CN216976989U - Radiator and air condensing units - Google Patents

Abstract

The application relates to the technical field of air conditioning, and discloses a radiator which comprises a base, a frequency conversion module and a heat dissipation module, wherein the base is used for being in heat conduction connection with the frequency conversion module so as to absorb heat of the frequency conversion module; the fin group comprises a heat conduction surface and a heat dissipation surface which are opposite, and the heat conduction surface is in heat conduction connection with the base so as to dissipate heat transferred by the base; the heat dissipation surface is provided with one or more open slots, and under the condition of convection heat dissipation, airflow flows through gaps between adjacent fins in the fin group, meets the open slots, and then is divided into the gaps between the adjacent fins in the fin group, so that the heat exchange time between the airflow and the fin group is prolonged. Therefore, the time for the air flow to contact with the fin group for heat exchange can be prolonged, so that the heat exchange coefficients of the air flow and the fin group are improved, the heat dissipation uniformity of the fin group can be improved, and local overheating is prevented; and then the whole radiating efficiency of the radiator is improved, and the temperature of the frequency conversion module is reduced. The application also discloses an air-conditioning indoor unit.

Description

Radiator and air condensing units

Technical Field

The present application relates to the field of air conditioning technologies, and for example, to a heat sink and an outdoor unit of an air conditioner.

Background

With the development of air conditioning technology, air conditioners continuously break through the refrigeration and heating technology under the limit condition. When the air conditioner is used for high-temperature refrigeration, the temperature of power components of the outdoor unit of the air conditioner needs to be reduced so that the air conditioner can run reliably. Therefore, the radiator is added to the power component of the outdoor unit of the air conditioner.

At present, air-cooled aluminum fins are generally adopted for heat dissipation or a compressor refrigerant plate is adopted for heat dissipation and temperature reduction of the frequency conversion module. However, under the working condition of high ambient temperature, the temperature of the frequency conversion module is rapidly increased due to the fact that high heat flow density and high power of the frequency conversion module cannot effectively dissipate heat, and the problem that the compressor is subjected to frequency reduction and even the frequency conversion module is damaged and burnt is easily caused.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the heat dissipation capacity of the existing radiator to the frequency conversion module is insufficient under the high-temperature refrigeration working condition, so that the air conditioner is greatly reduced in frequency, the refrigeration effect of the environment in a high-temperature day is poor, and the use experience of a user is influenced.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a radiator and an air conditioner outdoor unit, so as to solve the problem of poor radiating effect of the radiator.

In some embodiments, the heat sink comprises:

the base is in heat conduction connection with the frequency conversion module so as to absorb heat of the frequency conversion module;

the fin group comprises a heat conduction surface and a heat dissipation surface which are opposite, and the heat conduction surface is in heat conduction connection with the base so as to dissipate heat transferred by the base;

the heat dissipation surface is provided with one or more open slots, and under the condition of convection heat dissipation, airflow flows through gaps between adjacent fins in the fin group, meets the open slots, and then is divided into the gaps between the adjacent fins in the fin group, so that the heat exchange time between the airflow and the fin group is prolonged.

In some embodiments, the symmetrical dividing line of the width direction of the open slot is perpendicular to the fins of the fin group, so that the air flow passing through the slot is smooth and evenly distributed.

In some embodiments, the depth of the open slots is less than one-half of the width of the fin pack in a direction perpendicular to the heat dissipation surface.

In some embodiments, a plurality of the open grooves are uniformly arranged at intervals; and/or the width of part or all of the open grooves is the same.

In some embodiments, the fin set includes a plurality of fins, and first edges of the fins are bent in a first direction and connected with adjacent fins to configure the heat conduction surface.

In some embodiments, the heat sink further comprises:

the heat pipe is in heat conduction connection with the base and the fin group, and a phase-change medium is filled in the heat pipe so as to transfer the heat of the base to the fin group through medium phase change;

the heat pipe is arranged along the length direction of the base, and the heat pipe and the frequency conversion module are respectively arranged on two sides of the base.

In some embodiments, the heat pipe is flat and embedded in the heat conducting surface of the fin group to enlarge the heat conducting area with the fin group.

