CN212792334U

CN212792334U - Protective cover for preventing residual wax from splashing back after silicon wafer is waxed and wax is thrown

Info

Publication number: CN212792334U
Application number: CN202020991670.5U
Authority: CN
Inventors: 周峰; 贺贤汉
Original assignee: Shanghai Zhongxin Wafer Semiconductor Technology Co ltd
Current assignee: Shanghai Zhongxin Wafer Semiconductor Technology Co ltd
Priority date: 2020-06-03
Filing date: 2020-06-03
Publication date: 2021-03-26
Anticipated expiration: 2030-06-03

Abstract

The utility model relates to a wafer processing equipment field. The protective cover is used for preventing residual wax from splashing after wax is coated and thrown on the silicon wafer, and comprises a cover body and is characterized in that the cover body comprises a supporting part and a wax blocking part which are connected up and down; the wax blocking part is cylindrical, the supporting part is annular, and the inner wall of the supporting part is connected with the top of the wax blocking part; the supporting part and the wax blocking part are provided with a gap which is communicated with each other, and the gap is used for the movement of the wax coating pipe. This patent passes through the protection casing, and the vertical clearance between silicon chip and the supporting part bottom is thrown away smoothly after being convenient for wax evenly coats, can prevent again to get rid of wax in-process wax residue and splash back to the silicon chip surface, and it is protruding to form the foreign matter, and the wax membrane is inhomogeneous, uses this device can effectively prevent to get rid of the wax after the wax residue and splash back the silicon chip flatness that causes bad.

Description

Protective cover for preventing residual wax from splashing back after silicon wafer is waxed and wax is thrown

Technical Field

The utility model relates to a wafer processing equipment field specifically is waxing equipment.

Background

In recent years, the design line width of integrated circuits is developing towards nanometer scale, and more rigorous requirements are put on the surface performance of semiconductor silicon materials. However, after the characteristic size of the device is gradually reduced, the yield of the device is directly related to the flatness of the silicon wafer. The silicon wafer is affected by the back particles, and the removal amount at the corresponding position changes in the polishing process, so that the flatness is deteriorated, and the control on the flatness of the silicon wafer is not ensured.

The particles come from particles in the environment, foreign matters on the ceramic plate, particles generated in the silicon wafer processing process and the like; the particles generated in the silicon wafer processing process are particularly outstanding, and because the wax coating and sticking of the silicon wafer are indispensable procedures in the single-side polishing process, residual wax generated by wax coating and wax throwing in the process is splashed into the coating space, so that the particles in the space are increased, and the cleanliness is reduced.

In the prior art, wax is firstly dropped on the center of a silicon wafer during wax coating, and the wax is uniformly distributed on the whole silicon wafer surface through rotation, so that preparation is made for attaching a subsequent silicon wafer on a ceramic plate. Therefore, the amount of wax used must be such that the wax can be uniformly applied to the entire surface of the silicon wafer and cannot cover any position, and this is the lower limit of the amount used. It has now been found that excess wax can splash into the coating space during spin coating of the wax, which can have an effect on the cleanliness of the interior of the apparatus.

Therefore, there is a need for a device that controls the splashing of the residual wax and prevents the wax particles from depositing and falling onto the surface of the silicon wafer.

SUMMERY OF THE UTILITY MODEL

Problem to prior art existence, the utility model provides a protection casing that is used for silicon chip waxing to prevent after getting rid of the wax that the wax residue from splashing back to solve above at least one technical problem.

In order to achieve the aim, the utility model provides a protective cover for preventing the back splash of residual wax after the wax is thrown and coated on the silicon wafer, which comprises a cover body and is characterized in that the cover body comprises a supporting part and a wax blocking part which are connected up and down;

the wax blocking part is in a cylindrical shape,

the supporting part is annular, and the inner wall of the supporting part is connected with the top of the wax blocking part;

the supporting part and the wax blocking part are provided with a gap which is communicated with each other, and the gap is used for moving the wax coating pipe.

