CN214591454U

CN214591454U - Infrared wireless communication circuit

Info

Publication number: CN214591454U
Application number: CN202120829783.XU
Authority: CN
Inventors: 吴启宗
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-04-21
Filing date: 2021-04-21
Publication date: 2021-11-02
Anticipated expiration: 2031-04-21

Abstract

The utility model provides an infrared wireless communication circuit relates to the communication technology field, decode chip IC1, resistance R1, resistance R2, resistance R3, resistance R4, passive crystal oscillator X1, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5 and infrared optical transceiver IC2 including infrared data code. The utility model discloses, need not to use complicated circuit, only need two chips and a small amount of electric capacity resistance, simple structure is easy-to-use, low cost, owing to use 5V mains operated, the electric current that digital circuit consumed is very low, therefore the consumption is very low, has the advantage of environmental protection, and the performance is also very stable, and infrared emitter launch angle is little, and data security is high.

Description

Infrared wireless communication circuit

Technical Field

The utility model relates to the field of communication technology, especially, relate to an infrared wireless communication circuit.

Background

The wireless communication technology is a common communication technology, and currently, there are several methods for implementing wireless communication:

one is bluetooth technology. The Bluetooth uses short-wave Ultra High Frequency (UHF) radio waves, and adopts a frequency hopping technology to resist signal fading; the fast frequency hopping and short grouping technology can reduce the same frequency interference and ensure the reliability of transmission; forward error correction coding techniques can reduce the effects of random noise in long-range transmissions. The method has the advantages of low power, low delay and support of complex networks, but has the problems of short transmission distance, general transmission rate, incompatible protocols among different devices, poor networking capability and electric wave interference on the frequency of 2.4 GHz.

Yet another is WiFi technology. WiFi connectivity is often a priority for many developers, particularly given the popularity of WiFi in the home environment within local area networks. Existing infrastructures are extensive and provide fast data transmission and the ability to process large amounts of data. The method has the advantages of wide coverage range, convenience in use and low cost, but has the disadvantages of large potential safety hazard, poor stability, high power consumption and poor networking capability.

The other is Zigbee technology. Zigbee is a low power consumption personal area network protocol based on the ieee802.15.4 standard. The technology specified according to this protocol is a short-range, low-power wireless communication technology. The method has the main characteristics of low power consumption, low cost, low speed, support of a large number of nodes, support of various network topologies, low complexity, rapidness, reliability and safety. But the wall penetrating capability is weak, the cost is higher, the ad hoc network capability is poor, and the anti-interference performance is poor.

Yet another is the NFC technology. NFC (near field communication) was co-developed in 2002 by philips semiconductors, nokia and sony. Devices using NFC technology can exchange data in close proximity to each other, evolved from the integration of RFID (contactless radio frequency identification) and interconnect and interworking technologies, by integrating the functions of inductive card readers, inductive cards and point-to-point communication on a single chip. But the defects of short transmission and low speed are also obvious.

In summary, the research and development of an infrared wireless communication circuit is still a key problem to be solved urgently in the technical field of communication.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an infrared wireless communication circuit to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

an infrared wireless communication circuit comprises an infrared data coding and decoding chip IC1, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a passive crystal oscillator X1, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5 and an infrared optical transceiver IC 2;

pin 1 of the infrared data coding and decoding chip IC1 is connected with a 5V power supply, pin 2 is connected with pin 2 of a passive crystal oscillator X1, pin 3 is connected with pin 1 of a passive crystal oscillator X1, pin 4 is connected with pin 2 of a resistor R1, pin 5 is connected with pin 4 of an infrared optical transceiver IC2, pin 6 is connected with pin 3 of an infrared optical transceiver IC2, pin 7 is connected with the 5V power supply, pin 8 is grounded, pin 10 is grounded, pin 13 is connected with the 5V power supply, and pin 14 is grounded;

one end of the passive crystal oscillator X1 is connected with a capacitor C2, the other end of the passive crystal oscillator X1 is connected with a capacitor C3, and the other ends of the capacitor C2 and the capacitor C3 are both grounded;

one end of the capacitor C1 is grounded, and the other end of the capacitor C1 is respectively connected with the resistor R1 and a pin 4 of the infrared data decoding and encoding chip IC 1;

one end of the resistor R2 is connected with a pin 9 of an infrared data decoding and encoding chip IC1, and the other end of the resistor R2 is connected with a 5V power supply;

one end of the resistor R3 is connected with a 5V power supply, and the other end of the resistor R3 is connected with a pin 1 of an infrared optical transceiver IC 2;

pin 6 of the infrared optical transceiver IC2 is connected with a resistor R4, and the infrared optical transceiver IC2 is provided with an infrared light transmitting terminal 9 and an infrared light receiving terminal 10;

one end of the resistor R4 is connected with a 5V power supply, and the other end of the resistor R4 is connected with the capacitor C4 and the capacitor C5;

the capacitor C4 is connected with a pin 6 of the infrared optical transceiver IC2 at one end of the capacitor C5, and the other ends of the capacitor C4 and the capacitor C5 are grounded.

In a preferred embodiment, pin 11 of the ir data codec chip IC1 is used for receiving TTL formatted data, and pin 12 of the ir data codec chip IC1 is used for transmitting TTL formatted data.

In a preferred embodiment, pins 2 and 7 of the ir transceiver IC2 are floating and disconnected.

