CN213276237U - Heat dissipation module and projection device - Google Patents

Abstract

The utility model provides a heat radiation module for a projection arrangement, heat radiation module include a heat conduction piece, an insulating piece, a heat radiation structure, an at least first lock annex, an at least second lock annex and an insulating cover group. The heat conducting piece is arranged on a seat body of the projection device and is connected with a light valve of the projection device. The heat insulating member covers and is fixed to a part of the heat conductive member. The heat dissipation structure is configured on the heat conducting piece. At least one first locking accessory penetrates through the heat insulation piece and is locked and attached to the seat body. At least one second locking member passes through the heat dissipation structure and is locked to the heat conduction member. The heat insulation coating set coats the at least one first locking accessory, the at least one second locking accessory, the heat insulation piece, part of the heat conduction piece, part of the heat dissipation structure and part of the seat body. In addition, a projection device is disclosed, which comprises the heat dissipation module. The utility model discloses a heat insulation cladding group can reduce the probability that the component of heat radiation module takes place the dewfall, and reducible light valve takes place because of the impaired condition of dew.

Description

Heat dissipation module and projection device

Technical Field

The present invention relates to a heat dissipation module and an optical device, and more particularly to a heat dissipation module and a projection device.

Background

A projection device is a display device for forming an image. The projection device has an imaging principle that an illumination beam generated by a light source is converted into an image beam by a light valve, and the image beam is projected onto a screen or a wall through a lens to form an image.

Since the light valve of the projection apparatus generates heat during operation, a heat dissipation module is required to be disposed in the projection apparatus to dissipate the heat of the light valve. A heat-dissipating module is configured by contacting a light valve with a heat-conducting member, cooling the heat-conducting member with a cooling chip, and removing heat from the cooling chip with a water-cooling heat-dissipating unit. In order to avoid the undesirable cooling of the components other than the thermal conductor by the chill plate, the thermal conductor is typically covered with an insulating member. However, the temperature of the locking parts for fixing the above elements is still lower than the external temperature, and the relatively low temperature locking parts exchange heat with the relatively high temperature air in the environment, so that dew condensation may occur on the surfaces of the locking parts, and the dew contact with the light valve may cause damage to the light valve.

The background section is only provided to aid in understanding the present invention, and therefore the disclosure in the background section may include some prior art that does not constitute a part of the knowledge of those skilled in the art. The disclosure in the "background" section does not represent that matter or the problems which may be solved by one or more embodiments of the present invention are known or appreciated by those skilled in the art prior to the filing of the present application.

SUMMERY OF THE UTILITY MODEL

The utility model provides a heat radiation module, its lock annex can have the lower probability of taking place the dewfall.

The utility model provides a projection device has foretell heat dissipation module.

Other objects and advantages of the present invention can be obtained from the technical features disclosed in the present invention.

In order to achieve one or a part of or all of the above or other objects, an embodiment of the present invention provides a heat dissipation module for a projection apparatus, the heat dissipation module including a heat conducting member, an insulating member, a heat dissipation structure, at least one first locking member, at least one second locking member, and an insulating cover member. The heat conducting piece is arranged on a seat body of the projection device and is connected with a light valve of the projection device. The heat insulating member covers and is fixed to a part of the heat conductive member. The heat dissipation structure is configured on the heat conducting piece. At least one first locking accessory penetrates through the heat insulation piece and is locked and attached to the seat body. At least one second locking member passes through the heat dissipation structure and is locked to the heat conduction member. The heat insulation coating set coats the at least one first locking accessory, the at least one second locking accessory, the heat insulation piece, part of the heat conduction piece, part of the heat dissipation structure and part of the seat body.

