CN212461620U

CN212461620U - High-precision intelligent eutectic mounting equipment

Info

Publication number: CN212461620U
Application number: CN202021849044.9U
Authority: CN
Inventors: 吴超; 曾义; 蒋星
Original assignee: Energy Intelligent Technology Wuxi Co Ltd
Current assignee: Ennaji Intelligent Equipment Wuxi Co ltd
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2021-02-02
Anticipated expiration: 2030-08-28

Abstract

The utility model relates to a high accuracy intelligence eutectic pastes dress equipment, including the base, be equipped with material district and eutectic district along the Y direction on it, the middle part in material district is base plate material loading district and finished product unloading district, and the left and right sides is the chip material loading district, includes at least a chip material loading tool in every chip material loading district, gets along the chip of XY direction removal and gets bonding tool mechanism and preset platform, includes a base plate material loading tool along XY direction removal, gets along the base plate of Y direction removal and gets bonding tool mechanism in base plate material loading and finished product unloading district; the eutectic area comprises two eutectic welding mechanisms which respectively correspond to the positions of the two chip pick-and-place welding head mechanisms, each eutectic welding mechanism comprises a group of fixedly installed top cameras, an eutectic welding head which moves along the XZ direction, and two eutectic heating platforms which reciprocate between the chip loading position and the eutectic position; the utility model discloses material loading and eutectic separation, two eutectic platforms, two eutectic bonding tool simultaneous workings have improved the equipment productivity.

Description

High-precision intelligent eutectic mounting equipment

Technical Field

The utility model belongs to the technical field of semiconductor chip eutectic processing technique and specifically relates to a high accuracy intelligence eutectic pastes dress equipment.

Background

Eutectic welding, also known as low melting point alloy welding, has the essential characteristic that two different metals can be alloyed in a certain weight ratio at temperatures well below their respective melting points. The eutectic welding technology has wide application in the electronic packaging industry, and compared with the traditional epoxy conductive adhesive bonding, the eutectic welding has the advantages of high heat conductivity, low thermal resistance, high heat transfer speed, high reliability and high strength after bonding, and is suitable for interconnection of a wafer and a substrate in a high-frequency and high-power device and interconnection of the substrate and a tube shell. Because of the constraint requirements in the aspects of heating, smaller size of components, escaping gas and the like, the COS device in the optical communication field generally adopts an eutectic welding process.

In the eutectic welding process, because the volume change can take place along with the change of temperature in the plating layer on bottom sheet surface layer, becomes liquid melt from solid-state, at this in-process, must take place slight dislocation between two chips, if correct this dislocation or avoid this dislocation emergence in welding process, then can seriously influence final welding quality, produce badly. COS elements, such as Laser Diodes (LDs), Photodetectors (PDs), capacitors or thermistors, are typically as small as within 200 square microns and are made of brittle III-V compound semiconductor materials, such as GaAs and InP. Therefore, in the eutectic soldering process, the small, thin and fragile chip needs to be precisely controlled in real time, so that the constant pressure between the chip and the substrate in the eutectic soldering process is ensured, the damage of the chip is avoided, and the eutectic precision is ensured.

At present, mainstream suppliers of foreign high-precision intelligent eutectic mounting equipment include German FINETECH, French SET, American MRSI, American PALOMAR and Japan astringent valley. Both Finetech in germany and SET in france use a two-sided alignment scheme. The Finetech adopts rotary double-sided alignment, and simultaneously observes images of the chip and the substrate by using the same camera with fixed focal length, so that high-precision eutectic crystal with the maximum 0.5 mu m can be realized. The SET adopts a double-sided alignment camera, before eutectic, the double-sided alignment camera is moved between a welding head and an eutectic platform, so that the welding head chip and the eutectic platform substrate are positioned on the focal plane of the up-and-down view camera at the same time, and the eutectic precision can reach 0.51 mu m. The SET and Finetech high-precision intelligent eutectic mounting equipment consumes time for alignment adjustment and compensation, has low yield and cannot meet the requirement of mass production. The American MRSI and the American PALOMAR high-precision intelligent eutectic mounting equipment are similar, and adopt the scheme of feeding, eutectic separation and double eutectic tables. The left independent welding head is used for feeding, the right independent welding head is used for eutectic crystallization, and the single eutectic welding head is adopted for configuration, so that the yield cannot be effectively improved. The traditional design scheme of a single eutectic platform and a single eutectic welding head is adopted in the Japanese astringent valley, so that the yield is low.

Domestic high accuracy intelligence eutectic pastes dress equipment, like CN201922433688.3 discloses a high accuracy eutectic bonding equipment, adopts material loading and eutectic separation, two eutectic platforms, two eutectic bonding tool schemes, realizes equipment productivity improvement through parallel double-end scheme. However, the chip pick-up head, the substrate pick-up head and the finished product pick-up head of the equipment are arranged on the same gantry X-axis cantilever type sliding table module, and chip feeding, substrate feeding and finished product discharging can not be carried out simultaneously. And it can not ensure that the pressure between the chip and the substrate is constant during the eutectic soldering process.

SUMMERY OF THE UTILITY MODEL

The applicant provides a high-precision intelligent eutectic mounting device aiming at the defects in the prior art, left and right chip feeding is respectively completed by chip taking and placing welding head mechanisms on the left and right sides, substrate feeding and finished product discharging are completed by substrate taking and placing welding head mechanisms, and the left and right chip feeding and substrate feeding are not interfered with each other and are performed simultaneously. Meanwhile, the chip is loaded and transferred to the preset platform, and the preset platform moves to the bottom of the stationary phase machine, so that the circulation time of the equipment is saved.

