CN218603489U

CN218603489U - Optical module, photoelectric conversion module, electric processing module and optical communication equipment

Info

Publication number: CN218603489U
Application number: CN202221494003.1U
Authority: CN
Inventors: 刘伟; 陈留勇; 苏长征; 于飞
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-06-15
Filing date: 2022-06-15
Publication date: 2023-03-10
Anticipated expiration: 2032-06-15

Abstract

The embodiment of the invention discloses an optical module, a photoelectric conversion module, an electric processing module and optical communication equipment, which are used for realizing flexible collocation of optical module structures and effectively ensuring that an optical transmitting assembly and an optical receiving assembly can be matched with the optical module with increased channel number. The embodiment of the invention provides an optical module, which comprises a first circuit board, a second circuit board and a connecting plate, wherein the first circuit board comprises a light emitting component and a light receiving component; the first circuit board and the second circuit board are fixed on the connecting plate, and the connecting plate is used for aligning the first connecting port and the second connecting port; the first connection port and the second connection port are connected through a lead.

Description

Optical module, photoelectric conversion module, electric processing module and optical communication equipment

Technical Field

The present application relates to the field of optical communications, and in particular, to an optical module, a photoelectric conversion module, an electrical processing module, and an optical communication apparatus.

Background

With the continuous development of communication technology, the capacity of information transmitted in communication is larger and larger, and the capacity of information transmitted can be effectively increased by adopting an optical communication system. The optical communication system comprises a network device and an optical module connected with the network device, and the optical module is also connected with an optical cable. The optical module comprises an optical receiving component used for carrying out photoelectric conversion on an optical signal from the optical cable so as to send the converted electric signal to the network equipment. The optical module includes an optical transmit assembly for performing electrical-to-optical conversion on electrical signals from the network device to transmit the converted optical signals to the optical cable.

Optical modules include Printed Circuit Board Assemblies (PCBA), which may include optical digital signal processors (dsps), drivers (DRV), transimpedance amplifiers (TIA), microcontrollers (MCU), etc. for electrical signal processing. The optical module includes an optical transmitter module and an optical receiver module, which are packaged on the PCBA in a chip-on-board (COB) manner.

However, the light emitting element and the light receiving element are directly packaged on the PCBA, which results in a fixed structure between the light emitting element and the PCBA and a fixed structure between the light receiving element and the PCBA, and the light emitting element and the light receiving element cannot be flexibly matched with the PCBA, so that the structure of the optical module is limited. With the increasing demand for the number of channels supported by the optical module, the optical transmitting module and the optical receiving module cannot be matched with the optical module with the increased number of channels.

SUMMERY OF THE UTILITY MODEL

The embodiment of the invention provides an optical module, a photoelectric conversion module, an electric processing module and optical communication equipment, which are used for realizing flexible collocation of optical module structures and effectively ensuring that an optical transmitting assembly and an optical receiving assembly can be matched with the optical module with increased channel number.

A first aspect of an embodiment of the present invention provides an optical module, where the optical module includes a first circuit board, a second circuit board, and a connection board, the first circuit board includes a light emitting component and a light receiving component, the second circuit board includes a processing unit, the first circuit board further includes a first connection port, the second circuit board further includes a second connection port, the light emitting component and the light receiving component are respectively connected to the first connection port, and the processing unit is connected to the second connection port; the first circuit board and the second circuit board are fixed on the connecting plate, and the connecting plate is used for aligning the first connecting port and the second connecting port; the first connection port and the second connection port are connected through a lead.

By adopting the optical module shown in the aspect, the first connection port and the second connection port are aligned through the connection plate, the successful connection between the first connection port and the second connection port through the lead wire is ensured, and the thread length of the lead wire connected between the first connection port and the second connection port is reduced. The reduction of the thread length reduces the attenuation of the electric signals transmitted between the first connecting port and the second connecting port, improves the quality of the electric signals, improves the transmission efficiency of the transmitted electric signals, and effectively ensures that the light emitting assembly and the light receiving assembly can be matched with the optical module with the increased number of channels.

Based on the first aspect, in an optional implementation manner, the connecting plate, configured to align the first connection port and the second connection port, includes: the first connection port comprises a first high-speed interface, the second connection port comprises a second high-speed interface, the first high-speed interface is any one high-speed interface included in the first connection port, the second high-speed interface is one high-speed interface included in the second connection port, and the connection board is used for aligning the first high-speed interface and the second high-speed interface; the first connection port comprises a first low-speed interface, the second connection port comprises a second low-speed interface, the first low-speed interface is any one low-speed interface included in the first connection port, the second low-speed interface is one low-speed interface included in the second connection port, and the connecting plate is used for aligning the first low-speed interface and the second low-speed interface.

By adopting the optical module shown in the implementation mode, the first high-speed interface and the second high-speed interface are aligned through the connecting plate, and the first low-speed interface and the second low-speed interface are aligned through the connecting plate, so that the successful connection and the connection efficiency between the first connecting port and the second connecting port through the lead are ensured, the thread of the lead is reduced, and the manufacturing efficiency of the optical module is improved.

Based on the first aspect, in an optional implementation manner, the lead includes a first lead and a second lead, and the connecting between the first connection port and the second connection port by the lead includes: the first high-speed interface is connected with the second high-speed interface through the first lead wire, and the first low-speed interface is connected with the second low-speed interface through the second lead wire.

By adopting the optical module shown in the implementation mode, the aligned first high-speed interface and the aligned second high-speed interface are connected through the first lead, and the aligned first low-speed interface and the aligned second low-speed interface are connected through the second lead, so that the threads of the first lead and the second lead are reduced.

In an optional implementation manner based on the first aspect, an electrical signal transmission rate supported by the first lead is greater than an electrical signal transmission rate supported by the second lead.

With the optical module shown in this implementation, the first lead is different from the second lead, where the attenuation of the electrical signal in the second lead is greater than the attenuation of the electrical signal in the first lead, and thus the transmission rate of the electrical signal in the second lead is less than the transmission rate of the electrical signal in the first lead. The second lead is used for transmitting electrical signals with a relatively low transmission rate, and the second lead does not need to support high-speed electrical signal transmission under the condition of high cost, so that the cost of the second lead is effectively reduced, and the overall cost of the optical module is further reduced.

Based on the first aspect, in an optional implementation manner, in the first connection port, the first low-speed interface is located between two first high-speed interfaces that are located adjacently, and in the second connection port, the second low-speed interface is located between two second high-speed interfaces that are located adjacently.

With the optical module shown in this implementation manner, since the rate of the electrical signal transmitted by the first high-speed interface is greater than the rate of the electrical signal transmitted by the first low-speed interface, the first low-speed interface can play a shielding role to a certain extent between two adjacent first high-speed interfaces at the first low-speed interface, so as to reduce crosstalk between the electrical signals respectively transmitted by the two first high-speed interfaces.

Based on the first aspect, in an optional implementation manner, the first high-speed interface includes a first pin and a second pin, the first pin is connected to the light emitting assembly, and the second pin is grounded; the second high-speed interface comprises a third pin and a fourth pin, the third pin is respectively connected with the first pin and the processing unit, and the fourth pin is respectively connected with the second pin and the processing unit; the third pin is used for receiving a first electrical signal from the processing unit, the fourth pin is used for receiving a second electrical signal from the processing unit, and the first electrical signal and the second electrical signal are a pair of differential electrical signals.

With the optical module shown in this implementation manner, when the second circuit board outputs a pair of differential electrical signals, the optical transmission module only supporting single-ended driving can also perform electro-optical conversion on the electrical signals from the processing unit to emit service optical signals. Different second circuit boards do not need to be matched aiming at the single-end driven light emitting assembly, and flexible matching between the first circuit board and the second circuit board is guaranteed.

Based on the first aspect, in an optional implementation manner, the first high-speed interface includes a fifth pin and a sixth pin, and both the fifth pin and the sixth pin are connected to a light emitting component; the second high-speed interface comprises a seventh pin and an eighth pin, the seventh pin is respectively connected with the fifth pin and the processing unit, and the eighth pin is respectively connected with the sixth pin and the processing unit; the seventh pin is configured to receive a third electrical signal from the processing unit, the eighth pin is configured to receive a fourth electrical signal from the processing unit, and the third electrical signal and the fourth electrical signal are a pair of differential electrical signals.

By adopting the optical module shown in the implementation mode, the optical transmission assembly is driven through the differential electrical signal, and the optical transmission assembly can support optical signal transmission at a higher rate compared with the optical transmission assembly driven through a single-ended electrical signal.

Based on the first aspect, in an optional implementation manner, the plate material of the first circuit board is different from the plate material of the second circuit board, and the electrical signal transmission rate supported by the first circuit board is smaller than the electrical signal transmission rate supported by the second circuit board.

With the optical module shown in this implementation manner, the transmission rate of the electrical signal supported by the first circuit board is less than that of the electrical signal supported by the second circuit board. The first board of the first circuit board does not need to adopt a board supporting high-rate transmission of electric signals, so that the cost of the first circuit board is effectively reduced, and the integral manufacturing cost of the optical module is further reduced.

Based on the first aspect, in an optional implementation manner, the fixing of the first circuit board and the second circuit board to the connecting board includes: the two sides of the same surface of the connecting plate respectively comprise a first area and a second area, the first area comprises a first positioning piece, the first positioning piece is used for fixing the first circuit board in the first area, the second area comprises a second positioning piece, and the second positioning piece is used for fixing the second circuit board in the second area.

By adopting the optical module shown in the implementation mode, the first connection port and the second connection port can be accurately aligned, the thread of the lead wire for connecting the first connection port and the second connection port is effectively reduced, and the connection accuracy and efficiency are improved.

Based on the first aspect, in an optional implementation manner, the first circuit board includes a first sub-board and a second sub-board, the first connection port includes a first sub-connection port and a second sub-connection port, the first sub-board includes the light emitting component and the first sub-connection port, the second sub-board includes the light receiving component and the second sub-connection port, the light emitting component is connected to the first sub-connection port, and the light receiving component is connected to the second sub-connection port; the connection plate is used for aligning the first sub-connection port and the second connection port, and the connection plate is also used for aligning the second sub-connection port and the second connection port; the first sub-connection port is connected with the second connection port through a lead, and the second sub-connection port is connected with the second connection port through a lead.

By adopting the optical module shown in the implementation mode, the first daughter board and the second daughter board can be independently processed respectively, the manufacturing process of the optical module is further reduced, the first daughter board and the second daughter board can be independently tested respectively, and other processes are carried out, so that the first daughter board and the second daughter board are guaranteed to be good products which can normally work independently, and the product yield of the optical module is effectively improved.

Based on the first aspect, in an optional implementation manner, the first circuit board further includes a driver and/or an amplifier, where the driver is connected to the light emitting component and the first connection port, respectively, and the amplifier is connected to the light receiving component and the first connection port, respectively.

With the optical module shown in this implementation manner, when the first circuit board further includes a driver and/or an amplifier, the power of the electrical signal transmitted by the first circuit board is relatively high, and the signal quality is relatively good. The area and cost of the second circuit board are saved.

Based on the first aspect, in an optional implementation manner, the light emitting component and the first connection port are respectively connected to the driver through a first conductive component, and an electrical signal transmission rate supported by the first conductive component is greater than an electrical signal transmission rate supported by the first circuit board; the light receiving assembly and the first connection port are connected with the amplifier through second conductive pieces respectively, and the transmission rate of the electric signals supported by the second conductive pieces is greater than that of the electric signals supported by the first circuit board.