In order to achieve one or a part of or all of the above or other objectives, an embodiment of the present invention provides a projection apparatus, which includes a light source, a light valve, a base, a heat dissipation module, and a lens. The light source is used for emitting an illumination light beam. The light valve is disposed on the transmission path of the illumination beam and is used for converting the illumination beam into an image beam. The heat dissipation module comprises a heat conduction piece, an insulating piece, a heat dissipation structure, at least one first locking accessory, at least one second locking accessory and an insulating covering piece group. The heat conducting element is arranged on the seat body and connected with the light valve. The heat insulating member covers and is fixed to a part of the heat conductive member. The heat dissipation structure is configured on the heat conducting piece. At least one first locking accessory penetrates through the heat insulation piece and is locked and attached to the seat body. At least one second locking member passes through the heat dissipation structure and is locked to the heat conduction member. The heat insulation coating set coats the at least one first locking accessory, the at least one second locking accessory, the heat insulation piece, part of the heat conduction piece, part of the heat dissipation structure and part of the seat body. The lens is configured on the transmission path of the image light beam and is used for projecting the image light beam to the outside of the projection device.

Based on the above, the embodiments of the present invention have at least one of the following advantages or effects. The utility model discloses a heat radiation module utilizes adiabatic cladding group cladding at least one first lock annex, an at least second lock annex, adiabatic piece, partial heat-conducting piece, partial heat radiation structure and partial pedestal. Therefore, the probability of heat exchange between the air with relatively high temperature in the environment and the relatively low-temperature component of the heat dissipation module can be effectively reduced. Therefore, the probability of dewing of the components of the heat dissipation module can be reduced, and the probability of damage of the light valve due to dewing can be reduced.

In order to make the aforementioned and other features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic view of a projection apparatus according to an embodiment of the present invention.

Fig. 2 is a perspective view of a heat dissipation module according to an embodiment of the present invention.

Fig. 3 is a perspective view of another perspective view of the heat dissipation module of fig. 2.

Fig. 4 is a partial exploded view of the heat dissipation module of fig. 2.

Fig. 5 is a partial sectional perspective view of the heat dissipation module of fig. 2 taken along line a-a.

Fig. 6 is a partial sectional perspective view of the heat dissipation module of fig. 2 taken along line B-B.

List of reference numerals

L1 illumination Beam

L2 image Beam

10 projection device

20 light source

30 light valve

40: seat body

50: lens

100 heat radiation module

110 heat conducting member

120 insulating member

122 first through hole

130 heat radiation structure

132 second through hole

140 first lock attachment

142 first locking part

144 first stop part

146 first elastic member

150 second locking accessory

152 second locking part

154 second stop

156 second elastic member

160 heat insulation cladding component group

161 first opening

162 second opening

163 accommodating space

164 first insulating coating

165 second insulating coating

166 hole

170, refrigerating the wafer.

Detailed Description

The foregoing and other technical and scientific aspects, features and advantages of the present invention will be apparent from the following detailed description of a preferred embodiment, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

Fig. 1 is a schematic view of a projection apparatus according to an embodiment of the present invention. Referring to fig. 1, a Projection apparatus 10 of the present embodiment includes a light source 20, a light valve 30, and a lens 50(Projection lens). The light source 20 is, for example, a laser light source and is configured to emit an illumination light beam L1. The Light source 20 is, for example, a Laser Diode (LD) or a Light-emitting diode (LED), but is not limited thereto. The light valve 30 is, for example, a digital micro-mirror device (DMD), a liquid crystal on silicon (LCoS) panel, or a Liquid Crystal Display (LCD) panel, but is not limited thereto. The light valve 30 is disposed on the transmission path of the illumination beam L1 and is used for converting the illumination beam L1 into the image beam L2. The lens 50 is disposed on the transmission path of the image light beam L2 and is used for projecting the image light beam L2 to the outside of the projection apparatus 10.

Fig. 2 is a perspective view of a heat dissipation module according to an embodiment of the present invention. Since the light valve 30 generates a large amount of heat when the projection apparatus 10 is in operation, the heat dissipation module 100 is disposed on the light valve 30 for cooling. In the present embodiment, the heat dissipation module 100 has a special design to prevent the internal locking element from dewing. The internal components and configuration of the thermal module 100 are described below.