The utility model discloses the technical scheme who adopts as follows:

a high-precision intelligent eutectic mounting device comprises a base, wherein a material area and a eutectic area are arranged on the base along the Y direction, and the material area is positioned on the front side of the eutectic area; the middle part of the material area is a substrate feeding area and a finished product discharging area, the left side and the right side of the material area are chip feeding areas, each chip feeding area comprises at least one chip feeding jig and a chip taking and placing welding head mechanism which is matched with the chip feeding jig and moves along the XY direction, and a suction nozzle mechanism of the chip taking and placing welding head mechanism also has Z-direction movement and rotation freedom degrees; the substrate feeding and finished product blanking area comprises a substrate feeding jig moving along the XY direction and a substrate taking and placing welding head mechanism which is matched with the substrate feeding jig and moves along the Y direction, and a suction nozzle mechanism of the substrate taking and placing welding head mechanism also has Z-direction moving and rotating freedom degrees; the eutectic area comprises a left eutectic welding mechanism and a right eutectic welding mechanism which respectively correspond to the positions of the two chip pick-and-place welding head mechanisms, each eutectic welding mechanism comprises two fixedly installed top cameras and an eutectic welding head moving along the XZ direction, a preset platform with a bottom camera is arranged on the rear side of each chip pick-and-place welding head mechanism, and the preset platform has four degrees of freedom of XYZ linear movement and rotation; and two eutectic heating platforms moving along the X direction are further arranged in the eutectic area, and the two eutectic heating platforms move back and forth between the material loading position and the eutectic position of the substrate and are matched with the eutectic welding mechanism to complete the eutectic process of the chip and the substrate.

The further technical scheme is as follows:

an X-direction frame is arranged on the rear side of the upper surface of the base, and the substrate taking and placing welding head mechanism is arranged in the middle of the X-direction frame through a top Y-direction moving module; air floating platforms moving along the XZ direction are respectively arranged on two sides of the X-direction rack, and the bottom of each air floating platform is provided with one eutectic welding head; and the X direction is respectively connected with two top cameras through fixed mounting parts on two sides of the top of the rack.

The structure of the substrate picking and placing welding head mechanism is as follows: the automatic feeding device comprises a first support plate, wherein a first motor, a first screw rod assembly and a first Z-direction guide rail are fixedly connected to the front surface of the first support plate, an output shaft of the first motor is connected with the first screw rod assembly through a first belt transmission mechanism, a screw rod shaft of the first screw rod assembly is arranged along the Z direction, the screw rod shaft is in transmission connection with a sliding connection seat, a suction nozzle mechanism is mounted on the sliding connection seat, the automatic feeding device structurally comprises a feeding welding head driven by a rotary driving piece, and a force control assembly is further connected to the feeding welding head; the force control assembly comprises a voice coil motor, the voice coil motor is installed on the inner side of an adjusting connecting plate fixedly connected with the sliding connecting seat, the outer side of the adjusting connecting plate is connected with a welding head fixing seat, the material taking welding head is arranged in the welding head fixing seat in a penetrating mode and is rotationally connected with the welding head fixing seat through a bearing device, the top of the voice coil motor is connected with the welding head fixing seat through a voice coil connecting plate, the top of the voice coil connecting plate is connected with a spring upper plate through a spring part, and two ends of the spring upper plate are fixedly connected; a Z-direction guide rail II is arranged on the outer side wall surface of the adjusting connecting plate, an upper contact mounting block which slides along the Z-direction guide rail II and is fixedly connected with the welding head fixing seat is arranged on the Z-direction guide rail II, an upper contact which extends downwards is arranged on the bottom surface of the end part of the Z-direction guide rail II, a lower contact mounting block is arranged on the outer end wall surface of the adjusting connecting plate, and a lower contact which extends upwards and is matched with the upper contact is arranged on the upper surface of the end; get material bonding tool one side and still be equipped with and get the material camera, get the material camera and link firmly through getting material camera fixing base and getting material camera connecting plate, get the material camera connecting plate with a mounting plate fixed connection.

The structure of the rotary driving piece comprises a motor II, an output shaft of the motor II is in transmission connection with the material taking welding head through a second belt transmission mechanism, and the motor II is also fixedly arranged on the inner side of the adjusting connecting plate; the material taking welding head structurally comprises a suction nozzle pipe, the suction nozzle pipe is arranged in the welding head fixing seat through a rotating bearing, the top of the suction nozzle pipe is connected with the second belt transmission mechanism, and a suction nozzle is arranged at the bottom of the suction nozzle pipe; the top of the suction nozzle pipe extends out of the welding head fixing seat and is connected with a negative pressure device through an air pipe.

The upper surface of the base is provided with a XY direction moving module I, the chip taking and placing welding head mechanism is arranged on the XY direction moving module I, and the mounting structure of the chip taking and placing welding head mechanism is the same as that of the substrate taking and placing welding head mechanism.

The X includes the crossbeam to the structure of frame, and its bottom both ends support there is the stand structure, the air supporting platform is located the front surface of crossbeam, the mounting structure of eutectic bonding tool is: the device comprises a long arm connecting plate fixedly connected with an air floatation platform, wherein the bottom of the long arm connecting plate is connected with a pressure sensor, the bottom of the pressure sensor is connected with an L-shaped connecting block, and a tungsten steel suction nozzle is arranged on the bottom surface of the L-shaped connecting block; a Z-direction guide rail III is arranged on one side of the long arm connecting plate through a sliding group mounting plate, an L-shaped connecting plate sliding along the Z-direction guide rail III is arranged on the Z-direction guide rail III, the back of one end of the L-shaped connecting plate is connected with the Z-direction guide rail III in a sliding mode, and the bottom of the other end of the L-shaped connecting plate is connected with the upper surface of the L-shaped connecting block; the fixed mounting part is of a longitudinal beam structure, the front end of the fixed mounting part extends out of the front surface of the X-direction rack and spans the air floatation platform, a mounting support is fixed on the front end face of the longitudinal beam structure and located on the front surface of the air floatation platform, and the top camera is fixedly connected to the mounting support along the Z direction.

The system comprises a bottom Y-direction moving module, a preset platform, a chip placing platform, a negative pressure device and a negative pressure device, wherein the preset platform is connected to the bottom Y-direction moving module and structurally comprises a first platform bottom plate connected with the bottom Y-direction moving module, an X-direction sliding table I, a Y-direction sliding table I, a Z-direction sliding table I and a first rotating platform are sequentially arranged on the first platform bottom plate from bottom to top along the height direction; the bottom of the inclined mounting plate is connected with the first platform bottom plate, and the top of the inclined mounting plate is provided with the bottom camera through a locking block; the bottom camera is horizontally arranged, a point light source is arranged on one side of the bottom camera, and an upward recognition light path is formed at the position of a lens of the bottom camera by arranging a bevel edge right-angle reflecting prism.