In some embodiments, a siphon structure is arranged in the heat pipe to drive the circulation flow of the medium.

In some embodiments, the base is stepped, comprising:

the high step part is in heat conduction connection with the heat conduction surface of the fin group;

the low step part is in heat conduction connection with the frequency conversion module;

the low step part and the heat conducting surface of the fin group define an accommodating space, and the accommodating space is used for accommodating the heat pipe.

In some embodiments, the outdoor unit of an air conditioner includes: the heat sink provided in the foregoing embodiments.

The radiator and the air conditioner outdoor unit provided by the embodiment of the disclosure can realize the following technical effects:

the base absorbs heat generated by the frequency conversion module and transmits the heat to the fin group, under the condition of strong convection heat dissipation of the fin group, airflow flows through gaps of adjacent fins in the fin group and is mixed with the adjacent fins in the open slot, the converged airflow can exchange heat, so that the heat carried by the airflow is uniformly distributed and then flows out in a shunting manner through the fins of the fin group, and therefore, the time for heat exchange of the airflow in contact with the fin group can be prolonged, the heat exchange coefficients of the airflow and the fin group are improved, the heat dissipation uniformity of the fin group can be improved, and local overheating is prevented; and then the whole radiating efficiency of the radiator is improved, and the temperature of the frequency conversion module is reduced.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is a schematic structural diagram of the heat sink provided in the embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of another view of the heat sink provided by the embodiment of the present disclosure;

FIG. 3 is a schematic view of an assembly of the fin set and the heat pipe provided by an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of the base provided by the embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of another perspective view of the base according to the embodiment of the present disclosure.

Reference numerals:

10: a base; 101: a high step portion; 102: a stepped-down portion; 103: a first surface; 104: a second surface; 105: mounting holes; 20: a fin set; 201: a heat conducting surface; 202: a heat dissipating surface; 203: an open slot; 204: a fin; 30: a heat pipe.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their examples and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the disclosed embodiments can be understood by those of ordinary skill in the art according to specific situations.

The term "plurality" means two or more unless otherwise specified.

In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. E.g., a and/or B, represents: a or B, or A and B.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

Referring to fig. 1 to 5, an outdoor unit of an air conditioner according to an embodiment of the present disclosure includes a heat sink, where the heat sink includes a base 10 and a fin set 20, the base 10 is used for being thermally connected to a frequency conversion module to absorb heat of the frequency conversion module; the fin group 20 comprises a heat conducting surface 201 and a heat radiating surface 202 which are opposite, and the heat conducting surface 201 is in heat conducting connection with the base 10 so as to radiate heat transferred by the base 10; the heat dissipation surface 202 is configured with one or more open grooves 203, and in the case of convection heat dissipation, an airflow flows through a gap between adjacent fins 204 in the fin group 20, meets at the open grooves 203, and then is divided into gaps between adjacent fins 204 in the fin group 20, so as to prolong the heat exchange time between the airflow and the fin group 20.

Adopt the air condensing units that this disclosed embodiment provided, can reduce the temperature of frequency conversion module, solve under high ring temperature, the poor problem of refrigeration effect that frequency conversion module heat dissipation is bad leads to has promoted user's use and has experienced.

With reference to fig. 1 to 5, an embodiment of the present disclosure provides a heat sink, including: the base 10 is used for being in heat conduction connection with the frequency conversion module so as to absorb heat of the frequency conversion module; the fin group 20 comprises a heat conducting surface 201 and a heat radiating surface 202 which are opposite, and the heat conducting surface 201 is in heat conducting connection with the base 10 so as to radiate heat transferred by the base 10; the heat dissipation surface 202 is configured with one or more open grooves 203, and in the case of convection heat dissipation, an airflow flows through a gap between adjacent fins 204 in the fin group 20, meets at the open grooves 203, and then is divided into gaps between adjacent fins 204 in the fin group 20, so as to prolong the heat exchange time between the airflow and the fin group 20.