Fig. 3 is a perspective view of another perspective view of the heat dissipation module of fig. 2. Fig. 4 is a partial exploded view of the heat dissipation module of fig. 2. Fig. 5 is a partial sectional perspective view of the heat dissipation module of fig. 2 taken along line a-a. Fig. 6 is a partial sectional perspective view of the heat dissipation module of fig. 2 taken along line B-B. Note that fig. 3 is a back surface of fig. 2.

Referring to fig. 2 to fig. 6, in the present embodiment, the projection apparatus 10 further includes a heat dissipation module 100. As shown in fig. 4 to 6, the heat dissipation module 100 includes a heat conducting member 110, a heat insulating member 120, a heat dissipation structure 130, at least one first locking member 140, at least one second locking member 150, and a heat insulating covering member 160. The material of the thermal conductive member 110 is, for example, copper, but is not limited thereto. The heat conducting element 110 is disposed on a base 40 of the projection apparatus 10 and connected to the light valve 30 of the projection apparatus 10.

The seat 40 is made of aluminum, but not limited thereto. The seat 40 is located between the heat conducting member 110 and the light valve 30 of the projection apparatus 10, and the heat conducting member 110 penetrates through the seat 40 and is connected to the light valve 30. Specifically, as shown in fig. 5, in the present embodiment, the heat conducting member 110 has a protrusion, the seat 40 has an opening correspondingly, and the protrusion of the heat conducting member 110 is inserted through the opening of the seat 40 to contact the light valve 30.

The material of the thermal insulator 120 is, for example, but not limited to, plastic. The heat insulating member 120 covers and is fixed to a portion of the heat conductive member 110. In the present embodiment, a gasket (not shown) may be disposed between the heat conducting member 110 and the base 40, and the heat conducting member 110 is spaced apart from the base 40, and the gasket is, for example, but not limited to, a heat insulating plastic sheet. Thereby, the heat exchange between the base 40 and the heat conducting member 110 can be reduced. Alternatively, an air layer may be disposed between the heat conducting member 110 and the housing 40 to reduce the heat exchange probability.

In addition, the heat dissipation structure 130 is, for example, an air cooling heat dissipation set or a liquid cooling heat dissipation set (such as a water cooling heat dissipation set), and has a structure of fins, heat pipes, etc. for heat dissipation, but is not limited thereto. In the present embodiment, the heat dissipation module 100 further includes a cooling chip 170, and the cooling chip 170 is disposed between the heat dissipation structure 130 and the heat conducting element 110. The cooling wafer 170 is, for example, a heat dissipation element, but is not limited thereto. The chilling plate 170 has a hot side and a cold side, the hot side of the chilling plate 170 is connected to the heat sink 130, and the cold side of the chilling plate 170 is connected to the heat conducting member 110.

In this embodiment, when the projection apparatus 10 operates, the light beam is concentrated on the light valve 30 to generate a large amount of heat, the heat conducting member 110 of the heat dissipation module 100 is connected to the light valve 30 of the projection apparatus 10, and the heat is conducted from the light valve 30 to the heat conducting member 110. The thermal conductor 110 is attached to the cold side of the refrigeration chip 170, and the cold side of the refrigeration chip 170 cools the thermal conductor 110 to keep the thermal conductor 110 at a low temperature. The hot side of the chilling wafer 170 is connected to the heat dissipation structure 130, and heat is conducted from the hot side of the chilling wafer 170 to the heat dissipation structure 130. The heat dissipation structure 130 exchanges heat with the outside to dissipate heat. Therefore, the heat dissipation module 100 can help the light valve 30 of the projection apparatus 10 dissipate heat to prevent the light valve 30 from being damaged due to overheating.

