CN213519889U

CN213519889U - Novel BGA ball mounting equipment

Info

Publication number: CN213519889U
Application number: CN202022921461.6U
Authority: CN
Inventors: 梁春伟; 闻权
Original assignee: Shenzhen Zhuo Mao Technology Co ltd
Current assignee: Shenzhen Zhuo Mao Technology Co ltd
Priority date: 2020-12-08
Filing date: 2020-12-08
Publication date: 2021-06-22
Anticipated expiration: 2030-12-08

Abstract

The utility model discloses a novel BGA ball planting device, which comprises a feeding device, a point soldering paste device arranged above the feeding device, a transfer device arranged close to the point soldering paste device, and a ball planting device arranged at one end of the feeding device; the feeding device comprises a first translation mechanism and a plurality of second translation mechanisms which are arranged perpendicular to the first translation mechanism and are in driving connection with the first translation mechanism; each second translation mechanism is also connected with a jig limiting mechanism in a driving mode, and the jig limiting mechanism is used for bearing a jig support plate provided with the BGA and limiting and fixing the jig support plate. The utility model discloses collect loading attachment, some help the soldering paste device and plant ball device in an organic whole, can realize BGA's automatic loading, some help the soldering paste and implant a whole set of processes such as tin ball, intensity of automation is high, and work efficiency is high, and equipment overall design is reasonable, compact structure, area is little, the cost of labor is low, plant ball efficient, the practicality is strong.

Description

Novel BGA ball mounting equipment

Technical Field

The utility model relates to a BGA plants ball technical field, especially relates to a novel BGA plants ball equipment.

Background

With the rapid development of electronic technology, the requirement for the repair quality of electronic chips is higher and higher. For example, the BGA chip can be reused after being detached, but the solder balls on the bottom of the BGA chip are damaged to different degrees after the BGA chip is detached, so the BGA chip can be used again after re-melting the solder balls.

The BGA repairing ball planting method includes setting BGA onto corresponding base board, brushing soldering flux on the surface of the soldering pad, covering the corresponding metal template onto the base board, leaking soldering balls of corresponding specification onto the soldering pad of the BGA base board, and reflowing the soldering balls to complete ball planting. The ball planting method has the following disadvantages;

1) the ball planting mode of manually brushing the soldering paste is adopted, so that great difference exists, and the risk of tin connection is easy to occur during ball melting;

2) the repair efficiency is low, and the repair success rate cannot be ensured;

3) the uniformity of the paste cannot be ensured, the ball planting effect and the neatness of the bonding pad are affected, and a subsequent cleaning procedure is required;

4) the automation degree is low, the error in production work is large, and the working quality is low;

5) the positioning precision is low, the efficiency is low, and the mounting adaptability to various BGA chips and various specifications is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a novel BGA plants ball equipment, this equipment collect loading attachment, some help the soldering paste device and plant ball device in an organic whole, can realize BGA's automatic loading, some help the soldering paste and implant a whole set of processes such as tin ball, and intensity of automation is high, and work efficiency is high, and equipment overall design is reasonable, compact structure, area is little, the cost of labor is low, plant ball efficient, the practicality is strong.

In order to realize the purpose, the following technical scheme is adopted:

a novel BGA ball planting device comprises a feeding device, a point soldering paste device arranged above the feeding device, a transfer device arranged close to the point soldering paste device, and a ball planting device arranged at one end of the feeding device; the feeding device comprises a first translation mechanism and a plurality of second translation mechanisms which are arranged perpendicular to the first translation mechanism and are in driving connection with the first translation mechanism; each second translation mechanism is also connected with a jig limiting mechanism in a driving mode, and the jig limiting mechanism is used for bearing a jig support plate provided with the BGA and limiting and fixing the jig support plate.

Furthermore, the jig limiting mechanism comprises a first sliding seat in driving connection with the second translation mechanism, a first rotating mechanism arranged on the first sliding seat along the length direction of the second translation mechanism, and a bearing plate in driving connection with the first rotating mechanism and used for placing the jig carrier plate; the bearing plate is also provided with a plurality of first vacuum adsorption mechanisms and a limiting and fixing mechanism for limiting and fixing the jig carrier plate.

