CN215729605U

CN215729605U - Server chassis

Info

Publication number: CN215729605U
Application number: CN202122180586.2U
Authority: CN
Inventors: 邹晓光; 李海洋
Original assignee: Shenzhen Huachu Information Technology Development Co ltd
Current assignee: Shenzhen Huachu Information Technology Development Co ltd
Priority date: 2021-09-08
Filing date: 2021-09-08
Publication date: 2022-02-01
Anticipated expiration: 2031-09-08

Abstract

The utility model discloses a server case, which comprises a case body, a back plate and a functional module, wherein the case body is divided into a first accommodating cavity and a second accommodating cavity by the back plate, the functional module comprises a hard disk module, a power supply module, a mainboard module and a heat dissipation module, the back plate is provided with a connector electrically connected with the hard disk module, the power supply module, the mainboard module and the heat dissipation module, the hard disk module is connected with the first accommodating cavity in a drawable manner, and the power supply module, the mainboard module and the heat dissipation module are connected with the second accommodating cavity in a drawable manner; the mainboard module comprises a first fan and a mainboard, and the first fan is used for radiating heat of the mainboard; the heat dissipation module comprises a second fan, and the second fan is used for dissipating heat of the hard disk module, so that heat can be dissipated for the mainboard and the hard disk module respectively, and the heat dissipation effect is good.

Description

Server chassis

Technical Field

The utility model relates to the technical field of servers, in particular to a server case.

Background

With the rapid development of computer technology, the heat dissipation requirement of the server is higher and higher. The blade server can be a computer with high density and high performance, and is a rack-mounted computer with standard height, and a plurality of card-type server units can be inserted in the rack-mounted computer case, can be applied to special industries and high-density computing environments, and therefore, the blade server has high requirements on heat dissipation.

In the existing server case, the same fan module needs to dissipate heat of a plurality of functional modules such as a hard disk module and a mainboard module, and the heat dissipation effect is poor.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a server chassis.

The utility model provides a server chassis, comprising:

the box body is internally provided with an accommodating cavity;

the back plate is arranged in the accommodating cavity and is used for dividing the accommodating cavity into a first accommodating cavity and a second accommodating cavity;

the functional module comprises a hard disk module, a mainboard module, a heat dissipation module and a power supply module, wherein a connector electrically connected with the hard disk module, the mainboard module, the heat dissipation module and the power supply module is arranged on the backboard, the connector is used for enabling the power supply module to supply power to the hard disk module, the mainboard module and the heat dissipation module, and the connector is also used for data transmission between the hard disk module and the mainboard module; the hard disk module is connected to the first accommodating cavity in a drawable manner, and the power supply module, the mainboard module and the heat dissipation module are connected to the second accommodating cavity in a drawable manner;

the main board module comprises a first fan and a main board, and the first fan is used for dissipating heat of the main board; the heat dissipation module comprises a second fan, and the second fan is used for dissipating heat of the hard disk module.

Furthermore, the mainboard module further comprises a first box body, the first box body is provided with a first air inlet and a first air outlet, the first fan and the mainboard are installed on the first box body, one side of the mainboard, facing the backboard, is provided with a first plug connector used for being electrically connected with the connector, and the first fan is used for driving airflow to be input from the first air inlet and blow out from the first air outlet after the mainboard dissipates heat.

Further, the mainboard includes first plate body and with the second plate body that first plate body is the L shape and connects, first plate body with the second plate body encloses to close and forms and dodges the district, first fan is located dodge the district.

Furthermore, the heat dissipation module further comprises a second box body, a second plug connector used for being electrically connected with the connector is further arranged on one side, facing the back plate, of the second box body, the second plug connector is electrically connected with a second fan, the back plate is further provided with a hollow structure, so that the first accommodating cavity is communicated with the second accommodating cavity, the second fan is installed on the second box body, the second box body is provided with a second air inlet and a second air outlet, the second air inlet is communicated with the hollow structure of the back plate, and the second fan is used for driving air flow to input the hard disk module from the second air inlet and blow out the hard disk module from the second air outlet after heat dissipation.

Furthermore, the second fan is provided with an airflow input end and an airflow output end, the airflow input end is communicated with the second air inlet, and the airflow output end is communicated with the second air outlet; the heat dissipation module further comprises a flow guide structure, the flow guide structure comprises a first side plate and a second side plate, one end of the first side plate and one end of the second side plate are respectively connected to two sides of the second air outlet, the other end of the first side plate and the other end of the second side plate are respectively connected to two sides of the airflow output end, an airflow channel is formed by the first side plate and the second side plate in a surrounding mode, and in the air outlet direction, the distance between the first side plate and the second side plate is gradually increased.

Further, the first side plate is an inner wall of one side of the second box body.

Further, the power module comprises a third fan and a power supply, and the third fan is used for dissipating heat of the power supply.

Furthermore, the power module further comprises a third box body, the third fan and the power supply are mounted on the third box body, a third plug connector used for being electrically connected with the connector is arranged on one side, facing the back plate, of the power supply, the third fan is provided with a third air inlet and a third air outlet, and the third fan is used for driving air flow to be input from the third air inlet and blow out from the third air outlet after the power supply dissipates heat.

Furthermore, the box body comprises a top plate, a bottom plate, a left side plate and a right side plate, and the top plate, the bottom plate, the left side plate and the right side plate surround the periphery of the back plate; the top plate comprises a first cover plate and a second cover plate, the first cover plate covers the first accommodating cavity, the second cover plate covers the second accommodating cavity, a first buckle structure is arranged on one side, facing the second cover plate, of the first cover plate, a second buckle structure is arranged on one side, facing the first cover plate, of the second cover plate, and the first buckle structure is connected with the second buckle structure in a buckled mode.

Furthermore, the heat dissipation module, the mainboard module and the power module are all provided with first elastic buckle structures, the top plate, the bottom plate, the left side plate or the right side plate are provided with second elastic buckle structures at positions corresponding to the first elastic buckle structures, and the first elastic buckle structures are connected with the second elastic buckle structures in an elastic buckle mode, so that the heat dissipation module, the mainboard module and the power module are respectively locked in the second accommodating cavity.

According to the technical scheme, the server case provided by the utility model can respectively dissipate heat of the mainboard and the hard disk module through the arrangement of the first fan and the second fan, and the heat dissipation effect is good.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a server chassis according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of the baffle assembly installed in the second receiving cavity according to the embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a barrier assembly according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a barrier frame according to an embodiment of the present invention.

