CN214476721U - Heat conduction and flame retardant layer structure of chip type high-power resistor - Google Patents
Heat conduction and flame retardant layer structure of chip type high-power resistor Download PDFInfo
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- CN214476721U CN214476721U CN202120779948.7U CN202120779948U CN214476721U CN 214476721 U CN214476721 U CN 214476721U CN 202120779948 U CN202120779948 U CN 202120779948U CN 214476721 U CN214476721 U CN 214476721U
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Abstract
The utility model discloses a heat conduction and fire-retardant layer structure of high-power resistance of chip relates to chip resistance card technical field. The utility model discloses a chip resistance card and resistance protection mechanism, resistance protection mechanism are used for protecting chip resistance card, and resistance protection mechanism includes insulating layer, cooling material, fire-retardant flame retardant coating, dampproof course and protective layer, and the insulating layer setting is in the outside of chip resistance card for the electric energy of chip resistance card release cuts off, and the outside of insulating layer is provided with fire-retardant flame retardant coating, is used for cutting off flame, and it has cooling material to fill between insulating layer and the fire-retardant flame retardant coating, is used for cooling down the processing to chip resistance card. The utility model discloses a set up the cooling material and can effectually cool down chip resistance card, prevent that chip resistance card from damaging because being heated great, cut off the electric current when setting up a plurality of fuse-links can effectually the electric current in chip resistance card great to great hoisting device's security.
Description
Technical Field
The utility model belongs to the technical field of the piece formula resistance card, especially, relate to a heat conduction and fire-retardant layer structure of high-power resistance of piece formula.
Background
The resistance card is generally directly called as a resistor in daily life and is a current-limiting element, after the resistor is connected in a circuit, the resistance value of the resistance card is fixed, generally has two pins, can limit the magnitude of current passing through a branch connected with the resistance card, is called as a fixed resistance card with unchangeable resistance value, is called as a potentiometer or a variable resistance card with changeable resistance value, but the existing resistance card has poor heat dissipation performance, is easy to damage due to larger heating in the using process and has poor safety.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat conduction and fire-retardant layer structure of high-power resistance of chip formula to current problem has been solved: the existing resistance card has poor heat dissipation performance and is easy to damage due to large heating in the use process.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model relates to a heat conduction and flame retardant layer structure of a chip type high-power resistor, which comprises a chip type resistor disc and a resistor protection mechanism, wherein the resistor protection mechanism is used for protecting the chip type resistor disc;
the resistor protection mechanism comprises an insulating layer, a cooling material, a flame-retardant fireproof layer, a moisture-proof layer and a protective layer, wherein the insulating layer is arranged on the outer side of the chip resistor disc and used for cutting off electric energy released by the chip resistor disc;
the outside of fire-retardant flame retardant coating is provided with the dampproof course for cut off moisture, the outside of dampproof course is provided with the protective layer, is used for protecting chip resistance card, insulating layer, cooling material, fire-retardant flame retardant coating and dampproof course.
Furthermore, the material of the cooling material is one of methyl formate, ethyl ether, n-pentane and ethyl bromide.
Further, the chip resistor disc comprises a resistor protection shell and a resistor body, wherein the resistor protection shell is used for protecting the resistor body.
Further, the resistance protective housing is including protecting the inferior valve, the inside at the protection inferior valve is assembled to the resistance body, the upper end of protection inferior valve is equipped with the protection epitheca, the protection epitheca is used for sealing the protection inferior valve.
Furthermore, the resistance body includes the wave resistance wire, the wave resistance wire is located the inside of resistance protective housing, the equal electric connection in both ends of wave resistance wire has the busbar, two the equal electric connection in one end that the wave resistance wire was kept away from to the busbar has the conductor wire, just the one end of conductor wire runs through the resistance protective housing.
Furthermore, the wave resistance wire comprises a plurality of resistance wire bodies, two adjacent resistance wire bodies are connected through a fuse link, and the fuse link is electrically connected with the resistance wire bodies.
Furthermore, the fuse link is made of silver-copper alloy.
The utility model discloses following beneficial effect has:
1. the utility model discloses a set up cooling material and can effectually cool down chip resistance card, prevent that chip resistance card from damaging because being heated greatly.
