CN216905720U

CN216905720U - Cooling device and electronic equipment

Info

Publication number: CN216905720U
Application number: CN202122894227.3U
Authority: CN
Inventors: 詹克团; 曾宏波; 李洋; 李成; 胡航空; 郝明亮; 皮特; 吕海财; 葛永博
Original assignee: Bitmain Technologies Inc
Current assignee: Bitmain Technologies Inc
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-07-05
Anticipated expiration: 2031-11-19

Abstract

The present disclosure relates to a cooling device and an electronic apparatus; the cooling device includes: the circuit board cooling device comprises a condensation part and a sealing part, wherein the sealing part can contain cooling liquid which can immerse the circuit board provided with a heating element; the condensation part comprises a condensation pipe and an air cooling structure for radiating heat of the condensation pipe; the condensation pipe is communicated with the sealing part; the air cooling structure is arranged on at least one side of the condensation pipe. So this openly can adopt the phase transition heat transfer can effectual reduction chip operating temperature to need not to design, arrange extra liquid cooling structure, reduce the design complexity, save electronic equipment inner space.

Description

Cooling device and electronic equipment

Technical Field

The present disclosure relates to but is not limited to the field of heat sink technologies, and in particular, to a cooling device and an electronic apparatus.

Background

With the increasing power of electronic equipment, the heat dissipation problem of key components gradually becomes the technical bottleneck of each manufacturer, the heat dissipation problem directly affects the service life and power consumption of the electronic equipment, while the current common consumer-grade electronic equipment mostly uses natural heat dissipation or forced air cooling heat dissipation, and a water-cooling heat dissipation device is arranged in part of data centers, but because the number of heating elements arranged on a circuit board is large, and the heat flux density is continuously improved, the temperature uniformity of the electronic elements becomes a new subject.

When the liquid cooling heat dissipation device is arranged in the related technology, extra external parts are usually used, for example, the liquid cooling related devices are arranged around a condensation ring pipe, a pump and the like which are independent of the current internal heat dissipation mechanism of the electronic equipment, so that the design complexity is high, the occupied space is large, and the reliability and the cost are high.

Aiming at the problem that the design complexity and the volume size for solving the heat dissipation problem of the electronic equipment in the related technology are far larger than the practical application requirements, an effective solution is not provided at present.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a cooling device and an electronic apparatus to reduce design complexity and save internal space of the electronic apparatus.

According to a first aspect of embodiments of the present disclosure, there is provided a cooling device comprising: the circuit board cooling device comprises a condensation part and a sealing part, wherein the sealing part can contain cooling liquid which can immerse the circuit board provided with a heating element; the condensation part comprises a condensation pipe and an air cooling structure for radiating heat of the condensation pipe; the condensation pipe is communicated with the sealing part; the air cooling structure is arranged on at least one side of the condensation pipe.

In the scheme, the condensing pipe is a metal flat pipe; or a capillary structure is arranged in the condensation pipe.

In the above scheme, the outer wall of the condensation pipe is provided with a plurality of fins.

In the above scheme, the condensing part further comprises: the first shell, first casing enclose into first holding chamber, and the condenser pipe is held in first holding intracavity.

In the above scheme, the air cooling structure comprises the heat dissipation holes, and the heat dissipation holes are formed in the side wall of the first shell.

In the above scheme, the first casing further comprises a heat dissipation air duct, wherein the heat dissipation air duct is accommodated in the first accommodating cavity, the heat dissipation air duct is distributed according to the position of the condensation pipe, and the heat dissipation air duct is communicated with the heat dissipation holes.

In the above scheme, the air cooling structure comprises a heat radiation fan.

In the above-mentioned scheme, when the air-cooled structure includes radiator fan, cooling device still includes: the first power supply is connected with the cooling fan.

In the above-mentioned scheme, when the air-cooled structure includes radiator fan, cooling device still includes: the first control circuit is connected with the cooling fan.

In the above scheme, the sealing part comprises a second shell, and the second shell encloses a second accommodating cavity; the condensation chamber of condenser pipe and second holding chamber intercommunication.

In the above aspect, the second housing includes: a cover plate, a bottom plate and a side plate; wherein, the cover plate is provided with a through hole, and the condenser pipe is arranged at the through hole; the cover plate, the bottom plate, the side plates and the condensation pipe form a sealed space.