The structure of two sets of eutectic heating platforms is the same, and every eutectic heating platform's mounting structure is: including X to removing the module, install platform bottom plate two on it, along the direction of height from lower supreme X of installing in proper order to slip table two, Y to slip table two, Z to slip table two and rotary platform two on it, rotary platform is two to go up through two installation warm tables of cushion block subassembly, warm table surface mounting cover plate.

The structure of the chip feeding jig comprises a plurality of chip feeding carrier boxes; the substrate feeding jig is connected to the XY direction moving module II, the XY direction moving module II is installed on the upper surface of the base, the substrate feeding jig structurally comprises a pull type first material carrying plate and a pull type second material carrying plate, a plurality of substrate feeding boxes are arranged on the first material carrying plate, and a plurality of finished product discharging boxes are arranged on the second material carrying plate.

An eutectic processing method of high-precision intelligent eutectic mounting equipment comprises the following processing flows:

loading a substrate to an eutectic heating platform, loading a chip to a preset platform, then loading the chip to the substrate from the preset platform, heating and welding the chip and the substrate in an eutectic mode, and unloading a finished product, wherein the loading of the substrate and the unloading of the finished product are in the same working area and run continuously; simultaneously feeding the chips on the two sides and the substrate in the middle, and simultaneously feeding the chips to the preset platform and transferring the chips to the substrate; the specific process is as follows:

substrate feeding:

the substrate taking and placing welding head mechanism moves back and forth along the Y direction, the substrate on the substrate feeding jig is identified, the substrate is picked up to the eutectic heating platform at the feeding position, and then the eutectic heating platform moves to the eutectic position along the X direction;

chip loading:

the process which is carried out simultaneously with the substrate feeding comprises the following steps: the two groups of chip taking and placing welding head mechanisms work simultaneously, respectively identify chips uploaded by chip loading jigs butted below the two groups of chip taking and placing welding head mechanisms, then pick the chips onto corresponding preset platforms, and repeat the actions to realize continuous loading of the chips from the chip loading jigs to the preset platforms;

transferring the chip to a substrate:

each preset platform moves back and forth along the Y direction, and the chips are moved to and fro from the chip loading jig to the positions below the top camera and the eutectic welding head on the corresponding side; a top camera and an eutectic welding head respectively identify and pick up the chip on the preset platform; working process of the top camera on each side: after one of the top cameras identifies the position of a chip on the preset platform, the eutectic welding head picks up the chip, meanwhile, the preset platform returns to the original position to perform next chip loading, the other top camera identifies the welding position on a substrate on the eutectic heating platform, the eutectic welding head moves along the X direction along with the air floating platform, the chip is moved to the substrate of the eutectic heating platform at the eutectic position, and the chip is pressed at the preset position of the substrate;

eutectic welding:

heating the eutectic heating platform, pressing the chip on the substrate by the eutectic welding head, detecting the eutectic welding head in real time, keeping constant pressure output to the chip through feedback, lifting the eutectic welding head after the reaction is finished, returning to the original position, and continuously picking up the next chip on the preset platform; blanking of finished products: the finished product after the eutectic is moved to a blanking position by the eutectic heating platform, and is placed on a substrate feeding jig after being picked up by a substrate picking and placing welding head mechanism to finish blanking;

the above process is repeated to realize a continuous processing process.

The utility model has the advantages as follows:

the utility model discloses high accuracy intelligence eutectic pastes dress equipment structural design is reasonable, and degree of automation is high, adopts material loading and eutectic separation, two eutectic platforms, and the design of two eutectic bonding tools greatly improves the equipment productivity.

The utility model discloses the material district left and right sides is chip material loading district, and the centre is the same base plate material loading district and the finished product unloading district of getting the material bonding tool for the sharing. The left chip feeding and the right chip feeding are respectively completed by chip taking and placing welding head mechanisms on the left side and the right side, and the substrate feeding and the finished product discharging are completed by the substrate taking and placing welding head mechanisms; the left chip feeding and the right chip feeding and the substrate feeding are not interfered with each other and are carried out simultaneously. Chip feeding is firstly transferred to the preset platform, and the preset platform moves to the bottom of the stationary phase machine, so that the equipment cycle time is saved. In addition, the preset platform is provided with a bottom camera and is matched with a top camera to finish calibration work, and the calibration precision is improved.

The utility model discloses an eutectic bonding tool can ensure real-time force control, through the pressure of pressure sensor subassembly real time monitoring bonding tool to the chip to the pressure compensation is realized to the air supporting platform Z axle of cooperation and pressure sensor subassembly closed control to the downstream, and the constancy of pressure of guarantee eutectic in-process chip and base plate has improved eutectic welding precision and welding quality greatly.

The utility model discloses be located two sets of top camera fixed mounting of eutectic heating platform top both sides, discernment counterpoint precision is high, counterpoint in real time, realizes the high accuracy eutectic. One of each group of top cameras is used for adjusting the position of a chip on the preset platform and aligning the chip picked by the eutectic welding head in real time, and the other top camera is used for ensuring the alignment precision of the chip and the substrate during eutectic welding.

The chip taking and placing welding head mechanism and the substrate taking and placing welding head mechanism of the utility model adopt the same mounting structure, and adopt the voice coil motor to generate reaction force through current, thereby ensuring the stable force application of the suction nozzle in the taking and placing process and high force control precision, and preventing the chip substrate or finished product from being damaged; the substrate taking and placing welding head mechanism is shared by substrate feeding and finished product discharging, the structural design is optimized, and the space is saved;

the utility model discloses get the material bonding tool and can follow the motion of rectilinear movement module, still can follow Z to (vertical direction) motion, rotation, have multi freedom, satisfy base plate, chip and off-the-shelf position adjustment, degree of automation is high.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic structural diagram of the substrate pick-and-place welding head mechanism of the present invention.

