CN217116512U

CN217116512U - Printed circuit board

Info

Publication number: CN217116512U
Application number: CN202220017111.3U
Authority: CN
Inventors: 王成谷
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2022-01-05
Filing date: 2022-01-05
Publication date: 2022-08-02
Anticipated expiration: 2032-01-05

Abstract

The utility model discloses a printed circuit board, include: the double-sided conductive plate comprises a first dielectric layer and first conductive layers which are attached to two opposite sides of the first dielectric layer; the adhesive layer is arranged on one side, away from the first dielectric layer, of the first conductive layer; the single-sided conductive plate comprises a second dielectric layer and a second conductive layer which is attached to one side of part of the second dielectric layer; the second dielectric layer is attached to one side, far away from the first conducting layer, of the adhesive layer, so that the second dielectric layer and the first conducting layer are fixed through the adhesive layer. Through the structure, the utility model discloses can attenuate printed circuit board thickness, realize printed circuit board's miniaturization and lightness.

Description

Printed circuit board

Technical Field

The utility model discloses be applied to printed circuit board.

Background

Pcb (printed Circuit board), also known as printed Circuit board or printed Circuit board, is an important electronic component used in a wide range of applications, is a support for electronic components, and is also a carrier for electrical connection of electronic components.

With the increasingly thinner and smaller assembly space of electronic products in various application fields, increasingly stringent thickness and size requirements are put forward on the rigid-flex circuit board.

However, in the current flex-rigid circuit board, a flexible area of the flex-rigid circuit board is usually prepared by a CVL (flex-rigid circuit board or a flexible circuit board is used for a cover layer/film of a flexible board layer for insulation and circuit protection), but the flex-rigid circuit board prepared by the method has a large thickness, and is not beneficial to miniaturization and lightness.

SUMMERY OF THE UTILITY MODEL

The utility model provides a printed circuit board to the thickness of the circuit board who exists among the solution prior art is great, is unfavorable for the problem of miniaturization and portability.

In order to solve the technical problem, the utility model provides a printed circuit board, include: the double-sided conductive plate comprises a first dielectric layer and first conductive layers which are attached to two opposite sides of the first dielectric layer; the adhesive layer is arranged on one side, away from the first dielectric layer, of the first conductive layer; the single-sided conductive plate comprises a second dielectric layer and a second conductive layer which is attached to one side of part of the second dielectric layer; the second dielectric layer is attached to one side, far away from the first conducting layer, of the adhesive layer, so that the second dielectric layer and the first conducting layer are fixed through the adhesive layer.

The adhesive layer and one side of the first conducting layer, which is far away from the first dielectric layer, are attached.

The printed circuit board further comprises at least one third dielectric layer and at least one third conducting layer; the at least one third dielectric layer and the at least one third conductive layer are sequentially stacked and attached between the adhesive layer and the double-sided conductive plate; wherein, the one side of the third dielectric layer that is close to first conducting layer sets up with the laminating of first conducting layer, and the third conducting layer of keeping away from first conducting layer sets up with the laminating of glue film.

The printed circuit board further comprises at least one fourth dielectric layer and at least one fourth conducting layer which are sequentially stacked and attached; the at least one fourth dielectric layer and the at least one fourth conducting layer which are sequentially stacked and attached are arranged on one side, away from the double-sided conducting plate, of the single-sided conducting plate, and the fourth dielectric layer close to one side of the single-sided conducting plate is attached to the second conducting layer of the single-sided conducting plate.

And the projections of the at least one fourth dielectric layer, the at least one fourth conducting layer and the second conducting layer which are sequentially stacked and attached to each other on the first plane are completely overlapped.

The width of the at least one fourth conducting layer is arranged in a stepped mode, and the width of the at least one fourth conducting layer is gradually reduced along the direction of the double-sided conducting plate towards the at least one fourth conducting layer.

Wherein, the printed circuit board is provided with at least one groove; at least one groove at least penetrates through the second conducting layer and reaches the second dielectric layer to expose part of the second dielectric layer.

Wherein the printed circuit board further comprises at least one conductive via; at least one conductive via is used to conduct the conductive layers of the printed circuit board.

The printed circuit board comprises at least two layers of single-sided conductive plates; at least two layers of single-sided conductive plates are respectively arranged on two sides of the double-sided conductive plate.