By adopting the radiator provided by the embodiment of the disclosure, the base 10 absorbs heat generated by the frequency conversion module and transmits the heat to the fin group 20, under the condition of strong convection heat dissipation of the fin group 20, airflow flows through the gap between adjacent fins 204 in the fin group 20 and is mixed in the open slot 203, and the converged airflow can exchange heat, so that the heat carried by the airflow is uniformly distributed, and then is shunted and flowed out by the fins 204 of the fin group 20, thus, not only can the time for heat exchange of the airflow in contact with the fin group 20 be prolonged, and the heat exchange coefficients of the airflow and the fin group are improved, but also the improvement of the heat dissipation uniformity of the fin group 20 can be facilitated, and local overheating can be prevented; and then the whole radiating efficiency of the radiator is improved, and the temperature of the frequency conversion module is reduced.

The base 10 has a plate-like structure. The base 10 is not only connected in a heat-conducting manner to the frequency conversion module, but also detachably connected. Wherein the frequency conversion module can be connected to the base 10 by a fastener, or the frequency conversion module can be connected to the base 10 by a heat conductive silicone adhesive, or the frequency conversion module can be welded to the base 10. In addition, a heat conducting fin can be further arranged between the base 10 and the frequency conversion module to improve the heat transfer efficiency between the frequency conversion module and the base 10, and further improve the heat dissipation and cooling effects on the frequency conversion module.

The base 10 includes a first surface 103 and a second surface 104 opposite to each other, wherein the first surface 103 is attached to and thermally connected to the heat conduction surface 201 of the fin group 20. In this way, the heat of the base 10 can be rapidly transferred to the fin group 20, and the heat transfer efficiency of the base 10 and the fin group 20 is improved. After the heat is transferred to the fin group 20, the heat of the heat conduction surface 201 of the fin group 20 is transferred to the heat radiation surface 202 along the fins 204, and is heat-exchanged with the air of the surrounding environment by a convection method, thereby performing heat radiation and temperature reduction. It should be noted that the second surface 104 of the base 10 is thermally connected to the frequency conversion module.

The open grooves 203 are formed on the heat dissipating surface 202 of the fin group 20, and it is understood that the open grooves 203 are formed in a recessed configuration from the heat dissipating surface 202 toward the inside of the fin group 20. In this way, the fin 204 portion at the bottom of the open slot 203, i.e. the fin 204 portion inside the fin group 20, can not only directly exchange heat with the surrounding environment, but also the air flow passing through the gap between the adjacent fins 204 in the fin group 20 meets at the open slot 203. The heat exchange of the converged air flow is facilitated, the heat at the open grooves 203 is uniformly distributed, and the air flow continues to flow to the gaps of the next part of adjacent fins 204 after being converged by the open grooves 203 until flowing out of the fin group 20, so that the purpose of convection heat dissipation is achieved.

Alternatively, the fin set 20 may be in the form of folded fins 204 or aluminum extruded fins 204 or other fins 204. Wherein the fins 204 in the fin group 20 are partially arranged perpendicular to the base 10.

Optionally, open slots 203 extend through the heat dissipating surfaces 202 of the fin pack 20. It will be appreciated that each fin 204 in the fin pack 20 is provided with notches. The plurality of notches are sequentially combined to form an open slot 203.

Alternatively, the open slots 203 are in a linear structure, and the open slots 203 are arranged in a way of crossing the flow direction of the airflow. Preferably, the slots 203 run perpendicular to the direction of flow of the gas stream. Thus, on one hand, the processing is convenient, and on the other hand, the heat exchange is facilitated by the intersection of the air flows at the open grooves 203.

Alternatively, the symmetrical dividing line of the width direction of the open groove 203 is perpendicular to the fins 204 of the fin group 20. That is, the vertical plane of the symmetrical dividing line in the width direction of the open groove 203 is perpendicular to the plane of the fin 204 of the fin group 20. It will be appreciated that the slots 203 run perpendicular to the direction of flow of the air stream through the gaps between adjacent fins 204 in the fin assembly 20.