Fig. 3 is another structural diagram of the substrate pick-and-place bonding tool according to the present invention.

Fig. 4 is an enlarged view of a portion a in fig. 2.

Fig. 5 is a schematic structural diagram of the preset platform of the present invention.

Fig. 6 is a schematic view of the mounting structure of the top camera and the eutectic bonding tool of the present invention.

Fig. 7 is a schematic structural view of the eutectic bonding tool of the present invention.

Fig. 8 is a schematic view of the installation structure of the eutectic heating platform and the eutectic bonding tool of the present invention.

Fig. 9 is a schematic structural view of the eutectic heating platform of the present invention.

Fig. 10 is a schematic view of the mounting structure of the substrate loading jig of the present invention.

Wherein: 1. presetting a platform; 2. eutectic bonding tool; 3. an X-direction frame; 4. a chip pick-and-place welding head mechanism; 5. a substrate picking and placing welding head mechanism; 6. a eutectic heating platform; 7. a chip feeding jig; 8. a substrate feeding jig; 9. an air floating platform; 10. a top Y-direction moving module; 11. a base; 12. a top camera; 13. an XY-direction moving module I; 14. a bottom Y-direction moving module; 15. an X-direction moving module; 16. an XY direction moving module II; 17. a stringer structure;

101. a first X-direction sliding table; 102. a first Y-direction sliding table; 103. a first Z-direction sliding table; 104. rotating the first platform; 105. a first cushion block assembly; 106. a chip placement table; 107. a hypotenuse right-angle reflecting prism; 108. a bottom camera; 109. a point light source; 110. a first platform bottom plate; 111. installing an inclined plate; 1061. a central air hole;

201. a long arm connecting plate; 204. a sliding group mounting plate; 205. a Z-direction guide rail III; 206. an L-shaped connecting plate; 207. a tungsten steel suction nozzle; 208. an L-shaped connecting block; 209. a pressure sensor;

501. a material taking camera; 502. a material taking welding head; 503. a welding head fixing seat; 504. a Z-direction guide rail I; 505. a sliding connection seat; 506. a first motor; 507. a second motor; 508. a screw shaft; 509. a voice coil motor; 510. a first support plate; 511. adjusting the connecting plate; 512. a voice coil connecting plate; 513. a spring member; 514. a spring upper plate; 515. a Z-direction guide rail II; 516. an upper contact mounting block; 517. an upper contact; 518. a lower contact mounting block; 519. a lower contact; 520. an air tube; 521. a first belt drive mechanism; 522. a second belt drive mechanism; 523. a material taking camera connecting plate; 524. a material taking camera fixing seat;

601. an X-direction sliding table II; 602. a second Y-direction sliding table; 603. a second Z-direction sliding table; 604. rotating the second platform; 605. a second cushion block assembly; 606. a cover plate; 607. a heating stage; 608. a second platform bottom plate;

701. a loading carrier box; 801. a first material carrying plate; 802. and a material carrying plate II.

Detailed Description

The following describes embodiments of the present invention with reference to the drawings.

As shown in fig. 1, the high-precision intelligent eutectic mounting device of the present embodiment includes a base 11, a material region and a eutectic region are disposed on the base 11 along a Y direction, and the material region is located on a front side of the eutectic region; the middle part of the material area is a substrate feeding area and a finished product discharging area, the left side and the right side are chip feeding areas, each chip feeding area comprises at least one chip feeding jig 7 and a chip taking and placing welding head mechanism 4 which is matched with the chip feeding jig 7 and moves along the XY direction, and a suction nozzle mechanism of the chip taking and placing welding head mechanism 4 also has Z-direction movement and rotation freedom degrees; the substrate feeding and finished product blanking area comprises a substrate feeding jig 8 moving along the XY direction and a substrate taking and placing welding head mechanism 5 which is matched with the substrate feeding jig 8 and moves along the Y direction, and a suction nozzle mechanism of the substrate taking and placing welding head mechanism 5 also has Z-direction movement and rotation freedom degrees; the eutectic area comprises a left eutectic welding mechanism and a right eutectic welding mechanism which respectively correspond to the positions of the two chip taking and placing welding head mechanisms 4, each eutectic welding mechanism comprises two fixedly installed top cameras 12 and an eutectic welding head 2 moving along the XZ direction, a preset platform 1 with a bottom camera 108 is arranged on the rear side of each chip taking and placing welding head mechanism 4, and the preset platform 1 has four degrees of freedom of XYZ linear movement and rotation; and two eutectic heating platforms 6 moving along the X direction are further arranged in the eutectic area, the two eutectic heating platforms 6 reciprocate between the material loading position and the eutectic position of the substrate, and the eutectic process of the chip and the substrate is completed by matching with an eutectic welding mechanism.

An X-direction frame 3 is arranged on the rear side of the upper surface of the base 11, and a substrate taking and placing welding head mechanism 5 is arranged in the middle of the X-direction frame 3 through a top Y-direction moving module 10; air floating platforms 9 moving along the XZ direction are respectively arranged on two sides of the X-direction frame 3, and an eutectic welding head 2 is arranged at the bottom of each air floating platform 9; the two top cameras 12 are connected to the two sides of the top of the X-direction frame 3 through fixed mounting parts respectively.

Two sets of totally four top cameras 12 are located the both sides of eutectic heating platform 6 top, and top camera 12 is high resolution visual detection camera, and discernment counterpoint precision is high, counterpoint in real time, has improved the eutectic precision, and its theory of operation is:

one of the two top cameras 12 in each group identifies the position of the chip on the preset platform 1 to provide information for adjusting the position of the chip on the preset platform 1 and ensure real-time accurate alignment when the eutectic bonding head 2 picks up the chip from the preset platform 1, and the other top camera is used for identifying the bonding position on the substrate to ensure real-time alignment accuracy of the chip and the substrate during eutectic bonding and realize high-precision eutectic.

The top camera 12 integrates the light source, the lens and the camera, and uses airflow heat transfer in the housing to achieve the function of accelerating heat dissipation. Thereby avoiding negative effects on the lens and camera system due to too close proximity to the eutectic heating platform 6.