In the optical module shown in the implementation manner, the electric signal transmitted by the driver or the amplifier is a high-speed electric signal, and in order to reduce the cost of the first circuit board, the transmission path of the service electric signal transmitted by the driver or the amplifier does not need to be routed by the first circuit board, and is independent of the conductive piece which is independently arranged on the routing of the first circuit board, so that the optical module can adopt the first circuit board with a lower supported electric signal transmission rate, and the cost of the first circuit board is reduced.

A second aspect of the embodiments of the present invention provides a photoelectric conversion module, including a first circuit board, where the first circuit board includes a light emitting component and a light receiving component, the first circuit board further includes a first connection port, and the light emitting component and the light receiving component are respectively connected to the first connection port; the first circuit board is used for being fixed on a connecting board, the connecting board is also used for fixing a second circuit board, and the first connecting port and a second connecting port included by the second circuit board are aligned through the connecting board; the first connection port and the second connection port are connected through a lead. For the description of the beneficial effects of this aspect, please refer to the description in the first aspect, which is not repeated herein.

Based on the second aspect, in an optional implementation manner, the first connection port includes a first high-speed interface, the first high-speed interface is any one of high-speed interfaces included in the first connection port, and the first high-speed interface is aligned with a second high-speed interface included in the second connection port through the connection board; the first connection port comprises a first low-speed interface, the first low-speed interface is any one low-speed interface included in the first connection port, and the first low-speed interface is aligned with a second low-speed interface included in the second connection port through the connection plate.

Based on the second aspect, in an optional implementation manner, the first high-speed interface and the second high-speed interface are connected by the first lead, and the first low-speed interface and the second low-speed interface are connected by the second lead.

Based on the second aspect, in an optional implementation manner, the first lead supports a higher electrical signal transmission rate than the second lead supports.

In an optional implementation manner based on the second aspect, in the first connection port, the first low-speed interface is located between two first high-speed interfaces that are located adjacently.

Based on the second aspect, in an optional implementation manner, the first high-speed interface includes a first pin and a second pin, the first pin is connected with the light emitting component, and the second pin is grounded; the first pin is used for receiving a first electric signal from the second high-speed interface, the second pin is used for receiving a second electric signal from the second high-speed interface, and the first electric signal and the second electric signal are a pair of differential electric signals.

Based on the second aspect, in an optional implementation manner, the first circuit board includes a first sub-board and a second sub-board, the first connection port includes a first sub-connection port and a second sub-connection port, the first sub-board includes the light emitting component and the first sub-connection port, the second sub-board includes the light receiving component and the second sub-connection port, the light emitting component is connected to the first sub-connection port, and the light receiving component is connected to the second sub-connection port; the first sub-connection port and the second connection port are aligned by the connection plate, and the second sub-connection port and the second connection port are aligned by the connection plate; the first sub-connection port is connected with the second connection port through a lead, and the second sub-connection port is connected with the second connection port through a lead.

Based on the second aspect, in an optional implementation manner, the first circuit board further includes a driver and/or an amplifier, where the driver is connected to the light emitting component and the first connection port, respectively, and the amplifier is connected to the light receiving component and the first connection port, respectively.

Based on the second aspect, in an optional implementation manner, the light emitting component and the first connection port are respectively connected to a driver through a first conductive component, and an electrical signal transmission rate supported by the first conductive component is greater than an electrical signal transmission rate supported by the first circuit board; the light receiving assembly and the first connection port are connected with the amplifier through second conductive pieces respectively, and the transmission rate of the electric signals supported by the second conductive pieces is greater than that of the electric signals supported by the first circuit board.

A third aspect of the embodiments of the present invention provides an electrical processing module, where the electrical processing module includes a second circuit board, the second circuit board includes a processing unit, the second circuit board further includes a second connection port, and the processing unit is connected to the second connection port; the second circuit board is used for being fixed on a connecting board, the connecting board is also used for fixing a first circuit board, and the second connecting port is aligned with a first connecting port included in the first circuit board through the connecting board; the first connection port and the second connection port are connected through a lead. For an explanation of the beneficial effects of this aspect, please refer to the first aspect, which is not described in detail.

Based on the third aspect, in an optional implementation manner, the second connection port includes a second high-speed interface, the second high-speed interface is a high-speed interface included in the second connection port, and the second high-speed interface is aligned with the first high-speed interface included in the first connection port through the connection board; the second connection port includes a second low-speed interface, which is a low-speed interface included in the second connection port, and the second low-speed interface is aligned with the first low-speed interface included in the first connection port through the connection board.

Based on the third aspect, in an optional implementation manner, the first high-speed interface and the second high-speed interface are connected by the first lead, and the first low-speed interface and the second low-speed interface are connected by the second lead.

Based on the third aspect, in an optional implementation manner, the first lead supports a higher electrical signal transmission rate than the second lead supports.

In an optional implementation manner based on the third aspect, in the second connection port, the second low-speed interface is located between two adjacent second high-speed interfaces.

A fourth aspect of the embodiments of the present invention provides an optical communications device, where the optical communications device includes a communications board, and the optical communications device further includes at least one optical module connected to the communications board, where the optical module is as described in any of the above first aspects.

Drawings

Fig. 1 is a diagram illustrating a structure of an embodiment of an optical communication system according to an embodiment of the present application;

fig. 2a is a diagram illustrating a structure of a first embodiment of an optical communication device according to an embodiment of the present application;

fig. 2b is a diagram illustrating a second example structure of an optical communication device according to an embodiment of the present application;

fig. 3a is a side view structural example of a first embodiment of an optical module according to an embodiment of the present disclosure;

FIG. 3b is a schematic diagram of an exemplary top view of the optical module shown in FIG. 3 a;

FIG. 3c is a schematic diagram of an exemplary top view of a portion of the optical module shown in FIG. 3 b;

FIG. 4 is a diagram illustrating an example alignment of a first connection port and a second connection port provided by an embodiment of the present application;

FIG. 5a is a structural illustration of a connection plate according to a first embodiment of the present disclosure;

FIG. 5b is a diagram illustrating a structure of the connection board shown in FIG. 5a to which a first circuit board is fixed;

FIG. 5c is a view showing an example of a structure in which the first circuit board and the second circuit board are fixed to the connection board shown in FIG. 5 a;

FIG. 6a is a diagram illustrating a second exemplary structure of a connecting plate according to an embodiment of the present disclosure;

FIG. 6b is a diagram illustrating a structure of the connection board shown in FIG. 6a to which a first circuit board has been fixed;

FIG. 6c is a view showing an example of a structure in which the first circuit board and the second circuit board are fixed to the connection board shown in FIG. 6 a;

FIG. 7 is a diagram illustrating a side view structure of a second optical module according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of a first embodiment of a top view structure of an optical module according to an embodiment of the present application;

fig. 9 is a diagram illustrating an exemplary structure of a low-speed interface of the optical module shown in fig. 8;

fig. 10 is a schematic diagram illustrating a top view structure of a second embodiment of an optical module according to an embodiment of the present application;

fig. 11 is a schematic diagram of a top view structure of a third embodiment of an optical module according to an embodiment of the present application;

fig. 12 is a schematic diagram illustrating a top view structure of a fourth embodiment of an optical module according to an embodiment of the present application;

fig. 13 is a schematic diagram illustrating a top view structure of a fifth embodiment of an optical module according to an embodiment of the present application;

fig. 14 is a diagram illustrating a first application scenario of a photoelectric conversion module according to an embodiment of the present application;

fig. 15 is a diagram illustrating a second application scenario of a photoelectric conversion module according to an embodiment of the present application;

fig. 16 is a diagram illustrating a third application scenario of a photoelectric conversion module according to an embodiment of the present application;

fig. 17 is a flowchart illustrating a step of an assembly method according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

First, a structure of an optical communication system applied in the present application is described with reference to fig. 1, where fig. 1 is a diagram illustrating a structure of an embodiment of an optical communication system provided in an embodiment of the present application. The optical communication system 100 shown in this embodiment includes a convergence device 101 and one or more terminal devices 102, and the number of the terminal devices 102 included in the optical communication system 100 is not limited in this embodiment. Each terminal device 102 included in the optical communication system 100 is connected to the aggregation device 101.

The optical communication system 100 shown in the present embodiment may be a Passive Optical Network (PON), and then the aggregation device 101 is an Optical Line Terminal (OLT). The terminal device 102 is an Optical Network Unit (ONU). The aggregation device 101 shown in this embodiment may be directly connected to each terminal device 102, or the aggregation device 101 may be connected to each terminal device 102 through a point-to-multipoint optical splitter. The description of the type of the optical communication system 100 in this embodiment is an optional example, and is not limited, for example, the optical communication system 100 may also be an industrial optical network, a data center network, a wavelength division multiplexing network, or an Optical Transport Network (OTN).

The structure of the optical communication device provided in the embodiment of the present application is described with reference to fig. 2a, where fig. 2a is a diagram illustrating a structure of a first embodiment of the optical communication device provided in the embodiment of the present application. The optical communication device shown in this embodiment may be the convergence device 101 shown in fig. 1 or the terminal device 102 shown in fig. 1. The embodiment does not limit the specific device type of the optical communication device, and the optical communication device may also be a router, a switch, a server, or an OTN transmission device, for example.

The optical communication device specifically includes a network device 201 and an optical module inserted and fixed on a panel of the network device 201. The optical module shown in this embodiment may also be referred to as a high-speed pluggable optical module. In this embodiment, the number of the optical modules inserted into the panel of the network device 201 is two, and the

optical modules

203 and 204 are taken as examples, and it should be clear that the number of the optical modules inserted into the panel of the network device 201 is not limited in this embodiment. The optical module 203 is connected to the communication board 211 in the network device 201, and the optical module 204 is connected to the communication board 212 in the network device 201, and it should be clear that the number of the communication boards included in the network device 201 is not limited in this embodiment. In this embodiment, the number of the optical modules connected to each communication board included in the network device 201 is not limited.

For example, if the network device 201 is a convergence device shown in fig. 1, and the network device 201 is configured to send a downlink traffic optical signal to the terminal device, the communication board 211 generates a downlink traffic electrical signal and sends the downlink traffic electrical signal to the optical module 203. The optical module 203 performs an electrical-to-optical conversion on the downlink traffic electrical signal to obtain a downlink traffic optical signal. The optical module 203 transmits the downlink traffic optical signal to the terminal device through an optical cable connected between the optical module 203 and the terminal device. As another example, if the network device 201 is a convergence device and the network device 201 is configured to receive an uplink traffic optical signal from a terminal device, the optical module 204 of the network device 201 receives the uplink traffic optical signal via an optical cable connected between the optical module 204 and the terminal device. The optical module 204 performs photoelectric conversion on the uplink service optical signal to obtain an uplink service electrical signal, and the optical module 204 sends the uplink service electrical signal to the communication board 212. The communications board 212 processes the uplink traffic electrical signal. If the network device 201 shown in this embodiment is a terminal device, the network device 201 receives a downlink service optical signal from the convergence device and sends an uplink service optical signal to the convergence device, please refer to the above description of the network device 201 being a convergence device, which is not described in detail.