Furthermore, the limiting and fixing mechanism comprises a plurality of limiting columns and a first limiting cylinder; a plurality of limiting columns are arranged on the top of one adjacent two sides of the bearing plate at intervals in the length direction, and the first limiting cylinder is arranged at the junction of the other adjacent two sides of the bearing plate; first spacing cylinder still the drive is connected with first limiting plate, and the spacing breach of "V" style of calligraphy still is seted up to the one end that first limiting plate is close to the loading board.

Furthermore, the point soldering paste dispensing device comprises a first lifting mechanism arranged above one end of one of the second translation mechanisms, a first lifting seat in driving connection with the first lifting mechanism, and a visual positioning mechanism and a soldering paste dispensing mechanism which are arranged on the first lifting seat; the paste flux dispensing mechanism comprises a tin outlet cylinder and a piezoelectric valve, wherein the tin outlet cylinder is arranged on the first lifting seat.

Further, the transfer device comprises a third translation mechanism arranged above one side of the first translation mechanism in parallel, a second lifting mechanism arranged perpendicular to the third translation mechanism and in driving connection with one side of the second translation mechanism, and a suction nozzle mechanism which is arranged on the second lifting mechanism and used for transferring the jig carrier plate.

Furthermore, the ball planting device comprises a ball planting frame arranged at one end of the first translation mechanism, a third lifting mechanism obliquely arranged on one side of the ball planting frame, a second lifting seat in driving connection with the third lifting mechanism, and a ball planting mechanism arranged on the second lifting seat; and the second lifting seat is also provided with a brush mechanism, and the brush mechanism is positioned above the ball planting mechanism.

Further, the ball planting mechanism comprises a ball planting seat arranged on the second lifting seat; the top of the ball planting seat is provided with a first through hole, and the bottom of the ball planting seat is also provided with a second vacuum adsorption mechanism for adsorbing and fixing a steel mesh; a steel mesh protection mechanism is further mounted on one side of the planting ball seat and comprises a second limiting cylinder, a second limiting plate and a first push plate in driving connection with the second limiting cylinder; one end of the second limiting plate is hinged with the end part of the first push plate, and the other end of the second limiting plate extends towards the lower part of the steel mesh; the middle part of the second limiting plate is hinged to one side of the ball planting seat, and the second limiting cylinder is used for driving the second limiting plate to rotate through the first push plate, so that one end of the second limiting plate is close to or far away from the lower part of the steel mesh.

Furthermore, the brush mechanism comprises a fourth lifting mechanism arranged on the second lifting seat, a fourth translation mechanism arranged perpendicular to the fourth lifting mechanism and in driving connection with the fourth lifting mechanism, and an anti-static brush module which is in driving connection with the fourth translation mechanism and is positioned above the first through hole.

Furthermore, an ion fan is further installed on the ball planting frame and is located above the brush mechanism.

Further, novel BGA plants ball equipment and still includes visual inspection mechanism, and visual inspection mechanism is close to and plants the top that the ball device arranged and was located loading attachment.

Adopt above-mentioned scheme, the beneficial effects of the utility model are that:

1) the equipment has high automation degree, can realize a whole set of procedures of BGA automatic feeding, point soldering paste, tin ball implantation and the like, is provided with two working modes of parallel connection and series connection for users to freely select according to actual requirements, and has strong universality;

2) through the mutual matching of the visual positioning mechanism and the high-speed piezoelectric valve, the flux paste can be accurately sprayed at a high speed, the ball planting accuracy is effectively improved, and the risk of ball connection during ball melting is avoided;

3) the bearing plate is provided with a plurality of first vacuum adsorption mechanisms, so that the jig bearing plate and the steel mesh can be adsorbed and fixed, the placing stability of the jig bearing plate and the steel mesh in the ball planting process is ensured, and the ball planting precision is improved;

4) the first translation mechanism, the second translation mechanism and the first rotation mechanism are matched with each other to drive the jig carrier plate to do double-shaft and rotary motion, so that the solder balls fall to corresponding positions of the bonding pads through each hole of the steel mesh, and the working efficiency is improved;

5) the visual detection mechanism is arranged, so that the BGA after ball mounting can be automatically detected to judge whether the ball mounting is qualified, the method is simple and convenient, and the manual detection cost can be reduced;

6) be equipped with spacing fixed establishment, be applicable to the spacing of the BGA of different specifications and type fixed, the commonality is strong.

