CN216563103U

CN216563103U - Heat radiation assembly, radiator, semiconductor module and vehicle

Info

Publication number: CN216563103U
Application number: CN202122995339.8U
Authority: CN
Inventors: 刘春江; 廖磊杰; 张建利
Original assignee: BYD Semiconductor Co Ltd
Current assignee: BYD Semiconductor Co Ltd
Priority date: 2021-11-30
Filing date: 2021-11-30
Publication date: 2022-05-17
Anticipated expiration: 2031-11-30

Abstract

The utility model relates to a radiator unit, radiator, semiconductor module and vehicle, radiator unit include bottom plate and a plurality of vortex post, the bottom plate has relative first surface and second surface on its thickness direction, and is a plurality of the vortex post is connected on the first surface of bottom plate, and is a plurality of many parallel runners are injectd to the vortex post, and are many the entrance point of runner is located the first side of bottom plate communicates with each other, many the exit end of runner is located the second side relative with the first side of bottom plate communicates with each other, adjacent two the runner is separated at its border position. According to the heat dissipation assembly, the semiconductor elements such as the chips can be placed in different heat dissipation areas in a grouping mode, each flow channel is only used for cooling one group of semiconductor elements on the corresponding heat dissipation area, the direct heat exchange area is effectively increased, a good cooling effect is obtained, and each group of semiconductor elements are cooled through the independent flow channels, so that the temperature of each group of semiconductor elements is more uniform.

Description

Heat radiation assembly, radiator, semiconductor module and vehicle

Technical Field

The application belongs to the technical field of semiconductor module heat dissipation, and relates to a heat dissipation assembly, a radiator, a semiconductor module and a vehicle.

Background

Because the integration level of internal components of the power semiconductor module is high, the heat dissipation in unit volume is large, and if the heat cannot be dissipated timely, the heat of the module is gathered, the temperature rises, and the power semiconductor module fails. Pin-fin heat sinks are mostly used in the prior art. The cross-sectional shape of the pin-fin currently used is mostly circular, because the circular turbulent flow column has the highest comprehensive heat exchange efficiency.

However, traditional pin-fin radiator generally can evenly be covered with pin needle (circular turbulent flow post) at the bottom plate, though its processing is simple, nevertheless because pin needle evenly distributed, the runner that forms between the pin needle links into one piece, does not have the subregion, can't carry out temperature control to the multizone accurately, and the chip temperature who is difficult to realize each region is even.

Disclosure of Invention

The technical problem that this application will solve is: aiming at the problem that the temperature of a chip in each area is difficult to be uniform by a traditional pin-fin radiator, a radiating assembly, a radiator, a semiconductor module and a vehicle are provided.

In order to solve the technical problem, on the one hand, the application provides a heat dissipation assembly, including bottom plate and a plurality of vortex post, the bottom plate has relative first surface and second surface on its thickness direction, and is a plurality of the vortex post is connected on the first surface of bottom plate, and is a plurality of many parallel runners are injectd to the vortex post, and are many the entrance point of runner is located the first side of bottom plate communicates with each other, and is many the exit end of runner is located the second side relative with the first side of bottom plate communicates with each other, adjacent two the runner is separated at its border position.

Optionally, a plurality of the turbulence posts extend away from the first surface of the base plate.

Optionally, a partition element extending from the inlet end to the outlet end of the flow channel is disposed at a position adjacent to two adjacent flow channels, and the partition element partitions the flow channels on two sides.

Optionally, the dividing element is a spoiler column dividing wall consisting of one or more rows of the spoiler columns next to each other.

Optionally, the partition element is a flow blocking wall, the flow blocking wall is a block structure extending along the direction of the flow channel, and the flow blocking wall is as high as the spoiler column.

Optionally, the separating element at the adjacent position of two adjacent flow channels at the middle position is a flow blocking wall, the flow blocking wall is a block-shaped structure extending along the direction of the flow channel, and the flow blocking wall is as high as the spoiler column;

and at the two sides of the flow resisting wall, the separating elements at the adjacent positions of two adjacent flow channels are flow disturbing column separating walls formed by one or more rows of flow disturbing columns which are close to each other.