Continuing to refer to fig. 2b, fig. 2b is a diagram illustrating a second exemplary structure of an optical communication device according to an embodiment of the present application. The optical communication device 220 shown in this embodiment may be the convergence device shown in fig. 1 or the terminal device shown in fig. 1. The optical communication device 220 includes a communication board therein, and the number of the communication boards included in the optical communication device 220 is not limited in this embodiment, and in this embodiment, the optical communication device 220 includes two communication boards, which are a communication board 222 and a communication board 224 respectively. The optical communication device 220 further includes an optical module 221 and an optical module 223 located inside the optical communication device 220. The optical module 221 is connected to the communications board 222, and the optical module 223 is connected to the communications board 224. The present embodiment does not limit the number of optical modules located inside the optical communication device 220 and the number of optical modules connected to each communication board. As can be seen from fig. 2a and 2b, the optical module shown in this embodiment may be inserted into a panel of a network device as shown in fig. 2a, and the optical module may also be located inside an optical communication device as shown in fig. 2 b.

The structure of the optical module provided in the present application is exemplarily described below with reference to fig. 3a, where fig. 3a is an exemplary diagram of a side view structure of a first embodiment of the optical module provided in the present application. The optical module 300 shown in the present embodiment includes a photoelectric conversion module 310, an electrical processing module 320, and a connection board 330. The connection board 330 is used to fix the photoelectric conversion module 310 and the electrical processing module 320. Specifically, the bottom surface of the photoelectric conversion module 310 and the bottom surface of the electrical processing module 320 are fixed to the connection board 330.

The specific structures of the photoelectric conversion module 310 and the electric processing module 320 are described with reference to fig. 3b and fig. 3c, wherein fig. 3b is a schematic diagram of a top view structure of an optical module according to an embodiment of the present application. Fig. 3c is a top view of a portion of the optical module shown in fig. 3 b. The photoelectric conversion module 310 shown in the present embodiment includes a first circuit board 311. The electric processing module 320 includes a second circuit board 321. The first circuit board 311 shown in the present embodiment may be a Printed Circuit Board (PCB). Specifically, the first circuit board includes one or more layers of boards, and the conductive traces are disposed on one or both sides of each board. For the description of the second circuit board 321, please refer to the description of the first circuit board 311, which is not repeated herein.

The first circuit board 311 includes a light emitting component 312 and a light receiving component 313. The optical module 300 also includes a fiber optic connector 306, the fiber optic connector 306 for connecting an external fiber optic cable 307 and an internal fiber optic cable 308. The outer optical cable 307 is located outside the housing of the optical module 300 and the inner optical cable 308 is located inside the housing of the optical module. For example, the optical module 300 is connected to a convergence device, and then one end of the external optical cable 307 is connected to the optical fiber connector 306, and the other end is connected to a terminal device. As another example, the optical module 300 is connected to a terminal device, and then one end of the external optical cable 307 is connected to the optical fiber connector 306, and the other end is connected to the convergence device. The inner optical cable 308 is connected to a light emitting assembly 312 and a light receiving assembly 313, respectively. The optical fiber connector 306 receives the service optical signal from the external optical cable 307, and transmits the service optical signal to the optical receiving module 313 via the internal optical cable 308. The optical receiving component 313 performs photoelectric conversion on the service optical signal to obtain a service electrical signal. Alternatively, the optical transmitting component 312 performs electrical-optical conversion on the service electrical signal from the communications board to obtain a service optical signal, the internal optical cable 308 receives the service optical signal from the optical transmitting component 312, and the internal optical cable 308 transmits the service optical signal to the external optical cable 307 via the optical fiber connector 306. The specific type of the optical fiber connector 306 shown in this embodiment may be any one of the following types, and it should be clear that the description of the type of the optical fiber connector 306 in this embodiment is an optional example and is not limited:

a push (MPO) type optical fiber connector, a Ferrule (FC) type optical fiber connector, a Square (SC) type optical fiber connector, a small square (LC) type optical fiber connector, a straight-through (ST) optical fiber connector, or an optical fiber distributed data Interface (IFDD) type optical fiber connector.

The second circuit board 321 of the electrical processing module 320 includes a processing unit 322, and the processing unit 322 is connected to the light emitting component 312 and the light receiving component 313 respectively. The form of the processing unit 322 is not limited in this embodiment, for example, the processing unit 322 may be one or more chips, or one or more integrated circuits, for example, the processing unit 322 may be one or more optical digital signal processors (opps), field-programmable gate arrays (FPGAs), application Specific Integrated Chips (ASICs), system chips (socs), central Processing Units (CPUs), network Processors (NPs), micro Controllers (MCUs), programmable Logic Devices (PLDs), or other integrated chips, or any combination of the above chips or processors, and the like, which are not specifically described herein.

The second circuit board 321 further includes a gold finger 323 connected to the processing unit 322, where the gold finger 323 is connected to a communication board in the optical communication device, and the gold finger 323 realizes the transceiving of the electrical signal between the processing unit 322 and the communication board.

For example, if the optical communication device is used to emit a service optical signal, the communication board of the optical communication device sends the service electrical signal to the processing unit 322 via the gold finger 323. The processing unit 322 is connected to the optical transmit assembly 312, the processing unit 322 transmits the processed service electrical signal to the optical transmit assembly 312, and the optical transmit assembly 312 performs electrical-optical conversion on the service electrical signal to output a service optical signal through the optical fiber connector 306. If the optical communication device is configured to receive a service optical signal, the optical receiving component 313 receives the service optical signal through the optical fiber connector 306, the optical receiving component 313 performs photoelectric conversion on the service optical signal to obtain a service electrical signal, and the processing unit 322 sends the processed service electrical signal to the communication board of the optical communication device through the gold finger 323. When the processing unit 322 acquires the service electrical signal, it performs signal processing on the service electrical signal, such as signal amplification, signal retiming, signal shaping, signal regeneration, signal encoding and decoding, and the like.

The following describes a specific manner of connecting the processing unit 322 to the light emitting module 312 and the light receiving module 313 respectively in this embodiment:

the first circuit board 311 shown in the present embodiment includes a first connection port 314, and the second circuit board 321 includes a second connection port 324. The light emitting module 312 and the light receiving module 313 are respectively connected to the first connection port 314, and the second connection port 324 is connected to the processing unit 322. The first connection port 314 and the second connection port 324 are connected by a lead wire. It will be appreciated that the light emitting assembly 312 is in turn connected to the processing unit 322 via the first connection port 314 and the second connection port 324. The light receiving module 313 is connected to the processing unit 322 via the first connection port 314 and the second connection port 324 in turn. Specifically, the first connection port 314 includes a plurality of pins, and the second connection port 324 includes a plurality of pins. Any one of the plurality of pins included in the first connection port 314 is connected to one of the pins included in the second connection port 324 by a wire. For example, the first connection port 314 includes pins A1, A2 to AN, and the second connection port 324 includes pins B1, B2 to BN, where N is any positive integer. Pin A1 is connected to pin B1 via a lead, pin A2 is connected to pin B2 via a lead, and so on, pin AN is connected to pin BN via a lead. The lead wire shown in this embodiment may be made of one or more of gold, aluminum, copper, steel, or nickel. For example, in the present embodiment, the lead A1 and the lead B1 are connected by gold wire bonding. Specifically, the gold wire bonding means that the lead A1 and the lead B1 are directly combined into a whole through gold wires based on a thermocompression bonding, an ultrasonic bonding or a thermocompression ultrasonic bonding, and the like.

The optical module shown in this embodiment further includes a connection board 330, the first circuit board 311 and the second circuit board 321 are fixed to the connection board 330, and the connection board 330 is used for aligning the first connection port 314 and the second connection port 324. Continuing with the above example, the alignment of first connection port 314 and second connection port 324 means that the position of pin A1 is aligned with the position of pin B1, the position of pin A2 is aligned with the position of pin B2, and so on, the position of pin AN is aligned with the position of pin BN. The alignment of the first connection port 314 and the second connection port 324 is described with reference to fig. 4, where fig. 4 is an exemplary view of the alignment of the first connection port and the second connection port provided in the embodiments of the present application. The first connection port 314 has a first orthographic projection 401 on the projection plane 400, and specifically, a projection beam perpendicular to the projection plane 400 is irradiated on the first connection port 314 to form the first orthographic projection 401 on the projection plane 400, wherein the projection plane 400 is a plane perpendicular to the connection board 330. The projection light beam includes a plurality of projection lines parallel to each other and perpendicular to the projection plane 400, and the transmission path of the projection light beam can completely cover the first connection port 314. The second connection port 324 has a second orthographic projection 402 on the projection plane 400, and for the description of the forming manner of the second orthographic projection 402, please refer to the description of the forming manner of the first orthographic projection 401, which is not described in detail. The first forward projection 401 and the second forward projection 402 at least partially coincide. In the example shown in fig. 4, the first forward projection 401 and the second forward projection 402 partially overlap on the projection plane 400, and in other examples, the first forward projection 401 and the second forward projection 402 may completely overlap on the projection plane 400.

The following describes the beneficial effects of the alignment of the first connection port 314 and the second connection port 324:

in this embodiment, the first connection port 314 and the second connection port 324 are aligned via the connection board 330, so as to avoid the relative position between the first connection port 314 and the second connection port 324 from being shifted or wrong, and ensure the successful connection between the first connection port 314 and the second connection port 324 through the lead wire. Under the condition that the first connection port 314 and the second connection port 324 are aligned, the thread length of a lead wire connected between the first connection port 314 and the second connection port 324 can be effectively reduced, and therefore the insertion loss of an electric signal transmitted between the first connection port 314 and the second connection port 324 is reduced. The thread length of the lead wire connected between the first connection port 314 and the second connection port 324 means the length of the lead wire connected between the first connection port 314 and the second connection port 324. The reduction of the thread length reduces the attenuation of the electric signals transmitted between the first connection port and the second connection port, improves the signal quality of the electric signals, and improves the transmission efficiency of the transmitted electric signals. Between the aligned first connection port 314 and the second connection port 324, mutual operation interference in the wire bonding process is avoided, the efficiency and accuracy of connecting the first connection port 314 and the second connection port 324 through wires are improved, and the situation that the first connection port 314 and the second connection port 324 cannot be connected through wires is avoided.

The following optionally describes the manner in which the connection board 330 fixes the photoelectric conversion module 310 and the electric processing module 320:

alternative mode 1

Referring to fig. 5a, fig. 5b and fig. 5c, wherein fig. 5a is a structural example diagram of a first embodiment of a connection plate according to an embodiment of the present application. Fig. 5b is a diagram illustrating a structure of the connection board shown in fig. 5a to which the first circuit board has been fixed. Fig. 5c is a diagram illustrating a structure in which the first circuit board and the second circuit board are fixed to the connection board shown in fig. 5 a. The connection board 330 has a surface 501 facing the photoelectric conversion module 310 and the electric processing module 320. The surface 501 has a first region 511 and a second region 512. The first region 511 is used for fixing the first circuit board 311, and the second region 512 is used for fixing the second circuit board 321. The first region 511 includes a first positioning element 513, and the first positioning element 513 is a limiting step protruding from the surface 501. A first ramp is formed between first locator 513 and first region 511. The second region 512 includes a second positioning element 514, and the second positioning element 514 is a limit step protruding from the surface 501. A second slide way is formed between the second positioning member 514 and the second region 512. A limiting surface is arranged between the first slide way and the second slide way. The two sides of the first circuit board 311 can slide along the guiding directions of the first sliding ways of the two first positioning members 513, respectively, until the end portion of the first circuit board 311 abuts against and is fixed to the limiting surface. The two sides of the second circuit board 321 can slide along the guiding directions of the second sliding ways of the two second positioning members 514 respectively until the end of the second circuit board 321 is fixed to the limiting surface.