The printed circuit board further comprises a solder mask layer; the solder mask layers are arranged on two opposite sides of the printed circuit board and are arranged at intervals with the second dielectric layer.

The utility model has the advantages that: be different from prior art's condition, the utility model discloses a printed circuit board passes through the glue film and keeps away from the fixed single face current conducting plate that sets up in one side of first dielectric layer at the first conducting layer of two-sided current conducting plate to the second dielectric layer that utilizes the single face current conducting plate forms printed circuit board's flexible region, and the conducting layer that utilizes the second conducting layer that sets up with the laminating of second dielectric layer directly to realize printed circuit board increases the layer, thereby saves the pressfitting prepreg, and then the thickness of attenuate printed circuit board, realizes printed circuit board's miniaturization and lightness.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the printed circuit board of the present invention;

fig. 2 is a schematic structural diagram of another embodiment of the printed circuit board of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a printed circuit board of the present invention. The embodiment takes a 6-layer circuit board as an example for explanation, the specific structure is only illustrated and not limited, and when the number of the printed circuit boards is multiple, the structure is similar to that of the embodiment.

The printed circuit board 100 of the present embodiment includes: a double-sided conductive plate 101, a glue layer 102, and a single-sided conductive plate 103.

The double-sided conductive plate 101 includes a first dielectric layer 1012 and a first conductive layer 1011 attached to two opposite sides of the first dielectric layer 1012.

The glue layer 102 is disposed on a side of the first conductive layer 1011 away from the first dielectric layer 1012. In a specific application scenario, the glue layer 102 may be disposed to adhere to a side of the first conductive layer 1011 away from the first dielectric layer 1012. In another specific application scenario, the glue layer 102 may also be disposed at a distance from the side of the first conductive layer 1011 away from the first dielectric layer 1012. The arrangement between the adhesive layer 102 and the first conductive layer 1011 of the double-sided conductive plate 101 may be determined by whether a conductive layer needs to be added between the double-sided conductive plate 101 and the single-sided conductive plate 103 in actual production, and is not limited herein.

The glue layer 102 may be disposed on a side of the first conductive layer 1011 of the double-sided conductive plate 101 away from the first dielectric layer 1012, or may be disposed on a side of the first conductive layer 1011 of the double-sided conductive plate 101 away from the first dielectric layer 1012 through two glue layers 102, so as to correspond to the printed circuit board 100 in the single-sided flexible region and the printed circuit board 100 in the double-sided flexible region, respectively.

The single-sided conductive plate 103 includes a second dielectric layer 1031 and a second conductive layer 1032 attached to one side of a portion of the second dielectric layer 1031; the second dielectric layer 1031 is attached to one side of the adhesive layer 102 far from the first conductive layer 1011, so that the second dielectric layer 1031 and the first conductive layer 1011 are fixed through the adhesive layer 102. When a glue layer 102 is arranged on one side of the first conductive layer 1011 of the double-sided conductive plate 101 away from the first dielectric layer 1012, the single-sided conductive plate 103 can be arranged on the other side of the glue layer 102; when the two adhesive layers 102 are respectively disposed on the two first conductive layers 1011 of the double-sided conductive plate 101 on the side away from the first dielectric layer 1012, the two single-sided conductive plates 103 may be respectively disposed on the other sides of the two adhesive layers 102, so as to respectively correspond to the printed circuit board 100 in the single-sided flexible region and the printed circuit board 100 in the double-sided flexible region.

Each conductive layer of this embodiment may include a conductive metal layer such as a copper layer, a gold layer, a silver layer, or an alloy layer, which may be selected based on the actual situation, and is not limited herein. The first dielectric layer 1012 of the double-sided conductive plate 101 of this embodiment may include one or more of an epoxy resin layer, a Polyimide (PI) layer, a Bismaleimide Triazine (BT) layer, and a ceramic base layer, which may be specifically selected based on actual situations, and is not limited herein. The single-sided conductive plate 103 of the present embodiment may include a polyimide layer or other insulating layer with certain flexibility for forming the flexible region of the printed circuit board 100. In a specific application scenario, the double-sided conductive plate 101 may be a double-sided copper-clad plate, and the single-sided conductive plate 103 may be a single-sided copper-clad plate.

