CN212786362U - Equipment assembly for cooling heat-generating electronic parts and electronic heat-generating device - Google Patents

Abstract

The utility model discloses an equipment assembly that allows simpler change heat production electronic part. The equipment assembly includes a housing to house the heat-generating electronic parts. The part includes a coolant inlet, a coolant outlet, and a drain connector. The cold manifold supplies coolant to the heat-generating electronic parts through a coolant inlet. The thermal manifold collects coolant from the heat-generating electronic parts through the coolant outlet. The exhaust manifold includes a coupler. The coolant inlet and the coolant outlet are not connected to the cold manifold and the hot manifold. The drain connector is fluidly connected to the drain manifold to drain coolant from the heat-generating electronic part prior to removal of the heat-generating electronic part from the rack.

Description

Equipment assembly for cooling heat-generating electronic parts and electronic heat-generating device

[ technical field ] A method for producing a semiconductor device

The present invention generally relates to cooling systems for computer systems. More particularly, aspects of the present invention relate to a submerged cooling system having a discharge mechanism of a coolant distribution unit to facilitate maintenance.

[ background of the invention ]

Electronic devices, such as servers, contain a number of electronic components that are powered by a common power supply. Servers generate a significant amount of heat due to the operation of internal electronic devices, such as controllers, processors, and memory. Failure to effectively remove the heat can result in overheating, which can shut down or prevent the operation of the devices. Thus, existing servers are designed to remove heat generated by electronic components by means of airflow through the interior of the server. Servers typically include various heat sinks attached to electronic parts, such as processing units. The heat sink absorbs heat from the electronic part, thereby removing the heat from the electronic part. The heat of the heat sink must be removed from the server. A fan system is typically used to generate an air flow to remove the heat.

The development of new electronic components in each generation has led to an increasing amount of heat that needs to be removed due to improvements in high performance systems. With the advent of more powerful electronic components, conventional gas cooling in combination with fan systems is insufficient to adequately remove the heat generated by newer generation electronic components. The growing cooling demand has prompted the development of liquid cooling. Liquid cooling is a recently recognized solution for rapid heat dissipation, as liquid cooling exhibits superior thermal performance. At room temperature, air has a heat transfer coefficient (heat transfer coefficient) of only 0.024W/mK, while a coolant, such as water, has a heat transfer coefficient of 0.58W/mK, which is 24 times that of air. Thus, liquid cooling can more efficiently transfer heat from the heat source to the heat sink (radiator) and remove heat from the primary components without noise contamination.

A liquid cooling system is known as an immersion type system (immersion type system). In this system, the computing devices in the racks, such as servers, switches, and storage devices, are immersed in a tank containing a coolant. The enclosures of such systems are not sealed and coolant liquid may be circulated between and through the multiple parts to carry away the generated heat. However, such systems make repair and replacement of parts cumbersome, as the parts must be removed from the top of the tank. In addition, parts can only be placed side by side in the immersion tank, and therefore the power density of such systems is low (low power density).

Another type of immersion system does not require a tank. Such systems include a fully sealed enclosure and have an inlet connector and an outlet connector connected to manifolds (manifolds) that supply coolant to the parts. Fig. 1A shows an example of a prior art immersion system 10 without a tank. The submerged system 10 includes a frame 12, a column of heat-producing parts 14, and a Coolant Distribution Unit (CDU) 16. Fig. 1B is a close-up view of the coolant distribution unit 16. As can be seen in fig. 1A-1B, the frame 12 includes a base frame 20. The base frame 20 has wheels 22, the wheels 22 allowing the frame 12 to be moved to a desired location in the data center. The base frame 20 supports vertical rods 24a, 24b, 24c and 24 d. A top plate 26 connects the tops of the vertical rods 24a, 24b, 24c and 24 d. Each vertical bar 24a, 24b, 24c and 24d may include holes such that pins (pings) may be inserted into the holes to support the shelves supported by the vertical bars 24a, 24b, 24c and 24 d.

The coolant distribution unit 16 is mounted on the base frame 20 below all heat producing parts 14. Thus, each shelf supported by vertical bars 24a, 24b, 24c, and 24d can support one or more heat-producing parts 14. In this example, the heat-producing part 14 may include storage servers (storage servers), application servers (application servers), switches, or other devices. In this example, the part 14 is placed in a horizontal orientation in the frame 12, but the frame may also support the vertical orientation of the part.

