CN216449878U

CN216449878U - Thermoelectric refrigerating device of industrial camera

Info

Publication number: CN216449878U
Application number: CN202122792422.5U
Authority: CN
Inventors: 王朝付; 杨竣凯; 李坤
Original assignee: Hefei Eko Photoelectric Technology Co ltd
Current assignee: Hefei Eko Photoelectric Technology Co ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2022-05-06
Anticipated expiration: 2031-11-12

Abstract

The utility model discloses an industrial camera thermoelectric refrigerating device in the field of camera refrigeration, which comprises a shell assembly, wherein the shell assembly is connected and matched with a heat dissipation plate assembly on the lower side to form a sealed cavity; an image sensor is fixedly arranged in the cavity; the cavity is filled with dry protective gas; a TEC is arranged above the heat dissipation plate assembly and is attached to the hot end of the TEC, the cold end of the TEC is tightly attached to a heat conduction assembly, the periphery of the heat conduction assembly is wrapped and limited by a bushing, and the bushing is fixedly arranged in the cavity; a second heat conducting pad is further arranged above the bushing, the lower surface of the second heat conducting pad is tightly attached to the heat conducting assembly, and the upper surface of the second heat conducting pad is tightly attached to the back face of the image sensor. According to the utility model, the mode of filling dry gas in the cavity is utilized, and the structure of wrapping the bushing on the outer side of the heat conduction assembly is matched, so that the sealing structure is simple and easy to realize, the anti-condensation effect in the cavity can be realized, and the strong and rapid refrigeration of the TEC is not hindered.

Description

Thermoelectric refrigerating device of industrial camera

Technical Field

The utility model relates to the field of camera refrigeration, in particular to a thermoelectric refrigeration device for an industrial camera.

Background

The industrial camera converts optical signals into electric signals by using an image sensor, and the imaging quality of the image sensor is sensitive to thermal noise, so that the image sensor needs to be cooled to keep a lower working temperature and improve the imaging effect of the camera.

At present, thermoelectric cooling of a camera is generally implemented by a semiconductor Cooler (Thermo Electric Cooler, hereinafter abbreviated as TEC), which implements cooling by using the peltier effect, which means that when a loop formed by conductors of different materials applies current, heat is absorbed and generated at two corresponding ends of the conductors respectively. When the image sensor is refrigerated by the TEC, when the refrigerating temperature is lower than the ambient temperature, water vapor in the camera is easy to condense and adhere to the surface of a component with lower temperature, namely, the condensation phenomenon is generated. The dewing phenomenon can increase the electrical short circuit risk of the camera, has a certain corrosion effect on components and parts, and reduces the service life of the camera.

Chinese patent CN207833202U provides a camera refrigeration device, which adopts double sealing of the camera metal inner shell component to ensure the vacuum environment of the refrigeration cavity and prevent the influence of condensation of water molecules on the circuit board during the refrigeration process. But the evacuation mode leads to external steam can be because of the effect of pressure differential and inside infiltration, consequently to the requirement of sealing performance high, adopts two casing sealings can lead to the structure complicated, and the joint strength of structure requires highly, and difficult realization.

Chinese patent CN211061833U provides an industrial camera refrigeration device, which combines TEC refrigeration, air cooling and water cooling, and monitors the camera temperature in real time to control the refrigeration capacity and prevent condensation. Because this technique has adopted the water-cooling, needs water pump, water-cooling board, pipeline cooperation, in case take place the water-cooling liquid and reveal, camera short circuit risk improves by a wide margin, reduces the reliability when the structure is complicated. In addition, the technology adopts a temperature monitoring mode to prevent dewing, and because the moisture in the camera is not removed, the refrigerating capacity is limited to prevent the dewing phenomenon, and the technology is not suitable for occasions with low requirement on refrigerating temperature or rapid refrigeration.

