CN215578519U - Heat radiation structure for high-power circuit chip - Google Patents
Heat radiation structure for high-power circuit chip Download PDFInfo
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- CN215578519U CN215578519U CN202120476210.3U CN202120476210U CN215578519U CN 215578519 U CN215578519 U CN 215578519U CN 202120476210 U CN202120476210 U CN 202120476210U CN 215578519 U CN215578519 U CN 215578519U
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Abstract
The utility model belongs to the technical field of chip heat dissipation, and particularly discloses a heat dissipation structure for a high-power circuit chip, which comprises a circuit board, a chip set, a dust cover, a supporting frame, a heat dissipation fan and a water tank, wherein the chip set is installed on the circuit board, and the dust cover is covered on the chip set; a supporting frame is fixed at the edge of the top end of the dust cover, a water tank is fixed at the top end of the supporting frame, a mounting opening is formed in the center of the water tank, and a heat dissipation fan is fixed in the mounting opening; the inner wall of the supporting frame is provided with a cooling pipe in a bending disc mode, a plurality of heat conducting sleeves are sleeved on the cooling pipe, and the heat conducting sleeves are fixed on the inner wall of the supporting frame; a micro pump is fixed on the outer side wall of the supporting frame, one end of the cooling pipe is connected with the bottom of the water tank, and the other end of the cooling pipe is connected with the micro pump; the micro pump is connected with the bottom of the water tank through a connecting pipe; the structure can prevent external dust from accumulating on the surface of the chip and influencing the self heat dissipation of the chip; meanwhile, the temperature of the surrounding environment of the chip can be reduced, and the heat dissipation of the chip is accelerated.
Description
Technical Field
The utility model relates to a heat dissipation structure for a high-power circuit chip, and belongs to the technical field of chip heat dissipation.
Background
The integrated chip is manufactured by mainly using CMOS (complementary metal oxide semiconductor) process in modern digital integrated chips; the integrated chip is arranged on a circuit board, and a large amount of heat is generated by using the circuit board; in the prior art, in order to ensure normal heat dissipation of a circuit board and a chip, a heat dissipation fan is mostly adopted for heat dissipation, and in high-temperature weather, because the temperature of the surrounding environment of the circuit board is relatively high, the heat dissipation effect of the heat dissipation fan is greatly reduced; therefore, normal heat dissipation of the circuit board and the chip cannot be guaranteed, and normal use of the circuit board and the chip is affected; therefore, a heat dissipation structure for a high power circuit chip is provided to solve the above problems.
Disclosure of Invention
The present invention is directed to a heat dissipation structure for a high power circuit chip, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: a heat radiation structure for a high-power circuit chip comprises a circuit board, a chip group, a dust cover, a support frame, a heat radiation fan and a water tank, wherein the chip group is installed on the circuit board, and the dust cover is covered on the chip group; a supporting frame is fixed at the edge of the top end of the dust cover, a water tank is fixed at the top end of the supporting frame, a mounting opening is formed in the center of the water tank, and a heat dissipation fan is fixed in the mounting opening; the inner wall of the supporting frame is provided with a cooling pipe in a bending disc mode, a plurality of heat-conducting sleeves are sleeved on the cooling pipe, and the heat-conducting sleeves are fixed on the inner wall of the supporting frame; a micro pump is fixed on the outer side wall of the supporting frame, one end of the cooling pipe is connected with the bottom of the water tank, and the other end of the cooling pipe is connected with the micro pump; the micro pump is connected with the bottom of the water tank through a connecting pipe.
Preferably, the peripheral side wall of the dust cover is provided with a plurality of heat dissipation holes, and dust nets are arranged in the heat dissipation holes.
Preferably, four corners of the dust cover are provided with magnetic insertion blocks.
Preferably, a guide rail is arranged on the circuit board at the position of the magnetic insertion block, a limiting clamping sleeve is arranged in the guide rail in a sliding manner, and a magnetic suction plate is arranged on the inner wall of the limiting clamping sleeve; the limiting clamping sleeve is inserted into the magnetic insertion block.