Optionally, the heat dissipation assembly further includes a surrounding plate connected to the first surface of the base plate and surrounding the plurality of turbulence columns, the surrounding plate has a first side wall, a second side wall, a third side wall and a fourth side wall, the third side wall and the fourth side wall of the surrounding plate are opposite to each other at a gap and extend in the direction of the flow channel, the first side wall of the surrounding plate is connected between a first end of the third side wall and a first end of the fourth side wall, and the second side wall of the surrounding plate is connected between a second end of the third side wall and a second end of the fourth side wall; a liquid inlet collecting area is formed between the first side wall of the enclosing plate and the inlet ends of the plurality of flow channels, and a liquid outlet collecting area is formed between the second side wall of the enclosing plate and the outlet ends of the plurality of flow channels;

the plurality of turbulence columns in each flow channel form a plurality of turbulence column rows, the plurality of turbulence columns in each turbulence column row are mutually close to each other, and the plurality of turbulence column rows are arranged at intervals from the inlet end to the outlet end of the flow channel;

the flow channel adjacent the third side wall of the shroud being defined by the third side wall of the shroud and the adjacent divider member; the flow channel adjacent the fourth side wall of the shroud being defined by the fourth side wall of the shroud and the adjacent separating element;

the flow channel between the flow channel adjacent the third side wall of the shroud and the flow channel adjacent the fourth side wall of the shroud is defined by two adjacent separating elements.

Optionally, a plurality of turbulence column rows in each flow channel are arranged in parallel at intervals.

Optionally, a plurality of the turbulence column rows in the flow channel close to the third side wall of the enclosure, from the inlet end to the outlet end of the flow channel, one side of an odd number of the turbulence column rows abutting against the third side wall of the enclosure, the other side of the odd number of the turbulence column rows spaced from the adjacent partition element to form a cooling liquid passage, one side of an even number of the turbulence column rows spaced from the third side wall of the enclosure to form a cooling liquid passage, and the other side of the even number of the turbulence column rows abutting against the adjacent partition element;

and a plurality of turbulence column rows in the flow channel close to the fourth side wall of the enclosing plate are arranged from the inlet end to the outlet end of the flow channel, one side of the odd turbulence column rows is abutted against the fourth side wall of the enclosing plate, the other side of the odd turbulence column rows is spaced from the adjacent separating element to form a cooling liquid channel, one side of the even turbulence column rows is spaced from the fourth side wall of the enclosing plate to form a cooling liquid channel, and the other side of the even turbulence column rows is abutted against the adjacent separating element.

Optionally, a plurality of said turbulence column rows in said flow channel adjacent to the third side wall of said enclosure, from the inlet end to the outlet end of said flow channel, odd-numbered ones of said turbulence column rows having one side spaced from said third side wall of said enclosure to form a coolant passageway, odd-numbered ones of said turbulence column rows having another side abutting adjacent said partition element, even-numbered ones of said turbulence column rows having one side abutting said third side wall of said enclosure, and even-numbered ones of said turbulence column rows having another side spaced from adjacent said partition element to form a coolant passageway;

and a plurality of turbulence column rows in the flow channel close to the fourth side wall of the enclosing plate are arranged from the inlet end to the outlet end of the flow channel, one side of the odd turbulence column rows and the fourth side wall of the enclosing plate form a cooling liquid channel at intervals, the other side of the odd turbulence column rows is abutted against the adjacent separating element, one side of the even turbulence column rows is abutted against the fourth side wall of the enclosing plate, and the other side of the even turbulence column rows and the adjacent separating element form a cooling liquid channel at intervals.

Optionally, the plurality of turbulence column rows in the flow channel between the flow channel close to the third side wall of the enclosure and the flow channel close to the fourth side wall of the enclosure are from the inlet end to the outlet end of the flow channel, one side of an odd number of the turbulence column rows abuts against one of the partition elements, the other side of the odd number of the turbulence column rows is spaced from another adjacent partition element to form a cooling liquid passage channel, one side of an even number of the turbulence column rows is spaced from one of the partition elements to form a cooling liquid passage channel, and the other side of the even number of the turbulence column rows abuts against another adjacent partition element.

Optionally, the plurality of turbulence column rows in the flow channel between the flow channel close to the third side wall of the enclosure and the flow channel close to the fourth side wall of the enclosure are spaced from the inlet end to the outlet end of the flow channel to form a cooling liquid channel, one side of an odd number of the turbulence column rows is spaced from one of the partition elements, the other side of the odd number of the turbulence column rows is abutted against the other adjacent partition element, one side of an even number of the turbulence column rows is abutted against one of the partition elements, and the other side of the even number of the turbulence column rows is spaced from the other adjacent partition element to form a cooling liquid channel.