In view of the above, the technical scheme provides a refrigeration device with condensation prevention and simple structure, which is applicable to occasions with low refrigeration temperature and rapid refrigeration.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a thermoelectric cooling device for industrial cameras to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme:

the thermoelectric refrigerating device for the industrial camera comprises a shell assembly, a heat dissipation plate assembly and a heat dissipation plate assembly, wherein the shell assembly is connected and matched with the heat dissipation plate assembly on the lower side to form a sealed cavity; an image sensor is fixedly arranged in the cavity; the cavity is filled with dry protective gas; a TEC is arranged above the heat dissipation plate assembly and is attached to the hot end of the TEC, the cold end of the TEC is tightly attached to a heat conduction assembly, the periphery of the heat conduction assembly is wrapped and limited by a bushing, and the bushing is fixedly arranged in the cavity; and a second heat-conducting pad is further arranged above the bushing, the lower surface of the second heat-conducting pad is tightly attached to the heat-conducting assembly, and the upper surface of the second heat-conducting pad is tightly attached to the back surface of the image sensor.

In the utility model, dry gas is filled in the cavity, so that the balance of internal and external air pressures can be kept, and external water vapor enters the cavity and depends on free diffusion. Compared with the vacuum pumping mode inside the cavity adopted in the prior art, the cavity sealing structure adopted by the technical scheme is obviously more reliable, and the realization difficulty is not high. In addition, this technical scheme sets up the bush in the heat-conducting component outside, the low and small clearance that exists between the heat-conducting component of coefficient of thermal conductivity of bush, can play the effect of cold insulation, reduces the TEC to the image sensor refrigeration loss on the route, has the effect that reduces steam at microthermal heat-conducting component surface adhesion simultaneously. Because the interior of the cavity is dry, the residual water vapor is less, and the bushing is matched to prevent the condensation phenomenon, the rapid refrigeration of the TEC can not be influenced, and the utility model can play a good refrigeration effect on the image sensor.

In some embodiments, the heat conducting assembly includes a heat conducting block and a first heat conducting pad which are arranged up and down and closely attached, and a plurality of grooves are arranged on the surface of the heat conducting block attached to the first heat conducting pad and/or the second heat conducting pad. The arrangement of the groove can increase the certain compression amount of the first heat-conducting pad and the second heat-conducting pad, increase the contact area with the heat-conducting block and improve the heat-conducting effect.

In some embodiments, a heat conducting grease is filled between the TEC and the heat dissipation plate assembly or a third heat conducting gasket is disposed between the TEC and the heat dissipation plate assembly, so that thermal resistance between the hot end of the TEC and the heat dissipation plate assembly can be reduced, and heat dissipation efficiency can be improved.

In some embodiments, a drying device for absorbing gas moisture is installed on the inner wall of the cavity, and is used for further eliminating water vapor remaining in the cavity on the basis of filling dry gas in the cavity, so as to prevent the camera from being affected.

In some embodiments, a boss for limiting the TEC is formed above the heat sink plate assembly, and the boss is used for naturally positioning the TEC and preventing the TEC from moving.

In some embodiments, the heat sink plate assembly includes a heat sink base and a plurality of heat sinks formed on a surface of the heat sink base for dissipating heat from the hot end of the TEC.

In some embodiments, the heat dissipation plate assembly further includes a heat dissipation fan disposed outside the heat dissipation plate, and the heat dissipation fan can be used to perform forced convection heat transfer on the heat dissipation plate, so as to improve the heat dissipation efficiency of the heat dissipation plate.

In some embodiments, the housing assembly includes a housing and a filter assembly sealingly attached to an upper side of the housing and opposite a front side of the image sensor; the shell is provided with an inflation hole and an air exhaust hole, and the inflation hole and the air exhaust hole are provided with a sealing cover plate through a sealing cover plate sealing ring and a compression screw in a sealing manner.

In some embodiments, the image sensor is installed inside the cavity through a support assembly, the support assembly includes a sensor seat for installing and placing the image sensor and a sensor gland installed above the sensor seat, a notch is formed in the surface of the sensor gland, a bent hanging lug is arranged on the edge of the sensor gland, a plurality of second positioning columns are distributed on the inner wall of the housing, and positioning holes are formed in the surface of the hanging lug and are fixedly connected with the second positioning columns.

Has the advantages that: according to the utility model, the mode of filling dry gas in the cavity is utilized, and the structure of wrapping the bushing on the outer side of the heat conduction assembly is matched, so that the sealing structure is simple and easy to realize, the anti-condensation effect in the cavity can be realized, and the strong and rapid refrigeration of the TEC is not hindered.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of a heat-conducting block according to the present invention.