In addition, in the present embodiment, the contact area between the thermal conduction member 110 and the refrigeration chip 170 is larger than the contact area between the thermal conduction member 110 and the light valve 30 of the projection apparatus 10. Therefore, the heat conduction efficiency between the heat conduction member 110 and the refrigeration chip 170 can be greater than the heat conduction efficiency between the heat conduction member 110 and the light valve 30 of the projection apparatus 10, so that the heat conduction member 110 is maintained in a relatively low temperature state to facilitate heat dissipation of the light valve 30.

In addition, as shown in fig. 4, at least one first locking member 140 passes through the heat insulating member 120 and is locked to the housing 40. In the present embodiment, the number of the at least one first locking member 140 is, for example, four, and the at least one first locking member is arranged on opposite sides of the heat dissipation module 100 in pairs. In the present embodiment, the thermal insulation member 120 includes at least one first through hole 122, and the number of the at least one first through hole 122 is, for example, four. The first locking member 140 passes through the first through hole 122 and is locked to the base 40, and a gap exists between the first through hole 122 and the first locking member 140.

Referring to fig. 5, in the present embodiment, each first locking member 140 includes a first locking portion 142 and a first stopping portion 144 connected to each other, and the first locking portion 142 passes through the first through hole 122 of the thermal insulation member 120 and is screwed (screw-locked) to the base 40 by a screw thread at an end thereof. The heat dissipation module 100 further includes a first elastic member 146, the first elastic member 146 is disposed between the first blocking portion 144 and the thermal insulation member 120 and compressed, and the first elastic member 146 is pressed on the thermal insulation member 120, so that the thermal conduction member 110 covered by the thermal insulation member 120 is tightly attached to the light valve 30 by its elastic force.

In addition, referring to fig. 6, at least one second locking member 150 passes through the heat dissipation structure 130 and is locked to the heat conductive member 110. The number of the at least one second locking accessory 150 is, for example, four, and two second locking accessories are arranged on opposite sides of the heat dissipation module 100. The heat dissipation structure 130 includes at least one second through hole 132, and the number of the at least one second through hole 132 is, for example, four. The second locking attachment 150 passes through the second through hole 132 and is locked to the heat conductive member 110 with a gap between the second through hole 132 and the second locking attachment 150.

In the present embodiment, each second locking member 150 includes a second locking portion 152 and a second stopping portion 154 connected to each other, and the second locking portion 152 passes through the second through hole 132 of the heat dissipation structure 130 and is screwed (screw-locked) to the heat conduction member 110 by a screw thread at an end thereof. The heat dissipation module 100 further includes a second elastic member 156, the second elastic member 156 is disposed between the second stopping portion 154 and the heat dissipation structure 130 and compressed, and the second elastic member 156 is pressed on the heat dissipation structure 130, so that the heat conduction member 110, the refrigeration chip 170 and the heat dissipation structure 130 are tightly combined by its elastic force.

In the present embodiment, by the above configuration, the force applied by the first locking piece 140 and the second locking piece 150 can be applied in a segmented manner, so that the locking force of the first locking piece 140 is smaller than the locking force of the second locking piece 150. In detail, the second locking unit 150 tightly couples the heat conducting member 110, the cooling chip 170 and the heat dissipating structure 130 with a relatively large pressure, and the first locking unit 140 tightly couples the heat conducting member 110 to the light valve 30 with a relatively small pressure, so that the light valve 30 is not directly subjected to an excessive pressure and may be damaged.

It should be noted that, since the second locking member 150 is locked to the low-temperature heat-conducting member 110, the temperature of the second locking member 150 is relatively low, and the temperature difference between the second locking member and the outside is large. Furthermore, although the first locking member 140 is fixed by the first through hole 122 of the heat insulating member 120, and does not directly contact the low-temperature heat conductive member 110, the temperature of the first locking member 140 is higher than that of the second locking member 150, and the temperature difference between the first locking member 140 and the external environment is small, the first locking member 140 may dew condensation under normal conditions. The heat dissipation module 100 of the present embodiment utilizes the heat insulation covering member set 160 to reduce the probability of the first locking member 140 and the second locking member 150 from dewing, and can protect other components of the heat dissipation module 100.