The racks 12 support cold and hot manifolds 30, 32, the cold and hot manifolds 30, 32 being interposed between the base and top plates 20, 26 of the racks 12. The cold manifold 30 is fluidly connected to the coolant distribution unit 16 via a cold coolant tube 34 near the bottom of the rack 12. The thermal manifold 32 is fluidly connected to the coolant distribution unit 16 through heated coolant tubes 36 near the bottom of the rack 12. Each part 14 includes coolant connectors 40 and 42 connectable to couplers (couplers) disposed spaced along the length of the cold and hot manifolds 30 and 32. The part 14 may include an internal network of fluid conduits that circulate a coolant to all internal components of the part 14. For example, a part 14 may be an application server having an internal cold plate that contacts a processing device within the enclosure of the server. The cold manifold 30 provides coolant through coolant connectors 40, and the coolant circulates through the cold plates to carry away heat generated by the processing device. The coolant returns to the hot manifold 32 through the coolant connector 42.

Thus, coolant liquid will flow from the cold coolant tubes 34 and the cold manifold 30 into the part 14. The coolant will circulate through the internal components of the part 14 to absorb heat and then flow out of the part 14 and through the hot manifold 32 to the hot coolant tubes 36. The heated coolant will be sent through the coolant distribution unit 16. The coolant distribution unit 16 includes an internal heat exchanger and a pump. The heat exchanger removes heat from the heated coolant flowing from the hot coolant line 36 and the pump recirculates the now cooled coolant back to the cold coolant line 34. The heat exchanger may comprise a row of inner fins which may be cooled by the fan unit. In this example, the heat exchanger is integrated into the coolant distribution unit 16. Alternatively, a door may be attached to the rack 12 and the heat exchanger and fan unit may be mounted on the door.

Unlike the slot system, each part 14 is placed in a more efficient stacked arrangement, resulting in a higher power density. When one of the parts 14 requires servicing, a technician may interrupt the connection of the respective coolant connectors 40 and 42 to the cold and hot manifolds 30 and 32. The technician may then seal the coolant connectors 40 and 42 on the part 14 to avoid coolant leakage. The technician may then remove the part 14 from the frame 12. However, the sealed enclosure of the part 14 is filled with liquid coolant. Thus, the part 14 is very heavy and impedes the ability of the technician to service the part. For example, a server with coolant may weigh 26 kilograms (kg) (58 pounds), but the same server without any coolant may weigh about 14 kilograms (30 pounds).

Thus, there is a need to provide a method of exhausting coolant from computing device parts on a rack before the computing device parts on the rack are removed from the servers. There is also a need for a separate duct that can be connected to exhaust coolant from the parts of the rack prior to parts repair.

[ Utility model ] content

One disclosed example is an equipment assembly including a rack for housing electronic parts. The part includes a coolant inlet, a coolant outlet, and a drain connector. The cold manifold supplies coolant to the heat-generating electronic parts through a coolant inlet. The thermal manifold collects coolant from the heat-generating electronic parts through the coolant outlet. The exhaust manifold includes a coupler. The coolant inlet and the coolant outlet are unconnected to the cold manifold and the hot manifold. The drain connector is fluidly connected to the drain manifold to drain coolant from the heat-generating electronic part before the heat-generating electronic part is removed from the rack.

Another disclosed example is a method of discharging coolant from a heat-generating part in a rack. The frame includes a cold manifold, a hot manifold, and an exhaust manifold. The heat-generating part includes a coolant inlet in fluid communication with the cold manifold, a coolant inlet in communication with the hot manifold, and a drain connector. The coolant inlet and the cold manifold are not connected. The coolant outlet and the hot manifold are not connected. The discharge connector is connected to the discharge manifold to allow the coolant in the heat-generating part to be discharged to the discharge manifold. After the coolant is discharged, the heat-generating part is removed from the rack.

The above summary of the present invention is not intended to represent each embodiment, or every aspect, of the present invention. Rather, the foregoing summary merely provides an exemplification of some of the novel aspects and features set forth herein. The above features and advantages, and other features and advantages of the present invention, will be readily apparent from the following detailed description of various representative embodiments and methods of practicing the invention, taken in conjunction with the accompanying drawings and appended claims.