This patent passes through the protection casing, and the vertical clearance between silicon chip and the supporting part bottom is thrown away smoothly after being convenient for wax evenly coats, can prevent again to get rid of wax in-process wax residue and splash back to the silicon chip surface, and it is protruding to form the foreign matter, and the wax membrane is inhomogeneous, uses this device can effectively prevent to get rid of the wax after the wax residue and splash back the silicon chip flatness that causes bad.

Preferably, when the protective cover is mounted on the wax coating jig, the wax coating jig comprises an outer cover and a supporting platform for supporting the silicon wafer;

the lower side of the supporting part is abutted against the top surface of the outer cover, and the wax blocking part is positioned on the inner side of the outer cover;

the bottom of the wax blocking part is higher than the upper surface of the silicon wafer on the supporting platform, and the height difference is 10-12 mm.

The silicon wafer wax-coating and wax-throwing device is convenient to ensure that residual wax can be smoothly thrown out when the silicon wafer is wax-coated and wax-thrown, and meanwhile, the residual wax cannot be splashed back to the surface of the silicon wafer.

Further preferably, the longitudinal length of the cover body is 35mm-42 mm. So as to realize the waxing jig for different sizes.

Further preferably, the longitudinal length of the cover is 40 mm. The longitudinal length just ensures that when the silicon wafer is coated with wax and thrown away with wax, the residual wax can be smoothly thrown away, and meanwhile, the residual wax cannot be splashed back to the surface of the silicon wafer. The wax coating jig is suitable for a non-binary SCMM-23 type (fujikoshi) pasting machine.

Preferably, the outer cover is provided with an opening for moving the waxing tube, and the width of the opening is matched with that of the notch;

the longitudinal length of the opening is matched with the longitudinal length of the notch.

Further preferably, the width of the notch is 35.05 mm. This patent is through unanimous with width and waxing system utensil, and it is smooth and easy to guarantee to scribble the wax pipe and remove.

The method is used for silicon wafers with different sizes. For example, when the wax coating jig is used for coating wax on a silicon wafer with the outer diameter of 150mm-200mm, the inner diameter of the wax blocking part is 213mm-215 mm.

More preferably, the inner diameter of the wax blocking part is 213 mm. The silicon chip is ensured not to contact with the protective cover when being moved up and down, and is stably attached to the original wax-coated tool. The wax coating jig is suitable for a non-flux (fujikoshi) SCMM-23 pasting machine.

Further preferably, the shield is a stainless steel shield. And (4) corrosion resistance.

Further preferably, the protective cover comprises a metal base body, and the outer surface of the metal base body is coated with a teflon coating. The Teflon coating has non-stick property and increases the anti-blocking property. Is easy to clean and decontaminate.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a bottom view of the present invention;

fig. 3 is a schematic view of a partial structure of the wax coating jig of the present invention.

Wherein: 1 is a supporting part, 2 is a wax blocking part, 3 is a notch, 4 is an outer cover, and 5 is a wax coating pipe.

Detailed Description

The present invention will be further described with reference to the accompanying drawings.

Referring to fig. 1 to 3, the protective cover for preventing the back splash of the residual wax after the wax is coated and thrown on the silicon wafer comprises a cover body, wherein the cover body comprises a supporting part 1 and a wax blocking part 2 which are connected up and down; the wax blocking part 2 is cylindrical, the supporting part 1 is annular, and the inner wall of the supporting part 1 is connected with the top of the wax blocking part 2; the supporting part 1 and the wax blocking part 2 are provided with a gap 3 which is communicated with each other, and the gap 3 is used for the movement of the wax coating pipe 5. This patent passes through the protection casing, and the vertical clearance between silicon chip and the supporting part bottom is thrown away smoothly after being convenient for wax evenly coats, can prevent again to get rid of wax in-process wax residue and splash back to the silicon chip surface, and it is protruding to form the foreign matter, and the wax membrane is inhomogeneous, uses this device can effectively prevent to get rid of the wax after the wax residue and splash back the silicon chip flatness that causes bad.

When the protective cover is arranged on the wax coating jig, the wax coating jig comprises an outer cover 4 and a supporting platform for supporting the silicon wafer; the lower side of the supporting part is abutted against the top surface of the outer cover, and the wax blocking part is positioned on the inner side of the outer cover 4; the bottom of the wax blocking part is higher than the upper surface of the silicon wafer on the supporting platform, and the height difference is 10mm-12 mm. The silicon wafer wax-coating and wax-throwing device is convenient to ensure that residual wax can be smoothly thrown out when the silicon wafer is wax-coated and wax-thrown, and meanwhile, the residual wax cannot be splashed back to the surface of the silicon wafer.