According to a second aspect of the embodiments of the present disclosure, there is provided an electronic apparatus including: according to the cooling device and the circuit board, the circuit board is immersed in the cooling liquid in the sealing portion, the first surface of the circuit board faces the liquid level of the cooling liquid, the number of the heating elements arranged on the first surface is larger than that of the heating elements arranged on the second surface of the circuit board, and the first surface is opposite to the second surface.

In the above scheme, the included angle between the circuit board and the liquid level of the cooling liquid is a preset angle.

In the above scheme, the electronic device further includes: and the second power supply is connected with the circuit board.

In the above scheme, the electronic device further includes: and the second control circuit is respectively connected with the circuit board and the second power supply.

In the above scheme, the electronic device further includes: and the third control circuit is connected with the circuit board.

The technical scheme provided by the disclosure can comprise the following beneficial effects:

in this disclosure, through the coolant liquid that can be used for the circuit board when the cooling operation in the sealing part holding, after the coolant liquid vaporization, change the coolant liquid into liquid by the gaseous state through the condensation part, flow back to sealing part, realized dispelling the heat through the circuit board of liquid cooling mode with the forced air cooling mode during operation, reach and can effectually reduce chip operating temperature through adopting the phase transition heat transfer, and owing to need not independent design, arrange extra liquid cooling structure, thereby reduce the design complexity, save the electronic equipment inner space.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 illustrates a schematic view of a cooling apparatus provided in an exemplary embodiment;

FIG. 2 is a schematic diagram illustrating a fin of a condenser tube in a cooling apparatus according to an exemplary embodiment;

FIG. 3 illustrates an exploded view of a cooling device provided in accordance with an exemplary embodiment;

FIG. 4 illustrates a schematic cross-sectional view of a cooling device provided in an exemplary embodiment;

FIG. 5 illustrates a schematic diagram of an electronic device provided by an exemplary embodiment;

fig. 6 is a schematic external view of an electronic device according to an exemplary embodiment.

Detailed Description

The embodiments of the present disclosure are described below with reference to the drawings in the embodiments of the present disclosure. In the following description, reference is made to the accompanying drawings which form a part hereof and in which is shown by way of illustration specific aspects of the disclosed embodiments or in which the specific aspects of the disclosed embodiments may be used. It should be understood that the disclosed embodiments may be used in other respects, and may include structural or logical changes not depicted in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present application is defined by the appended claims. For example, it should be understood that the disclosure in connection with the described methods may equally apply to the corresponding apparatus or system for performing the methods, and vice versa. For example, if one or more particular method steps are described, the corresponding apparatus may comprise one or more units, such as functional units, to perform the described one or more method steps (e.g., a unit performs one or more steps, or multiple units, each of which performs one or more of the multiple steps), even if such one or more units are not explicitly described or illustrated in the figures. On the other hand, for example, if a particular apparatus is described based on one or more units, such as functional units, the corresponding method may comprise one step to perform the functionality of the one or more units (e.g., one step performs the functionality of the one or more units, or multiple steps, each of which performs the functionality of one or more of the plurality of units), even if such one or more steps are not explicitly described or illustrated in the figures. Further, it is to be understood that features of the various exemplary embodiments and/or aspects described herein may be combined with each other, unless explicitly stated otherwise.

Example 1

The present disclosure provides a cooling device that may be installed in an electronic apparatus or externally connected to the electronic apparatus, for dissipating heat from a circuit board in the electronic apparatus on which one or more heat generating elements are installed. Illustratively, the circuit board may be a computing board in a computing device, a motherboard in a service cabinet, or the like.

Fig. 1 is a schematic diagram illustrating a cooling apparatus provided in an exemplary embodiment, and as shown in fig. 1, the cooling apparatus may include: a condensing section 12 and a sealing section 14. Wherein the sealing portion 14 can accommodate a cooling liquid, and the cooling liquid can immerse the circuit board 20 mounted with the heating element to perform immersion heat dissipation on the circuit board 20. The condensing part 12 may include a condensing duct 121 and an air cooling structure 122 for dissipating heat from the condensing duct; the condensation duct 121 communicates with the sealing portion 14; the air cooling structure 122 is disposed on at least one side of the condensation duct 121.