In the figure: 1-a housing; 2-sealing the cover plate; 3-a compression screw; 4-sealing the cover plate sealing ring; 5-a radiator plate assembly; 501-heat dissipation base; 502-a heat sink; 503-boss; 6-a first positioning column; 7-heat conducting grease condensation; 8-TEC; 801-hot side; 802-cold end; 9-a first thermally conductive pad; 10-a heat conducting block; 1001-groove; 11-a liner; 12-a bushing screw; 13-a circuit board; 14-a second thermally conductive pad; 15-sensor seat; 16-an image sensor; 17-a sensor gland; 18-a set screw; 19-an electrical interface; 20-housing sealing ring; 21-a drying device; 22-a second positioning column; 23-filter seal ring; 24-a filter; 25-filter gland; 26-a filter window; 27-an inflation hole; 28-hanging ears.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, the thermoelectric refrigerating device for the industrial camera comprises a shell assembly, wherein the shell assembly is connected and matched with a heat dissipation plate assembly 5 on the lower side to form a sealed cavity. In some embodiments, the housing assembly includes a housing 1 and a filter assembly disposed on an upper side of the housing 1. The housing 1 is preferably made of a metal material having a high thermal conductivity, such as an aluminum alloy. The filter assembly is opposite the front of the image sensor 16 mounted inside the chamber and on the same central axis.

To maintain a hermetic seal inside the chamber, the filter assembly is sealingly connected to the housing 1. Specifically, a step-shaped filter window 26 is arranged above the housing 1, the filter assembly comprises a filter 24, a filter gland 25 and a filter sealing ring 23, the filter 24 is arranged at the filter window 26, the filter gland 25 is arranged above the filter 24 and fixes the edge of the filter 24 with the housing 1, and the filter sealing ring 23 is arranged between the filter 24 and the housing 1 to play a sealing role.

The sealed cavity can isolate the gas exchange with the outside, and the influence of external water vapor on the inside of the camera is avoided. In order to reduce the influence of air moisture inside the chamber on the image sensor 16, a gas filling hole 27 and a gas exhaust hole (not shown) are formed on the housing 1 for filling dry protective gas, typically inert gas such as nitrogen, argon, etc., into the chamber. The mode of filling dry gas in the cavity can maintain the air pressure balance with the outside, compared with the mode of vacuumizing in the prior art, the method reduces the complexity of the structure and the requirement on the connection strength of the structure, and meanwhile, the method can reduce the permeation of the outside gas to the inside of the cavity due to the action of pressure difference, and improves the sealing reliability.

In order to keep the sealing of the inflation hole 27 and the air exhaust hole, the inflation hole 27 and the air exhaust hole are both provided with a sealing cover plate 2, the joint of the sealing cover plate 2, the inflation hole 27 and the air exhaust hole is also provided with a sealing cover plate sealing ring 4, and the sealing cover plate 2 is fixed in the inflation hole 27 and the air exhaust hole through a compression screw 3.

In a preferred embodiment, in order to eliminate residual moisture in the dry gas inside the cavity and a very small amount of permeated ambient gas, a drying device may be further mounted on the inner wall of the cavity, and the drying device may be a drying sheet, a drying agent, a gas adsorbent, or the like, so as to further ensure a dry environment inside the camera.

A TEC8 is provided above the heat sink assembly 5. In some embodiments, to facilitate positioning of the TEC, a boss 503 is formed above the heat sink base 501 to limit the TEC 8. In a preferred embodiment, the heat sink assembly 5 includes a heat sink base 501 and a plurality of heat sinks 502 formed on the surface of the heat sink base 501. The heat dissipation base 501 is fixedly connected with the housing 1 by means of screws or the like, and a housing sealing ring 20 is arranged at the joint of the heat dissipation base 501 and the housing 1 in order to maintain the sealing of the cavity. The heat dissipation plate 502 mainly adopts a natural air cooling mode to dissipate heat of the TEC8, so that leakage risk caused by water cooling heat dissipation in the prior art is avoided. In order to improve the heat dissipation efficiency, in some embodiments, a heat dissipation fan may be further disposed outside the heat dissipation plate 502, so as to accelerate the heat dissipation efficiency by means of forced convection heat transfer.