The shield is a stainless steel shield. And (4) corrosion resistance. Alternatively, the protective cover comprises a metal base body, and the outer surface of the metal base body is coated with a Teflon coating. The Teflon coating has non-stick property and increases the anti-blocking property. Is easy to clean and decontaminate. The thickness of the Teflon coating layer decreases from top to bottom.

The longitudinal length of the cover body is 35mm-42 mm. So as to realize the waxing jig for different sizes. An opening for moving the waxing tube is formed in the outer cover, and the width of the opening is matched with that of the notch; the longitudinal length of the opening matches the longitudinal length of the notch. When the wax coating jig is used for coating wax on a silicon wafer with the outer diameter of 150mm-200mm, the inner diameter of the wax blocking part is 213mm-215 mm.

The dimensions of the protective cover for the wax-coated jig of the no-two-crossing (fujikoshi) model SCMM-23 placement machine are optimized as follows:

the longitudinal length of the cover body is 40 mm. The longitudinal length just ensures that when the silicon wafer is coated with wax and thrown away with wax, the residual wax can be smoothly thrown away, and meanwhile, the residual wax cannot be splashed back to the surface of the silicon wafer. The width of the notch is 35.05 mm. This patent is through unanimous with width and waxing system utensil, and it is smooth and easy to guarantee to scribble the wax pipe and remove. The inner diameter of the wax blocking part is 213 mm. The silicon chip is ensured not to contact with the protective cover when being moved up and down, and is stably attached to the original wax-coated tool.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The protective cover is used for preventing residual wax from splashing after wax is coated and thrown on the silicon wafer, and comprises a cover body, and is characterized in that the cover body comprises a supporting part and a wax blocking part which are connected up and down;

the wax blocking part is in a cylindrical shape,

2. The protective cover for preventing the back splash of the residual wax after the wax coating and the wax throwing of the silicon wafer as claimed in claim 1, is characterized in that: when the protective cover is arranged on the wax coating jig, the wax coating jig comprises an outer cover and a supporting platform for supporting the silicon wafer;

3. The protective cover for preventing the back splash of the residual wax after the wax coating and the wax throwing of the silicon wafer as claimed in claim 1, is characterized in that: the longitudinal length of the cover body is 35mm-42 mm.

4. The protective cover for preventing the back splash of the residual wax after the wax is thrown on the silicon wafer according to the claim 3, which is characterized in that: the longitudinal length of the cover body is 40 mm.

5. The protective cover for preventing the back splash of the residual wax after the wax is thrown on the silicon wafer according to the claim 2, which is characterized in that: an opening for moving the waxing tube is formed in the outer cover, and the width of the opening is matched with that of the notch;

6. The protective cover for preventing the back splash of the residual wax after the wax is thrown on the silicon wafer according to the claim 5, which is characterized in that: the width of the notch is 35.05 mm.

7. The protective cover for preventing the back splash of the residual wax after the wax is thrown on the silicon wafer according to the claim 2, which is characterized in that: when the wax coating jig is used for coating wax on a silicon wafer with the outer diameter of 150mm-200mm, the inner diameter of the wax blocking part is 213mm-215 mm.

8. The protective cover for preventing the back splash of the residual wax after the wax is thrown on the silicon wafer according to claim 7, wherein: when the wax coating jig is used for coating wax on a silicon wafer with the outer diameter of 150mm-200mm, the inner diameter of the wax blocking part is 213 mm.

9. The protective cover for preventing the back splash of the residual wax after the wax coating and the wax throwing of the silicon wafer as claimed in claim 1, is characterized in that: the shield is a stainless steel shield.

10. The protective cover for preventing the back splash of the residual wax after the wax coating and the wax throwing of the silicon wafer as claimed in claim 1, is characterized in that: the protective cover comprises a metal base body, and the outer surface of the metal base body is coated with a Teflon coating.