CN217386282U - Server - Google Patents

Abstract

The application provides a server, which comprises a case, a mainboard, a first heat dissipation module and a second heat dissipation module, wherein the mainboard, the first heat dissipation module and the second heat dissipation module are arranged in the case; the first heat dissipation module is arranged on the first surface and used for dissipating heat of at least part of the electronic components on the first surface; the second heat radiation module is arranged on the second surface and used for radiating the central processing unit on the second surface. The server increases the heat dissipation effect of the server in a double-sided heat dissipation mode.

Description

Server

Technical Field

The embodiment of the application relates to the technical field of electronic equipment, in particular to a server.

Background

The server is one of computers, and has high-speed CPU (central processing unit, chinese name central processing unit) operation capability, long-time reliable operation capability, strong Input/Output (I/O for short) external data throughput capability, and better expansion performance.

In the correlation technique, the server includes quick-witted case and mainboard, the mainboard sets up in the lower part of quick-witted incasement, the mainboard is first towards the one side on quick-witted case upper portion, be provided with multiple electronic components on the first side of mainboard, these multiple electronic components, especially CPU, can produce a large amount of heats at the during operation, in order to guarantee the normal work of server, the upper portion that just is located the mainboard at quick-witted incasement usually is provided with radiator fan in order to dispel the heat to the server, but along with the improvement of server complete machine performance, server CPU's consumption is higher and higher, and then make the heat that the server produced also more and more when the operation.

When the power consumption of the server CPU is large, the server cannot be well cooled by using the cooling method in the related art.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a server, which is used for solving the technical problem that the server with larger power consumption cannot be well cooled by adopting a heat dissipation mode in the related technology.

The embodiment of the present application provides the following technical solutions for solving the above technical problems:

an embodiment of the present application provides a server, where the server includes:

a chassis;

the mainboard is arranged inside the case and provided with a first surface and a second surface, the first surface and the second surface are oppositely arranged, the first surface is provided with various electronic components, and the second surface is provided with at least one central processing unit;

the first heat dissipation module is arranged on the first surface and used for dissipating heat of at least part of the electronic components on the first surface;

and the second heat dissipation module is arranged on the second surface and used for dissipating heat of the central processing unit positioned on the second surface.

The beneficial effects of the embodiment of the application are as follows: according to the server provided by the embodiment of the application, the first heat dissipation module is arranged on the first surface of the mainboard, the second heat dissipation module is arranged on the second surface of the mainboard, the first heat dissipation module is used for dissipating heat of at least part of electronic components on the first surface, the second heat dissipation module is used for dissipating heat of a central processing unit on the second surface, and the heat dissipation effect of the server is improved in a double-surface heat dissipation mode; and central processing unit is the more components and parts of heat production in the server, and in the correlation technique, radiator fan when dispelling the heat to central processing unit, can blow the heat that central processing unit produced to the electronic components who is located central processing unit low reaches on, and then lead to the fact the influence to the electronic components who is located low reaches, this application embodiment sets up central processing unit on the second face, dispels the heat through second heat dissipation module, has reduced the influence of the heat that central processing unit produced to other electronic components.

In a possible implementation manner, the second heat dissipation module includes a second heat dissipation fan and a heat pipe radiator disposed at a rear end of the second heat dissipation fan, and the heat pipe radiator covers the cpu.

In a possible embodiment, the number of the heatpipe radiators is the same as the number of the cpus, and one heatpipe radiator is covered on one cpu.

In a possible implementation manner, the second heat dissipation module further includes an air guiding cover, the air guiding cover is disposed between the second heat dissipation fan and the heat pipe radiator, and the air guiding cover is configured to guide the air blown by the second heat dissipation fan to the heat pipe radiator to dissipate heat of the heat pipe radiator.

In a possible implementation manner, the second heat dissipation module further includes an exhaust fan, and the exhaust fan is disposed at an end of the heatpipe heat sink away from the second heat dissipation fan.

In a possible implementation manner, the first heat dissipation module includes a first heat dissipation fan, and an air outlet direction of the first heat dissipation fan is the same as an air outlet direction of the second heat dissipation fan.