In this embodiment, two sides of the first circuit board 311 are inserted into and fixed to the first sliding channel, two sides of the second circuit board 321 are inserted into and fixed to the second sliding channel, and the first circuit board 311 and the second circuit board 321 respectively abut against the limiting surfaces, so that the first circuit board 311 and the second circuit board 321 are fixed to the connecting plate 330, and the first connecting port 314 and the second connecting port 324 are aligned.

In order to improve the stability of the fixing structure of the first circuit board 311 and the second circuit board 321 on the connection board 330, the surface 501 of the connection board 330 and/or the surface of the first circuit board 311 facing the connection board 330 has an adhesive layer for adhesively fixing the first circuit board 311 on the surface 501. For the description that the second circuit board 321 is fixed on the surface 501 through the adhesive layer, please refer to the description that the first circuit board 311 is fixed on the surface 501 through the adhesive layer, which is not described in detail herein.

Alternative mode 2

Referring to fig. 6a, fig. 6b and fig. 6c, where fig. 6a is a diagram illustrating a structure of a connection plate according to a second embodiment of the present application. Fig. 6b is a structural example of the connection board shown in fig. 6a to which the first circuit board has been fixed. Fig. 6c is a diagram illustrating a structure in which the first circuit board and the second circuit board are fixed to the connection board shown in fig. 6 a. The connection plate 330 has a first region 611 and a second region 612 facing the surface 601 of the photoelectric conversion module 310 and the electrical processing module 320. The first region 611 is used for fixing the first circuit board 311, and the second region 612 is used for fixing the second circuit board 321. The first area 611 includes first positioning elements, which are first positioning pins 613 protruding from the surface 601, and the number of the first positioning pins 613 is not limited in this embodiment, for example, the first positioning pins 613 are distributed at positions opposite to the connecting plate 330 of the first circuit board 311. The second area 612 includes a second positioning element, which is a second positioning pin 614 protruding from the surface 601, for the description of the second positioning pin 614, please refer to the description of the first positioning pin 613, which is not repeated herein. The first circuit board 311 faces the surface 601, and a first positioning hole is disposed at a position opposite to each first positioning pin 613, and the first positioning pins 613 are inserted into and fixed in the first positioning holes, so as to fix the first circuit board 311 on the connecting plate 330. The second circuit board 311 faces the surface 601, and a second positioning hole is disposed at a position opposite to each second positioning pin 614, and the second positioning pin 614 is inserted into the second positioning hole to fix the second circuit board 311 on the connection board 330. In order to improve the stability of the structure, the first positioning pin 613 and the second positioning pin 614 are in interference fit.

In this embodiment, when the first positioning pin 613 is inserted and fixed in the first positioning hole and the second positioning pin 614 is inserted and fixed in the second positioning hole, the alignment between the first connection port 314 and the second connection port 324 can be effectively ensured.

In this embodiment, the stability of the structure that the first circuit board 311 and the second circuit board 321 are fixed on the connection board 330 can be further improved by an adhesive layer, and please refer to fig. 5a to 5c for the description of the adhesive layer, which is not repeated herein.

It should be clear that, this embodiment is used for realizing the description of the first positioning element and the second positioning element structure aligned with the first connection port and the second connection port, which is an optional example and is not limited, for example, the first positioning element and the second positioning element may both be a buckle, the first circuit board is provided with a slot for being fixed by being engaged with the buckle, and the second circuit board is also provided with a slot for being fixed by being engaged with the buckle. For example, the first circuit board 311 is fixed to the connection board first, and then the second circuit board 321 is fixed to the connection board, which is not limited. For another example, the first circuit board 311 and the second circuit board 321 may be fixed to the connection board at the same time. The first positioning member and the second positioning member have the same structure, and in other examples, the first positioning member and the second positioning member have different structures, for example, the first positioning member may have a positioning pin and the second positioning member may have a snap. The connecting plate shown in this embodiment may be a part of the optical module housing, or the connecting plate may be located inside the optical module housing and fixed inside the optical module housing.

The material of the connecting plate is not limited in the embodiment, and the connecting plate can achieve the purpose of firmly fixing the first circuit board and the second circuit board. For example, the connecting plate may be made of metal such as tungsten or copper, or may be made of non-metal such as ceramic. The number of the connection plates is not limited in this embodiment, and for example, the number of the connection plates may be one or more.

After the first circuit board 311 and the second circuit board 321 shown in this embodiment are fixed on the connection board 330, the first connection port 314 of the first circuit board 311 and the second connection port 324 of the second circuit board 321 are connected by a lead, so that the first circuit board 311 and the second connection board 302 are effectively prevented from being separated from the connection board 330. Even if the environment in which the optical module is located is changed violently, such as collision and falling, due to the fixing effect of the connecting plate on the first circuit board 311 and the second circuit board 321, the first circuit board 311 and the second connecting plate 302 are effectively prevented from being separated from the connecting plate 330, the lead wire connected between the first connecting port and the second connecting port is prevented from being broken, the stability of the connection relation between the first connecting port and the second connecting port is improved, the transmission of electric signals between the first connecting port and the second connecting port is effectively ensured, and further the safety and the service life of the optical module are ensured.

The optical module shown in the embodiment is characterized in that the photoelectric conversion module and the electric processing module are fixedly spliced through the connecting plate, before the optical module is spliced, the photoelectric conversion module and the electric processing module can be independently processed respectively, the manufacturing process of the optical module is reduced, and the photoelectric conversion module and the electric processing module can be independently tested respectively, so that the photoelectric conversion module and the electric processing module are guaranteed to be good products capable of normally working independently, and then the photoelectric conversion module and the electric processing module are fixedly spliced through the connecting plate, and the product yield of the optical module is effectively improved. The photoelectric conversion module and the electric processing module can be designed and distributed independently, so that the flexibility of the optical module structure is improved, and the flexible collocation of the optical module structure is realized.

If the photoelectric conversion module of the optical module breaks down, the photoelectric conversion module can be directly detached from the connecting plate, the lead connected between the first connecting port and the second connecting port is removed, the photoelectric conversion module of a good product is installed in the optical module in a replacement mode, and if the electric processing module breaks down, the electric processing module is directly detached from the connecting plate, the lead connected between the first connecting port and the second connecting port is removed, and the electric processing module of a good product is installed in the optical module in a replacement mode. Therefore, when the photoelectric conversion module or the electric processing module breaks down, the whole optical module does not need to be replaced, and only the broken photoelectric conversion module or the broken electric processing module needs to be replaced, so that the difficulty in maintaining the optical module, material loss and cost are reduced.

The first connecting port of the photoelectric conversion module and the second connecting port of the electric processing module are connected through the lead wires, so that the electric connection thread between the first connecting port and the second connecting port is effectively reduced, and the attenuation of electric signals transmitted between the first connecting port and the second connecting port is effectively reduced. For example, in a scenario where the number of channels of the electrical signal supported by the electrical processing module is increased, a photoelectric conversion module supporting a larger bandwidth may be connected to the electrical processing module to form an optical module. Therefore, in a scene that the number of channels of the electric signal is increased, the matching between the photoelectric conversion module and the electric processing module can be ensured, so that the normal work of the optical module is ensured. As another example, as digital economy has developed and traffic demands for production and living have increased explosively, the transmission rate of optical signals supported by optical modules has evolved to a high speed, for example, from 25 gigabits per second (Gbps) supported optical modules to 400Gbps. With the doubled transmission rate of the optical signals supported by the optical module, the photoelectric conversion module and the electric processing module can be connected to form the optical module after the transmission rate of the optical signals is increased in the scene, so that the optical module can work normally under the condition that the transmission rate of the optical signals is increased.

The first circuit board of the optical module shown in this embodiment includes a light emitting module and a light receiving module, and the second circuit board of the optical module includes a processing unit, and the second circuit board is configured to ensure that the processing unit can process an electrical signal from the light receiving module or process an electrical signal from a communication board and then send the processed electrical signal to the light emitting module, so that the second circuit board needs to support a larger transmission rate of the electrical signal. The first circuit board comprises a first plate, and the second circuit board comprises a second plate. In this embodiment, taking the first plate and the second plate as an example, attenuation of the electrical signal in the different first plate and second plate is different, which results in different transmission rates of the electrical signal in the different first plate and second plate. In this embodiment, for example, the attenuation of the electrical signal in the first plate is greater than the attenuation of the electrical signal in the second plate, and then the transmission rate of the electrical signal in the first plate is less than the transmission rate of the electrical signal in the second plate. It is understood that the first circuit board supports a lower rate of electrical signal transmission than the second circuit board. Under the condition that the transmission rate of the electrical signals supported by the second circuit board is relatively high, normal processing and transmission of the electrical signals by the processing unit can be effectively ensured. Under the condition that the electric signal transmission rate supported by the first circuit board is less than the electric signal transmission rate supported by the second circuit board, the first plate of the first circuit board does not need to adopt a plate supporting high-rate transmission of electric signals, the cost of the first circuit board is effectively reduced, and the integral manufacturing cost of the optical module is further reduced.

The connecting board shown in this embodiment can perform other functions in addition to the above-described functions of fixing the first circuit board and the second circuit board and aligning the first connection port and the second connection port, for example, the connecting board also fixes a heat sink for dissipating heat from the light receiving module, the light emitting module, and the processing unit, and the heat sink can dissipate heat absorbed from the optical module.

In this embodiment, taking the example that the first connection port of the first circuit board and the second connection port of the second circuit board are connected by a lead, in other examples, the first circuit board further includes a first connector, the first connection port is located in the first connector, the second circuit board further includes a second connector, and the second connection port is located in the second connector. Under the condition that the first connector and the second connector are connected in an inserting mode, the first connecting port and the second connecting port are connected, and therefore transmission of electric signals between the photoelectric conversion module and the electric processing module is guaranteed. For another example, the optical module further includes a Flexible Printed Circuit (FPC) for connecting the first connection port and the second connection port. The FPC may connect the first connection port and the second connection port based on a flexible printed circuit (FPC Connector), a Rigid-flexible Board (rib Board), or a Soldering (Soldering).

In the above embodiments, the photoelectric conversion module and the electrical processing module are connected to form a planar structure, and in other examples, the photoelectric conversion module and the electrical processing module may also be in a stacked structure. For example, fig. 7 is a diagram illustrating a side view structure of a second embodiment of an optical module according to an embodiment of the present application. The photoelectric conversion module includes a first circuit board 701, the electric processing module includes a second circuit board 702, and the first circuit board 701 and the second circuit board 702 are in a state of being stacked up and down. In the present embodiment, the first circuit board 701 is stacked on the top surface of the second circuit board 702 as an example, and in other examples, the second circuit board 702 may be stacked on the top surface of the first circuit board 701. For the description of the first circuit board 701 and the second circuit board 702, please refer to the embodiments described above, which are not repeated herein. The first connection port 703 of the first circuit board 701 is connected to the second connection port 704 of the second circuit board 702, and the connection manner between the first connection port 703 and the second connection port 704 is not limited in this embodiment, for example, the connection is performed by welding, and the connection is performed by a lead wire. In this embodiment, the first connection port 703 is located on the bottom surface of the first circuit board 701, and the second connection port 704 is located on the top surface of the second circuit board 702.