After the air flows flowing into the open grooves 203 meet the open grooves 203, a part of the air flows continue to flow along the original flow trajectory, and the other part of the air flows diffuse to the other direction of the open grooves 203, are merged with the air flows from the gaps of the adjacent fins 204 to carry out heat exchange, and then flow into the gaps of the other fins 204 in the flowing process. When the airflow opening grooves 203 are diffused in other directions, the trend of the opening grooves 203 is perpendicular to the airflow flowing through the gaps between the adjacent fins 204 in the fin group 20, so that the airflow at the front opening grooves 203 can be prevented from flowing back to the opening grooves 203 at the oblique rear side, turbulence is avoided, and meanwhile, the airflow can be helped to be uniformly converged, and the heat exchange efficiency is improved.

Optionally, the depth of the slots 203 in a direction perpendicular to the heat-dissipating surface 202 is less than one-half the width of the fin pack 20.

Under the condition that the depth of the open slot 203 is less than one half of the width of the fin group 20, not only can the strength of the fin group 20 be ensured, but also the middle and inner fin 204 parts of the fin group 20 can exchange heat with the surrounding environment through the open slot 203, so that the middle part of the fin group 20 is prevented from being overheated, the heat exchange efficiency of the fin 204 of the fin group 20 and the surrounding environment is improved, and the heat dissipation efficiency of the radiator is further improved.

Alternatively, the plurality of open grooves 203 are arranged at regular intervals. In this way, processing is facilitated. In addition, the plurality of open grooves 203 are arranged at even intervals, so that the structure of the fin group 20 is symmetrical. Under the condition that the fin group 20 is in heat conduction connection with the base 10, based on the symmetrical structure of the fin group 20, the base 10 can be uniformly stressed, and the stability of the radiator in the using process is further ensured.

Alternatively, some or all of the open slots 203 may have the same width.

In the case where the widths of the partially open grooves 203 are the same, the widths of the open grooves 203 may be proportional to the local temperature of the fin group 20. That is, the higher the local temperature of the fin group 20 is, the larger the width of the opening groove 203 provided therein is. Therefore, the heat exchange efficiency between the fins 204 of the fin group 20 and the surrounding environment can be improved, the heat dissipation efficiency of the radiator is further improved, and the temperature of the frequency conversion module is reduced.

In addition, under the condition that the widths of all the open grooves 203 are the same, the structure of the fin group 20 is symmetrical, and under the condition that the fin group 20 is in heat conduction connection with the base 10, based on the symmetrical structure of the fin group 20, the base 10 can be uniformly stressed, so that the stability of the radiator in the use process is ensured.

Alternatively, some or all of the open grooves 203 may have the same depth.

In the case where the depths of the partially open grooves 203 are the same, the depths of the open grooves 203 may be proportional to the local temperatures of the fin groups 20. That is, the higher the local temperature of the fin group 20 is, the greater the depth of the open groove 203 provided therein is. Therefore, the air of the surrounding environment is fully contacted with the inside of the fin group 20, the heat exchange efficiency between the fins 204 of the fin group 20 and the surrounding environment can be improved, the heat dissipation efficiency of the radiator is further improved, and the temperature of the frequency conversion module is reduced.

In addition, under the condition that the depths of all the open grooves 203 are the same, the structure of the fin group 20 is symmetrical, and under the condition that the fin group 20 is in heat conduction connection with the base 10, based on the symmetrical structure of the fin group 20, the base 10 can be uniformly stressed, so that the stability of the radiator in the use process is ensured.

Optionally, the fin group 20 includes a plurality of fins 204, and first edges of the fins 204 are bent in a first direction and connected with adjacent fins 204 to form the heat conduction surface 201.

The first edges of the plurality of fins 204 are bent and connected with the adjacent fins 204 to form the heat conduction surface 201, and the heat conduction surface 201 is attached to the base 10 for heat conduction connection, so that the heat conduction area between the fin group 20 and the base 10 can be enlarged, and the heat transfer efficiency between the base 10 and the fin group 20 is improved. The fin group 20 is bent and connected by the first edges of the plurality of fins 204 to form the heat conduction surface 201, which contributes to improving the stability of the fin group 20.