In one possible embodiment, the main board has a first end and a second end which are oppositely arranged, and the first end is provided with a first connector;

the mainboard is also provided with a first hard disk module, the first hard disk module is provided with a second connector which is in plug-in fit with the first connector, and the first hard disk module is in plug-in fit with the mainboard through the first connector and the second connector.

In a possible implementation manner, the first heat dissipation module is disposed in a region of the first surface close to the first end, the first heat dissipation module is configured to dissipate heat of an electronic component located between the first heat dissipation module and the second end, and the electronic component located between the first heat dissipation module and the second end includes a dual in-line memory module, a power supply unit, and an input/output module;

the power supply unit and the input/output module are arranged at the second end, and the dual in-line memory module is arranged between the first heat dissipation module and the area where the power supply unit and the input/output module are located;

the dual in-line type storage modules comprise three groups, the three groups of dual in-line type storage modules are distributed at intervals along the width direction of the case, and a spacing space is formed between every two adjacent dual in-line type storage modules;

the number of the central processing units is two, and the two central processing units are respectively arranged on the second surfaces opposite to the two spacing spaces.

In one possible embodiment, a first space is provided between the first thermal module and the dual inline memory module;

the area of the second face close to the second end is provided with a second space;

the first space, the second space and two all are provided with the second hard disk module in the interval space, the second hard disk module connect in on the mainboard.

In a possible implementation manner, the chassis includes a chassis main body, a chassis upper cover mounted on an upper portion of the chassis main body, a chassis lower cover mounted on a lower portion of the chassis main body, and a rear panel mounted on a rear end of the chassis, and the first hard disk module is located at a front end of the chassis.

In a possible embodiment, a motherboard tray is disposed on the motherboard for mounting the motherboard in the chassis.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

FIG. 1 is a top perspective view of a server according to an embodiment of the present application;

FIG. 2 is a bottom perspective view of a server according to an embodiment of the present application;

FIG. 3 is a top perspective view of the interior of a server according to an embodiment of the present application;

FIG. 4 is a bottom perspective view of the interior of a server according to an embodiment of the present application;

fig. 5 is a bottom perspective view of the server according to the embodiment of the present application with the second heat dissipation module removed;

FIG. 6 is a schematic view of a heat pipe heat sink;

FIG. 7 is a top view of a heatpipe heatsink;

FIG. 8 is a side view of a heatpipe heatsink;

fig. 9 is a top perspective view of a second hard disk module added in a server according to an embodiment of the present application;

fig. 10 is a bottom perspective view of a server with a second hard disk module added therein according to the embodiment of the present application;

FIG. 11 is a simulated temperature cloud for a motherboard with a CPU having a power consumption of 600W;

FIG. 12 is a simulated temperature cloud of a motherboard having a CPU with a power consumption of 800W;

fig. 13 is a simulated temperature cloud for a motherboard with a CPU having a power consumption of 1200W.

Description of reference numerals:

110. a chassis main body; 120. an upper cover of the case; 130. a lower cover of the case; 140. a rear panel;

200. a main board;

210. a dual inline memory module; 220. a power supply unit; 230. a network card; 240. a third hard disk module; 250. an intervening space; 260. a first space; 270. a central processing unit;

300. a first heat dissipation module;

400. a second heat dissipation module;

410. a second heat dissipation fan; 420. a heat pipe radiator; 430. a second space;

421. a heat dissipating fin; 422. a heat pipe; 423. an evaporation zone; 424. a heat dissipation area; 425. a heat sink substrate; 426. a uniform heating plate;

500. a first hard disk module;

600. a motherboard tray;

700. and a second hard disk module.

With the above figures, there are shown specific embodiments of the present application, which will be described in more detail below. These drawings and written description are not intended to limit the scope of the inventive concepts in any manner, but rather to illustrate the inventive concepts to those skilled in the art by reference to specific embodiments.