2. The utility model discloses a set up a plurality of fuse-links and can effectually cut off the electric current when the electric current in chip resistance card is great to great hoisting device's security.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat conducting and flame retardant layer structure of a chip type high-power resistor of the present invention;
FIG. 2 is a schematic view of an overall cutting structure of a heat-conducting and flame-retardant layer structure of a chip-type high-power resistor according to the present invention;
fig. 3 is a schematic structural diagram of a chip resistor disc with a heat conducting and flame retardant layer structure of a chip high-power resistor according to the present invention;
fig. 4 is a schematic structural diagram of the heat conducting and flame retardant layer structure resistor body of the chip type high-power resistor of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. chip resistor disc; 2. a resistance protection mechanism; 3. an insulating layer; 4. a cooling material; 5. a flame retardant and fire resistant layer; 6. a moisture barrier; 7. a protective layer; 8. a resistor protection shell; 9. a resistor body; 10. a protective lower shell; 11. protecting the upper shell; 12. a wave resistance wire; 13. a conductive strip; 14. a conductive wire; 15. a fuse link; 16. resistance wire body.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention relates to a heat conducting and flame retardant layer structure of a chip type high power resistor, which includes a chip type resistor disc 1 and a resistor protection mechanism 2, wherein the resistor protection mechanism 2 is used for protecting the chip type resistor disc 1;
the resistance protection mechanism 2 comprises an insulating layer 3, a cooling material 4, a flame-retardant fireproof layer 5, a moisture-proof layer 6 and a protective layer 7, wherein the insulating layer 3 is arranged on the outer side of the chip resistance card 1 and used for cutting off electric energy released by the chip resistance card 1, the flame-retardant fireproof layer 5 is arranged on the outer side of the insulating layer 3 and used for cutting off flame, and the cooling material 4 is filled between the insulating layer 3 and the flame-retardant fireproof layer 5 and used for cooling the chip resistance card 1;
the material of the cooling material 4 can be one of methyl formate, ethyl ether, n-pentane and ethyl bromide, when the temperature of the resistor body 9 rises to the melting point of the cooling material 4, the cooling material 4 can be melted into liquid, and a large amount of heat energy can be absorbed in the melting process, so that the purpose of cooling is effectively achieved;
the moisture-proof layer 6 is arranged on the outer side of the flame-retardant fireproof layer 5 and used for cutting off moisture and preventing the moisture from entering the chip resistance card 1, so that short circuit of the chip resistance card 1 due to moisture is avoided, and the protective layer 7 is arranged on the outer side of the moisture-proof layer 6 and used for protecting the chip resistance card 1, the insulating layer 3, the cooling material 4, the flame-retardant fireproof layer 5 and the moisture-proof layer 6;
further, the chip resistor disc 1 comprises a resistor protection shell 8 and a resistor body 9, wherein the resistor protection shell 8 is used for protecting the resistor body 9;
the resistor protection shell 8 comprises a protection lower shell 10, the resistor body 9 is assembled inside the protection lower shell 10, the upper end of the protection lower shell 10 is assembled with a protection upper shell 11, and the protection upper shell 11 is used for sealing the protection lower shell 10;
the resistor body 9 comprises a wave resistance wire 12, the wave resistance wire 12 is positioned inside the resistor protection shell 8, both ends of the wave resistance wire 12 are electrically connected with conductive strips 13, both ends of the two conductive strips 13 far away from the wave resistance wire 12 are electrically connected with a conductive wire 14, and one end of the conductive wire 14 penetrates through the resistor protection shell 8;
specifically, the wave resistance wire 12 comprises a plurality of resistance wire bodies 16, two adjacent resistance wire bodies 16 are connected through a fuse link 15, the fuse link 15 is electrically connected with the resistance wire bodies 16, and the fuse link 15 is made of silver-copper alloy;
in the use, when the electric current in chip resistance card 1 is great, the temperature of electric current can increase, when the temperature of electric current increases to more than the fusing point of fuse-link 15, fuse-link 15 can be heated the fusing to cut off the electric current, cut off the electric current when setting up a plurality of fuse-links 15 can be effectual electric current in chip resistance card 1 great, thereby great hoisting device's security.