Fig. 5 is an exploded view of a top plate according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of the back plate installed in the box according to the embodiment of the present invention.

Fig. 7 is a partially enlarged schematic view at a in fig. 6.

Fig. 8 is a schematic structural diagram of a first viewing angle of the back plate between the first position-limiting frame and the second position-limiting frame according to the embodiment of the present invention.

Fig. 9 is a partially enlarged schematic view at B in fig. 8.

Fig. 10 is a schematic structural diagram of a second viewing angle of the back plate between the first limiting frame and the second limiting frame according to the embodiment of the utility model.

Fig. 11 is a schematic structural view of the partition assembly installed in the first receiving cavity according to the embodiment of the present invention.

Fig. 12 is a schematic structural diagram of a mounting plate according to an embodiment of the present invention.

Fig. 13 is a schematic structural diagram of a hard disk module according to an embodiment of the present invention.

Fig. 14 is a schematic structural diagram of a first view angle of a motherboard module according to an embodiment of the utility model.

Fig. 15 is a schematic structural diagram of a second view angle of the motherboard module according to the embodiment of the utility model.

Fig. 16 is a schematic structural diagram of a heat dissipation module according to an embodiment of the present invention.

Fig. 17 is a schematic view of an internal structure of a heat dissipation module according to an embodiment of the present invention.

Fig. 18 is a schematic structural diagram of a first view angle of a power module according to an embodiment of the present invention.

Fig. 19 is a schematic structural diagram of a second view angle of a power module according to an embodiment of the utility model.

In the figure, a server chassis 100; a case 10; a back plate 11; a first connector 111; a second connector 112; a third connector 113; a fourth connector 114; a top plate 12; a first cover plate 121; a second cover plate 122; a slot 123; a protrusion 124; a bottom plate 13; a left side panel 14; a right side plate 15; a card slot 16; a first housing chamber 101; an accommodation section 1011; a housing groove 1012; a second housing cavity 102; a first plugging chamber 1011; a second plugging chamber 1012; a third plugging chamber 1013; a first opening 103; a second opening 104; a hard disk module 20; a hard disk 21; a bracket 22; positioning holes 221; a motherboard module 30; a first fan 31; a main board 32; the first plate body 32 a; the second plate body 32 b; a first plug 321; an avoidance zone 322; a first box 33; the first air inlet 331; the first air outlet 332; a heat dissipation module 40; a second fan 41; a gas flow input 411; an airflow output 412; the second container 42; a bottom case 42 a; an upper shell 42 b; the second air inlet 421; a second air outlet 422; a second plug 43; a first side plate 44; a second side plate 45; an air flow passage 46; a routing channel 47; a circuit board 48; an indicator lamp 49; a power supply module 50; a third fan 51; a third connector 52; the third container 53; a third air inlet 531; a third air outlet 532; a spacing assembly 60; a first stopper 61; a first window 611; a second stopper 62; a second window 621; a first fixed structure 63; a second fixed structure 64; a partition member 70; a horizontal partition plate 71; a vertical partition plate 72; a mounting plate 721; a limiting boss 722; a first guiding structure 723; a slide rail 7231; a guide slot 724; a positioning assembly 80; a positioning plate 81; a ramp 82; a positioning post 83; a barrier assembly 90; a first mounting bracket 91; a second mounting bracket 92; a first vertical partition 921; a second vertical partition 922; a limiting structure 923; a first diaphragm 93; the reinforcing protrusions 931; a barrier frame 94; a guide structure 941; a guide rail 942; a second bulkhead 95; a third vertical partition 96; an elastic sheet 200; a latch bolt 201.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It is also to be understood that the terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

As shown in fig. 1 to fig. 19, an embodiment of the present invention provides a server chassis 100, including a box body 10, a back plate 11 and functional modules, wherein a containing cavity is arranged in the box body 10; the back plate 11 is arranged in the accommodating cavity, and the back plate 11 is used for dividing the accommodating cavity into a first accommodating cavity 101 and a second accommodating cavity 102; the functional module comprises a hard disk module 20, a mainboard module 30, a heat dissipation module 40 and a power supply module 50, the backboard 11 is provided with a connector which is electrically connected with the hard disk module 20, the mainboard module 30, the heat dissipation module 40 and the power supply module 50, the connector is used for enabling the power supply module 50 to supply power to the hard disk module 20, the mainboard module 30 and the heat dissipation module 40, and the connector is also used for data transmission between the hard disk module 20 and the mainboard module 30; the hard disk module 20 is connected to the first receiving cavity 101 in a drawable manner, and the power module 50, the motherboard module 30 and the heat dissipation module 40 are connected to the second receiving cavity 102 in a drawable manner.

The main board module 30 includes a first fan 31 and a main board 32, as shown in fig. 15, the first fan 31 is used for dissipating heat from the main board 32; the heat dissipation module 40 includes a second fan 41, as shown in fig. 17, the second fan 41 is used for dissipating heat of the hard disk module 20.

Exemplarily, the first fan 31 and the second fan 41 both use centrifugal fans, both ends of the box 10 in the length direction are respectively provided with a first opening 103 and a second opening 104 which are communicated with the accommodating chamber, the first accommodating chamber 101 is communicated with the first opening 103, the second accommodating chamber 102 is communicated with the second opening 104, the second fan 41 drives an airflow to be input from the first opening 103, the airflow enters the first accommodating chamber 101 to take away heat of the hard disk module 20, then enters the second accommodating chamber 102, and the airflow with heat is output from the second opening 104 by driving of the second fan 41; the first fan 31 drives the airflow to enter the motherboard module 30, and then takes away the heat of the motherboard 32 and outputs the heat from the second opening 104.

In the utility model, the first fan 31 and the second fan 41 are arranged, so that the heat dissipation can be respectively carried out on the mainboard 32 and the hard disk module 20, and the heat dissipation effect is good; the hard disk module 20 is configured with a plurality of plugs and plugs towards the first opening 103, the power module 50, the motherboard module 30 and the heat dissipation module 40 are all plugged and plugged towards the second opening 104, and the hard disk module 20, the power module 50, the motherboard module 30 and the heat dissipation module 40 are designed to be capable of being pulled and pulled, so that the hard disk module, the power module 50, the motherboard module 30 and the heat dissipation module 40 are convenient to install, maintain and replace.