Detailed Description

In the related art, the server includes quick-witted case and mainboard, the mainboard sets up the lower part in quick-witted case, the mainboard is the first side towards the one side on quick-witted case upper portion, be provided with multiple electronic components on the first side of mainboard, these multiple electronic components, especially CPU, can produce a large amount of heats at the during operation, in order to guarantee the normal work of server, the upper portion that is located the mainboard at quick-witted incasement and is provided with radiator fan usually in order to dispel the heat to the server, but along with the improvement of server complete machine performance, server CPU's consumption is higher and higher, and then make the server also more and more that the heat that produces when moving, adopt the radiating mode among the related art then can't better dispel the heat to the server this moment, when CPU's consumption is greater than 600W usually, adopt the radiating mode among the related art and can's heat dissipation problem of server has been solved. In the related art, the connection mode between the front hard disk module and the motherboard in the server is cable connection, such connection mode can enable a wiring space to be formed between the motherboard and the left and right side walls (two ends in the width direction of the interior of the case), the cooling fan is arranged on one side of the interior of the case close to the front hard disk module, the direction of air outlet of the cooling fan in the case is air blowing towards one side far away from the front hard disk module, the existence of the wiring space can enable airflow in the case to flow back to the front hard disk module along the wiring space, and further influence is caused on the hard disk module, and turbulent flow can be generated in the case, and heat dissipation of the server is influenced. On the other hand, the existence of the wiring space can reduce the space inside the case, so that the size of the main board is limited, and the space for arranging the heat dissipation device is limited.

In view of this, in the embodiment of the present application, the motherboard is disposed in the middle of the case in the thickness direction, the heat dissipation modules are disposed on both sides of the motherboard, the heat dissipation module disposed on one side of the motherboard is used for dissipating heat of the central processing unit, and the heat dissipation module disposed on the other side of the motherboard is used for dissipating heat of a part of electronic components, so as to increase the heat dissipation effect of the server in a double-sided heat dissipation manner.

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

FIG. 1 is a top perspective view of a server according to an embodiment of the present application; FIG. 2 is a bottom perspective view of a server according to an embodiment of the present application; FIG. 3 is a top perspective view of the interior of a server according to an embodiment of the present application; FIG. 4 is a bottom perspective view of the interior of a server according to an embodiment of the present application; fig. 5 is a bottom perspective view of the server according to the embodiment of the present application with the second heat dissipation module removed; FIG. 6 is a schematic view of a heat pipe heat sink; FIG. 7 is a top view of a heatpipe heatsink; FIG. 8 is a side view of a heatpipe heatsink; fig. 9 is a top perspective view of a second hard disk module added in a server according to an embodiment of the present application; fig. 10 is a bottom perspective view of a server with a second hard disk module added therein according to the embodiment of the present application; FIG. 11 is a simulated temperature cloud for a motherboard with a CPU having a power consumption of 600W; FIG. 12 is a simulated temperature cloud of a motherboard having a CPU with a power consumption of 800W; fig. 13 is a simulated temperature cloud for a motherboard with a CPU having a power consumption of 1200W.

As shown in fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, a server according to an embodiment of the present invention includes a chassis, a motherboard 200 disposed in the chassis, a first heat dissipation module 300 disposed in the chassis, and a second heat dissipation module 400 disposed in the chassis. In the embodiment of the present application, in order to meet the requirement that the heat dissipation modules (the first heat dissipation module 300 and the second heat dissipation module 400) are disposed on both sides of the motherboard 200, the external size of the server is greater than 1U, for example, the external size of the server is 2U, 3U, or 4U, and the like, where U is a unit abbreviation representing the unit of the external size of the server, the thickness of 1U is 4.445cm, and the thickness of 2U is 2 times that of 1U, and is 8.89 cm. Of course, when the thicknesses of the first heat dissipation module 300 and the second heat dissipation module 400 are small, the external size of the server may also be 1U, which is not particularly limited herein.

As shown in fig. 1 and 2, the chassis includes a chassis main body 110, a chassis upper cover 120 mounted on an upper portion of the chassis main body 110, a chassis lower cover 130 mounted on a lower portion of the chassis main body 110, and a rear panel 140 mounted on a rear end of the chassis, and a first hard disk module 500 described below is disposed on a front end of the chassis.