In addition, in the form that the fin group 20 is connected by bending the first edges of the plurality of fins 204, the distance between the adjacent fins 204 can be controlled by adjusting the bending size, so that the distance between the adjacent fins 204 can be adjusted. In the existing effective installation space, the number of the fins 204 can be increased by reducing the distance between the adjacent fins 204, and further the heat dissipation area of the heat sink is increased. Compare current crowded radiator of aluminium, this embodiment can improve the whole heat transfer efficiency of radiator and heat radiating area in effective space and under the condition that does not change the whole volume of radiator, and then improved the whole heat transfer performance of radiator, effectively solve base 10 and frequency conversion module's heat dissipation problem.

Optionally, the heat sink further comprises: the heat pipe 30 is in heat conduction connection with the base 10 and the fin group 20, and a phase change medium is poured into the heat pipe 30 so as to transfer heat of the base 10 to the fin group 20 through medium phase change; the heat pipe 30 is disposed along the length direction of the base 10, and the heat pipe and the frequency conversion module are disposed on two sides of the base 10 respectively.

The heat pipe 30 is connected with the base 10 in a heat conduction manner, and a medium on the heat conduction connection side of the heat pipe 30 and the base 10 is heated to change phase, moves to a region with lower temperature, namely moves to the fin group 20, exchanges heat with the fin group 20, and dissipates heat and reduces temperature through the fin group 20.

According to the heat sink provided by the embodiment of the present disclosure, the heat transferred to the base 10 by the frequency conversion module can be directly transferred to the fin group 20, and can be transferred to the fin group 20 for heat dissipation through the phase change of the medium in the heat pipe 30. Wherein the heat transfer efficiency through the phase change of the medium in the heat pipe 30 is higher than the direct heat transfer efficiency of the base 10 and the fin group 20. Compared with the prior art, the heat dissipation efficiency of the base 10 can be improved through the phase change heat transfer of the medium in the heat pipe 30, and the temperature of the frequency conversion module is reduced.

It should be noted that, the heat pipe 30 is disposed along the length direction of the base 10, which can improve the temperature uniformity of the base 10, that is, the medium in the heat pipe 30 corresponding to the higher temperature region of the base 10 is heated to change phase, and flows to the lower temperature region of the base 10 on one side and flows to the side close to the fin group 20 on the other side, thereby helping to provide the temperature uniformity of different positions of the base 10.

In addition, under the driving of high-temperature heat, the medium in the heat pipe 30 does not need to be driven by electricity, and self-circulation flow is realized by phase change, namely, density difference under different forms. And the forced convection heat dissipation of the fin group 20 and the structural design of the open slot 203 are combined, so that the heat dissipation effect of the heat sink is greatly improved.

Optionally, the phase-changeable medium is a refrigerant.

Alternatively, the heat pipe 30 has a linear structure, which can effectively avoid temperature difference.

Alternatively, the heat pipe 30 is flat, and two opposite side surfaces are respectively in heat conduction contact with the heat conduction surface 201 of the fin group 20 and the base 10, so as to enlarge the heat conduction area of the heat pipe 30 with the fin group 20 and the base 10.

Two side surfaces of the flat heat pipe 30 are respectively connected with the heat conduction surface 201 of the fin group 20 and the surface of the base 10 in a heat conduction manner. Compared with a tubular structure, the heat conduction area between the fin group 20 and the base 10 is enlarged, and the corresponding heat transfer efficiency is further improved.

Optionally, the flat heat pipe 30 is embedded in the heat conduction surface 201 of the fin group 20, so that the heat conduction area between the heat pipe 30 and the fin group can be further enlarged, and the structural design of the open slot 203 of the fin group 20 is combined, so that the heat dissipation effect of the fin group 20 on the base 10 can be greatly improved, and the frequency conversion module can be effectively cooled.

Optionally, a siphon structure is provided in the heat pipe 30 to drive the circulation of the medium.

The liquid medium in the heat pipe 30 can flow to the heat absorption side of the heat pipe 30, i.e. the heat conduction connection side of the heat pipe 30 and the base 10, along the inner wall of the heat pipe 30 by a siphon force under the action of the siphon structure, and the medium is driven to flow to the heat dissipation side of the heat pipe 30, i.e. the heat conduction connection side of the heat pipe 30 and the fin group 20, under the condition that the medium is heated, evaporated and changed into a gas state. The medium is driven to circularly flow by the siphon structure, so that the medium resists gravity, and the heat dissipation efficiency of the radiator is improved.