In a preferred embodiment,

pins

5 and 8 of the infrared transceiver IC2 are both grounded.

In a preferred embodiment, the infrared data encoding and decoding chip IC1 has a model of MCP 2120.

In a preferred embodiment, the infrared optical transceiver IC2 is model number TFDU 4101.

Compared with the prior art, the utility model has the advantages and positive effects that,

1. the utility model discloses in, need not to use complicated circuit, only need two chips and a small amount of electric capacity resistance, simple structure is easy-to-use, low cost.

2. The utility model discloses in, owing to use 5V mains operated, the electric current that digital circuit consumed is very low, therefore the consumption is very low, has the advantage of environmental protection, and the performance is also very stable, and infrared emitter launch angle is little, and data security is high.

Drawings

Fig. 1 is a circuit diagram of an infrared wireless communication circuit according to the present invention.

Detailed Description

The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1, the present invention provides a technical solution: an infrared wireless communication circuit comprises an infrared data coding and decoding chip IC1, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a passive crystal oscillator X1, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5 and an infrared optical transceiver IC 2;

pin 1 of infrared data coding decoding chip IC1 connects the 5V power, pin 2 is connected with passive crystal oscillator X1's pin 2, pin 3 is connected with passive crystal oscillator X1's pin 1, pin 4 is connected with resistance R1's pin 2, pin 5 is connected with infrared optical transceiver IC 2's pin 4, pin 6 is connected with infrared optical transceiver IC 2's pin 3, 5V power is connected to pin 7, pin 8 ground connection, pin 10 ground connection, pin 13 connects the 5V power, pin 14 ground connection.

One end of the passive crystal oscillator X1 is connected with the capacitor C2, the other end of the passive crystal oscillator X1 is connected with the capacitor C3, and the other ends of the capacitor C2 and the capacitor C3 are both grounded.

One end of the capacitor C1 is grounded, and the other end of the capacitor C1 is respectively connected with the resistor R1 and the pin 4 of the infrared data decoding and coding chip IC 1.

One end of the resistor R2 is connected with a pin 9 of the infrared data decoding and coding chip IC1, and the other end of the resistor R2 is connected with a 5V power supply.

One end of the resistor R3 is connected with a 5V power supply, and the other end of the resistor R3 is connected with a pin 1 of the infrared optical transceiver IC 2.

Pin 6 of the infrared optical transceiver IC2 is connected to a resistor R4, and the infrared optical transceiver IC2 is provided with an infrared light transmitting terminal 9 and an infrared light receiving terminal 10.

One end of the resistor R4 is connected with a 5V power supply, and the other end of the resistor R4 is connected with the capacitor C4 and the capacitor C5.

The capacitor C4 is connected with the pin 6 of the infrared optical transceiver IC2 at one end of the capacitor C5, and the other ends of the capacitor C4 and the capacitor C5 are grounded.

Pin 11 of the infrared data codec chip IC1 is used for receiving data in TTL format, and pin 12 of the infrared data codec chip IC1 is used for transmitting data in TTL format.

Pin 2 and pin 7 of the infrared optical transceiver IC2 are both floating and disconnected components.

Pin 5 and pin 8 of the infrared optical transceiver IC2 are both grounded.

The model of the infrared data coding and decoding chip IC1 is MCP2120, and the used infrared data coding and decoding chip IC1 can be replaced by a chip similar to the MCP2120 according to the use requirement.

The infrared optical transceiver IC2 is model number TFDU4101, and the infrared optical transceiver IC2 used can be replaced by a chip similar to TFDU 4101.

The working principle of the embodiment is as follows: when receiving data: the infrared light receiving end 10 receives external IrDA infrared data, and sends the external IrDA infrared data to the pin 6 of the infrared data coding and decoding chip IC1 through the pin 3, and the infrared data coding and decoding chip IC1 decodes the data and sends TTL format data through the pin 12.

When data is transmitted: pin 11 of the infrared data encoding and decoding chip IC1 receives TTL format data, and after encoding, the TTL format data is sent to pin 4 of the infrared optical transceiver IC2 through pin 5, and the infrared optical transceiver IC2 sends out IrDA optical data through the infrared light transmitting terminal 9.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may use the above-mentioned technical contents to change or modify the equivalent embodiment into equivalent changes and apply to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical matters of the present invention will still fall within the protection scope of the technical solution of the present invention.

Claims

1. An infrared wireless communication circuit is characterized by comprising an infrared data coding and decoding chip IC1, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a passive crystal oscillator X1, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5 and an infrared optical transceiver IC 2;

2. An infrared wireless communication circuit according to claim 1, wherein: the pin 11 of the infrared data encoding and decoding chip IC1 is used for receiving data in TTL format, and the pin 12 of the infrared data encoding and decoding chip IC1 is used for sending data in TTL format.

3. An infrared wireless communication circuit according to claim 1, wherein: and pin 2 and pin 7 of the infrared optical transceiver IC2 are all floating and are not connected with components.

4. An infrared wireless communication circuit according to claim 1, wherein: pin 5 and pin 8 of the infrared optical transceiver IC2 are both grounded.

5. An infrared wireless communication circuit according to claim 1, wherein: the model of the infrared data coding and decoding chip IC1 is MCP 2120.

6. An infrared wireless communication circuit according to claim 1, wherein: the infrared optical transceiver IC2 is of the type TFDU 4101.