Specifically, the structures of the first connection port and the second connection port are described with reference to fig. 8, where fig. 8 is a schematic diagram illustrating a top view structure of a first embodiment of an optical module according to an embodiment of the present application. The optical module shown in this embodiment includes a first circuit board 801 and a second circuit board 802. The first circuit board 801 includes a light emitting component 811 and a light receiving component 812, and the second circuit board 802 includes a processing unit 803 and a gold finger 804 connected to the processing unit 803. For a detailed description, please refer to the descriptions in fig. 3b to fig. 3c, which are not repeated herein. The first connection port of the first circuit board 801 includes a first high-speed interface 821 and a first high-speed interface 822. The present embodiment does not limit the number of the first high-speed interfaces included in the first circuit board 801. Alternatively, the light emitting module 811 and the light receiving module 812 may be connected with different first high-speed interfaces, for example, the light emitting module 811 is connected with the first high-speed interface 821, and the light receiving module 812 is connected with the first high-speed interface 822. Still alternatively, the light emitting component 811 may be connected to a plurality of different first light speed interfaces, for example, the light emitting component 811 is connected to the first high speed interface 821 and the first high speed interface 822, respectively. The description of the connection between the light receiving module 812 and the first high-speed interface is given by referring to the description of the connection between the light emitting module 811 and the first high-speed interface, which is not repeated herein. The second connection port of the second circuit board 802 includes a second high-speed interface 831 and a second high-speed interface 832. The present embodiment does not limit the number of the second high-speed interfaces included in the second circuit board 802. In this embodiment, the number of the first high-speed interfaces included in the first circuit board 801 is equal to the number of the second high-speed interfaces included in the second circuit board 802. In other examples, if one electrical processing module connects a plurality of photoelectric conversion modules, the number of second high-speed interfaces included in the electrical processing module may be greater than the number of first high-speed interfaces included in the connected one photoelectric conversion module. In a case where the first circuit board 801 and the second circuit board 802 are fixed to the connection board 800, respectively, a plurality of first high-speed interfaces included in the first circuit board 801 are aligned with a plurality of second high-speed interfaces included in the second circuit board 802 in turn. For example, first high-speed interface 821 is aligned with second high-speed interface 831, and first high-speed interface 822 is aligned with second high-speed interface 832. For the description of the connection board, please refer to the above embodiments, which are not repeated herein. In this embodiment, the first high-speed interface 821 and the second high-speed interface 831 are connected by wires, and the first high-speed interface 822 and the second high-speed interface 832 are also connected by wires, for the description of the wires, please refer to the description of the embodiment corresponding to fig. 3c, which is not repeated herein. Wherein, the processing unit 821 sends the service electric signal to the light emitting component 811 via the second high-speed interface 831 and the first high-speed interface 821 which are in a connected state. As another example, the optical receiving component 812 sends the traffic electrical signals to the processing unit 803 via the first high speed interface 822 and the second high speed interface 832 which are in a connected state.

The first connection port shown in this embodiment further includes a first low-speed interface, and the second connection port includes a second low-speed interface. With continued reference to the example shown in fig. 8, the first low speed interface 823 of the first circuit board 801 and the second low speed interface 833 of the second circuit board 802 are aligned, and a wire connection is made between the first low speed interface 823 and the second low speed interface 833. The second low speed interface 833 is also connected to the processing unit 803. The first low-speed interface 823 is also connected to the optical component driving unit 810 included in the first circuit board 801. The optical module driving unit 810 is also connected to a light emitting module 811 and a light receiving module 812, respectively. The first low-speed interface 823 and the second low-speed interface 833 in a connected state are used for the purpose that the processing unit 803 sends an instruction electrical signal to the optical component driving unit 810, for example, the instruction electrical signal may be used to instruct the optical component driving unit 810 to drive the light emitting component 811 to emit light, and for example, the instruction electrical signal may be used to instruct the optical component driving unit 810 to drive the wavelength of the optical signal emitted by the light emitting component 811. As another example, the command electrical signal may be used to instruct the light assembly driving unit 810 to drive the light emitting assembly 811 to perform electro-optical conversion. As another example, the command electrical signal is used to instruct the optical component driving unit 810 to drive the optical receiving component 812 to receive the service optical signal. For another example, the command electrical signal is used to instruct the optical component driving unit 810 to drive the light receiving component 812 to perform photoelectric conversion, etc.

Taking the first connection port as an example, the transmission rate of the electrical signals transmitted by the first high-speed interface is greater than the transmission rate of the electrical signals transmitted by the first low-speed interface. For example, the transmission rate of the electrical signal transmitted by the first high-speed interface is greater than or equal to the rate threshold, and the transmission rate of the electrical signal transmitted by the first low-speed interface is less than the rate threshold, which is 1Gbps for example in this embodiment. The value of the rate threshold is not limited.

Optionally, the first lead shown in this embodiment is different from the second lead, where the first lead is used to connect first high-speed interface 821 and second high-speed interface 831, and the second lead is used to connect first low-speed interface 823 and second low-speed interface 833. The difference between the first lead and the second lead means that the first lead and the second lead are made of different materials and/or the structure of the first lead and the structure of the second lead are different. The difference in the first and second leads results in different attenuation of the electrical signal in the different first and second leads, which in turn results in different transmission rates of the electrical signal in the different first and second leads. In this embodiment, for example, the attenuation of the electrical signal in the second lead is greater than that of the electrical signal in the first lead, and then the transmission rate of the electrical signal in the second lead is less than that of the electrical signal in the first lead. It will be appreciated that the second lead supports a lower rate of electrical signal transmission than the first lead. In the case that the transmission rate of the electrical signal supported by the first lead is relatively high, it can be effectively ensured that the service electrical signal is successfully transmitted between the processing unit and the optical transmission module, and the service electrical signal is successfully transmitted between the processing unit and the optical reception module. The second lead is used for transmitting command electrical signals with a relatively low transmission rate, and the second lead does not need to support high-speed electrical signal transmission under the condition of high cost, so that the cost of the second lead is effectively reduced, and the overall cost of the optical module is further reduced.

The structure of the low-speed interface provided in the embodiment of the present application is described with reference to fig. 8 and 9, where fig. 9 is a diagram illustrating a structure of the low-speed interface of the optical module shown in fig. 8. The first low-speed interface 823 comprises at least one pair of power interfaces for supplying power to the optical module driving unit 810, so as to ensure that the optical module driving unit 810 drives the light emitting module 811 and the light receiving module 812 to operate normally. The example shown in fig. 9 includes a pair of power interfaces, i.e., a power supply Voltage (VCC) pin and a Ground (GND) pin, as the first low speed interface 823. The first low-speed interface 823 further includes at least one pair of communication buses, where the communication buses are used for transmitting the command electrical signals, and the type of the communication buses may be an integrated circuit (IIC) or a Serial Peripheral Interface (SPI), and the specific type of the communication buses is not limited. Taking the communication bus as the IIC bus as an example, the communication interface specifically includes a Serial Clock (SCL) pin and a data line signal line (SDA) pin. The first low-speed interface 823 shown in this embodiment may further include an extension pin to ensure that the first low-speed interface can adapt to subsequent use requirements of the optical module, and the type of the extension pin is not limited in this embodiment. For a specific description of the second low-speed interface 833, please refer to the description of the first low-speed interface 823, which is not repeated herein.

In this embodiment, under the condition that the first circuit board 801 and the second circuit board 802 are both fixed to the connection board 800, the VCC pin of the first low-speed interface 823 is aligned with the VCC pin of the second low-speed interface 833 and connected by a lead, and so on, the SCL pin of the first low-speed interface 823 is aligned with the SCL pin of the second low-speed interface 833 and connected by a lead. It is understood that any pin included in the first low-speed interface 823 is connected to one pin included in the second low-speed interface 833 through a wire.

In the case where the first circuit board 801 includes a plurality of first high-speed interfaces, the first circuit board 801 includes at least a pair of two first high-speed interfaces located adjacently. The two first high-speed interfaces which are adjacent to each other mean that any first high-speed interface is not separated between the two first high-speed interfaces. For example, as shown in fig. 8, the first high-speed interface 821 and the first high-speed interface 822 are not separated by any first high-speed interface, and then the first high-speed interface 821 and the first high-speed interface 822 are two first high-speed interfaces located adjacently. Among the first connection ports, a first low speed interface 823 is located between the first high speed interface 821 and the first high speed interface 822 which are adjacently located.

In this embodiment, because the rate of the electrical signal transmitted by the first high-speed interface is greater than that of the electrical signal transmitted by the first low-speed interface, when the first low-speed interface 823 is located between the first high-speed interface 821 and the first high-speed interface 822 that are adjacent to each other, the first low-speed interface 823 can perform a shielding function to a certain extent, so as to reduce crosstalk between the electrical signal transmitted by the first high-speed interface 821 and the electrical signal transmitted by the first high-speed interface 822. For the description of the positions of the second high-speed interface and the second low-speed interface included in the second connection port, please refer to the description of the first connection port, which is not repeated herein.

The structures of the first high speed interface and the second high speed interface are described with reference to fig. 10, where fig. 10 is a diagram illustrating a second embodiment of an optical module according to an embodiment of the present application in a top view. The optical module shown in this embodiment includes a first circuit board 1010, a second circuit board 1020, and a connecting board 1000, for a detailed description, please refer to the description in fig. 3b, which is not repeated herein. For a detailed description, please refer to the description of fig. 8 and 9, which will not be repeated herein, the first high speed interface 1011 included in the first circuit board 1010 is connected to the light emitting module 1012, the second high speed interface 1021 included in the second circuit board 1020 is connected to the processing unit 1022, and the first high speed interface 1011 and the second high speed interface 1021 are connected by a lead. For an illustration of the light emitting element 1012, please refer to the illustration of fig. 3c, which is not described in detail. The optical transmit assembly 1012 is shown in this embodiment to support multi-channel transmission. For example, the light emitting module 1012 supports four-channel transmission, the light emitting module 1012 supporting four channels can acquire four service optical signals, the light emitting module 1012 respectively performs optical-to-electrical conversion on the four service optical signals to acquire four service electrical signals, and the light emitting module 1012 sends the four service electrical signals to the processing unit 1022 through the first high-speed interface 1011 and the second high-speed interface 1021 in a connected state. The first high-speed interface 1011 is configured to transmit four paths of service electrical signals, and then the first high-speed interface 1011 includes ground-signal-ground-signal-ground-signal-ground-signal-ground (GSGSGSGSG) pins, it can be understood that in the first high-speed interface 1011, a G pin is included between two S pins adjacent to each other, and each S pin is configured to receive one path of service electrical signals from the optical transmission module 1012. For a description of each pin included in the second high-speed interface 1021, please refer to the description of the first high-speed interface 1011, which is not described in detail. It should be noted that, the light emitting assembly 1012 supports four-channel transmission as an example in this embodiment, and the number of channels supported by the light emitting assembly is not limited in this embodiment. For a description of the structures of the first high-speed interface and the second high-speed interface connected to the light receiving component, please refer to the description of the first high-speed interface and the second high-speed interface connected to the light emitting component, which is not repeated herein.

