CN214252487U - Chip test module - Google Patents

Chip test module Download PDF

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Publication number
CN214252487U
CN214252487U CN202021798226.8U CN202021798226U CN214252487U CN 214252487 U CN214252487 U CN 214252487U CN 202021798226 U CN202021798226 U CN 202021798226U CN 214252487 U CN214252487 U CN 214252487U
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China
Prior art keywords
chip
positioning
positioning block
mounting plate
cavity
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CN202021798226.8U
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Chinese (zh)
Inventor
王树锋
陈阳
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Qianhai Jingyun Shenzhen Storage Technology Co ltd
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Qianhai Jingyun Shenzhen Storage Technology Co ltd
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Priority to CN202021798226.8U priority Critical patent/CN214252487U/en
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Abstract

The utility model discloses a chip testing module, the chip testing module comprises a chip mounting plate and a chip positioning mechanism, wherein the chip mounting plate is detachably connected with the chip positioning mechanism; a chip pin carrier plate is fixed on the chip mounting plate; the chip positioning mechanism comprises a chip cavity, a positioning block and a chip locking mechanism; the chip cavity is provided with a chip mounting groove, and the chip needle support plate is sleeved in the chip mounting groove; one end of the positioning block extends into the chip mounting groove and is abutted with the chip; the chip locking mechanism is arranged at the other end of the positioning block and used for locking the positioning block. The chip testing module of the utility model fixes the chip by arranging the mounting plate and the chip positioning mechanism, thereby facilitating the subsequent test; meanwhile, the chip positioning mechanism is detachably connected with the mounting plate, so that the chip positioning mechanism is convenient to mount and dismount.