The printed circuit board 100 of the embodiment may be applied to the fields of communications, medical treatment, consumer electronics, military industry, aerospace, and the like, which is not limited herein.

In the preparation of the conventional printed circuit board, the arrangement of the insulating layer with certain flexibility in the flexible region needs to be performed by coating the adhesive layer 102 on one side of the first conductive layer 1011 to adhere the insulating layer, and when the adding of the second conductive layer 1032 is performed on one side of the insulating layer away from the first conductive layer 1011, the prepreg and the second conductive layer 1032 need to be further pressed, so as to realize the adding of the second conductive layer 1032, while in the embodiment, the second dielectric layer 1031 and the second conductive layer 1032 which are arranged in an attaching manner are directly fixed and added through the adhesive layer 102 by the arrangement of the single-sided conductive plate 103, so that the same physical properties between the second dielectric layer 1031 and the insulating layer in the single-sided conductive plate 103 can be utilized to replace the insulating layer to prepare the flexible region through the second dielectric layer 1031 of the single-sided conductive plate 103, and the adding of the conductive layer is directly completed through the second conductive layer 1032 of the single-sided conductive plate 103, therefore, on the premise of ensuring that the insulating layer with certain flexibility is arranged on the flexible area, the arrangement of the prepreg and the thickness of the prepreg are omitted, so that the preparation process of the printed circuit board 100 is omitted, and the thickness of the printed circuit board 100 is reduced. When the printed circuit board 100 needs to be provided with the flexible regions on both sides, the thickness of at least two prepregs can be saved.

Through the structure, the printed circuit board of the embodiment is fixedly provided with the single-sided conductive plate on one side, away from the first dielectric layer, of the first conductive layer of the double-sided conductive plate through the glue layer, so that the second dielectric layer of the single-sided conductive plate is utilized to form the flexible area of the printed circuit board, and the conductive layer of the printed circuit board is directly added by utilizing the second conductive layer arranged in a manner of being attached to the second dielectric layer, so that a laminating prepreg is omitted, the thickness of the printed circuit board is further reduced, and the miniaturization and the lightness of the printed circuit board are realized.

In other embodiments, the glue layer 102 is attached to a side of the first conductive layer 1011 of the double-sided conductive plate 101 away from the first dielectric layer 1012, and the glue layer 102 is further attached to the second dielectric layer 1031, so that the first conductive layer 1011 of the double-sided conductive plate 101 and the second dielectric layer 1031 of the single-sided conductive plate 103 are directly adhered and fixed by the glue layer 102. The bonding method corresponds to an embodiment in which an additional conductive layer is not required between the double-sided conductive plate 101 and the single-sided conductive plate 103.

In other embodiments, the printed circuit board 100 further includes at least one fourth dielectric layer 104 and at least one fourth conductive layer 105 sequentially stacked and attached.

At least one fourth dielectric layer 104 and at least one fourth conductive layer 105, which are sequentially stacked and attached to each other, are disposed on the side of the single-sided conductive plate 103 away from the double-sided conductive plate 101, and the fourth dielectric layer 104 on the side close to the single-sided conductive plate 103 is attached to the second conductive layer 1032 of the single-sided conductive plate 103.

The number of the fourth dielectric layers 104 is the same as that of the fourth conductive layers 105, so that the corresponding fourth conductive layers 105 are bonded through the fourth dielectric layers 104. The specific number of the fourth dielectric layer 104 and the fourth conductive layer 105 may be 4, 5, 10, and the like, and may be specifically set based on the layer number requirement of the printed circuit board 100, which is not limited herein.

The fourth dielectric layer 104 may include one or more of an epoxy resin layer, a Polyimide (PI) layer, a Bismaleimide Triazine (BT) layer, and a ceramic base layer, which may be specifically selected based on actual situations and is not limited herein. The fourth conductive layer 105 may include a conductive metal layer such as a copper layer, a gold layer, a silver layer, or an alloy layer, which may be selected based on practical situations and is not limited herein.