Compared with the prior art, the utility model has the beneficial effects that:
1. the utility model relates to a heat dissipation structure for a high-power circuit chip, which can prevent external dust from accumulating on the surface of a chip group and prevent the dust from influencing the self heat dissipation of the chip by arranging a dust cover.
2. The utility model is provided with a heat radiation fan, a water tank, a micropump, a cooling pipe and a heat radiation sleeve, wherein the micropump is utilized to enable water in the water tank to enter the cooling pipe to form circulation, air in the supporting frame can exchange heat with cold water under the action of the heat conduction sleeve, so that the temperature of the air in the supporting frame is reduced, and the air in the supporting frame enters the dust cover to exchange heat with the chip group under the action of the heat radiation fan, so that the heat radiation function of the chip group is completed.
3. The dustproof cover is provided with the guide rail, the limiting clamping sleeve and the magnetic insert block, the magnetic suction plate is arranged on the inner wall of the limiting clamping sleeve, the magnetic suction plate can be attracted with the magnetic insert block by the magnetic suction plate, the magnetic suction block can be guaranteed to be tightly clamped with the limiting clamping sleeve, the dustproof cover is stably installed, meanwhile, the dustproof cover is convenient to detach, and the heat dissipation structure is further convenient to detach.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the dust boot;
fig. 3 is an enlarged view of a portion a in fig. 1.
In the figure: 1. a circuit board; 2. a chipset; 3. a dust cover; 301. heat dissipation holes; 4. a support frame; 5. a heat dissipation fan; 6. a water tank; 7. a cooling tube; 8. a heat conducting sleeve; 9. a micro-pump; 10. a dust screen; 11. a magnetic insert block; 12. a guide rail; 13. a limiting clamping sleeve; 14. and a magnetic attraction plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-3, the present invention provides a technical solution: a heat radiation structure for a high-power circuit chip comprises a circuit board 1, a chip group 2, a dust cover 3, a support frame 4, a heat radiation fan 5 and a water tank 6, wherein the chip group 2 is installed on the circuit board 1, and the dust cover 3 is covered on the chip group 2; a supporting frame 4 is fixed at the edge of the top end of the dust cover 3, a water tank 6 is fixed at the top end of the supporting frame 4, a mounting opening is formed in the center of the water tank 6, and a heat dissipation fan 5 is fixed in the mounting opening; the inner wall of the supporting frame 4 is provided with a cooling pipe 7 in a bending disc mode, a plurality of heat-conducting sleeves 8 are sleeved on the cooling pipe 7, and the heat-conducting sleeves 8 are fixed on the inner wall of the supporting frame 4; a micro pump 9 is fixed on the outer side wall of the supporting frame 4, one end of the cooling pipe 7 is connected with the bottom of the water tank 6, and the other end of the cooling pipe 7 is connected with the micro pump 9; the micro pump 9 is connected with the bottom of the water tank 6 through a connecting pipe.
Further, a plurality of heat dissipation holes 301 are formed in the peripheral side wall of the dust cover 3, and a dust screen 10 is arranged in each heat dissipation hole 301; the surface of the chip group can be prevented from being accumulated by external dust, and the influence of the dust on the self heat dissipation of the chip is avoided.
Further, magnetic insertion blocks 11 are mounted at four corners of the dust cover 3.
Further, a guide rail 12 is installed on the circuit board 1 at the position of the magnetic insertion block 11, a limiting cutting sleeve 13 is slidably arranged in the guide rail 12, and a magnetic suction plate 14 is arranged on the inner wall of the limiting cutting sleeve 13; the limiting clamping sleeve 13 is inserted in the magnetic insertion block 11. Utilize magnetism suction disc 14 to be so that magnetism suction disc 14 and magnetism inserted block 11 attract mutually, can guarantee that magnetism inserted block 11 and spacing cutting ferrule 13 closely joint, realize the stable installation of dust cover 3 and be convenient for dust cover 3's of dismantlement simultaneously, and then be convenient for this heat radiation structure's dismantlement.