Specifically, as shown in fig. 1, the cooling device provided in the embodiment of the present disclosure is composed of a condensation portion 12 and a sealing portion 14, where the sealing portion 14 is used to store a cooling liquid and a circuit board 20, the circuit board 20 is immersed in the cooling liquid, when a component in the circuit board 20 generates heat in a working state of the circuit board 20, the cooling liquid takes away heat from a surface of the component, the cooling liquid is converted from a liquid state to a gas state in a vaporization manner, and reaches a condensation tube 121 in the condensation portion 12, and based on a positional relationship that an air cooling structure 122 is disposed on at least one side of the condensation tube 121, the air cooling structure 122 dissipates heat from the condensation tube 121, and the vaporized cooling liquid is converted from the gas state to the liquid state in the condensation tube 121 and returns to the sealing portion 14 again.

It should be noted that the Circuit Board 20 in the embodiment of the present disclosure may be a Printed Circuit Board 20 Assembly (PCBA for short). The PCBA includes a TOP face (which may also be referred to as a front face, i.e., a first surface) on which the number of heat generating elements is provided is larger than the number of heat generating elements provided on a BOT face (which may also be referred to as a back face, i.e., a second surface).

In practical applications, the heating element may be a chip with relatively high power, such as a CPU or a GPU.

In the disclosed embodiment, after the sealing portion 14 is filled with the coolant, the PCBA is entirely submerged in the coolant with the TOP facing toward the surface of the coolant, which may also be understood as the TOP facing upward.

In the embodiment of the present disclosure, the PCBA may change the form of the specific portion of the circuit board through a hollowing process, so as to promote the rising of the bubbles on the back surface of the PCBA, and may also promote the rising of the bubbles on the back surface of the PCBA by controlling the tilt angle of the PCBA.

Then, after each component on the PCBA is in operation, the heat generating element on the TOP surface generates heat as the power of the heat generating element increases, so that the coolant is locally boiled. The cooling liquid absorbs the heat of the heating element and takes away the heat of the heating element through vaporization (namely, the cooling liquid is converted from liquid state to gaseous state), so that the heat of the heating element is dissipated, and the stability of the operating temperature of the heating element is further ensured. Then, the coolant in the gaseous state rises from the sealing portion 14 to the condensing portion 12, and enters the condensation duct 121. The air cooling structure 122 dissipates heat from the condensation duct 121, so that the temperature of the cooling liquid entering the condensation duct 121 is lowered to condense the cooling liquid in a gaseous state, so that the cooling liquid is changed from the gaseous state to a liquid state, and then flows back to the sealing portion 14. Thus, heat dissipation of the circuit board 20 is achieved by two-phase circulation of the cooling liquid.

In some possible embodiments, the condensation duct 121 may be one or more. When the number of the condensation pipes 121 in the condensation part 12 is plural, the arrangement positions of the condensation pipes 121 may be distributed according to the reserved positions of the sealing part 14, wherein the reserved positions may be arranged according to the position of each heating element on the PCBA, so that the cooling liquid is effectively collected after the cooling liquid is vaporized for each heating element position;

the condensation pipes 121 may be placed in groups, and the condensation pipes 121 may be further cooled in groups, so that a targeted heat dissipation process may be performed when heat is subsequently dissipated through the air cooling structure 122.

In a preferred embodiment, the condensation pipe 121 in the embodiment of the present disclosure may be a metal flat pipe; alternatively, a capillary structure is disposed in the condensation pipe 121. It can be understood that the condensation chamber of the condensation pipe 121 has a hollow structure, wherein the hollow structure includes: a flat hollow shape or a capillary structure.

Specifically, the condensation cavity of each condensation tube 121 may be configured to collect the vaporized cooling fluid and condense the vaporized cooling fluid from a gaseous state to a liquid state. Further, in order to accelerate the cooling liquid after condensation to flow back to the sealing portion 14, when the condensation pipe 121 is a metal flat pipe, the sectional area of the flat pipe is much larger than that of the cylindrical pipe, and based on the thermal conductivity of metal, when the condensation pipe 121 is a metal flat pipe, the cooling liquid is accelerated to be converted from a gaseous state to a liquid state by increasing the heat dissipation area of the condensation pipe 121 according to the thermal conductivity of metal, and thus two-phase circulation is realized; the metal flat pipe can be processed by aluminum profile extrusion, casting and the like.