Alternatively, as shown in fig. 1-2, the box body 10 includes a top plate 12, a bottom plate 13, a left side plate 14 and a right side plate 15, the left side plate 14 and the right side plate 15 are respectively vertically connected to two sides of the bottom plate 13 and integrally formed to form a U-shaped structure, and the top plate 12, the bottom plate 13, the left side plate 14 and the right side plate 15 surround the back plate 11; the top plate 12 covers the U-shaped structure and is riveted with the U-shaped structure, so that the assembly and disassembly are convenient.

Optionally, as shown in fig. 5, the top plate 12 includes a first cover plate 121 covering the first receiving cavity 101 and a second cover plate 122 covering the second receiving cavity 102, a first fastening structure is disposed on one side of the first cover plate 121 facing the second cover plate 122, a second fastening structure is disposed on one side of the second cover plate 122 facing the first cover plate 121, and the first fastening structure and the second fastening structure are fastened and connected. Illustratively, the first locking structure is a slot 123 disposed on a side of the first cover plate 121 facing the second cover plate 122, and the second locking structure is a protrusion 124 disposed on a side of the second cover plate 122 facing the first cover plate 121, it is understood that the slot 123 may also be disposed on a side of the second cover plate 122 facing the first cover plate 121, and the protrusion 124 may also be disposed on a side of the first cover plate 121 facing the second cover plate 122; the top plate 12 is disassembled into a first cover plate 121 and a second cover plate 122, the first accommodating cavity 101 and the second accommodating cavity 102 are respectively covered, and the detachable connection is realized through the matching of the slot 123 and the protrusion 124, so that the first accommodating cavity 101 and the second accommodating cavity 102 are respectively conveniently opened, and the disassembly and assembly of any functional module in the box body 10 are facilitated.

Optionally, as shown in fig. 6 to 10, the server chassis 100 further includes a limiting component 60, the limiting component 60 includes a first limiting frame 61 and a second limiting frame 62, the first limiting frame 61 is located in the first accommodating cavity 101, the second limiting frame 62 is located in the second accommodating cavity 102, the first limiting frame 61 and the second limiting frame 62 are respectively disposed opposite to the two side surfaces of the backplane 11 where the connector is disposed, and are used for limiting the movement of the backplane 11, and the first limiting frame 61 and the second limiting frame 62 are respectively provided with a first window 611 and a second window 621 that are adapted to the connector, so that the connector leaks outside. The movement of the back board 11 can be limited by the arrangement of the limiting component 60, so that the back board 11 is prevented from being deformed forwards or backwards due to the plugging and unplugging of each functional module, and the butting stability of the connectors is improved.

Optionally, the first and second position-limiting

frames

61 and 62 are respectively provided with a first fixing structure 63 and a second fixing structure 64, the first fixing structures 63 of the first and second position-limiting

frames

61 and 62 are fixedly connected with the box body 10, and the second fixing structures 64 of the first and second position-

limiting frames

61 and 62 are fixedly connected with the back plate 11, so as to clamp the back plate 11 between the first and second position-limiting

frames

61 and 62 to limit the movement of the back plate 11, exemplarily, as shown in fig. 9, the first fixing structure 63 includes riveting structures arranged around the first and second position-

limiting frames

61 and 62, the riveting structures arranged around the first and second position-

limiting frames

61 and 62 are respectively fixedly connected with the top plate 12, the bottom plate 13, the left side plate 14 and the right side plate 15, the second fixing structure 64 includes a plurality of screw fixing structures, and screws pass through fixing holes on the first position-limiting frame 61, the back plate 11 and the second position-limiting frame 62, thereby connect backplate 11 with first spacing 61, second spacing 62 fixedly, prevent that backplate 11 from producing forward or backward deformation because each functional module's plug to promote the stability of connector butt joint.

Optionally, the plurality of connectors include a first connector 111, a second connector 112, a third connector 113, and a fourth connector 114, the first connector 111 is used to electrically connect with the hard disk module 20, the second connector 112 is used to electrically connect with the heat dissipation module 40, the third connector 113 is used to electrically connect with the motherboard module 30, and the fourth connector 114 is used to electrically connect with the power module 50, wherein a side of the backplane 11 facing the first receiving cavity 101 is a first side, a side of the backplane 11 facing the second receiving cavity 102 is a second side, the first connector 111 is disposed on the first side, and the second connector 112, the third connector 113, and the fourth connector 114 are disposed on the second side.

Exemplarily, the back panel 11 is formed by combining multiple layers of PCB boards, and includes at least 12 layers, and the arrangement of the multiple layers facilitates the wiring of multiple connectors, so as to avoid the mutual interference of the wiring of the connectors.

Optionally, the first connectors 111, the second connectors 112, the third connectors 113, and the fourth connectors 114 are disposed in a staggered manner to prevent mutual interference, the first connectors 111 are disposed in more than four rows, the more than four first connectors 111 are arranged on the first side surface in a matrix manner, in fig. 8, the first connectors 111 are twenty-four in an example, and the twenty-four first connectors 111 are arranged on the first side surface in six rows and four columns; each first connector 111 can accommodate one hard disk module 20, and each hard disk module 20 can be loaded with two hard disks 21, so that forty-eight hard disks 21 can be accommodated.

Optionally, the second connectors 112 are configured to be more than four, the more than four second connectors 112 are arranged on the second side surface in a matrix manner, the third connector 113 is disposed between two adjacent second connectors 112 along a first direction, the first direction is the arrangement direction of the left side plate 14 and the right side plate 15, and the fourth connector 114 is disposed at the edge of the second side surface in the first direction; in fig. 10, twelve second connectors 112 are illustrated, and the twelve second connectors 112 are arranged in two rows and six rows on the first side surface, so as to facilitate heat dissipation of the plurality of hard disk modules 20, and the fourth connector 114 is disposed at the edge, so as to facilitate heat dissipation of the hard disk modules 20 by the heat dissipation module 40.

Optionally, the number of the third connectors 113 is two, two third connectors 113 are arranged on the second side surface at intervals along the first direction, and the two third connectors 113 are vertically arranged between two adjacent second connectors 112, so that the arrangement is reasonable, and the main board module 30 can be conveniently plugged.

Optionally, the fourth connectors 114 are configured in two groups, each group of the fourth connectors 114 includes more than one fourth connector 114 arranged along a second direction, the second direction is the arrangement direction of the top plate 12 and the bottom plate 13, and the two groups of the fourth connectors 114 are respectively disposed at two side edges of the second side surface in the first direction. In fig. 10, each set of the fourth connectors 114 includes two fourth connectors 114 arranged along the second direction, wherein the two fourth connectors 114 are used for connecting a standby power module, and are not plugged with a power supply in normal use, and can be plugged with a standby power supply when necessary; the two third connectors 113 are symmetrically arranged on one side of the two groups of second connectors 112 close to the fourth connector 114, so that the space is reasonably utilized, and the heat dissipation module 40 is not influenced to dissipate heat of the hard disk module 20 in a centralized manner.