[ description of the drawings ]

The invention will be better understood through the following description of a number of exemplary embodiments, with reference to the attached drawings:

FIG. 1A is a perspective view showing a known prior art submerged cooling system on a rack enclosure;

FIG. 1B is a close-up view depicting the prior art rack housing of FIG. 1A with a coolant distribution unit;

fig. 2A is a perspective view depicting an exemplary rack-mounted liquid immersion system with a drain mechanism according to certain aspects of the present disclosure;

fig. 2B is a close-up top perspective view depicting an example of the liquid submersion system with drain mechanism of fig. 2A, in accordance with certain aspects of the present disclosure;

fig. 2C is a side view depicting the example rack-mounted liquid immersion system of fig. 2A with a drain mechanism, according to certain aspects of the present disclosure;

fig. 2D is a close-up bottom perspective view depicting an example of the liquid submersion system with drain mechanism of fig. 2A, in accordance with certain aspects of the present disclosure;

fig. 3A is a top cross-sectional view depicting an exemplary heat-producing part (with an unattached drain mechanism) in an operating position, in accordance with certain aspects of the present invention;

fig. 3B is a top cross-sectional view depicting the example heat-producing part of fig. 3A in a position relative to the rack to allow for coolant drainage, in accordance with certain aspects of the present disclosure;

FIG. 3C is a side view of the exemplary heat-producing part of FIG. 3A in a position relative to the rack to discharge coolant to the reservoir; and

FIG. 3D is a top cross-sectional view depicting the exemplary heat-generating part of FIG. 3A being removed from the rack after coolant has been discharged.

The present invention is to be understood as being capable of numerous and varied modifications and alternative forms. Some representative embodiments have been presented by way of example in the several figures and will be described in detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the spirit and scope of the present invention is defined by the appended claims, and all changes, equivalents, and substitutions that fall within the spirit and scope of the invention are intended to be embraced therein.

[ notation ] to show

10 immersion system

12,102 frame

14,104 parts

16,106 refrigerant distribution unit

20,110 bottom frame

22,112 wheel

24 a-24 d vertical rods

26,116 roof

30,124 cold manifold

32,126 Heat manifold

34,130 refrigerant tube

36,132 heated coolant tube

40,42 coolant connector

100 immersion cooling system

108 storage device

114a to 114d support member

118,120 transverse brace member

122 bus bar

128: discharge manifold

138 casing

140 inlet connector

142 outlet connector

144 discharge connector

150,154 connecting pipe

152,210,212 coupler

220, a handle

[ detailed description ] embodiments

The utility model discloses can realize by the form of multiple difference. Various representative embodiments are shown in the drawings and will be described herein in detail. The present invention is an example or illustration of the principles of the invention and is not intended to limit the broad aspects of the disclosure to the embodiments described. The disclosed degree, elements, and limitations are, for example, in the abstract, novel description, and detailed description, but are not explicitly described in the claims, and are not intended to be incorporated into the claims, either individually or collectively, by implication or otherwise. With respect to this embodiment, the singular forms "a", "an" and "the" include plural forms and vice versa, unless expressly excluded; and the words "include" represent "including but not limited to". Also, words representing rough estimates, such as "about", "almost", "approximately", "about", etc., may be used herein, for example, to represent "on the value", "close to the value", or "nearly on the value", or "between 3-5% different from the value", or "within tolerable manufacturing tolerances", or any logical combination thereof.

The present invention relates to an immersion cooling system on a rack having a liquid discharge mechanism in a sealed enclosure to discharge coolant from the sealed enclosure. The venting mechanism includes additional venting connectors in a fully sealed enclosure of each of the number of heat-generating parts supported by the frame. The drain connector connects to additional drain manifolds and reservoirs on the rack to store drained liquid coolant during part servicing. When the part requires servicing, the liquid coolant may be drained from the drain connector. Thus, the part will not contain coolant and therefore have a lighter weight to remove from the rack. After repair or replacement of parts, the reservoir may provide stored coolant to the coolant distribution unit so that the drained liquid coolant may be recycled for replacement parts.

