advantage:

CPU-based heat abstractor and test equipment, CPU is located the mounting bracket, be equipped with the wind-guiding groove on the mounting bracket, and seal the setting between the both ends in wind-guiding groove, then can form airflow channel between first fan, wind-guiding groove, the second fan, take away the heat on the multiunit CPU, avoid the heat to exert an influence to CPU once more, can obtain effectual heat dissipation, reduce the probability that leads to the crash and die of test equipment system because of the heat, and then improve efficiency of software testing, avoid damaging test element, reduce cost. Specifically, when the first fan on the air guide groove is a blowing fan and the second fan is an air draft fan, the air of the first fan is concentrated into the air guide groove and brought to the CPU along with the air guide groove, the air quantity of the first fan effectively cools the CPU, the heat of the CPU is pumped to the outside through the second fan, and the heat is prevented from affecting the CPU again; when the second fan on the air guide groove is a blowing fan, and the first fan is an air draft fan, the wind of the second fan directly blows the CPU, the blown heat is pumped to the outside through the first fan, airflow circulation is achieved, the CPU is effectively cooled, the system of the testing equipment is prevented from being crashed due to large heat and high temperature, the testing efficiency is improved, the testing element is prevented from being damaged, and the cost is reduced.

Drawings

In order to make the content of the invention more clearly understood, the invention will now be described in further detail with reference to specific embodiments thereof, in conjunction with the accompanying drawings, in which

Fig. 1 is a schematic structural diagram of the CPU-based heat dissipation apparatus of the present invention;

FIG. 2 is a schematic structural view of an air guiding groove and a supporting frame in the CPU-based heat dissipation device of the present invention;

FIG. 3 is a schematic structural diagram of the testing apparatus of the present invention;

description reference numbers indicate: 1. a base plate; 11. placing an object hole; 2. a mounting frame; 21. a support frame; 22. a shelf; 221. a first placing hole; 222. a second placing hole; 223. a strip-shaped hole; 3. a PCB board; 31. a CPU; 4. a heat dissipation module; 41. a wind guide groove; 411. a first tuyere; 412. a second tuyere; 42. a first fan; 43. a second fan; 5. a test cabinet; 6. and a clamp box.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Referring to fig. 1 and fig. 2, the utility model provides a CPU-based heat dissipation device, which comprises a bottom plate 1 and a heat dissipation module 4, wherein the bottom plate 1 is provided with an object placing hole 11, an installation frame 2 is arranged above the object placing hole 11, and a CPU31 is positioned in the installation frame 2; the heat dissipation module 4 includes an air guiding groove 41, the air guiding groove 41 is inserted into the mounting rack 2, a first fan 42 is installed at one end of the air guiding groove 41, the other end of the air guiding groove 41 is located at one side of the CPU31, the air guiding groove 41 is sealed at two ends, a second fan 43 is installed at one side of the air guiding groove 41, the second fan 43 is installed on the mounting rack 2 and located above the CPU31, and an air flow channel is formed among the first fan 42, the air guiding groove 41 and the second fan 43.

This heat abstractor based on CPU is middle and upper multiunit CPU31 is located mounting bracket 2, be equipped with wind-guiding groove 41 on mounting bracket 2, and seal the setting between the both ends of wind-guiding groove 41, then first fan 42, wind-guiding groove 41, can form airflow channel between the second fan 43, take away the heat on the multiunit CPU31, avoid the heat to exert an influence to CPU31 once more, can obtain effectual heat dissipation, reduce the probability that leads to the test equipment system collapse crash to die because of the heat, and then improve efficiency of software testing, avoid damaging test element, and therefore, the cost is reduced. Specifically, when the first fan 42 on the air guiding groove 41 is a blowing fan and the second fan 43 is a suction fan, the air of the first fan 42 is concentrated into the air guiding groove 41 and brought to the CPU31 along with the air guiding groove 41, the air volume of the first fan 42 effectively cools the CPU31, and the heat of the CPU31 is pumped to the outside by the second fan 43, so as to avoid the heat from affecting the CPU31 again; when the second fan 43 on the air guide groove 41 is a blowing fan and the first fan 42 is an air draft fan, the wind of the second fan 43 directly blows the CPU31, and the blown heat is pumped to the outside through the first fan 42, so that the air flow circulation is realized, the CPU31 is effectively cooled, and further, the temperature is reduced, the system of the testing device is prevented from being crashed due to large heat and high temperature, the testing efficiency is improved, the testing element is prevented from being damaged, and the cost is reduced.

The mounting rack 2 includes support frames 21 installed on two sides of the placement hole 11, the support frames 21 are fixed on the bottom plate 1 and serve as a support part of the whole heat dissipation module 4, the two support frames 21 are provided with a placement frame 22, and the placement frame 22 is provided with a first placement hole 221 for clamping the air guide groove 41 and a second placement hole 222 for installing the second fan 43. Specifically, the air inlet of the air guiding groove 41 is aligned to the CPU31, so that the CPU31 can effectively dissipate heat, the position of the air guiding groove 41 is fixed, namely, the air guiding groove 41 is detachably connected with the storage rack 22 through a bolt, the storage rack 22 is detachably connected with the support frame 21, the storage rack 22 is installed above the multiple groups of CPUs 31, the air guiding groove 41, the first fan 42 and the second fan 43 can be conveniently installed, and further the heat dissipation of the multiple groups of CPUs 31 can be realized.