Description

Chip test module
Technical Field
The utility model relates to a chip test technical field especially relates to a chip test module.
Background
The chip testing module is used for bearing a chip and driving the chip to be tested in the testing machine correspondingly. The existing chip testing module is fixedly installed and is difficult to disassemble, so that the inconvenience of installation and transportation is caused.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problem that a chip testing module is provided, and a chip fixing structure is detachable and is convenient to install and transport.
In order to solve the technical problem, the utility model discloses a technical scheme be: providing a chip testing module, wherein the chip testing module comprises a chip mounting plate and a chip positioning mechanism, and the chip mounting plate is detachably connected with the chip positioning mechanism;
a chip pin carrier plate is fixed on the chip mounting plate;
the chip positioning mechanism comprises a chip cavity, a positioning block and a chip locking mechanism;
the chip cavity is provided with a chip mounting groove, and the chip needle support plate is sleeved in the chip mounting groove; one end of the positioning block extends into the chip mounting groove and is abutted with the chip; the chip locking mechanism is arranged at the other end of the positioning block and used for locking the positioning block.
The chip mounting plate is provided with a first magnetic part, a second magnetic part is buried in the chip cavity, and the chip cavity and the chip mounting plate are attracted through the first magnetic part and the second magnetic part.
The chip mounting plate is provided with a chip cavity, the chip cavity is provided with a guide hole, and the guide part penetrates through the guide hole, so that the chip cavity is mounted on the chip mounting plate.
The chip cavity further comprises a positioning piece mounting platform, and the positioning piece is arranged on the positioning piece mounting platform;
the chip mounting groove with one side that setting element installation platform is relative forms the breach, the one end of locating piece is passed through the breach stretches into in the chip mounting groove.
The notch is located on a connecting line between the center of the chip mounting groove and the center of the positioning piece mounting platform, and the length center line of the positioning piece is superposed with the connecting line.
One end, close to the notch, of the positioning block comprises a first side and a second side which are forked, and the first side and the second side are respectively abutted against two adjacent sides of the chip;
a clearance groove is further formed at the intersection of the first edge and the second edge;
and the other end of the positioning block upwards forms a bulge.
The chip locking mechanism comprises an elastic piece, and the elastic piece is arranged at the other end of the positioning block and used for applying elastic force to the positioning block; the chip locking mechanism also comprises a cover plate, and the cover plate is covered on the positioning piece mounting platform;
the cover plate is provided with a through groove, and the protrusion penetrates through the through groove.
The chip testing module also comprises a module shell, wherein a hole is formed in the module shell;
the chip mounting plate with the chip positioning mechanism hold in the module housing, just the chip positioning mechanism is followed downthehole the exposing.
One end of the elastic piece is fixed on the inner wall of the hole, and the other end of the elastic piece is abutted to the positioning block.
And the module shell is also provided with a patch panel.
Compared with the prior art, the utility model discloses a beneficial effect that chip test module reached does: the chip is fixed by arranging the mounting plate and the chip positioning mechanism, so that the subsequent test is facilitated; meanwhile, the chip positioning mechanism is detachably connected with the mounting plate, so that the chip positioning mechanism is convenient to mount and dismount.
Drawings
To illustrate the technical solutions in the embodiments of the present invention more clearly, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and those skilled in the art can also obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a chip testing module according to the present invention;
FIG. 2 is a schematic view of the present invention after the chip positioning mechanism is removed from FIG. 1;
FIG. 3 is a schematic structural diagram of a chip positioning mechanism of the chip testing module according to the present invention;
FIG. 4 is a schematic structural view of a chip cavity of the chip positioning mechanism of the present invention;
FIG. 5 is a schematic structural diagram of a cover plate of the chip positioning mechanism of the present invention;
fig. 6 is a schematic structural diagram of a positioning block of the middle chip positioning mechanism of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
All directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "first", "second", etc. in this application are used to distinguish between different objects and not to describe a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Please refer to fig. 1 to fig. 3, fig. 1 is a schematic structural diagram of the middle chip testing module of the present invention, fig. 2 is a schematic structural diagram of the chip positioning mechanism of fig. 1 after removing the chip positioning mechanism, and fig. 3 is a schematic structural diagram of the chip positioning mechanism of the middle chip testing module of the present invention. The chip testing module in the application comprises a chip mounting plate 71 and a chip positioning mechanism 72, wherein the chip mounting plate 71 is detachably connected with the chip positioning mechanism 72. The chip testing module is used for fixing and bearing the chip and enters the tester together with the chip to be tested.
A chip pin carrier plate 73 is fixed on the chip mounting plate 71 in this application, and the chip mounting plate 71 is a substrate of the chip testing module and is used for bearing parts. The pin carrier 73 mainly functions to protect the chip and to interface the ic chip with the outside, and the chip is mounted on the pin carrier 73.
The chip positioning mechanism 72 in this application is used to fix the chip on the chip testing module, and in this embodiment, the chip positioning mechanism 72 includes a chip cavity 721, a positioning block 722 and a chip locking mechanism, where the chip cavity 721 is used to cooperate with the pin carrier 73 to form a groove, so that the chip is fixed in the groove. The positioning block 722 is used for fixing the chip, and the chip locking mechanism is used for locking the positioning block 722 to abut against the chip. For the convenience of mounting and dismounting, the chip positioning mechanism 72 in this embodiment is detachably connected to the chip mounting plate 71.