Fig. 2A illustrates an exemplary fully enclosed enclosure submerged cooling system 100 comprising a rack 102, a first row of heat-producing parts 104, a Coolant Distribution Unit (CDU) 106, and a reservoir 108. Fig. 2B is a close-up top perspective view of the coolant distribution unit 106 and the reservoir 108. Fig. 2C is a side view of the exemplary closed enclosure submerged cooling system 100. Fig. 2D is a close-up bottom perspective view of the coolant distribution unit 106 and the reservoir 108. Like elements in fig. 2A-2D are labeled with the same reference numeral. As can be seen in fig. 2A-2D, in rack 102, a plurality of heat-producing parts 104 are stacked on a reservoir 108 and coolant distribution unit 106. Each heat-generating part 104 has a completely sealed enclosure to allow circulation of a coolant to cool multiple internal components in the enclosure.

As shown in fig. 2A-2D, the frame 102 includes a rectangular base frame 110. The base frame 110 includes a set of wheels 112 attached to the bottom of the base frame 110. The wheels 112 allow the rack 102 to be moved to a desired location in the data center. The side members of the bottom frame 110 support vertical supports 114a, 114b, 114c and 114 d. A top plate 116 connects the tops of the vertical supports 114a, 114b, 114c, and 114 d. The top plate 116 holds transverse strut members 118 and 120, the transverse strut members 118 and 120 connecting the tops of the vertical supports 114a, 114b, 114c and 114d, respectively. Each vertical support 114a, 114b, 114c, and 114d may include an aperture such that a pin may be inserted into the aperture to support a rack that may be mounted between the vertical supports 114a, 114b, 114c, and 114 d. The supports 114a and 114b define the rear end of the frame 102. Vertical bus bars 122 extend from behind the top plate 116 to the bottom frame 110. The bus bar 122 may supply power to the plurality of parts 104. The bus bar 122 may also support multiple cables that may be connected to multiple pieces 104. The front end of the frame 102 is defined by supports 114c and 114 d. A plurality of parts 104 are typically mounted from between the front end of the frame 102 and the supports 114c and 114d and are located in one of a plurality of shelves. Thus, the plurality of parts 104 may be pushed into the rack 102 until they contact the bus bar 122. The individual parts 104 may also be pulled out of the frame 102 from the front end of the frame 102 (between the supports 114c and 114 d) to replace or repair the individual parts 104.

In this example, the coolant distribution unit 106 is mounted on the bottom frame 110, below the stack of all heat-producing parts 104. In this example, heat-producing part 104 may be a storage server, an application server, a switch, or other electronic device. Each shelf between supports 114a-114d may hold one or more heat-generating parts 104. The shelves may be configured to have different heights between the plurality of shelves. It should be understood that any number of shelves and corresponding heat-producing parts 104 may be mounted in rack 102. In this example, the part 104 is placed in a horizontal orientation in the frame 102. However, with additional internal structure connected to supports 114a, 114b, 114c, and 114d, heat-producing part 104 may be placed in a vertical orientation.

The racks 102 support cold, hot, and exhaust manifolds 124, 126, 128, respectively, the cold, hot, and exhaust manifolds 124, 126, 128 extending behind the racks 102, between the supports 114a and 114b, at the height of the racks 102. The cold manifold 124 is fluidly coupled to the coolant distribution unit 106 through a cold coolant tube 130. The thermal manifold 126 is fluidly connected to the coolant distribution unit 106 through a thermal coolant tube 132. Each of the cold and hot manifolds 124, 126 may allow coolant to circulate along individual lengths of the manifolds. Cold manifold 124 and hot manifold 126 have respective fluid couplings to allow fluid communication with one of the plurality of parts 104.

Each section 104 includes a fully sealed enclosure 138, the fully sealed enclosure 138 enclosing the plurality of electronic devices of the section 104. In this example, the housing 138 of each part 104 includes an inlet connector 140 therebehind, the inlet connector 140 being connectable to one of the plurality of fluid couplers of the cold manifold 124. The rear of the housing 138 also includes an outlet connector 142, the outlet connector 142 being connectable to one of the plurality of fluid couplers of the hot manifold 126. The rear of the housing 138 of each part 104 also includes a drain connector 144. A drain connector 144 is connected to a recessed area behind the cabinet 138. In this example, the drain connector 144 is a tube such that the drain connector 144 may extend out to connect to the drain manifold 128 to drain the coolant. During normal operation, the exhaust connector 144 is not connected to the exhaust manifold 128 and may be recessed into the casing 138.

