CN217895147U

CN217895147U - Microphone and electronic equipment

Info

Publication number: CN217895147U
Application number: CN202221308281.3U
Authority: CN
Inventors: 刘波; 吴安生
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2022-05-26
Filing date: 2022-05-26
Publication date: 2022-11-25
Anticipated expiration: 2032-05-26

Abstract

The utility model relates to a microphone and electronic equipment. The microphone comprises a substrate, a shell, an MEMS chip and an ASIC chip; a first through hole is formed in the substrate; the shell is arranged on one side of the substrate, a cavity is formed between the shell and the substrate, and the cavity is communicated with the outside air through the first through hole; the MEMS chip is provided with a second through hole, and the MEMS chip is inversely arranged in the cavity, so that the second through hole is opposite to the first through hole; the ASIC chip is buried in the substrate, and the ASIC chip is connected with the MEMS chip. The utility model provides a microphone has less product size or higher acoustic performance.

Description

Microphone and electronic device

Technical Field

The utility model relates to an electronic equipment technical field, more specifically, the utility model relates to a microphone and electronic equipment.

Background

The microphone, known as a microphone, is translated from an english microphone (microphone), and is also called a microphone or a microphone. A microphone is an energy conversion device that converts a sound signal into an electrical signal. There are classes of moving coil, capacitor, electret and recently emerging silicon micro-microphones, but also liquid microphones and laser microphones.

In the conventional technology, some microphone structures usually include a MEMS (Micro-Electro-Mechanical System) chip and an ASIC (Application Specific Integrated Circuit) chip connected to the MEMS chip, which are packaged in a back cavity of the microphone, and the ASIC chip is protected by glue, which is limited by the product size and the packaging rule, the diaphragm area of the MEMS only occupies 10% to 20% of the product area, and the space of the back cavity is occupied by more than 40% of the ASIC chip and the protection glue, so that the performance of the MEMS chip cannot be fully utilized.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a microphone and electronic equipment.

According to a first aspect of the present invention, there is provided a microphone, comprising:

the substrate is provided with a first through hole;

the shell is arranged on one side of the substrate, a cavity is formed between the shell and the substrate, and the cavity is communicated with the outside air through the first through hole;

the MEMS chip is provided with a second through hole, and the MEMS chip is inversely arranged in the cavity so that the second through hole is opposite to the first through hole;

the ASIC chip is buried in the substrate and connected with the MEMS chip.

Optionally, the MEMS chip includes a substrate and a diaphragm assembly disposed on the substrate, and the second through hole is located on the diaphragm assembly;

the diaphragm assembly is disposed on a side proximate to the substrate.

Optionally, the diaphragm assembly is sandwiched between the substrate and the base plate.

and a bonding pad is arranged on one side of the substrate close to the substrate, and the diaphragm assembly is connected with the ASIC chip through the bonding pad.

Optionally, at least a part of the projection of the ASIC chip on the substrate and a part of the projection of the MEMS chip on the substrate overlap each other.

Optionally, a projection of the ASIC chip on the substrate is within a range of a projection of the MEMS chip on the substrate.

Optionally, a first circuit layer is disposed on one side of the substrate close to the MEMS chip, and the ASIC chip is connected to the MEMS chip through the first circuit layer.

Optionally, a second circuit layer is disposed on one side of the substrate, which is far away from the MEMS chip, the second circuit layer is connected to the first circuit layer through a via hole, and the microphone can be connected to an external structure through the second circuit layer.

Optionally, the MEMS chip has a first pin, the ASIC chip has a second pin, the first pin and the second pin are connected, and the first pin and the second pin are disposed opposite to each other.

According to a second aspect of the present invention, there is provided an electronic device comprising the microphone of the first aspect.

