CN213987422U

CN213987422U - Bottom exhaust type heat radiation machine case

Info

Publication number: CN213987422U
Application number: CN202120245442.8U
Authority: CN
Inventors: 唐小景; 黄晶; 沈海峰
Original assignee: Wuhan Pansheng Dingcheng Technology Co ltd
Current assignee: Wuhan Pansheng Dingcheng Technology Co ltd
Priority date: 2021-01-28
Filing date: 2021-01-28
Publication date: 2021-08-17
Anticipated expiration: 2031-01-28

Abstract

The utility model discloses a bottom formula of airing exhaust heat dissipation machine case, including set up mainboard subassembly in the box, set up in the first radiator unit of box bottom, set up in first radiator unit with be fixed in wind scooper between the CPU subassembly on the mainboard subassembly, first radiator unit including set up in a plurality of ventilation holes on the box bottom plate, set up in a plurality of first fans of a plurality of ventilation hole tops. In this way, the utility model relates to a rationally, simple structure, through set up the formula of airing exhaust radiator unit in the bottom, form stable wind channel, can dispel the heat to electronic components such as CPU subassembly fast.

Description

Bottom exhaust type heat radiation machine case

Technical Field

The utility model relates to a computer field especially relates to a bottom exhaust type heat dissipation machine case.

Background

With the rapid development of intellectualization, computers have been popularized in various fields, people can not leave the computer in daily work, study and life, and for workers, the computers are kept in a working state for a long time, after the computer is continuously used, all electronic components in a case can dissipate heat, so that the internal temperature rises, the operation of the computers is influenced, the computers are seriously halted or even halted or the internal components are damaged, and therefore, the system which can quickly dissipate heat and cool various components is extremely important to be additionally arranged in the case.

In the prior art, most of the chassis heat dissipation adopts a structural form that a heat dissipation fan and heat dissipation holes are arranged at the top and the side of the chassis, and internal electronic components are dissipated through air circulation flow.

Although the technology can be used for radiating the chassis, the radiating effect is poor, air flows in the box body unsmoothly, and partial gas passing through the electronic components cannot be discharged in time, so that vortex is easily formed to influence the radiating effect.

Therefore, it is necessary to design a bottom exhaust type heat dissipation case which has a simple structure, a stable internal air duct, a small air flow resistance, is not easy to form a vortex, and can dissipate heat of internal electronic components in time.

SUMMERY OF THE UTILITY MODEL

In order to overcome current computer machine case cooling system radiating effect poor, the easy problem that forms the vortex of inside air flow, the utility model provides a bottom exhaust formula heat dissipation machine case, through set up the first radiator unit who comprises the fan in machine bottom end, and from the top down sets up on the mainboard and shows card module and CPU module, be provided with the fresh air inlet on the right side of machine case simultaneously, can form the wind channel heat dissipation, the quick complete discharge of heat with producing, set up the wind scooper simultaneously between CPU module and exhaust area, can reduce wind loss, improve first radiator unit's fan performance, the temperature of CPU module has further been reduced.

In order to achieve the above object, the utility model adopts the following technical scheme:

a bottom exhaust type heat dissipation case comprises a main board assembly arranged in a case body, a first heat dissipation assembly arranged at the bottom end of the case body, and an air guide cover arranged between the first heat dissipation assembly and a CPU assembly fixed on the main board assembly, wherein the first heat dissipation assembly comprises a plurality of first ventilation holes formed in a bottom plate of the case body and a plurality of first fans arranged above the first ventilation holes.

Furthermore, the upper end and the lower end of the air guide cover are respectively provided with a first opening and a second opening, and air flow is sucked from the CPU assembly through the first opening and the second opening so as to dissipate heat of the CPU assembly.

Further, the first opening contacts with the lower end face of the CPU assembly and is matched with the CPU assembly in size.

Furthermore, the second opening is in contact with the upper end face of the first heat dissipation assembly and is matched with the first heat dissipation assembly in size, and the plurality of first fans are located in the second opening.

Furthermore, the mainboard assembly comprises a mainboard and a display card assembly transversely inserted on the mainboard through a PCI interface, and the display card assembly is positioned above the CPU assembly.

Furthermore, the right side of the box body is provided with an air inlet hole.

Further, still be provided with power supply module in the box, just power supply module is located mainboard subassembly's left side is kept away from display card subassembly and CPU subassembly, just power supply module 9 is from its right side air inlet to from its bottom side air-out.

Furthermore, the CPU assembly includes a CPU connected to the motherboard, and a heat sink located outside the CPU, and the heat sink is located above the first opening.