The chip locking mechanism of the present application only needs to apply a force to the positioning block 722 to make the positioning block 722 abut against the chip, so as to achieve the effect of limiting the chip, and in this embodiment, the chip locking mechanism at least includes an elastic member 723, and the elastic member 723 is disposed at the other end of the positioning block 722, and is used for applying an elastic force to the positioning block 722 to push the positioning block 722 to abut against the chip.
Please refer to fig. 4, fig. 4 is a schematic structural diagram of a chip cavity of the chip positioning mechanism of the present invention. In the present application, the chip cavity 721 is provided with a chip mounting groove 724, and the chip pin carrier plate 73 is sleeved in the chip mounting groove 724; one end of the positioning block 722 extends into the chip mounting groove 724 and is abutted with the chip; the elastic member 723 is disposed at the other end of the positioning block 722 for applying an elastic force to the positioning block 722.
Still be equipped with first magnetic part 74 on the chip mounting panel 71 in this application, the second magnetic part has been buried underground in chip die cavity 721, and chip die cavity 721 attracts mutually through first magnetic part 74 and second magnetic part magnetism with chip mounting panel 71 to make chip die cavity 721 and chip mounting panel 71 swing joint, be convenient for installation and dismantlement.
In this application, the chip mounting plate 71 is further provided with a guide member 75, the chip cavity 721 is provided with a guide hole 725, and the guide member 75 penetrates through the guide hole 725, so that the chip cavity 721 is mounted on the chip mounting plate 71. In order to facilitate the mounting of the chip cavity 721 to a predetermined position on the chip mounting plate 71, the guide member 75 and the guide hole 725 are provided in this embodiment, so that the chip cavity 721 is mounted at a correct position, and the chip cavity 721 is movably mounted on the chip mounting plate 71 by the first magnetic member 74 and the second magnetic member as described above.
In this application, the chip cavity 721 further includes a positioning member mounting platform 726, and the positioning block 722 is disposed on the positioning member mounting platform 726. A notch is formed at one side of the chip mounting groove 724 opposite to the positioning piece mounting platform 726, one end of the positioning block 722 extends into the chip mounting groove 724 through the notch, and the other end of the positioning block 722 is abutted to a chip positioned in the chip mounting groove 724, so that the chip is fixed in the chip testing module.
In this application, the notch is located on a connection line between the center of the chip mounting groove 724 and the center of the positioning member mounting platform 726, and the length center line of the positioning block 722 coincides with the connection line. The line connecting the center of the chip mounting groove 724 and the center of the positioning member mounting platform 726 forms an angle of 45 degrees with respect to the two ends of the length and width of the chip mounting plate 71, and the length direction of the positioning block 722 is parallel to the line, so that the force applied by the positioning block 722 to the chip is directed toward the center of the chip, and the stress of the chip is relatively balanced.
Please refer to fig. 6, fig. 6 is a schematic structural diagram of a positioning block of the chip positioning mechanism of the present invention. In the application, one end of the positioning block 722 close to the notch comprises a first side 7221 and a second side 7222 which are forked, and the first side 7221 and the second side 7222 respectively abut against two adjacent sides of the chip; a clearance groove 7223 is also arranged at the intersection of the first edge 7221 and the second edge 7222; the other end of the positioning block 722 is formed upward with a projection 7224. In this embodiment, the chip is square or rectangular, the four corners of the chip are right angles, so as to form an even force on the chip when the chip is fixed, the positioning block 722 forms a first side 7221 and a second side 7222 which are bifurcated, an included angle between the first side 7221 and the second side 7222 is 90 degrees, the included angle is respectively abutted against two adjacent sides of the chip, the clearance groove 7223 is used for avoiding the four corners of the chip, and the opposite side of the chip, which is subjected to the thrust of the positioning block 722, is abutted against the inner wall of the chip cavity 721, so that the chip is fixed in the chip testing module.
Please refer to fig. 5, fig. 5 is a schematic structural diagram of a cover plate of the chip positioning mechanism of the present invention. The chip locking mechanism of the present application further includes a cover plate 76, and the cover plate 76 is disposed on the positioning member mounting platform 725. The cover plate 76 is provided with a through groove 761, and the protrusion 7224 penetrates through the through groove 761, so that the positioning block 722 can perform reciprocating motion under the limit of the cover plate 76.
The chip test module in the application also comprises a module shell 77, and a hollow-out hole 771 is formed in the module shell 77; the chip mounting board 71 and the chip positioning mechanism 72 are accommodated in the module case 77, and the chip positioning mechanism 72 is exposed from the hollowed-out hole 771.
In this application, one end of the elastic member 723 is fixed to the inner wall of the hollow 771, and the other end of the elastic member abuts against the positioning block 722, so as to apply an elastic force to the positioning block 722 and push the positioning block 722 to press the chip, thereby fixing the chip.
In this application, the module housing 77 is further provided with a patch panel 78 for introducing or leading out signals to facilitate connection of a test instrument or provision of a signal source, thereby performing debugging and maintenance.
The application flow of the chip testing module in the chip testing assembly line is as follows:
the chip testing module flows into an empty module transmission line through the material transfer device, flows back to the automatic feeding machine through the empty module transmission line, bears and waits to detect the chip on the automatic feeding machine, then transmits to the auxiliary feeding machine through the module transmission line that awaits measuring, shifts to the tester through the auxiliary feeding machine and tests, the test finishes and puts to the module transmission line that has been tested through the auxiliary feeding machine again, at last transmits to the automatic unloader department, the automatic unloader takes out the chip that has passed through the detection in the chip testing module, collect empty chip testing module, continue to drop into the use of next cycle.
By using the chip testing module of the utility model, the chip is fixed by arranging the mounting plate and the chip positioning mechanism, which is convenient for the subsequent test; meanwhile, the chip positioning mechanism is detachably connected with the mounting plate, so that the chip positioning mechanism is convenient to mount and dismount.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