Specifically, in the present embodiment, the heat insulation covering member set 160 has flexibility, and the material of the heat insulation covering member set 160 is, for example, but not limited to, rubber or silica gel. As shown in fig. 2 and fig. 3, the heat insulation covering member set 160 covers the first locking member 140, the second locking member 150, the heat insulation member 120, part of the heat conduction member 110, part of the heat dissipation structure 130, and part of the base 40.

Referring to fig. 5 and fig. 6, in the present embodiment, the heat insulation covering member set 160 includes a first opening 161, a second opening 162 and an accommodating space 163 communicating the first opening 161 and the second opening 162, the first locking member 140, the second locking member 150, the heat insulation member 120, a part of the heat conduction member 110, a part of the heat dissipation structure 130 and a part of the seat body 40 are located in the accommodating space 163, the first opening 161 exposes the heat dissipation structure 130, and the second opening 162 exposes the seat body 40.

Therefore, the heat insulation covering member set 160 covers the relatively low-temperature components of the heat dissipation module 100, so that the heat exchange between the relatively high-temperature air in the environment and the relatively low-temperature components of the heat dissipation module 100 is effectively reduced. Accordingly, the probability of dew condensation of the components of the heat dissipation module 100 can be reduced and the heat dissipation effect can be improved. In addition, the heat dissipation structure 130 covered by the heat insulation covering member set 160 can increase the covering performance of the heat insulation covering member set 160 on the heat dissipation module 100, but does not affect the heat exchange between the heat dissipation structure 130 and the outside.

In the present embodiment, the insulation covering assembly 160 includes at least a first insulation covering 164 and a second insulation covering 165. The number of the at least one first insulating coating 164 is, for example, four, and the first insulating coating 164 coats the first locking fitting 140. The second heat-insulating covering member 165 covers the second locking member 150, the heat-insulating member 120, a portion of the heat-conducting member 110, a portion of the heat-dissipating structure 130, and a portion of the seat 40, the second heat-insulating covering member 165 includes at least one hole 166 (as shown in fig. 4), the number of the at least one hole 166 is four, for example, and the first heat-insulating covering member 164 is disposed through the hole 166 and contacts the second heat-insulating covering member 165.

Therefore, when the heat dissipation module 100 needs to be disassembled for maintenance, a user only needs to pull the first insulating covering piece 164 out of the hole 166 of the second insulating covering piece 165 to expose the first locking member 140, and can directly disassemble the exposed first locking member 140, so that the heat dissipation module 100 is separated from the projection apparatus 10. Thus, the user can detach the first locking member 140 without removing the second heat insulating cover 165, and the heat dissipation module 100 and the second heat insulating cover 165 can be detached from the projection apparatus 10. Furthermore, it is possible for the user to simply identify the first locking accessory 140 from the first insulating cladding 164 to avoid disassembly errors.

In summary, the embodiments of the present invention have at least one of the following advantages or effects. In an embodiment of the present invention, the heat dissipation module utilizes the heat insulation covering member set to cover at least one first locking member, at least one second locking member, the heat insulation member, a part of the heat conduction member, a part of the heat dissipation structure, and a part of the seat body. Therefore, the probability of heat exchange between the air with relatively high temperature in the environment and the relatively low-temperature component of the heat dissipation module can be effectively reduced. Therefore, the probability of dew condensation of the components of the heat dissipation module can be reduced, and the damage of the light valve caused by the dew can be reduced.