Specifically, a plurality of strip-shaped holes 223 are formed between the first placing hole 221 and the second placing hole 222, so that heat can be emitted upwards, and the storage of heat of the CPU31 is reduced.

In this embodiment, one side of the bottom plate 1 is provided with the mounting frame 2, the other side is provided with the PCB 3, the PCB 3 is provided with a plurality of groups of CPUs 31, and the plurality of groups of CPUs 31 pass through the object placing holes 11 and are positioned in the mounting frame 2. Multiunit CPU31 is a CPU31 piece, and is concrete, be equipped with a plurality of CPU31 pieces on PCB board 3, can set up this heat abstractor on whole CPU31 piece, concentrate many CPU31 and carry out the heat dissipation treatment, and is timely, effectually dispel the heat to CPU31 piece, and then the cooling, reduce the heat to test system's influence, avoid operations such as maintenance, improve detection efficiency, further improve test system's life, also can avoid the damage to being surveyed the component, and the cost is reduced.

Further, the air guiding groove 41 includes a first air opening 411 and a second air opening 412, the first air opening 411 is used for installing the first fan 42, the second air opening 412 covers one side of the CPU31, that is, the second air opening 412 covers one side of the CPU31, and a space between the first air opening 411 and the second air opening 412 is in a closed state, so that the air of the first fan 42 is fully utilized.

Specifically, the width of the first air opening 411 is greater than the width of the second air opening 412, and one side of the air guiding groove 41 is an inclined plane, so that the air of the first fan 42 acts on the CPU31 along with the inside of the air guiding groove 41.

The first fan 42 may be an air-drawing fan, the second fan 43 is an air-blowing fan, the second fan 43 blows the multiple groups of CPUs 31 for heat dissipation, and the first fan 42 draws heat to the outside through the air guide slot 41 to realize air circulation, so as to more effectively dissipate heat of the multiple groups of CPUs 31 and realize cooling.

The first fan 42 may be a blowing fan, and the second fan 43 may be a suction fan, and the first fan 42 concentrates the wind into the wind guide groove 41, and directly blows the wind through the second wind port 412 to dissipate the heat of the CPU31, and the second fan 43 brings the hot wind blown by the first fan 42 to the outside, thereby achieving the circulation of the air flow and effectively dissipating the heat of the plurality of sets of CPUs 31.

In addition, please refer to fig. 3, the present invention further provides a testing apparatus, which includes a heat dissipation device based on the CPU. Specifically, including test cabinet 5, be provided with anchor clamps case 6 on the test cabinet 5, be provided with the heat abstractor based on CPU in the anchor clamps case 6, through the effective heat dissipation of 4 multiunit CPU31 of heat dissipation module in the heat abstractor based on CPU for test equipment's system can avoid collapsing the crash etc. because of the heat, provides test equipment's efficiency of software testing, can avoid damaging simultaneously by the survey component, reduce cost consumption.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Various other modifications and alterations will occur to those skilled in the art upon reading the foregoing description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. A kind of heat dissipating double-fuselage based on CPU, characterized by that: comprises that

2. The CPU-based heat sink of claim 1, wherein: the mounting rack comprises support frames arranged on two sides of the object placing hole, article placing frames are arranged on the two support frames, and a first placing hole used for clamping the air guide groove and a second placing hole used for mounting the second fan are formed in each article placing frame.

3. The CPU-based heat sink of claim 2, wherein: a plurality of strip-shaped holes are formed between the first placing hole and the second placing hole.

4. The CPU-based heat sink of claim 1, wherein: the bottom plate one side sets up the mounting bracket, the PCB board is installed to the another side, set up the multiunit CPU on the PCB board, the multiunit CPU passes put the thing hole and is located in the mounting bracket.

5. The CPU-based heat sink of claim 1, wherein: the air guide groove comprises a first air opening and a second air opening, the first air opening is provided with the first fan, and the second air opening covers one side of the CPU.

6. The CPU-based heat sink of claim 5, wherein: the width of the first air opening is larger than that of the second air opening, and one side of the air guide groove is an inclined plane.

7. The CPU-based heat sink of claim 1, wherein: the first fan is an air-draft fan, and the second fan is an air-blowing fan.

8. The CPU-based heat sink of claim 1, wherein: the first fan is a blowing fan, and the second fan is a suction fan.

9. A test apparatus, characterized by: comprising the CPU-based heat sink of any one of claims 1-8.

10. The test apparatus of claim 9, wherein: the test cabinet is provided with a clamp box, and the clamp box is internally provided with the heat dissipation device based on the CPU.