1. A chip test module for mounting a chip, characterized in that,
the chip testing module comprises a chip mounting plate and a chip positioning mechanism, and the chip mounting plate is detachably connected with the chip positioning mechanism;
a chip pin carrier plate is fixed on the chip mounting plate;
the chip positioning mechanism comprises a chip cavity, a positioning block and a chip locking mechanism;
the chip cavity is provided with a chip mounting groove, and the chip needle support plate is sleeved in the chip mounting groove; one end of the positioning block extends into the chip mounting groove and is abutted with the chip; the chip locking mechanism is arranged at the other end of the positioning block and used for locking the positioning block.
2. The chip testing module according to claim 1, wherein a first magnetic member is further disposed on the chip mounting plate, a second magnetic member is embedded in the chip cavity, and the chip cavity and the chip mounting plate are magnetically attracted to each other through the first magnetic member and the second magnetic member.
3. The chip testing module according to claim 1 or 2, wherein a guide member is further provided on the chip mounting plate, and a guide hole is provided on the chip cavity, and the guide member passes through the guide hole, thereby mounting the chip cavity on the chip mounting plate.
4. The chip testing module according to claim 1, wherein the chip cavity further comprises a positioning member mounting platform, and the positioning member is disposed on the positioning member mounting platform;
the chip mounting groove with one side that setting element installation platform is relative forms the breach, the one end of locating piece is passed through the breach stretches into in the chip mounting groove.
5. The chip testing module of claim 4, wherein the notch is located on a connection line between the center of the chip mounting groove and the center of the positioning member mounting platform, and the length center line of the positioning member coincides with the connection line.
6. The chip testing module of claim 5, wherein an end of the positioning block near the notch includes a first side and a second side that are bifurcated, and the first side and the second side respectively abut against two adjacent sides of the chip;
a clearance groove is further formed at the intersection of the first edge and the second edge;
and the other end of the positioning block upwards forms a bulge.
7. The chip testing module of claim 6, wherein the chip locking mechanism comprises an elastic member disposed at the other end of the positioning block for applying an elastic force to the positioning block; the chip locking mechanism also comprises a cover plate, and the cover plate is covered on the positioning piece mounting platform;
the cover plate is provided with a through groove, and the protrusion penetrates through the through groove.
8. The chip test module of claim 7, further comprising a module housing, the module housing having a hole formed therein;
the chip mounting plate with the chip positioning mechanism hold in the module housing, just the chip positioning mechanism is followed downthehole the exposing.
9. The chip testing module of claim 8, wherein one end of the elastic member is fixed on the inner wall of the hole, and the other end of the elastic member abuts against the positioning block.
10. The chip test module according to claim 8 or 9, wherein an interposer is further provided on the module housing.
CN202021798226.8U 2020-08-24 2020-08-24 Chip test module Active CN214252487U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021798226.8U CN214252487U (en) 2020-08-24 2020-08-24 Chip test module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021798226.8U CN214252487U (en) 2020-08-24 2020-08-24 Chip test module

Publications (1)

Publication Number Publication Date
CN214252487U true CN214252487U (en) 2021-09-21

Family

ID=77714716

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021798226.8U Active CN214252487U (en) 2020-08-24 2020-08-24 Chip test module

Country Status (1)

Country Link
CN (1) CN214252487U (en)

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