Alternatively, in order to accelerate the condensed cooling liquid to flow back to the sealing portion 14, a capillary structure may be disposed in the condensation pipe 121, so that the condensed cooling liquid is less attached to the inner wall of the condensation pipe 121 and flows back to the sealing portion 14 along the capillary structure. The capillary structure may be formed by processing the inside of the condensation pipe 121, and the capillary structure at least includes at least one groove formed on the inner wall of the condensation pipe 121, and for example, the groove on the inner wall of the condensation pipe 121 may be in a spiral shape along the inner wall. The liquid returning capacity of the cooling liquid in the condensation pipe 121 can be improved based on the capillary structure.

In a preferred embodiment, the outer wall of the condensation duct 121 in the disclosed embodiment is provided with a plurality of fins.

Specifically, the arrangement of the plurality of fins 1211 on the outer wall of the condensation pipe 121 includes at least two implementation manners, that is, the plurality of fins are machined on the outer wall of the condensation pipe 121 in a machining manner, or the plurality of fins are distributed on the outer surface of the condensation pipe 121 in a fixing manner such as sleeving, welding or adhering. Because the plurality of fins are arranged, the heat dissipation area of the condensation pipe 121 is increased, and therefore the condensation pipe 121 can accelerate the completion of two-phase circulation of the cooling liquid when condensing the gaseous cooling liquid, and further the heat dissipation efficiency of the circuit board 20 during operation is improved.

Fig. 2 is a schematic diagram illustrating a fin of a condensation tube in a cooling apparatus according to an exemplary embodiment. As shown in fig. 2, the outer wall of the condensation pipe 121 in the embodiment of the present disclosure is provided with a plurality of fins, wherein each fin is arranged in parallel and arranged from bottom to top below the condensation pipe 121. It should be noted that fig. 2 only shows the structure of one condensation duct 121, and the structure of each condensation duct may be the same in the embodiment of the present disclosure.

In some possible embodiments, the cooling device provided by the embodiments of the present disclosure is shown in fig. 3, and fig. 3 shows an exploded schematic view of the cooling device provided by an exemplary embodiment.

In the disclosed embodiment, the condensing portion 12 further includes: the first shell 123, the first shell 123 encloses into a first accommodating cavity, and the condensation pipe 121 is accommodated in the first accommodating cavity.

As shown in fig. 3, the space formed by the first housing 123 of the condensing portion 12 may be referred to as a first accommodating chamber, the condensing pipe 121 and the air-cooling structure 122 are disposed on the first housing, and the condensing pipe 121 is disposed in the first accommodating chamber.

It should be noted that, in the heat dissipation and temperature reduction process of the condensation pipe 121, the implementation manners of the embodiment of the present disclosure at least include the following three types:

the first method is as follows: and dissipating heat by natural wind.

In a preferred embodiment, the air cooling structure 122 includes a heat dissipating hole 1221, and the heat dissipating hole 1221 is opened on a side wall of the first housing 123.

As shown in fig. 3, the heat dissipation hole 1221 is located on a side wall of the first housing 123, and is configured to guide outside air (or cold air guided by an external device) into the first accommodating cavity, so as to dissipate heat of the condensation pipe 121 by natural air.

In the embodiment of the present disclosure, the first housing 123 further includes a heat dissipation air duct, wherein the heat dissipation air duct is accommodated in the first accommodating cavity, the heat dissipation air duct is distributed according to the position of the condensation pipe 121, and the heat dissipation air duct is communicated with the heat dissipation holes 1221.

Under the condition that no forced air cooling refrigeration equipment is added, the heat dissipation air channel is formed in the first shell 123, so that the heat dissipation air channel located in the first accommodating cavity can conduct air conducted from the heat dissipation holes 1221 into the position of each condensation pipe 121 according to the position of each condensation pipe 121, and effective heat dissipation of the surface of the condensation pipe 121 by natural air is achieved.