Optionally, the turbulence columns are cylinders, and a plurality of the turbulence columns are equal in height.

According to the heat dissipation assembly of the embodiment of the application, a plurality of parallel flow channels are limited by a plurality of turbulence columns, the inlet ends of the flow channels are located on the first side of the bottom plate and communicated with each other, the outlet ends of the flow channels are located on the second side, opposite to the first side, of the bottom plate and communicated with each other, and two adjacent flow channels are separated at the adjacent positions of the flow channels. Like this, the runner on the bottom plate is cut apart into many parallelly, the region that the second surface of bottom plate just is to the runner is formed with the heat dissipation region, namely, every runner corresponds a heat dissipation region, can place semiconductor component such as chip in different heat dissipation regions in groups, every runner is only used for cooling a set of semiconductor component on the heat dissipation region that corresponds, not only effectively increased direct heat transfer area, obtain better cooling effect, and every group semiconductor component all is independent runner cooling, make the temperature of every group semiconductor component more even. The cooling liquid can take away heat transmitted from the bottom plate in time, the cooling effect is obvious, and the application scenes of needing large current and high heating are facilitated. Simulation shows that the design can effectively reduce the temperature of the semiconductor element, ensure the temperature uniformity of each semiconductor element and further improve the electrical performance of the semiconductor module.

On the other hand, the embodiment of the application further provides a radiator, which comprises a cooling groove and the radiating assembly, wherein a groove which is opened towards the bottom plate is formed in the cooling groove, a liquid inlet channel and a liquid outlet channel are formed in the groove wall of the cooling groove, a first communicating port which is communicated with the liquid inlet channel is formed in one side of the bottom of the groove, a second communicating port which is communicated with the liquid outlet channel is formed in the other side of the bottom of the groove, the turbulence columns are embedded into the groove, and the edge of the first surface of the bottom plate is attached and fixed to the opening end face of the cooling groove;

the inlet ends of the flow passages are communicated with the first communicating port, and the outlet ends of the flow passages are communicated with the second communicating port.

Optionally, a plurality of grooves are provided, and inlet ends of the plurality of grooves are arranged at intervals along the length direction of the cooling tank; the heat dissipation assembly is provided with a plurality of heat dissipation assemblies, and the plurality of turbulence columns of each heat dissipation assembly are embedded into the corresponding grooves;

the first end of inlet channel is opened, inlet channel's second end is sealed, outlet channel's first end is opened, outlet channel's second end is sealed, inlet channel's first end and outlet channel's first end are located the length direction's of cooling bath relative both sides, inlet channel is with a plurality of the first intercommunication mouth intercommunication of the bottom of recess, outlet channel is with a plurality of the second intercommunication mouth intercommunication of the bottom of recess.

In another aspect, an embodiment of the present application further provides a semiconductor module, including semiconductor elements and the above heat sink, where the semiconductor elements are provided with multiple groups, each group of the semiconductor elements is provided with one semiconductor element or multiple semiconductor elements arranged along the length direction of the flow channel, the second surface of the bottom plate is opposite to each of the areas of the flow channel, where a heat dissipation area is formed, and each of the heat dissipation areas is provided with a group of the semiconductor elements.

Drawings

Fig. 1 is a perspective view of a heat dissipating assembly of a heat sink according to an embodiment of the present application;

fig. 2 is a top view of a heat dissipation assembly of a heat sink according to an embodiment of the present application;

FIG. 3 is a perspective view of a cooling channel of a heat sink provided in an embodiment of the present application;

FIG. 4 is a top view of a cooling slot of a heat sink provided in an embodiment of the present application;

FIG. 5 is a sectional view taken along the line A-A in FIG. 4;

FIG. 6 is a cross-sectional view taken along the line B-B in FIG. 4;

fig. 7 is a perspective view of a heat sink assembly provided in accordance with another embodiment of the present application;

fig. 8 is a top view of a heat dissipation assembly provided in another embodiment of the present application.