With reference to fig. 11, a description continues on an alternative structure of the first high-speed interface and the second high-speed interface, where fig. 11 is a schematic diagram of a top view structure of a third embodiment of the optical module provided in the embodiment of the present application. Please refer to the corresponding description of fig. 10 for the description of the first circuit board 1110, the second circuit board 1120, the connecting board 1100, the light emitting element 1112 and the processing unit 1122 shown in this embodiment, which is not repeated herein. The first circuit board 1110 shown in this embodiment further includes a first high speed interface 1111 that is connected to the optical transmit assembly 1112. The second circuit board 1120 also includes a second high speed interface 1121 that is connected to the processing unit 1122. In this embodiment, the light emitting device 1112 supports two channels as an example, please refer to the description of the light emitting device supporting four channels shown in fig. 10 for the description of the light emitting device supporting two channels, which is not repeated herein. The first high-speed interface 1111 shown in fig. 11 is different from the first high-speed interface shown in fig. 10 in that the first high-speed interface 1111 shown in fig. 11 is a differential interface capable of transmitting differential electrical signals. Specifically, for example, when the optical transmit module 1112 supports two channels, the first high-speed interface 1111 includes two pairs of differential pins, wherein the fifth pin (pin S1131 shown in fig. 11) and the sixth pin (pin S1132 shown in fig. 11) included in the first high-speed interface 1111 are a pair of differential pins. Second high speed interface 1121 also includes two pairs of differential pins. The seventh pin (pin S1133 shown in fig. 11) and the eighth pin (pin S1134 shown in fig. 11) included in the second high speed interface 1121 are a pair of differential pins. The third electrical signal from the processing unit 1122 is sent to the light emitting assembly 1112 through the fifth pin and the seventh pin in the connected state by the lead wires. The fourth electrical signal from the processing unit 1122 is sent to the light emitting assembly 1112 through the sixth pin and the eighth pin in the connected state by the lead wires. The third electrical signal and the fourth electrical signal are a pair of differential electrical signals. The optical transmitter 1112 loaded with the third electrical signal and the fourth electrical signal performs an electrical-to-optical conversion to output a service optical signal. It is understood that the optical transmit module 1112 shown in the present embodiment supports two channels, for example, the first high speed interface 1111 includes a GSSGSSG pin, and the second high speed interface 1121 includes a GSSGSSG pin. The first high-speed interface 1111 and the second high-speed interface 1121 shown in this embodiment drive the light emitting element 1112 through differential electrical signals, so that the driving voltage for driving the light emitting element 1112 can be reduced, and the efficiency for driving the light emitting element 1112 is improved. For descriptions of the differential pins included in the first high-speed interface 1111 and the second high-speed interface 1121, please refer to the description of the differential pins, which is not repeated herein. In this embodiment, the light emitting device supports two channels for transmission, and the number of the channels supported by the light emitting device 1112 is not limited in this embodiment. For a description of the structures of the first high-speed interface and the second high-speed interface connected to the light receiving element, please refer to the description of the first high-speed interface and the second high-speed interface connected to the light emitting element 1112, which is not described in detail herein.

The first high-speed interface shown in fig. 11 is a differential interface, and the second high-speed interface is also a differential interface as an example, so that the first high-speed interface and the second high-speed interface shown in fig. 11 in the connected state can transmit the differential electrical signal from the processing unit to the optical transmission assembly. The light emitting assembly supports differential driving, thereby enabling the light emitting assembly to perform electro-optical conversion under the action of differential electrical signals. In the embodiment shown in fig. 12, the light emitting module only supports single-ended driving, but not differential driving, and the optical module can be ensured to normally operate without replacing the photoelectric conversion module. Fig. 12 is a schematic diagram illustrating a top view structure of a fourth embodiment of an optical module according to an embodiment of the present application. For descriptions of the first circuit board 1210, the second circuit board 1220, the connecting board 1200, the light emitting element 1212 and the processing unit 1222 shown in this embodiment, please refer to the corresponding description in fig. 10, which is not repeated herein. The first high-speed interface 1211 of the first circuit board 1210 is connected with the light emitting assembly 1212. The second high-speed interface 1221 of the second circuit board 1220 is connected with the processing unit 1222. Please refer to the description of fig. 3c for a description of the light emitting assembly 1212 in this embodiment, which is not described in detail. For an example that the light emitting device 1212 supports two channels, please refer to the description of the light emitting device supporting two channels shown in fig. 11 for a description of the light emitting device supporting two channels, which is not described in detail herein. The first high-speed interface 1211 includes two pairs of differential pins, wherein the first pin (the pin S1231 shown in fig. 12) and the second pin (the pin S1232 shown in fig. 12) included in the first high-speed interface 1211 are a pair of differential pins. The second high-speed interface 1221 also includes two pairs of differential pins, and the third pin (pin S1233 shown in fig. 12) and the fourth pin (pin S1234 shown in fig. 12) included in the second high-speed interface 1221 are a pair of differential pins. The first electrical signal from the processing unit 1222 is transmitted to the light emitting assembly 1212 through the first pin and the third pin in the connected state of the lead wires. The second pin shown in this embodiment is connected to the ground resistor 1240, and the second electrical signal from the processing unit 1222 is transmitted to the ground resistor 1240 through the third pin and the fourth pin in the connected state. The ground resistor 1240 can terminate the transmission of the second electrical signal. The first electrical signal and the second electrical signal are a pair of differential electrical signals. The second electrical signal transmitted to the ground resistor 1240 to be terminated is not transmitted to the light emitting assembly 1212 to be grounded. The optical transmitter assembly 1212 loaded with the first electrical signal performs an electrical-to-optical conversion to output a service optical signal. It is understood that the optical transmit module 1212 shown in this embodiment supports two channels, for example, the first high speed interface 1211 includes a GSSGSSG pin, and the second high speed interface 1221 also includes a GSSGSSG pin. In this embodiment, the light emitting assembly supports two-channel transmission as an example, and the number of channels supported by the light emitting assembly is not limited in this embodiment.

In the embodiment shown in fig. 12, in the case where the second high-speed interface 1221 of the second circuit board 1220 outputs a pair of differential electrical signals, the optical transmission assembly 1212 supporting only single-ended driving can also perform electrical-optical conversion on the traffic electrical signal from the processing unit 1222 to emit a traffic optical signal. As can be seen from fig. 11 and 12, the second high-speed interface of the same second circuit board can be adapted to the optical transmission module supporting differential driving (the embodiment shown in fig. 11), and can also be adapted to the optical transmission module supporting single-ended driving (the embodiment shown in fig. 12).

In the above embodiment, the first circuit board is taken as an example, the first circuit board provided in the embodiment shown in fig. 13 includes two sub-boards, where fig. 13 is a schematic diagram of a top view structure of a fifth embodiment of the optical module provided in the embodiment of the present application. The electrical processing module shown in this embodiment includes a second circuit board 1301, a processing unit 1302, a gold finger 1303 and a second connection port 1304, please refer to the descriptions in fig. 3a to fig. 3c, which is not repeated herein.

The first circuit board shown in the present embodiment includes two sub-boards, i.e., a first sub-board 1311 and a second sub-board 1321. The first sub-board 1311 includes a light emitting assembly 1312 and a light emitting assembly driving unit 1313 for driving the light emitting assembly 1312. The first circuit board 1311 also includes a first sub-connection port 1314. The first high-speed interface included in the first sub-connection port 1314 is connected to the light emitting device 1312, the first low-speed interface included in the first sub-connection port 1314 is connected to the light emitting device driving unit 1313, and the first sub-connection port 1314 is connected to the second connection port 1304, for describing the first high-speed interface and the first low-speed interface included in the first sub-connection port 1314, please refer to fig. 8, and fig. 10 to 12, which are not described in detail. The first sub-board 1321 includes a light-receiving component 1322 and a light-receiving component driving unit 1323 for driving the light-receiving component 1322. The second circuit board 1321 further includes a second sub-connection port 1324. The first high-speed interface included in the second sub-connection port 1324 is connected to the optical receiving element 1322, the first low-speed interface included in the second sub-connection port 1324 is connected to the optical receiving element driving unit 1323, the second sub-connection port 1324 is connected to the second connection port 1304, and for the description of the first high-speed interface and the first low-speed interface included in the second sub-connection port 1314, please refer to fig. 8, and fig. 10 to 11, which are not described in detail.

The first sub circuit board 1311 and the second circuit board 1301 fixed to the connection board 1300 shown in this embodiment enable alignment of the first sub connection port 1314 and the second connection port 1304. The second sub-circuit board 1321 and the second circuit board 1301, which are fixed on the connection board 1300, enable the alignment of the second sub-connection port 1324 and the second connection port 1304. It can be understood that the connection board 1300 shown in the present embodiment can prevent the relative position between the first sub-connection port 1314 and the second connection port 1304 from being shifted or wrong, and ensure the successful connection between the first sub-connection port 1314 and the second connection port 1304 through the lead wire. Moreover, under the condition that the first sub-connection port 1314 and the second connection port 1304 are aligned, the thread length of a lead wire connected between the first sub-connection port 1314 and the second connection port 1304 can be effectively reduced, and the insertion loss of an electric signal transmitted between the first sub-connection port 1314 and the second connection port 1304 is effectively reduced. Moreover, the aligned first sub-connection port 1314 and second connection port 1304 do not interfere with each other in the wire bonding process, so that the efficiency and accuracy of connecting the first sub-connection port 1314 and the second connection port 1304 by wires are improved, and the situation that the first sub-connection port 1314 and the second connection port 1304 cannot be connected by wires is avoided. For a description of the beneficial effects of aligning the second sub-connection port 1324 and the second connection port 1304 by the connection board 1300, please refer to the description of the beneficial effects of aligning the first sub-connection port 1314 and the second connection port 1304 by the connection board 1300, which is not described in detail herein.

In the optical module shown in the embodiment, the first sub-board and the second sub-board can be independently processed respectively, the manufacturing process of the optical module is further reduced, and the first sub-board and the second sub-board can be independently tested respectively, so that the first sub-board and the second sub-board are guaranteed to be good products which can normally work independently, and the product yield of the optical module is effectively improved. The first sub-board and the second sub-board are designed and arranged independently, and flexibility of the optical module structure is improved. When the first daughter board 1311 included in the photoelectric conversion module fails, only the first daughter board 1311 needs to be replaced, and the whole photoelectric conversion module does not need to be replaced, so that difficulty in maintaining the optical module, material loss, and cost are reduced.

The following describes an exemplary structure of a photoelectric conversion module provided in the present application, and fig. 14 is a diagram illustrating a first application scenario of the photoelectric conversion module provided in an embodiment of the present application. The photoelectric conversion module 1410 shown in the present embodiment includes a light emitting module 1400 and a light receiving module 1420. In the present embodiment, the light emitting module 1400 supports four channels as an example, and the number of channels supported by the light emitting module 1400 is not limited in the present embodiment. The light emitting module 1400 includes a combiner 1401 and four lasers, i.e., a laser 1402, a laser 1403, a laser 1404, and a laser 1405, connected to the combiner 1401. The photoelectric conversion module further includes four drivers connected to the four lasers, respectively, i.e., a driver 1406 connected to the laser 1402, a driver 1407 connected to the laser 1403, a driver 1408 connected to the laser 1404, and a driver 1409 connected to the laser 1405. The four drivers are connected to the first connection ports 1430, respectively.