The second method comprises the following steps: the heat dissipation fan dissipates heat.

In a preferred embodiment, the air-cooled structure 122 includes a heat dissipation fan 1222; the heat dissipation fan 1222 is installed at least one side of the condensation duct 121.

Specifically, as shown in fig. 3, the connection structure of the heat dissipation fan 1222 and other devices of the condensation portion 12 is as follows: the heat dissipation fan 1222 is positioned at one side of the condensation duct 121, and the number of the heat dissipation holes 1221 is set according to the number of the heat dissipation fans 1222. The flowing air generated by the operation of the heat radiation fan 1222 can radiate heat to the condensation duct 121, thereby enhancing the condensation efficiency of the cooling liquid and accelerating the two-phase circulation of the cooling liquid.

In the embodiment of the present disclosure, the number of the heat dissipation fans 1222 is not limited, and the number of the heat dissipation fans 1222 may be increased or decreased according to the heat dissipation requirement; or, under the condition that a plurality of cooling fans exist, the number of the cooling fans which are started (or the number of the cooling fans which are closed) is adjusted by the plurality of cooling fans according to the monitored operating temperature of the PCBA, so that the cooling requirement of the PCBA is met in real time; the embodiments of the present disclosure are described only by way of examples, and are not limited to the cooling device provided in the present disclosure.

In addition, it should be noted that, in implementation manners in the embodiment of the present disclosure, the setting manner of the heat dissipation fan 1222 further includes: on the premise of no first shell 123, the heat dissipation fan 1222 is disposed at one side of the condensation pipe 121, the condensation pipe 121 and the heat dissipation fan 1222 are not wrapped by any shell, the condensation pipe 121 is directly contacted with the outside air while the heat dissipation fan 1222 is running, a heat dissipation space is increased, condensation efficiency of the cooling liquid is improved, and two-phase circulation of the cooling liquid is accelerated.

Further, based on the connection structure of the heat dissipation fan 1222 and the condensation duct 121, the heat dissipation fan 1222 cools the condensation duct 121 and the fins, the gaseous cooling liquid is re-liquefied, and flows back to the sealing portion 14 under the action of gravity, so as to realize the phase change cooling of the cooling device provided by the embodiment of the present disclosure.

When the air-cooled structure 122 includes the heat dissipation fan 1222, the cooling device provided in the embodiment of the present disclosure further includes: the first power supply 13, the first power supply 13 is connected to the heat dissipation fan 1222.

When the air-cooling structure 122 includes the heat dissipation fan 1222, the cooling device provided by the embodiment of the present disclosure further includes: the first control circuit 15, the first control circuit 15 is connected to the heat dissipation fan 1222.

Specifically, in the embodiment of the present disclosure, the structure that the first power supply 13 is connected to the heat dissipation fan 1222, and the first control circuit 15 is connected to the heat dissipation fan 1222 is not shown in fig. 3, the first power supply 13 is used for supplying power to the heat dissipation fan 1222, and the first control circuit 15 is used for controlling the operation of the heat dissipation fan 1222, where controlling the operation of the heat dissipation fan 1222 may include: the heat dissipation fan 1222 is controlled to be turned on or off, the operation speed of the heat dissipation fan 1222 is controlled, or the rotation direction of the blades of the heat dissipation fan 1222 is controlled.

The third method comprises the following steps: the combination of the first and second modes.

Under the condition that first casing 123 is provided with louvre 1221, radiator fan 1222 and louvre 1221 phase-match to radiator fan 1222 is connected with the heat dissipation wind channel, through radiator fan 1222's operation, with the leading-in first casing 123 of ambient air with higher speed in, will follow the setting in heat dissipation wind channel with higher speed leading-in air through the heat dissipation wind channel, transmits to every condenser pipe 121 department, has realized promoting the condensation efficiency of coolant liquid, the double-phase circulation of coolant liquid with higher speed.

In a preferred embodiment, the sealing portion 14 includes a second housing 141, the second housing 141 enclosing a second accommodating chamber; the condensation chamber of the condensation pipe 121 is communicated with the second accommodating chamber.

