CN217428593U - Immersed heat dissipation system - Google Patents
Immersed heat dissipation system Download PDFInfo
- Publication number
- CN217428593U CN217428593U CN202221087768.3U CN202221087768U CN217428593U CN 217428593 U CN217428593 U CN 217428593U CN 202221087768 U CN202221087768 U CN 202221087768U CN 217428593 U CN217428593 U CN 217428593U
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- cooling
- circuit board
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- water
- cooling tank
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Abstract
An immersion heat dissipation system, comprising: a cooling tank having a cooling water inlet line introduced from a lower portion of the cooling tank and an upper opening; a water returning tank disposed around an outer wall of the cooling tank to receive hot water overflowing from an upper opening of the cooling tank and having a hot water drain line; the fixing frame is arranged in the cooling tank and used for vertically fixing the circuit board to be radiated and enabling the circuit board to be vertically fixed to be spaced from the bottom of the cooling tank; a flexible sealing bag with a top opening for placing the circuit board, wherein the sealing bag is arranged on the fixing frame and the top opening of the sealing bag is higher than the upper opening of the cooling groove; and the circulating pump is used for pumping cooling water from an external cooling water source into the cooling water inlet pipeline, wherein the tail end of the cooling water inlet pipeline is positioned near the circuit board fixing position of the fixing frame. The utility model discloses a cooling system can carry out the high-efficient cooling of omnidirectional to the circuit board, has avoided the use of special insulating coolant liquid simultaneously to whole cooling cycle is rationally distributed compactly.
Description
Technical Field
The utility model relates to an submergence formula cooling system especially is suitable for the heat dissipation of the high density circuit board of large data center's computer.
Background
With the rapid development of electronic technology, high-performance chips and integrated circuits are used more and more widely, and meanwhile, the high-performance chips and the integrated circuits have higher and higher power and smaller volume or higher and higher installation density of electronic devices, so that the power consumption and the heat productivity of a unit area are increased dramatically. If the heat is not dissipated in time, the temperature of the electronic device is continuously increased, and the operation stability and the service life are seriously influenced.
Traditional air cooling and water cooling can not meet the heat dissipation requirement of a circuit board with higher heating power, and the problem of local hot spots of a chip is difficult to solve. The immersion liquid cooling is to directly immerse a heating electronic element in insulating cooling liquid and take away heat by means of liquid flow circulation; the cooling method has higher heat dissipation efficiency and lower noise compared with a cold plate or spraying liquid cooling, but the cost is overhigh and the environmental friendliness is poor due to certain toxicity because special cooling liquid needs to be used.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an submergence formula cooling system, its radiating efficiency is high, with low costs and friendly to the environment.
According to the utility model discloses an submergence formula cooling system includes:
a cooling tank having a cooling water inlet line introduced from a lower portion of the cooling tank and an upper opening;
a water returning tank disposed around an outer wall of the cooling tank to receive hot water overflowing from an upper opening of the cooling tank and having a hot water drain line;
the fixing frame is arranged in the cooling groove and used for vertically fixing the circuit board to be radiated and enabling the circuit board to be radiated to be spaced from the bottom of the cooling groove;
a flexible sealing bag with a top opening for placing the circuit board, wherein the sealing bag is arranged on the fixing frame and the top opening of the sealing bag is higher than the upper opening of the cooling groove; and
and the circulating pump is used for pumping cooling water from an external cooling water source into the cooling water inlet pipeline, wherein the tail end of the cooling water inlet pipeline is positioned near the circuit board fixing position of the fixing frame.
According to the utility model discloses an submergence formula cooling system can also be including setting up the temperature sensor near the circuit board fixed position of mount for the discharge of control circulating pump.
According to the utility model discloses an submergence formula cooling system, external cooling water source can contain cooling tower, and wherein the hot water drainage pipeline and the cooling tower selectivity intercommunication of return flume.
According to the utility model discloses an submergence formula cooling system, the wet return is preferred to have along the awl section of thick bamboo shape of radial outside-in height reduction. Preferably, a water inlet gap is formed between the inner wall of the water return tank and the outer wall of the cooling tank.
According to the utility model discloses an submergence formula cooling system, the sealed bag is preferably to fold multilayer sealed bag that the cover is in the same place.
According to the submerged heat dissipation system of the present invention, the top opening of the sealing bag is preferably tied after the circuit board is placed therein.
According to the utility model discloses an submergence formula cooling system treats radiating circuit board and can be large computer's integrated circuit board.
The utility model discloses a cooling system can carry out the high-efficient cooling of omnidirectional to the circuit board, has avoided the use of special insulating coolant liquid simultaneously to whole cooling cycle is overall arrangement compact reasonable.
Drawings
Fig. 1 is a schematic structural diagram of an immersion type heat dissipation system according to the present invention.
Detailed Description
The present invention is further described with reference to the following examples and accompanying drawings, which should be understood by those skilled in the art that the examples and drawings are only for the purpose of better understanding the present invention, and are not intended to limit the present invention in any way.