As shown in fig. 2 to 4, the substrate pick-and-place bonding head mechanism 5 has the following structure: the automatic feeding device comprises a first support plate 510, wherein a first motor 506, a first screw rod assembly and a first Z-direction guide rail 504 are fixedly connected to the front surface of the first support plate 510, an output shaft of the first motor 506 is connected with the first screw rod assembly through a first belt transmission mechanism 521, a screw rod shaft 508 of the first screw rod assembly is arranged along the Z direction, a sliding connection base 505 is in transmission connection with the screw rod shaft 508, a suction nozzle mechanism is installed on the sliding connection base, the automatic feeding device structurally comprises a material taking welding head 502 driven by a rotary driving piece, and a force control assembly is further connected to the material; the force control assembly comprises a voice coil motor 509, the voice coil motor 509 is installed on the inner side of an adjusting connecting plate 511 fixedly connected with a sliding connecting seat 505, the outer side of the adjusting connecting plate 511 is connected with a welding head fixing seat 503, a material taking welding head 502 is arranged in the welding head fixing seat 503 in a penetrating mode and is in rotating connection with the material taking welding head through a bearing device, the top of the voice coil motor 509 is connected with the welding head fixing seat 503 through a voice coil connecting plate 512, the top of the voice coil connecting plate 512 is connected with a spring upper plate 514 through a spring part 513, and two ends of the spring; a second Z-guide rail 515 is arranged on the outer side wall surface of the adjusting connecting plate 511, an upper contact mounting block 516 which slides along the second Z-guide rail 515 and is fixedly connected with the welding head fixing seat 503 is arranged on the second Z-guide rail 515, an upper contact 517 which extends downwards is arranged on the bottom surface of the end part of the second Z-guide rail, a lower contact mounting block 518 is arranged on the outer end wall surface of the adjusting connecting plate 511, and a lower contact 519 which extends upwards and is matched with the upper contact 517 is arranged on the upper surface of the end part of; the material taking camera 501 is further arranged on one side of the material taking welding head 502, the material taking camera 501 is fixedly connected with a material taking camera connecting plate 523 through a material taking camera fixing seat 524, and the material taking camera connecting plate 523 is fixedly connected with a first support plate 510.

The structure of the rotary driving piece comprises a second motor 507, an output shaft of the second motor is in transmission connection with the material taking welding head 502 through a second belt transmission mechanism 522, and the second motor 507 is also fixedly arranged on the inner side of the adjusting connecting plate 511; the material taking welding head 502 structurally comprises a suction nozzle pipe which is arranged in a welding head fixing seat 503 through a rotating bearing, the top of the suction nozzle pipe is connected with a second belt transmission mechanism 522, and the bottom of the suction nozzle pipe is provided with a suction nozzle; the top of the suction nozzle pipe extends out of the welding head fixing seat 503 and is connected with a negative pressure device through an air pipe 520.

The working principle of the substrate taking and placing welding head mechanism 5 is as follows:

in an initial state, the upper contact 517 and the lower contact 519 contact each other. When the material is taken, the first motor 506 drives the screw rod assembly to move through the first belt transmission mechanism 521, so that the sliding connection seat 505 moves downwards along the first Z-direction guide rail 504, when the welding head touches a substrate or a finished product, the material taking welding head 502 and the welding head fixing seat 503 are stressed upwards, the upper contact mounting block 516 drives the upper contact 571 to move upwards, the upper contact 517 and the lower contact 519 are separated, at the moment, the voice coil motor 509 starts to work, the electrified coil and the permanent magnet act to generate a reaction force, and the welding head fixing seat 503 and the material taking welding head 502 are driven to move downwards through the voice coil connecting plate 512, so that the action force is applied to. When material is taken, the material taking welding head 502 is driven to rotate by a second motor 507 through a second belt transmission mechanism 522.

As shown in fig. 1 and 6, an XY-direction moving module i 13 is mounted on the upper surface of the base 11, and a chip pick-and-place bonding tool mechanism 4 is mounted on the XY-direction moving module i, and the mounting structure of the chip pick-and-place bonding tool mechanism 4 is the same as that of the substrate pick-and-place bonding tool mechanism 5.

The X-direction frame 3 comprises a cross beam, two ends of the bottom of the cross beam are supported with upright column structures, and the air floating platform 9 is positioned on the front surface of the cross beam;

as shown in fig. 7, the mounting structure of the eutectic bonding tool 2 is: the device comprises a long arm connecting plate 201 fixedly connected with an air floatation platform 9, wherein the bottom of the long arm connecting plate is connected with a pressure sensor 209, the bottom of the pressure sensor 209 is connected with an L-shaped connecting block 208, and a tungsten steel suction nozzle 207 is arranged on the bottom surface of the L-shaped connecting block 208; a Z-direction guide rail III 205 is arranged on one side of the long arm connecting plate 201 through a sliding group mounting plate 204, an L-shaped connecting plate 206 sliding along the Z-direction guide rail III 205 is arranged on the Z-direction guide rail III, the back of one end of the L-shaped connecting plate 206 is connected with the Z-direction guide rail III 205 in a sliding mode, and the bottom of the other end of the L-shaped connecting plate is connected with the upper surface of an L-shaped connecting block; fixed mounting adopts longeron structure 17, and its front end stretches out X to 3 front surfaces of frame to stride in air supporting platform 9 tops, be fixed with the installing support on the preceding terminal surface of longeron structure 17, the installing support be located air supporting platform 9 front surface, top camera 12 links firmly on the installing support along the Z to.