As shown in fig. 3, the meaning of the communication between the condensation chamber of the condensation pipe 121 and the second accommodation chamber is that the cooling liquid in the condensation pipe 121 in the gaseous state is condensed to form a liquid cooling liquid, and through the structure of the communication between the condensation pipe 121 and the second accommodation chamber, the liquid cooling liquid in the condensation chamber of the condensation pipe 121 can flow back to the second accommodation chamber, so as to realize two-phase circulation of the cooling liquid.

Wherein the second case 141 includes: cover 1411, bottom panel 1412 and side panels 1413; wherein, the cover plate 1411 is provided with a through hole, and the condensation pipe 121 is arranged at the through hole; the cover 1411, the bottom plate 1412, the side plate 1413 and the condensation duct 121 form a sealed space.

Specifically, in the embodiment of the present disclosure, the condensation pipe 121 is fixed on the cover plate 1411 by friction welding, brazing, or gluing, and the cover plate 1411, the bottom plate 1412, and the side plate 1413 form a sealing cavity together by sealing means such as a sealing ring and a sealant, wherein the condensation pipe 121 is communicated with the inside of the sealing cavity.

In addition, the condensation pipe 121 in the embodiment of the present disclosure may also be connected to the sealing cavity by using a mechanical connection matching with a sealing ring.

In the disclosed embodiment, fig. 4 shows a schematic cross-sectional view of a cooling device provided by an exemplary embodiment. As shown in fig. 4, the cross-sectional view of the cooling device provided by the embodiment of the present disclosure shows the condensation duct 121, the first power supply 13, the first control circuit 15, and the heat dissipation fan 1222, wherein the shaded portions of the condensation duct 121 and the heat dissipation fan 1222 overlapped with each other are fins of the condensation duct 121.

It should be noted that the cooling device provided in the embodiment of the present disclosure is only described by taking the above example as an example, and is not particularly limited to the implementation of the cooling device provided in the embodiment of the present disclosure.

According to the cooling device provided by the embodiment of the disclosure, the circuit board 20 and the heating element are immersed in the cooling liquid by the design of the wind-liquid integrated independent case, and the heat of the heating element is taken away by boiling of the cooling liquid, so that the working temperature of the heating element is always in a safe range, and the cooling and temperature equalization of the heating element are realized; the phase change liquid is directly cooled through the integrated air-cooled heat exchange part (the condensation part 12 and the sealing part 14), so that the short cooling distance and high heat exchange efficiency are realized; the integrated design is flexible, the integrated design is suitable for independent transportation and work, and the cluster application can directly replace the current air-cooled product to adapt to various air-cooled application scene deployment forms; compared with a liquid cooling product which is integrally designed, pump-free and pipeline-free, the liquid cooling product is smaller and more convenient in overall design.

In addition, compared with the existing air cooling and water cooling which are widely adopted, the cooling device provided by the embodiment of the disclosure can effectively reduce the working temperature of the heating element by adopting phase change heat exchange, thereby improving the temperature uniformity and reducing the energy consumption of the system; the high-efficient cooling of phase transition heat transfer has reduced the volume of forced air cooling, and water-cooled complicated accessory has been got rid of in the integrated design. And by adopting the condensation pipe structure provided by the embodiment of the disclosure, the heat dissipation of a high-power system can be realized, the processing mode is simple, and the cost is lower than that of VC, gravity heat pipes and the like.

Example 2

The present disclosure provides an electronic device as shown in fig. 5, fig. 5 showing a schematic view of the electronic device provided by an exemplary embodiment.

The embodiment of the present disclosure provides an electronic device, specifically including: the cooling device 52 and the circuit board 54 in embodiment 1, wherein the circuit board 54 is immersed in the cooling liquid in the sealed portion, a first surface of the circuit board 54 faces a liquid surface of the cooling liquid, the number of heat generating elements provided on the first surface is greater than the number of heat generating elements provided on a second surface of the circuit board 54, and the first surface is opposite to the second surface.

The electronic device provided by the embodiment of the disclosure can be a server, a server cluster or a computer, and the like, and is a computing device with high computing power and high chip energy consumption. The structure of the cooling device 52 can be referred to the description of the cooling device in embodiment 1, and is not described herein again.