The heat dissipation base 501 is attached to the hot end 801 of the TEC8, and the cold end 802 of the TEC8 is tightly attached to a heat conduction assembly. The hot end 801 of the TEC8 generates a large amount of heat during the working process, in some embodiments, a heat conducting grease 7 is filled between the TEC8 and the heat dissipation plate assembly 5, the heat conducting grease 7 is made of a material with high thermal conductivity, and the laying thickness is generally 0.1-0.2mm, and is used for filling a contact gap between the hot end 801 and the heat dissipation base 501, reducing thermal resistance, and improving the heat dissipation efficiency of the heat dissipation plate assembly 5. In other embodiments, a third thermal pad may be disposed between the TEC8 and the heat sink assembly 5, and the third thermal pad is made of a material having a thermal conductivity coefficient similar to or higher than that of the thermal grease 7, which can also achieve the effect of improving the heat dissipation efficiency.

The periphery of the heat conducting assembly is wrapped and limited by a bushing 11, and the bushing 11 is fixedly arranged in the cavity; a second thermal pad 14 is disposed above the bushing 11, a lower surface of the second thermal pad 14 is closely attached to the thermal conductive member, and an upper surface of the second thermal pad is closely attached to a back surface of the image sensor 16. Thus, the cooling path for TEC8 to image sensor 16 is, in order, cold side 802, the thermally conductive assembly, second thermally conductive pad 14, and image sensor 16. The liner 11 is preferably made of a material with a low heat conductivity coefficient but a certain structural strength, such as a high polymer material PEEK (polyether ether ketone), and can limit and fix the heat conducting assembly, and the liner 11 can not only keep the heat conducting assembly cold when the temperature of the air inside the cavity rises due to the work of the camera, but also wrap the heat conducting assembly so that the moisture inside the cavity cannot be attached to the low-temperature surface of the cavity, i.e., condensation is prevented.

Therefore, in the present embodiment, by filling the dry gas into the cavity and matching the structure of wrapping the bushing 11 outside the heat conducting assembly, the sealing structure is simple and easy to implement, the dewing prevention effect inside the cavity can be achieved, and the powerful rapid cooling of the TEC8 is not hindered.

In some embodiments, the heat conducting assembly includes a heat conducting block 10 and a first heat conducting pad 9 which are disposed up and down and closely attached to each other, and the heat conducting block 10 is made of a material with excellent heat conducting property, such as aluminum, copper or alloy, for reducing cold loss and enhancing refrigeration effect. In order to reduce the thermal resistance, increase the contact area with the first thermal pad 9, and provide a certain compression space for the first thermal pad 9, in some embodiments, the surface of the thermal block 10 attached to the first thermal pad 9 is provided with a plurality of grooves 1001. In other embodiments, the heat conducting block 10 may further have a plurality of grooves 1001 on the surface attached to the second heat conducting pad 14, so as to achieve the same technical effect. The first heat conducting pad 9 and the second heat conducting pad 14 are both made of soft medium with good heat conducting performance.

The bush 11 mainly used wraps up the heat conduction piece 9, and in order to form effectual cold insulation effect, the hole of bush 11 slightly is greater than the outside dimension of heat conduction piece 10, and the clearance is about 0.1 ~ 0.2 mm. The surface of bush 11 sets up porosely, and the first reference column 6 of downthehole threaded connection all sets up the screw hole in heat dissipation base 501 and the first reference column 6, and first reference column 6 passes through bush screw 12 threaded fixation in heat dissipation base 501 to installation bush 11. The bushing screw 12 and the first positioning column 6 are preferably made of a material with low thermal conductivity and certain structural strength, such as PEEK or other high polymer materials.

The image sensor 16 is mounted inside the cavity by a bracket assembly. In some embodiments, the bracket assembly includes a sensor seat 15 and a sensor gland 17, the sensor seat 15 is used for installing and placing an image sensor 16, a through hole is formed in the back of the sensor seat 15 for the second heat-conducting pad 14 to be attached to the back of the image sensor 16, a circuit board 13 is arranged below the sensor seat 15, pins of the sensor seat 15 are welded on the circuit board 13, an electrical interface 19 is formed on the heat dissipation base 501 and used for transmitting signals with the outside, and the periphery of the electrical interface 19 is sealed by a sealing ring or a sealant.