Optionally, the server casing 100 further includes a partition component 70 and a positioning component 80, as shown in fig. 11, the partition component 70 is disposed in the first receiving cavity 101 at intervals for partitioning the first receiving cavity 101 into a plurality of receiving sections 1011, each receiving section 1011 includes at least one receiving slot 1012, each receiving slot 1012 receives one hard disk module 20, the number of the receiving slots 1012 corresponds to the number of the hard disk modules 20, in fig. 11, twenty-four receiving slots 1012 are exemplified, the positioning component 80 includes a positioning plate 81, as shown in fig. 7, the positioning plate 81 is connected to the first side surface of the back plate 11 and is located below the first connector 111, one side of the positioning plate 81 facing the hard disk module 20 is provided with a slope 82 for guiding the hard disk module 20 inserted into the receiving slot 1012 to move to be close to the first connector 111, so that the hard disk module 20 moves along the slope 82 to abut against the surface of the positioning plate 81 to align with the first connector 111, thereby facilitating accurate mating of the hard disk module 20 to the first connector 111.

Illustratively, as shown in fig. 11-12, the separating structure includes a horizontal separating plate 71 and a vertical separating plate 72, the vertical separating plate 72 includes two mounting plates 721, each of the two mounting plates 721 opposite to each other is provided with a limiting boss 722 and a first guiding structure 723, so that each of the two sides of the vertical separating plate 72 facing the left side plate 14 and the right side plate 15 is provided with a limiting boss 722 and a first guiding structure 723, in this embodiment, the number of the vertical separating plates 72 is six, the number of the horizontal separating plates 71 is one, the horizontal separating plate 71 is provided at a middle position between the top plate 12 and the bottom plate 13 along the second direction, so as to separate the second receiving cavity 102 into an upper area and a lower area, wherein three vertical separating plates 72 are uniformly provided between the left side plate 14 and the right side plate 15 at intervals along the first direction in the upper area, four receiving areas 1011 are defined in the upper area, and three vertical separating plates 72 are uniformly provided between the left side plate 14 and the right side plate 15 at intervals along the first direction in the lower area, four accommodating sections 1011 are formed in the lower region in a surrounding manner, so that eight accommodating sections 1011 arranged in a matrix manner are formed by arranging the horizontal partition plates 71 and the vertical partition plates 72, each accommodating section 1011 comprises three accommodating grooves 1012 to form twenty-four accommodating grooves 1012, and each accommodating groove 1012 corresponds to the limiting boss 722 and the first guide structure 723.

The limiting boss 722 is used for limiting the movement of the hard disk module 20 in a first direction, the first guide structure 723 extends along the plugging direction of the hard disk module 20, the second guide structures are arranged on two sides of the hard disk module 20, and the first guide structure 723 is matched with the second guide structures to guide the movement of the hard disk module 20 in the accommodating groove 1012; when the hard disk module 20 is inserted into the receiving groove 1012, the two sides of the hard disk module are tightly attached to the limiting bosses 722 to limit the right and left movement of the hard disk module 20, meanwhile, the second guide structures on the two sides of the hard disk module 20 are matched with the first guide structures 723 to guide the hard disk module 20 to move in the receiving groove 1012 and limit the up and down movement of the hard disk module 20, thereby preventing the hard disk module 20 from generating distortion due to overlong reciprocating distance and large dead weight, facilitating the accurate butt joint of the first connector 111 and the hard disk module 20, and avoiding uneven stress of the connectors and causing damage.

Specifically, the first guiding structure 723 includes at least two sliding rails 7231 spaced apart in the second direction, two adjacent sliding rails 7231 enclose a guide groove 724, and the hard disk module 20 is slidably clamped in the guide groove 724 and can slide along the guide groove 724 in the length direction of the receiving groove 1012.

Optionally, as shown in fig. 7 and 13, the positioning assembly 80 further includes a positioning post 83, the hard disk module 20 includes at least one hard disk 21 and a bracket 22 for carrying the hard disk 21, the second guiding structure may be a side plate on both sides of the bracket 22, the bracket 22 is connected to the receiving groove 1012 in a drawable manner, a positioning hole 221 adapted to the positioning post 83 is disposed on one side of the bracket 22 facing the back plate 11, and when the bracket 22 is inserted into the receiving groove 1012, the positioning post 83 is inserted into the positioning hole 221 to align the first connector 111 with the hard disk module 20, so as to facilitate accurate docking of the hard disk module 20 with the first connector 111.

Illustratively, the end of the positioning post 83 is truncated cone-shaped, the end with smaller diameter is opposite to the positioning hole 221, the part with larger diameter is matched with the positioning hole 221, the gap between the directly smaller end and the positioning hole 221 is set to be 0.2mm, so that the positioning post 83 is conveniently inserted into the positioning hole 221, when the hard disk module 20 is inserted into the accommodating groove 1012, the positioning holes 221 on both sides are easily guided to the end of the positioning post 83 opposite to the positioning hole due to the small gap between the hard disk module 20 and the inner wall of the accommodating groove 1012, and after the positioning post 83 is inserted into the positioning hole 221, the positioning post 83 is guided, so that the first connector 111 is ensured to be accurately butted with the hard disk module 20.

Optionally, the second accommodating cavity 102 is a plugging cavity, the server chassis 100 further includes a blocking component 90 disposed in the plugging cavity, as shown in fig. 2, the blocking component 90 is configured to divide the plugging cavity into at least one first plugging cavity 1011, at least one second plugging cavity 1012 and at least one third plugging cavity 1013, the first plugging cavity 1011 is configured to accommodate the heat dissipation module 40 so that the heat dissipation module 40 is removably mounted in the first plugging cavity 1011, the second plugging cavity 1012 is configured to accommodate the motherboard module 30 so that the motherboard module 30 is removably mounted in the second plugging cavity 1012, the third plugging cavity 1013 is configured to accommodate the power module 50 so that the power module 50 is removably mounted in the third plugging cavity 1013, and front and rear ends of the first plugging cavity 1011, the second plugging cavity 1012 and the third plugging cavity 1013 are provided with openings, which facilitates airflow circulation.