The above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made according to the claims and the description of the present invention are still included in the scope of the present invention. Furthermore, it is not necessary for any embodiment or claim of the invention to address all of the objects, advantages, or features disclosed herein. Furthermore, the abstract and the title of the specification are provided only for assisting the retrieval of patent documents and are not intended to limit the scope of the present invention. Furthermore, the terms "first", "second", and the like in the description or the claims are used only for naming elements (elements) or distinguishing different embodiments or ranges, and are not used to limit upper or lower limits on the number of elements.

Claims (24)

1. A heat dissipation module for a projection device, the heat dissipation module comprising a heat conducting member, a heat insulating member, a heat dissipation structure, at least one first locking member, at least one second locking member, and a heat insulating cover member, wherein the heat conducting member, the heat insulating member, the heat dissipation structure, the at least one first locking member, the at least one second locking member, and the heat insulating cover member are disposed on a substrate, and the

The heat conducting piece is configured on the seat body of the projection device and connected to the light valve of the projection device;

the heat insulating member covers and is fixed to a part of the heat conductive member;

the heat dissipation structure is configured on the heat conducting piece;

the at least one first locking accessory penetrates through the heat insulation piece and is locked and attached to the seat body;

the at least one second locking attachment penetrates through the heat dissipation structure and is locked to the heat conduction piece; and

the heat insulation covering member group covers the at least one first locking member, the at least one second locking member, the heat insulation member, part of the heat conduction member, part of the heat dissipation structure and part of the seat body.

2. The thermal module of claim 1, wherein the thermal insulation covering member set includes a first opening, a second opening and a receiving space communicating the first opening and the second opening, the at least one first locking member, the at least one second locking member, the thermal insulation member, a portion of the thermal conductive member, a portion of the heat dissipation structure and a portion of the housing are disposed in the receiving space, the first opening exposes the heat dissipation structure, and the second opening exposes the housing.

3. The heat dissipating module of claim 1, wherein the heat insulating covering assembly comprises at least a first heat insulating covering the at least a first locking member and a second heat insulating covering the at least a second locking member, the heat insulating member, a portion of the heat conducting member, a portion of the heat dissipating structure and a portion of the housing, the second heat insulating covering comprises at least one hole, and the at least a first heat insulating covering is disposed through the at least one hole and contacts the second heat insulating covering.

4. The thermal module of claim 1 wherein the set of thermally insulating covers is flexible.

5. The thermal module of claim 1, wherein the thermal insulator comprises at least one first through hole, the at least one first locking member passes through the at least one first through hole and is locked to the housing, and a gap exists between the at least one first through hole and the at least one first locking member.

6. The heat dissipation module of claim 1, wherein the heat dissipation structure comprises at least one second through hole, the at least one second locking attachment passes through the at least one second through hole and is locked to the heat conductive member, and a gap exists between the at least one second through hole and the at least one second locking attachment.

7. The heat dissipating module of claim 1, wherein each of the first locking members comprises a first locking portion and a first stopping portion connected to each other, the first locking portion penetrates through the heat insulating member, and the heat dissipating module further comprises a first elastic member disposed between the first stopping portion and the heat insulating member.

8. The heat dissipation module of claim 1, wherein each of the second locking elements includes a second locking portion and a second stopping portion connected to each other, the second locking portion passes through the heat dissipation structure, and the heat dissipation module further includes a second elastic element disposed between the second stopping portion and the heat dissipation structure.

9. The thermal module of claim 1, further comprising a cooling wafer, wherein the cooling wafer is disposed between the heat dissipation structure and the thermal conductor.

10. The thermal module of claim 9, wherein a contact area between the thermal conductor and the chilling wafer is greater than a contact area between the thermal conductor and the light valve of the projection device.

11. The thermal module of claim 1, wherein the base is located between the thermal conducting member and the light valve of the projection apparatus, and the thermal conducting member passes through the base and is connected to the light valve.