Drawings

Fig. 1 is a perspective view of the present invention;

fig. 2 is a perspective view of the feeding device of the present invention;

fig. 3 is a perspective view of the jig limiting mechanism of the present invention;

fig. 4 is a perspective view of the spot flux paste dispensing device of the present invention;

fig. 5 is a perspective view of the transfer device of the present invention;

fig. 6 is a perspective view of the ball mounting device of the present invention;

FIG. 7 is an enlarged view of a portion of FIG. 6A;

wherein the figures identify the description:

1-a feeding device; 2-point soldering paste device;

3-a transfer device; 4-ball planting device;

5-ion fan; 6-visual inspection mechanism;

7, mounting a platform; 8, a steel mesh;

11 — a first translation mechanism; 12-a second translation mechanism;

13-a jig limiting mechanism; 14-a jig carrier plate;

21-a first lifting mechanism; 22-a first lifting seat;

23-a visual positioning mechanism; 24-discharging the tin cylinder;

25-a piezoelectric valve; 31 — a third translation mechanism;

32-a second lifting mechanism; 33-a suction nozzle mechanism;

41-planting ball rack; 42-a third lifting mechanism;

43-a second lifting seat; 44-a ball planting mechanism;

45-brush means; 131-a first sliding seat;

132 — a first rotation mechanism; 133-a carrier plate;

134-a first vacuum adsorption mechanism; 135-a limit fixing mechanism;

441-planting a ball seat; 442-a second vacuum adsorption mechanism;

443-a second limit cylinder; 444-second limiting plate;

445 — first push plate; 451-fourth lifting mechanism;

452 — a fourth translation mechanism; 453-antistatic brush module;

1351, a limiting column; 1352, a first limit cylinder;

1353, a first limit plate.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 to 7, the utility model provides a novel BGA ball-planting device, which comprises a feeding device 1, a point soldering paste assisting device 2 arranged above the feeding device 1, a transfer device 3 arranged near the point soldering paste assisting device 2, and a ball-planting device 4 arranged at one end of the feeding device 1; the feeding device 1 comprises a first translation mechanism 11 and a plurality of second translation mechanisms 12 which are arranged perpendicular to the first translation mechanism 11 and are in driving connection with the first translation mechanism 11; each second translation mechanism 12 is also connected with a jig limiting mechanism 13 in a driving manner, and the jig limiting mechanism 13 is used for bearing a jig carrier plate 14 provided with BGA and limiting and fixing the jig carrier plate 14.

The jig limiting mechanism 13 includes a first sliding seat 131 drivingly connected to the second translating mechanism 12, a first rotating mechanism 132 mounted on the first sliding seat 131 along the length direction of the second translating mechanism 12, and a carrier plate 133 drivingly connected to the first rotating mechanism 132 for placing the jig carrier plate 14; the bearing plate 133 is further provided with a plurality of first vacuum adsorption mechanisms 134 and a limiting and fixing mechanism 135 for limiting and fixing the jig carrier plate 14; the limiting fixing mechanism 135 comprises a plurality of limiting columns 1351 and a first limiting cylinder 1352; a plurality of limiting columns 1351 are arranged on the top of one adjacent two sides of the bearing plate 133 at intervals in the length direction, and a first limiting cylinder 1352 is arranged at the junction of the other adjacent two sides of the bearing plate 133; the first limiting cylinder 1352 is also in driving connection with a first limiting plate 1353, and one end of the first limiting plate 1353, which is close to the bearing plate 133, is also provided with a V-shaped limiting notch; the paste dispensing device 2 comprises a first lifting mechanism 21 arranged above one end of one of the second translation mechanisms 12, a first lifting seat 22 in driving connection with the first lifting mechanism 21, and a visual positioning mechanism 23 and a paste dispensing mechanism for dispensing paste, which are arranged on the first lifting seat 22; the paste dispensing mechanism comprises a tin outlet cylinder 24 mounted on the first lifting seat 22, and a piezoelectric valve 25.