The first plugging cavities 1011 are configured to be more than one group, each group of first plugging cavities 1011 includes at least two first plugging cavities 1011 arranged in a stacked manner, the height of the second plugging cavity 1012 is matched with the height of each group of first plugging cavities 1011 after being stacked, the second plugging cavity 1012, the third plugging cavity 1013 and each group of first plugging cavities 1011 are arranged between the left side plate 14 and the right side plate 15 along a first direction in a staggered manner, and the first direction is the arrangement direction of the left side plate 14 and the right side plate 15. The plugging cavity is divided into a first plugging cavity 1011, a second plugging cavity 1012 and a third plugging cavity 1013 which are arranged along a first direction in a staggered manner by the arrangement of the blocking component 90, so that the heat dissipation module 40, the main board module 30 and the power module 50 can be installed in the box body 10 in a pull-type manner, and the modularized design is convenient for installation, maintenance and replacement of each component in the server; wherein, the design of arranging through first plug chamber 1011, second plug chamber 1012 and third plug chamber 1013 can the rational utilization space, because mainboard module 30's volume is great, arrange along first direction and can reduce shared horizontal area, each first plug chamber 1011 of group that parallels with second plug chamber 1012 can range upon range of a plurality ofly in order to install a plurality of heat dissipation module 40 to can install a plurality of functional module, in order to satisfy the user demand.

Optionally, in order to make the overall structure more harmonious, a plurality of heat dissipation devices may be installed at the same time, each group of the first plug cavities 1011 includes two first plug cavities 1011, and the height of the two first plug cavities 1011 after being stacked is adapted to the height of the second plug cavity 1012.

Optionally, each set of the first plugging chamber 1011 is located in a middle region of the plugging chamber in the first direction, the third plugging chamber 1013 is located in an edge region of the plugging chamber in the first direction, and the second plugging chamber 1012 is located between the first plugging chamber 1011 and the second plugging chamber 1012. Thereby conveniently arrange a plurality of first plug chambeies 1011, make heat abstractor install and concentrate in first plug chamber 1011 and dispel the heat to hard disk module 20, thereby can satisfy the heat dissipation of a plurality of hard disk module 20, third plug chamber 1013 of accommodating power module 50 sets up and can avoid influencing the heat dissipation of heat dissipation module 40 to hard disk module 20 in marginal area, because mainboard module 30 is vertical along the first direction arranges, the width is less, reduce shared horizontal area, also can avoid influencing the heat dissipation of heat dissipation module 40 to hard disk module 20, the rational utilization space.

Optionally, as shown in fig. 2 to 4, the two second plugging cavities 1012 are configured in two, the baffle assembly 90 includes a first mounting frame 91 and a second mounting frame 92 disposed between the left side plate 14 and the right side plate 15 along the first direction, each of the first mounting frame 91 and the second mounting frame 92 includes a first vertical partition 921 and a second vertical partition 922, and the first vertical partition 921 and the second vertical partition 922 are disposed opposite to each other to enclose the second plugging cavity 1012 adapted to the main board module 30, so as to facilitate plugging and unplugging of the main board module 30. Exemplarily, gaps are arranged between the first vertical partition plate 921 and the second vertical partition plate 922 of the first mounting frame 91 and the second mounting frame 92 and the back plate 11, a limiting structure 923 with a cross section in a shape like Chinese character 'ao' is arranged at the bottom of the first vertical partition plate 921 or the second vertical partition plate 922, the limiting structure 923 with a shape like Chinese character 'ao' extends towards the edge of the second plug cavity 1012 along the plug direction of the mainboard module 30, so as to guide the mainboard module 30 to move in the second plug cavity 1012, the limiting structure 923 with a shape like Chinese character 'ao' can not only play a role in guiding, but also can enable gaps to be arranged between the mainboard module 30 and the second vertical partition plate 922, hollow structures are further arranged on the first vertical partition plate 921 or the second vertical partition plate 922, and through the arrangement, 1012 air flow is convenient for cooling the mainboard 32 in the second plug cavity.

Wherein, the upper portion and the lower part of first perpendicular baffle 921 and second perpendicular baffle 922 are equipped with the additional strengthening of bending of hugging closely roof 12 and bottom plate 13 respectively for realize that first perpendicular baffle 921, second are erect baffle 922 and roof 12 and bottom plate 13's riveting is fixed, make things convenient for the dismouting, foretell font limit structure 923 can be for the additional strengthening of bending of first perpendicular baffle 921 or the bottom of second perpendicular baffle 922, the convenient equipment.

Optionally, as shown in fig. 3, the blocking assembly 90 further includes a first transverse partition plate 93 and two or more blocking frames 94, the two or more blocking frames 94 are disposed between the first mounting frame 91 and the second mounting frame 92 at intervals along a first direction, the first transverse partition plate 93 is disposed between the top plate 12 and the bottom plate 13 along a second direction, the second direction is the arrangement direction of the top plate 12 and the bottom plate 13, the first transverse partition plate 93 is disposed in the middle of the two or more blocking frames 94 in a penetrating manner, and two side edges of the first transverse partition plate 93 are respectively mounted in the middle of the first mounting frame 91 and the middle of the second mounting frame 92, so as to divide the region between the blocking frame 94 and the first mounting frame 91 and the second mounting frame 92 and the region between the two adjacent blocking frames 94 into a plurality of groups of first plugging and unplugging cavities 1011. Because mainboard module 30 highly is higher than thermal module 40, the height of a mainboard module 30 and two thermal module 40's high looks adaptations, can conveniently arrange a plurality of first plug chambeies 1011 through the setting of baffle frame 94 and first cross slab 93, thereby install a plurality of thermal module 40, in order to satisfy the heat dissipation of a plurality of hard disk modules 20, the example is three baffle frame 94 in the figure, thereby separate into eight first plug chambeies 1011 with the region between first mounting bracket 91 and the second mounting bracket 92.

Optionally, as shown in fig. 3 to fig. 4, the blocking assembly 90 further includes a guiding structure 941, the guiding structure 941 is installed in the middle of the blocking frame 94 and located at the interval between two adjacent first plugging cavities 1011, the guiding structure 941 is provided with a guide rail 942 at the edge of two sides of the second plugging cavity 1012, the guide rail 942 extends along the plugging direction of the heat dissipation module 40 to guide the heat dissipation module 40 to move in the first plugging cavity 1011, the plugging of the heat dissipation module 40 can be smoother through the arrangement of the guide rail 942, and meanwhile, the heat dissipation module 40 can be guided to move, so that the heat dissipation module 40 aligns to the fourth connector 114 on the back plate 11, and accurate docking is achieved.