In other embodiments, at least one fourth dielectric layer 104 and at least one fourth conductive layer 105 stacked and attached in sequence completely overlap with a projection of the second conductive layer 1032 on the first plane, that is, the sizes of the fourth conductive layers 105 on the same side are the same. Here, since the second conductive layer 1032 is attached to a portion of the second dielectric layer 1031, and the second dielectric layer 1031 is not attached to the second conductive layer 1032, a flexible region of the printed circuit board 100 is formed, which needs to be exposed. Then, the projection of the at least one fourth dielectric layer 104, the at least one fourth conductive layer 105 and the second conductive layer 1032, which are sequentially stacked and attached to each other, on the first plane are completely overlapped, so that the fourth dielectric layer 104 and the fourth conductive layer 105 do not shield the exposed second dielectric layer 1031, thereby facilitating the application of the flexible region.

In other embodiments, at least one recess 106 is provided on the printed circuit board 100; the at least one recess 106 extends through at least the second conductive layer 1032 and reaches the second dielectric layer 1031 to expose a portion of the second dielectric layer 1031, i.e. the bottom of the at least one recess 106 is formed by the second dielectric layer 1031, so as to expose the second dielectric layer 1031 with a certain flexibility to form a flexible region of the printed circuit board 100. While the outermost conductive layer of the printed circuit board 100 forms a rigid area of the printed circuit board 100.

In a specific application scenario, when at least one fourth dielectric layer 104 and at least one fourth conductive layer 105 are disposed on a side of the printed circuit board 100 where the at least one recess 106 is disposed, the at least one recess 106 penetrates all the fourth dielectric layers 104, all the fourth conductive layers 105, and the second conductive layer 1032 on the side to reach the second dielectric layer 1031, so as to expose a portion of the second dielectric layer 1031.

At least one groove 106 may be disposed on one side or both sides of the printed circuit board 100, or may be disposed in the middle or an edge of a certain side of the printed circuit board 100, or a plurality of grooves 106 may be disposed on a certain side of the printed circuit board 100, and the specific arrangement may be set based on actual conditions, which is not limited herein.

In other embodiments, the printed circuit board 100 further comprises at least one conductive via 107; at least one conductive via 107 is used to conduct the conductive layers of the printed circuit board 100.

In a specific application scenario, one conductive via 107 of the printed circuit board 100 may communicate with 2 conductive layers, another conductive via 107 may communicate with 4 conductive layers, another conductive via 107 may communicate with 6 conductive layers, and so on, wherein the connection of each conductive via 107 may be set based on actual conditions, but generally, the connection of each conductive via 107 of the printed circuit board 100 needs to communicate with all conductive layers.

In other embodiments, the printed circuit board 100 may include at least two layers of single-sided conductive plates 103, wherein the at least two layers of single-sided conductive plates 103 are disposed on two sides of the double-sided conductive plate 101, respectively, to provide two layers of second dielectric layers 1031 and two layers of second conductive layers 1032 on two sides of the double-sided conductive plate 101, respectively, so as to prepare the printed circuit board 100 with the double-sided flexible region.

In other embodiments, the printed circuit board 100 further includes a solder resist layer (not shown); the solder resist layers are disposed on opposite sides of the printed circuit board 100 and spaced apart from the second dielectric layer 1031. That is, the solder resist layer exposes the second dielectric layer 1031, so as to prevent the solder resist material from affecting the bending performance of the flexible region formed by the second dielectric layer 1031.

The solder resist layer may include an ink or an insulating film to protect opposite sides of the printed circuit board 100 and to prevent solder from contacting locations on the printed circuit board 100 where soldering is not required, causing a short circuit or burn-in, and improving reliability of the printed circuit board 100.

Referring to fig. 2, fig. 2 is a schematic structural diagram of another embodiment of the printed circuit board of the present invention.

The position connection relationship between the first dielectric layer 2012 and the first conductive layer 2011 in the double-sided conductive plate 201, the position connection relationship between the second dielectric layer 2031 and the second conductive layer 2032 of the single-sided conductive plate 203, the position connection relationship between the glue layer 202 and the second dielectric layer 2031 of the single-sided conductive plate 203, the corresponding relationship and arrangement between the fourth dielectric layer 204 and the fourth conductive layer 205, the arrangement of the conductive holes 207, the arrangement of the solder resist layer, the arrangement of the flexible region formed by the second dielectric layer 2031, the material between the layers, and the like in the printed circuit board 200 of the embodiment are the same as those in the foregoing embodiment, and are not described herein again.