One specific application of this embodiment is: in the using process, when the current in the resistor body 9 is too large, large heat energy can be generated, when the temperature of the heat energy is higher than the melting point of the cooling material 4, the cooling material 4 can be heated and melted into liquid, and the cooling material 4 can absorb a large amount of heat in the process of melting the solid into the liquid, so that the chip resistor sheet 1 can be effectively cooled, and the damage of the chip resistor sheet 1 due to large heating can be prevented;
after the chip resistor disc 1 is used, the temperature of the chip resistor disc 1 is reduced, the temperature of the temperature reducing material 4 is adaptively reduced without heating the temperature reducing material 4, and when the temperature of the temperature reducing material 4 is reduced below the melting point of the temperature reducing material 4, the temperature reducing material 4 is solidified into a solid from a liquid;
and in the use, when the electric current in chip resistance card 1 is great, the temperature of electric current can increase, when the temperature of electric current increases to more than the fusing point of fuse-link 15, fuse-link 15 can be heated the fusing to cut off the electric current, cut off the electric current when setting up a plurality of fuse-links 15 can be effectual electric current in chip resistance card 1 is great, thereby great hoisting device's security.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (7)
1. A heat conduction and flame retardant layer structure of a chip type high-power resistor is characterized by comprising a chip type resistor disc (1) and a resistor protection mechanism (2), wherein the resistor protection mechanism (2) is used for protecting the chip type resistor disc (1);
the resistor protection mechanism (2) comprises an insulating layer (3), a cooling material (4), a flame-retardant fireproof layer (5), a moisture-proof layer (6) and a protective layer (7), wherein the insulating layer (3) is arranged on the outer side of the chip type resistor disc (1) and used for cutting off electric energy released by the chip type resistor disc (1), the flame-retardant fireproof layer (5) is arranged on the outer side of the insulating layer (3) and used for cutting off flame, and the cooling material (4) is filled between the insulating layer (3) and the flame-retardant fireproof layer (5) and used for cooling the chip type resistor disc (1);
the outside of fire-retardant flame retardant coating (5) is provided with dampproof course (6) for cut off moisture, the outside of dampproof course (6) is provided with protective layer (7) for protect chip resistance card (1), insulating layer (3), cooling material (4), fire-retardant flame retardant coating (5) and dampproof course (6).
2. The heat-conducting and flame-retardant layer structure of the chip type high-power resistor as claimed in claim 1, wherein the material of the temperature-reducing material (4) is one of methyl formate, ethyl ether, n-pentane and bromoethane.
3. The heat-conducting and flame-retardant layer structure of a chip type high-power resistor as claimed in claim 1, wherein the chip type resistor chip (1) comprises a resistor protection casing (8) and a resistor body (9), and the resistor protection casing (8) is used for protecting the resistor body (9).
4. The heat-conducting and flame-retardant layer structure of a chip type high-power resistor as claimed in claim 3, wherein the resistor protection casing (8) comprises a protection lower casing (10), the resistor body (9) is assembled inside the protection lower casing (10), the upper end of the protection lower casing (10) is assembled with a protection upper casing (11), and the protection upper casing (11) is used for sealing the protection lower casing (10).
5. The heat-conducting and flame-retardant layer structure of a chip type high-power resistor as claimed in claim 3, wherein the resistor body (9) comprises a wave resistance wire (12), the wave resistance wire (12) is located inside the resistor protection case (8), both ends of the wave resistance wire (12) are electrically connected with conductive strips (13), one ends of the two conductive strips (13) far away from the wave resistance wire (12) are electrically connected with conductive wires (14), and one ends of the conductive wires (14) penetrate through the resistor protection case (8).
6. The heat-conducting and flame-retardant layer structure of the chip type high-power resistor as claimed in claim 5, wherein the wavy resistance wire (12) comprises a plurality of resistance wire bodies (16), two adjacent resistance wire bodies (16) are connected through a fuse link (15), and the fuse link (15) is electrically connected with the resistance wire bodies (16).
7. The heat-conducting and flame-retardant layer structure of a chip type high-power resistor as claimed in claim 6, wherein the fuse link (15) is made of silver-copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120779948.7U CN214476721U (en) | 2021-04-16 | 2021-04-16 | Heat conduction and flame retardant layer structure of chip type high-power resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120779948.7U CN214476721U (en) | 2021-04-16 | 2021-04-16 | Heat conduction and flame retardant layer structure of chip type high-power resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214476721U true CN214476721U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120779948.7U Active CN214476721U (en) | 2021-04-16 | 2021-04-16 | Heat conduction and flame retardant layer structure of chip type high-power resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214476721U (en) |
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2021
- 2021-04-16 CN CN202120779948.7U patent/CN214476721U/en active Active
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