The first surface of the circuit board 54 may be a TOP surface of the circuit board 54 and the second surface may be a BOT surface of the circuit board 54 in the embodiments of the present disclosure. The TOP surface is equivalent to the front surface of the circuit board, the BOT surface is equivalent to the back surface of the circuit board, the TOP surface and the BOT surface are matched, and the difference between the TOP surface and the BOT surface is as follows: TOP boards have many components (i.e., heating elements in the disclosed embodiments) and few components on the BOT side; therefore, the TOP surface is arranged to face upwards, so that the cooling liquid can completely immerse the TOP surface, and the heat of the heating elements on the TOP surface is accelerated and taken away in the two-phase circulation process of the cooling liquid, so that the aim of dissipating the heat of the circuit board 54 is fulfilled.

Specifically, the circuit board 54 is completely immersed in the cooling liquid, and when the temperature of the heating element (e.g., chip) exceeds the boiling point of the liquid during operation of the electronic device, the cooling liquid is caused to locally boil in the vicinity of the chip, and the heat of the chip is carried away by the vaporization of the surface liquid. When the equipment runs stably, the system reaches heat transfer balance, and the heat generated by the chip is continuously taken away through phase change, so that the stability of the running temperature of the chip is ensured.

It should be noted that the PCBA material (i.e., the circuit board 54 in the embodiments of the present disclosure) in the embodiments of the present disclosure may be an FR-4 grade material, an aluminum-based material, a copper-based material, etc., and the embodiments of the present disclosure do not specifically limit this. In addition, the surface of the chip may be a non-thermal expansion surface, or may be a form of increasing a thermal expansion surface, such as chip surface soldering, gluing, deposition, etc., which is only subject to the implementation of the electronic device provided by the embodiment of the present disclosure, and is not particularly limited.

In the disclosed embodiment, the included angle between the circuit board 54 and the liquid level of the cooling liquid may be a preset angle.

Specifically, the angle between the circuit board 54 and the liquid level of the cooling liquid is set to be a preset angle: the heating element of high-power consumption can effectively contact the coolant liquid according to the position relation of slope for the coolant liquid is more effective in the vaporization process takes away the heat that heating element gived off, keeps heating element's normal operating condition.

In a preferred implementation manner, an electronic device provided in an embodiment of the present disclosure further includes: and a second power supply 56 connected to the circuit board 54.

Specifically, as shown in fig. 5, the second power supply 56 is connected to the circuit board 54 through a copper bar, the copper bar passes through a hole formed in the sealing portion of the cooling device 52, and the sealing compound is sealed around the copper bar to complete the sealing of the hole of the copper bar, so that the second power supply 56 supplies power to the circuit board 54.

It should be noted that the first power supply in the cooling device 52 may be the same power supply as the second power supply 56, or two power supply modules in the same power supply respectively supplying power to the circuit board and the cooling fan.

In the embodiment of the present disclosure, a control circuit in an electronic device includes two implementation manners:

in the first mode, the second control circuit 58 is connected to the circuit board 54 and the second power supply 56 respectively

In a preferred implementation manner, an electronic device provided in an embodiment of the present disclosure further includes: and a second control circuit 58 connected to the circuit board 54 and the second power supply 56, respectively.

Specifically, in the embodiment of the present disclosure, the second control circuit 58 is connected to the circuit board 54 and the second power supply 56, respectively, and is configured to monitor and control the circuit board 54 and obtain power supply of the second power supply 56. The second control circuit 58 in the embodiment of the present disclosure may be the first control circuit in the first embodiment, or two different control units on the same integrated control board as the first control circuit.

In the embodiment of the present disclosure, fig. 6 shows an appearance schematic diagram of an electronic device provided in an exemplary embodiment, as shown in fig. 6, the electronic device is composed of a cooling device, a second power supply 56 and a second control circuit 58, wherein a circuit board is mounted on a sealing portion of the cooling device, the second power supply 56 is disposed below the cooling device, and the second control circuit 58 is located on a right side of the cooling device.

In addition, the installation position of the second power supply 56 may also be located above the machine, on the left side and the right side, so as to implement the electronic device provided in the embodiment of the present disclosure, which is not limited specifically.

In a preferred embodiment, the third control circuit is connected to the circuit board 54

In the foregoing solution, the electronic device provided in this embodiment of the present disclosure further includes: and a third control circuit connected to the circuit board 54.