As shown in fig. 3, 4 and 5, the motherboard 200 has a first side and a second side, the first side and the second side are disposed opposite to each other, the first side faces the upper case cover 120, the second side faces the lower case cover 130, various electronic components, such as Dual-Inline Memory Modules 210 (abbreviated as DIMMs), Power supply units 220(PC Power supply units, abbreviated as PSUs), are disposed on the first side, at least one central processing unit 270 (abbreviated as CPU) is disposed on the second side, the first thermal module 300 is disposed on the first side for dissipating heat of at least some of the electronic components on the first side, the second thermal module 400 is disposed on the second side for dissipating heat of the central processing unit 270 on the second side, that is, both sides of the motherboard 200 are disposed with thermal Modules, the thermal module disposed on one side for dissipating heat of the central processing unit 270, the heat dissipation module arranged on the other side is used for dissipating heat of part of electronic components, and the heat dissipation effect of the server is improved in a double-side heat dissipation mode. And central processing unit 270 is the more electronic components of heat production in the server, in the correlation technique, radiator fan when dispelling the heat to central processing unit 270, can blow the heat that central processing unit 270 produced to the electronic components who is located central processing unit 270 low reaches (along the direction of radiator fan air-out), and then lead to the fact the influence to the electronic components who is located the low reaches, this application embodiment sets up central processing unit 270 on the second face, dispel the heat through second heat dissipation module 400, the influence of the heat that has reduced central processing unit 270 and produced other electronic components.

As shown in fig. 4, the second heat dissipation module 400 includes a second heat dissipation fan 410 and a heat pipe heat sink 420 disposed at a rear end of the second heat dissipation fan 410, wherein the heat pipe heat sink 420 covers the cpu 270. That is, the cpu 270 in the embodiment of the present application radiates heat through the heat pipe radiator 420. Compared with the cooling method of the heat dissipation fan, the cooling of the cpu 270 can be accelerated by cooling the cpu 270 with the heat pipe radiator 420. Optionally, as shown in fig. 6, 7 and 8, the heat pipe radiator 420 includes a heat distributing plate 426, a radiator base plate 425 and heat dissipating fins 421 that are sequentially stacked, heat pipes 422 are arranged in the heat dissipating fins 421, the number of the heat pipes 422 may be designed according to actual situations, the number of the heat pipes 422 may be 6, 8, 10, and the like, each heat pipe 422 has an evaporation area 423 and a condensation area 424, where the evaporation area 423 is located in the middle of the heat pipe radiator 420 and located on one side of the heat dissipating fins 421 close to the heat distributing plate 426, an area of the heat distributing plate 426 corresponding to the position of the evaporation area 423 is attached to the CPU to dissipate heat of the CPU, the condensation area 424 is located on one side of the heat dissipating fins 421 away from the heat distributing plate 426, and the outlet air of the second heat dissipating fan 410 is blown to the heat dissipating fins 421 to dissipate heat of the condensation area 424. That is, the liquid in the heat pipe 422 evaporates in the evaporation area 423 to absorb heat, and condenses in the condensation area 424 to dissipate heat.

In some embodiments of the present application, the number of the heatpipe radiators 420 is the same as that of the cpus 270, and one heatpipe radiator 420 covers one cpu 270, that is, one heatpipe radiator 420 has one evaporation area 423, and the evaporation area 423 is disposed corresponding to the cpu 270 to radiate heat to the cpu 270, for example, the number of the cpus 270 is two, so that the number of the heatpipe radiators 420 is two, the two heatpipe radiators 420 radiate heat to the two cpus 270 respectively, and at the same time, the second cooling fans 410 are disposed in one group, and the group of the second cooling fans 410 is used for radiating heat to the two heatpipe radiators 420. Of course, for example, the number of the heatpipe radiators 420 is different from the number of the cpus 270, for example, the number of the cpus 270 is two, the number of the heatpipe radiators 420 is one, the heatpipe radiators 420 are provided with two evaporation areas 423, and the two evaporation areas 423 respectively dissipate heat of the two cpus 270.

In order to increase the heat dissipation efficiency of the heatpipe radiator 420, the second heat dissipation module 400 further includes an air guiding cover (not shown) disposed between the second cooling fan 410 and the heatpipe radiator 420, and the air guiding cover is used for guiding the air blown by the second cooling fan 410 to the heatpipe radiator 420 to dissipate the heat of the heatpipe radiator 420.