As shown in fig. 1, the immersed heat dissipation system of the present invention generally includes a cooling tank 4, a water return tank 5, a fixing frame 3, a sealing bag 1, a circulating pump 7 and a cooling tower 6.
The cooling tank 4 has a cooling water inlet line 10 introduced from below and an upper opening (slightly higher than the water return tank 5).
The return water tank 5 is disposed around an outer wall of the cooling tank 4 to receive hot water overflowing from an upper opening of the cooling tank 4 and has a hot water drain line 11. The backwater tank 5 shown in the figure has a tapered cylindrical shape with a height decreasing from outside to inside in the radial direction, and a water inlet gap 12 is formed between the inner cylindrical wall of the backwater tank 5 and the outer cylindrical wall of the cooling tank 4.
The fixing frame 3 is arranged in the cooling tank 4, is spaced from the bottom of the cooling tank 4, and is used for vertically fixing the circuit board 2 to be cooled. The circuit board 2 may be an integrated circuit board of a mainframe computer on which heat-generating electronic devices are arranged. The circuit board 2 may also be further coated with an insulating material.
The sealed bag 1 is a flexible bag, for example made of resin or plastic, having a top opening for inserting the circuit board 1. The sealing bag 1 is arranged on the fixing frame and the top opening of the sealing bag is higher than the upper opening of the cooling tank 4. The sealed bag 1 may be a multi-layered sealed bag stacked together, and the top opening of the sealed bag 1 is fastened after the circuit board 2 is inserted.
The circulation pump 7 is used to pump cooling water from an external cooling water source, such as the cooling water tower 6, into the cooling water inlet line 10. The end of the cooling water inlet pipe 10 is located near the circuit board fixing position of the fixing frame 3. The hot water discharge line 11 of the return flume 5 may be in selective communication with the cooling water tower 6 via a valve.
Although not specifically shown, the immersion heat dissipation system of the present invention may further include a temperature sensor disposed near the circuit board fixing position of the fixing frame 3 for controlling the water flow of the circulation pump 7. For example, when the temperature is too high, the pump water amount of the circulation pump 7 is increased.
The working principle of the heat dissipation system of the present invention is briefly described below. Cooling water enters the circulation pump 7 through the inlet 8 or from the cooling water tower 6 and then enters the cooling tank 4 in the cooling water inlet line 10 in the direction of the arrow a near the location of the circuit board 2. The cooling water, which is changed into hot water after passing through the circuit board 2 sealed by the sealing bag 1, flows upward or overflows the opening of the cooling tank 4, and flows into the water returning tank 5 through the water inlet slits 12 of the water returning tank 5. The hot water in the return water tank 5 is then drained or recirculated in the direction of arrow B through drain 9 in hot water drain line 11 into the cooling tower 6 to be recooled for continued recirculation.
Claims (8)
1. An immersed heat dissipation system, comprising:
a cooling tank having a cooling water inlet line introduced from a lower portion of the cooling tank and an upper opening;
a water returning tank disposed around an outer wall of the cooling tank to receive hot water overflowing from an upper opening of the cooling tank and having a hot water drain line;
the fixing frame is arranged in the cooling tank and used for vertically fixing the circuit board to be radiated and enabling the circuit board to be vertically fixed to be spaced from the bottom of the cooling tank;
a flexible sealing bag with a top opening for placing the circuit board, wherein the sealing bag is arranged on the fixing frame and the top opening of the sealing bag is higher than the upper opening of the cooling groove; and
and the circulating pump is used for pumping cooling water from an external cooling water source into the cooling water inlet pipeline, wherein the tail end of the cooling water inlet pipeline is positioned near the circuit board fixing position of the fixing frame.
2. The submerged heat dissipating system of claim 1, further comprising a temperature sensor disposed near a circuit board securing location of the mounting bracket for controlling water flow of the circulating pump.
3. The submerged heat removal system of claim 1, wherein the external source of cooling water comprises a cooling tower, and wherein the hot water drain line of the water return tank is in selective communication with the cooling tower.
4. The submerged heat dissipating system of claim 1, wherein the water returning tank has a shape of a cone that is reduced in height from outside to inside in a radial direction.
5. The submerged heat dissipation system as recited in claim 4, wherein a water inlet gap is formed between the inner wall of the water return tank and the outer wall of the cooling tank.
6. The submerged heat dissipating system of claim 1, wherein the sealed bag is a multi-layered sealed bag nested together.
7. The submerged heat dissipating system of claim 1, wherein the top opening of the sealed bag is tied after the circuit board is inserted.
8. The submerged heat dissipation system of claim 1, wherein the circuit board to be cooled is an integrated circuit board of a mainframe computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221087768.3U CN217428593U (en) | 2022-05-08 | 2022-05-08 | Immersed heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221087768.3U CN217428593U (en) | 2022-05-08 | 2022-05-08 | Immersed heat dissipation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217428593U true CN217428593U (en) | 2022-09-13 |
Family
ID=83184437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221087768.3U Active CN217428593U (en) | 2022-05-08 | 2022-05-08 | Immersed heat dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217428593U (en) |
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2022
- 2022-05-08 CN CN202221087768.3U patent/CN217428593U/en active Active
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