Optionally, as shown in fig. 4, the blocking frame 94 is a hollow frame structure, so that the adjacent first plugging cavities 1011 are communicated with each other, thereby reducing the weight of the box 10, the cross section of the guide structure 941 is a concave structure, which not only can play a role in guiding, but also can enable the adjacent first plugging cavities 1011 to have a gap, thereby facilitating the circulation of air flow.

Optionally, as shown in fig. 2, in order to make the overall structure more consistent, the third plugging chambers 1013 are configured in two groups, each group of the third plugging chambers 1013 includes at least two third plugging chambers 1013 arranged in a stacked manner, and the height of the first plugging chamber 1011 is adapted to the height of the group of the second plugging chambers 1012. Each set of the third plugging chambers 1013 includes two third plugging chambers 1013 arranged in a stacked manner, since the height of the motherboard module 30 is higher than that of the power module 50, the height of one motherboard module 30 is adapted to the height of the power modules 50 at two ends, the portion having a height difference can be adjusted by a bending reinforcing structure, so that the third plugging chambers 1013 are adapted to the power module 50, a door plate can be disposed at an opening of the third plugging chambers 1013, one or two of the third plugging chambers 1013 can be vacant in the plurality of third plugging chambers 1013 to serve as a standby power bin, the power module 50 is not assembled, the standby power module 50 is sealed by the door plate, and when the original power module 50 is damaged, the standby power module 50 is assembled to supply power to the hard disk module 20, the motherboard module 30, and the fan module.

Optionally, in some embodiments, the baffle assembly 90 further includes two second transverse partition plates 95 and two or more third vertical partition plates 96, the two or more third vertical partition plates 96 are disposed between the left side plate 14 and the first mounting frame 91 and between the right side plate 15 and the second mounting frame 92 along the first direction, the second transverse partition plates 95 are disposed between the top plate 12 and the bottom plate 13 along the second direction, the two second transverse partition plates 95 are respectively disposed in the middle of the two or more third vertical partition plates 96, two side edges of one second transverse partition plate 95 are respectively mounted in the middle of the left side plate 14 and the first mounting frame 91, two side edges of the other second transverse partition plate 95 are respectively mounted in the middle of the right side plate 15 and the second mounting frame 92, so as to divide the region between the left side plate 14 and the first mounting frame 91 and the region between the right side plate 15 and the second mounting frame 92 into two sets of third plugging chambers 1013, the area between the third vertical partition plate 96 and the first mounting rack 91 and the second mounting rack 92 is divided into a plurality of groups of first plugging cavities 1011; with the above arrangement, the plurality of first plugging chambers 1011 can be arranged at the same time as the third plugging chamber 1013 is arranged.

As shown in fig. 2-3, two third vertical partition boards 96 are provided, one of the two third vertical partition boards 96 is disposed between the left side board 14 and the first mounting rack 91, an area between the left side board 14 and the third vertical partition board 96 is divided into a set of third plugging cavities 1013, and an area between the third vertical partition board 96 and the first mounting rack 91 is divided into a set of first plugging cavities 1011; the other of the two third vertical partition boards 96 is disposed between the right side plate 15 and the second mounting frame 92, the area between the right side plate 15 and the third vertical partition board 96 is divided into a set of third plugging cavities 1013, and the area between the third vertical partition board 96 and the second mounting frame 92 is divided into a set of first plugging cavities 1011.

Optionally, in other embodiments (not shown), the blocking assembly further includes two second transverse partition plates, the second transverse partition plates are disposed between the top plate and the bottom plate along the second direction, two side edges of one of the second transverse partition plates are respectively mounted in the middle of the left side plate and the first mounting frame, two side edges of the other second transverse partition plate are respectively mounted in the middle of the right side plate and the second mounting frame, so as to separate the region between the left side plate and the first mounting frame and the region between the right side plate and the second mounting frame into two sets of third plugging and unplugging cavities, in this embodiment, only the third plugging and unplugging cavities are disposed between the left side plate and the first mounting frame and between the right side plate and the second mounting frame, so as to reduce the volume of the chassis.

Alternatively, as shown in fig. 3, the first diaphragm plate 93 and the second diaphragm plate 95 are provided with a reinforcing protrusion 931 at a side facing the bottom plate 13 or the top plate 12, and the reinforcing protrusion 931 is formed by stamping for example, so as to enhance the structural strength of the first diaphragm plate 93 and the second diaphragm plate 95, it is understood that the reinforcing protrusion 931 may not be provided on the first diaphragm plate 93 and the second diaphragm plate 95, or the reinforcing protrusion 931 may be provided on one of the first diaphragm plate 93 and the second diaphragm plate 95, in order to reduce the cost.

Optionally, a first elastic fastening structure is disposed on one side of the heat dissipation module 40, the motherboard module 30, and the power module 50 facing the top plate 12 or the bottom plate 13, a second elastic fastening structure is disposed on the top plate 12, the bottom plate 13, the first transverse partition plate 93, or the second transverse partition plate 95 corresponding to the first elastic fastening structure, and the first elastic fastening structure and the second elastic fastening structure are elastically fastened and connected, so that the heat dissipation module 40, the motherboard module 30, and the power module 50 are respectively locked in the first plugging cavity 1011, the second plugging cavity 1012, and the third plugging cavity 1013. The first elastic buckle structure and the second elastic buckle structure can facilitate the positioning and locking of the heat dissipation module 40, the main board module 30 and the power module 50.

For example, as shown in fig. 14 to 19, the first elastic fastening structure is an elastic piece 200 installed on the heat dissipation module 40, the motherboard module 30, and the power module 50, and the elastic piece 200 extends to form a protruding locking tongue 201, as shown in fig. 3, the second elastic fastening structure is a locking groove 16 located at a corresponding position on the top, the bottom plate 13, the first diaphragm plate 93, or the second diaphragm plate 95, and when the heat dissipation module 40, the motherboard module 30, and the power module 50 are inserted into the corresponding position, the locking tongue 201 is locked in the locking groove 16 to lock the heat dissipation module 40, the motherboard module 30, and the power module 50, and since the elastic piece 200 has elasticity, when the heat dissipation module 40, the motherboard module 30, and the power module 50 need to be pulled out, the heat dissipation module 40, the motherboard module 30, and the power module 50 need to be pulled out with force.