The sensor gland 17 is installed above the sensor seat 15 through a fixing screw 18, a notch is formed in the surface of the sensor gland 17, a bent hanging lug 28 is arranged on the edge of the sensor gland 17, the notch is used for enabling the front face of the image sensor 16 to be opposite to the filter assembly, a positioning hole is formed in the surface of the hanging lug 28, a plurality of second positioning columns 22 are distributed on the inner wall of the shell 1, the second positioning columns 22 are also made of materials with low heat conductivity coefficient and certain structural strength, such as high polymer materials such as PEEK, and the heat insulation effect can be achieved. The second positioning column 22 is matched and positioned with the positioning hole, and fixes the sensor gland 17 through a screw. The second positioning column 22, the positioning hole, the sensor gland 17 and the sensor seat 15 are matched together, so that the image sensor 16 is positioned, the parallelism between the image sensor 16 and the shell 1 is ensured, and the imaging quality of the camera is improved.

Although the present description is described in terms of embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art should be able to integrate the description as a whole, and the embodiments can be appropriately combined to form other embodiments as will be understood by those skilled in the art.

Therefore, the above description is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application; all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. The thermoelectric refrigerating device for the industrial camera comprises a shell assembly, wherein the shell assembly is connected and matched with a heat dissipation plate assembly (5) on the lower side to form a sealed cavity; an image sensor (16) is fixedly arranged in the cavity; the device is characterized in that dry protective gas is filled in the cavity; a TEC (8) is arranged above the heat dissipation plate component (5) and attached to a hot end (801) of the TEC (8), a heat conduction component is tightly attached to a cold end (802) of the TEC (8), the periphery of the heat conduction component is wrapped and limited through a bushing (11), and the bushing (11) is fixedly arranged in the cavity; and a second heat-conducting pad (14) is further arranged above the bushing (11), the lower surface of the second heat-conducting pad (14) is tightly attached to the heat-conducting component, and the upper surface of the second heat-conducting pad is tightly attached to the back surface of the image sensor (16).

2. The thermoelectric refrigerating device of claim 1, wherein the heat conducting assembly comprises a heat conducting block (10) and a first heat conducting pad (9) which are arranged up and down and closely attached, and a plurality of grooves (1001) are arranged on the surface of the heat conducting block (10) attached to the first heat conducting pad (9) and/or the second heat conducting pad (14).

3. An industrial camera thermoelectric cooling device according to claim 1 or 2, characterized in that a heat conducting grease (7) is filled between the TEC (8) and the heat sink plate assembly (5) or a third heat conducting gasket is arranged.

4. An industrial camera thermoelectric cooling device according to claim 1 or 2, characterized in that a drying device (21) for absorbing gas moisture is mounted on the inner wall of the cavity.

5. The thermoelectric cooling device for industrial cameras as claimed in claim 1, wherein a boss (503) for limiting the TEC (8) is formed above the heat dissipating plate component (5).

6. The thermoelectric cooling device for industrial cameras as claimed in claim 1 or 5, wherein the heat sink assembly (5) comprises a heat sink base (501) and a plurality of heat sinks (502) formed on the surface of the heat sink base (501).

7. An industrial camera thermoelectric cooling device according to claim 6, characterized in that the heat sink assembly (5) further comprises a heat sink fan arranged outside the heat sink (502).

8. An industrial camera thermoelectric cooling device according to claim 1, characterized in that the housing assembly comprises a housing (1) and a filter assembly hermetically connected to the upper side of the housing (1) and opposite to the front side of the image sensor (16); the air inflation hole (27) and the air exhaust hole are formed in the shell (1), and the air inflation hole (27) and the air exhaust hole are provided with the sealing cover plate (2) through the sealing cover plate sealing ring (4) and the compression screw in a sealing mode.

9. The thermoelectric refrigerating device of claim 8, wherein the image sensor (16) is installed inside the cavity through a bracket assembly, the bracket assembly comprises a sensor seat (15) for installing and placing the image sensor (16) and a sensor cover (17) installed above the sensor seat (15), the surface of the sensor cover (17) is provided with a notch, the edge of the sensor cover is provided with a bent lug, the inner wall of the housing (1) is distributed with a plurality of second positioning pillars (22), and the surface of the lug (28) is provided with a positioning hole and fixedly connected with the second positioning pillars (22).