As shown in fig. 3, the first heat dissipation module 300 includes a first heat dissipation fan, and an air outlet direction of the first heat dissipation fan is the same as an air outlet direction of the second heat dissipation fan 410. That is to say, the air-out direction of the first cooling fan is to blow to the rear end of the server, the air-out direction of the second cooling fan 410 is also to blow to the rear end of the server, this setting makes the direction of air flow about the mainboard 200 the same, can accelerate the heat dissipation of the server, and simultaneously, if the air-out direction of the first cooling fan is different from the air-out direction of the second cooling fan 410, the upper and lower two parts of the mainboard 200 can be made to generate heat convection, that is, the first cooling fan blows heat to the rear end of the server, and the second cooling fan 410 blows heat to the front end of the server, which is not favorable for the heat dissipation of the server, therefore, the air-out direction of the first cooling fan is the same as the air-out direction of the second cooling fan 410.

In this embodiment, the main board 200 has a first end and a second end opposite to each other, the first end is located at the front end of the chassis, the second end is located at the rear end of the chassis, that is, the end close to the rear panel 140, and the first end is provided with a first connector. The motherboard 200 is further provided with a first hard disk module 500 (i.e. a front hard disk module located in the server), the first hard disk module 500 is provided with a second connector in plug-in fit with the first connector, and the first hard disk module 500 is plugged in the motherboard 200 through the cooperation of the first connector and the second connector. That is to say, the first connector and the second connector are a male connector and a female connector, which are matched with each other, and the first hard disk module 500 can be plugged onto the motherboard 200 by the cooperation of the male connector and the female connector. Compared with the mode that the first hard disk module 500 is connected to the main board 200 through the cable in the related art, the arrangement can eliminate the cable usage amount and the usage cost on the one hand, and can eliminate the wiring space between the main board 200 and the left and right side walls of the case, so as to increase the utilization space in the case, that is, the arrangement can omit the cable for connecting the first hard disk module 500 and the main board 200, so as to vacate the space for placing the cable (the cable for connecting the first hard disk module 500 and the main board 200) in the case, so that the left and right length of the main board 200 can be properly increased after the vacated space, the main board 200 can extend to one side of the first hard disk module 500, so as to increase the size of the main board 200, so as to enable more electronic components to be arranged on the main board 200, and the cable (the cable for connecting the first hard disk module 500 and the main board 200) in the case can be placed After the space is vacated, the first and second heat dissipation fans 410 may move a certain distance to one side of the first hard disk assembly, so that the installation space of the heat pipe radiator 420 is larger, and the heat dissipation effect of the server can be increased. After the wiring space is eliminated, the main board 200 extends to the left and right sides, and the left and right sides of the first and second heat dissipation fans 410 also extend to the left and right side walls of the chassis, so that the air backflow can be prevented, and further, the influence of the air backflow on the first hard disk module 500 is avoided. In the embodiment of the present application, for example, taking a server with an external size of 2U as an example, compared to a manner in which the first hard disk module 500 is connected to the motherboard 200 through a cable in the related art, the manner in which the first hard disk module 500 is plugged onto the motherboard 200 through the mating of the first connector and the second connector can increase the installation space of the heat pipe radiator 420 by about 3 times.

Optionally, the first thermal module 300 is disposed in an area of the first surface near the first end, and the first thermal module 300 is configured to dissipate heat of the electronic component located between the first thermal module 300 and the second end, in this embodiment, all the electronic components located on the first surface are disposed between the first thermal module 300 and the second end. The electronic components located between the first heat dissipation module 300 and the second end include a dual in-line memory module 210, a power supply unit 220, and an Input/Output (I/O) module, where the Input/Output module includes a Network Card 230 (NIC for short) and a third hard disk module 240. The power supply unit 220 and the input/output module are disposed at the second end, wherein the network card 230 is disposed between the third hard disk module 240 and the power supply unit 220, and the dual inline memory module 210 is disposed between the first heat sink module 300 and the area where the power supply unit 220 and the input/output module are located.

Further, the dual in-line memory modules 210 include three sets, the three sets of dual in-line memory modules 210 are distributed at intervals along the width direction of the chassis, and an interval space 250 is formed between two adjacent dual in-line memory modules 210;

the number of the central processing units 270 is two, the two central processing units 270 are respectively arranged on the second surfaces opposite to the two spacing spaces 250, the arrangement enables most of heat generated by the two central radiators to be taken away by wind blown by the second cooling fans 410, heat generated by electronic components on the first surfaces is taken away by wind blown by the first cooling fans, the heat generated by the two central radiators cannot be blown to the input/output module, and the influence of heat cascade of the central processing units 270 on the input/output module is reduced.