The working principle of the eutectic bonding tool 2 is as follows:

the eutectic bonding tool 2 is mounted on an air floating platform 9 (adopting a commercially available air floating motion module), and during specific implementation, a bridge type pressure sensor (LSB200) can be adopted, and the output form is voltage and has a feedback function. Because the chip belongs to extremely fragile article, eutectic bonding tool 2's real-time force control function has both guaranteed the welded precision and has protected the chiplet, its theory of operation is as follows:

a standard value is preset by a pressure sensor 209 (the model of a standard part is LSB200 in specific implementation), in the eutectic process, the pressure sensor 209 detects the stress value of the tungsten steel suction nozzle 207 in real time, the stress value changes in the eutectic reaction process, so that an L-shaped connecting block 208 and an L-shaped connecting plate 206 slightly float along a Z-direction guide rail III 205, deformation is generated between the top of the pressure sensor 209 and the bottom of a long arm connecting plate 201, the pressure sensor 209 is induced, a compensation force is provided when an error value exists between the induced force value and the preset value, when the error value is positive (the detected value is greater than the preset value), the tungsten steel suction nozzle 207 needs to be adjusted to be lifted, the pressure sensor 209 is used for closing and controlling the air floating platform to move upwards along the Z-axis direction to realize pressure compensation, when the error value is negative (the detected value is less than the preset value), the tungsten steel suction nozzle 207 needs to be adjusted to press downwards, the pressure sensor 209, therefore, the tungsten steel suction nozzle 207 can control the force of the chip in real time, the stress between the chip and the substrate is ensured to be constant, and the eutectic welding precision and the welding quality are greatly improved.

As shown in fig. 5, the preset platform 1 is connected to the bottom Y-direction moving module 14, the preset platform 1 structurally comprises a platform base plate one 110 connected to the bottom Y-direction moving module 14, an X-direction sliding table one 101, a Y-direction sliding table one 102, a Z-direction sliding table one 103 and a rotating platform one 104 are sequentially installed on the platform base plate one from bottom to top along the height direction, a chip placing table 106 is installed on the rotating platform one 104 through a cushion block assembly one 105, a central air hole 1061 is formed in the middle of the top surface of the chip placing table 106, air cavities are formed in the sliding tables and communicated with the central air hole 1061, and the air cavities are connected with a negative pressure device through pipelines; the platform further comprises a mounting inclined plate 111, the bottom of the mounting inclined plate is connected with the first platform bottom plate 110, and the top of the mounting inclined plate is provided with a bottom camera 108 through a locking block; the bottom camera 108 is horizontally arranged, a point light source 109 is arranged on one side of the bottom camera 108, and an upward-recognized light path is formed by arranging a hypotenuse right-angle reflecting prism 107 at the position of a lens of the bottom camera 108.

As shown in fig. 8 and 9, the two groups of eutectic heating platforms 6 have the same structure, and the mounting structure of each eutectic heating platform 6 is as follows: the X-direction moving module 15 is provided with a second platform bottom plate 608, the second X-direction sliding table 601, the second Y-direction sliding table 602, the second Z-direction sliding table 603 and the second rotating platform 604 are sequentially arranged on the second X-direction moving module along the height direction from bottom to top, the second rotating platform 604 is provided with a heating table 607 through a second cushion block assembly 605, and the surface of the heating table 607 is provided with a cover plate 606.

The working principle of the eutectic heating platform 6 is as follows:

and keeping a low-temperature state in the non-eutectic stage, and starting to heat and realize eutectic operation after the chip is contacted with the substrate. The top of the eutectic heating platform 6 is made of ceramic, so that the heat conducting property is improved.

As shown in fig. 1, the structure of the chip loading jig 7 includes a plurality of chip loading carrier boxes 701;

as shown in fig. 10, the substrate feeding jig 8 is connected to the second XY-direction moving module 16, the second XY-direction moving module 16 is installed on the upper surface of the base 11, the structure of the substrate feeding jig 8 includes a first pull-out material carrying plate 801 and a second pull-out material carrying plate 802, the first pull-out material carrying plate 801 is provided with a plurality of substrate feeding boxes, and the second pull-out material carrying plate 802 is provided with a plurality of finished product discharging boxes.

The working principle of the substrate feeding jig 8 is as follows:

the material loading jig of the substrate material loading jig 8 comprises two parts, wherein a plurality of substrate material loading boxes are arranged on the material loading plate I801 and used for loading unfinished products to be eutectic; the second material loading plate 802 is provided with a plurality of finished product discharging boxes for loading eutectic finished products.

The eutectic processing method of the high-precision intelligent eutectic mounting equipment comprises the following processing flows:

feeding a substrate to an eutectic heating platform 6, feeding a chip to a preset platform 1, feeding the chip to the substrate from the preset platform 1, carrying out eutectic heating welding on the chip and the substrate, and discharging a finished product, wherein the substrate feeding and the finished product discharging are in the same working area and run continuously; simultaneously feeding the chips on the two sides and the substrate in the middle, and simultaneously feeding the chips to the preset platform 1 and transferring the chips to the substrate;

the specific process is as follows:

initialization operation:

firstly, initializing equipment, namely determining specific positions of the center of the preset platform 1, the center of the eutectic heating platform 6 and the center of the eutectic welding head 2 by using two top cameras 12 on each side and one bottom camera 108 connected to the preset platform 1 on the corresponding side so as to finish calibration work;

substrate feeding:

the substrate feeding jig 8 moves to a feeding position along the XY-direction moving module II 16, the substrate taking and placing welding head mechanism 5 moves to the position above the substrate feeding jig 8 along the Y direction, the substrate is picked up by the material taking camera 501 through the material taking welding head 502 after the position of the substrate is identified, the substrate is picked up on the eutectic heating platform 6, and then the eutectic heating platform 6 moves to the eutectic position along the X direction;

chip loading:

the process which is carried out simultaneously with the substrate feeding comprises the following steps: two sets of chips get and put bonding tool mechanism 4 simultaneous workings, discern the chip that chip material loading tool 7 uploaded of butt joint below separately respectively, then pick up and get corresponding preset platform 1 on, repeat above-mentioned action again, realize the chip from chip material loading tool 7 to the continuous material loading of preset platform 1, specifically: after a camera (corresponding to a material taking camera 501) in the chip taking and placing welding head mechanism identifies a chip, a welding head (corresponding to a material taking welding head 502) is used for picking up the chip, after the placing position of the chip of the preset platform 1 is identified, the chip is placed in a central air hole 1061 in the upper surface of a chip placing table 106 at the top of the preset platform 1, the chip is adsorbed on the chip placing table 106 through negative pressure, and the chip is moved to the position below a top camera 12 through the preset platform 1;