The reference numerals in the specification are as follows:

10. a heat dissipating component; 1. a base plate; 11. a first surface; 12. a second surface; 2. a turbulence column; 2a, a turbulent column row; 3. a flow channel; 31. an inlet end; 32 an outlet end; 4a, a flow blocking wall; 4b, a flow disturbing column partition wall; 5. enclosing plates; 51. a first side wall; 52. a second side wall; 53. a third side wall; 54. a fourth side wall; 6. a liquid inlet collecting area; 7. a liquid outlet collection area;

20. a cooling tank; 201. a groove; 202. a liquid inlet channel; 203. a liquid outlet channel; 204. a first communication port; 205. a second communication port; 206. an open end face.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Referring to fig. 1 to 6, a heat sink according to an embodiment of the present invention includes a cooling tank 20 and a heat dissipation assembly 10, a groove 201 opening toward a bottom plate 1 is disposed in the cooling tank 20, and a liquid inlet channel 202 and a liquid outlet channel 203 are disposed on a wall of the cooling tank 201. The outside of the liquid inlet channel 202 is connected with a water inlet pipe, and the outside of the liquid outlet channel 203 is connected with a water outlet pipe. The heat dissipation assembly 10 includes a bottom plate 1 and a plurality of turbulence columns 2, the bottom plate 1 has a first surface 11 and a second surface 12 opposite to each other in a thickness direction of the bottom plate, the plurality of turbulence columns 2 are connected to the first surface 11 of the bottom plate 1, the plurality of turbulence columns 2 define a plurality of parallel flow channels 3, inlet ends 31 of the plurality of flow channels 3 are located on a first side of the bottom plate 1 and are communicated with each other, outlet ends 32 of the plurality of flow channels 3 are located on a second side of the bottom plate 1 opposite to the first side and are communicated with each other, and two adjacent flow channels 3 are separated at adjacent positions thereof. The turbulence column 2 is used for increasing the contact area of the cooling liquid and the heat dissipation assembly 10 and improving the heat exchange efficiency.

In one embodiment, a plurality of the turbulence posts 2 extend away from the first surface 11 of the base plate 1. More preferably, a plurality of the turbulence columns 2 are perpendicular to the base plate 1.

A first communicating port 204 communicated with the liquid inlet channel 202 is arranged on one side of the bottom of the groove 201, a second communicating port 205 communicated with the liquid outlet channel 203 is arranged on the other side of the bottom of the groove 201, the plurality of turbulence columns 2 are embedded into the groove 201, and the edge of the first surface 11 of the bottom plate 1 is attached and fixed on an opening end surface 206 of the cooling groove 20; the inlet ends 31 of the plurality of flow paths 3 communicate with the first communication port 204, and the outlet ends 32 of the plurality of flow paths 3 communicate with the second communication port 205.

In one embodiment, referring to fig. 1 and 2, the turbulence columns 2 are cylinders, a plurality of the turbulence columns 2 are equal in height, and top end surfaces of the turbulence columns 2 abut against the bottom surface of the groove 201.

In some alternatives, the turbulence column 2 may also be a conical column or a circular truncated cone column, and a plurality of the turbulence columns 2 may also be unequal in height.

In one embodiment, adjacent positions of two adjacent flow channels 3 are provided with a partition element extending from the inlet end 31 to the outlet end 32 of the flow channel 3, and the partition element separates the flow channels 3 on two sides.

In an embodiment, referring to fig. 1 and fig. 2, the partition element at the adjacent position of two adjacent flow channels 3 at the middle position is a flow blocking wall 4a, the flow blocking wall 4a is a block-shaped structure extending along the direction of the flow channel 3, and the flow blocking wall 4a is as high as the flow disturbing columns 3; at the two sides of the choke wall 4a, the separating elements at the adjacent positions of two adjacent flow channels 3 are spoiler separating walls 4b formed by a row of adjacent spoiler columns 2. The gap between adjacent flow pillars 2 of the flow pillar partition wall 4b is small (may be 0).