The utility model discloses a technological effect does: by embedding the ASIC chip in the substrate and inversely arranging the MEMS chip in the cavity, the second through hole on the MEMS chip is arranged opposite to the first through hole on the substrate, so that the acoustic function of the microphone is realized, the occupied area of the ASIC chip in the cavity is saved, and the overall size of the product is reduced; meanwhile, compared with the existing microphone structure with the same size, the proportion of the MEMS chip in the cavity is improved, and the acoustic performance of the MEMS chip is improved.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic structural diagram of a microphone according to the present invention.

Description of the reference numerals:

1. a substrate; 11. a first through hole; 12. a first circuit layer; 13. a second circuit layer; 2. a cavity; 3. a housing; 4. an MEMS chip; 41. a substrate; 42. a diaphragm assembly; 43. a second through hole; 44. a first pin; 5. an ASIC chip; 51. a second pin.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

As shown in fig. 1, the present invention provides a microphone, which includes a substrate 1, a housing 3, a MEMS chip 4 and an ASIC chip 5; a first through hole 11 is formed in the substrate 1; the shell 3 is arranged on one side of the substrate 1, and forms a cavity 2 with the substrate 1, and the cavity 2 is communicated with the outside air through the first through hole 11; the MEMS chip 4 is provided with a second through hole 43, and the MEMS chip 4 is placed upside down in the cavity 2, so that the second through hole 43 is opposite to the first through hole 11; the ASIC chip 5 is embedded in the substrate 1, and the ASIC chip 5 is connected with the MEMS chip 4.

Specifically, in the present invention, the substrate 1 is connected to one side of the housing 3 to form a cavity 2, and the cavity 2 can communicate with the outside air through the first through hole 11 on the substrate 1, and the second through hole 43 on the MEMS chip 4 is disposed opposite to the first through hole 11. In one embodiment, the MEMS chip 4 has a diaphragm, and the second through hole 43 is located on the diaphragm, so as to balance the air pressure on both sides of the diaphragm during the vibration of the diaphragm. In practical use, an external sound signal acts on the MEMS chip 4 through the first through hole 11 on the substrate 1, so that the diaphragm vibrates, and the MEMS chip 4 can be connected to an external circuit, so that the vibration of the diaphragm is converted into a current signal, thereby implementing an acoustic function of the microphone. In addition, the ASIC chip 5 is connected to the MEMS chip 4, and can process the current signal converted by the MEMS chip 4 to improve the acoustic performance of the microphone.

In the conventional structure, the ASIC chip 5 is also located in the cavity 2, and occupies a considerable cavity space, and the size of the cavity space has a great influence on the performance of the MEMS chip 4, that is, the larger the proportion of the MEMS chip 4 to the cavity volume is, the more favorable the performance of the MEMS chip 4 is. In this embodiment, the ASIC chip 5 is embedded inside the substrate 1, so that the space occupied by the ASIC chip 5 in the cavity 2 is saved, the volume ratio of the MEMS chip 4 in the cavity 2 is increased, the performance of the MEMS chip 4 is well realized, and the acoustic performance of the microphone is improved.

In addition, the ASIC chip 5 is embedded in the substrate 1, so that the overall size of the microphone can be matched with the MEMS chip 4 only, glue for protecting the ASIC chip 5 is not required to be arranged in the cavity 2, the overall size of the microphone is greatly reduced, the microphone can be applied to an application scene in a small space, and the applicability of the microphone is improved. The embedded ASIC chip 5 may be directly formed during the process of manufacturing the substrate 1, or may be formed by drilling after the substrate 1 is manufactured, which is not limited in the present application.

The MEMS chip 4 is placed in the cavity 2 in an inverted mode, the volume of the cavity 2 can be increased to a certain degree, and the connection with the ASIC chip 5 is facilitated, so that the acoustic performance of the microphone is further improved. The MEMS chip 4 is inverted, the MEMS chip 4 can be arranged in the cavity 2 by adopting an inverted pile process, or the volume of the MEMS chip 4 in the cavity 2 is reduced by changing the design structure of the traditional MEMS chip 4, so that the size of a space formed by the MEMS chip 4, the substrate 1 and the shell 3 is increased, and the acoustic performance of the microphone is improved.