Optionally, as shown in fig. 14 to 15, the main board module 30 further includes a first box 33, the first box 33 is provided with a first air inlet 331 and a first air outlet 332, the first air outlet 332 faces the second opening 104 to facilitate air flow output, the first air inlet 331 is disposed on a side surface of the first box 33 in a first direction, the first direction is an arrangement direction of the left side plate 14 and the right side plate 15, the first box 33 is provided with a non-blocking design that the side surface in the first direction can be opened, the first air inlet 331 is an air flow input end of the first blower 31, the first blower 31 and the main board 32 are mounted on another side surface of the first box 33 in the first direction, the side surface is provided with a plurality of hollow structures to facilitate air flow circulation, the first air outlet 332 is disposed opposite to an air flow output end of the first blower 31, the first air outlet 332 includes a plurality of hexagonal hollow structures to form a honeycomb structure, the ventilation quantity is increased, the air flow is convenient to circulate, and the heat dissipation effect on the main board 32 is good; a first plug 321 for electrically connecting with a connector is disposed on one side of the main board 32 facing the back panel 11, and the first fan 31 is configured to drive airflow to be input from the first air inlet 331 and to dissipate heat of the main board 32, and then to be blown out from the first air outlet 332. Can integrate first fan 31 and mainboard 32 in first box body 33 through above-mentioned setting and form the modularized design, can make things convenient for mainboard 32's heat dissipation when making things convenient for mainboard module 30's dismouting.

Optionally, as shown in fig. 15, the main board 32 includes a first board 32a and a second board 32b integrally connected to the first board 32a in an L-shape, the first board 32a and the second board 32b enclose to form an avoidance area 322, and the first fan 31 is located in the avoidance area 322. The arrangement structure of the main board 32 with the L-shaped structure and the first fan 31 in the avoiding area 322 is compact, and the space is reasonably utilized.

Optionally, as shown in fig. 16-17, the heat dissipation module 40 further includes a second box 42, a second plug 43 for electrically connecting with a connector is further disposed on a side of the second box 42 facing the back plate 11, the second plug 43 is electrically connected with a second blower 41, the back plate 11 is further provided with a hollow structure to communicate the first receiving cavity 101 with the second receiving cavity 102, the second blower 41 is mounted on the second box 42, the second box 42 is provided with a second air inlet 421 and a second air outlet 422, the second air outlet 422 faces the second opening 104 to facilitate air flow output, the second air inlet 421 is communicated with the hollow structure of the back plate 11, the second blower 41 is integrated in the second box 42, which not only facilitates the pull-type mounting on the second receiving cavity 102, the modular design can facilitate the mounting of the heat dissipation module 40, maintenance and replacement, and the heat dissipation is conveniently carried out to hard disk module 20 moreover, promotes the radiating effect.

Alternatively, as shown in fig. 17, the second fan 41 is provided with an airflow input end 411 and an airflow output end 412, the airflow input end 411 is communicated with the second air inlet 421, and the airflow output end 412 is communicated with the second air outlet 422; the heat dissipation module 40 further includes a flow guiding structure, the flow guiding structure includes a first side plate 44 and a second side plate 45, one end of the first side plate 44 and one end of the second side plate 45 are respectively connected to two sides of the second air outlet 422, the other end of the first side plate 44 and the other end of the second side plate 45 are respectively connected to two sides of the airflow output end 412, an airflow channel 46 for outputting airflow is formed by enclosing the first side plate 44 and the second side plate 45, and in the air outlet direction, the distance between the first side plate 44 and the second side plate 45 is gradually increased. The second fan 41 is configured to drive airflow to dissipate heat of the hard disk module 20, and then the airflow is input from the second air inlet 421 into the second box 42 and blown out from the second air outlet 422 through the flow guiding structure; through the setting of water conservancy diversion structure, can guide the air current to concentrate from second air outlet 422 output, prevent that the air current from flowing back air current input 411 to through in the air-out direction, make the interval between first curb plate 44 and the second curb plate 45 crescent setting gradually, can promote the air volume, thereby make this radiating module 40's radiating effect better.

Optionally, the first side plate 44 is an inner wall of one side of the second box 42, and the inner wall of one side of the second box 42 is used as the first side plate 44, so that the structure in the second box 42 can be simplified, and only the inclined second side plate 45 needs to be arranged, and it can be understood that a plate body can be added to be tightly attached to the inner wall of the second box 42 to form the first side plate 44, and then the first side plate 44 and the second side plate 45 enclose to form the airflow channel 46, and the design of the second side plate 45 enables the airflow with heat, which is driven by the second fan 41 and input into the second box 42, to be concentrated and output from the airflow channel 46 to the second air outlet 422, so as to prevent the airflow from flowing back to the airflow input end 411 or being dissipated from other gaps to affect heat dissipation.

Optionally, the angle between the second side plate 45 and the second side plate 45 is 24 ° -26 °. The design can be 24 °, 25 °, 25.3 °, 25.5 ° or 26 °, since the width of the airflow output end 412 of the centrifugal fan is smaller than the width of the box, a gap is left between the airflow output end 412 and the inner wall of the second box 42, and the airflow output end 412 cannot be prevented from being scattered out of the gap or flowing back to the airflow input end 411, so that the airflow output end 412 is disposed on the inner wall of one side close to the second box 42, and then the second side plate 45 and the inner wall of the second box 42 are disposed to form the airflow channel 46 in a surrounding manner, so as to block the airflow from being scattered out of the gap or flowing back to the airflow input end 411.

Optionally, the heat dissipating module 40 further includes a circuit board 48, the second plug 43 is disposed on the circuit board 48, the circuit board 48 is electrically connected to the third fan 51, and the circuit board 48 is mounted at an end of the second box 42 close to the third air inlet 531. The circuit board 48 is installed at one end close to the third air inlet 531, so that the space is reasonably utilized, the arrangement of the air flow channel 46 is not influenced, and the circuit board 48 can play a certain role in heat dissipation.

Optionally, the heat dissipation module 40 further includes an indicator lamp 49, the indicator lamp 49 is installed in the second box 42, the indicator lamp 49 is electrically connected to the circuit board 48 through an electric wire, and is used for displaying a starting state of the heat dissipation module 40, so as to facilitate observation of whether the heat dissipation module 40 works normally, for example, the indicator lamp 49 is installed in one side of the second box 42 where the second air outlet 422 is disposed, so that the indicator lamp 40 is located outside the server chassis 100, thereby facilitating observation.