The working principle is as follows: the utility model relates to a heat radiation structure for a high-power circuit chip, which is characterized in that when the heat radiation structure is used, a water tank 6 is ensured to be filled with cold water, a heat radiation fan 5 and a micropump 9 are realized, the micropump 9 enables the water in the water tank 6 to enter a cooling pipe 7 and then return to the water tank 6 to form water circulation, the air in a support frame 4 can exchange heat with the cold water under the action of a heat conduction sleeve 8, so that the temperature of the air in the support frame 4 is reduced, the air in the support frame 4 enters a dust cover 3 to exchange heat with a chip group 2 under the action of the heat radiation fan 5, and then is discharged through a heat radiation hole 301, so that the heat radiation function of the chip group 2 is completed, and the chip group 2 can still work normally under a high-temperature environment. When dismantling this structure, when maintaining it, can remove spacing cutting ferrule 13 for magnetic attraction board 14 inserts piece 11 separation with magnetism, and then makes spacing cutting ferrule 13 insert piece 11 separation with magnetism, can follow circuit board 1 with dust cover 3 and take off, and then realize the split function of this structure.
It is worth noting that: the micropump is controlled by the master control button, and the equipment matched with the control button is common equipment, so that the micropump belongs to the existing mature technology, and the electrical connection relation and the specific circuit structure of the micropump are not repeated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a heat radiation structure for high power circuit chip which characterized in that: the heat dissipation fan comprises a circuit board (1), a chip set (2), a dust cover (3), a supporting frame (4), a heat dissipation fan (5) and a water tank (6), wherein the chip set (2) is installed on the circuit board (1), and the dust cover (3) is covered on the chip set (2); a supporting frame (4) is fixed at the edge of the top end of the dust cover (3), a water tank (6) is fixed at the top end of the supporting frame (4), a mounting opening is formed in the center of the water tank (6), and a heat dissipation fan (5) is fixed in the mounting opening; the inner wall of the supporting frame (4) is provided with a cooling pipe (7) in a bending disc mode, a plurality of heat-conducting sleeves (8) are sleeved on the cooling pipe (7), and the heat-conducting sleeves (8) are fixed on the inner wall of the supporting frame (4); a micro pump (9) is fixed on the outer side wall of the supporting frame (4), one end of the cooling pipe (7) is connected with the bottom of the water tank (6), and the other end of the cooling pipe (7) is connected with the micro pump (9); the micro pump (9) is connected with the bottom of the water tank (6) through a connecting pipe.
2. The heat dissipation structure for high power circuit chip according to claim 1, wherein: the dust cover (3) is provided with a plurality of heat dissipation holes (301) on the peripheral side wall, and dust nets (10) are arranged in the heat dissipation holes (301).
3. The heat dissipation structure for high power circuit chip according to claim 1, wherein: and magnetic inserting blocks (11) are arranged at four corners of the dust cover (3).
4. The heat dissipation structure for high power circuit chip according to claim 1, wherein: a guide rail (12) is arranged on the circuit board (1) at the position of the magnetic insert block (11), a limiting clamping sleeve (13) is arranged in the guide rail (12) in a sliding manner, and a magnetic suction plate (14) is arranged on the inner wall of the limiting clamping sleeve (13); the limiting clamping sleeve (13) is inserted into the magnetic insertion block (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120476210.3U CN215578519U (en) | 2021-03-04 | 2021-03-04 | Heat radiation structure for high-power circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120476210.3U CN215578519U (en) | 2021-03-04 | 2021-03-04 | Heat radiation structure for high-power circuit chip |
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| Publication Number | Publication Date |
|---|---|
| CN215578519U true CN215578519U (en) | 2022-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120476210.3U Active CN215578519U (en) | 2021-03-04 | 2021-03-04 | Heat radiation structure for high-power circuit chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116581097A (en) * | 2023-07-11 | 2023-08-11 | 北京汤谷软件技术有限公司 | Device for stabilizing communication data transmission among multiple chips |
-
2021
- 2021-03-04 CN CN202120476210.3U patent/CN215578519U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116581097A (en) * | 2023-07-11 | 2023-08-11 | 北京汤谷软件技术有限公司 | Device for stabilizing communication data transmission among multiple chips |
| CN116581097B (en) * | 2023-07-11 | 2023-09-29 | 北京汤谷软件技术有限公司 | Device for stabilizing communication data transmission among multiple chips |
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