The printed circuit board 200 of this embodiment further comprises at least one third dielectric layer 208 and at least one third conductive layer 209. At least one third dielectric layer 208 and at least one third conductive layer 209 are sequentially stacked and attached between the adhesive layer 202 and the double-sided conductive plate 201. The number of the third dielectric layers 208 is the same as that of the third conductive layers 209.

One side of the third dielectric layer 208 close to the first conductive layer 2011 is attached to the first conductive layer 2011, one side of the adhesive layer 202 is attached to the second dielectric layer 2031, and the other side of the adhesive layer 202 is attached to the third conductive layer 209 far away from the first conductive layer 2011, that is, the third conductive layer 209 far away from the first conductive layer 2011 is attached to the adhesive layer 202. Thereby, the conductive layer is built up between the single-sided conductive plate 203 and the double-sided conductive plate 201. The third dielectric layer 208 and the third conductive layer 209 stacked and attached in sequence may be attached to the first conductive layer 2011 on one side of the double-sided conductive plate 201, or may be attached to the first conductive layers 2011 on both sides of the double-sided conductive plate 201, and the positions and the number of the third dielectric layer 208 and the third conductive layer 209 may be set based on actual requirements, which is not limited herein.

In other embodiments, the width of the at least one fourth conductive layer 205 is gradually decreased along the direction from the double-sided conductive plate 201 to the at least one fourth conductive layer 205, so as to ensure that the flexible region of the second dielectric layer 2031 is exposed, and at the same time, when the printed circuit board 200 is bent, the bent fourth conductive layers 205 are prevented from colliding with each other, generating cracks or chips, and affecting the functions of the printed circuit board 200, thereby improving the reliability and quality of the printed circuit board 200.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A printed circuit board, comprising:

the double-sided conductive plate comprises a first dielectric layer and first conductive layers which are attached to two opposite sides of the first dielectric layer;

the adhesive layer is arranged on one side, far away from the first dielectric layer, of the first conductive layer;

the single-sided conductive plate comprises a second dielectric layer and a second conductive layer which is attached to one side of part of the second dielectric layer; the second dielectric layer is attached to one side, far away from the first conducting layer, of the adhesive layer, so that the second dielectric layer and the first conducting layer are fixed through the adhesive layer.

2. The printed circuit board of claim 1, wherein the glue layer is attached to a side of the first conductive layer away from the first dielectric layer.

3. The printed circuit board of claim 1, further comprising at least one third dielectric layer and at least one third conductive layer;

the at least one third dielectric layer and the at least one third conductive layer are sequentially stacked and attached to each other and arranged between the adhesive layer and the double-sided conductive plate;

one side of the third medium layer close to the first conducting layer is attached to the first conducting layer, and the third conducting layer far away from the first conducting layer is attached to the adhesive layer.

4. The printed circuit board of any one of claims 1-3, further comprising at least one fourth dielectric layer and at least one fourth conductive layer sequentially stacked and attached;

the at least one fourth dielectric layer and the at least one fourth conducting layer which are sequentially stacked and attached are arranged on one side, away from the double-sided conducting plate, of the single-sided conducting plate, and the fourth dielectric layer close to one side of the single-sided conducting plate is attached to the second conducting layer of the single-sided conducting plate.

5. The printed circuit board of claim 4, wherein the at least one fourth dielectric layer and the at least one fourth conductive layer stacked and attached in sequence completely overlap with a projection of the second conductive layer onto the first plane.

6. The printed circuit board of claim 4, wherein the width of the at least one fourth conductive layer is arranged in a stepwise manner with a gradually decreasing width along the direction of the double-sided conductive plate toward the at least one fourth conductive layer.

7. The printed circuit board of claim 1, wherein the printed circuit board has at least one recess disposed thereon;

the at least one groove at least penetrates through the second conducting layer and reaches the second dielectric layer to expose part of the second dielectric layer.

8. The printed circuit board of claim 1, wherein the printed circuit board further comprises at least one conductive via;

the at least one conductive hole is used for conducting each conductive layer of the printed circuit board.

9. The printed circuit board of claim 1, wherein the printed circuit board comprises at least two layers of single-sided conductive plates;

at least two layers of single-sided conductive plates are respectively arranged on two sides of the double-sided conductive plate.

10. The printed circuit board of claim 1, wherein the printed circuit board further comprises a solder mask layer;

the solder mask layers are arranged on two opposite sides of the printed circuit board and are arranged at intervals with the second dielectric layer.