Optionally, a side of the second side plate 45 facing away from the first side plate 44 and an inner wall of the other side of the box body enclose to form a wiring channel 47, and an electric wire of the indicator 49 passes through the wiring channel 47 to be electrically connected with the circuit board 48. The separation of the routing channel 47 from the air flow channel 46 is achieved by the above arrangement using a simple structural arrangement, preventing mutual interference.

Optionally, the second air outlet 422 includes a plurality of hexagonal apertures forming a honeycomb structure. Compare in current tetragonal air outlet, the ventilation effect of honeycomb structure's air outlet is better.

Optionally, the second box 42 includes a bottom shell 42a and an upper shell 42b, and the bottom shell 42a and the upper shell 42b are detachably connected to form a cavity for accommodating the second blower 41, the air guide structure and the circuit board 48. The bottom shell 42a and the top shell 42b can be connected by screws for convenient detachment and installation, or can be detachably connected by other ways such as a buckle structure, and the box body is of a cuboid structure for convenient pull-out installation in the second accommodating cavity 102.

Optionally, as shown in fig. 18 to 19, the power module 50 includes a third fan 51 and a power supply, the third fan 51 is configured to dissipate heat of the power supply, and after the third fan 51 drives an airflow to enter the power module 50, the airflow carries away heat of the power supply and is then output from the second opening 104. In the utility model, the third fan 51 is arranged, so that heat can be intensively dissipated for the power module 50, and the heat dissipation effect is good.

Optionally, the power module 50 further includes a third box 53, the third fan 51 and the power source are mounted on the third box 53, a third plug 52 for electrically connecting with the connector is disposed on one side of the power source facing the back plate 11, the third box 53 is provided with a third air inlet 531 and a third air outlet 532, the third air outlet 532 is disposed at one end of the third box 53 facing the second opening 104, and the second air inlet 421 is disposed at the other end of the third box 53; the third fan 51 is configured to drive an airflow to be input from the third air inlet 531, dissipate heat from the power supply, and blow out from the third air outlet 532. Through the setting, the third fan 51 and the power supply can be integrated in the third box body 53 to form a modular design, so that the power supply module 50 can be conveniently disassembled and assembled and the heat dissipation of the power supply can be facilitated.

In the utility model, the hard disk module 20, the mainboard module 30, the heat dissipation module 40 and the power module 50 are designed in a drawable manner, so that the installation, maintenance and replacement are convenient; the first fan 31, the second fan 41 and the third fan 51 are arranged to radiate heat for the mainboard 32, the power supply and the hard disk module 20 respectively, so that the radiating effect is good; the movement of the back plate 11 can be limited by the arrangement of the limiting component 60, so that the back plate 11 is prevented from being deformed forwards or backwards due to the plugging and unplugging of each functional module, and the butting stability of the connectors is improved; through the setting that separates fender subassembly 90 can the rational utilization space, can also hold a plurality of functional modules on the basis of minimize machine case weight to make things convenient for the installation of each functional module.

While the utility model has been described with reference to specific embodiments, the utility model is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the utility model. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A server chassis, comprising:

the box body is internally provided with an accommodating cavity;

2. The server chassis according to claim 1, wherein the motherboard module further includes a first box, the first box has a first air inlet and a first air outlet, the first fan and the motherboard are mounted on the first box, a first plug connector for electrically connecting with the connector is disposed on a side of the motherboard facing the backplane, and the first fan is configured to drive an airflow to be input from the first air inlet and to dissipate heat of the motherboard and then to be blown out from the first air outlet.

3. The server chassis of claim 2, wherein the motherboard comprises a first board body and a second board body connected to the first board body in an L-shape, the first board body and the second board body enclose an avoidance area, and the first fan is located in the avoidance area.

4. The server chassis according to claim 1, wherein the heat dissipation module further includes a second box body, a second plug connector for electrically connecting with the connector is further disposed on a side of the second box body facing the back plate, the second plug connector is electrically connected with the second fan, the back plate further includes a hollow structure to communicate the first receiving cavity with the second receiving cavity, the second fan is mounted on the second box body, the second box body is provided with a second air inlet and a second air outlet, the second air inlet is communicated with the hollow structure of the back plate, and the second fan is configured to drive an air flow to input from the second air inlet and blow out from the second air outlet after dissipating heat of the hard disk module.

5. The server chassis of claim 4, wherein the second fan has an airflow input and an airflow output, the airflow input communicating with the second air inlet and the airflow output communicating with the second air outlet; the heat dissipation module further comprises a flow guide structure, the flow guide structure comprises a first side plate and a second side plate, one end of the first side plate and one end of the second side plate are respectively connected to two sides of the second air outlet, the other end of the first side plate and the other end of the second side plate are respectively connected to two sides of the airflow output end, an airflow channel is formed by the first side plate and the second side plate in a surrounding mode, and in the air outlet direction, the distance between the first side plate and the second side plate is gradually increased.

6. The server chassis of claim 5, wherein the first side panel is an inner wall of a side of the second box.

7. The server chassis of claim 1, wherein the power module includes a third fan and a power source, the third fan configured to dissipate heat from the power source.

8. The server chassis of claim 7, wherein the power module further comprises a third box, the third fan and the power source are mounted on the third box, a third plug for electrically connecting with the connector is disposed on a side of the power source facing the backplane, the third fan has a third air inlet and a third air outlet, and the third fan is configured to drive an airflow to be input from the third air inlet and to blow out from the third air outlet after dissipating heat from the power source.

9. The server chassis of claim 1, wherein the box comprises a top panel, a bottom panel, a left side panel, and a right side panel, the top panel, the bottom panel, the left side panel, and the right side panel surrounding the back panel; the top plate comprises a first cover plate and a second cover plate, the first cover plate covers the first accommodating cavity, the second cover plate covers the second accommodating cavity, a first buckle structure is arranged on one side, facing the second cover plate, of the first cover plate, a second buckle structure is arranged on one side, facing the first cover plate, of the second cover plate, and the first buckle structure is connected with the second buckle structure in a buckled mode.

10. The server chassis according to claim 9, wherein the heat dissipation module, the motherboard module, and the power module are each provided with a first elastic fastening structure, and a second elastic fastening structure is provided at a position of the top plate, the bottom plate, the left side plate, or the right side plate corresponding to the first elastic fastening structure, and the first elastic fastening structure and the second elastic fastening structure are elastically fastened to connect, so that the heat dissipation module, the motherboard module, and the power module are respectively locked in the second receiving cavity.