A completely sealed enclosure 138 encloses the various electronic components, power supplies, circuit boards, device cards, processors, memory devices, and other components. The enclosure 138 may contain an internal network of fluid conduits that circulate a coolant around the plurality of internal components of the plurality of parts 104. The coolant is completely sealed by the enclosure 138 and the coolant may only enter or exit the enclosure 138 through the inlet connector 140, the outlet connector 142, or the drain connector 144.

For example, one of the parts 104 can be an application server having a plurality of processing devices, such as Central Processing Units (CPUs) and Graphics Processors (GPUs). The application server may include a cold plate that contacts the central processing unit and the graphics processor, and an adjacent storage device, such as dual row memory modules (DIMMs). A coolant is circulated through the cold plate to carry away heat generated by the processing device and the storage device. In this example, individual heat-producing parts 104 may be inserted onto a rack from the front of the rack 102. Once positioned, the inlet connector 140 is fluidly connected to one of the plurality of couplers of the cold manifold 124 and the outlet connector 142 is fluidly connected to one of the plurality of couplers of the hot manifold 126. The part 104 may be connected to a power supply and other cables, such as cables supported by the bus bar 122.

The cold and hot manifolds 124, 126 circulate coolant to the part 104 through a closed loop formed by the coolant distribution unit 106. Thus, coolant liquid will flow from the inlet connector 140 from the cold manifold 124 into each of the parts 104. The coolant will circulate through the plurality of internal conduits of the part 104 to absorb heat from the plurality of internal elements and flow out of the part 104 through the outlet connector 142 to the thermal manifold 126. The heated coolant will circulate from the outlet pipe (hot coolant pipe 132) to the coolant distribution unit 106. The coolant distribution unit 106 includes an internal heat exchanger and a pump mounted inside the cabinet. The heat exchanger is used to remove heat from the heated coolant, and the pump recirculates the now cooled coolant through an inlet pipe (cold coolant pipe 130) back to the cold manifold 124. Typically, the heat exchanger dissipates the collected heat through an open loop cooling system, such as a fan system. In this example, the heat exchanger and the pump are an integrated unit. However, a rear door may be attached behind the chassis 102. The rear door may support a heat exchanger and an open loop cooling system, such as a fan wall (fan wal).

The drain mechanism, consisting of the reservoir 108 and the drain manifold 128, allows coolant to drain from either part 104 prior to removing the part 104 from the rack 102. An exhaust manifold 128 passes through the length of the frame 102 and is interposed between the bottom frame 110 and the top plate 116. The exhaust manifold 128 is fluidly connected to the reservoir 108 via a connecting tube 150. The exhaust manifold 128 includes a plurality of couplers 152, with the plurality of couplers 152 positioned in vertical alignment with each piece 104. A plurality of couplers 152 may be connected to the drain connector 144 of the part 104. The connecting tube 154 fluidly connects the reservoir 108 to the coolant distribution unit 106. In this manner, the coolant collected in the reservoir 108 may be supplied to the coolant distribution unit 106.

The reservoir 108 may store liquid coolant that may be discharged from any part 104 removed from the rack 102. Fig. 3A, 3B, and 3D are top views of one of the plurality of parts 104 in the frame 102 during the removal and venting process. Fig. 3C is a side view of one of the plurality of parts 104 in the removal process. Like elements in fig. 2A-2D are labeled with the same reference numerals in fig. 3A-3D. In a normal operating state of the part 104, the drain connector 144 of the part 104 is not connected to the drain manifold 128, as shown in FIG. 3A. The drain connector 144 is typically plugged (plug) to prevent coolant from escaping the enclosure 138. The inlet connector 140 and the outlet connector 142 are connected to the couplers 210 and 212 of the respective cold manifold 124 and hot manifold 126 to allow the coolant to circulate to the part 104.