The transfer device 3 comprises a third translation mechanism 31 which is arranged above one side of the first translation mechanism 11 in parallel, a second lifting mechanism 32 which is arranged perpendicular to the third translation mechanism 31 and is in driving connection with one side of the third translation mechanism, and a suction nozzle mechanism 33 which is arranged on the second lifting mechanism 32 and is used for transferring the jig carrier plate 14; the ball planting device 4 comprises a ball planting frame 41 arranged at one end of the first translation mechanism 11, a third lifting mechanism 42 obliquely arranged at one side of the ball planting frame 41, a second lifting seat 43 in driving connection with the third lifting mechanism 42, and a ball planting mechanism 44 installed on the second lifting seat 43; the second lifting seat 43 is further provided with a brush mechanism 45, and the brush mechanism 45 is positioned above the ball planting mechanism 44; the ball-planting mechanism 44 includes a ball-planting seat 441 mounted on the second elevating seat 43; the top of the ball planting seat 441 is provided with a first through hole, and the bottom of the ball planting seat 441 is further provided with a second vacuum adsorption mechanism 442 for adsorbing and fixing the steel mesh 8; a steel mesh protection mechanism is further mounted on one side of the planting ball seat 441 and comprises a second limiting cylinder 443, a second limiting plate 444 and a first push plate 445 in driving connection with the second limiting cylinder 443; one end of the second limit plate 444 is hinged with the end of the first push plate 445, and the other end of the second limit plate 444 extends towards the lower part of the steel mesh 8; the middle part of the second limit plate 444 is also hinged to one side of the tee-planting base 441, and the second limit cylinder 443 is used for driving the second limit plate 444 to rotate through the first push plate 445, so that one end of the second limit plate 444 is close to or far away from the lower part of the steel mesh 8.

The brush mechanism 45 comprises a fourth lifting mechanism 451 mounted on the second lifting seat 43, a fourth translation mechanism 452 arranged perpendicular to the fourth lifting mechanism 451 and in driving connection therewith, and an anti-static brush module 453 in driving connection with the fourth translation mechanism 452 and above the first through hole; the ball planting frame 41 is also provided with an ion fan 5, and the ion fan 5 is positioned above the brush mechanism 45; novel BGA plants ball equipment and still includes visual inspection mechanism 6, and visual inspection mechanism 6 is close to and plants ball device 4 and arrange and be located loading attachment 1's top.

The utility model discloses the theory of operation:

with continued reference to fig. 1 to 7, the ball-planting equipment further comprises a frame, wherein an installation platform 7 is further arranged in the frame, and the feeding device 1, the point soldering paste device 2, the transfer device 3 and the ball-planting device 4 are uniformly arranged on the installation platform 7; the top of the frame is provided with a three-color indicator lamp, the bottom of the frame is provided with a caster foot cup, and one side of the frame is also provided with a computer; as shown in fig. 1, in one embodiment, two second translation mechanisms 12 and two jig limiting mechanisms 13 are provided, and the two second translation mechanisms 12 are arranged in parallel at intervals and are suitable for a parallel operation mode, that is, one of the jig limiting mechanisms 13 is used for placing a jig carrier 14 (the jig carrier 14 is loaded with a BGA for loading), the point soldering paste device 2 is arranged above the jig limiting mechanism 13 and is used for spraying the soldering paste onto the BGA, and then the transfer device 3 transfers the jig carrier 14 to the other jig limiting mechanism 13, when the ball-planting device 4 performs ball-planting operation on the BGA on the jig limiting mechanism 13, the original jig limiting mechanism 13 can be loaded again, the two mechanisms are independent and do not interfere with each other, thereby realizing parallel operation of two stations and high operation efficiency; in addition, in another embodiment, the second translation mechanism 12 and the jig limiting mechanism 13 are respectively arranged in one, so that the device is suitable for a serial working mode, the point soldering paste and the ball planting work are sequentially and serially operated, the device is suitable for a miniaturized production line, the user can freely select the two working modes of parallel connection and serial connection according to actual requirements, and the universality is high; the working principle of the parallel working mode is similar to that of the series working mode, and the parallel working mode is mainly used for detailed principle explanation:

feeding device 1: as shown in fig. 2 to 3, the feeding device 1 includes two second translation mechanisms 12 and two jig limiting mechanisms 13, wherein each of the first translation mechanism 11 and the second translation mechanism 12 may include a first linear motor module and an organ cover mounted on the first linear motor module, which is not limited herein; the first sliding seat 131 of the jig limiting mechanism 13 is in driving connection with the second translation mechanism 12, and the first sliding seat 131 can be driven to do biaxial translation motion through the mutual matching of the first translation mechanism 11 and the second translation mechanism 12, so that the soldering paste can be fed and dispensed conveniently; the jig carrier plate 14 is provided with a limiting cassette for loading the BGA, and two ends of the limiting cassette are respectively provided with a second through hole; two first vacuum adsorption mechanisms 134 (the first vacuum adsorption mechanisms 134 include first adsorption holes and a vacuum pump) are installed on the carrier plate 133, wherein one of the first vacuum adsorption mechanisms 134 is used for adsorbing and fixing the jig carrier plate 14 on the carrier plate 133 so as to preliminarily adsorb and fix the carrier plate, and the other first vacuum adsorption mechanism 134 is located below the two second through holes and is used for adsorbing and fixing the steel mesh 8 of the ball planting device 4 on the jig carrier plate 14 when the ball planting device 4 plants balls (solder balls) so that the solder balls fall to the corresponding positions of the pads through each hole of the steel mesh 8; after the jig carrier plate 14 is placed on the carrier plate 133, the first limiting cylinder 1352 of the limiting and fixing mechanism 135 drives the first limiting plate 1353 to extend out, a V-shaped limiting notch of the first limiting plate 1353 clamps one corner of the jig carrier plate 14, and the edge of the side portion of the jig carrier plate 14 is driven by the first limiting cylinder 1352 to abut against the limiting post 1351, so that the jig carrier plate 14 can be further limited and fixed, and the soldering paste pointing device 2 can conveniently point soldering paste on a pad of the BGA; the first sliding seat 131 is further provided with a first rotating mechanism 132, the first rotating mechanism 132 includes a rotary servo motor, a resonant speed reducer, and a rotating shaft, and can drive the bearing plate 133 to swing left and right (within a range of plus or minus 25 °), so as to adjust the inclination angle of the bearing plate 133, and facilitate the ball-planting device 4 to attach the steel mesh 8 to the surface of the bearing plate 133.

And (3) dispensing solder paste device 2: the point soldering paste device 2 is arranged above one end of one of the second translation mechanisms 12, and when the jig limiting mechanism 13 on the second translation mechanism 12 limits and fixes the jig carrier plate 14 (loaded with BGA), the jig limiting mechanism 13 is driven to drive the jig carrier plate 14 to move to the lower part of the point soldering paste device 2, so that the point soldering paste work is carried out; the method specifically comprises the following steps: firstly, the second translation mechanism 12 drives the jig carrier plate 14 to move to the lower part of the visual positioning mechanism 23 (including a CCD camera for photographing and positioning, which adopts a diagonal positioning mode to accurately position and compensate angle offset) for positioning, then the jig carrier plate 14 moves to the lower part of the tin outlet cylinder 24, the first lifting mechanism 21 (including a second linear motor module) drives the paste assistant dispensing mechanism to descend, and finally, the paste assistant is sprayed onto the BGA bonding pad under the driving of the piezoelectric valve 25; through the mutual cooperation of CCD camera location and high-speed piezoelectric valve 25, can realize high-speed accurate the jetting and help the soldering paste, effectively improve the ball precision of planting, appear the risk of even ball when avoiding melting the ball.