transferring the chip to a substrate:

each preset platform 1 moves back and forth along the Y direction, and chips are moved to and fro from the chip loading jig 7 to the positions below the top camera 12 and the eutectic welding head 2 on the corresponding side; the top camera 12 and the eutectic bonding head 2 respectively identify and pick up the chip on the preset platform 1; operation of the top camera 12 on each side: after one of the top cameras 12 identifies the position of a chip on the preset platform 1, the eutectic bonding head 2 picks up the chip, meanwhile, the preset platform 1 returns to the original position to perform next chip loading, the other top camera 12 identifies the welding position on a substrate on the eutectic heating platform 6, the eutectic bonding head 2 moves along the X direction along with the air floating platform 9, the chip is moved to the substrate of the eutectic heating platform 6 at the eutectic position, and the chip is pressed at the preset position of the substrate;

eutectic welding:

heating the eutectic heating platform 6, pressing the chip on the substrate by the eutectic welding head 2, detecting the eutectic welding head 2 in real time, keeping constant pressure output to the chip through feedback, lifting the eutectic welding head 2 after the reaction is finished, returning to the original position, and continuously picking up the next chip on the preset platform 1; specifically, the method comprises the following steps: after one of the top cameras 12 identifies the position of the chip, the eutectic bonding head 2 picks up the chip, meanwhile, the preset platform 1 returns to the original position (for next chip feeding), the other top camera 12 identifies the welding position on the substrate, the eutectic bonding head 2 (moves along the Z direction and the X direction along with the air floating platform 9) presses the chip to the preset position of the substrate, a tin sheet is attached to the bottom of the chip, the tin melts after the temperature rises, the reaction force borne by the eutectic bonding head 2 changes in the melting process, the feedback function of the eutectic bonding head 2 can ensure that the real-time force is consistent with the preset force, the eutectic heating platform 6 completes the welding process, the tungsten steel suction nozzle 207 of the eutectic bonding head 2 lifts up after the welding is completed, and the next chip picking is carried out after the welding is completed;

blanking of finished products:

the finished product after the eutectic is moved to a blanking position by the eutectic heating platform 6, after the material taking camera 501 of the substrate taking and placing welding head mechanism 5 identifies the finished product as a grade, the material taking welding head 502 picks up the finished product and places the finished product to the substrate feeding jig 8 to finish blanking;

the above process is repeated to realize a continuous processing process.

Substrate feeding and chip feeding are carried out simultaneously, and two chip picking and placing welding head mechanisms 4 work simultaneously, so that the efficiency is greatly improved.

The above description is for the purpose of explanation and not limitation of the invention, which is defined in the claims, and any modifications may be made within the scope of the invention.

Claims

1. The utility model provides a high accuracy intelligence eutectic pastes dress equipment which characterized in that: the device comprises a base (11), wherein a material area and a eutectic area are arranged on the base (11) along the Y direction, and the material area is positioned on the front side of the eutectic area;

the middle part of the material area is a substrate feeding area and a finished product discharging area, the left side and the right side of the material area are chip feeding areas, each chip feeding area comprises at least one chip feeding jig (7) and a chip taking and placing welding head mechanism (4) which is matched with the chip feeding jig (7) and moves along the XY direction, and a suction nozzle mechanism of the chip taking and placing welding head mechanism (4) also has the Z-direction movement and rotation freedom degree; the substrate feeding and finished product blanking area comprises a substrate feeding jig (8) moving along the XY direction and a substrate taking and placing welding head mechanism (5) which is matched with the substrate feeding jig (8) and moves along the Y direction, and a suction nozzle mechanism of the substrate taking and placing welding head mechanism (5) also has Z-direction movement and rotation freedom degrees;

the eutectic area comprises a left eutectic welding mechanism and a right eutectic welding mechanism which respectively correspond to the positions of the two chip taking and placing welding head mechanisms (4), each eutectic welding mechanism comprises two fixedly installed top cameras (12) and an eutectic welding head (2) which moves along the XZ direction and controls the pressure of the chip and the substrate in the eutectic process in real time, a preset platform (1) with a bottom camera (108) is arranged on the rear side of each chip taking and placing welding head mechanism (4), and the preset platform (1) has four degrees of freedom of XYZ linear movement and rotation;

still be equipped with two in the eutectic district along X to the eutectic heating platform (6) that remove, two eutectic heating platform (6) all on the base plate material level and eutectic position between reciprocating motion, the cooperation eutectic welds the eutectic process that the mechanism accomplished chip and base plate.

2. The high-precision intelligent eutectic mounting device of claim 1, wherein: an X-direction frame (3) is arranged on the rear side of the upper surface of the base (11), and the substrate taking and placing welding head mechanism (5) is arranged in the middle of the X-direction frame (3) through a top Y-direction moving module (10); air floating platforms (9) moving along the XZ direction are respectively arranged on two sides of the X-direction frame (3), and the bottom of each air floating platform (9) is provided with one eutectic welding head (2); and the two sides of the top of the X-direction frame (3) are respectively connected with the two top cameras (12) through fixed mounting parts.

3. The high-precision intelligent eutectic mounting device of claim 2, wherein: the structure of the substrate picking and placing welding head mechanism (5) is as follows: the automatic feeding mechanism comprises a first support plate (510), wherein a first motor (506), a first screw rod assembly and a first Z-direction guide rail (504) are fixedly connected to the front surface of the first support plate (510), an output shaft of the first motor (506) is connected with the first screw rod assembly through a first belt transmission mechanism (521), a screw rod shaft (508) of the first screw rod assembly is arranged along the Z direction, the screw rod shaft (508) is in transmission connection with a sliding connection base (505) and is provided with a suction nozzle mechanism, the automatic feeding mechanism structurally comprises a material taking welding head (502) driven by a rotary driving piece, and a force control assembly is further connected to the material taking welding head (502);