Furthermore, the first fans are all arranged outwards, and air flow of the air guide cover is driven to be discharged outwards.

Furthermore, the bottom of the box body is provided with a foot pad.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a set up the first radiator unit who comprises a plurality of fans side by side in the bottom of box, outside can not only making the air of quick-witted incasement can discharge the box smoothly, the air that can also make the first ventilation hole in bottom expands with certain speed on the ground and scatters, guarantees that outer air of arranging can not follow rear side inlet air hole and get into quick-witted case, forms the vortex.

2. The utility model ensures that the boundary layer separation phenomenon can not occur in the air flowing process by arranging the wind scooper with the curved surface structure, reduces the on-way resistance loss of air flowing, improves the performance of a bottom fan, and further cools the CPU assembly by heat dissipation; the CPU heat radiation component, the wind scooper and the bottom side fan form a unique air channel, under the action of the bottom side fan, the discharged air must pass through the CPU heat radiation fins, and the heat on the heat radiation fins can be taken away quickly.

3. The utility model discloses a be provided with a plurality of fresh air inlets on the box on CPU subassembly right side for cold air can directly get into from this fresh air inlet, the pertinence to the CPU subassembly cooling.

4. The utility model discloses a arrange power supply module in the comparatively gentle region of the air flow of quick-witted case, guaranteed that power fan can bring sufficient air, reduce the temperature of power.

Drawings

FIG. 1 is a schematic view of an axial measurement structure of the present invention;

fig. 2 is a schematic view of another perspective axial structure of the present invention;

FIG. 3 is an air flow diagram of the present invention;

fig. 4 is a partial structure front view of the present invention;

FIG. 5 is an isometric view of a portion of the structure of the present invention;

the parts in the drawings are numbered as follows: 1. a box body; 21. a second vent hole; 22. a second fan; 31. a first vent hole; 32. a first fan; 4. an air outlet; 5. an air inlet hole; 6. a main board; 7. a graphics card assembly; 8. a CPU component; 81. a heat sink; 9. a power supply component; 10. an air guide cover.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the aspects of the present invention are shown in the drawings, and other details not relevant to the present invention are omitted.

In addition, it is also to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Example 1

As shown in fig. 1 to 2, a bottom exhaust type heat dissipation case comprises a main board assembly arranged in a case 1, a first heat dissipation assembly arranged at the bottom end of the case 1, and a ventilation structure arranged between the first heat dissipation assembly and a CPU assembly 8 fixed on the main board assembly, wherein the first heat dissipation assembly comprises a plurality of first ventilation holes 31 arranged on a bottom plate of the case 1, and a plurality of first fans 32 arranged above the first ventilation holes 31, the first heat dissipation assembly not only enables air in the case to be smoothly exhausted out of the case 1, but also enables air in the first ventilation holes 31 at the bottom end to be diffused on the ground at a certain speed, so that the outward-exhausted air is prevented from entering the case from a rear side air inlet hole 5 to form an eddy current.

In this embodiment, the ventilation structure is an air guiding cover 10 with a curved surface structure on the outer side, the upper end and the lower end of the air guiding cover 10 are respectively provided with a first opening and a second opening, air flow is sucked from the CPU component 8 through the first opening and the second opening to dissipate heat of the CPU component 8, and meanwhile, it is ensured that no boundary layer separation phenomenon occurs when air flows along the air guiding cover 10.

In this embodiment, the first opening contacts with the lower end surface of the CPU component 8 and is matched with the CPU component 8 in size, so that the first opening of the wind scooper 10 can guide more airflow flowing through the CPU component 8 into the wind scooper 10.

In this embodiment, the second opening contacts with the upper end surface of the first heat sink and is matched with the first heat sink in size, so that more air flow passing through the CPU assembly 8 can be guided through the second opening and then exhausted through the first heat sink, and the plurality of first fans 32 are located in the second opening.

In this embodiment, the motherboard assembly includes a motherboard 6 and a graphics card assembly 7 transversely inserted into the motherboard 6 through a PCI interface, and the graphics card assembly 7 is located above the CPU assembly 8, so that the airflow flowing through the graphics card assembly can act on the CPU assembly 8 again and then be exhausted through the air guiding cover 10.

As shown in fig. 3, in the present embodiment, an air inlet 5 is disposed at the right side of the box body 1, and forms a stable air duct with the first heat dissipation assembly.