Please refer to fig. 8, fig. 10 to fig. 13, which are specific details of the first connection port 1430 receiving the four service electrical signals from the electrical processing module, and the description of the first connection port 1430 receiving the service electrical signals. Taking the driver 1406 as an example, the driver 1406 amplifies the power of the traffic electrical signal from the first connection port 1430 to transmit the power-amplified electrical signal to the laser 1402. The laser 1402 performs electro-optical conversion on the electrical signal after power amplification to output one-path service optical signal, and the combiner 1401 receives four-path service optical signals from the four lasers and performs combining to emit a multiplexed service optical signal. Each laser shown in this embodiment is an electro-absorption modulator (EML) having an electro-optical conversion function, a Direct Modulation Laser (DML), a Vertical Cavity Surface Emitting Laser (VCSEL), or the like.

In this embodiment, for example, four drivers are located on the first circuit board included in the optical processing module, and for example, the driver 1406 is used, the transmission rate of the electrical signal transmitted by the driver 1406 is higher, and when the driver 1406 is located on the first circuit board, the distance between the driver 1406 and the laser 1402 is smaller than the distance between the driver 1406 and the laser 1402 when the driver 1406 is located on the second circuit board. The closer the distance between the driver 1406 and the laser 1402, the greater the power of the traffic electrical signal sent by the driver 1406 to the laser 1402, the better the signal quality. Therefore, when the driver 1406 is located on the first circuit board, the efficiency of the electro-optical conversion by the laser 1402 can be effectively improved. The driver 1406 is arranged on the first circuit board, so that the area and the cost of the second circuit board are saved.

In this embodiment, the electrical signal transmitted by the driver 1406 is a high-speed electrical signal, and in order to reduce the cost of the first circuit board, the transmission path of the service electrical signal transmitted by the driver 1406 does not need to pass through the routing of the first circuit board, and the first conductive member is separately disposed independently from the routing of the first circuit board. The electric signal transmission rate supported by the first conductive piece is greater than the electric signal transmission rate supported by the routing of the first circuit board. The laser 1402 and the first connection port 1430 are connected to the driver 1406 through the first conductive member, respectively. It can be seen that, in the embodiment, the first circuit board with a relatively low supported electrical signal transmission rate can be adopted, and it can also be ensured that each driver amplifies the electrical signal sent to the light emitting assembly, thereby reducing the cost of the first circuit board. The driver 1406 shown in this embodiment may also be disposed on the second circuit board, or the driver 1406 may be integrated with the processing unit of the second circuit board.

In the present embodiment, the light receiving module 1420 supports four channels as an example, and the number of channels supported by the light receiving module 1420 is not limited in the present embodiment. The light receiving module 1420 includes a demultiplexer 1421 and four Photo Detectors (PDs) connected to the demultiplexer 1421, that is, a PD1422, a PD1423, a PD1424, and a PD1425. The photoelectric conversion module further includes four TIAs connected to the four PDs, i.e., a TIA1426 connected to the PD1422, a TIA1427 connected to the PD1423, a TIA1428 connected to the PD1424, and a TIA1429 connected to the PD1425, respectively. The four TIAs are connected with the first connection ports 1430, respectively. The demultiplexer 1421 receives the multiplexed service optical signal and demultiplexes the service optical signal to obtain four service optical signals. The demultiplexer 1421 is configured to send four paths of service optical signals to four PDs, taking the PD1422 as an example, the PD1422 performs photoelectric conversion on the received service optical signal to send a service electrical signal to the TIA1426, and the TIA1426 amplifies the received service electrical signal to send the amplified service electrical signal to the first connection port 1430.

In this embodiment, taking four TIAs on the first circuit board included in the optical processing module as an example, the transmission rate of the electrical signal transmitted by the TIA1426 is higher, and in the case that the TIA is on the first circuit board, the distance between the TIA1426 and the PD1422 is smaller than the distance between the TIA1426 and the PD1422 when the TIA1426 is on the second circuit board. Therefore, under the condition that the TIA1426 is located on the first circuit board, the higher the power of the service electrical signal received by the TIA1426 and the service electrical signal sent by the TIA1426 to the first connection port 1430 is, the better the signal quality is, and the efficiency and accuracy of the service carried by the service electrical signal acquired by the electrical processing module are improved. And the TIA1426 is arranged on the first circuit board, so that the area and the cost of the second circuit board are saved.

In this embodiment, the electrical signal transmitted by the TIA1426 is a high-speed electrical signal, and in order to reduce the cost of the first circuit board, the transmission path of the service electrical signal transmitted through the TIA1426 does not need to be routed through the first circuit board, and the second conductive component is separately provided independently from the routing of the first circuit board. The electric signal transmission rate supported by the second conductive piece is greater than the electric signal transmission rate supported by the routing of the first circuit board. The PD1422 and the first connection port 1430 are connected to the TIA1426 through the second conductive member, respectively. As can be seen, the first circuit board with a relatively low supported electrical signal transmission rate can be used in this embodiment, and it can also be ensured that each TIA amplifies an electrical signal from the optical receiving assembly, thereby reducing the cost of the first circuit board. The TIA1426 shown in this embodiment may also be provided on the second circuit board, or the TIA1426 may be integrated with the processing unit of the second circuit board.

Fig. 15 is a diagram illustrating a second application scenario of a photoelectric conversion module according to an embodiment of the present application. The first circuit board 1501 of the photoelectric conversion module shown in this embodiment further includes a silicon photo chip 1502, and the silicon photo chip 1502 includes a light emitting component and a light receiving component. In this embodiment, the light emitting module supports four channels as an example, and the number of channels supported by the light emitting module is not limited in this embodiment. The optical transmission module includes a combiner 1503 and four modulators, i.e., a modulator 1511, a modulator 1512, a modulator 1513, and a modulator 1514, connected to the combiner 1503. First circuit board 1501 also includes four drivers connected to the four modulators, respectively, namely driver 1515 connected to modulator 1511, driver 1516 connected to modulator 1512, driver 1517 connected to modulator 1513, and driver 1518 connected to modulator 1514. The four drivers are connected to the first connection ports 1504, respectively. Taking the modulator 1511 as an example, the modulator 1511 may be a micro-ring modulator or a mach-zehnder (MZ) modulator. The silicon optical chip also includes a light source 1505 for sending four optical signals to the four modulators, respectively, for example, the light source 1505 may be a Laser diode (Laser diode). Alternatively, in other examples, the light source 1505 may not be located on a silicon die, but directly on the first circuit board 1501.

The first connection port 1504 receives four traffic electrical signals from the electrical processing module, and taking the driver 1515 as an example, the driver 1515 amplifies the power of the traffic electrical signal from the first connection port 1504 to send the power-amplified traffic electrical signal to the modulator 1511. The modulator 1511 modulates the traffic electrical signal on the optical signal from the light source 1505 to output one traffic optical signal, and the combiner 1503 receives four traffic optical signals from the four modulators and combines them to emit a multiplexed traffic optical signal.

The four drivers shown in this embodiment are located on the first circuit board, and for the description of the specific beneficial effects, please refer to the description corresponding to fig. 14, which is not repeated herein. The silicon optical chip 1502 shown in this embodiment further includes a light receiving element, and please refer to the corresponding description in fig. 14 for a description of the structure of the light receiving element, which is not repeated herein. In this embodiment, the first circuit board includes one silicon optical chip as an example, in other examples, the first circuit board may include a plurality of silicon optical chips, and the number of the silicon optical chips is not limited.

Fig. 16 is a diagram illustrating a third application scenario of a photoelectric conversion module according to an embodiment of the present application. The first circuit board 1601 of the photoelectric conversion module shown in this embodiment further includes a silicon photo chip 1602, and the silicon photo chip 1602 includes a light emitting component and a light receiving component. In this embodiment, the light emitting module supports four channels as an example, and the number of channels supported by the light emitting module is not limited in this embodiment. The optical transmit module includes a combiner 1603 and four coherent transmitters (ICTs) connected to the combiner 1603, i.e., ICT1611, ICT1612, ICT1613 and ICT1614. The first circuit board 1601 further includes four drivers connected to the four ICTs, respectively, i.e., a driver 1615 connected to the ICT1611, a driver 1616 connected to the ICT1612, a driver 1617 connected to the ICT1613, and a driver 1618 connected to the ICT1614. The four drivers are connected to the first connection ports 1604, respectively. The silicon photonic chip 1602 further includes a light source 1605, and for the description of the light source 1605, please refer to the corresponding description in fig. 15, which is not described in detail.

The first connection port 1604 receives four service electrical signals from the electrical processing module, and taking the driver 1615 as an example, the driver 1615 amplifies the power of the service electrical signals from the first connection port 1604 to send the power-amplified service electrical signals to the ICT. The ICT1611 modulates the service electrical signal on the optical signal from the light source 1605 to output one path of service coherent optical signal, and the wave combiner 1603 receives four paths of service coherent optical signals from the four ICTs and combines them to emit a multiplexed service coherent optical signal. The four drivers shown in this embodiment are located on the first circuit board, and for the description of the specific beneficial effects, please refer to the description corresponding to fig. 14, which is not described in detail.

The silicon optical chip 1602 shown in this embodiment further includes a light receiving component, and this embodiment takes the light receiving component supporting four channels as an example, and the number of channels supported by the light receiving component is not limited in this embodiment. The light receiving module includes a demultiplexer 1607 and four coherent receiver (ICR) devices (ICR 1621, ICR1622, ICR1623, and ICR 1624) connected to the demultiplexer 1607. The first circuit board further includes four TIAs connected to the four ICRs, respectively, TIA1625 connected to ICR1621, TIA1626 connected to ICR1622, TIA1627 connected to ICR1623, and TIA1628 connected to ICR1624. The four TIAs are connected to the first connection ports 1604, respectively. The demultiplexer 1607 receives the multiplexed service coherent optical signal and demultiplexes the multiplexed service coherent optical signal to obtain four service coherent optical signals. The demultiplexer 1607 is configured to send four traffic-coherent optical signals to the four ICRs, respectively. Taking the ICR1621 as an example, the ICR1621 performs coherent coupling on the received service coherent optical signal and the local oscillator optical signal from the light source 1605, performs photoelectric conversion to output one service electrical signal, and sends the service electrical signal to the TIA1625, and the TIA1625 amplifies the received service electrical signal to send the amplified service electrical signal to the first connection port 1604. In the embodiment, the ICT and ICR share the light source 1605 as an example, and the cost of the photoelectric conversion module is saved as an example, in other examples, the ICT and ICR may also use different light sources respectively.

For an example that four TIAs are located on the first circuit board included in the optical processing module, please refer to the description of the embodiment corresponding to fig. 14 for a description of specific beneficial effects, which is not repeated herein. The optical conversion module shown in this embodiment can realize coherent optical communication, and effectively improves the sensitivity, communication capacity and communication distance of the photoelectric conversion module.

The present embodiment further provides an assembling method for assembling an optical module, which is shown in fig. 17, where fig. 17 is a flowchart of a step of the assembling method provided in the embodiment of the present application.

Step 1701, the first circuit board is secured to the connection plate.

In this embodiment, the first circuit board may be fixed to the connection board by an assembling apparatus, for example, a robot arm. Specifically, the first circuit board is fixed in the first area through the first positioning element of the first area of the connection board, and for the description of the specific fixing manner, please refer to the description of fig. 5a to 5b or refer to the description of fig. 6a to 6b, which is not repeated in detail.