In an embodiment, referring to fig. 1 and 2, the heat dissipation assembly 10 further includes a surrounding plate 5 connected to the first surface 11 of the base plate 1 and surrounding the plurality of turbulence columns 2, the surrounding plate 5 is square, the surrounding plate has a first side wall 51, a second side wall 52, a third side wall 53 and a fourth side wall 54, the third side wall 53 and the fourth side wall 54 of the surrounding plate 5 are opposite to each other at a distance and extend along the direction of the flow channel 3, the first side wall 51 of the surrounding plate 3 is connected between a first end of the third side wall 53 and a first end of the fourth side wall 54, and the second side wall 52 of the surrounding plate 5 is connected between a second end of the third side wall 53 and a second end of the fourth side wall 54. A liquid inlet collecting area 6 is formed between the first side wall 51 of the enclosing plate 5 and the inlet ends 31 of the plurality of flow channels 3, and a liquid outlet collecting area 7 is formed between the second side wall 52 of the enclosing plate 5 and the outlet ends 32 of the plurality of flow channels 3; the plurality of turbulence columns 2 in each flow channel 3 are divided into a plurality of turbulence column rows 2a, the plurality of turbulence columns 2 in each turbulence column row 2a are arranged next to each other, and the plurality of turbulence column rows 2a are arranged at intervals from the inlet end 31 to the outlet end 32 of the flow channel 3. Preferably, a plurality of the turbulence column rows 2a are arranged in parallel and at equal intervals. The inlet liquid collection area 6 faces the first communication port 204 and is communicated with the first communication port, and the outlet liquid collection area 7 faces the second communication port 205 and is communicated with the second communication port. Thus, the cooling liquid entering from the liquid inlet channel 202 enters the liquid inlet collecting region 6 through the first communication port 204, then flows through the plurality of turbulent flow columns 2 in the multipath flow channel 3, and finally flows into the liquid outlet channel 203 after being collected in the liquid outlet collecting region 7.

The flow channel 3 adjacent to the third side wall 53 of the shroud 5 is defined by the third side wall 53 of the shroud 5 and the adjacent dividing element (i.e. the spoiler pillar dividing wall 4 b); the flow channel 3 adjacent to the fourth side wall 54 of the shroud 5 is defined by the fourth side wall 54 of the shroud 5 and the adjacent dividing element (i.e. the spoiler pillar partition wall 4 b).

The flow channels 3 between the flow channels 3 adjacent to the third side wall 53 of the shroud 5 and the flow channels 3 adjacent to the fourth side wall 54 of the shroud 5 are defined by two adjacent separating elements. For example, in fig. 1 and 2, there are 4 flow channels 3, and the two middle flow channels 3 are separated by the spoiler wall 4a, that is, the two middle flow channels 3 are defined by the spoiler separation wall 4b and the spoiler wall 4 a.

In one embodiment, the multiple turbulence column rows 2a in each flow channel 3 are arranged in parallel at intervals.

The turbulence column rows 2a in the flow channel 3 close to the third side wall 53 of the enclosure 5 are from the inlet end 31 to the outlet end 32 of the flow channel 3, one side of the odd turbulence column rows 2a is close to the third side wall 53 of the enclosure 5, the other side of the odd turbulence column rows 2a is spaced from the adjacent partition element 4 to form a cooling liquid channel, one side of the even turbulence column rows 2a is spaced from the third side wall 53 of the enclosure 5 to form a cooling liquid channel, and the other side of the even turbulence column rows 2a is close to the adjacent partition element 4.

The turbulence column rows 2a in the flow channel 3 close to the fourth side wall 54 of the enclosure 5 are from the inlet end 31 to the outlet end 32 of the flow channel 3, one side of the odd turbulence column rows 2a is close to the fourth side wall 54 of the enclosure 5, the other side of the odd turbulence column rows 2a is spaced from the adjacent partition element 4 to form a cooling liquid channel, one side of the even turbulence column rows 2a is spaced from the fourth side wall 54 of the enclosure 5 to form a cooling liquid channel, and the other side of the even turbulence column rows 2a is close to the adjacent partition element 4.

The turbulence column rows 2a in the flow channel 3 between the flow channel 3 near the third side wall 53 of the enclosure 5 and the flow channel 3 near the fourth side wall 54 of the enclosure 5 (i.e. the flow channel 3 in the middle position) are from the inlet end 31 to the outlet end 32 of the flow channel 3, one side of the odd number of the turbulence column rows 2a is closely adjacent to one of the partition elements 4, the other side of the odd number of the turbulence column rows 2a is spaced from the other adjacent partition element 4 to form a cooling liquid passage, one side of the even number of the turbulence column rows 2a is spaced from one of the partition elements 4 to form a cooling liquid passage, and the other side of the even number of the turbulence column rows 2a is closely adjacent to the other adjacent partition element 4.

In this way, each flow channel 3 continuously turns and repeats from the first side to the second side of the bottom plate 1. The liquid in the flow channel 3 can be better guided, and the heat exchange is more sufficient.