In this embodiment, a power supply assembly 9 is further disposed in the box body 1, and the power supply assembly 9 is located on the left side of the main board 6 assembly and is far away from the graphics card assembly 7 and the CPU assembly 8, so that the power supply assembly 9 is located in an area where air flow in the box body 1 is relatively gentle, a fan of the power supply assembly 9 is ensured to bring sufficient air, and the temperature of the power supply assembly 9 is reduced; and the power supply assembly 9 is supplied with air from the right side thereof and is discharged with air from the bottom side thereof.

As shown in fig. 4 to 5, in this embodiment, the CPU assembly 8 includes a CPU connected to the motherboard 6, and a heat sink 81 located on an end surface of the CPU, where the heat sink 81 is located above the first opening, so as to better dissipate heat of the CPU assembly 8.

In this embodiment, the first fans 32 are all disposed in an outward direction to drive the airflow of the wind scooper 10 to be discharged outward.

In this embodiment, the bottom of the case 1 is provided with a foot pad to facilitate the air flow to be discharged from the first ventilation hole 31.

Example 2

When another embodiment is adopted, a second heat dissipation assembly corresponding to the first heat dissipation assembly can be arranged at the top end of the box body 1, and the second heat dissipation assembly comprises a plurality of second ventilation holes 21 arranged on the top plate of the box body 1 and a plurality of second fans 22 arranged below the second ventilation holes 21, so that air around the top end can enter the case more easily, the local resistance loss of the air passing through the second ventilation holes 21 at the top end is reduced, and the air flows more smoothly; and the display card assembly 7 is positioned below the second heat dissipation assembly, so that the resistance of the display card fan is reduced, and the heat dissipation performance of the display card assembly 7 is obviously improved.

In this embodiment, the right side of box 1 just corresponds to CPU subassembly 8 department sets up fresh air inlet 5, and the right side of box 1 just corresponds to graphics card subassembly 7 department is provided with exhaust vent 4 for it forms two independent wind channels to graphics card subassembly 7 and CPU subassembly 8, improves graphics card subassembly 7 and CPU subassembly 8's radiating effect.

In this embodiment, the cool air of the CPU module 8 comes not only from the air flow entering from the air inlet 5 but also from the air flow entering from the left side of the graphics card module 7.

The above description is only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings of the utility model, or the direct or indirect application in other related technical fields, are included in the patent protection scope of the utility model.

Claims

1. The bottom exhaust type heat dissipation case is characterized by comprising a main board assembly arranged in a case body (1), a first heat dissipation assembly arranged at the bottom end of the case body (1) and an air guide cover (10) arranged between the first heat dissipation assembly and a CPU assembly (8) fixed on the main board assembly, wherein the first heat dissipation assembly comprises a plurality of first ventilation holes (31) formed in a bottom plate of the case body (1) and a plurality of first fans (32) arranged above the first ventilation holes (31).

2. The chassis with bottom-exhaust heat dissipation according to claim 1, wherein the wind scooper (10) has a first opening and a second opening at its upper and lower ends, respectively, and the first opening and the second opening draw the airflow from the CPU module (8) to dissipate the heat of the CPU module (8).

3. The bottom-vented heat sink chassis of claim 2, wherein the first opening contacts a lower end surface of the CPU component (8) and is sized to fit the CPU component (8).

4. The chassis of claim 3, wherein the second opening contacts the top surface of the first heat sink and is sized to fit the first heat sink, and a plurality of the first fans (32) are disposed in the second opening.

5. The chassis with bottom-vented heat dissipation of claim 1, wherein the motherboard assembly comprises a motherboard (6) and a graphics card assembly (7) transversely plugged onto the motherboard (6) through a PCI interface, and the graphics card assembly (7) is located above the CPU assembly (8).

6. The bottom-exhaust heat-dissipation case of claim 5, wherein the right side of the case body (1) is provided with an air inlet hole (5).

7. The bottom-exhaust heat-dissipation case according to claim 6, wherein a power supply component (9) is further disposed in the case (1), and the power supply component (9) is located on the left side of the motherboard component, away from the graphics card component (7) and the CPU component (8), and the power supply component (9) is used for supplying air from the right side and discharging air from the bottom side.

8. The bottom-vented heat sink enclosure of claim 2, wherein the CPU assembly (8) comprises a CPU connected to the motherboard (6), a heat sink (81) located outside the CPU, and the heat sink (81) is located above the first opening.

9. The bottom-exhaust heat-dissipation case of claim 8, wherein the first fans (32) are disposed outward to drive the airflow of the wind scooper (10) to be exhausted outward.

10. A bottom-vented heat sink case as claimed in any one of claims 1 to 9, wherein the bottom of the case (1) is provided with foot pads.