In the present embodiment, a first space 260 is formed between the first thermal module 300 and the dual inline memory module 210, and a second space 430 is formed on the second surface near the second end. That is to say, in the embodiment of the present application, the motherboard 200 is disposed in the middle of the thickness direction in the chassis, and the first hard disk module 500 is plugged onto the motherboard 200 through the cooperation of the first connector and the second connector, so that a part of the idle spaces are left on the motherboard 200, and the idle spaces include two spacing spaces 250, the first space 260, and the second space 430. Some electronic components may be disposed in these vacant spaces, and some second hard disk modules 700 may also be disposed, for example, as shown in fig. 9 and 10, the second hard disk modules 700 are disposed in the first space 260, the second space 430 and the two spacing spaces 250, and the second hard disk modules 700 are connected to the motherboard 200. Taking a server with an external size of 2U as an example, 5 Hard Disk drives (Hard Disk drives, abbreviated as HDDs) can be disposed in the first space 260, 10 Hard Disk drives can be disposed in the second space 430, 2 Hard Disk drives can be disposed in each partition 250, the third Hard Disk module 240 in the server includes 2 Hard Disk drives or solid state disks, the first space 260, the second space 430, the Hard Disk drives disposed in the two partition spaces 250, and the third Hard Disk module 240 are all built-in Hard disks, the first Hard Disk module 500 is a front Hard Disk, and the first Hard Disk module 500 includes 12 Hard Disk drives, that is, 21 sets of built-in Hard disks and 12 sets of front Hard disks can be accommodated in the server with an external size of 2U.

In the embodiment of the present application, a motherboard 200 tray for installing the motherboard 200 in the chassis is further disposed on the motherboard 200, and the motherboard 200 tray can support the motherboard 200 at the same time. The first hard disk module 500 includes a first hard disk module 500 body and a back plate connected to the first hard disk module 500.

It should be noted that the first Hard Disk module 500, the second Hard Disk module 700, and the third Hard Disk module 240 may be Solid State Disks (SSD), Hard Disk Drives (HDD), or a combination of a Solid State Disk and a Hard Disk Drive, for example, the first Hard Disk module 500 and the second Hard Disk module 700 are Hard Disk drives, and the third Hard Disk module 240 is a Solid State Disk.

As shown in fig. 11, fig. 11 is a simulated temperature cloud diagram of the motherboard 200 with two CPUs consuming 600W power, wherein the maximum allowable operating temperature of the CPU is 77 ℃, the external size of the server is 2U, and the measurement result of the simulated temperature cloud diagram of the motherboard 200 shows that the average temperature of one CPU is 68.3 ℃, the stable temperature of the other CPU is 67.1 ℃, and the operating temperature requirement of the CPU is met.

As shown in fig. 12, fig. 12 is a simulated temperature cloud diagram of the motherboard 200 with two CPUs consuming 800W using the solution of the above embodiment, wherein the maximum allowable operating temperature of the CPU is 77 ℃, the external size of the server is 2U, and the measurement result of the simulated temperature cloud diagram of the motherboard 200 shows that the average temperature of one of the CPUs is 78.6 ℃, although the overtemperature is 1.6 ℃, the risk is controllable, and the steady temperature of the other CPU is 76.8 ℃, which substantially meets the operating temperature requirement of the CPU.

In some embodiments of the present application, in order to further increase the heat dissipation effect of the server, the second heat dissipation module 400 further includes a suction fan disposed at an end of the heatpipe heat sink 420 away from the second heat dissipation fan 410. That is to say, one end of the heat pipe radiator 420 is provided with the second cooling fan 410, and the other end is provided with the exhaust fan, the second cooling fan 410 blows air to the heat pipe radiator 420, the exhaust fan exhausts air in the heat pipe radiator 420, and the second cooling fan 410 and the exhaust fan cooperate to accelerate air flow in the heat pipe radiator 420, so as to take away hot air in the heat pipe radiator 420 quickly, and increase the cooling efficiency of the heat pipe radiator 420. This arrangement is used to enable heat dissipation of the main board 200 having a CPU with power consumption of 1200W, and the heat dissipation effect can satisfy the demand.