Optionally, referring to fig. 1, the MEMS chip 4 includes a substrate 41 and a diaphragm assembly 42 disposed on the substrate 41, and the second through hole 43 is located on the diaphragm assembly 42; the diaphragm assembly 42 is disposed on a side close to the substrate 1.

Specifically, in the present embodiment, the MEMS chip 4 includes a substrate 41 and a diaphragm assembly 42, the second through hole 43 is located on the diaphragm assembly 42, and the substrate 41 is generally used to provide support for the diaphragm assembly 42. In practical application, the diaphragm assembly 42 is disposed on one side close to the substrate 1, that is, the diaphragm assembly 42 is disposed close to the first through hole 11, so that the size of the space between the diaphragm assembly 42 and the housing 3 is increased, and when the external sound signal acts on the diaphragm assembly 42 from the first through hole 11, the signal-to-noise ratio of the microphone can be improved, thereby improving the acoustic performance of the microphone. The diaphragm assembly 42 may include a single diaphragm and a backplate, or a dual diaphragm and a backplate, and may be specifically designed according to the actual requirements of the microphone, which is not limited in this application.

Alternatively, referring to fig. 1, the diaphragm assembly 42 is sandwiched between the substrate 41 and the base plate 1.

Specifically, in this embodiment, the diaphragm assembly 42 is sandwiched between the substrate 41 and the base plate 1, so as to further increase the volume of the cavity 2 and improve the acoustic performance of the microphone. On the other hand, when the substrate 1 is manufactured, the MEMS chip 4 and the substrate can be designed into an integrated structure, so that the waterproof and dustproof performance of the microphone is improved, the manufacturing process is simplified, the production efficiency is improved, and the substrate is suitable for mass production.

Optionally, referring to fig. 1, the MEMS chip 4 includes a substrate 41 and a diaphragm assembly 42 disposed on the substrate 41, and the second through hole 43 is located on the diaphragm assembly 42; a pad is disposed on the substrate 41 on a side close to the substrate 1, and the diaphragm assembly 42 is connected to the ASIC chip 5 through the pad.

Specifically, in the present embodiment, the diaphragm assembly 42 may be connected to a pad through a conductive material such as a wire, and the ASIC chip 5 may be connected through the pad. The bonding pad is arranged on one side close to the substrate 1, so that the connection distance between the MEMS chip 4 and the ASIC chip 5 is shortened, and the realization of the process is facilitated.

Optionally, referring to fig. 1, a projection of the ASIC chip 5 on the substrate 1 and a projection of the MEMS chip 4 on the substrate 1 at least partially overlap each other.

Specifically, the embedded position of the ASIC chip 5 in the substrate 1 may be designed according to the requirement, and in this embodiment, the position of the ASIC chip 5 is set to overlap with at least a portion of the MEMS chip 4 in the planar direction of the substrate 1, that is, a portion or the whole of the ASIC chip 5 is set below the MEMS chip 4, so as to reduce the size of the microphone in the planar direction of the substrate 1. In addition, the ASIC chip 5 is located at least partially overlapping the MEMS chip 4 to facilitate connection of the two.

Alternatively, referring to fig. 1, the projection of the ASIC chip 5 on the substrate 1 is located within the range of the projection of the MEMS chip 4 on the substrate 1. That is, the ASIC chip 5 is completely disposed below the MEMS chip 4, so that when designing the microphone structure, the dimension of the microphone structure in the plane direction of the substrate 1 can be only the dimension of the MEMS chip 4, which greatly reduces the overall dimension of the microphone, improves the ratio of the MEMS chip 4 in the cavity 2, and improves the acoustic performance of the microphone.

Optionally, referring to fig. 1, a first circuit layer 12 is disposed on one side of the substrate 1 close to the MEMS chip 4, and the ASIC chip 5 is connected to the MEMS chip 4 through the first circuit layer 12.

Specifically, in the present embodiment, the first circuit layer 12 is disposed on the substrate 1 on a side close to the MEMS chip 4, so as to facilitate connection of other electronic devices to the MEMS chip 4.