Transfer device 3: after the solder paste dispensing operation is completed, the transfer device 3 transfers the jig carrier 14 to another jig limiting mechanism 13, so that the ball implanting device 4 implants the solder balls; the third translation mechanism 31 of the transfer device 3 comprises a third linear motor module, the second lifting mechanism 32 comprises a transfer lifting cylinder, and the suction nozzle mechanism 33 is in driving connection with the transfer lifting cylinder; under the mutual cooperation of the third moving mechanism 31 and the second lifting mechanism 32, the suction nozzle mechanism 33 realizes the rapid moving and loading of the jig carrier plate 14, thereby improving the working efficiency.

Ball planting device 4: after a jig limiting mechanism 13 arranged close to the ball planting device 4 receives a jig carrier plate 14 transferred by the transfer device 3, the jig limiting mechanism 13 immediately limits and fixes the jig carrier plate 14 and translates the jig carrier plate to the lower part (ball planting station) of the ball planting device 4; the first rotating mechanism 132 of the jig limiting mechanism 13 drives the jig carrier 14 to rotate to a predetermined angle, so that the angle of the jig carrier is consistent with that of the ball-planting mechanism 44, and then the third lifting mechanism 42 (including the fourth linear motor module) drives the ball-planting mechanism 44 (a plurality of solder balls corresponding to the BGA type are pre-placed in the first through-hole steel mesh 8 of the ball-planting mechanism 44) to descend, so that the ball-planting seats 441 of the ball-planting mechanism 44 are positioned and attached to the jig carrier 14; subsequently, the second vacuum suction mechanism 442 (including the vacuum suction hole and the vacuum pump) is turned off, the second limiting cylinder 443 of the steel mesh protection mechanism drives the second limiting plate 444 to be away from the lower side of the steel mesh 8, and at this time, the steel mesh 8 falls to be attached to the surface of the BGA (the first vacuum suction mechanism 134 sucks the steel mesh 8); then, the third lifting mechanism 42 drives the ball-mounting mechanism 44 to ascend to a safe distance, and the jig carrier 14 is driven by the first translation mechanism 11, the second translation mechanism 12 and the first rotation mechanism 132 to perform multi-dimensional biaxial and rotational motions, so that the solder balls fall to corresponding positions of the pads through each hole of the steel mesh 8; subsequently, the jig carrier 14 is reset, the inclination angle of the jig carrier is consistent with that of the ball planting mechanism 44, the third lifting mechanism 42 drives the ball planting mechanism 44 to descend, so that the ball planting base 441 is attached to the steel mesh 8, then the fourth lifting mechanism 451 (including a lifting cylinder) drives the fourth translation mechanism 452 to drive the anti-static brush module 453 to descend into the first through hole, and the fourth translation mechanism 452 (including a translation cylinder) drives the anti-static brush module 453 to move horizontally left and right, so that the solder balls on the steel mesh 8 are swept to one side thereof; subsequently, the second vacuum suction mechanism 442 is turned on (the first vacuum suction mechanism 134 is turned off) to suck the steel mesh 8, and the second limit cylinder 443 drives the second limit plate 444 to rotate below the steel mesh 8 to prevent the steel mesh from falling off; finally, the third lifting mechanism 42 drives the ball planting seat 441 to drive the steel mesh 8 to return to the starting point, thereby completing the ball planting work; in addition, the ball-planting frame 41 is also provided with an ion fan 5, and the ion fan 5 has a function of static elimination, so that static electricity can be further avoided during ball-planting work; simultaneously, this equipment of planting the ball still is equipped with visual detection mechanism 6 (including elevator motor to and install the CCD camera on elevator motor), can carry out automated inspection to the BGA after planting the ball, in order to judge whether qualified, simple and convenient, degree of automation is high planting the ball.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A novel BGA ball-planting device is characterized by comprising a feeding device, a point soldering paste assisting device arranged above the feeding device, a transfer device arranged close to the point soldering paste assisting device, and a ball-planting device arranged at one end of the feeding device; the feeding device comprises a first translation mechanism and a plurality of second translation mechanisms which are arranged perpendicular to the first translation mechanism and are in driving connection with the first translation mechanism; each second translation mechanism is also connected with a jig limiting mechanism in a driving mode, and the jig limiting mechanism is used for bearing a jig support plate provided with the BGA and limiting and fixing the jig support plate.