As shown in fig. 13, fig. 13 is a simulated temperature cloud diagram of the motherboard 200 with two CPUs with power consumption of 1200W, wherein the maximum allowable operating temperature of the CPU is 77 ℃, the external size of the server is 2U, and the measurement result of the simulated temperature cloud diagram of the motherboard 200 shows that the average temperature of one of the CPUs is 69.4 ℃, although the overtemperature is 1.6 ℃, the risk is controllable, and the steady temperature of the other CPU is 69.5 ℃, which meets the operating temperature requirement of the CPU.

In summary, the server provided by the embodiment of the application can meet the heat dissipation requirement of the server with a CPU with larger power consumption.

The server provided by the embodiment of the application can comprise the following assembling modes during installation:

the first step is as follows: the motherboard 200 and the motherboard 200 tray are installed together, and then the backplane connected with the first hard disk module 500 is inserted into the motherboard 200.

The second step is that: the first-step mounted assembly is integrally mounted in the chassis body, the last electronic component and the first cooling fan are mounted on the first surface of the main board 200, and the second cooling module 400 and the central processor 270 are mounted on the second surface of the main board 200.

The third step: after the second step of installation, the upper case top 120, the lower case top 130 and the rear panel 140 are installed.

The fourth step: the first hard disk module 500 and the power supply unit 220 are installed to complete the installation.

This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (10)

1. A server, characterized in that the server comprises:

a chassis;

the mainboard is arranged inside the case and provided with a first surface and a second surface, the first surface and the second surface are oppositely arranged, the first surface is provided with various electronic components, and the second surface is provided with at least one central processing unit;

the first heat dissipation module is arranged on the first surface and used for dissipating heat of at least part of the electronic components on the first surface;

and the second heat dissipation module is arranged on the second surface and used for dissipating heat of the central processing unit positioned on the second surface.

2. The server according to claim 1, wherein the second heat sink module comprises a second heat sink fan and a heat pipe heat sink disposed at a rear end of the second heat sink fan, and the heat pipe heat sink covers the cpu.

3. The server according to claim 2, wherein the number of the heatpipe radiators is the same as the number of the cpus, and one of the heatpipe radiators is covered with one of the cpus.

4. The server according to claim 2, wherein the second heat dissipation module further comprises an air guiding cover, the air guiding cover is disposed between the second heat dissipation fan and the heatpipe heat sink, and the air guiding cover is configured to guide the air blown by the second heat dissipation fan to the heatpipe heat sink to dissipate heat of the heatpipe heat sink.

5. The server according to claim 4, wherein the second heat sink module further comprises an exhaust fan disposed at an end of the heatpipe heat sink away from the second heat sink fan.

6. The server according to claim 4, wherein the first heat dissipation module comprises a first heat dissipation fan, and an air outlet direction of the first heat dissipation fan is the same as an air outlet direction of the second heat dissipation fan.

7. The server according to any one of claims 1-6, wherein the motherboard has a first end and a second end arranged opposite to each other, the first end being provided with a first connector;

the mainboard is also provided with a first hard disk module, the first hard disk module is provided with a second connector which is in plug-in fit with the first connector, and the first hard disk module is in plug-in fit with the mainboard through the first connector and the second connector.

8. The server according to claim 7, wherein the first thermal module is disposed in a region of the first surface near the first end, the first thermal module is configured to dissipate heat of an electronic component located between the first thermal module and the second end, and the electronic component located between the first thermal module and the second end includes a dual in-line memory module, a power supply unit, and an input/output module;

the power supply unit and the input/output module are arranged at the second end, and the dual in-line storage module is arranged between the first heat dissipation module and the area where the power supply unit and the input/output module are located.

9. The server according to claim 8, wherein the dual inline memory modules comprise three groups, the three groups of dual inline memory modules are spaced apart along the width direction of the chassis, and a spacing space is formed between two adjacent dual inline memory modules;

the number of the central processing units is two, and the two central processing units are respectively arranged on the second surfaces opposite to the two spacing spaces.

10. The server according to claim 9, wherein the first thermal module and the dual in-line memory module have a first space therebetween;

the area of the second face close to the second end is provided with a second space;

the first space, the second space and two all are provided with the second hard disk module in the interval space, the second hard disk module connect in on the mainboard.

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