The third control circuit is connected to the circuit board 54, and is used for controlling the operation of the circuit board 54 or forwarding an external command to the circuit board 54 through the third control circuit.

It should be noted that, in the embodiment of the present disclosure, the second control circuit 58 and the third control circuit may be the same control circuit, or two different control units on the same integrated control board, and both the second control circuit 58 and the third control circuit may be connected to the circuit board 54 through an aviation plug, wherein the aviation plug is also fixed on the outer sidewall of the sealing portion in the cooling device by sealing with an adhesive.

In the embodiment of the disclosure, the electronic device provided by the embodiment of the disclosure contains the cooling liquid which can be used for cooling the circuit board during operation through the sealing part in the cooling device, and after the cooling liquid is vaporized, the cooling liquid is converted from a gaseous state into a liquid state through the condensing part and flows back to the sealing part, so that the circuit board during operation is cooled through the liquid cooling mode and the air cooling mode, the working temperature of a chip can be effectively reduced by adopting phase change heat exchange, the temperature uniformity is improved, and the energy consumption of a system is reduced; the volume of air cooling is reduced, and the water-cooled complex fittings are eliminated through integrated design.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The above description is only an exemplary embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A cooling apparatus, comprising: a condensing part and a sealing part, wherein,

the sealing part can contain cooling liquid, and the cooling liquid can immerse the circuit board provided with the heating element;

the condensation part comprises a condensation pipe and an air cooling structure for radiating heat of the condensation pipe; the condensation pipe is communicated with the sealing part; the air cooling structure is arranged on at least one side of the condensation pipe.

2. The cooling device according to claim 1, wherein the condensation pipe is a metal flat pipe; or a capillary structure is arranged in the condensation pipe.

3. A cooling apparatus according to claim 1 or 2, wherein an outer wall of the condensation duct is provided with a plurality of fins.

4. The cooling apparatus according to claim 1, wherein the condensing portion further comprises: the condenser comprises a first shell, wherein the first shell surrounds a first accommodating cavity, and the condenser pipe is accommodated in the first accommodating cavity.

5. The cooling device as claimed in claim 4, wherein the air-cooling structure comprises heat dissipation holes opened on a side wall of the first housing.

6. The cooling device as claimed in claim 5, wherein the first housing further comprises a heat dissipation air duct, wherein the heat dissipation air duct is accommodated in the first accommodating chamber, the heat dissipation air duct is distributed according to the position of the condensation pipe, and the heat dissipation air duct is communicated with the heat dissipation holes.

7. A cooling apparatus according to claim 1 or 5, wherein the air-cooled structure comprises a radiator fan.

8. The cooling device of claim 7, wherein when the air-cooling structure comprises a heat-dissipating fan, the cooling device further comprises: and the first power supply is connected with the cooling fan.

9. The cooling apparatus according to claim 7 or 8, wherein when the air-cooling structure includes a heat-dissipating fan, the cooling apparatus further comprises: the first control circuit is connected with the heat dissipation fan.

10. The cooling device of claim 1, wherein the sealing portion includes a second housing enclosing a second receiving chamber; and the condensation cavity of the condensation pipe is communicated with the second accommodating cavity.

11. The cooling apparatus of claim 10, wherein the second housing comprises: a cover plate, a bottom plate and a side plate; the condenser pipe is arranged at the through hole; the cover plate, the bottom plate, the side plates and the condensation pipe form a sealed space.

12. An electronic device, comprising:

the cooling device and the circuit board according to any one of claims 1 to 11, wherein the circuit board is immersed in the cooling liquid in the sealed portion, a first surface of the circuit board faces a liquid surface of the cooling liquid, the first surface has a greater number of heat generating elements than those of a second surface of the circuit board, and the first surface is opposite to the second surface.

13. The electronic device of claim 12, wherein the circuit board is at a predetermined angle relative to a surface of the cooling fluid.

14. The electronic device of claim 12, further comprising: and the second power supply is connected with the circuit board.

15. The electronic device of claim 14, further comprising: and the second control circuit is respectively connected with the circuit board and the second power supply.

16. The electronic device of claim 12, further comprising: and the third control circuit is connected with the circuit board.