Optionally, referring to fig. 1, a second circuit layer 13 is disposed on a side of the substrate 1 away from the MEMS chip 4, the second circuit layer 13 is connected to the first circuit layer 12 through a via hole, and the microphone can be connected to an external structure through the second circuit layer 13.

Specifically, in this embodiment, the circuits, i.e., the first circuit layer 12 and the second circuit layer 13, are disposed on both sides of the substrate 1, so that in practical applications, the utilization rate of the substrate 1 can be increased, and the integration of the whole microphone can be improved. The MEMS chip 4 is connected with the first circuit layer 12, the first circuit layer 12 is connected with the second circuit layer 13, and when the microphone needs to be applied to other equipment, the microphone can be connected with other equipment through the second circuit layer 13, so that the microphone can be arranged in other electronic equipment as an integral part, and the microphone is more convenient to maintain and replace.

Optionally, referring to fig. 1, the MEMS chip 4 has a first pin 44, the ASIC chip 5 has a second pin 51, the first pin 44 is connected to the second pin 51, and the first pin 44 is disposed opposite to the second pin 51.

Specifically, the actual shapes of the MEMS chip 4 and the ASIC chip 5 can be designed according to the actual requirements of the microphone. In one embodiment, the first lead 44 of the MEMS chip 4 is disposed opposite to the second lead 51 of the ASIC chip 5, so that the connection distance between the two is shortened, thereby facilitating the integrated arrangement of the microphone.

According to a second aspect of the present invention, there is provided an electronic device comprising the microphone provided in the first aspect.

Specifically, in this embodiment, the electronic device may be a mobile phone, an earphone, or a tablet, etc., and the present invention is not limited thereto. When the microphone provided by the embodiment is applied to the electronic equipment, compared with the traditional microphone, the microphone with the same configuration has smaller overall size or higher acoustic performance, on one hand, the arrangement space in the electronic equipment can be saved, and on the other hand, the acoustic experience of the electronic equipment can be improved.

In the above embodiments, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in consideration of brevity of the text.

Although some specific embodiments of the present invention have been described in detail by way of illustration, it should be understood by those skilled in the art that the above illustration is only for purposes of illustration and is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A microphone, comprising:

the substrate is provided with a first through hole;

the ASIC chip is buried in the substrate and connected with the MEMS chip.

2. The microphone of claim 1, wherein the MEMS chip comprises a substrate and a diaphragm assembly disposed on the substrate, and the second through hole is located on the diaphragm assembly;

the diaphragm assembly is disposed on a side adjacent to the substrate.

3. The microphone of claim 2, wherein the diaphragm assembly is sandwiched between the substrate and the baseplate.

4. The microphone of claim 1, wherein the MEMS chip comprises a substrate and a diaphragm assembly disposed on the substrate, the second via being located on the diaphragm assembly;

and a bonding pad is arranged on one side of the substrate close to the substrate, and the diaphragm component is connected with the ASIC chip through the bonding pad.

5. The microphone of claim 1, wherein a projection of the ASIC chip onto the substrate and a projection of the MEMS chip onto the substrate at least partially overlap each other.

6. The microphone of claim 5, wherein a projection of the ASIC chip on the substrate is within a range of a projection of the MEMS chip on the substrate.

7. The microphone of claim 1, wherein a first circuit layer is disposed on a side of the substrate adjacent to the MEMS chip, and the ASIC chip is connected to the MEMS chip through the first circuit layer.

8. The microphone of claim 7, wherein a second circuit layer is disposed on a side of the substrate away from the MEMS chip, the second circuit layer is connected to the first circuit layer through a via, and the microphone can be connected to an external structure through the second circuit layer.

9. The microphone of claim 1, wherein the MEMS chip has a first pin, the ASIC chip has a second pin, the first pin and the second pin are connected, and the first pin is disposed opposite to the second pin.

10. An electronic device, comprising: a microphone according to any of claims 1-9.