In an embodiment, referring to fig. 4 to 6, the plurality of grooves 201 (3 are exemplarily shown in the figures), the plurality of grooves 201 are arranged at intervals along the length direction of the cooling slot 20, the length direction of the cooling slot 20 is perpendicular to the length direction of the flow channel 3, and the liquid inlet channel 202 and the liquid outlet channel 203 extend along the length direction of the cooling slot 20; the heat dissipation assembly 10 is provided with a plurality of heat dissipation assemblies 10, and the plurality of turbulence columns 2 of each heat dissipation assembly 10 are embedded into the corresponding grooves 201, that is, one groove 201 corresponds to one heat dissipation assembly 10; the first end of inlet channel 202 is opened, the second end of inlet channel 202 is sealed, the first end of outlet channel 203 is opened, the second end of outlet channel 203 is sealed, the first end of inlet channel 202 and the first end of outlet channel 202 are located the relative both sides of the length direction of cooling bath 20, inlet channel 202 is with a plurality of the first intercommunication mouth 204 intercommunication of the bottom of recess 201, outlet channel 203 is with a plurality of the second intercommunication mouth 205 intercommunication of the bottom of recess 201.

Thus, the coolant entering from the inlet passage 202 enters the inlet collecting region 6 of each heat dissipating module 10 through the first communication port 204 at the bottom of the plurality of grooves 201. In each heat dissipation assembly 10, the cooling liquid flows through the plurality of turbulence columns 2 in the multi-path flow channel 3, and finally flows into the liquid outlet channel 203 after being collected in the liquid outlet collection area 7. Providing a plurality of heat dissipation assemblies 10 and recesses 201 enables a greater number of semiconductor elements (e.g., chips, IGBTs) to be cooled. The semiconductor element is seen in a small dashed frame a in fig. 2.

In one embodiment, the height of the turbulence column is 4 mm.

The bottom plate 1 and the coaming 5 are integrally formed or welded into a whole. The bottom plate 1, the turbulence column 2 and the coaming 5 are made of single metal or alloy such as copper, aluminum and the like. That is, the heat sink 10 is made of copper, and the surface thereof may be plated with nickel, thereby improving the corrosion resistance of the heat sink 10.

Referring to fig. 7 and 8, in another embodiment of the heat dissipation assembly 10 of the present application, the partition member is a spoiler separating wall 4b formed by a row of the spoiler columns 2 adjacent to each other. Here, the partition elements are turbulence column partition walls 4 b.

Further, in this embodiment, the flow channels 3 are provided with 5, correspondingly, the region of the second surface of the base plate 1 facing the flow channels 3 is formed with a heat dissipation region, and the semiconductor elements (small boxes b in fig. 8) are provided with 5 groups, each group being arranged in the direction of the flow channels 3.

In other embodiments, a plurality of the turbulence column rows 2a in the flow channel 3 close to the third side wall 53 of the enclosure 5 extend from the inlet end 31 to the outlet end 32 of the flow channel 3, odd-numbered ones of the turbulence column rows 2a are spaced from the third side wall 53 of the enclosure 5 to form a coolant passageway, odd-numbered ones of the turbulence column rows 2a are abutted against the adjacent separating elements, even-numbered ones of the turbulence column rows 2a are abutted against the third side wall 53 of the enclosure 5, and even-numbered ones of the turbulence column rows 2a are spaced from the adjacent separating elements to form a coolant passageway.

The turbulence column rows 2a in the flow channel 3 close to the fourth side wall 54 of the enclosure 5 are spaced from the inlet end 31 to the outlet end 32 of the flow channel 3 to form a cooling liquid channel, one side of the odd turbulence column rows 2a is spaced from the fourth side wall 54 of the enclosure 5 to form a cooling liquid channel, the other side of the odd turbulence column rows 2a is abutted against the adjacent separating element, one side of the even turbulence column rows 2a is abutted against the fourth side wall 54 of the enclosure 5, and the other side of the even turbulence column rows 2a is spaced from the adjacent separating element to form a cooling liquid channel.

The plurality of turbulence column rows 2a in the flow channel 3 between the flow channel 3 near the third side wall 53 of the shroud 5 and the flow channel 3 near the fourth side wall 54 of the shroud 5 are arranged from the inlet end 31 to the outlet end 32 of the flow channel 3, one side of the odd number of turbulence column rows 2a is spaced from one of the partition elements to form a cooling liquid passage channel, the other side of the odd number of turbulence column rows 2a is abutted against the other adjacent partition element, one side of the even number of turbulence column rows 2a is abutted against one of the partition elements, and the other side of the even number of turbulence column rows 2a is spaced from the other adjacent partition element to form a cooling liquid passage channel.