2. The BGA ball mounting device of claim 1, wherein the jig limiting mechanism comprises a first sliding seat in driving connection with the second translation mechanism, a first rotating mechanism mounted on the first sliding seat along the length direction of the second translation mechanism, and a carrier plate in driving connection with the first rotating mechanism for placing the jig carrier plate; the bearing plate is also provided with a plurality of first vacuum adsorption mechanisms and a limiting and fixing mechanism for limiting and fixing the jig carrier plate.

3. The novel BGA ball mounting device of claim 2, wherein the position limiting fixing mechanism comprises a plurality of position limiting columns, a first position limiting cylinder; a plurality of limiting columns are arranged on the top of one adjacent two sides of the bearing plate at intervals in the length direction, and the first limiting cylinder is arranged at the junction of the other adjacent two sides of the bearing plate; first spacing cylinder still the drive is connected with first limiting plate, and the spacing breach of "V" style of calligraphy still is seted up to the one end that first limiting plate is close to the loading board.

4. The BGA ball mounting apparatus of claim 1, wherein the paste dispensing device comprises a first elevating mechanism disposed above one end of a second translation mechanism, a first elevating base drivingly connected to the first elevating mechanism, and a visual positioning mechanism and a paste dispensing mechanism mounted on the first elevating base; the paste flux dispensing mechanism comprises a tin outlet cylinder and a piezoelectric valve, wherein the tin outlet cylinder is arranged on the first lifting seat.

5. The BGA ball mounting apparatus of claim 1, wherein the transfer device includes a third translation mechanism disposed parallel to the first translation mechanism above one side thereof, a second lifting mechanism disposed perpendicular to the third translation mechanism and drivingly connected to one side thereof, and a nozzle mechanism mounted on the second lifting mechanism for transferring the jig carrier.

6. The BGA ball mounting device of claim 1, wherein the ball mounting device includes a ball mounting frame disposed at one end of the first translation mechanism, a third lifting mechanism disposed at one side of the ball mounting frame in an inclined manner, a second lifting base in driving connection with the third lifting mechanism, and a ball mounting mechanism mounted on the second lifting base; and the second lifting seat is also provided with a brush mechanism, and the brush mechanism is positioned above the ball planting mechanism.

7. The BGA ball mounting device of claim 6, wherein the ball mounting mechanism includes a ball mounting base mounted on the second lift base; the top of the ball planting seat is provided with a first through hole, and the bottom of the ball planting seat is also provided with a second vacuum adsorption mechanism for adsorbing and fixing a steel mesh; a steel mesh protection mechanism is further mounted on one side of the planting ball seat and comprises a second limiting cylinder, a second limiting plate and a first push plate in driving connection with the second limiting cylinder; one end of the second limiting plate is hinged with the end part of the first push plate, and the other end of the second limiting plate extends towards the lower part of the steel mesh; the middle part of the second limiting plate is hinged to one side of the ball planting seat, and the second limiting cylinder is used for driving the second limiting plate to rotate through the first push plate, so that one end of the second limiting plate is close to or far away from the lower part of the steel mesh.

8. The BGA ball mounting apparatus of claim 7, wherein the brush mechanism includes a fourth elevating mechanism mounted on the second elevating base, a fourth translating mechanism disposed perpendicular to and in driving connection with the fourth elevating mechanism, and an anti-static brush module in driving connection with the fourth translating mechanism and located above the first through hole.

9. The BGA ball mounting device of claim 8, wherein an ion fan is further mounted on the ball mounting frame and located above the brush mechanism.

10. The novel BGA ball mounting device of claim 1, further comprising a vision inspection mechanism, wherein the vision inspection mechanism is disposed near the ball mounting device and above the loading device.