the force control assembly comprises a voice coil motor (509), the voice coil motor (509) is installed on the inner side of an adjusting connecting plate (511) fixedly connected with the sliding connecting seat (505), the outer side of the adjusting connecting plate (511) is connected with a welding head fixing seat (503), the material taking welding head (502) penetrates through the welding head fixing seat (503) and is rotatably connected with the welding head fixing seat through a bearing device, the top of the voice coil motor (509) is connected with the welding head fixing seat (503) through a voice coil connecting plate (512), the top of the voice coil connecting plate (512) is connected with a spring upper plate (514) through a spring part (513), and two ends of the spring upper plate (514) are fixedly connected with the top of the adjusting connecting plate (511);

a Z-direction guide rail II (515) is arranged on the outer side wall surface of the adjusting connecting plate (511), an upper contact mounting block (516) which slides along the Z-direction guide rail II (515) and is fixedly connected with the welding head fixing seat (503) is arranged on the Z-direction guide rail II (515), an upper contact (517) which extends downwards is arranged on the bottom surface of the end part of the Z-direction guide rail II, a lower contact mounting block (518) is arranged on the outer end wall surface of the adjusting connecting plate (511), and a lower contact (519) which extends upwards and is matched with the upper contact (517) is arranged on the upper surface of;

get material bonding tool (502) one side and still be equipped with and get material camera (501), get material camera (501) and get material camera connecting plate (523) and link firmly through getting material camera fixing base (524), get material camera connecting plate (523) with mounting plate (510) fixed connection.

4. The high-precision intelligent eutectic mounting device of claim 3, wherein: the structure of the rotary driving piece comprises a second motor (507), an output shaft of the second motor is in transmission connection with the material taking welding head (502) through a second belt transmission mechanism (522), and the second motor (507) is also fixedly arranged on the inner side of the adjusting connecting plate (511); the material taking welding head (502) structurally comprises a suction nozzle pipe, the suction nozzle pipe is arranged in the welding head fixing seat (503) through a rotating bearing, the top of the suction nozzle pipe is connected with the second belt transmission mechanism (522), and a suction nozzle is arranged at the bottom of the suction nozzle pipe; the top of the suction nozzle pipe extends out of the welding head fixing seat (503) and is connected with a negative pressure device through an air pipe (520).

5. The high-precision intelligent eutectic mounting device of any one of claims 1-4, wherein: an XY-direction moving module I (13) is mounted on the upper surface of the base (11), the chip taking and placing welding head mechanism (4) is mounted on the XY-direction moving module I, the mounting structure of the chip taking and placing welding head mechanism (4) is the same as that of the substrate taking and placing welding head mechanism (5).

6. The high-precision intelligent eutectic mounting device of claim 2, wherein: the structure of X to frame (3) includes the crossbeam, and its bottom both ends support there is the stand structure, air supporting platform (9) are located the front surface of crossbeam, the mounting structure of eutectic bonding tool (2) is: the device comprises a long arm connecting plate (201) fixedly connected with an air floatation platform (9), wherein the bottom of the long arm connecting plate is connected with a pressure sensor (209), the bottom of the pressure sensor (209) is connected with an L-shaped connecting block (208), and a tungsten steel suction nozzle (207) is arranged on the bottom surface of the L-shaped connecting block (208); a Z-direction guide rail III (205) is arranged on one side of the long arm connecting plate (201) through a sliding group mounting plate (204), an L-shaped connecting plate (206) sliding along the Z-direction guide rail III (205) is arranged on the Z-direction guide rail III (205), the back of one end of the L-shaped connecting plate (206) is connected with the Z-direction guide rail III (205) in a sliding mode, and the bottom of the other end of the L-shaped connecting plate is connected with the upper surface of the L-shaped connecting block;

fixed mounting spare adopts longeron structure (17), and its front end stretches out X to frame (3) front surface to stride in air supporting platform (9) top, be fixed with the installing support on the preceding terminal surface of longeron structure (17), the locating of installing support air supporting platform (9) front surface, top camera (12) along Z to link firmly in on the installing support.

7. The high-precision intelligent eutectic mounting device of claim 1, wherein: the system comprises a preset platform (1), a bottom Y-direction moving module (14), a platform base plate I (110) connected with the bottom Y-direction moving module (14), a first X-direction sliding table (101), a first Y-direction sliding table (102), a first Z-direction sliding table (103) and a first rotary platform (104) are sequentially arranged on the preset platform (1) from bottom to top along the height direction, a chip placing table (106) is arranged on the first rotary platform (104) through a first cushion block assembly (105), a central air hole (1061) is formed in the middle of the top surface of the chip placing table (106), an air cavity is formed in each sliding table and communicated with the central air hole (1061), and the air cavity is connected with a negative pressure device through a pipeline; the bottom of the inclined mounting plate (111) is connected with the first platform bottom plate (110), and the top of the inclined mounting plate is provided with the bottom camera (108) through a locking block; the bottom camera (108) is horizontally arranged, a point light source (109) is arranged on one side of the bottom camera (108), and an upward recognition light path is formed at the position of a lens of the bottom camera (108) by arranging a bevel right-angle reflecting prism (107).

8. The high-precision intelligent eutectic mounting device of claim 1, wherein: the structure of two sets of eutectic heating platforms (6) is the same, and the mounting structure of every eutectic heating platform (6) is: including X to removing module (15), install platform bottom plate two (608) on it, follow the direction of height on it and install X in proper order by supreme down to slip table two (601), Y to slip table two (602), Z to slip table two (603) and rotary platform two (604), through cushion block subassembly two (605) installation warm table (607) on rotary platform two (604), warm table (607) surface mounting cover plate (606).

9. The high-precision intelligent eutectic mounting device of claim 1, wherein: the structure of the chip feeding jig (7) comprises a plurality of chip feeding carrier boxes (701); the substrate feeding jig (8) is connected to the XY direction moving module II (16), the XY direction moving module II (16) is installed on the upper surface of the base (11), the structure of the substrate feeding jig (8) comprises a pull-out type material carrying plate I (801) and a pull-out type material carrying plate II (802), a plurality of substrate feeding boxes are arranged on the material carrying plate I (801), and a plurality of finished product discharging boxes are arranged on the material carrying plate II (802).