CN215050807U

CN215050807U - Substrate carrier device for glass substrate electrochemical deposition

Info

Publication number: CN215050807U
Application number: CN202121131921.3U
Authority: CN
Inventors: 蒋新; 陈书良; 施利君
Original assignee: Suzhou Kzone Equipment Technology Co Ltd
Current assignee: Suzhou Kzone Equipment Technology Co Ltd
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2021-12-07
Anticipated expiration: 2031-05-25

Abstract

The utility model relates to a base plate carrier device for glass substrate electrochemical deposition, it includes: a carrier having a primary conductor disposed therein; the protective cover is internally provided with an electric conduction mechanism which is used for electrically connecting the main conductor with the substrate; and the electroplating epitaxial plate is connected to the protective cover, and the electroplating epitaxial plate is electrically connected with the electric conduction mechanism. Because the electroplating epitaxial plate is arranged on the protective cover, the protective cover is connected with the electroplating epitaxial plate when the substrate is connected, so that the connection area of the substrate is enlarged, the uneven part of the coating is expanded, and the uniformity of the substrate is ensured.

Description

Substrate carrier device for glass substrate electrochemical deposition

Technical Field

The utility model relates to a substrate carrier device for glass substrate electrochemical deposition.

Background

The common method for improving the uniformity of the electroplating surface in the industry at present is to install a shielding plate on an electroplating anode net and control the conduction of the surface current of a substrate to control the thickness of a plating layer in a current shielding mode. This kind of mode needs adjust through changing the shielding plate when switching different products at present, and inside the shielding plate was installed in the equipment cell body, and inside is full of liquid medicine, changes at every turn and need get rid of liquid medicine, and the cell body is clean the back, just can change the action, and the operation maintenance cost that produces from this is very high. Improvements are therefore needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a base plate carrier device for glass substrate electrochemical deposition has solved the problem that improves the electrochemical deposition homogeneity.

In order to achieve the above purpose, the utility model adopts the technical scheme that:

the utility model provides a base plate carrier device for glass substrate electrochemical deposition, it includes:

a carrier having a primary conductor disposed therein;

the protective cover is internally provided with an electric conduction mechanism which is used for electrically connecting the main conductor with the substrate;

and the electroplating epitaxial plate is connected to the protective cover, and the electroplating epitaxial plate is electrically connected with the electric conduction mechanism.

Preferably, the protective cover is a frame-shaped structure, and the protective cover surrounds the periphery of the substrate.

Further, the electroplating epitaxial plate extends into a frame shape along with the protective cover.

Preferably, the electrical conduction means has elasticity.

Preferably, the plated epitaxial plate is disposed outside the protective cover.

Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

the utility model discloses a base plate carrier device for glass substrate electrochemical deposition owing to set up electroplating epitaxial plate on the protective cover for the visor has switched on electroplating epitaxial plate simultaneously when switching on the base plate, makes the area that switches on of base plate can enlarge, and the inhomogeneous part of cladding material can expand outward, thereby has guaranteed the homogeneity of base plate current, and then has improved the cladding material homogeneity.

Drawings

Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

fig. 1 is a schematic structural view of a substrate carrier apparatus for electrochemical deposition of glass substrates according to a preferred embodiment of the present invention;

FIG. 2 is a cross-sectional view A-A of FIG. 1;

FIG. 3 is an enlarged view at B in FIG. 2;

FIG. 4 is an enlarged view at C of FIG. 3;

wherein the reference numerals are as follows:

1. a carrier;

2. a protective cover;

3. electroplating the epitaxial plate;

4. a main conductor;

5. an electrical conduction mechanism;

6. a suspension arm;

7. a substrate; 71. and (5) processing.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

The substrate carrier device for the electrochemical deposition of glass substrates as shown in fig. 1 is used for placing a substrate, then vertically immersing the substrate in a plating solution, and electrifying the substrate for electroplating.

Referring to fig. 1 and 2, a substrate carrier device for electrochemical deposition of glass substrates includes a suspension arm 6, a carrier 1, and a protective cover 2 covering the carrier 1. Wherein the carrier 1 is connected to a boom 6 and is moved by the boom 6. The protective cover 2 is a frame body, and an electric conduction mechanism is arranged in the protective cover 2 and used for conducting the substrate. After the substrate is attached to the surface of the carrier 1, the protective cover 2 is covered on the outer edge of the substrate.

As shown in fig. 3, fig. 3 is an enlarged view of B in fig. 2, and both sides of the carrier 1 are used for attaching the substrate 7. Here, a one-sided structure will be explained. A main conductor 4 is arranged within the carrier 1. An electrical conduction mechanism 5 is provided in the protective cover 2. After the substrate 7 is attached to the surface of the carrier 1, the protective cover 2 is pressed against the outer edge of the substrate 7, so that the substrate 7 is electrically connected with the main conductor 4. The main conductor 4 is connected to a power source to thereby conduct electricity to the substrate 7. The electrical conduction mechanism 5 has elasticity so as to be able to press the main conductor 4 and the base plate 7 to secure conduction efficiency.

As shown in fig. 3 and 4, a plating epitaxial plate 3 is provided outside the protective cover 2. The electroplating epitaxial plate 3 is electrically connected with the electric conduction mechanism 5. Therefore, when the substrate 7 is electrically conducted by the electrical conduction mechanism 5, the plated epitaxial plates 3 are simultaneously electrically conducted. This expands the conduction area of the substrate 7 and spreads the non-uniform current out onto the electroplated epitaxial plate 3, thereby ensuring the uniformity of the surface coating of the process edge 71 of the substrate 7 during the process.

In this example, the plated epitaxial plate 3 is extended into a frame shape along with the protective cover 2, so that the plating of the entire outer peripheral process edge 71 of the substrate 7 is uniform.

In summary, since the plating extension plate 3 is disposed on the protective cover 2, when the substrate 7 is electrochemically processed, the plating extension plate 3 is conducted at the same time, so that the non-uniform current is spread out onto the plating extension plate 3, and the current conducted on the internal substrate 7 (mainly the process edge 71) is ensured to be uniform, thereby ensuring the uniformity of the surface plating layer of the process edge 71 of the substrate 7 in the process.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A substrate carrier apparatus for use in the electrochemical deposition of glass substrates, comprising:

a carrier (1), a main conductor (4) being arranged in the carrier (1);

the protective cover (2), there are conducting mechanisms (5) in the said protective cover (2), the said conducting mechanism (5) is used for connecting electrically said main conductor (4) with base plate;

electroplate epitaxial plate (3), it connects to electroplate epitaxial plate (3) on visor (2), just it connect to electroplate epitaxial plate (3) with electric conduction mechanism (5) electricity is connected.

2. The substrate carrier device for electrochemical deposition of glass substrates of claim 1, wherein: the protective cover (2) is of a frame-shaped structure, and the protective cover (2) surrounds the periphery of the substrate.

3. The substrate carrier device for electrochemical deposition of glass substrates of claim 2, wherein: the electroplating epitaxial plate (3) extends into a frame shape along with the protective cover (2).

4. The substrate carrier device for electrochemical deposition of glass substrates of claim 1, wherein: the electric conduction mechanism (5) has elasticity.

5. The substrate carrier device for electrochemical deposition of glass substrates of claim 1, wherein: the electroplating epitaxial plate (3) is arranged on the outer side of the protective cover (2).