In addition, the embodiment of the application also provides a semiconductor module, which comprises semiconductor elements and the radiator of the embodiment, wherein the semiconductor elements are provided with a plurality of groups, each group of semiconductor elements is provided with one semiconductor element or a plurality of semiconductor elements arranged along the length direction of the flow channel, the second surface of the bottom plate is opposite to each flow channel, a heat dissipation area is formed in the area of the flow channel, and each heat dissipation area is provided with a group of semiconductor elements. The semiconductor element may be, for example, an IGBT, a chip, a MOSFET module, or the like.

In one embodiment, each group of semiconductor elements is provided with a plurality of semiconductor elements, and the plurality of semiconductor elements of each group of semiconductor elements are linearly arranged at intervals along the direction of the flow channel.

In addition, an embodiment of the present application further provides a vehicle including the semiconductor module described above.

According to the heat dissipation assembly, the radiator, the semiconductor module and the vehicle of the embodiment of the application, the plurality of flow disturbing columns define a plurality of parallel flow channels, inlet ends of the plurality of flow channels are located on a first side of the bottom plate and communicated with each other, inlet ends of the plurality of flow channels are located on a second side, opposite to the first side, of the bottom plate and communicated with each other, and two adjacent flow channels are separated at adjacent positions of the plurality of flow channels. Like this, the runner on the bottom plate is cut apart into many parallelly, the region that the second surface of bottom plate just is to the runner is formed with the heat dissipation region, namely, every runner corresponds a heat dissipation region, can place semiconductor component such as chip in different heat dissipation regions in groups, every runner is only used for cooling a set of semiconductor component on the heat dissipation region that corresponds, not only effectively increased direct heat transfer area, obtain better cooling effect, and every group semiconductor component all is independent runner cooling, make the temperature of every group semiconductor component more even. The cooling liquid can take away heat transmitted from the bottom plate in time, the cooling effect is obvious, and the application scenes of needing large current and high heating are facilitated. Simulation shows that the design can effectively reduce the temperature of the semiconductor element, ensure the temperature uniformity of each semiconductor element and further improve the electrical performance of the semiconductor module.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. The utility model provides a heat dissipation assembly, its characterized in that includes bottom plate and a plurality of vortex post, the bottom plate has relative first surface and second surface in its thickness direction, and is a plurality of the vortex post is connected on the first surface of bottom plate, and is a plurality of parallel many runners are injectd to the vortex post, and is many the entrance point of runner is located the first side of bottom plate communicates with each other, and is many the exit end of runner is located the second side relative with the first side of bottom plate communicates with each other, and adjacent two the runner is separated at its border position.

2. The heat dissipation assembly of claim 1, wherein a plurality of the turbulation posts extend away from the first surface of the base plate.

3. The heat dissipating assembly of claim 1, wherein adjacent positions of two adjacent flow passages are provided with a partition member extending from the inlet end to the outlet end of the flow passage, and the partition member separates the flow passages on both sides.

4. The heat removal assembly of claim 3, the dividing element being a turbulator dividing wall comprised of one or more rows of the turbulators in close proximity.

5. The heat dissipation assembly of claim 3, wherein the partition element is a flow blocking wall, the flow blocking wall is a block-shaped structure extending in the direction of the flow channel, and the flow blocking wall is as high as the flow disturbing columns.

6. The heat dissipation assembly of claim 3, wherein the partition elements at the adjacent positions of two flow channels adjacent to each other at the intermediate position are flow blocking walls, each flow blocking wall is a block-shaped structure extending along the direction of the flow channel, and each flow blocking wall is as high as the corresponding flow disturbing column;

7. The heat sink assembly of claim 3, further comprising a shroud attached to the first surface of the base plate and surrounding the plurality of turbulence posts, the shroud having a first side wall, a second side wall, a third side wall, and a fourth side wall, the third side wall of the shroud being spaced apart from the fourth side wall and extending in the direction of the flow channel, the first side wall of the shroud being attached between a first end of the third side wall and a first end of the fourth side wall, and the second side wall of the shroud being attached between a second end of the third side wall and a second end of the fourth side wall; a liquid inlet collecting area is formed between the first side wall of the enclosing plate and the inlet ends of the plurality of flow channels, and a liquid outlet collecting area is formed between the second side wall of the enclosing plate and the outlet ends of the plurality of flow channels;

8. The heat dissipation assembly of claim 7, wherein the plurality of rows of turbulating posts in each flow channel are spaced in parallel.