12. The thermal module of claim 1, wherein the thermal conductor is spaced apart from the housing.

13. A projection device is characterized in that the projection device comprises a light source, a light valve, a seat body, a heat dissipation module and a lens, wherein the light source, the light valve, the seat body, the heat dissipation module and the lens are arranged in the seat body

The light source is used for emitting an illumination light beam;

the light valve is configured on the transmission path of the illumination light beam and is used for converting the illumination light beam into an image light beam;

the heat dissipation module comprises a heat conducting member, a heat insulating member, a heat dissipation structure, at least one first locking member, at least one second locking member and a heat insulating coating member group, wherein the heat conducting member, the heat insulating member, the heat dissipation structure, the at least one first locking member, the at least one second locking member and the heat insulating coating member group are arranged in parallel

The heat conducting piece is arranged on the seat body and connected to the light valve;

the heat insulating member covers and is fixed to a part of the heat conductive member;

the heat dissipation structure is configured on the heat conducting piece;

the at least one first locking accessory penetrates through the heat insulation piece and is locked and attached to the seat body;

the at least one second locking attachment penetrates through the heat dissipation structure and is locked to the heat conduction piece; and

the heat insulation cladding set is used for cladding the at least one first locking accessory, the at least one second locking accessory, the heat insulation piece, part of the heat conduction piece, part of the heat dissipation structure and part of the seat body; and

the lens is configured on the transmission path of the image light beam and is used for projecting the image light beam to the outside of the projection device.

14. The projection apparatus according to claim 13, wherein the heat-insulating cover assembly includes a first opening, a second opening and a receiving space communicating the first opening and the second opening, the at least one first locking member, the at least one second locking member, the heat-insulating member, a portion of the heat-conducting member, a portion of the heat-dissipating structure and a portion of the housing are disposed in the receiving space, the first opening exposes the heat-dissipating structure, and the second opening exposes the housing.

15. The projection apparatus according to claim 13, wherein the thermal insulation covering assembly includes at least a first thermal insulation covering and a second thermal insulation covering, the at least a first thermal insulation covering covers the at least a first locking member, the second thermal insulation covering covers the at least a second locking member, the thermal insulation member, a portion of the thermal conductive member, a portion of the heat dissipation structure, and a portion of the base, the second thermal insulation covering includes at least one hole, and the at least a first thermal insulation covering is disposed through the at least one hole and contacts the second thermal insulation covering.

16. The projection device of claim 13, wherein the set of insulating coverings is flexible.

17. The projection apparatus according to claim 13, wherein the thermal insulator comprises at least one first through hole, the at least one first locking member passes through the at least one first through hole and is locked to the housing, and a gap exists between the at least one first through hole and the at least one first locking member.

18. The projection apparatus of claim 13, wherein the heat dissipation structure comprises at least one second through hole, the at least one second locking member passes through the at least one second through hole and is locked to the heat conduction member, and a gap exists between the at least one second through hole and the at least one second locking member.

19. The projection apparatus according to claim 13, wherein each of the first locking members includes a first locking portion and a first stopping portion connected to each other, the first locking portion penetrates through the thermal insulation member, and the heat dissipation module further includes a first elastic member disposed between the first stopping portion and the thermal insulation member.

20. The projection apparatus according to claim 13, wherein each of the second locking elements includes a second locking portion and a second stopping portion connected to each other, the second locking portion passes through the heat dissipation structure, and the heat dissipation module further includes a second elastic element disposed between the second stopping portion and the heat dissipation structure.

21. The projection device of claim 13, wherein the heat dissipation module further comprises a cooling wafer, wherein the cooling wafer is disposed between the heat dissipation structure and the heat conducting member.

22. The projection device of claim 21, wherein a contact area between the thermal conduction member and the chilling plate is greater than a contact area between the thermal conduction member and the light valve of the projection device.

23. The projection apparatus of claim 13, wherein the seat is located between the heat conducting member and the light valve of the projection apparatus, and the heat conducting member passes through the seat and is connected to the light valve.

24. The projection apparatus of claim 13, wherein the thermal conduction member is spaced apart from the base.

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