When the part 104 requires servicing, a portion of the enclosure 138 is pulled out from the front of the frame 102, as shown in FIGS. 3B and 3C. In this example, the front end of the housing 138 may include a handle 220 to assist in pulling the part 104 out. The inlet connector 140 and the outlet connector 142 are decoupled or decoupled from the couplers 210 and 212 of the cold manifold 124 and the hot manifold 126, respectively. The technician may then pull the part 104 from the front portion of the frame 102. The inlet connector 140 and the outlet connector 142 are plugged to prevent coolant from leaking out of the part 104. As shown in fig. 3B-3C, the housing 138 is pulled out a distance in which the drain connector 144 can connect to the coupler 152 of the drain manifold 128, and this is a sufficient distance to separate the inlet connector 140 from the outlet connector 142 and the couplers 210 and 212. When the housing 138 is in this position, the drain connector 144 is unplugged (e.g., the plug is removed) and connected to the coupler 152 of the drain manifold 128. Thus, all of the coolant in the enclosure 138 will be discharged through the discharge connector 144 to the discharge manifold 128. The discharged coolant will flow from the discharge manifold 128 through the connecting tube 150 to the reservoir 108 to store the coolant.

As shown in fig. 3D, the drain connector 144 may be disconnected from the drain manifold 128 after draining all of the coolant of the enclosure 138. The coupler 152 of the exhaust manifold 128 may be plugged to avoid coolant leakage. The exhausted coolant part 104 may then be pulled completely out of the frame 102 for repair or replacement. The removal of the coolant makes the part 104 lighter for ease of handling.

When a new or repaired part 104 is inserted back into the rack 102, the inlet connector 140 and the outlet connector 142 will be connected to the couplers of the cold manifold 124 and the hot manifold 126. The connected part 104 will then be filled with liquid coolant from the inlet connector 140 from the cold manifold 124. After a new or repaired part 104 has been filled with liquid coolant, the power to the part 104 can be turned on.

The terminology used herein is for the purpose of describing particular examples only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. Furthermore, the words "include," including, "" have, "" having, "or variations thereof used in the embodiments and/or the claims are to be understood as being somewhat analogous to the words" comprise.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Moreover, words such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

While several embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. The disclosed examples can be modified in many ways in accordance with the disclosure herein, without departing from the spirit or scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described examples. Rather, the scope of the invention should be defined in accordance with the following claims and their equivalents.

Although the invention has been described and illustrated with reference to one or more embodiments, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.

Claims (10)

1. An apparatus assembly for cooling heat-generating electronic parts, comprising:

a housing for receiving the heat-generating electronic part, the heat-generating electronic part including a coolant inlet, a coolant outlet, and a drain connector;

a cold manifold for supplying coolant to the heat-generating electronic part through the coolant inlet;

a thermal manifold for collecting coolant from the heat-generating electronic part through the coolant outlet; and

an exhaust manifold comprising a coupler, wherein the coolant inlet and the coolant outlet are not connected to the cold manifold and the hot manifold, and wherein the exhaust connector is fluidly connected to the exhaust manifold to exhaust coolant from the heat-generating electronic part prior to removal of the heat-generating electronic part from the rack.

2. The equipment assembly of claim 1, further comprising a coolant distribution unit fluidly coupled to the hot manifold and the cold manifold, the coolant distribution unit comprising a heat exchanger, a pump, a chilled coolant line fluidly coupled to the cold manifold, and a hot coolant line fluidly coupled to the hot manifold.

3. The equipment assembly of claim 2, wherein the coolant distribution unit is located at a bottom of the rack and below the heat-generating electronic components.

4. The apparatus assembly of claim 1, further comprising a reservoir having a fluid conduit in fluid communication with the exhaust manifold.

5. The equipment assembly of claim 1 further comprising a door positioned on the rack and a cooling system in fluid communication with the cold manifold and the hot manifold is mounted on the door.

6. The apparatus assembly of claim 1, wherein the heat-generating electronic component comprises a sealed enclosure containing a plurality of internal components and a plurality of internal conduits coupled to the coolant inlet and the coolant outlet to circulate coolant around the plurality of internal components.

7. The equipment assembly of claim 1, wherein the heat-generating electronic component is one of a storage server, an application server, or a switch device.

8. An electronic heat-generating device, comprising:

a sealed housing having at least one heat-generating element;

a coolant inlet fluidly connectable to the cold manifold;

a coolant outlet fluidly connectable to the hot manifold;

a plurality of internal conduits for circulating coolant around the at least one heat-generating component in the sealed enclosure; and

a drain connector to drain liquid coolant from the plurality of internal conduits when the electronic heat-generating device is removed from the rack.

9. The electronic heat-generating device of claim 8, wherein the at least one heat-generating component is one of a processor or a memory device.

10. The electronic heat-generating device of claim 8, wherein the electronic heat-generating device is one of a storage server, an application server, or a switch device.

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