9. The heat dissipation assembly of claim 8, wherein a plurality of the turbulence column rows in the flow channel adjacent to the third sidewall of the enclosure extend from the inlet end to the outlet end of the flow channel, wherein an odd number of the turbulence column rows have one side abutting the third sidewall of the enclosure, an odd number of the turbulence column rows have another side spaced from the adjacent partition element to form a coolant passage, an even number of the turbulence column rows have one side spaced from the third sidewall of the enclosure to form a coolant passage, and an even number of the turbulence column rows have another side abutting the adjacent partition element;

10. The heat dissipation assembly of claim 8, wherein a plurality of the turbulator column rows in the flow channel adjacent to the third sidewall of the enclosure are spaced from the inlet end to the outlet end of the flow channel to form a coolant passageway, wherein an odd number of the turbulator column rows have one side thereof spaced from the third sidewall of the enclosure, an odd number of the turbulator column rows have another side thereof abutting the adjacent spacer element, an even number of the turbulator column rows have one side thereof abutting the third sidewall of the enclosure, and an even number of the turbulator column rows have another side thereof spaced from the adjacent spacer element to form a coolant passageway;

11. The heat removal assembly of claim 8, wherein a plurality of rows of the turbulence columns in the flow channels between the flow channels adjacent to the third sidewall of the enclosure and the flow channels adjacent to the fourth sidewall of the enclosure extend from the inlet end to the outlet end of the flow channels, wherein one side of an odd number of the rows of the turbulence columns abuts one of the partition elements, the other side of an odd number of the rows of the turbulence columns is spaced from another adjacent partition element to form a coolant flow channel, wherein one side of an even number of the rows of the turbulence columns is spaced from one of the partition elements to form a coolant flow channel, and the other side of an even number of the rows of the turbulence columns abuts another adjacent partition element.

12. The heat removal assembly of claim 8, wherein a plurality of rows of the turbulence columns in the flow channels between the flow channels adjacent to the third sidewall of the enclosure and the flow channels adjacent to the fourth sidewall of the enclosure extend from the inlet end to the outlet end of the flow channels, an odd number of rows of the turbulence columns having one side spaced from one of the partition elements to form a coolant passage, an odd number of rows of the turbulence columns having another side abutting another adjacent one of the partition elements, an even number of rows of the turbulence columns having one side abutting one of the partition elements, and an even number of rows of the turbulence columns having another side spaced from another adjacent one of the partition elements to form a coolant passage.

13. The heat dissipation assembly of claim 1, wherein the turbulator columns are cylindrical, and a plurality of the turbulator columns are of equal height.

14. A radiator, comprising a cooling tank and the heat dissipation assembly as claimed in any one of claims 1 to 13, wherein a groove opened toward the bottom plate is formed in the cooling tank, a liquid inlet channel and a liquid outlet channel are formed in a wall of the cooling tank, a first communication port communicated with the liquid inlet channel is formed in one side of the bottom of the groove, a second communication port communicated with the liquid outlet channel is formed in the other side of the bottom of the groove, a plurality of turbulence columns are embedded in the groove, and the edge of the first surface of the bottom plate is fitted and fixed on the opened end face of the cooling tank;

15. The heat sink of claim 14, wherein a plurality of said grooves are provided, and said plurality of said grooves have inlet ends spaced apart along a length of said cooling channel; the heat dissipation assembly is provided with a plurality of heat dissipation assemblies, and the plurality of turbulence columns of each heat dissipation assembly are embedded into the corresponding grooves;

16. A semiconductor module comprising semiconductor devices and the heat spreader of claim 14 or 15, wherein the semiconductor devices are arranged in a plurality of groups, each group of the semiconductor devices is provided with one semiconductor device or a plurality of semiconductor devices arranged along the length direction of the flow channel, a heat dissipation area is formed on the second surface of the base plate in a region facing each flow channel, and a group of the semiconductor devices is arranged on each heat dissipation area.

17. A vehicle characterized by comprising the semiconductor module of claim 16.