Step 1702, secure a second circuit board to the connection board.

For example, step 1701 may be executed first and then step 1702 may be executed, or step 1702 may be executed first and then step 1701 may be executed, or step 1701 may be executed first and then step 1702 may be executed, or step 1701 and step 1702 may be executed simultaneously, and the description of the execution subject of step 1702 is executed, for example, refer to the description of step 1701 and will not be repeated.

Specifically, the second circuit board is fixed in the second area by the second positioning element connected to the second area, and for the description of the process of fixing the second circuit board to the connecting board in this embodiment, please refer to the description of fig. 5c or fig. 6c, which is not repeated in detail. As can be seen from the above embodiments, the first connection port of the first circuit board fixed to the connection plate and the second connection port of the second circuit board are aligned.

And step 1703, connecting the first high-speed interface of the first connection port and the second high-speed interface of the second connection port through a first lead.

For a detailed description of this step, please refer to the description corresponding to fig. 8, which is not repeated herein.

Step 1704, connecting the first low-speed interface of the first connection port and the second low-speed interface of the second connection port through a second lead.

The execution timing between step 1703 and step 1704 in this embodiment is not limited, for example, step 1703 may be executed first and then step 1704 may be executed, or for example, step 1704 may be executed first and then step 1703 may be executed, or for example, step 1703 and step 1704 may be executed simultaneously.

For a detailed description of this step, please refer to the corresponding descriptions in fig. 8 and fig. 9, which are not repeated herein.

In this embodiment, the test can be directly performed under the condition that the first circuit board and the second circuit board are both fixed to the connection board. And if the test is normal, packaging the connecting plate with the first circuit board and the second circuit board fixed in the shell of the optical module. And then, the packaged optical module can be tested again to ensure the normal use of the packaged optical module. The test mode is not limited in this embodiment, as long as the optical module passing the test can be used normally, for example, the test may include testing the optical power of the optical module, testing a spectrometer, testing an eye pattern instrument or testing an error code instrument.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. An optical module is characterized in that the optical module comprises a first circuit board, a second circuit board and a connecting board, wherein the first circuit board comprises a light emitting component and a light receiving component, the second circuit board comprises a processing unit, the first circuit board further comprises a first connecting port, the second circuit board further comprises a second connecting port, the light emitting component and the light receiving component are respectively connected with the first connecting port, and the processing unit is connected with the second connecting port;

the first circuit board and the second circuit board are fixed on the connecting board, and the connecting board is used for aligning the first connecting port and the second connecting port;

the first connection port and the second connection port are connected through a lead.

2. The optical module of claim 1, wherein the connection board for aligning the first connection port and the second connection port comprises:

the first connection port comprises a first high-speed interface, the second connection port comprises a second high-speed interface, the first high-speed interface is any one high-speed interface included in the first connection port, the second high-speed interface is one high-speed interface included in the second connection port, and the connection board is used for aligning the first high-speed interface and the second high-speed interface;

the first connection port comprises a first low-speed interface, the second connection port comprises a second low-speed interface, the first low-speed interface is any one low-speed interface included in the first connection port, the second low-speed interface is one low-speed interface included in the second connection port, and the connecting plate is used for aligning the first low-speed interface and the second low-speed interface.

3. The optical module of claim 2, wherein the lead comprises a first lead and a second lead, and the first connection port and the second connection port are connected by a lead comprising:

the first high-speed interface is connected with the second high-speed interface through the first lead wire, and the first low-speed interface is connected with the second low-speed interface through the second lead wire.

4. The optical module of claim 3, wherein the first pin supports a greater rate of electrical signaling than the second pin.

5. The optical module according to any one of claims 2 to 4, wherein the first low-speed interface is located between two first high-speed interfaces located adjacent to each other in the first connection port, and the second low-speed interface is located between two second high-speed interfaces located adjacent to each other in the second connection port.

6. The optical module of any one of claims 2 to 4, wherein the first high speed interface comprises a first pin and a second pin, the first pin is connected with the light emitting component, and the second pin is grounded;

the second high-speed interface comprises a third pin and a fourth pin, the third pin is respectively connected with the first pin and the processing unit, and the fourth pin is respectively connected with the second pin and the processing unit;

the third pin is configured to receive a first electrical signal from the processing unit, the fourth pin is configured to receive a second electrical signal from the processing unit, and the first electrical signal and the second electrical signal are a pair of differential electrical signals.

7. The optical module according to any one of claims 2 to 4, wherein the first high speed interface comprises a fifth pin and a sixth pin, both of which are connected to the light emitting assembly;

the second high-speed interface comprises a seventh pin and an eighth pin, the seventh pin is respectively connected with the fifth pin and the processing unit, and the eighth pin is respectively connected with the sixth pin and the processing unit;

the seventh pin is configured to receive a third electrical signal from the processing unit, the eighth pin is configured to receive a fourth electrical signal from the processing unit, and the third electrical signal and the fourth electrical signal are a pair of differential electrical signals.

8. The optical module according to any one of claims 1 to 4, wherein a plate material of the first circuit board and a plate material of the second circuit board are different, and a transmission rate of an electrical signal supported by the first circuit board is smaller than a transmission rate of an electrical signal supported by the second circuit board.

9. The optical module according to any one of claims 1 to 4, wherein the fixing of the first circuit board and the second circuit board to the connection board comprises:

the two sides of the same surface of the connecting plate respectively comprise a first area and a second area, the first area comprises a first positioning piece, the first positioning piece is used for fixing the first circuit board in the first area, the second area comprises a second positioning piece, and the second positioning piece is used for fixing the second circuit board in the second area.

10. The optical module of any one of claims 1 to 4, wherein the first circuit board comprises a first sub-board and a second sub-board, the first connection port comprises a first sub-connection port and a second sub-connection port, the first sub-board comprises the light emitting component and the first sub-connection port, the second sub-board comprises the light receiving component and the second sub-connection port, the light emitting component is connected with the first sub-connection port, and the light receiving component is connected with the second sub-connection port;

the connection plate is used for aligning the first sub-connection port and the second connection port, and the connection plate is also used for aligning the second sub-connection port and the second connection port;

the first sub-connection port is connected with the second connection port through a lead, and the second sub-connection port is connected with the second connection port through a lead.

11. The optical module of any of claims 1 to 4, wherein the first circuit board further comprises a driver and/or an amplifier, wherein the driver is connected to the light emitting module and the first connection port, respectively, and the amplifier is connected to the light receiving module and the first connection port, respectively.

12. The optical module of claim 11, wherein the optical transmitting component and the first connection port are respectively connected to the driver through a first conductive member, and the first conductive member supports a transmission rate of electrical signals greater than that supported by the first circuit board;

the light receiving component and the first connection port are respectively connected with the amplifier through a second conductive piece, and the transmission rate of the electric signals supported by the second conductive piece is greater than that of the electric signals supported by the first circuit board.

13. A photoelectric conversion module is characterized by comprising a first circuit board, wherein the first circuit board comprises a light emitting component and a light receiving component, the first circuit board further comprises a first connecting port, and the light emitting component and the light receiving component are respectively connected with the first connecting port;

the first circuit board is used for being fixed on a connecting board, the connecting board is also used for fixing a second circuit board, and the first connecting port and a second connecting port included by the second circuit board are aligned through the connecting board;

14. The photoelectric conversion module according to claim 13, wherein the first connection port includes a first high-speed interface, the first high-speed interface being any one of high-speed interfaces included in the first connection port, the first high-speed interface being aligned with a second high-speed interface included in the second connection port through the connection board;

the first connection port comprises a first low-speed interface, the first low-speed interface is any one low-speed interface included in the first connection port, and the first low-speed interface is aligned with a second low-speed interface included in the second connection port through the connection plate.

15. The photoelectric conversion module according to claim 14, wherein the first high-speed interface and the second high-speed interface are connected to each other by the first lead wire, and the first low-speed interface and the second low-speed interface are connected to each other by the second lead wire.

16. The photoelectric conversion module of claim 15, wherein the first lead supports a greater rate of electrical signal transmission than the second lead.

17. The photoelectric conversion module according to any one of claims 14 to 16, wherein in the first connection port, the first low-speed interface is located between two first high-speed interfaces located adjacently.

18. The photoelectric conversion module according to any one of claims 14 to 16, wherein the first high-speed interface includes a first pin and a second pin, the first pin is connected to the light emitting element, and the second pin is grounded;

the first pin is used for receiving a first electric signal from the second high-speed interface, the second pin is used for receiving a second electric signal from the second high-speed interface, and the first electric signal and the second electric signal are a pair of differential electric signals.

19. The optical-to-electrical conversion module according to any one of claims 13 to 16, wherein the first circuit board includes a first sub-board and a second sub-board, the first connection port includes a first sub-connection port and a second sub-connection port, the first sub-board includes the light emitting component and the first sub-connection port, the second sub-board includes the light receiving component and the second sub-connection port, the light emitting component is connected to the first sub-connection port, and the light receiving component is connected to the second sub-connection port;

the first sub-connection port and the second connection port are aligned by the connection plate, and the second sub-connection port and the second connection port are aligned by the connection plate;

20. The photoelectric conversion module according to any one of claims 13 to 16, wherein the first circuit board further comprises a driver and/or an amplifier, wherein the driver is connected to the light emitting module and the first connection port, respectively, and the amplifier is connected to the light receiving module and the first connection port, respectively.

21. The optical-to-electrical conversion module of claim 20, wherein the optical transmitter module and the first connection port are respectively connected to a driver through a first conductive member, and the first conductive member supports a transmission rate of electrical signals that is greater than a transmission rate of electrical signals supported by the first circuit board;

the light receiving assembly and the first connection port are connected with the amplifier through second conductive pieces respectively, and the transmission rate of the electric signals supported by the second conductive pieces is greater than that of the electric signals supported by the first circuit board.

22. An electrical processing module comprising a second circuit board, said second circuit board comprising a processing unit, said second circuit board further comprising a second connection port, said processing unit being connected to said second connection port;

the second circuit board is used for being fixed on a connecting board, the connecting board is also used for fixing a first circuit board, and the second connecting port is aligned with a first connecting port included in the first circuit board through the connecting board;

23. The electronic processing module of claim 22, wherein the second connection port comprises a second high-speed interface, the second high-speed interface being one high-speed interface included with the second connection port, the second high-speed interface being aligned with the first high-speed interface included with the first connection port through the connection board;

the second connection port includes a second low-speed interface, which is a low-speed interface included in the second connection port, and the second low-speed interface is aligned with the first low-speed interface included in the first connection port through the connection board.

24. The electrical processing module of claim 23 wherein said first high speed interface and said second high speed interface are connected by said first wire and said first low speed interface and said second low speed interface are connected by said second wire.

25. The electrical processing module of claim 24 wherein the first lead supports a greater rate of electrical signal transmission than the second lead supports.

26. An electronic processing module according to any one of claims 23 to 25, wherein in the second connection port, the second low speed interface is located between two of the second high speed interfaces that are adjacently located.

27. An optical communication apparatus, characterized in that the optical communication apparatus comprises a communication board, and the optical communication apparatus further comprises at least one optical module connected to the communication board, wherein the optical module is according to any one of claims 1 to 12.