Optionally, the wick structure includes, but is not limited to, a groove, a metal mesh, a metal powder layer. Wherein the metal powder layer may be copper powder.

Optionally, the base 10 is stepped, comprising: a high step portion 101 thermally connected to the heat-conducting surface 201 of the fin group 20; the low step part 102 is connected with the frequency conversion module in a heat conduction way; the stepped portion 102 and the heat conduction surface 201 of the fin set 20 define a receiving space for receiving the heat pipe 30.

The stepped part 102 is connected with the frequency conversion module in a heat conduction mode, the heat pipe 30 is arranged in an accommodating space defined by the stepped part 102 and the heat conduction surface 201 of the fin group 20, and on one hand, the heat pipe 30 can receive heat of the stepped part 102 to cool the stepped part 102; on the other hand, the low step part 102 and the high step part 101 have a step-like structure, which facilitates the installation of the frequency conversion module and the base 10.

Optionally, the fins 204 of the fin group 20 extend into the receiving space until they are in heat-conducting connection with the stepped portion 102. This can enlarge the heat transfer area between the base 10 and the fin group 20. Optionally, the heat pipe 30 is embedded in the fin group 20 extending to the accommodating space, and the fin group 20 covers the heat pipe 30 in a half-wrapped manner, so that the heat transfer area between the heat pipe 30 and the fin group 20 can be enlarged.

Optionally, the low step part 102 is configured with a mounting hole 105 for mounting the frequency conversion module. The installation hole 105 is located at a position avoiding the area where the heat pipe 30 is located. Thus, interference with the heat pipe 30, which causes unnecessary loss, can be prevented.

The above description and the drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and illustrated in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A heat sink, comprising:

the base is in heat conduction connection with the frequency conversion module so as to absorb heat of the frequency conversion module;

the fin group comprises a heat conduction surface and a heat dissipation surface which are opposite, and the heat conduction surface is in heat conduction connection with the base so as to dissipate heat transferred by the base;

the heat dissipation surface is provided with one or more open slots, and under the condition of convection heat dissipation, airflow flows through gaps of adjacent fins in the fin group, meets the open slots and then is divided into the gaps of the adjacent fins in the fin group, so that the heat exchange time between the airflow and the fin group is prolonged.

2. The heat sink of claim 1,

the symmetrical dividing lines in the width direction of the open grooves are perpendicular to the fins of the fin group, so that the air flow flowing through the fins is smooth and evenly distributed.

3. The heat sink of claim 1,

the depth of the open slot is less than one half of the width of the fin group along the direction vertical to the radiating surface.

4. The heat sink as claimed in claim 1, wherein in the case of including a plurality of the open grooves, the plurality of open grooves are uniformly spaced; and/or the width of part or all of the open grooves is the same.

5. The heat sink of claim 1,

the fin group comprises a plurality of fins, and first edges of the fins are bent along a first direction and connected with adjacent fins to form the heat conduction surface.

6. The heat sink according to any one of claims 1 to 5, further comprising:

the heat pipe is in heat conduction contact with the base and the fin group, and a phase-changeable medium is poured into the heat pipe so as to transfer the heat of the base to the fin group through medium phase change;

wherein the heat pipe is disposed along a length direction of the base.

7. The heat sink of claim 6,

the heat pipe is flat and is embedded in the heat conducting surface of the fin group so as to enlarge the heat conducting area with the fin group.

8. The heat sink of claim 6,

and a siphon structure is arranged in the heat pipe to drive the medium to circularly flow.

9. The heat sink as claimed in claim 6, wherein the base is stepped, comprising:

the high step part is in heat conduction connection with the heat conduction surface of the fin group;

the low step part is in heat conduction connection with the frequency conversion module;

the low step part and the heat conducting surface of the fin group define an accommodating space, and the accommodating space is used for accommodating the heat pipe.

10. An outdoor unit of an air conditioner, comprising the heat sink of any one of claims 1 to 9.

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